JP5282858B2 - Chip tape direct loading means - Google Patents
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- JP5282858B2 JP5282858B2 JP2006122144A JP2006122144A JP5282858B2 JP 5282858 B2 JP5282858 B2 JP 5282858B2 JP 2006122144 A JP2006122144 A JP 2006122144A JP 2006122144 A JP2006122144 A JP 2006122144A JP 5282858 B2 JP5282858 B2 JP 5282858B2
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- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 2
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Abstract
Description
本発明は、長尺の台紙（キャリァーテープ）に等間隔に形成したチップ装填穴内にチップを１個宛装填してチップテープを製造する工程において、チップ搬送フィダー及び中継ステージで１列搬送・１個搬送されるチップを、従来のようなハンドリング手段（例、ローター若しくはターンテーブル、またはピックアップノズル等）無しで、チップテープの台紙のチップ装填穴へダイレクト（直接）装填するように備え、In the process of manufacturing a chip tape by loading one chip into a chip loading hole formed at an equal interval on a long mount (carrier tape) and manufacturing a chip tape, the present invention conveys one row with a chip conveyance feeder and a relay stage. A chip to be transported is provided to be directly loaded into a chip loading hole of a chip tape mount without a conventional handling means (eg, a rotor or a turntable, or a pickup nozzle).
もって、台紙のチップ装填穴へのチップ装填速度の高速化（例、毎分４０００〜５０００個）を実現して、チップテープの製造効率を画期的に向上したことを特徴とする、チップテープのチップのダイレクト装填手段に係るものである。Have been, speed up the chip loading rate to the chip loading hole mount to achieve (eg, every minute 4000-5000 pieces), characterized in that it has remarkably improved production efficiency of the chip tape, chips The present invention relates to a direct loading means for a tape chip.
従来、狭巾で長尺な台紙（メインテープ、主に紙製）に方形、長方形等のチップの装填穴を等間隔にあけ、各チップ装填穴内に適宜の装填手段でチップを１個宛装填し、そのチップを装填した台紙の上面にトップテープを貼着してチップ装填済みの各チップ装填穴をシールしてチップテープを設けることが広く行われており、例えば、該チップテープを設定個数分宛（例、１００００〜５００００個）リールに巻取ってチップテープリールを製造して、該チップテープリールをチップマウント装置等用として供給している。 Conventionally, rectangular and rectangular chip loading holes are equally spaced on a narrow and long mount (main tape, mainly made of paper), and one chip is loaded to each chip loading hole with appropriate loading means. It is widely practiced to attach a top tape to the upper surface of the mount on which the chip is loaded and seal each chip loading hole where the chip has been loaded to provide a chip tape. A chip tape reel is manufactured by winding on a reel (for example, 10,000 to 50,000), and the chip tape reel is supplied for a chip mount device or the like.
しかして、従来手段によるチップ装填は、例えば、特開平７−５２９０９号公報（特に、図１を参照）に記載のように、チップテープのテープ１の各チップ装填穴２にチップｔを１個宛装填する工程を、チップ搬送フィダー（図１のローター３ａの左側に片仮名で記載の「リニアフィーダー」）で１列搬送されてくるチップｔをローター３ａ（ハンドリング手段の１例）の各チップ装填穴２に１個宛移乗装填し、ローター３ａの回転で搬送し、該ローター３ａのチップ支持凹部７からテープ１の各チップ装填穴へ適宜の移乗手段で移乗装填して行っていたものである。
なお、ハンドリング手段としては、前記ローターの他、例えば、ローターと同様な構成のターンテーブル、チップを１個宛ピックアップして移動するピックアップノズル等が用いられている。）
As the handling means, in addition to the rotor, for example, a turntable having the same configuration as the rotor, a pickup nozzle that picks up one chip and moves it are used. )
しかるところ、上記従来手段は、上記のようにチップ搬送フィダーと台紙との間にローター等のハンドリング手段の設置を必要としていたため、どうしても装置全体の製造コストが嵩み、メンテナンスを要し、 However, since the conventional means required installation of a handling means such as a rotor between the chip transport feeder and the mount as described above, the manufacturing cost of the entire apparatus is inevitably increased, and maintenance is required.
