JP5272918B2 - Board device - Google Patents

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JP5272918B2
JP5272918B2 JP2009145330A JP2009145330A JP5272918B2 JP 5272918 B2 JP5272918 B2 JP 5272918B2 JP 2009145330 A JP2009145330 A JP 2009145330A JP 2009145330 A JP2009145330 A JP 2009145330A JP 5272918 B2 JP5272918 B2 JP 5272918B2
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land
solder
substrate
external connection
conductor pattern
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JP2011003711A (en
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浩史 一色
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Denso Wave Inc
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Description

本発明は、ばね性を有する外部接続導体板と接触導通される外部接続用ランドを備えた基板装置に関する。   The present invention relates to a board device including an external connection land that is brought into contact with an external connection conductor plate having a spring property.

従来、電気部品を実装した基板装置では、基板に導体パターンからなる外部接続用ランドを設け、この外部接続用ランドを外部回路端子と接続するようにしたものがある。このものでは、ワイヤーを該外部回路端子と前記外部接続用のランドとに半田付けすることにより両者を導通接続するようにしていた。   2. Description of the Related Art Conventionally, there is a substrate device on which an electrical component is mounted, in which an external connection land made of a conductor pattern is provided on a substrate and the external connection land is connected to an external circuit terminal. In this device, a wire is soldered to the external circuit terminal and the external connection land so that they are conductively connected.

ところがこの場合、上述のワイヤーの一端部及び他端部をそれぞれ前記外部回路端子及び前記外部接続用ランドに半田付けしなければならず、この半田付け作業が非常に面倒であった。
これに対する改善策として、外部回路端子に、ばね性を有する金属製導体板からなる外部接続導体板の一端を接続しておき、この外部接続導体板の他端側を前記基板の前記外部接続用ランドに前記ばね力をもって圧接状態に接触させる構成がある（例えば特許文献１）。 However, in this case, one end and the other end of the wire must be soldered to the external circuit terminal and the external connection land, respectively, and this soldering operation is very troublesome.
As an improvement measure against this, one end of an external connection conductor plate made of a metal conductor plate having a spring property is connected to the external circuit terminal, and the other end side of the external connection conductor plate is used for the external connection of the substrate. There is a configuration in which the land is brought into contact with the land with the spring force (for example, Patent Document 1).

特開平１０−１４９８６２号公報JP 10-149862 A

上述のばね性を有する外部接続導体板を前記基板の前記外部接続用ランドにばね力をもって圧接状態に接触させる構成によれば、ワイヤー半田付けの面倒は解消されるものの、外部接続用ランドの導体パターンが露出する形態となることから、酸化腐食の問題が残り、ランドと外部接続導体板との導通不良を起すおそれがある。
これを改善するために、上記導体パターン表面に半田層を形成することを考えているが、この場合、半田層形成設備や形成工程が増えてしまうと、製造コストが高くなるという問題がある。 According to the configuration in which the external connection conductor plate having the spring property is brought into contact with the external connection land of the substrate in a pressure contact state with a spring force, the trouble of wire soldering is eliminated, but the conductor of the external connection land Since the pattern is exposed, the problem of oxidative corrosion remains and there is a risk of poor conduction between the land and the external connection conductor plate.
In order to improve this, it is considered to form a solder layer on the surface of the conductor pattern, but in this case, if the number of solder layer forming facilities and forming steps increases, there is a problem that the manufacturing cost increases.

本発明は上述の事情に鑑みてなされたものであり、その目的は、ランド用導体パターンの酸化腐食を防止できると共に、製造コストの増加を抑えることができる基板装置を提供することにある。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate device that can prevent oxidative corrosion of a land conductor pattern and suppress an increase in manufacturing cost.

本発明は次に点に着目してなされている。本発明者は、ランド用導体パターン表面に半田層を形成するについて、種々の半田付けの手法を検討してみた。すなわち、基板に半田付けを行う手法としては、一般的には半田ごてを用いて手作業で行う手法が知られているが、このような手作業で半田層を形成するには、時間がかかり、実用的ではない。   The present invention has been made by paying attention to the following points. The present inventor examined various soldering methods for forming a solder layer on the surface of the land conductor pattern. That is, as a technique for soldering to a substrate, a technique of manually using a soldering iron is generally known, but it takes time to form a solder layer manually. Takes and is not practical.

他の半田付けの手法としては、工業的手法があり、これは、大きく分けてリフロー半田とフロー半田とがある。
上記リフロー半田は、基板上に半田ペースト（半田の粉末にフラックスを加えて、適当な粘度にしたもの）を印刷し、その上に電気部品を載せてから熱を加えて半田を溶かす手法である。 As another soldering technique, there is an industrial technique, which is roughly classified into reflow soldering and flow soldering.
The reflow soldering is a technique in which a solder paste (which is made by adding a flux to solder powder to have an appropriate viscosity) is printed on a substrate, electric components are placed on the solder paste, and heat is applied to melt the solder. .

