JP5334933B2 - Cutting and dividing method of resin-sealed substrate - Google Patents

Cutting and dividing method of resin-sealed substrate Download PDF

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JP5334933B2
JP5334933B2 JP2010202547A JP2010202547A JP5334933B2 JP 5334933 B2 JP5334933 B2 JP 5334933B2 JP 2010202547 A JP2010202547 A JP 2010202547A JP 2010202547 A JP2010202547 A JP 2010202547A JP 5334933 B2 JP5334933 B2 JP 5334933B2
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resin
cutting
substrate
peeling
dividing
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JP2012059972A (en
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貴昭 日比
雄治 上柳
純 岡本
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Towa Corp
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Description

本発明は、基板上に装着したＬＥＤ（発光素子）等を樹脂材料にて封止成形した状態の樹脂封止済基板を個々の最小単位に切断して分割する方法と、この方法を実施するための基板切断分割装置に関し、更に、詳細には、樹脂封止済基板の切断分割効率を向上させることができると共に、切断分割用ブレードの耐久性を向上させることができるように改善したものに関する。   The present invention implements a method of cutting and dividing a resin-sealed substrate in a state in which an LED (light emitting element) or the like mounted on the substrate is sealed with a resin material into individual minimum units, and this method. More specifically, the present invention relates to an improved apparatus that can improve the cutting and dividing efficiency of a resin-sealed substrate and improve the durability of a cutting and dividing blade. .

まず、広く知られている樹脂封止済基板の切断加工装置の構成例について説明する。
この切断装置には、例えば、図６(1) に示すように、機台１と、この機台１上において前後方向への移動が可能となるように配設した樹脂封止済基板Ｗを保持するための基板保持機構２と、機台１上において上記基板保持機構２の前後移動方向と直交する左右方向への移動が可能となるように配設した樹脂封止済基板Ｗを切断分割するための基板切断機構３とが備えられている。
上記した基板保持機構２には、上記機台１上において前後移動方向に沿って並設した一対の案内レール２ａと、該案内レールに前後移動可能な状態で嵌装した移動テーブル２ｂと、該移動テーブル上に設けた支持テーブル２ｃと、該支持テーブル上に設けた基板保持テーブル２ｄとが備えられている。そして、上記支持テーブル２ｃは移動テーブル２ｂ上面に枢着されると共に、移動テーブル２ｂ上において水平方向への回転が可能となるように設けられている。
なお、上記保持テーブル２ｄの上面には、樹脂封止済基板Ｗの切断位置Ｃ（図６(2) 参照）に対応する回転ブレードの逃げ溝（図示なし）が縦横に並設されており、また、この保持テーブル２ｄの上面所定位置には、切断分割された個々の基板を各別に吸着保持するための吸引孔（図示なし）等が設けられている。
また、上記した基板切断機構３には、機台１上において左右移動方向に沿って並設した一対の案内レール３ａと、該案内レールに左右移動可能に嵌装した移動テーブル３ｂと、該移動テーブル上に設けた上下方向ガイド３ｃと、この上下方向ガイド３ｃに嵌装させた上下スライダ３ｄと、該上下スライダに設けたスピンドルユニット３ｅと、該スピンドルユニットにおけるスピンドル３ｆに固着させた基板切断用の回転ブレード３ｇとが備えられている。 First, a configuration example of a widely known resin-sealed substrate cutting apparatus will be described.
In this cutting apparatus, for example, as shown in FIG. 6 (1), a machine base 1 and a resin-sealed substrate W arranged so as to be movable in the front-rear direction on the machine base 1 are provided. A substrate holding mechanism 2 for holding, and a resin-sealed substrate W disposed on the machine base 1 so as to be movable in the left-right direction perpendicular to the front-rear movement direction of the substrate holding mechanism 2 is cut and divided. And a substrate cutting mechanism 3 for the purpose.
The above-described substrate holding mechanism 2 includes a pair of guide rails 2a arranged side by side along the front-rear movement direction on the machine base 1, a moving table 2b fitted to the guide rail so as to be movable back and forth, A support table 2c provided on the moving table and a substrate holding table 2d provided on the support table are provided. The support table 2c is pivotally attached to the upper surface of the moving table 2b, and is provided so as to be able to rotate in the horizontal direction on the moving table 2b.
In addition, on the upper surface of the holding table 2d, escape grooves (not shown) of rotating blades corresponding to the cutting position C (see FIG. 6 (2)) of the resin-sealed substrate W are arranged side by side. In addition, suction holes (not shown) and the like are provided at predetermined positions on the upper surface of the holding table 2d for sucking and holding individual cut and divided substrates.
The substrate cutting mechanism 3 includes a pair of guide rails 3a arranged side by side along the horizontal movement direction on the machine base 1, a moving table 3b fitted to the guide rails so as to be movable left and right, and the movement A vertical guide 3c provided on the table, a vertical slider 3d fitted to the vertical guide 3c, a spindle unit 3e provided on the vertical slider, and a substrate cutting unit fixed to the spindle 3f of the spindle unit Rotating blade 3g.

上記した切断装置においては、基板保持機構２における保持テーブル２ｄ上に吸着保持させた樹脂封止済基板Ｗを前後移動方向に移動させると共に、該樹脂封止済基板を水平方向へ回転させてその切断位置Ｃを決定する位置決め制御工程と、上記した基板切断機構３における回転ブレード３ｇを左右移動方向に移動させると共に、該回転ブレードを上下方向に移動させて樹脂封止済基板Ｗにおける所定の切断位置Ｃを切断する基板切断工程とを組み合わせることによって、図６(2) に示すように、位置決めされた樹脂封止済基板Ｗにおける所定の切断位置Ｃを切断し、これによって、封止樹脂材料４にて封止成形された基板５上の各ＬＥＤ６を個々の最小単位に切断分割することができる。   In the above-described cutting apparatus, the resin-sealed substrate W sucked and held on the holding table 2d in the substrate holding mechanism 2 is moved in the front-rear movement direction, and the resin-sealed substrate is rotated in the horizontal direction. A positioning control step for determining the cutting position C, and the predetermined cutting of the resin-sealed substrate W by moving the rotary blade 3g in the substrate cutting mechanism 3 in the left-right movement direction and moving the rotary blade in the vertical direction. By combining with the substrate cutting step of cutting the position C, as shown in FIG. 6 (2), the predetermined cutting position C in the positioned resin-sealed substrate W is cut, and thereby the sealing resin material 4, each LED 6 on the substrate 5 sealed and molded can be cut and divided into individual minimum units.