特に、近時の急速なチップの小型化（０６０３型・０．６×０．３ｍｍ、０４０２型・０．４×０．２ｍｍ）及び莫大数需要増に伴い、該チップを台紙の略同形同大の各チップ装填穴への高速装填（毎分・３０００〜５０００個）が強く要求されてきているのに対し、その要望に対応することが困難であり、よって、チップテープ製造の画期的な高速化の大きな妨げとなってきたものである。 In particular, with the recent rapid downsizing of the chip (0603 type, 0.6 × 0.3 mm, 0402 type, 0.4 × 0.2 mm) and a huge increase in demand, the chip has almost the same shape as the mount. Although high-speed loading (3000 to 5000 pieces per minute) has been strongly demanded in each chip loading hole of the same size, it is difficult to meet the demand, and therefore the breakthrough of chip tape manufacturing This has been a major impediment to the speeding up.
上記の要望が強くなった結果、上記従来のハンドリング手段（中間手段）を省いて、チップをチップ搬送フィダーから台紙のチップ装填穴へダイレクトに装填するために有効な手段が種々模索されつつあった。 As a result of the strong demand, various effective means for directly loading the chip from the chip transfer feeder into the chip loading hole of the mount are being sought without the conventional handling means (intermediate means). .
そこで、本発明は、チップのダイレクト挿入を、従来手段に比し格段に高速かつ精密に行い得る手段を提供して、上記従来の課題を解決したものである。 Accordingly, the present invention solves the above-described conventional problems by providing means capable of performing chip direct insertion much faster and more accurately than conventional means.
即ち、本発明は、チップを１列搬送するチップ搬送フィダーにおけるチップ１列送出部と、搬送レール上のチップテープとの中間位置に、チップを高速直進するガイド孔を備えると共に該ガイド孔の周囲にチップの１個分離・測定・検索の手段を備えた中継ステージを介在設置し、該中継ステージのガイド孔の前方でチップテープのチップ装填孔の上方位置に挿入ガイド部を備えて、該挿入ガイド部に、下面にガイド孔からの１個分離チップをチップテープのチップ装填穴の先端縁に衝突する方向へ滑り案内するガイド面を形成したガイド面部を備えると共に、その後方に吸気孔を備えてその吸気力をガイド面を経て中継ステージのガイド孔に常時吸引作用するように備え、That is, the present invention is provided with a guide hole for moving a chip straight at a high speed at a position intermediate between a chip row feeder in a chip carrying feeder for carrying a chip in one row and a chip tape on a carrying rail, and around the guide hole. A relay stage having means for separating / measuring / retrieving one chip is interposed between the guide stage of the relay stage and an insertion guide portion at a position above the chip loading hole of the chip tape. The guide portion is provided with a guide surface portion formed on the lower surface with a guide surface that slides and guides one separated chip from the guide hole in a direction to collide with the tip edge of the chip loading hole of the chip tape, and an intake hole is provided behind the guide surface portion. The suction force is provided so that the suction force always acts on the guide hole of the relay stage through the guide surface,
また、チップをチップ装填穴の先端縁に向け滑り案内するガイド面部の下面のガイド面において、該ガイド面をチップ進入方向に通る接線と、搬送レール上のチップテープのチップ装填穴において、該チップ装填穴の上面をチップ進入方向に通る接線との交叉角度を１０〜４５度に備えたものであり、Further, in the guide surface on the lower surface of the guide surface portion that slides and guides the chip toward the tip edge of the chip loading hole, the chip has a tangent passing through the guide surface in the chip entry direction and the chip loading hole of the chip tape on the transport rail. The crossing angle with the tangent passing through the top surface of the loading hole in the chip entry direction is 10 to 45 degrees,
中継ステージで１個分離し、吸気力でガイド孔内を高速直進したチップが、ガイド面の滑り案内で高速進してチップ装填穴の先端縁に衝突し、若しくは、衝突の反動でガイド面方向へ回動してガイド面に衝突し、それら衝突による前進停止と反動及び自重の複合作用でチップ装填穴内に落下して、チップ装填穴内に装填されるように備えたことを特徴とする、チップテープのチップのダイレクト装填手段によって、課題を解決したものである。 The tip separated by one at the relay stage and moved straight in the guide hole at high speed by the suction force, moved at high speed by the sliding guide of the guide surface and collided with the tip edge of the tip loading hole, or the guide surface direction by reaction of the collision The chip is arranged so as to collide with the guide surface by rotating to the tip and fall into the chip loading hole by a combined action of forward stop, reaction and self-weight due to the collision, and loaded into the chip loading hole. The problem is solved by the direct loading means of the tape chip.