又、前記フロー半田は、基板の一面を電気部品配置面とし他面をフロー半田面とし、且つ該基板に、前記電気部品配置面からフロー半田面まで貫通する端子孔部を形成しておき、電気部品を、基板の電気部品配置面に電気部品を配置すると共に、該電気部品の端子を前記端子孔部に貫通させておき、この状態で、基板のフロー半田面を、半田槽に溶かしておいた半田の表層に浸すことによって、半田付けを行う手法である。   In addition, the flow solder has one surface of the substrate as an electric component placement surface and the other surface as a flow solder surface, and a terminal hole portion penetrating from the electric component placement surface to the flow solder surface is formed in the substrate, The electrical component is placed on the electrical component placement surface of the substrate, and the terminal of the electrical component is passed through the terminal hole, and in this state, the flow solder surface of the substrate is melted in the solder bath. This is a technique of soldering by immersing it in the surface layer of the solder.

前記リフロー半田の手法により外部接続のためのランド用導体パターンに半田層を形成するには、ランド用導体パターン上に、該パターンと同形状の半田ペーストの印刷パターンを製作することが必要であるため、印刷パターンの形状設定も面倒で、しかも主回路印刷パターンに、半田層形成のための印刷パターンを付加した全体印刷パターンを設計し直す面倒もあり、さらには、ランド用導体パターン表面に半田ペーストを加熱し冷却して形成した半田層は剥がれやすいという問題もある。   In order to form a solder layer on a land conductor pattern for external connection by the reflow soldering method, it is necessary to produce a printed pattern of solder paste having the same shape as the pattern on the land conductor pattern. Therefore, it is troublesome to set the shape of the printed pattern, and there is also the trouble of redesigning the entire printed pattern in which the printed pattern for forming the solder layer is added to the main circuit printed pattern. There is also a problem that the solder layer formed by heating and cooling the paste is easily peeled off.

これに対して、前記フロー半田といった手法の場合、基板のフロー半田面にしか、半田槽の溶融半田が浸されず、このままでは、フロー半田面と反対側の電気部品配置面に形成されたランド用導体パターンに半田層を形成できない。   On the other hand, in the case of the method such as the flow solder, the molten solder in the solder bath is only immersed in the flow solder surface of the substrate, and the land formed on the electric component placement surface opposite to the flow solder surface is left as it is. The solder layer cannot be formed on the conductor pattern.

そこで本発明者は、なんとか、半田槽の溶融半田をフロー半田面と反対側の電気部品配置面に誘導できないかを模索し、その結果、前記ランド用導体パターン領域内に、該基板を電気部品配置面からフロー半田面まで貫通し溶融半田が毛管現象にて浸入し得る程度の大きさのスルーホールを形成すれば、フロー半田を前記ランド用導体パターン表面に半田層を形成できることを見出した。   Therefore, the present inventor has sought whether or not the molten solder in the solder bath can be guided to the electric component placement surface opposite to the flow solder surface, and as a result, the substrate is placed in the land conductor pattern region. It has been found that a solder layer can be formed on the surface of the land conductor pattern by forming a through-hole having such a size that the molten solder penetrates from the arrangement surface to the flow solder surface and can penetrate by capillary action.

上述の調査結果を考慮してなされた請求項１の基板装置は、前記基板を、一面を電気部品配置面とし他面をフロー半田面とし、且つ両面間に前記電気部品の端子を前記電気部品配置面からフロー半田面まで貫通させる端子貫通孔部を有する構成とし、前記電気部品を前記電気部品配置面に配置しその端子を前記端子挿通孔部を貫通させて前記フロー半田面でフロー半田付けし、前記外部接続用ランドを、前記基板の電気部品配置面に形成したランド用導体パターンと、前記基板の前記ランド用導体パターン領域内に形成され、該基板を電気部品配置面から前記フロー半田面まで貫通し溶融半田が毛管現象にて浸入し得る程度の大きさのスルーホールと、前記フロー半田により構成され前記フロー半田面から前記スルーホールを通し前記ランド用導体パターン表面に形成された半田層とから構成し、さらに、前記スルーホールは、前記ランド用導体パターンの領域に複数あって、いずれも長円形もしくは楕円形をなし、夫々のスルーホールの長手方向の端部同士が接近するように形成したところに特徴を有する。 The board device according to claim 1, which has been made in consideration of the above investigation results, has the board as an electrical component placement surface, the other side as a flow soldering surface, and terminals of the electrical component between the both sides as the electrical component. It has a structure having a terminal through-hole portion that penetrates from the arrangement surface to the flow solder surface, and the electric component is arranged on the electric component arrangement surface, and the terminal penetrates the terminal insertion hole portion and is flow soldered on the flow solder surface. The land for external connection is formed on the electric component placement surface of the substrate and the land conductor pattern region of the substrate is formed in the land conductor pattern region, and the substrate is connected to the flow solder from the electric component arrangement surface. A through-hole having a size that allows molten solder to penetrate into the surface by capillarity, and the land is formed by the flow solder and passes through the through-hole from the flow solder surface. Consist of a solder layer formed on the conductor pattern surface, further wherein the through hole is a plurality of regions of the conductor pattern for the land, both without the oval or elliptical, the longitudinal direction of the through hole in the respective It is characterized in that it is formed so that the ends of the two are close to each other .