なお、上記基板保持機構２の保持テーブル２ｄ上に吸着保持させた樹脂封止済基板Ｗの所定切断位置を切断するための回転ブレード３ｇは、通常の場合、スピンドル３ｆに単数の回転ブレードを固着させているが、例えば、スピンドルに複数の回転ブレードを固着させる構成のものも提案されている（例えば、特許文献１・２参照）。
また、基板切断用回転ブレードの近傍位置に、基板切断時に発生する切断クズを外部へ吸引排出するように構成したものも提案されている（例えば、特許文献３参照）。 Note that the rotating blade 3g for cutting the predetermined cutting position of the resin-sealed substrate W sucked and held on the holding table 2d of the substrate holding mechanism 2 usually has a single rotating blade fixed to the spindle 3f. However, for example, a configuration in which a plurality of rotating blades are fixed to a spindle has been proposed (see, for example, Patent Documents 1 and 2).
In addition, a configuration has been proposed in which cutting scraps generated during substrate cutting are sucked and discharged to the outside at a position near the substrate cutting rotary blade (see, for example, Patent Document 3).

ところで、上記した基板切断機構３による樹脂封止済基板Ｗの切断工程においては、図６(2) に示すように、回転ブレード３ｇを高速回転させて、該基板における切断位置Ｃの表面に一体化された封止用の樹脂材料４を切断しながら、これと同時的に該基板を切断する封止用樹脂と基板との、所謂、複合材を同時に切断加工することが行われている。
また、ＬＥＤ６の封止に用いられている樹脂材料は、樹脂封止成形後における基板５の変形（反り）の発生を防止する目的で比較的に軟らかい素材、例えば、シリコーン樹脂等を用いるのが通例である。
このため、上記した封止用の樹脂材料４の切断時において、該封止用樹脂材料による回転ブレード３ｇの目詰まりが発生して樹脂封止済基板Ｗの切断効率・切断品質が低下すると共に、該回転ブレード自体の耐久性を損なうと云う問題がある。 By the way, in the cutting process of the resin-sealed substrate W by the substrate cutting mechanism 3 described above, as shown in FIG. 6 (2), the rotating blade 3g is rotated at a high speed to be integrated with the surface of the cutting position C on the substrate. A so-called composite material of a sealing resin and a substrate for cutting the substrate is simultaneously cut while simultaneously cutting the formed sealing resin material 4.
The resin material used for sealing the LED 6 is a relatively soft material such as a silicone resin for the purpose of preventing the deformation (warpage) of the substrate 5 after the resin sealing molding. It is customary.
For this reason, at the time of cutting the sealing resin material 4 described above, clogging of the rotating blade 3g by the sealing resin material occurs, and the cutting efficiency and cutting quality of the resin-sealed substrate W are lowered. There is a problem that the durability of the rotating blade itself is impaired.

また、上記した樹脂封止済基板Ｗの切断効率・切断品質の低下を防止する目的で、例えば、回転ブレード３ｇによる切断速度が遅くなるように設定することも考えられるが、この場合は、作業効率（生産性）を低下させる要因となる。
また、例えば、上記樹脂封止済基板Ｗの切断工程において、まず、回転ブレード３ｇを低速回転させて封止用樹脂材料４のみを切削除去する予備的な切断工程を行い、次に、該回転ブレードにて該基板を切断する本来の切断工程を行う等、該切断工程を二段階的に行うことも考えられるが、この場合は、作業効率を低下させる要因となるのみならず、回転ブレードの目詰まりを解消することはできない。また、回転ブレード３ｇによる封止用樹脂材料４の切削時において、該基板の切断位置Ｃに突起状の樹脂バリ等が形成されたり、該基板の表面からＬＥＤ６の樹脂封止成形体（レンズ部等）が剥離したり、或は、これを損傷したりする等の切断加工上の重大な弊害が発生する虞がある。 Further, for the purpose of preventing the cutting efficiency and cutting quality of the above-described resin-sealed substrate W from being lowered, for example, it is conceivable to set the cutting speed by the rotating blade 3g to be slow. It becomes a factor which reduces efficiency (productivity).
Further, for example, in the cutting step of the resin-sealed substrate W, first, a preliminary cutting step of cutting and removing only the sealing resin material 4 by rotating the rotary blade 3g at a low speed is performed, and then the rotation is performed. It is conceivable to perform the cutting process in two steps, such as performing the original cutting process of cutting the substrate with a blade, but in this case, not only will the work efficiency be reduced, Clogging cannot be eliminated. Further, when the sealing resin material 4 is cut by the rotating blade 3g, a protruding resin burr or the like is formed at the cutting position C of the substrate, or the resin sealing molded body (lens portion) of the LED 6 from the surface of the substrate. Or the like) may be peeled off or may be damaged.

特開昭６１−２９０００８号公報JP-A-61-290008 特開２０００−３５７６７２号公報JP 2000-357672 A 特開２００６−２４５４５９号公報JP 2006-245459 A

上述したように、従来の技術においては、樹脂封止済基板の切断工程において、該基板の切断効率・切断品質を向上させようとするときはその作業効率（生産性）が低下すると云った問題があり、逆に、作業効率を向上させようとするときは切断分割用ブレードの耐久性が低下すると云った問題がある。
そこで、本発明は、基板上に装着したＬＥＤ等を樹脂材料にて封止成形した状態の樹脂封止済基板の切断分割効率を向上させることができると共に、切断分割用ブレードの耐久性を向上させることができる樹脂封止済基板の切断分割方法と、この方法を実施するための樹脂封止済基板の切断分割装置を提供すること目的とする。 As described above, in the prior art, in the cutting process of a resin-sealed substrate, when it is attempted to improve the cutting efficiency and cutting quality of the substrate, the work efficiency (productivity) is reduced. On the contrary, there is a problem that the durability of the cutting and dividing blade is lowered when trying to improve the working efficiency.
Therefore, the present invention can improve the cutting and dividing efficiency of the resin-sealed substrate in which the LED mounted on the substrate is sealed with a resin material, and also improves the durability of the cutting and dividing blade. It is an object of the present invention to provide a method for cutting and dividing a resin-sealed substrate and a resin-sealed substrate cutting and dividing apparatus for carrying out this method.

