JP5303579B2 - 半導体発光素子取付用モジュール、及び、半導体発光素子モジュール - Google Patents

半導体発光素子取付用モジュール、及び、半導体発光素子モジュール Download PDF

Info

Publication number: JP5303579B2
Authority: JP; Japan
Prior art keywords: semiconductor light; light emitting; emitting element; module; contact
Prior art date: 2011-01-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP2011003448A

Other languages

English (en)

Japanese (ja)

Other versions

JP2012146794A (ja

Inventor

透我妻

敦佐藤

啓光栗元

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kyocera Connector Products Corp

Original Assignee

Kyocera Connector Products Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-01-11

Filing date

2011-01-11

Publication date

2013-10-02

2011-01-11 Application filed by Kyocera Connector Products Corp filed Critical Kyocera Connector Products Corp

2011-01-11 Priority to JP2011003448A priority Critical patent/JP5303579B2/ja

2011-04-18 Priority to KR1020110035594A priority patent/KR101177713B1/ko

2012-08-02 Publication of JP2012146794A publication Critical patent/JP2012146794A/ja

2013-10-02 Application granted granted Critical

2013-10-02 Publication of JP5303579B2 publication Critical patent/JP5303579B2/ja

Status Expired - Fee Related legal-status Critical Current

2031-01-11 Anticipated expiration legal-status Critical

Links

239000004065 semiconductor Substances 0.000 title claims abstract description 164
238000005520 cutting process Methods 0.000 claims description 46
239000002184 metal Substances 0.000 claims description 30
229910052751 metal Inorganic materials 0.000 claims description 30
230000005489 elastic deformation Effects 0.000 claims description 23
239000011347 resin Substances 0.000 claims description 21
229920005989 resin Polymers 0.000 claims description 21
239000000463 material Substances 0.000 claims description 18
238000009792 diffusion process Methods 0.000 claims description 9
230000017525 heat dissipation Effects 0.000 abstract description 19
238000009413 insulation Methods 0.000 abstract description 9
238000005286 illumination Methods 0.000 abstract description 6
230000001747 exhibiting effect Effects 0.000 abstract 1
238000013461 design Methods 0.000 description 21
230000000452 restraining effect Effects 0.000 description 14
238000004519 manufacturing process Methods 0.000 description 10
239000007769 metal material Substances 0.000 description 10
238000000465 moulding Methods 0.000 description 9
229910000906 Bronze Inorganic materials 0.000 description 7
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
239000010974 bronze Substances 0.000 description 7
KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 7
238000010586 diagram Methods 0.000 description 7
238000012986 modification Methods 0.000 description 7
230000004048 modification Effects 0.000 description 7
239000000758 substrate Substances 0.000 description 7
230000000694 effects Effects 0.000 description 5
230000002093 peripheral effect Effects 0.000 description 5
238000012546 transfer Methods 0.000 description 5
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
239000000853 adhesive Substances 0.000 description 4
230000003287 optical effect Effects 0.000 description 4
238000003825 pressing Methods 0.000 description 4
238000002310 reflectometry Methods 0.000 description 4
229910000679 solder Inorganic materials 0.000 description 4
238000005476 soldering Methods 0.000 description 4
230000001070 adhesive effect Effects 0.000 description 3
238000005452 bending Methods 0.000 description 3
238000003780 insertion Methods 0.000 description 3
230000037431 insertion Effects 0.000 description 3
229910001369 Brass Inorganic materials 0.000 description 2
239000004677 Nylon Substances 0.000 description 2
229910052782 aluminium Inorganic materials 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
239000010951 brass Substances 0.000 description 2
238000001746 injection moulding Methods 0.000 description 2
229910052742 iron Inorganic materials 0.000 description 2
229920001778 nylon Polymers 0.000 description 2
238000003466 welding Methods 0.000 description 2
206010037660 Pyrexia Diseases 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
230000031700 light absorption Effects 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
238000000034 method Methods 0.000 description 1
230000002265 prevention Effects 0.000 description 1
230000001629 suppression Effects 0.000 description 1

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]