この構成の基板装置によれば、電気部品の端子がフロー半田付けされるときに、溶融状態のフロー半田が、基板のフロー半田面から前記スルーホールを毛管現象により上昇し、そしてランド用導体パターン表面上に広がり、これにより半田層がこのランド用導体パターン表面に形成される。このように、スルーホールを形成するといった簡単な構成で、電気部品の端子を半田付けするときに、ランド用導体パターンに半田層を形成でき、もって、製造コストの増加を抑えつつ、ランド用導体パターンの酸化腐食を防止できる。しかも、この半田層は、ランド用導体パターンのみならず、ランド用導体パターン表面からスルーホール内にまで固着された形態となるから、半田層がランド用導体パターンから剥がれにくいといった効果も奏する。   According to the substrate device of this configuration, when the terminals of the electrical component are flow soldered, the molten flow solder rises from the flow solder surface of the substrate through the through hole by capillary action, and the land conductor pattern The solder layer is formed on the surface of the land conductor pattern. In this way, a solder layer can be formed on the land conductor pattern when a terminal of an electrical component is soldered with a simple configuration such as forming a through hole, thereby suppressing an increase in manufacturing cost and a land conductor. Oxidative corrosion of the pattern can be prevented. Moreover, since the solder layer is fixed not only to the land conductor pattern but also from the surface of the land conductor pattern to the inside of the through hole, there is an effect that the solder layer is hardly peeled off from the land conductor pattern.

この場合、前記スルーホールは、前記ランド用導体パターンの領域に複数あって、いずれも長円形もしくは楕円形をなし、夫々のスルーホールの長手方向の端部同士が接近するように形成している。これによれば、フロー半田処理においてスルーホールを上昇した溶融半田が確実にランド用導体パターン表面に半田層として形成される。

In this case, there are a plurality of the through holes in the area of the land conductor pattern, all of which are oval or elliptical, and are formed so that the end portions in the longitudinal direction of the respective through holes approach each other . . According to this, the molten solder that has lifted the through hole in the flow solder process is reliably formed as a solder layer on the surface of the land conductor pattern.

すなわち、スルーホールが長円形もしくは楕円形をなす場合、当該スルーホールを上昇した溶融半田は長円形もしくは楕円形の曲率半径が小さい部分つまり端部からランド用導体パターン上に溢れやすい。従って、長円形もしくは楕円形をなす複数のスルーホールの夫々の端部が接近する上記請求項２によれば、接近する両端部間で溢れ出た半田が相手端部側へ延びて確実に結合するようになり、もって、フロー半田処理においてスルーホールを上昇した溶融半田が、ランド用導体パターン表面のみならず確実にスルーホール間におけるランド用導体パターン表面に半田層として形成される。   That is, when the through hole has an elliptical shape or an elliptical shape, the molten solder that has moved up the through hole tends to overflow from the portion of the elliptical shape or the elliptical shape having a small curvature radius, that is, the end portion, onto the land conductor pattern. Therefore, according to the second aspect in which the end portions of the plurality of through-holes having an oval shape or an elliptic shape approach each other, the solder overflowing between the approaching both end portions extends toward the other end portion and is securely coupled. As a result, the molten solder that has raised the through-holes in the flow solder process is surely formed as a solder layer not only on the land conductor pattern surface but also on the land conductor pattern surface between the through-holes.

本発明の第１の実施形態を示し、基板装置の外部接続用ランド部分での縦断側面図1 is a vertical side view of an external connection land portion of a board device according to a first embodiment of the present invention. 基板装置をケースに組み込んだ状態で上方から見た斜視図A perspective view seen from above with the substrate device incorporated in the case 基板装置と外部接続端子とを下方から見た斜視図A perspective view of the board device and the external connection terminal as seen from below. 外部接続用ランド部分を下方から見た斜視図Perspective view of the external connection land as seen from below 電気部品配置前及び半田層形成前の状態で示す基板の斜視図The perspective view of the board | substrate shown in the state before electrical component arrangement | positioning and solder layer formation ランド用導体パターン部分の斜視図Perspective view of land conductor pattern 電気部品配置状態で且つ半田層形成前の状態で示す基板の斜視図The perspective view of the board | substrate shown in the state before electrical component arrangement | positioning and solder layer formation フロー半田処理を説明するための図Diagram for explaining flow soldering process フロー半田処理後の外部接続用ランド部分の斜視図Perspective view of external connection land after flow soldering 本発明の第２の実施形態を示す図４相当図FIG. 4 equivalent view showing the second embodiment of the present invention 図１相当図1 equivalent diagram 図７相当図7 equivalent diagram

以下、本発明の第１の実施形態について図１ないし図９を参照して説明する。図２において、電子機器１のケース２には、基板装置収容部３が形成されており、この基板装置収容部３には、基板装置４が上方から配置されている。前記ケース２には、ばね性を有する外部接続導体５が取り付けられており、前記基板装置４が基板装置収容部３に収容配置されたときに、該基板装置４が備えた外部接続用ランド１２（後述する）がこの外部接続導体５と圧接状態に接触するようになっている。   Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In FIG. 2, a substrate device housing portion 3 is formed in the case 2 of the electronic device 1, and the substrate device 4 is disposed in the substrate device housing portion 3 from above. An external connection conductor 5 having a spring property is attached to the case 2, and an external connection land 12 provided in the board device 4 when the board device 4 is housed in the board device housing portion 3. (Described later) comes into contact with the external connection conductor 5 in a pressure contact state.