前記課題を解決するための本発明に係る樹脂封止済基板の切断分割方法は、複数の切断線によって区画された複数の領域の各々に装着された素子を樹脂材料にて封止成形した樹脂封止済基板を前記切断線に沿って個々の最小単位に切断分割する樹脂封止済基板の切断分割方法であって、前記素子をＬＥＤ（発光素子）とする工程を行い、前記樹脂封止済基板における切断線上の表面に付着した封止樹脂材料を剥離除去する付着樹脂剥離除去工程を行い、前記付着樹脂剥離除去工程の後に、前記樹脂封止済基板における切断線に沿って前記樹脂封止済基板を個々の最小単位に切断分割する基板切断分割工程を行うことを特徴とする。 The resin-sealed substrate cutting and dividing method according to the present invention for solving the above problems is a resin in which an element mounted in each of a plurality of regions partitioned by a plurality of cutting lines is sealed with a resin material. A method for cutting and dividing a resin-sealed substrate, wherein the sealed substrate is cut and divided into individual minimum units along the cutting line, wherein the element is made into an LED (light emitting element), and the resin sealing is performed. An adhesion resin peeling removal process is performed to peel and remove the sealing resin material adhering to the surface on the cutting line in the finished substrate, and the resin sealing is performed along the cutting line in the resin sealed board after the adhesion resin peeling removal process. A substrate cutting / dividing step of cutting and dividing the stopped substrate into individual minimum units is performed.

また、前記課題を解決するための本発明に係る樹脂封止済基板の切断分割方法は、複数の切断線によって区画された複数の領域の各々に装着された素子を樹脂材料にて封止成形した樹脂封止済基板を前記切断線に沿って個々の最小単位に切断分割する樹脂封止済基板の切断分割方法であって、前記樹脂材料をシリコーン樹脂とする工程を行い、前記樹脂封止済基板における切断線上の表面に付着した封止樹脂材料を剥離除去する付着樹脂剥離除去工程を行い、前記付着樹脂剥離除去工程の後に、前記樹脂封止済基板における切断線に沿って前記樹脂封止済基板を個々の最小単位に切断分割する基板切断分割工程を行うことを特徴とする。 Further, the method for cutting and dividing a resin-sealed substrate according to the present invention for solving the above-mentioned problem is to seal and mold an element mounted on each of a plurality of regions partitioned by a plurality of cutting lines with a resin material. A method for cutting and dividing a resin-sealed substrate , wherein the resin-sealed substrate is cut and divided into individual minimum units along the cutting line, wherein the resin material is made into a silicone resin. An adhesion resin peeling removal process is performed to peel and remove the sealing resin material adhering to the surface on the cutting line in the finished substrate, and the resin sealing is performed along the cutting line in the resin sealed board after the adhesion resin peeling removal process. A substrate cutting / dividing step of cutting and dividing the stopped substrate into individual minimum units is performed.

また、前記課題を解決するための本発明に係る樹脂封止済基板の切断分割方法は、前記した付着樹脂剥離除去工程が、前記基板の切断分割部位における所要切断幅の付着樹脂を剥離刃にて剥離除去することを特徴とする。   Further, in the method for cutting and dividing a resin-sealed substrate according to the present invention for solving the above-described problem, the above-described attached resin peeling and removing step uses the attached resin having a required cutting width at the cutting and dividing portion of the substrate as a peeling blade. It is characterized by peeling and removing.

また、前記課題を解決するための本発明に係る樹脂封止済基板の切断分割方法は、前記した付着樹脂剥離除去工程が、まず、前記基板における切断分割幅と対応する部位の付着樹脂に切断溝を刻設し、次に、前記切断溝が刻設された付着樹脂を剥離刃にて剥離除去することを特徴とする。   In addition, in the method for cutting and dividing a resin-sealed substrate according to the present invention for solving the above-described problem, the above-described attached resin peeling and removing step is first cut into an attached resin at a portion corresponding to the cut and divided width in the substrate. A groove is engraved, and then the adhered resin in which the cutting groove is engraved is peeled and removed by a peeling blade.

また、前記課題を解決するための本発明に係る樹脂封止済基板の切断分割方法は、前記した付着樹脂剥離除去工程によって剥離された樹脂を、少なくとも、前記基板における切断分割部位の外部へ排出する工程を備えたことを特徴とする。   In addition, in the method for cutting and dividing a resin-sealed substrate according to the present invention for solving the above-described problem, the resin peeled off by the attached resin peeling and removing step is discharged at least outside the cutting and dividing portion of the substrate. It is characterized by comprising the step of:

本発明によれば、樹脂封止済基板における切断位置（切断線上）の表面に付着した封止樹脂材料を剥離除去した後に、該切断位置（切断線）に沿って樹脂封止済基板を個々の最小単位に切断分割することが可能となる。
従って、上述したような封止用樹脂材料による回転ブレードの目詰まり等が発生しないため、樹脂封止済基板の切断効率・切断品質を向上させることができると共に、上記回転ブレード自体の耐久性を向上させることができると云った実用的な効果を奏する。 According to the present invention, after the sealing resin material adhering to the surface of the cutting position (on the cutting line) in the resin-sealed substrate is peeled and removed, the resin-sealed substrates are individually separated along the cutting position (cutting line). It is possible to cut and divide into the smallest units.
Therefore, since the clogging of the rotating blade due to the sealing resin material as described above does not occur, the cutting efficiency and cutting quality of the resin-sealed substrate can be improved, and the durability of the rotating blade itself can be improved. There is a practical effect that it can be improved.

また、本発明によれば、樹脂封止済ＬＥＤ（発光素子）基板の切断分割方法に用いることが可能となる。
従って、本発明によれば、樹脂封止済ＬＥＤ基板の切断分割を効率良く且つ確実に行うことができると云った実用的な効果を奏する。 Moreover, according to this invention, it becomes possible to use for the cutting-splitting method of resin-sealed LED (light emitting element) board | substrates .
Therefore, according to the present invention, there is a practical effect that the resin-sealed LED substrate can be cut and divided efficiently and reliably.

また、本発明によれば、剥離刃によって樹脂封止済基板における切断位置（切断線上）の表面に付着した封止樹脂材料を剥離除去することが可能となる。
従って、本発明によれば、封止樹脂材料の剥離除去をより効率良く且つ確実に行うことができると云った実用的な効果を奏する。 Moreover, according to this invention, it becomes possible to peel and remove the sealing resin material adhering to the surface of the cutting position (on the cutting line) in the resin-sealed substrate with the peeling blade.
Therefore, according to the present invention, there is a practical effect that the sealing resin material can be peeled and removed more efficiently and reliably.

