JP5255665B2 - How to assemble a sealed LED bulb - Google Patents

How to assemble a sealed LED bulb Download PDF

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JP5255665B2
JP5255665B2 JP2011035316A JP2011035316A JP5255665B2 JP 5255665 B2 JP5255665 B2 JP 5255665B2 JP 2011035316 A JP2011035316 A JP 2011035316A JP 2011035316 A JP2011035316 A JP 2011035316A JP 5255665 B2 JP5255665 B2 JP 5255665B2
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bulb envelope
bulb
led
envelope
base
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JP2012038704A (en
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建郎 黄
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液光固態照明股▲ふん▼有限公司
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Description

本発明は、電球の組立て方法に関し、より詳細には、密閉型ＬＥＤ電球の組立方法に関する。   The present invention relates to a method for assembling a light bulb, and more particularly to a method for assembling a sealed LED light bulb.

図６を参照するに、従来のＬＥＤ電球は、放熱ハウジング６０、ＬＥＤ装置、電球エンベロープ７０、ステム装置及び口金８０を備える。放熱ハウジング６０は金属で作られ、上端を有し、前記ＬＥＤ装置から発生した熱を放散するために使われる。電球エンベロープ７０は、放熱ハウジング６０の前記上端と強固に接続される。前記ＬＥＤ装置は、放熱ハウジング６０及び電球エンベロープ７０内に設置される。前記ステム装置は、前記ＬＥＤ装置と強固に接続されており、放熱ハウジング６０に取り外し可能に設置される。口金８０は、前記ステム装置のまわりに強固に設置される。しかしながら、従来のＬＥＤ電球は、以下の欠点を有する。   Referring to FIG. 6, the conventional LED bulb includes a heat dissipation housing 60, an LED device, a bulb envelope 70, a stem device, and a base 80. The heat dissipating housing 60 is made of metal, has an upper end, and is used to dissipate heat generated from the LED device. The bulb envelope 70 is firmly connected to the upper end of the heat dissipation housing 60. The LED device is installed in the heat dissipation housing 60 and the bulb envelope 70. The stem device is firmly connected to the LED device and is detachably installed in the heat dissipation housing 60. The base 80 is firmly installed around the stem device. However, the conventional LED bulb has the following drawbacks.

１．ＬＥＤ装置の損傷の受け易さ：
放熱ハウジング６０及び電球エンベロープ７０が接着剤で相互に接続されているので、放熱ハウジング６０と電球エンベロープ７０との間にギャップが生じ易い。前記ステム装置が放熱ハウジング６０に取り外し可能に設置されるので、また前記ステム装置と放熱ハウジング６０との間にギャップが生じ易い。環境の湿気は前記ＬＥＤ電球に入り易く、ギャップを経てＬＥＤ装置に損傷を与え、該ＬＥＤ装置の信頼性は低減される。前記ＬＥＤ装置のプリント基板（PCB）や導体は、酸化され易く、湿気を帯び易い。その結果、ＬＥＤ電球の寿命は短かくなってしまう。 1. Ease of damage to LED devices:
Since the heat radiating housing 60 and the light bulb envelope 70 are connected to each other with an adhesive, a gap is easily generated between the heat radiating housing 60 and the light bulb envelope 70. Since the stem device is detachably installed in the heat radiating housing 60, a gap is easily generated between the stem device and the heat radiating housing 60. Environmental moisture is likely to enter the LED bulb and damage the LED device through the gap, reducing the reliability of the LED device. The printed circuit board (PCB) and the conductor of the LED device are easily oxidized and wet. As a result, the lifetime of the LED bulb is shortened.

２．放熱ハウジング６０の低汎用性：
放熱ハウジング６０の形状は、放熱ハウジング６０及び電球エンベロープ７０の組立が容易になるように、電球エンベロープ７０の形状に一致する必要がある。しかしながら、放熱ハウジング６０の形状を変えることは、新しい型を必要とし、これは製造コストを増大させ、融通性がない。 2. Low versatility of heat dissipation housing 60:
The shape of the heat radiating housing 60 needs to match the shape of the light bulb envelope 70 so that the heat radiating housing 60 and the light bulb envelope 70 can be easily assembled. However, changing the shape of the heat radiating housing 60 requires a new mold, which increases manufacturing costs and is not flexible.