上記基板装置４について説明する。図１ないし図４において、この基板装置４の基板６は、一面を電気部品配置面６ａとし、他面をフロー半田面６ｂとしている。そして、この基板６において、前記両面６ａ、６ｂ間に、電気部品７、８の端子７ａ、８ａを前記電気部品配置面６ａからフロー半田面６ｂまで貫通させる端子貫通孔部９、１０（図５参照）を有する構成である。この端子貫通孔部９、１０におけるフロー半田面６ｂ側には、図示しないが電気部品７、８の端子７ａ、８ａと半田付けされる端子用ランド部が形成されている。   The said board | substrate apparatus 4 is demonstrated. 1 to 4, the substrate 6 of the substrate device 4 has one surface as an electric component placement surface 6a and the other surface as a flow solder surface 6b. And in this board | substrate 6, the terminal through-hole part 9 and 10 which penetrates the terminals 7a and 8a of the electrical components 7 and 8 from the said electrical component arrangement | positioning surface 6a to the flow solder surface 6b between the said both surfaces 6a and 6b (FIG. 5). Reference). Although not shown, terminal land portions to be soldered to the terminals 7a and 8a of the electrical components 7 and 8 are formed on the flow solder surface 6b side of the terminal through-hole portions 9 and 10.

前記電気部品７、８の端子７ａ、８ａは基板６の電気部品配置面６ａに配置され、端子７ａ、８ａは、前記端子貫通孔部９、１０に貫通されてフロー半田面６ｂに突出されており、この突出端部は後述するフロー半田により前記端子用ランド部と半田付けされている。
さらに、この基板６において前記電気部品配置面６ａには、前記端子貫通孔部９、１０を囲うように閉ループのＧＮＤ用導体パターン１１が形成されている。このＧＮＤ用導体パターン１１には、外部接続用ランド１２が形成されている。 The terminals 7a and 8a of the electric components 7 and 8 are arranged on the electric component arrangement surface 6a of the substrate 6, and the terminals 7a and 8a are penetrated by the terminal through-hole portions 9 and 10 and protruded from the flow solder surface 6b. The projecting end portion is soldered to the terminal land portion by flow solder described later.
Further, in the substrate 6, a closed loop GND conductor pattern 11 is formed on the electrical component placement surface 6 a so as to surround the terminal through-hole portions 9 and 10. An external connection land 12 is formed on the GND conductor pattern 11.

この外部接続用ランド１２は、図１ないし図６に示すように、ランド用導体パターン１３と、スルーホール１４Ａ、１４Ｂと、半田層１５とを備えて構成されている。前記ランド用導体パターン１３は、図５及び図６に示すように、前記ＧＮＤ用導体パターン１１と一体に形成されており、この場合、それぞれほぼ長円形をなす第１のランドパターン部１３ａと第２のランドパターン部１３ｂとを有すると共に、これら各ランドパターン部１３ａと１３ｂとの間を繋ぐ繋ぎパターン部１３ｃを有する。   As shown in FIGS. 1 to 6, the external connection land 12 includes a land conductor pattern 13, through holes 14 </ b> A and 14 </ b> B, and a solder layer 15. As shown in FIGS. 5 and 6, the land conductor pattern 13 is formed integrally with the GND conductor pattern 11, and in this case, the first land pattern portion 13a and the first land pattern portion 13a each having a substantially oval shape are formed. 2 land pattern portions 13b, and a connection pattern portion 13c that connects the land pattern portions 13a and 13b.

又、前記スルーホール１４Ａは、基板６の前記ランド用導体パターン１３領域内のうち前記第１のランドパターン部１３ａ領域内に、該基板６を電気部品配置面６ａから前記フロー半田面６ｂまで貫通して形成されている。さらに、前記スルーホール１４Ｂも、基板６の前記ランド用導体パターン１３領域内のうち前記第２のランドパターン部１３ｂ領域内に、該基板６を電気部品配置面６ａから前記フロー半田面６ｂまで貫通して形成されている。   The through hole 14A penetrates the substrate 6 from the electrical component placement surface 6a to the flow solder surface 6b in the first land pattern portion 13a region in the land conductor pattern 13 region of the substrate 6. Is formed. Further, the through hole 14B also penetrates the substrate 6 from the electric component placement surface 6a to the flow solder surface 6b in the second land pattern portion 13b region of the land conductor pattern 13 region of the substrate 6. Is formed.

これらスルーホール１４Ａ、１４Ｂは、図６に示すように、いずれも長円形をなし、夫々のスルーホール１４Ａ、１４Ｂの長手方向の端部１４Ａ１、１４Ｂ１同士が接近するように形成されている。さらに、これらスルーホール１４Ａ、１４Ｂは、溶融半田が毛管現象にて浸入し得る程度の大きさ（幅寸法）に形成されている。   As shown in FIG. 6, these through holes 14A and 14B are all oval and formed so that the end portions 14A1 and 14B1 in the longitudinal direction of the respective through holes 14A and 14B approach each other. Furthermore, these through holes 14A and 14B are formed in a size (width dimension) that allows molten solder to enter by capillary action.