また、本発明によれば、剥離刃によって、基板における切断分割幅と対応する部位の付着樹脂に刻設した切断溝に沿って、該切断溝間の付着樹脂を剥離除去することが可能となる。
従って、本発明によれば、封止樹脂材料の剥離除去をより効率良く且つ確実に行うことができると云った実用的な効果を奏する。 In addition, according to the present invention, it is possible to peel and remove the adhesive resin between the cut grooves along the cut grooves formed in the attached resin at the portion corresponding to the cut division width of the substrate by the peeling blade. .
Therefore, according to the present invention, there is a practical effect that the sealing resin material can be peeled and removed more efficiently and reliably.

また、本発明によれば、樹脂封止済基板における切断線上の表面から剥離除去された樹脂片を該基板における切断分割部位の外部へ排出することが可能となる。
従って、本発明によれば、剥離除去された樹脂片を基板における切断分割部位の外部へ排出することできるので、これらの不要な異物が残存して、例えば、回転ブレードによる基板切断作用を阻害したり、或は、該基板表面の樹脂封止成形体を損傷する等の弊害の発生を未然に防止することができると云った実用的な効果を奏する。 Moreover, according to this invention, it becomes possible to discharge | emit the resin piece peeled and removed from the surface on the cutting line in the resin-sealed board | substrate to the exterior of the cutting | disconnection division | segmentation site | part in this board | substrate.
Therefore, according to the present invention, the peeled and removed resin piece can be discharged to the outside of the cut and divided part of the substrate, so that these unnecessary foreign matters remain, for example, hindering the substrate cutting action by the rotating blade. Or, there is a practical effect that it is possible to prevent the occurrence of adverse effects such as damage to the resin-sealed molded body on the substrate surface.

図１は本発明に係る樹脂封止済基板の切断分割装置で、図１(1) はその要部を示す概略側面図、図１(2) は図１(1) に対応する部分拡大縦断図である。FIG. 1 is a cutting / dividing apparatus for a resin-sealed substrate according to the present invention. FIG. 1 (1) is a schematic side view showing an essential part thereof, and FIG. 1 (2) is a partially enlarged longitudinal section corresponding to FIG. FIG. 図２(1) 及び図２(2) は図１(2) に対応する側面図で、樹脂封止済基板の表面に付着した封止樹脂材料を剥離除去する工程の作用説明図である。FIGS. 2 (1) and 2 (2) are side views corresponding to FIG. 1 (2), and are operation explanatory views of the process of peeling and removing the sealing resin material adhering to the surface of the resin-sealed substrate. 図３(1) 及び図３(2) は図１(2) に対応する正面図で、樹脂封止済基板の表面に付着した封止樹脂材料を剥離除去する工程の作用説明図である。FIGS. 3 (1) and 3 (2) are front views corresponding to FIG. 1 (2), and are operation explanatory views of the process of peeling and removing the sealing resin material adhering to the surface of the resin-sealed substrate. 図４(1) 及び図４(2) は樹脂封止済基板を個々の最小単位に切断分割する工程の作用説明図である。4 (1) and 4 (2) are explanatory views of the operation of the step of cutting and dividing the resin-sealed substrate into individual minimum units. 図５は本発明に係る他の樹脂封止済基板の切断分割装置であって、図５(1) はその要部を示す概略側面図、図５(2) は図５(1) のＡ−Ａ線における拡大縦断正面図、図５(3) は図５(2) に対応する部分拡大断面図である。FIG. 5 shows another resin-sealed substrate cutting / dividing apparatus according to the present invention. FIG. 5 (1) is a schematic side view showing the main part, and FIG. 5 (2) is A in FIG. 5 (1). FIG. 5 (3) is a partially enlarged sectional view corresponding to FIG. 5 (2). 図６は従来の樹脂封止済基板切断分割装置の構成例を示しており、図５(1) はその要部を示す概略側面図、図５(2) は図５(1) に対応する部分拡大縦断面図である。6 shows a configuration example of a conventional resin-sealed substrate cutting and dividing apparatus. FIG. 5 (1) is a schematic side view showing the main part, and FIG. 5 (2) corresponds to FIG. 5 (1). It is a partial expanded longitudinal cross-sectional view.

以下、本発明に係る第一実施例の形態を図１乃至図４に基づいて説明する。   Hereinafter, the form of the first embodiment according to the present invention will be described with reference to FIGS.

図１は、本発明に係る樹脂封止済基板の切断分割装置の要部を示しており、基板保持機構２０における基板保持テーブル２０ｄと、上記基板保持テーブル２０ｄの上面に吸着保持させた樹脂封止済基板Ｗと、該樹脂封止済基板の付着樹脂剥離除去機構７０の概略構成を図示している。   FIG. 1 shows a main part of a cutting and dividing apparatus for a resin-sealed substrate according to the present invention. The substrate holding table 20d in the substrate holding mechanism 20 and the resin seal sucked and held on the upper surface of the substrate holding table 20d are shown. A schematic configuration of the stopped substrate W and the adhesion resin peeling and removing mechanism 70 of the resin-sealed substrate is illustrated.

また、上記樹脂封止済基板Ｗは、基板５０上に装着したＬＥＤ６０を封止樹脂材料４０にて封止成形して構成されている。   The resin-sealed substrate W is formed by sealing and molding the LED 60 mounted on the substrate 50 with the sealing resin material 40.

また、上記基板保持機構２０には、従来装置の構成と同様に、機台１０上において前後移動方向に沿って並設した一対の案内レール２０ａと、該案内レールに前後移動可能な状態で嵌装した移動テーブル２０ｂと、該移動テーブル上に設けた支持テーブル２０ｃと、該支持テーブル上に設けた基板保持テーブル２０ｄとが備えられている。
また、上記支持テーブル２０ｃは上記移動テーブル２０ｂ上面に枢着されると共に、移動テーブル２０ｂ上において水平方向への回転が可能となるように設けられている。
なお、上記保持テーブル２０ｄの上面には、樹脂封止済基板Ｗの切断位置（切断線）Ｃに対応する回転ブレードの逃げ溝（図示なし）が縦横に並設されており、また、この保持テーブル２０ｄの上面所定位置には、切断分割された個々の基板を各別に吸着保持するための吸引孔（図示なし）等が設けられている。 Similarly to the configuration of the conventional apparatus, the substrate holding mechanism 20 is fitted with a pair of guide rails 20a arranged side by side along the front-rear movement direction on the machine base 10 so as to be movable in the front-rear direction. A mounted movement table 20b, a support table 20c provided on the movement table, and a substrate holding table 20d provided on the support table are provided.
The support table 20c is pivotally attached to the upper surface of the moving table 20b, and is provided so as to be able to rotate in the horizontal direction on the moving table 20b.
In addition, on the upper surface of the holding table 20d, escape grooves (not shown) of rotating blades corresponding to the cutting position (cutting line) C of the resin-sealed substrate W are arranged side by side in the vertical and horizontal directions. At predetermined positions on the upper surface of the table 20d, there are provided suction holes (not shown) and the like for sucking and holding individual cut and divided substrates.