３．非効率な照明：
電球エンベロープ７０の内面の被覆膜は光反射を助け、照明を強化する。しかしながら、電球エンベロープ７０の内面の表面積は小さく、放熱ハウジング６０が一部の光を遮断する。したがって、従来のＬＥＤ電球の照明は非効率である。 3. Inefficient lighting:
The coating on the inner surface of the bulb envelope 70 helps with light reflection and enhances illumination. However, the surface area of the inner surface of the bulb envelope 70 is small, and the heat radiating housing 60 blocks some light. Therefore, conventional LED bulb illumination is inefficient.

４．絶縁不良：
放熱ハウジング６０は、通常、熱の放散に役立つように金属で作られる。しかしながら、金属の放熱ハウジング６０は絶縁されておらず、ユーザが感電するかもしれず、安全ではない。 4). Insulation failure:
The heat dissipation housing 60 is typically made of metal to help dissipate heat. However, the metal heat dissipating housing 60 is not insulated, and the user may get an electric shock and is not safe.

前記欠点を克服するために、本発明は、前記の問題を除去する密閉型ＬＥＤ電球の組立方法を提供することを企図する。   In order to overcome the above drawbacks, the present invention contemplates providing a method for assembling a sealed LED bulb that obviates the aforementioned problems.

本発明の主たる目的は、密閉型ＬＥＤ電球の組立方法を提供することにある。   The main object of the present invention is to provide a method for assembling a sealed LED bulb.

密閉型のＬＥＤ電球を組み立てる方法は、ステム装置をＬＥＤ装置と接続するステップと、該ＬＥＤ装置を乾燥させるステップと、ステム装置を電球エンベロープと接続するステップと、パイプを通して前記電球エンベロープ内の空気を抜き出すステップと、前記パイプを通して窒素又は不活性ガスで前記電球エンベロープを満たすステップと、前記電球エンベロープを完全に密封すべく該電球エンベロープの外方に位置する前記パイプの開口を封止するステップと、口金を前記電球エンベロープと接続するステップを含む。
前記ステム装置を前記電球エンベロープと接続するステップは、電球エンベロープが立てられ、トーチは下方へ傾けられ、炎はステム装置のフランジ部に向けられ、炎角度は炎とフランジ部が位置する水平線との間の角度として定義され、前記炎角度は５°から１５°である。
前記電球エンベロープは密封されているので、環境の湿気は前記ＬＥＤ装置に損傷を与えることができず、前記パイプを通して前記電球エンベロープ内の空気を抜き出し、前記パイプを通して窒素又は不活性ガスで前記電球エンベロープを満たすステップは実現可能である。


Method of assembling a sealed type LED light bulb, and connecting the stem device and LED devices, and drying the said LED device, and connecting the stem device and bulb envelope, the air in the bulb envelope through a pipe a step of sealing the steps of extracting a step of filling the bulb envelope with nitrogen or an inert gas through the pipe, the opening of the pipe located outside of the electric bulb envelope so as to completely seal the bulb envelope, Connecting a base with the bulb envelope.
Connecting the stem device to the bulb envelope includes raising the bulb envelope, tilting the torch downward, directing the flame toward the flange portion of the stem device, and the flame angle between the flame and the horizontal line where the flange portion is located. Defined as the angle between, the flame angle is between 5 ° and 15 °.
Since the bulb envelope is sealed, environmental moisture cannot damage the LED device, drawing air in the bulb envelope through the pipe and nitrogen or inert gas through the pipe with the bulb envelope. A step that satisfies is feasible.


その結果、前記ＬＥＤ装置は容易に酸化したり、湿らないので、前記ＬＥＤ電球の寿命を延ばすことができる。   As a result, the LED device is not easily oxidized or wetted, so that the lifetime of the LED bulb can be extended.

本発明の他の目的、利点及び斬新な機能は、添付図面に関連した以下の詳細な説明により、さらに明白になるであろう。   Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