前記半田層１５は後述するフロー半田により構成されており、前記フロー半田面６から前記スルーホール１４Ａ、１４Ｂを通し前記ランド用導体パターン１３表面に形成されている。   The solder layer 15 is made of flow solder described later, and is formed on the surface of the land conductor pattern 13 from the flow solder surface 6 through the through holes 14A and 14B.

ここで、前記電気部品７、８の端子７ａ、８ａの半田付け及び前記半田層１５の形成手順について説明する。図５に示すように、基板６の電気部品配置面６ａを上向きとし、そして図７に示すように、この電気部品配置面６ａの各端子貫通孔部９、１０に電気部品７、８の各端子７ａ、８ａを貫通させた形態で、該電気部品７、８を電気部品配置面６ａに配置し、この状態で、図８に示すように、フロー半田処理を行う。このフロー半田処理においては、基板６のフロー半田面６ｂを、図示しないフロー半田槽に収容された溶融状態のフロー半田１６に浸す。   Here, a procedure for soldering the terminals 7a and 8a of the electrical components 7 and 8 and forming the solder layer 15 will be described. As shown in FIG. 5, the electric component placement surface 6a of the substrate 6 is directed upward, and as shown in FIG. 7, each of the electric components 7, 8 is inserted into the terminal through holes 9, 10 of the electric component placement surface 6a. The electric components 7 and 8 are arranged on the electric component arrangement surface 6a in a form in which the terminals 7a and 8a are penetrated. In this state, as shown in FIG. 8, a flow soldering process is performed. In this flow soldering process, the flow solder surface 6b of the substrate 6 is immersed in a molten flow solder 16 accommodated in a flow solder bath (not shown).

これにより、電気部品７、８においてフロー半田面６ｂから突出する端子７ａ、８ａがフロー半田１６により、図示しない前記端子用ランド部と半田付けされる。これと同時に、溶融状態のフロー半田１６が、基板６のフロー半田面６ａから前記スルーホール１４Ａ、１４Ｂを毛管現象により上昇し、該スルーホール１４Ａ、１４Ｂ上端開口からランド用導体パターン１３表面上に溢れ出て、広がる。   As a result, the terminals 7 a and 8 a protruding from the flow solder surface 6 b in the electrical components 7 and 8 are soldered to the terminal land portion (not shown) by the flow solder 16. At the same time, the molten flow solder 16 rises from the flow solder surface 6a of the substrate 6 through the through holes 14A and 14B by capillarity, and from the upper end openings of the through holes 14A and 14B onto the land conductor pattern 13 surface. Overflow and spread.

この場合、スルーホール１４Ａ、１４Ｂが長円形をなすから、当該スルーホール１４Ａ、１４Ｂを上昇した溶融半田は長円形の曲率半径が小さい部分つまり端部１４Ａ１、１４Ａ２、１４Ｂ１、１４Ｂ２からランド用導体パターン１３上に溢れやすい。そして、長円形をなすスルーホール１４Ａ、１４Ｂの夫々の端部１４Ａ１、１４Ｂ１が接近するから、この接近する両端部１４Ａ１、１４Ｂ１間で溢れ出た半田１６が繋ぎパターン１３ｃ上を相手端部側へ延びて確実に結合するようになる。さらに、各スルーホール１４Ａ、１４Ｂの長手方向へ延びる側端部からも溶融フロー半田１６が溢れ出るようになり、第１のランドパターン１３ａ、第２のランドパターン１３ｂ上にも広がる。そして、このフロー半田１６が冷却固化することにより、ランド用導体パターン１３表面上に前記半田層１５が形成される。そして、スルーホール１４Ａ、１４Ｂにはこの半田層１５と一体の半田充填部１５ａが形成される。   In this case, since the through holes 14A and 14B have an oval shape, the molten solder that has moved up the through holes 14A and 14B has a conductor pattern for land from a portion of the oval with a small radius of curvature, that is, from the end portions 14A1, 14A2, 14B1, and 14B2. It is easy to overflow on 13th. Since the end portions 14A1 and 14B1 of the oval through holes 14A and 14B approach each other, the solder 16 overflowing between the approaching both end portions 14A1 and 14B1 joins the pattern 13c to the other end side. It extends and comes to join securely. Further, the melt flow solder 16 overflows from the side end portions of the through holes 14A and 14B extending in the longitudinal direction, and spreads on the first land pattern 13a and the second land pattern 13b. The flow solder 16 is cooled and solidified to form the solder layer 15 on the surface of the land conductor pattern 13. A solder filling portion 15a integrated with the solder layer 15 is formed in the through holes 14A and 14B.

上述のようにフロー半田処理された基板装置４の半田層１５を下向きにして、図２に示すように、前記ケース２の基板装置収容部３に収容配置すると、外部接続用ランド１２の半田層１５が前記外部接続導体５に当接してこれを押し下げる。これにより、外部接続用ランド５が弾性変形して、自身のばね力により外部接続用ランド１２と圧接する。   When the solder layer 15 of the board device 4 that has been subjected to the flow soldering process as described above faces downward and is accommodated in the board device accommodation portion 3 of the case 2 as shown in FIG. 2, the solder layer of the external connection land 12 is disposed. 15 abuts against the external connection conductor 5 and pushes it down. Thereby, the external connection land 5 is elastically deformed and press-contacted with the external connection land 12 by its own spring force.