チップをチップ搬送フィダー及び中継ステージで１列搬送・１個搬送されるチップをチップテープの台紙の各チップ装填穴へダイレクトに装填出来るので、従来必要であったローター等のハンドリング手段を省略することが可能であり、よって、装置の省力化、コンパクト化、メンテナンスフリー化、コストダウン等が可能な優れた効果がある。
特に、チップテープの台紙の各チップ装填穴へのダイレクト装填を従来手段に比し格段に高速化することを可能としたため、チップテープ製造の画期的な高速化を実現し得る優れた効果がある。Chips can be directly transferred to each chip loading hole on the chip tape mount by transferring chips in a single row with a chip transfer feeder and relay stage. Therefore, there is an excellent effect that the apparatus can be labor-saving, downsized, maintenance-free, cost reduction, and the like.
In particular, the direct loading of each chip tape mount into each chip loading hole can be made much faster than the conventional means, so it has an excellent effect that can achieve a breakthrough speedup in chip tape manufacturing. is there.
チップを１列搬送するチップ搬送フィダーにおけるチップ１列送出部１と、搬送レール３上のチップテープ２との中間位置に、チップｔを高速直進するガイド孔４ａを備えると共に該ガイド孔４ａの周囲にチップｔの１個分離・測定・検索の手段４ｂを備えた中継ステージ４を介在設置し、該中継ステージ４のガイド孔４ａの前方でチップテープ２のチップ装填穴２ａの上方位置に挿入ガイド部５を備えて、該挿入ガイド部５に、下面にガイド孔４ａからの１個分離チップｔをチップテープ２のチップ装填穴２ａの先端縁に衝突する方向へ滑り案内するガイド面５ｂを形成したガイド面部５ａを備えると共に、その後方に吸気孔６（吸気手段）を備えてその吸気力をガイド面５ｂを経て中継ステージ４のガイド孔４ａに常時吸引作用するように備えた、チップテープのチップのダイレクト装填手段。A guide hole 4a for moving the chip t straight at a high speed is provided at an intermediate position between the chip one-row delivery unit 1 and the chip tape 2 on the transport rail 3 in the chip transport feeder for transporting one row of chips, and the periphery of the guide hole 4a. A relay stage 4 provided with a means 4b for separating, measuring and searching for one chip t is interposed between the guide stage 4a of the relay stage 4 and an insertion guide at a position above the chip loading hole 2a of the chip tape 2. A
本発明の実施例Ａ１を説明する（図１、及び図２、図３を参照）。
実施例Ａ１は、チップを１列搬送するチップ搬送フィダーにおけるチップ１列送出部１と、搬送レール３上のチップテープ２との中間位置に、チップｔを高速直進するガイド孔４ａを備えると共に該ガイド孔４ａの周囲にチップｔの１個分離・測定・検索の手段４ｂを備えた中継ステージ４を介在設置し、該中継ステージ４のガイド孔４ａの前方でチップテープ２のチップ装填穴２ａの上方位置に挿入ガイド部５を備えて、該挿入ガイド部５に、下面にガイド孔４ａからの１個分離チップｔをチップテープ２のチップ装填穴２ａの先端縁に衝突する方向へ滑り案内するガイド面５ｂを形成したガイド面部５ａを備えると共に、その後方に吸気孔６（吸気手段）を備えてその吸気力をガイド面５ｂを経て中継ステージ４のガイド孔４ａに常時吸引作用するように備えたものであり、Example A1 of the present invention will be described (see FIGS. 1, 2 and 3).
