JP5296823B2 - 樹脂成形品及びその製造方法 - Google Patents
樹脂成形品及びその製造方法 Download PDFInfo
- Publication number
- JP5296823B2 JP5296823B2 JP2011059672A JP2011059672A JP5296823B2 JP 5296823 B2 JP5296823 B2 JP 5296823B2 JP 2011059672 A JP2011059672 A JP 2011059672A JP 2011059672 A JP2011059672 A JP 2011059672A JP 5296823 B2 JP5296823 B2 JP 5296823B2
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- JP
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- Prior art keywords
- chip
- conductive member
- reinforcing
- resin
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229920005989 resin Polymers 0.000 title claims description 73
- 239000011347 resin Substances 0.000 title claims description 73
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 125
- 238000005476 soldering Methods 0.000 claims description 29
- 238000000465 moulding Methods 0.000 claims description 19
- 230000002787 reinforcement Effects 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/58—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Claims (7)
- 互いに幅方向に間隔をおいて配置された複数の導電部材と、各導電部材に亘るように配置されるチップ部品と、各導電部材及びチップ部品を覆う樹脂部とを備え、各導電部材及びチップ部品を樹脂でインサート成形することにより樹脂部を形成するようにした樹脂成形品において、
前記各導電部材に亘るように各導電部材に接続され、各導電部材同士を固定する補強チップを備え、
補強チップを、各導電部材に亘って延びる絶縁性の補強部材と、各導電部材にそれぞれ接続される複数の接続部とから形成した
ことを特徴とする樹脂成形品。 - 前記チップ部品と補強チップとを互いに厚さ方向に重なり合うように配置し、チップ部品を補強チップの接続部に接続した
ことを特徴とする請求項1記載の樹脂成形品。 - 前記チップ部品を、補強チップの厚さ方向一方の面側に配置するとともに、補強チップの厚さ方向他方の面側を導電部材に接続した
ことを特徴とする請求項2記載の樹脂成形品。 - 前記チップ部品を、補強チップの厚さ方向一方の面側に配置するとともに、チップ部品が各導電部材の間に位置するように、補強チップの厚さ方向一方の面側を導電部材に接続した
ことを特徴とする請求項2記載の樹脂成形品。 - 前記各導電部材に補強チップが厚さ方向に係合する凹部を設けた
ことを特徴とする請求項1、2、3または4記載の樹脂成形品。 - 互いに幅方向に間隔をおいて配置された複数の導電部材に、各導電部材に亘るようにチップ部品を配置し、各導電部材及びチップ部品を覆う樹脂部をインサート成形によって形成する樹脂成形品の製造方法において、
前記各導電部材同士を固定する補強チップを各導電部材に亘るように配置するとともに、
各導電部材、チップ部品及び補強チップをハンダ付けにより接続し、
インサート成形用の金型内にハンダ付け部よりも溶融温度の高い樹脂を充填して各導電部材、チップ部品及び補強チップをインサート成形することにより樹脂部を形成する
ことを特徴とする樹脂成形品の製造方法。 - 前記金型内に充填される樹脂の溶融温度と前記ハンダ付け部の溶融温度との温度差は90℃以下である
ことを特徴とする請求項6記載の樹脂成形品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011059672A JP5296823B2 (ja) | 2011-03-17 | 2011-03-17 | 樹脂成形品及びその製造方法 |
PCT/JP2012/056383 WO2012124682A1 (ja) | 2011-03-17 | 2012-03-13 | 樹脂成形品及びその製造方法 |
US14/005,410 US20140069716A1 (en) | 2011-03-17 | 2012-03-13 | Resin molded product and method for producing same |
EP12758262.5A EP2687350A4 (en) | 2011-03-17 | 2012-03-13 | RESIN MOLDED PRODUCT AND PROCESS FOR PRODUCTION THEREOF |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011059672A JP5296823B2 (ja) | 2011-03-17 | 2011-03-17 | 樹脂成形品及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012192688A JP2012192688A (ja) | 2012-10-11 |
JP5296823B2 true JP5296823B2 (ja) | 2013-09-25 |
Family
ID=46830749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011059672A Active JP5296823B2 (ja) | 2011-03-17 | 2011-03-17 | 樹脂成形品及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140069716A1 (ja) |
EP (1) | EP2687350A4 (ja) |