このとき、図４に示すように、前記外部接続導体５は、前記外部接続用ランド１２のうち、スルーホール１４Ａ、１４Ｂの端部間の部分１２ａ（繋ぎパターン１３ｃの部分）に接触（接触する部分を５ａで示している）するように形状及び長さなどが予め設定されている。   At this time, as shown in FIG. 4, the external connection conductor 5 contacts (contacts) a portion 12a (a portion of the connecting pattern 13c) between the end portions of the through holes 14A and 14B in the external connection land 12. The shape and length are set in advance so that the portion is indicated by 5a).

上述したように本実施形態によれば、基板としてフロー半田により電気部品７、８の端子７ａ、８ａが半田付けされる基板６を用い、この基板６の電気部品配置面６ａに設けたランド用導体パターン１３領域内に、スルーホール１４Ａ、１４Ｂを形成するといった簡単な構成で、電気部品７、８の端子７ａ、８ａを半田付けするときに、ランド用導体パターン１３に半田層１５を形成でき、もって、ランド用導体パターン１３の酸化腐食を防止できると共に、製造コストの増加を抑えることができる。しかも、この半田層１５は、ランド用導体パターン１３のみならず、ランド用導体パターン１３表面からスルーホール１４Ａ、１４Ｂ内にまで固着された形態となるから、半田層１３がランド用導体パターン１３から剥がれにくいといった効果も奏する。   As described above, according to the present embodiment, the substrate 6 on which the terminals 7a and 8a of the electrical components 7 and 8 are soldered by flow soldering is used as the substrate, and the land for the land provided on the electrical component placement surface 6a of the substrate 6 The solder layer 15 can be formed on the land conductor pattern 13 when the terminals 7a and 8a of the electrical components 7 and 8 are soldered with a simple configuration in which the through holes 14A and 14B are formed in the conductor pattern 13 region. Therefore, the oxidative corrosion of the land conductor pattern 13 can be prevented, and an increase in manufacturing cost can be suppressed. Moreover, since the solder layer 15 is fixed not only to the land conductor pattern 13 but also from the surface of the land conductor pattern 13 to the through holes 14A and 14B, the solder layer 13 is formed from the land conductor pattern 13. There is also an effect that it is difficult to peel off.

又、本実施形態によれば、前記スルーホール１４Ａ、１４Ｂが、前記ランド用導体パターン１３の領域に複数あって、いずれも長円形をなし、夫々のスルーホール１４Ａ、１４Ｂの長手方向の端部１４Ａ１、１４Ｂ１同士が接近するように形成したから、フロー半田処理においてスルーホール１４Ａ、１４Ｂを上昇した溶融半田がこれらスルーホール１４Ａ、１４Ｂ間の繋ぎパターン１３ｃ表面で確実に半田層１５として形成させることができる。   Further, according to the present embodiment, there are a plurality of the through holes 14A and 14B in the area of the land conductor pattern 13, each of which has an oval shape, and the end portions in the longitudinal direction of the respective through holes 14A and 14B. 14A1 and 14B1 are formed so as to be close to each other, so that the molten solder that has risen through the through holes 14A and 14B in the flow soldering process is surely formed as the solder layer 15 on the surface of the connecting pattern 13c between the through holes 14A and 14B. Can do.

すなわち、スルーホール１４Ａ、１４Ｂが上述の長円形をなす場合、当該スルーホール１４Ａ、１４Ｂを上昇した溶融半田は長円形の曲率半径が小さい部分つまり端部１４Ａ１、１４Ａ２、１４Ｂ１、１４Ｂ２からランド用導体パターン１３上に溢れやすい。従って、長円形をなす複数のスルーホール１４Ａ、１４Ｂの夫々の端部１４Ａ１、１４Ｂ１が接近する本実施形態によれば、接近する両端部１４Ａ１、１４Ｂ１間で溢れ出た半田が相手端部側へ延びて確実に結合するようになり、もって、フロー半田処理においてスルーホール１４Ａ、１４Ｂを上昇した溶融半田が、スルーホール１４Ａ、１４Ｂ間の繋ぎパターン１３ｃ上に半田層１５として確実に形成されるようになる。そして、その後、スルーホール１４Ａ周囲の第１のランドパターン１３ａ表面及びスルーホール１４Ｂ周囲の第２のランドパターン１３ｂにも溶融半田が広がり、ランド用導体パターン１３表面全体に半田層１５が形成される。   That is, when the through holes 14A and 14B have the above-described oval shape, the molten solder that has moved up the through holes 14A and 14B has a small radius of curvature, that is, ends 14A1, 14A2, 14B1, and 14B2. It tends to overflow on the pattern 13. Therefore, according to the present embodiment in which the end portions 14A1 and 14B1 of the plurality of oval through holes 14A and 14B approach each other, the solder overflowing between the approaching both end portions 14A1 and 14B1 moves toward the opposite end portion. As a result, the molten solder that has risen through the through holes 14A and 14B in the flow solder process is surely formed as the solder layer 15 on the connecting pattern 13c between the through holes 14A and 14B. become. After that, the molten solder spreads on the surface of the first land pattern 13a around the through hole 14A and the second land pattern 13b around the through hole 14B, and the solder layer 15 is formed on the entire surface of the land conductor pattern 13. .