Example A1 is provided with a guide hole 4a for moving the chip t at a high speed at a middle position between the chip one-row delivery unit 1 in the chip transport feeder for transporting the chip in one row and the chip tape 2 on the transport rail 3. A relay stage 4 provided with a means 4b for separating, measuring, and searching for one chip t is interposed around the guide hole 4a, and the chip loading hole 2a of the chip tape 2 is inserted in front of the guide hole 4a of the relay stage 4. An insertion guide part 5 is provided at an upper position, and a single separated chip t from the guide hole 4a is slid and guided to the insertion guide part 5 in a direction of colliding with the tip edge of the chip loading hole 2a of the chip tape 2. A guide surface portion 5a having a
上記における、チップｔをチップ装填穴２ａの先端縁に向け滑り案内するガイド面部５ａの下面のガイド面５ｂにおいて、該ガイド面５ｂをチップ進入方向に通る接線Ｌａと、搬送レール３上のチップテープ２のチップ装填穴２ａにおいて、該チップ装填穴２ａの上面をチップ進入方向に通る接線Ｌｂとの交叉角度を１０〜４５度に備えたものであり、In the
中継ステージ４で１個分離し、吸気力でガイド孔４ａ内を高速直進したチップｔが、ガイド面５ｂの滑り案内で高速進してチップ装填穴２ａの先端縁に衝突し、若しくは、衝突の反動でガイド面５ｂ方向へ回動してガイド面５ｂに衝突し、それら衝突による前進停止と反動及び自重の複合作用でチップ装填穴２ａ内に落下して、チップ装填穴２ａ内に装填されるように備えたことを特徴とする、チップテープのチップのダイレクト装填手段Ａ１である。The tip t, which is separated by one at the relay stage 4 and advances straight in the guide hole 4a by the intake force, advances at high speed by the sliding guide of the
上記実施例において、中継ステージ４は、チップを１列搬送するチップ搬送フィダーにおけるチップ１列送出部１と搬送レール３上のチップテープ２の中間位置に備えたものであり、
該中継ステージ４に、チップ送出部１と連通状態にチップｔを高速直進するガイド孔４ａを備えると共に、該ガイド孔４ａを中心としてその周囲に、ガイド孔４ａ内の１列チップｔの先頭のチップｔを一時停止するストッパーピン４ｄ若しくは吸気孔、一時停止した先頭のチップｔの次位のチップｔを一時停止する吸気孔４ｅ、一時停止した先頭チップｔの測定・検索手段４ｂ、１個分離チップｔの通過検出手段４ｃを備えたものであり、
上記の各手段を経たチップｔを１個ずつ次位の挿入ガイド部５へ送給するように備えたものである。In the above-described embodiment, the relay stage 4 is provided at an intermediate position between the chip tape feed unit 1 and the chip tape 2 on the transport rail 3 in the chip transport feeder that transports chips in one row.
The relay stage 4 is provided with a guide hole 4a for moving the chip t straight at a high speed in communication with the chip delivery part 1, and around the guide hole 4a, the leading end of the row of chips t in the guide hole 4a. Stopper pin 4d or intake hole for temporarily stopping the chip t, intake hole 4e for temporarily stopping the next chip t after the temporarily stopped leading chip t, measuring / retrieving means 4b for the temporarily stopped leading chip t, 1 piece separated It is provided with the passage detection means 4c of the chip t,
Chips t that have passed through the above-mentioned means are provided one by one to the next insertion guide portion 5.
