JP5256547B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5256547B2 JP5256547B2 JP2011021277A JP2011021277A JP5256547B2 JP 5256547 B2 JP5256547 B2 JP 5256547B2 JP 2011021277 A JP2011021277 A JP 2011021277A JP 2011021277 A JP2011021277 A JP 2011021277A JP 5256547 B2 JP5256547 B2 JP 5256547B2
- Authority
- JP
- Japan
- Prior art keywords
- emitting device
- led element
- recess
- light emitting
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- -1 gallium nitride compound Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
基体2は、上端面21に開口する凹部22を有するものであり、例えば、アルミナや窒化アルミニウム等の熱伝導率が高い絶縁材料を成型してなるものが挙げられる。
21・・・上端面
22・・・凹部
221・・・底面
3・・・LED素子
4・・・柱状放熱部材
5・・・封止部材
Claims (3)
- 上端面に開口する凹部を有した基体と、
前記凹部内に実装されたLED素子と、
前記凹部の底面から起立して設けられた柱状放熱部材と、
前記凹部内に充填された透光性材料からなる封止部材と、を備えていることを特徴とする発光装置。 - 前記柱状放熱部材の先端部に接して設けられて前記凹部の開口部を覆う透光性材料からなる板状放熱部材を備えている請求項1記載の発光装置。
- 前記封止部材が、蛍光体を含有している請求項1又は2記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011021277A JP5256547B2 (ja) | 2011-02-03 | 2011-02-03 | 発光装置 |
PCT/JP2012/051875 WO2012105458A1 (ja) | 2011-02-03 | 2012-01-27 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011021277A JP5256547B2 (ja) | 2011-02-03 | 2011-02-03 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012160675A JP2012160675A (ja) | 2012-08-23 |
JP5256547B2 true JP5256547B2 (ja) | 2013-08-07 |
Family
ID=46602674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011021277A Expired - Fee Related JP5256547B2 (ja) | 2011-02-03 | 2011-02-03 | 発光装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5256547B2 (ja) |
WO (1) | WO2012105458A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080062698A1 (en) * | 2006-09-13 | 2008-03-13 | Yun Tai | LED module |
JP2009021418A (ja) * | 2007-07-12 | 2009-01-29 | Toshiba Corp | 発光装置 |
JP5396607B2 (ja) * | 2009-10-19 | 2014-01-22 | 株式会社エンプラス | 発光装置、面光源装置、及び表示装置 |
JP5507373B2 (ja) * | 2010-07-23 | 2014-05-28 | スタンレー電気株式会社 | フレキシブル基板を用いた信号灯具 |
-
2011
- 2011-02-03 JP JP2011021277A patent/JP5256547B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-27 WO PCT/JP2012/051875 patent/WO2012105458A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2012105458A1 (ja) | 2012-08-09 |
JP2012160675A (ja) | 2012-08-23 |
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