ところで、フロー半田１６をスルーホール１４Ａ、１４Ｂを介してランド用導体パターン１３上に溢れ出して半田層１５を形成する場合には、スルーホール１４Ａ、１４Ｂ部分で、溶融半田が冷却固化する際に半田に肉引け（凹み）が発生することがある。このため、前記外部接続導体板５を外部接続用ランド１２におけるスルーホール１４Ａ、１４Ｂ部分のみで接触させると、接触信頼性が低くて導通が不確実となるおそれがある。   When the solder layer 15 is formed by overflowing the flow solder 16 over the land conductor pattern 13 via the through holes 14A and 14B, the molten solder is cooled and solidified in the through holes 14A and 14B. There may be a shrinkage (dent) in the solder. For this reason, if the external connection conductor plate 5 is brought into contact only with the through holes 14A and 14B in the external connection land 12, contact reliability may be low and conduction may be uncertain.

この点、本実施形態によれば、前記外部接続導体板５を、前記外部接続用ランド１２においてスルーホール１４Ａ、１４Ｂの近接する端部１４Ａ１、１４Ｂ１間の部分１２ａつまり肉引けの無い部分で該外部接続用ランド１２に接触させた構成としたから、外部接続用ランド１２と外部接続導体板５との確実な導通を図ることができる。しかも該部分１２ａの半田層１５は基板６上にあるから、外部接続導体板５のばね力（圧接力）で半田層１５が陥没したりすることもない。   In this regard, according to the present embodiment, the external connection conductor plate 5 is connected to the external connection land 12 at the portion 12a between the adjacent end portions 14A1 and 14B1 of the through holes 14A and 14B, that is, the portion having no shrinkage. Since it is configured to be in contact with the external connection land 12, reliable conduction between the external connection land 12 and the external connection conductor plate 5 can be achieved. Moreover, since the solder layer 15 of the portion 12 a is on the substrate 6, the solder layer 15 is not depressed due to the spring force (pressure contact force) of the external connection conductor plate 5.

なお、上記第１の実施形態では、スルーホール１４Ａ、１４Ｂを長円形に形成したが、楕円形に形成しても良い。
次に、本発明の第２の実施形態について図１０ないし図１２を参照して説明する。この第２の実施形態においては、外部接続用ランド２０のランド用導体パターン２１はほぼ正方形状をなし、このランド用導体パターン２１の領域内に３つのスルーホール２２Ａ、２２Ｂ、２２Ｃが形成されている。これらスルーホール２２Ａ、２２Ｂ、２２Ｃは、いずれも長円形をなし、夫々のスルーホール２２Ａ、２２Ｂ、２２Ｃを長手方向に延びる縁部が略平行をなして近接するように形成している。 In the first embodiment, the through holes 14A and 14B are formed in an oval shape, but may be formed in an oval shape.
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the land conductor pattern 21 of the external connection land 20 has a substantially square shape, and three through holes 22A, 22B, and 22C are formed in the area of the land conductor pattern 21. Yes. These through-holes 22A, 22B, and 22C are all oval, and the through-holes 22A, 22B, and 22C are formed so that the edges extending in the longitudinal direction are close to each other in a substantially parallel manner.

そして、この外部接続用ランド２０の半田層２３も、前述のフロー半田処理によりランド用導体パターン２１表面に形成されている。このフロー半田処理において、長円形をなす各スルーホール２２Ａ、２２Ｂ、２２Ｃを上昇した溶融半田は、前述したように、各スルーホール２２Ａ、２２Ｂ、２２Ｃの端部から溢れやすいものであるが、各スルーホール２２Ａ、２２Ｂ、２２Ｃの長手方向に延びる縁部からも溢れるものである。この場合、この第２の実施形態においては、各スルーホール２２Ａ、２２Ｂ、２２Ｃを長手方向に延びる縁部が略平行をなして近接するように形成したから、隣り合うスルーホール２２Ａ、２２Ｂ、２２Ｃの各縁部間で半田が結合して広範囲の半田層２３を形成することが可能であり、従って、ランド用導体パターン２１をこの実施形態のように広く形成したい場合に好適する。   The solder layer 23 of the external connection land 20 is also formed on the surface of the land conductor pattern 21 by the aforementioned flow soldering process. In this flow soldering process, the molten solder that has risen through the oval through holes 22A, 22B, and 22C tends to overflow from the end portions of the through holes 22A, 22B, and 22C as described above. It overflows also from the edge part extended in the longitudinal direction of through-hole 22A, 22B, 22C. In this case, in the second embodiment, the through holes 22A, 22B, and 22C are formed so that the edges extending in the longitudinal direction are close to each other in a substantially parallel manner, so that the adjacent through holes 22A, 22B, and 22C are adjacent to each other. It is possible to form a wide range of solder layers 23 by bonding the solder between the respective edges, and therefore, it is suitable when the land conductor pattern 21 is to be formed widely as in this embodiment.