挿入ガイド部５は、中継ステージ４のガイド孔４ａの前方の搬送レール３上のチップテープ２のチップ装填穴２ａの上方位置に備えたものであり、
下面にガイド孔４ａからの１個分離チップｔをチップテープ２のチップ装填穴２ａの先端縁に衝突する方向へ滑り案内するガイド面５ｂを形成したガイド面部５ａを備えると共に、その後方に吸気孔６を備え、その吸気力がガイド面５ｂを経て中継ステージ４のガイド孔４ａに常時吸引作用するように備え、また、チップ装填穴２ａへのチップ装填を検出するセンサー（チップ装填検出手段）５ｄを備えたものであり、
上記ガイド面部５ａを、設定寸法上下動自在に備えて、測定・検索による不良チップ、チップ装填孔への装填不良のチップｔを、ガイド面部５ａを上昇して後方の吸気孔６から外部へ吸引排除する、不良チップの排除手段５ｃを備えたものである。The insertion guide portion 5 is provided at a position above the chip loading hole 2a of the chip tape 2 on the transport rail 3 in front of the guide hole 4a of the relay stage 4,
The lower surface is provided with a guide surface portion 5a formed with a
The guide surface portion 5a is provided so as to be movable up and down the set dimension, and a defective chip by measurement / search and a chip t that has not been correctly loaded into the chip loading hole are lifted up the guide surface portion 5a and sucked out from the rear intake hole 6 to the outside. A defective chip removing means 5c for removing is provided.
また、チップをチップ装填穴の先端縁に向け滑り案内するガイド面部の下面のガイド面において、該ガイド面をチップ進入方向に通る接線と、搬送レール上のチップテープのチップ装填穴において、該チップ装填穴の上面をチップ進入方向に通る接線との交叉角度を１０〜４５度に備えたものである。Further, in the guide surface on the lower surface of the guide surface portion that slides and guides the chip toward the tip edge of the chip loading hole, the chip has a tangent passing through the guide surface in the chip entry direction and the chip loading hole of the chip tape on the transport rail. The crossing angle with the tangent passing through the top surface of the loading hole in the chip entry direction is 10 to 45 degrees.
次に、実施例Ａ２を説明する（図４、及び図１〜３を参照）。
実施例Ａ２は、上記実施例Ａ１（図１図示例）の一部を変更した実施例であり、チップを１列搬送するチップ搬送フィダーにおけるチップ１列送出部１、中継ステージ４のガイド孔４ａ、及び挿入ガイド部５のガイド面５ｂを、該ガイド面５ｂをチップ進入方向に通る接線Ｌａに沿って備えた点を変更しただけであり、
よって、チップｔをチップ装填穴２ａの先端縁に向け滑り案内するガイド面部５ａの下面のガイド面５ｂにおいて、該ガイド面５ｂをチップ進入方向に通る接線Ｌａと、搬送レール３上のチップテープ２のチップ装填穴２ａにおいて、該チップ装填穴２ａの上面をチップ進入方向に通る接線Ｌｂとの交叉角度を１０〜４５度に備えた点、その他は同じであるので、詳細な説明を省略する。Next, Example A2 will be described (see FIGS. 4 and 1 to 3).
Example A2 is an example in which a part of the above Example A 1 (example shown in FIG. 1 ) is changed, and a chip one-row delivery unit 1 and a guide hole in the relay stage 4 in a chip transport feeder that transports one row of chips. 4a and the
Therefore, in the
本発明は、チップ搬送フィダー及び中継ステージで１列搬送・１個分離搬送するチップを、チップテープの各チップ装填穴へ、ローター等のハンドリング手段を省略して、ダイレクトに装填出来る手段であるので、当然、新規の構成手段として実施できるばかりでなく、従来既存の構成手段に対しても、その既存のローター等のハンドリング手段を省いて本発明を実施できる優れた汎用性があり、よって、従来既存の構成装置によるチップテープの各チップ装填穴へのダイレクト装填を従来手段に比し格段に高速化して、そのチップテープ製造効率を画期的な高速化することも可能である。Since the present invention is a means that can directly load chips that are conveyed in a row and separated by a chip conveyance feeder and a relay stage into each chip loading hole of a chip tape, without handling means such as a rotor. Of course, not only can it be implemented as a new configuration means, but also the conventional configuration means has excellent versatility that allows the present invention to be carried out by omitting the handling means such as the existing rotor. The direct loading of the chip tape into each chip loading hole by an existing component device can be made much faster than the conventional means, and the chip tape manufacturing efficiency can be dramatically increased.