また、上記した付着樹脂剥離除去機構７０には、上記した機台１０上において左右移動方向に沿って並設した一対の案内レール７０ａと、該案内レールに左右移動可能に嵌装した移動テーブル７０ｂと、該移動テーブル上に設けた上下方向ガイド７０ｃと、該上下方向ガイド７０ｃに嵌装させた上下スライダ７０ｄと、該上下スライダに設けた付着樹脂剥離除去ユニット７０ｅとが備えられている。
更に、この付着樹脂剥離除去機構７０には、樹脂封止済基板Ｗの切断分割部位における所要切断幅８０の付着樹脂（封止樹脂材料４１）を剥離除去するためのスクレーパや彫刻刀等から成る付着樹脂剥離用の剥離刃７１と、該剥離刃にて剥離した樹脂片４１ａを、少なくとも、上記樹脂封止済基板Ｗにおける切断分割部位の外部へ吸引力にて強制排出するための吸引排出機構７２が備えられている。
なお、図示していないが、上記機台１０上には、従来装置の構成と同様の案内レール、該案内レールに嵌装した移動テーブル、該移動テーブル上に設けた上下方向ガイド、該上下方向ガイドに嵌装させた上下スライダ、該上下スライダに設けたスピンドルユニット、該スピンドルユニットのスピンドルに固着させた基板切断用の回転ブレード等から構成される基板切断機構（図６(1) 参照）が備えられている。 Further, the above-mentioned adhered resin peeling and removing mechanism 70 includes a pair of guide rails 70a arranged side by side along the horizontal movement direction on the above-described machine base 10, and a moving table 70b fitted to the guide rails so as to be movable left and right. A vertical guide 70c provided on the movable table, a vertical slider 70d fitted to the vertical guide 70c, and an adhesive resin peeling / removing unit 70e provided on the vertical slider.
Further, the adhesion resin peeling / removal mechanism 70 includes a scraper, a sculptured knife, and the like for peeling and removing the adhesion resin (sealing resin material 41) having a required cutting width 80 at the cut and divided portion of the resin-sealed substrate W. A peeling blade 71 for peeling the adhered resin, and a suction / discharge mechanism for forcibly discharging the resin piece 41a peeled by the peeling blade to at least the outside of the cut divided portion of the resin-sealed substrate W with a suction force. 72 is provided.
Although not shown in the drawings, on the machine base 10, the same guide rail as that of the conventional apparatus, a moving table fitted to the guide rail, a vertical guide provided on the moving table, the vertical direction A substrate cutting mechanism (see FIG. 6 (1)) is composed of an upper and lower slider fitted to a guide, a spindle unit provided on the upper and lower sliders, and a rotating blade for cutting the substrate fixed to the spindle of the spindle unit. Is provided.

次に、上記付着樹脂剥離除去機構７０にて樹脂封止済基板Ｗの切断分割部位における所要切断幅８０の付着樹脂（封止樹脂材料４１）を剥離除去する場合について説明する。
まず、上記移動テーブル７０ｂと上下スライダ７０ｄとを作動させて、図２(1) に示すように、剥離刃７１の刃先を樹脂封止済基板Ｗにおける切断位置（切断線）Ｃに合致させると共に、この状態で剥離刃７１の刃先を該樹脂封止済基板（基板５０）の上面に接合させる。
次に、上記移動テーブル７０ｂを作動させて基板５０の上面に接合させた剥離刃７１を摺動させることにより、基板５０の上面に付着した封止樹脂材料４１を、図２(2) に示すように、該基板の上面から剥離させることができる。
なお、このとき、剥離刃７１にて剥離された樹脂片４１ａは該剥離刃の近傍位置に配置した吸引排出機構７２によって外部へ強制的に排除されるため、この樹脂片４１ａが、例えば、不要異物として残存し、回転ブレードによる基板切断作用を阻害したり、或は、該基板表面の樹脂封止成形体等を損傷する等の弊害を未然に防止することができる。
更に、このとき、図３(1) 及び図３(2) に示すように、樹脂封止済基板Ｗの切断分割部位における所要切断幅８０の封止樹脂材料４１を剥離除去することができるので、該切断分割部位には基板の上面部５０ａが露出することになる。
即ち、上記した付着樹脂剥離除去工程によって、樹脂封止済基板Ｗにおける全ての切断位置（切断線）Ｃ上に付着した封止樹脂材料４１を剥離除去することができる。従って、全ての切断線Ｃ上に樹脂封止済基板Ｗにおける基板５０の上面部５０ａを露出させることができる。 Next, a case where the attached resin (sealing resin material 41) having the required cutting width 80 at the cut and divided part of the resin-sealed substrate W is peeled and removed by the attached resin peeling and removing mechanism 70 will be described.
First, the moving table 70b and the upper and lower sliders 70d are operated so that the cutting edge of the peeling blade 71 matches the cutting position (cutting line) C in the resin-sealed substrate W as shown in FIG. In this state, the cutting edge of the peeling blade 71 is bonded to the upper surface of the resin-sealed substrate (substrate 50).
Next, the sealing resin material 41 adhering to the upper surface of the substrate 50 by sliding the peeling blade 71 bonded to the upper surface of the substrate 50 by operating the moving table 70b is shown in FIG. 2 (2). Thus, it can be made to peel from the upper surface of this board | substrate.
At this time, since the resin piece 41a peeled off by the peeling blade 71 is forcibly excluded to the outside by the suction / discharge mechanism 72 disposed in the vicinity of the peeling blade, the resin piece 41a is unnecessary, for example. It is possible to prevent adverse effects such as remaining as foreign matter and hindering the cutting action of the substrate by the rotating blade, or damaging the resin-sealed molded body on the substrate surface.
Further, at this time, as shown in FIGS. 3 (1) and 3 (2), the sealing resin material 41 having the required cutting width 80 at the cut and divided part of the resin-sealed substrate W can be peeled and removed. The upper surface portion 50a of the substrate is exposed at the cut and divided part.
That is, the sealing resin material 41 attached on all cutting positions (cutting lines) C in the resin-sealed substrate W can be peeled and removed by the above-described attached resin peeling and removing step. Therefore, the upper surface portion 50a of the substrate 50 in the resin-sealed substrate W can be exposed on all the cutting lines C.