そして、この第２の実施形態においては、前記外部接続導体板５を、前記外部接続用ランド２０において前記複数のスルーホール２２Ａ、２２Ｂ、２２Ｃに跨る形態で接触させる構成としている。この構成によれば、外部接続導体板５を、外部接続用ランド２０において肉引けのない複数の各スルーホール２２Ａ、２２Ｂ、２２Ｃ間の部分２０ａ、２０ｂの半田層２３に確実に接触させることができ、しかも該部分２０ａ、２０ｂの半田層２３は基板６上にあるから、外部接続導体板５のばね力で半田層２３が陥没したりすることもなく、総じて、この第２の実施形態においても、外部接続用ランド２０と外部接続導体板５との確実な導通を図ることができる。
なお、本発明は上述した各実施形態に限定されるものではなく、スルーホールは一つ設ける構成でも良いなど、種々変更して実施することができる。 In the second embodiment, the external connection conductor plate 5 is brought into contact with the external connection land 20 in a form straddling the plurality of through holes 22A, 22B, and 22C. According to this configuration, the external connection conductor plate 5 can be reliably brought into contact with the solder layer 23 of the portions 20a, 20b between the plurality of through holes 22A, 22B, 22C that are not thinned in the external connection land 20. In addition, since the solder layer 23 of the portions 20a and 20b is on the substrate 6, the solder layer 23 is not depressed due to the spring force of the external connection conductor plate 5, and generally in the second embodiment. In addition, reliable conduction between the external connection land 20 and the external connection conductor plate 5 can be achieved.
The present invention is not limited to the above-described embodiments, and can be implemented with various modifications such as a configuration in which one through hole is provided.

図面中、１は電子機器、２はケース、３は基板収容部、４は基板装置、５は外部接続導体、６は基板、６ａは電気部品配置面、６ｂはフロー半田面、７、８は電気部品、７ａ、８ａは端子、９、１０は端子貫通孔部、１１はＧＮＤ導体パターン、１２は外部接続用ランド、１３はランド用導体パターン、１４Ａ、１４Ｂはスルーホール、１５は半田層、２０は外部接続用ランド、２１はランド用導体パターン、２２Ａ、２２Ｂ、２２Ｃはスルーホール、２３は半田層を示す。   In the drawings, 1 is an electronic device, 2 is a case, 3 is a board housing portion, 4 is a board device, 5 is an external connection conductor, 6 is a board, 6a is an electric component placement surface, 6b is a flow solder surface, and 7 and 8 are Electrical components, 7a and 8a are terminals, 9, 10 are terminal through holes, 11 is a GND conductor pattern, 12 is an external connection land, 13 is a land conductor pattern, 14A and 14B are through holes, 15 is a solder layer, 20 is an external connection land, 21 is a land conductor pattern, 22A, 22B, and 22C are through holes, and 23 is a solder layer.

Claims (1)

基板に、電気部品が実装されると共に、外部接続導体板と接触導通される外部接続用ランドを備えた基板装置であって、
前記基板を、一面を電気部品配置面とし他面をフロー半田面とし、且つ両面間に前記電気部品の端子を前記電気部品配置面からフロー半田面まで貫通させる端子貫通孔部を有する構成とし、
前記電気部品を、前記電気部品配置面に配置しその端子を前記端子挿通孔部を貫通させて前記フロー半田面でフロー半田付けし、
前記外部接続用ランドを、
前記基板の電気部品配置面に形成したランド用導体パターンと、
前記基板の前記ランド用導体パターン領域内に形成され、該基板を電気部品配置面から前記フロー半田面まで貫通し溶融半田が毛管現象にて浸入し得る程度の大きさのスルーホールと、
前記フロー半田により構成され前記フロー半田面から前記スルーホールを通し前記ランド用導体パターン表面に形成された半田層とから構成し、
さらに、前記スルーホールは、前記ランド用導体パターンの領域に複数あって、いずれも長円形もしくは楕円形をなし、夫々のスルーホールの長手方向の端部同士が接近するように形成したことを特徴とする基板装置。 A board device having an external connection land on which electrical components are mounted and in contact with an external connection conductor plate,
The substrate has a structure including a terminal through-hole portion through which one side is an electrical component placement surface and the other side is a flow solder surface, and a terminal of the electrical component is passed between the both sides from the electrical component placement surface to the flow solder surface.
The electrical component is disposed on the electrical component placement surface, and the terminal is flow soldered on the flow solder surface through the terminal insertion hole,
The external connection land,
A land conductor pattern formed on the electrical component placement surface of the substrate;
A through hole formed in the conductor pattern region for the land of the substrate, and having a size sufficient to penetrate the substrate from the electric component placement surface to the flow solder surface and allow molten solder to enter by capillary action;
A solder layer formed on the surface of the land conductor pattern through the through-hole from the flow solder surface and configured by the flow solder;
Further, the through hole has a plurality in the region of the land conductor pattern, each of which has an oval shape or an oval shape, and is formed so that end portions in the longitudinal direction of the respective through holes are close to each other. A substrate device.
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JPH08125301A (en) * 1994-10-20 1996-05-17 Fujitsu Ltd Mounting structure of relay substrate
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