Ａ１ 図１図示実施例
Ａ２ 図４図示実施例
ｔ チップ
Ｌａ ガイド面５ｂをチップ進入方向に通る接線
Ｌｂ チップ装填穴２ａの上面をチップ進入方向に通る接線
θ 交叉角度（１０〜４５度）
１ チップ搬送フィダーのチップ１列送出部
２ チップテープ
２ａ チップ装填穴
２ｂ チップテープの台紙
２ｃ チップテープを高速間欠搬送するためのピッチホール
３ 搬送レール
４ 中継ステージ
４ａ ガイド孔
４ｂ １個分離・測定（例、電圧、抵抗値、表裏等）手段
４ｃ 検出（例、チップ１個通過検出）手段
４ｅ 吸気孔
５ 挿入ガイド部
５ａ ガイド面部
５ｂ ガイド面
５ｃ 不良チップの排除手段
５ｄ チップ装填検出手段
６ 吸気手段・吸気孔A1 FIG. 1 illustrated embodiment A2 FIG. 4 illustrated embodiment t Tangential line Lb passing through the chip
DESCRIPTION OF SYMBOLS 1 Chip 1 row sending part of chip conveyance feeder 2 Chip tape 2a Chip loading hole 2b Chip tape mount 2c Pitch hole 3 for conveying chip tape intermittently at high speed 3 Conveying rail 4 Relay stage 4a Guide hole 4b One piece separation and measurement ( Example, voltage, resistance value, front and back, etc.) Means 4c Detection (eg, one chip detection) means 4e Air intake hole 5 Insertion guide portion 5a
Claims (4)
また、チップをチップ装填穴の先端縁に向け滑り案内するガイド面部の下面のガイド面において、該ガイド面をチップ進入方向に通る接線と、搬送レール上のチップテープのチップ装填穴において、該チップ装填穴の上面をチ ップ進入方向に通る接線との交叉角度を１０〜４５度に備えたものであり、
中継ステージで１個分離し、吸気力でガイド孔内を高速直進したチップが、ガイド面の滑り案内で高速進してチップ装填穴の先端縁に衝突し、若しくは、衝突の反動でガイド面方向へ回動してガイド面に衝突し、それら衝突による前進停止と反動及び自重の複合作用でチップ装填穴内に落下して、チップ装填穴内に装填されるように備えたことを特徴とする、
チップテープのチップのダイレクト装填手段。Chip 1 row sending unit in the chip carrier feeder you send 1 Retsu搬chips, an intermediate position between the chip tape on the transport rail, the first chip around the guide hole provided with a guide hole at a high speed straight tip A relay stage having means for separating / measuring / searching the individual is interposed, and an insertion guide portion is provided at a position above the chip loading hole of the chip tape in front of the guide hole of the relay stage. The lower surface is provided with a guide surface portion that forms a guide surface that slides and guides one separated chip from the guide hole in the direction of colliding with the tip edge of the chip loading hole of the chip tape, and an intake hole is provided at the rear of the guide surface. Is provided so that it always sucks into the guide hole of the relay stage through the guide surface,
Further, in the guide surface on the lower surface of the guide surface portion that slides and guides the chip toward the tip edge of the chip loading hole, the chip has a tangent passing through the guide surface in the chip entry direction and the chip loading hole of the chip tape on the transport rail. cross angle between the tangent line passing through the top surface of the loading hole in Chi-up approach direction are those having a 10 to 45 degrees,
The tip separated by one at the relay stage and moved straight in the guide hole at high speed by the suction force, moved at high speed by the sliding guide of the guide surface and collided with the tip edge of the tip loading hole, or the guide surface direction by reaction of the collision to collide with the guide surface rotates, and falls into the chip loading the holes with the combined action of the forward stop and recoil and its own weight due to their collision, characterized by comprising as Hama instrumentation into chip loading hole,
Chip tape direct loading means.