次に、上記した付着樹脂剥離除去工程の終了後において、樹脂封止済基板Ｗの切断位置（切断線）Ｃを切断加工する場合について説明する。
この切断加工工程は、従来装置の構成と同様の基板切断機構（図６(1) 参照）によって行われる。
例えば、まず、基板保持機構２０における保持テーブル２０ｄ上に吸着保持させた樹脂封止済基板Ｗを前後方向に移動させると共に、該基板を水平方向へ回転させて、切断しようとする切断位置Ｃを決定する位置決め制御工程を行い、次に、基板切断機構(３)における回転ブレード(３ｇ)を左右方向に移動させると共に、該回転ブレードを上下方向に移動させて、上記位置決め制御工程によって位置決めされた所定の切断位置Ｃを切断する基板切断工程とを組み合わせて行う。
従って、位置決めされた樹脂封止済基板Ｗにおける全ての切断位置Ｃを切断することによって、封止樹脂材料４０にて封止成形された基板５０上の各ＬＥＤ６０を個々の最小単位に切断分割することができる。
なお、上記基板切断工程において、切断分割されたＬＥＤ６０を含む最小単位の各基板は、保持テーブル２０ｄの上面所定位置に設けられた吸引孔を介して該保持テーブルに各別に吸着保持されている。 Next, a case where the cutting position (cutting line) C of the resin-sealed substrate W is cut after the above-described attached resin peeling and removing step is described.
This cutting process is performed by a substrate cutting mechanism (see FIG. 6 (1)) similar to the configuration of the conventional apparatus.
For example, first, the resin-sealed substrate W sucked and held on the holding table 20d in the substrate holding mechanism 20 is moved in the front-rear direction, and the substrate is rotated in the horizontal direction so that the cutting position C to be cut is set. The positioning control process to be determined is performed, and then the rotating blade (3g) in the substrate cutting mechanism (3) is moved in the left-right direction, and the rotating blade is moved in the up-down direction to be positioned by the positioning control process. This is performed in combination with a substrate cutting step for cutting a predetermined cutting position C.
Therefore, by cutting all the cutting positions C in the positioned resin-sealed substrate W, each LED 60 on the substrate 50 molded by the sealing resin material 40 is cut and divided into individual minimum units. be able to.
In the substrate cutting step, each substrate of the minimum unit including the LED 60 that has been cut and divided is sucked and held by the holding table via a suction hole provided at a predetermined position on the upper surface of the holding table 20d.

上記した樹脂封止済基板Ｗの切断加工工程においては該基板を回転ブレードにて切断する場合について説明しているが、該基板の切断加工手段については他の公知の切断加工手段を採用しても差し支えない。
即ち、この種の基板としては、セラミックや金属、或は、ガラスエポキシ等が用いられているため、その材質に適応した、例えば、レーザ切断加工機その他の最適な切断加工手段を採用すれば良い。 In the above-described cutting process of the resin-encapsulated substrate W, the case where the substrate is cut with a rotating blade is described. However, as the cutting process means for the substrate, other known cutting process means is adopted. There is no problem.
That is, since this type of substrate is made of ceramic, metal, glass epoxy, or the like, a laser cutting machine or other optimum cutting means suitable for the material may be employed. .

上述した第一実施例によれば、樹脂封止済基板Ｗにおける切断位置（切断線）Ｃ上の表面に付着した付着樹脂（封止樹脂材料）４１を剥離除去した後に、該切断位置（切断線）に沿って樹脂封止済基板Ｗを個々の最小単位に切断分割することができる。
このため、付着樹脂（封止樹脂材料）４１による回転ブレード(３ｇ)の目詰まり等の発生を防止して樹脂封止済基板Ｗの切断効率・切断品質を向上させることができるのみならず、上記回転ブレード(３ｇ)自体の耐久性を向上させることができると云った実用的な効果を奏する。
また、上記したように、付着樹脂４１の剥離除去と、樹脂封止済基板Ｗの切断加工とは別工程として行われるため、従来技術と較べて、付着樹脂剥離除去工程としての作業時間が別途に必要となる。しかしながら、該両工程は夫々に独立して行うことができるので、各々の作業時間を短縮化することが可能となる。その結果として、全体的な作業効率・生産性を向上させることができると云った実用的な効果を奏する。 According to the first embodiment described above, after the attached resin (sealing resin material) 41 attached to the surface on the cutting position (cutting line) C in the resin-sealed substrate W is peeled and removed, the cutting position (cutting) The resin-sealed substrate W can be cut and divided into individual minimum units along the line.
For this reason, it is possible not only to prevent clogging of the rotating blade (3g) by the adhering resin (sealing resin material) 41 and improve the cutting efficiency and cutting quality of the resin-sealed substrate W, There is a practical effect that the durability of the rotating blade (3g) itself can be improved.
Further, as described above, since the separation and removal of the adhesion resin 41 and the cutting process of the resin-sealed substrate W are performed as separate processes, the work time as the adhesion resin separation and removal process is separately compared with the conventional technique. Is required. However, since both the steps can be performed independently, each operation time can be shortened. As a result, there is a practical effect that the overall work efficiency and productivity can be improved.

次に、本発明に係る第二実施例の形態を図５に基づいて説明する。   Next, the form of 2nd Example based on this invention is demonstrated based on FIG.

