JP5335339B2 - 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 - Google Patents
黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 Download PDFInfo
- Publication number
- JP5335339B2 JP5335339B2 JP2008233604A JP2008233604A JP5335339B2 JP 5335339 B2 JP5335339 B2 JP 5335339B2 JP 2008233604 A JP2008233604 A JP 2008233604A JP 2008233604 A JP2008233604 A JP 2008233604A JP 5335339 B2 JP5335339 B2 JP 5335339B2
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- Japan
- Prior art keywords
- graphite
- heat sink
- aluminum
- metal composite
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002905 metal composite material Substances 0.000 title claims description 37
- 229910052782 aluminium Inorganic materials 0.000 title claims description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 35
- 239000000463 material Substances 0.000 title description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 36
- 229910002804 graphite Inorganic materials 0.000 claims description 30
- 239000010439 graphite Substances 0.000 claims description 30
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 238000005242 forging Methods 0.000 claims description 5
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 150000004696 coordination complex Chemical class 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009694 cold isostatic pressing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C37/00—Cast-iron alloys
- C22C37/04—Cast-iron alloys containing spheroidal graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
これにより、LEDパッケージ、高負荷半導体、高負荷コンデンサー、或いは集積回路基板から発生する熱は、黒鉛一金属複合体によって、効率良く熱拡散し、その熱は、丈夫なアルミニウム合金のヒートシンクによって、大きな表面積を持つフィン部から放熱される経済性にも優れた放熱体が提供される。
又、この時、黒鉛繊維のチョップドしたものを含んでいても良い。
より好ましくは65%〜92%である。
発熱体
2.
黒鉛金属複合体
3.
アルミニウム製ヒートシンク
Claims (4)
- 黒鉛粉末を50〜92体積%含む黒鉛成形体にアルミニウム、銅或いはそれらの合金を溶湯鍛造法により加圧含浸させて、得られた黒鉛一金属複合体を板状、円柱状又は角柱状に切り出しアルミニウム、又はアルミニウム合金からなるヒートシンクの平面部又は曲面部の箇所に接触させてなり、発熱体に接する位置に黒鉛−金属複合体が配置されているLEDパッケージ用又は高負荷半導体用放熱体。
- 請求項1で黒鉛粉末の代わりに黒鉛のチョップドした繊維と人造黒鉛と併せて50〜92体積%含む成形体であることを特徴とするLEDパッケージ用又は高負荷半導体用放熱体。
- 請求項1で黒鉛一金属複合体を円柱状又は角柱状に切り出し、ヒートシンクのフィンが放射状に配列されてなるヒートシンクに中央部に配置して、円柱又は角柱の側面が、ヒートシンクに接することを特徴とするLEDパッケージ用又は高負荷半導体用放熱体。
- 請求項1、請求項2又は請求項3に使用される黒鉛成形体が、押出成形体、冷間等方圧力成形体、金型にて一方向圧力による成形体のいずれかによるものであることを特徴とするLEDパッケージ用又は高負荷半導体用放熱体。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008233604A JP5335339B2 (ja) | 2008-09-11 | 2008-09-11 | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 |
KR1020117008073A KR20110085978A (ko) | 2008-09-11 | 2008-12-29 | 흑연 금속 복합재와 알루미늄 압출재의 조합으로 구성된 방열체 |
PCT/US2008/088461 WO2010030307A1 (en) | 2008-09-11 | 2008-12-29 | A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
EP08876944A EP2324074A4 (en) | 2008-09-11 | 2008-12-29 | HEAT BEAM FROM A COMBINATION OF A GRAPHITE METAL COMPLEX AND AN EXTRUDED ALUMINUM MATERIAL |
US13/063,568 US20110259570A1 (en) | 2008-09-11 | 2008-12-29 | Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008233604A JP5335339B2 (ja) | 2008-09-11 | 2008-09-11 | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010067842A JP2010067842A (ja) | 2010-03-25 |