該中継ステージに、チップ送出部と連通状態にチップを高速直進するガイド孔を備えると共に、該ガイド孔を中心としてその周囲に、ガイド孔内の１列チップの先頭のチップを一時停止するストッパーピン若しくは吸気孔、一時停止した先頭のチップの次位のチップを一時停止する吸気孔、一時停止した先頭チップの測定・検索手段、１個分離チップの通過検出手段を備えたものであり、
上記の各手段を経たチップを１個ずつ次位の挿入ガイド部へ送給するように備えたものである、
請求項１のチップテープのチップのダイレクト装填手段。The intermediate stage, which has provided the intermediate position of the chip tape on the transport rail chip 1 row sending unit in the chip carrier feeder you send 1 Retsu搬chips,
The relay stage is provided with a guide hole for moving the chip at a high speed in a state of communication with the chip delivery unit, and a stopper pin for temporarily stopping the leading chip of one row chip in the guide hole around the guide hole Or, it is equipped with an intake hole, an intake hole that temporarily stops the next chip after the temporarily stopped first chip, a measurement / retrieval means for the temporarily stopped first chip, and a passage detection means for one separated chip,
It is equipped to feed the chips passed through each means to the next insertion guide part one by one.
A direct loading means for chips of the chip tape according to claim 1 .
下面にガイド孔からの１個分離チップをチップテープのチップ装填穴の先端縁に衝突する方向へ滑り案内するガイド面を形成したガイド面部を備えると共に、その後方に吸気孔を備え、その吸気力がガイド面を経て中継ステージのガイド孔に常時吸引作用するように備えたものであり、
上記ガイド面部を、設定寸法上下動自在に備えて、測定・検索による不良チップ、チップ装填孔への装填不良のチップを、ガイド面部を上昇して後方の吸気孔から外部へ吸引排除する、不良チップの排除手段を備えたものである、
請求項１のチップテープのチップのダイレクト装填手段。The insertion guide part is provided at a position above the chip loading hole of the chip tape on the transport rail in front of the guide hole of the relay stage,
The lower surface is provided with a guide surface portion that forms a guide surface that slides and guides one separated chip from the guide hole in the direction of colliding with the tip edge of the chip loading hole of the chip tape, and is provided with an intake hole at the rear thereof, and the intake force Is provided so as to always act on the guide hole of the relay stage through the guide surface,
The above guide surface part can be moved up and down the set dimensions, and defective chips by measurement and search, chips that are not loaded into the chip loading hole are lifted up the guide surface part and sucked out from the rear intake hole to the outside. With chip removal means,
A direct loading means for chips of the chip tape according to claim 1 .
請求項１のチップテープのチップのダイレクト装填手段。In the guide surface of the lower surface of the guide surface portion for sliding and guiding the chip toward the tip edge of the chip loading hole , the chip loading hole in the tangent passing through the guide surface in the chip entry direction and the chip loading hole of the chip tape on the transport rail The crossing angle with the tangent passing through the upper surface of the chip in the chip entry direction is 10 to 45 degrees,
A direct loading means for chips of the chip tape according to claim 1 .
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| JP5426267B2 (en) * | 2009-07-29 | 2014-02-26 | 池田自動機器株式会社 | Automatic alignment device work damming device |
| JP5716896B2 (en) * | 2010-12-29 | 2015-05-13 | 株式会社村田製作所 | How to store electronic components |
| JP5923827B2 (en) * | 2011-06-01 | 2016-05-25 | 日本リトル株式会社 | Work insertion device and work insertion method |
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| JPH04267710A (en) * | 1991-02-23 | 1992-09-24 | Dainippon Printing Co Ltd | Electronic component taping device |
| JP3537164B2 (en) * | 1993-08-13 | 2004-06-14 | 日東工業株式会社 | Chip tape chip loading device |
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