この実施例において前実施例と異なる点は次のとおりであり、その他の点については前実施例について説明した事項と同様である。従って、説明の重複を避けるため、両者に共通する構成については同じ符号を付している。
図５に示す付着樹脂剥離除去機構７０には、樹脂封止済基板Ｗの切断分割幅８０と対応する部位の付着樹脂４１に所定の間隔を保持した状態の二つの切断溝４２・４２を刻設するための二枚の回転刃７３・７３が備えられている。また、この二枚の回転刃７３・７３は、スピンドル７４に軸支されると共に、図５(1) に示すように、剥離刃７１の摺動方向に向かって前方となる位置に配設されている。即ち、剥離刃７１を摺動させて基板５０の上面に付着した封止樹脂材料４１を該基板上面から剥離させる前に、上記切断分割幅８０と対応する部位の付着樹脂４１に切断溝４２・４２を刻設することができるように設けられている。このため、図５(3) に示すように、剥離刃７１は刻設された二本の切断溝４２・４２間の付着樹脂４１を効率良く且つ確実に剥離させることができる。 This embodiment is different from the previous embodiment in the following points, and the other points are the same as those described in the previous embodiment. Therefore, in order to avoid duplication of description, the same reference numerals are given to configurations common to both.
The adhesive resin peeling / removal mechanism 70 shown in FIG. 5 has two cutting grooves 42 and 42 in a state where a predetermined interval is maintained in the adhesive resin 41 in a portion corresponding to the cut division width 80 of the resin-sealed substrate W. Two rotary blades 73 and 73 are provided for installation. Further, the two rotary blades 73 and 73 are pivotally supported by the spindle 74 and are disposed at a position forward in the sliding direction of the peeling blade 71 as shown in FIG. 5 (1). ing. That is, before the sealing resin material 41 adhering to the upper surface of the substrate 50 is separated from the upper surface of the substrate 50 by sliding the peeling blade 71, the cutting grooves 42. 42 is provided so that it can be engraved. For this reason, as shown in FIG. 5 (3), the peeling blade 71 can efficiently and reliably peel the adhesion resin 41 between the two cut grooves 42 and 42 formed.

なお、上記した二枚の回転刃７３・７３は一体的に形成されたものであっても良いが、図５(2) に示すように、この二枚の回転刃の間に間隔調整用のスペーサ７５を交換可能な状態で嵌装させることにより、上記二枚の回転刃７３・７３によって刻設される二本の切断溝４２・４２の間隔を適宜に調整できるようにしても差し支えない。
また、上記したように、樹脂封止済基板Ｗの切断分割幅８０と対応する部位の付着樹脂４１には、図５(2) 及び図５(3) に示すように、上記した二枚の回転刃７３・７３による二本の切断溝４２・４２が刻設されることになる。この二本の切断溝４２・４２は上記切断分割幅８０の両側縁に沿って連続状に刻設されることになり、その後の剥離刃７１による付着樹脂４１の剥離除去工程を、該切断分割幅の両側縁に沿って、より効率良く且つ確実に行うことができる。
なお、上記切断溝４２は付着樹脂４１の剥離除去効率を向上させるためのものであるため、例えば、スピンドル７４に三枚以上の回転刃７３を装着して、上記切断分割幅８０内に三つ以上の切断溝を刻設するように設定しても良い。 The two rotary blades 73 may be formed integrally, but as shown in FIG. 5 (2), the distance between the two rotary blades is adjusted. By fitting the spacer 75 in a replaceable state, the interval between the two cutting grooves 42 and 42 formed by the two rotary blades 73 and 73 can be adjusted appropriately.
Further, as described above, the adhering resin 41 at the portion corresponding to the cut division width 80 of the resin-sealed substrate W has the above-mentioned two sheets as shown in FIGS. 5 (2) and 5 (3). The two cutting grooves 42 and 42 by the rotary blades 73 and 73 are engraved. The two cutting grooves 42 and 42 are continuously engraved along both side edges of the cutting division width 80, and the peeling and removing process of the adhered resin 41 by the peeling blade 71 is performed in the cutting division. This can be done more efficiently and reliably along both side edges of the width.
Since the cutting groove 42 is for improving the removal and removal efficiency of the adhered resin 41, for example, three or more rotary blades 73 are attached to the spindle 74, and three in the cutting division width 80 are provided. You may set so that the above cutting groove may be engraved.

上述した実施例２によれば、回転刃７３によって、樹脂封止済基板Ｗの切断分割幅８０と対応する部位の付着樹脂４１に切断溝４２を刻設することができる。
このため、まず、樹脂封止済基板Ｗの切断分割幅８０と対応する部位の付着樹脂４１に切断溝４２を刻設し、その次に、上記切断溝４２が刻設された付着樹脂４１を剥離刃７１にて剥離除去することができる。
従って、上記付着樹脂４１を、より効率良く且つ確実に行うことができると云った実用的な効果を奏する。
このように、付着樹脂４１の剥離除去工程を、より効率良く且つ確実に行うことができると、後工程となる樹脂封止済基板Ｗの切断工程をも効率良く且つ確実に行うことができるので、該後工程において、例えば、回転ブレード３ｇを高速回転させて基板５０を切削加工する際に、該回転ブレードが該基板の切断位置Ｃに残存する付着樹脂４１に接触して目詰まりを起こしたり、また、その付着樹脂４１に接触して上記切断位置Ｃに突起状の樹脂バリ等を形成したり、また、その付着樹脂４１に接触し且つ該付着樹脂を介してＬＥＤ６０の樹脂封止成形体（レンズ部等）を該基板の表面から剥離させたり或はこれを損傷したりする等の切断加工上の重大な弊害の発生を未然に防止することができる。 According to the above-described second embodiment, the cutting groove 42 can be engraved in the attached resin 41 at a portion corresponding to the cutting division width 80 of the resin-sealed substrate W by the rotary blade 73.
For this reason, first, the cutting groove 42 is cut in the adhesion resin 41 at a portion corresponding to the cut division width 80 of the resin-sealed substrate W, and then the adhesion resin 41 in which the cutting groove 42 is cut is formed. It can be peeled and removed by the peeling blade 71.
Therefore, there is a practical effect that the adhesion resin 41 can be performed more efficiently and reliably.
Thus, if the peeling removal process of the adhesion resin 41 can be performed more efficiently and reliably, the cutting process of the resin-sealed substrate W as a subsequent process can also be performed efficiently and reliably. In the subsequent process, for example, when the rotating blade 3g is rotated at a high speed to cut the substrate 50, the rotating blade comes into contact with the adhered resin 41 remaining at the cutting position C of the substrate to cause clogging. Also, a resin-like molded burr of the LED 60 is formed in contact with the adhesive resin 41 to form a protruding resin burr or the like at the cutting position C, or in contact with the adhesive resin 41 and through the adhesive resin. It is possible to prevent the occurrence of a serious adverse effect on the cutting process such as peeling the lens part (the lens part, etc.) from the surface of the substrate or damaging it.