JP (1) | JP5296823B2 (ja) |
WO (1) | WO2012124682A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6458376B2 (ja) * | 2014-07-03 | 2019-01-30 | 株式会社デンソー | 樹脂成型品の製造方法 |
JP2016103429A (ja) * | 2014-11-28 | 2016-06-02 | 富士通コンポーネント株式会社 | コネクタ |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS445818Y1 (ja) * | 1966-09-13 | 1969-03-03 | ||
US4772225A (en) * | 1987-11-19 | 1988-09-20 | Amp Inc | Electrical terminal having means for mounting electrical circuit components in series thereon and connector for same |
US5583377A (en) * | 1992-07-15 | 1996-12-10 | Motorola, Inc. | Pad array semiconductor device having a heat sink with die receiving cavity |
JPH0676894A (ja) * | 1992-08-28 | 1994-03-18 | Murata Mfg Co Ltd | コネクタ |
JPH10116934A (ja) * | 1996-10-09 | 1998-05-06 | Fuji Electric Co Ltd | 樹脂封止半導体装置およびその製造方法 |
JP3213578B2 (ja) | 1998-03-17 | 2001-10-02 | 三洋電機株式会社 | 混成集積回路装置の製造方法 |
JPH11291286A (ja) * | 1998-04-09 | 1999-10-26 | Hitachi Ltd | 電気接続子の射出成形方法及び発熱抵抗式流量測定装置の電気接続子 |
JP2002074300A (ja) * | 2000-08-31 | 2002-03-15 | Shinko Electric Ind Co Ltd | 非接触型icカ−ド及びその製造方法 |
JP2002184908A (ja) * | 2000-12-19 | 2002-06-28 | Sony Corp | 電子回路装置 |
WO2002095335A1 (de) * | 2001-05-23 | 2002-11-28 | Continental Teves Ag & Co. Ohg | Elektronischer sensor mit elektronischen sensorbauelementen und verfahren zu dessen herstellung |
JP3909670B2 (ja) * | 2002-02-01 | 2007-04-25 | 住友電気工業株式会社 | 光モジュールの製造方法 |
AT411639B (de) * | 2002-04-26 | 2004-03-25 | Pollmann Austria Ohg | Verfahren zum herstellen einer kunststoffumspritzten leiterstruktur sowie elektrische schaltungseinheit mit einer kunststoffumspritzten leiterstruktur |
JP2004363410A (ja) | 2003-06-06 | 2004-12-24 | Honda Motor Co Ltd | 樹脂封止電子部品ユニット及びその製造方法 |
JP3956920B2 (ja) * | 2003-08-26 | 2007-08-08 | 松下電工株式会社 | コネクタ |
DE102004044614B4 (de) * | 2004-09-13 | 2007-10-25 | Hans Huonker Gmbh | Verfahren zur Herstellung von mehrfach umspritzten Elektronikbauteilen |
JP2006329668A (ja) * | 2005-05-23 | 2006-12-07 | Alps Electric Co Ltd | 検出装置及びその製造方法 |
US7268429B2 (en) * | 2005-06-27 | 2007-09-11 | Delphi Technologies, Inc. | Technique for manufacturing an overmolded electronic assembly |
JP4809717B2 (ja) * | 2006-06-03 | 2011-11-09 | アピックヤマダ株式会社 | 樹脂封止型電子部品の製造方法および樹脂封止型電子部品 |
KR101145011B1 (ko) * | 2006-11-03 | 2012-05-11 | 한라공조주식회사 | 전자 클러치용 슬리브 커넥터 및 그 제조방법 |
-
2011
- 2011-03-17 JP JP2011059672A patent/JP5296823B2/ja active Active
-
2012
- 2012-03-13 US US14/005,410 patent/US20140069716A1/en not_active Abandoned
- 2012-03-13 EP EP12758262.5A patent/EP2687350A4/en not_active Withdrawn
- 2012-03-13 WO PCT/JP2012/056383 patent/WO2012124682A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2687350A4 (en) | 2014-09-03 |
EP2687350A1 (en) | 2014-01-22 |
JP2012192688A (ja) | 2012-10-11 |
WO2012124682A1 (ja) | 2012-09-20 |
US20140069716A1 (en) | 2014-03-13 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |