JP5273804B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP5273804B2 JP5273804B2 JP2009164571A JP2009164571A JP5273804B2 JP 5273804 B2 JP5273804 B2 JP 5273804B2 JP 2009164571 A JP2009164571 A JP 2009164571A JP 2009164571 A JP2009164571 A JP 2009164571A JP 5273804 B2 JP5273804 B2 JP 5273804B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible wiring
- wiring board
- connector
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 125000006850 spacer group Chemical group 0.000 description 13
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
Claims (6)
- 表示パネルと、
前記表示パネルの表示面とは反対側に配置された下フレームと、
前記下フレームの前記表示パネルとは反対側の面に配置された回路基板と、
前記表示パネルに接続されたフレキシブル配線基板とを有し、
前記フレキシブル配線基板は、前記表示パネル側から前記下フレームの前記表示パネルとは反対側の面へ折り返され、且つ少なくとも一部が前記下フレームと前記回路基板との間に配置され、
前記フレキシブル配線基板は穴を有し、
前記下フレームは、前記回路基板の方向に突出する第1の凸部と第2の凸部とを有し、
前記第1の凸部と前記第2の凸部は、前記フレキシブル配線基板の前記穴に挿入されて前記回路基板を支持し、
前記回路基板は、前記下フレームと前記第1の凸部で固定され、
前記第2の凸部が前記回路基板に接触していることを特徴とする表示装置。 - 請求項1に記載された表示装置において、
前記第1の凸部の高さと前記第2の凸部の高さとは共に、前記フレキシブル配線基板の厚みよりも高く、
前記回路基板と前記フレキシブル配線基板との間及び前記下フレームと前記フレキシブル配線基板との間の少なくとも一方に隙間が形成されることを特徴とする表示装置。 - 請求項1又は2に記載された表示装置において、
前記回路基板の、前記フレキシブル配線基板とは反対側の面には、コネクタが搭載され、
前記回路基板は、前記コネクタの搭載位置と前記コネクタ搭載位置から最も近い前記回路基板の端部との間の位置で、前記下フレームに固定されることを特徴とする表示装置。 - 請求項1又は2に記載された表示装置において、
前記回路基板の、前記フレキシブル配線基板とは反対側の面には、コネクタが搭載され、
前記コネクタと前記下フレームの間に、前記フレキシブル配線基板の少なくとも一部が配置されることを特徴とする表示装置。 - 請求項4に記載された表示装置において、
前記コネクタは接続口を有し、
前記接続口は所定の方向を向いており、
前記所定の方向は、前記コネクタの搭載位置から前記フレキシブル配線基板が折り返されている部分へ向かう方向であることを特徴とする表示装置。 - 請求項1又は2に記載された表示装置において、
前記回路基板の、前記フレキシブル配線基板とは反対側の面には、第1のコネクタと第2のコネクタが搭載され、
前記第1のコネクタは接続口を有し、
前記フレキシブル配線基板と前記回路基板とは、前記第1のコネクタの前記接続口の前方を避けて第2のコネクタで接続されていることを特徴とする表示装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009164571A JP5273804B2 (ja) | 2009-07-13 | 2009-07-13 | 表示装置 |
US12/772,393 US8422239B2 (en) | 2009-07-13 | 2010-05-03 | Display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009164571A JP5273804B2 (ja) | 2009-07-13 | 2009-07-13 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011022192A JP2011022192A (ja) | 2011-02-03 |
JP5273804B2 true JP5273804B2 (ja) | 2013-08-28 |
Family
ID=43427317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009164571A Active JP5273804B2 (ja) | 2009-07-13 | 2009-07-13 | 表示装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8422239B2 (ja) |
JP (1) | JP5273804B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5760706B2 (ja) | 2011-05-31 | 2015-08-12 | 三菱電機株式会社 | 面状光源装置および表示装置 |
KR101847570B1 (ko) | 2014-12-19 | 2018-04-10 | 주식회사 쏠리드 | 지연량 조절이 가능한 간섭제거중계기 및 그 지연량 조절 방법 |
JP6598569B2 (ja) * | 2015-08-11 | 2019-10-30 | 三菱電機株式会社 | 電子機器 |
CN111651076A (zh) * | 2019-03-15 | 2020-09-11 | 上海铼锶信息技术有限公司 | 一种集成柔性线路板及其设置方法和相关电子设备 |
CN112888283B (zh) * | 2019-11-30 | 2023-03-24 | 华为技术有限公司 | 一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2565774B2 (ja) * | 1989-08-25 | 1996-12-18 | シャープ株式会社 | 液晶表示装置 |
JP3018653B2 (ja) * | 1991-09-19 | 2000-03-13 | カシオ計算機株式会社 | 液晶表示モジュール |
JP3182468B2 (ja) * | 1993-03-05 | 2001-07-03 | シチズン時計株式会社 | 表示装置 |
JP3594500B2 (ja) * | 1998-11-12 | 2004-12-02 | 松下電器産業株式会社 | 液晶表示器取付接続装置 |
JP3110408B2 (ja) * | 1998-12-25 | 2000-11-20 | 静岡日本電気株式会社 | 携帯機器の液晶表示デバイス保持構造 |
JP3562793B2 (ja) * | 1999-08-04 | 2004-09-08 | 三洋電機株式会社 | 表示装置 |
JP2002328623A (ja) * | 2001-02-27 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 表示装置およびそれに用いる表示パネル並びにその製造方法 |
TW548479B (en) * | 2001-02-27 | 2003-08-21 | Matsushita Electric Ind Co Ltd | Display device, display panel for the device, and the manufacturing method thereof |
JP3814503B2 (ja) | 2001-08-30 | 2006-08-30 | 株式会社日立製作所 | 画像表示装置 |
JP4727383B2 (ja) | 2005-10-27 | 2011-07-20 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
JP2007279591A (ja) * | 2006-04-11 | 2007-10-25 | Toshiba Matsushita Display Technology Co Ltd | 平面表示装置 |
JP2007293104A (ja) * | 2006-04-26 | 2007-11-08 | Optrex Corp | 表示装置 |
JP4842739B2 (ja) * | 2006-09-01 | 2011-12-21 | 株式会社 日立ディスプレイズ | 表示装置 |
JP2008058860A (ja) * | 2006-09-04 | 2008-03-13 | Epson Imaging Devices Corp | 液晶装置及び電子機器 |
KR101348247B1 (ko) * | 2007-06-07 | 2014-01-09 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
JP2009103983A (ja) * | 2007-10-24 | 2009-05-14 | Nihon Kaiheiki Industry Co Ltd | 発光表示装置 |
-
2009
- 2009-07-13 JP JP2009164571A patent/JP5273804B2/ja active Active
-
2010
- 2010-05-03 US US12/772,393 patent/US8422239B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8422239B2 (en) | 2013-04-16 |
JP2011022192A (ja) | 2011-02-03 |
US20110007481A1 (en) | 2011-01-13 |
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