１ 機台
２ 基板保持機構
２ａ 案内レール
２ｂ 移動テーブル
２ｃ 支持テーブル
２ｄ 基板保持テーブル
３ 基板切断機構
３ａ 案内レール
３ｂ 移動テーブル
３ｃ 上下方向ガイド
３ｄ 上下スライダ
３ｅ スピンドルユニット
３ｆ スピンドル
３ｇ 回転ブレード
４ 樹脂材料
５ 基板
６ ＬＥＤ（発光素子）
１０ 機台
２０ 基板保持機構
２０ａ 案内レール
２０ｂ 移動テーブル
２０ｃ 支持テーブル
２０ｄ 基板保持テーブル
４０ 封止樹脂材料
４１ 付着樹脂（封止樹脂材料）
４１ａ 樹脂片
４２ 切断溝
５０ 基板
５０ａ 基板の上面部
６０ ＬＥＤ
７０ 付着樹脂剥離除去機構
７０ａ 案内レール
７０ｂ 移動テーブル
７０ｃ 上下方向ガイド
７０ｄ 上下スライダ
７０ｅ 付着樹脂剥離除去ユニット
７１ 剥離刃
７２ 吸引排出機構
７３ 回転刃
７４ スピンドル
７５ スペーサ
８０ 所要切断幅
Ｃ 切断位置（切断線）
Ｗ 樹脂封止済基板 1 machine base 2 substrate holding mechanism 2a guide rail 2b moving table 2c support table 2d substrate holding table 3 substrate cutting mechanism 3a guide rail 3b moving table 3c vertical guide 3d vertical slider 3e spindle unit 3f spindle 3g rotating blade 4 resin material 5 substrate 6 LED (light emitting element)
DESCRIPTION OF SYMBOLS 10 Machine stand 20 Substrate holding mechanism 20a Guide rail 20b Moving table 20c Support table 20d Substrate holding table 40 Sealing resin material 41 Adhesive resin (sealing resin material)
41a Resin piece 42 Cutting groove 50 Substrate 50a Upper surface portion of substrate 60 LED
70 Adhesive resin peeling / removal mechanism 70a Guide rail 70b Moving table 70c Vertical guide 70d Vertical slider 70e Adhesive resin peeling / removal unit 71 Peeling blade 72 Suction discharge mechanism 73 Rotary blade 74 Spindle 75 Spacer 80 Required cutting width C Cutting position (cutting line)
W Resin sealed substrate

Claims (5)

複数の切断線によって区画された複数の領域の各々に装着された素子を樹脂材料にて封止成形した樹脂封止済基板を前記切断線に沿って個々の最小単位に切断分割する樹脂封止済基板の切断分割方法であって、
前記素子をＬＥＤ（発光素子）とする工程を行い、
前記樹脂封止済基板における切断線上の表面に付着した封止樹脂材料を剥離除去する付着樹脂剥離除去工程を行い、
前記付着樹脂剥離除去工程の後に、前記樹脂封止済基板における切断線に沿って前記樹脂封止済基板を個々の最小単位に切断分割する基板切断分割工程を行うことを特徴とする樹脂封止済基板の切断分割方法。 Resin sealing that cuts and divides a resin-sealed substrate obtained by sealing and molding an element mounted in each of a plurality of regions partitioned by a plurality of cutting lines into individual minimum units along the cutting lines A method for cutting and dividing a finished board,
A step of making the element an LED (light emitting element);
Performing an adhesion resin peeling removal step of peeling and removing the sealing resin material adhered to the surface on the cutting line in the resin-sealed substrate;
Resin sealing characterized by performing a substrate cutting and dividing step of cutting and dividing the resin-sealed substrate into individual minimum units along a cutting line in the resin-sealed substrate after the adhesion resin peeling and removing step Cutting and dividing method for finished substrates. 複数の切断線によって区画された複数の領域の各々に装着された素子を樹脂材料にて封止成形した樹脂封止済基板を前記切断線に沿って個々の最小単位に切断分割する樹脂封止済基板の切断分割方法であって、
前記樹脂材料をシリコーン樹脂とする工程を行い、
前記樹脂封止済基板における切断線上の表面に付着した封止樹脂材料を剥離除去する付着樹脂剥離除去工程を行い、
前記付着樹脂剥離除去工程の後に、前記樹脂封止済基板における切断線に沿って前記樹脂封止済基板を個々の最小単位に切断分割する基板切断分割工程を行うことを特徴とする樹脂封止済基板の切断分割方法。 Resin sealing that cuts and divides a resin-sealed substrate obtained by sealing and molding an element mounted in each of a plurality of regions partitioned by a plurality of cutting lines into individual minimum units along the cutting lines A method for cutting and dividing a finished board,
Performing a step of using the resin material as a silicone resin;
Performing an adhesion resin peeling removal step of peeling and removing the sealing resin material adhered to the surface on the cutting line in the resin-sealed substrate;
Resin sealing characterized by performing a substrate cutting and dividing step of cutting and dividing the resin-sealed substrate into individual minimum units along a cutting line in the resin-sealed substrate after the adhesion resin peeling and removing step Cutting and dividing method for finished substrates. 前記した付着樹脂剥離除去工程が、前記基板の切断分割部位における所要切断幅の付着樹脂を剥離刃にて剥離除去することを特徴とする請求項１、又は、請求項２に記載の樹脂封止済基板の切断分割方法。   3. The resin sealing according to claim 1, wherein the attached resin peeling and removing step peels and removes the attached resin having a required cutting width at a cut division portion of the substrate with a peeling blade. Cutting and dividing method for finished substrates. 前記した付着樹脂剥離除去工程が、まず、前記基板における切断分割幅と対応する部位の付着樹脂に切断溝を刻設し、次に、前記切断溝が刻設された付着樹脂を剥離刃にて剥離除去することを特徴とする請求項１、又は、請求項２に記載の樹脂封止済基板の切断分割方法。 In the above-described adhesion resin peeling and removing step, first, a cutting groove is formed in the adhesion resin at a portion corresponding to the cutting division width in the substrate, and then the adhesion resin in which the cutting groove is formed is removed with a peeling blade. The method for cutting and dividing a resin-sealed substrate according to claim 1 or 2, wherein peeling and removing are performed. 前記した付着樹脂剥離除去工程によって剥離された樹脂を、少なくとも、前記基板における切断分割部位の外部へ排出する工程を備えたことを特徴とする請求項１、又は、請求項２に記載の樹脂封止済基板の切断分割方法。 3. The resin seal according to claim 1, further comprising a step of discharging the resin peeled by the above-described attached resin peeling and removing step to the outside of the cut divided portion of the substrate. A method for cutting and dividing a stopped substrate.
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