Landscapes

Engineering & Computer Science (AREA)
General Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
General Physics & Mathematics (AREA)
Theoretical Computer Science (AREA)
Optics & Photonics (AREA)
Led Device Packages (AREA)

JP2011003448A 2011-01-11 2011-01-11 半導体発光素子取付用モジュール、及び、半導体発光素子モジュール Expired - Fee Related JP5303579B2 (ja)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
JP2011003448A JP5303579B2 (ja)	2011-01-11	2011-01-11	半導体発光素子取付用モジュール、及び、半導体発光素子モジュール
KR1020110035594A KR101177713B1 (ko)	2011-01-11	2011-04-18	반도체 발광소자 부착용 모듈 및 반도체 발광소자 모듈

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2011003448A JP5303579B2 (ja)	2011-01-11	2011-01-11	半導体発光素子取付用モジュール、及び、半導体発光素子モジュール

Publications (2)

Publication Number	Publication Date
JP2012146794A JP2012146794A (ja)	2012-08-02
JP5303579B2 true JP5303579B2 (ja)	2013-10-02

Family

ID=46713669

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2011003448A Expired - Fee Related JP5303579B2 (ja)	2011-01-11	2011-01-11	半導体発光素子取付用モジュール、及び、半導体発光素子モジュール

Country Status (2)

Country	Link
JP (1)	JP5303579B2 (ko)
KR (1)	KR101177713B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5609925B2 (ja)	2012-07-09	2014-10-22	日亜化学工業株式会社	発光装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6325958A (ja) *	1986-07-18	1988-02-03	Toshiba Corp	半導体装置
WO2002089222A1 (fr) *	2001-04-26	2002-11-07	Moriyama Sangyo Kabushiki Kaisha	Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses
JP2003051615A (ja) *	2001-05-29	2003-02-21	Tsuchida Seisakusho:Kk	Ｌｅｄ用ソケットおよびこのｌｅｄ用ソケットの製造方法並びにこのｌｅｄ用ソケットを用いたｌｅｄ装着体
KR100674786B1 (ko) *	2002-10-25	2007-01-25	모리야마 산교 가부시키가이샤	발광 모듈
JP2004253328A (ja)	2003-02-21	2004-09-09	Moriyama Sangyo Kk	発光装置及びｌｅｄモジュール
JP2006237464A (ja) *	2005-02-28	2006-09-07	Matsushita Electric Ind Co Ltd	半導体発光装置
JP4379731B2 (ja)	2005-04-01	2009-12-09	住友電装株式会社	発光装置
JP2007214522A (ja) *	2006-02-10	2007-08-23	Intekkusu Kk	光源装置及びこれを用いた照明装置
JP2008282932A (ja) *	2007-05-09	2008-11-20	Omron Corp	発光素子及びその製造方法
TWM338431U (en) *	2008-03-19	2008-08-11	E Pin Optical Industry Co Ltd	Package structure for light emitting diode
JP2009239025A (ja) *	2008-03-27	2009-10-15	Furukawa Electric Co Ltd:The	接続構造

2011
- 2011-01-11 JP JP2011003448A patent/JP5303579B2/ja not_active Expired - Fee Related
- 2011-04-18 KR KR1020110035594A patent/KR101177713B1/ko not_active IP Right Cessation

Also Published As

Publication number	Publication date
JP2012146794A (ja)	2012-08-02
KR20120081540A (ko)	2012-07-19
KR101177713B1 (ko)	2012-08-29

Legal Events

Date	Code	Title	Description
2012-11-23	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121122
2013-02-22	A977	Report on retrieval	Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130222
2013-03-27	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130326
2013-05-09	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130508
2013-06-07	TRDD	Decision of grant or rejection written
2013-06-12	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130611
2013-06-27	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130624
2013-06-28	R150	Certificate of patent or registration of utility model	Free format text: JAPANESE INTERMEDIATE CODE: R150
2016-03-22	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2017-06-27	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2017-07-05	S111	Request for change of ownership or part of ownership	Free format text: JAPANESE INTERMEDIATE CODE: R313111
2017-07-13	R350	Written notification of registration of transfer	Free format text: JAPANESE INTERMEDIATE CODE: R350
2018-06-28	LAPS	Cancellation because of no payment of annual fees

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