JP5335339B2 true JP5335339B2 (ja) | 2013-11-06 |
Family
ID=42005380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008233604A Expired - Fee Related JP5335339B2 (ja) | 2008-09-11 | 2008-09-11 | 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110259570A1 (ja) |
EP (1) | EP2324074A4 (ja) |
JP (1) | JP5335339B2 (ja) |
KR (1) | KR20110085978A (ja) |
WO (1) | WO2010030307A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7156586B1 (ja) | 2022-03-17 | 2022-10-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
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US20110027603A1 (en) * | 2008-12-03 | 2011-02-03 | Applied Nanotech, Inc. | Enhancing Thermal Properties of Carbon Aluminum Composites |
US20100310447A1 (en) * | 2009-06-05 | 2010-12-09 | Applied Nanotech, Inc. | Carbon-containing matrix with functionalized pores |
US20110147647A1 (en) * | 2009-06-05 | 2011-06-23 | Applied Nanotech, Inc. | Carbon-containing matrix with additive that is not a metal |
JP5622465B2 (ja) * | 2010-07-22 | 2014-11-12 | ローム株式会社 | Led電球およびled電球の製造方法 |
CN102114495A (zh) * | 2010-11-25 | 2011-07-06 | 深圳市天电光电科技有限公司 | Led散热器制造方法 |
WO2012100022A2 (en) * | 2011-01-19 | 2012-07-26 | Graftech International Holdings Inc. | Thermal solution for led bulbs |
DE102011081687A1 (de) * | 2011-08-26 | 2013-02-28 | Robert Bosch Gmbh | Halbleiterbauelement mit einem Kühlkörper |
JP2014047127A (ja) | 2012-09-04 | 2014-03-17 | Toyo Tanso Kk | 金属−炭素複合材、金属−炭素複合材の製造方法及び摺動部材 |
JP6164632B2 (ja) * | 2013-01-11 | 2017-07-19 | 株式会社アカネ | 炭素基金属複合材料の製造方法 |
US10914539B2 (en) | 2013-05-15 | 2021-02-09 | Osram Sylvania Inc. | Two piece aluminum heat sink |
KR101301624B1 (ko) * | 2013-07-05 | 2013-08-29 | (주) 동양에이.케이코리아 | 카본이 함유된 알루미늄 또는 알루미늄 합금 압출재의 제조방법 및 이를 이용한 카본이 함유된 알루미늄 또는 알루미늄 합금 압출재 |
CN105916348A (zh) * | 2016-03-25 | 2016-08-31 | 华为技术有限公司 | 一种电子设备中框配件及其制造方法 |
CN106531874B (zh) * | 2016-11-30 | 2018-10-12 | 南京劲峰洋光电科技有限公司 | 一种新型散热绝缘复合材料及其制备方法 |
CN107022690B (zh) * | 2017-05-03 | 2019-03-08 | 合肥工业大学 | 一种通过压力浸渗铝合金制备铝/碳基复合材料的方法 |
CN114761588A (zh) * | 2019-12-17 | 2022-07-15 | Ube株式会社 | 石墨-铜复合材料、使用了该石墨-铜复合材料的散热器构件、和石墨-铜复合材料的制造方法 |
KR102298678B1 (ko) * | 2020-04-22 | 2021-09-07 | 부경대학교 산학협력단 | 전기 자동차의 파워트레인용 냉각 파이프의 제조방법 및 이에 의해 제조된 냉각 파이프 |
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-
2008
- 2008-09-11 JP JP2008233604A patent/JP5335339B2/ja not_active Expired - Fee Related
- 2008-12-29 US US13/063,568 patent/US20110259570A1/en not_active Abandoned
- 2008-12-29 WO PCT/US2008/088461 patent/WO2010030307A1/en active Application Filing
- 2008-12-29 EP EP08876944A patent/EP2324074A4/en not_active Withdrawn
- 2008-12-29 KR KR1020117008073A patent/KR20110085978A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7156586B1 (ja) | 2022-03-17 | 2022-10-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010067842A (ja) | 2010-03-25 |
US20110259570A1 (en) | 2011-10-27 |
EP2324074A4 (en) | 2012-06-13 |
KR20110085978A (ko) | 2011-07-27 |
EP2324074A1 (en) | 2011-05-25 |
WO2010030307A1 (en) | 2010-03-18 |
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