本発明に係る密閉型ＬＥＤ電球の組立方法のステップのブロック図であり、It is a block diagram of the steps of the assembly method of the sealed LED bulb according to the present invention 図１の方法で製造された密閉型ＬＥＤ電球のＬＥＤ装置と接続されたステム装置の斜視図であり、FIG. 2 is a perspective view of a stem device connected to an LED device of a sealed LED bulb manufactured by the method of FIG. 1; 前記ステム装置を電球エンベロープと接続するステップを示す図１の密閉型ＬＥＤ電球を部分的に破断して工程を示す側面図であり、前記電球エンベロープは立てられ、またトーチはわずかに下方へ傾いており、FIG. 2 is a side view showing the process of partially breaking the sealed LED bulb of FIG. 1 showing the step of connecting the stem device to the bulb envelope, wherein the bulb envelope is raised and the torch is tilted slightly downward And 前記ステム装置を電球エンベロープと接続する代替ステップを示す図１の密閉型ＬＥＤ電球を部分的に破断して工程を示す側面図であり、前記電球エンベロープは逆さまに立てられ、またトーチは水平方向に設置されており、FIG. 2 is a side view showing the process of partially breaking the sealed LED bulb of FIG. 1 showing an alternative step of connecting the stem device with the bulb envelope, wherein the bulb envelope is upside down and the torch is horizontally oriented Installed, 完成した密閉型ＬＥＤ電球を形成すべく前記電球エンベロープと接続された口金を示す図１の密閉型ＬＥＤ電球の斜視図であり、2 is a perspective view of the sealed LED bulb of FIG. 1 showing a base connected to the bulb envelope to form a completed sealed LED bulb; 従来技術に係る従来のＬＥＤ電球の側面図である。It is a side view of the conventional LED bulb which concerns on a prior art.

図１から３を参照するに、本発明に係る密閉型のＬＥＤ電球を組み立てる方法は、以下のステップを含む。   1 to 3, a method for assembling a sealed LED bulb according to the present invention includes the following steps.

ステム装置１０をＬＥＤ装置２０と接続：
ステム装置１０は、ＬＥＤ（発光ダイオード）装置２０と接続される。ステム装置１０は、ベース１１、２本のワイヤ１２及びパイプ１３を備える。ベース１１はガラスで作られており、中空であり、第１の端部、第２の端部及びフランジ部１１１を有する。ベース１１の前記第２の端部は、ベース１１の前記第１の端部の反対側にある。フランジ部１１１は、漏斗形であり、ベース１１の前記第２の端部から放射状に突出している。 The stem device 10 is connected to the LED device 20:
The stem device 10 is connected to an LED (light emitting diode) device 20. The stem device 10 includes a base 11, two wires 12 and a pipe 13. The base 11 is made of glass, is hollow, and has a first end, a second end, and a flange portion 111. The second end of the base 11 is on the opposite side of the first end of the base 11. The flange portion 111 has a funnel shape and projects radially from the second end portion of the base 11.

ワイヤ１２は、それぞれベース１１を通って設置されており、各ワイヤ１２は支持端部１２１及び接続端部１２２を有する。ワイヤ１２の支持端部１２１は、ベース１１の前記第１の端部の外方にあって該端部に強固に設置され、金属で作られている。ワイヤ１２の接続端部１２２は、フランジ部１１１に隣接する。パイプ１３は、ガラスで作られており、ベース１１に強固に設置されて、また該ベースから外方へ突出し、２つの相対する開口を有する。   Each wire 12 is installed through the base 11, and each wire 12 has a support end 121 and a connection end 122. The support end 121 of the wire 12 is located outside the first end of the base 11 and is firmly installed at the end, and is made of metal. The connection end portion 122 of the wire 12 is adjacent to the flange portion 111. The pipe 13 is made of glass and is firmly installed on the base 11 and projects outwardly from the base and has two opposing openings.

ＬＥＤ装置２０は、ワイヤ１２の支持端部１２１に強固に設置され、また該支持端部と電気的に接続されており、少なくとも１つのＬＥＤを有する。支持端部１２１は金属で作られているので、ワイヤ１２は安定してＬＥＤ装置２０を支持することができる。   The LED device 20 is firmly installed on the support end 121 of the wire 12 and is electrically connected to the support end, and has at least one LED. Since the support end 121 is made of metal, the wire 12 can stably support the LED device 20.

ＬＥＤ装置２０を乾燥：
ＬＥＤ装置２０は、該ＬＥＤ装置２０の湿気を低減するために乾燥される。ＬＥＤ装置２０に吸収された湿気が蒸発し凝縮すると、ＬＥＤ装置２０に損傷を引き起こし、またＬＥＤ装置２０の寿命を短くするので、このステップは、ＬＥＤ装置２０が組み合わせられる前に、該ＬＥＤ装置内の水分を蒸発させることができる。環境の湿気が図６で示すように放熱ハウジング６０と電球エンベロープ７０との間のギャップを通してＬＥＤ装置に損害を与え得るので、ＬＥＤ装置２０を乾燥させるステップは、従来のＬＥＤ電球を組み立てる方法では採用されておらずまた無駄になる。 Dry LED device 20:
The LED device 20 is dried to reduce the moisture of the LED device 20. Since the moisture absorbed in the LED device 20 evaporates and condenses, the LED device 20 is damaged and shortens the life of the LED device 20, so this step is performed in the LED device before the LED device 20 is assembled. The water can be evaporated. The step of drying the LED device 20 is adopted in the conventional method of assembling the LED bulb, because the environmental moisture can damage the LED device through the gap between the heat dissipation housing 60 and the bulb envelope 70 as shown in FIG. It is not done and it becomes useless again.

好ましくは、ＬＥＤ装置２０を乾燥させる時間は１０分から１５分に及び、ＬＥＤ装置２０を乾燥させる温度は１２０℃から１２５℃に及ぶ。   Preferably, the time for drying the LED device 20 ranges from 10 to 15 minutes, and the temperature for drying the LED device 20 ranges from 120 ° C to 125 ° C.

ステム装置１０を電球エンベロープ３０と接続：
電球エンベロープ３０は準備され、ＬＥＤ装置２０が電球エンベロープ３０内に入れられる。電球エンベロープ３０は、中空であり、ガラスで作られており、端部及びネック部３１を有する。ネック部３１は、電球エンベロープ３０の前記端部に形成されており、開口部を有する。ネック部３１の前記開口部は、ネック部３１を通って軸方向に形成されており、ＬＥＤ装置２０は、ネック部３１の前記開口部を経て電球エンベロープ３０内に入れられる。ＬＥＤ装置２０がネック部３１を通って電球エンベロープ３０内に挿入されると、フランジ部１１１はネック部３１に接する。フランジ部１１１及びネック部３１は、該フランジ部１１１及びネック部３１が相互に継ぎ目なくかつ強固に接続されるように、電球エンベロープ３０及びステム装置１０の同時の回転に伴ってトーチＦの炎Ｆ１によって溶かされる。パイプ１３の一方の前記開口は、該開口を通して電球エンベロープ３０の内部空間を環境と連通すべく、電球エンベロープ３０の外に位置している。 The stem device 10 is connected to the bulb envelope 30:
The bulb envelope 30 is prepared and the LED device 20 is placed in the bulb envelope 30. The bulb envelope 30 is hollow, made of glass, and has an end portion and a neck portion 31. The neck portion 31 is formed at the end of the bulb envelope 30 and has an opening. The opening portion of the neck portion 31 is formed in the axial direction through the neck portion 31, and the LED device 20 is inserted into the bulb envelope 30 through the opening portion of the neck portion 31. When the LED device 20 is inserted into the bulb envelope 30 through the neck portion 31, the flange portion 111 contacts the neck portion 31. The flange portion 111 and the neck portion 31 have a flame F1 of the torch F in association with the simultaneous rotation of the bulb envelope 30 and the stem device 10 so that the flange portion 111 and the neck portion 31 are seamlessly and firmly connected to each other. Is melted by. One said opening of the pipe 13 is located outside the bulb envelope 30 in order to communicate the interior space of the bulb envelope 30 with the environment through the opening.

さらに図３を参照するに、好ましくは、電球エンベロープ３０は立てられ、トートＦはわずかに下方へ傾けられる。炎Ｆ１は、フランジ部１１１に向けられる（トーチＦが配置された直線に沿って炎Ｆ１がまっすぐに噴射されると仮定する）。炎角度θは、炎Ｆ１と、フランジ部１１１が置かれる水平線との間の角度として定義される。好ましくは、炎角度θは５°から１５°に及ぶ。炎Ｆ１が下に傾くので、電球エンベロープ３０及びステム装置１０の温度分布は変化し、その結果ＬＥＤ装置２０が過熱されることが防止される。   Still referring to FIG. 3, preferably the bulb envelope 30 is raised and the tote F is tilted slightly downward. The flame F1 is directed toward the flange portion 111 (assuming that the flame F1 is jetted straight along a straight line on which the torch F is disposed). The flame angle θ is defined as an angle between the flame F1 and a horizontal line on which the flange portion 111 is placed. Preferably, the flame angle θ ranges from 5 ° to 15 °. Since the flame F1 tilts downward, the temperature distribution of the bulb envelope 30 and the stem device 10 changes, and as a result, the LED device 20 is prevented from being overheated.

代わりに、図４を参照するに、電球エンベロープ３０は逆さまに立てられ、トーチＦは水平方向に設置されており、炎Ｆ１はフランジ部１１１に向けられている。炎Ｆ１がフランジ部１１１を溶かすと、また電球エンベロープ３０内の空気は熱せられる。したがって、逆さまの電球エンベロープ３０内の空気は、ＬＥＤ装置２０に向けて流れてＬＥＤ装置２０に損傷を与える対流を生じない。   Instead, referring to FIG. 4, the bulb envelope 30 is upside down, the torch F is installed in the horizontal direction, and the flame F <b> 1 is directed to the flange portion 111. When the flame F1 melts the flange portion 111, the air in the bulb envelope 30 is also heated. Therefore, the air in the bulb envelope 30 upside down does not cause convection which flows toward the LED device 20 and damages the LED device 20.

パイプ１３を通しての電球エンベロープ３０内の空気の抜き出し：
電球エンベロープ３０内の空気は、パイプ１３を通して抜き出される。 Extraction of air in the bulb envelope 30 through the pipe 13:
Air in the bulb envelope 30 is extracted through the pipe 13.

パイプ１３を通しての電球エンベロープ３０内への窒素又は不活性ガスの充填：
電球エンベロープ３０は、パイプ１３を通して、窒素あるいはネオン又はアルゴンなどの不活性ガスで満たされる。窒素又は不活性ガスは、ＬＥＤ装置２０の酸化のおそれを減らし、ＬＥＤ装置２０の寿命を延ばし、ＬＥＤ装置２０から発生した熱の放散を容易にする。その結果、従来の放熱ハウジング６０は不要となる。電球エンベロープ３０は密封されているので、パイプ１３を通して電球エンベロープ３０内の空気を抜き出すステップ及びパイプ１３を通して電球エンベロープ３０内に窒素又は不活性ガスを充填するステップは、実現可能である。 Filling the bulb envelope 30 through the pipe 13 with nitrogen or inert gas:
The bulb envelope 30 is filled through the pipe 13 with an inert gas such as nitrogen or neon or argon. Nitrogen or an inert gas reduces the risk of oxidation of the LED device 20, extends the life of the LED device 20, and facilitates the dissipation of heat generated from the LED device 20. As a result, the conventional heat radiating housing 60 becomes unnecessary. Since the bulb envelope 30 is sealed, the steps of extracting air from the bulb envelope 30 through the pipe 13 and filling the bulb envelope 30 with nitrogen or inert gas through the pipe 13 are feasible.

電球エンベロープ３０を完全に密封するために電球エンベロープ３０外方に位置するパイプ１３の開口の封止：
パイプ１３は、電球エンベロープ３０を完全に密封するために、電球エンベロープ３０の外方に位置するパイプ１３の前記開口を封印するべく炎Ｆ１で溶かされる。 Sealing the opening of the pipe 13 located outside the bulb envelope 30 to completely seal the bulb envelope 30:
The pipe 13 is melted with a flame F <b> 1 to seal the opening of the pipe 13 located outside the bulb envelope 30 in order to completely seal the bulb envelope 30.

口金４０を電球エンベロープ３０と接続：
口金４０は、電球エンベロープ３０と確実に接続される接着剤によって、ネック部３１のまわりに確実に取り付けられる。口金４０は、対応する電極に応じたワイヤ１２の接続端部１２２と電気的に接続される。 Connect the base 40 to the bulb envelope 30:
The base 40 is securely attached around the neck portion 31 by an adhesive that is securely connected to the bulb envelope 30. The base 40 is electrically connected to the connection end 122 of the wire 12 corresponding to the corresponding electrode.

上記の説明から、本発明が以下の利点を持っていることは注目される。   From the above description, it is noted that the present invention has the following advantages.

１．電球エンベロープ３０は、密閉されている：
電球エンベロープ３０が全体にガラスで作られて継ぎ目が無く、ステム装置１０が電球エンベロープ３０と継ぎ目無く接続されており、パイプ１３の開口が封止されるので、電球エンベロープ３０は完全に密閉される。電球エンベロープ３０が密封されるので、環境の湿気はＬＥＤ装置２０を損うことが無く、またパイプ１３を通して電球エンベロープ３０内の空気を抜き出すステップと、パイプ１３を通して電球エンベロープ３０内に窒素又は不活性ガスを充填するステップは、実現可能である。その結果、ＬＥＤ装置２０は容易に酸化したり湿ったりせず、密閉型のＬＥＤ電球の寿命を延ばすことができ、密閉型ＬＥＤ電球の信頼性を高めることができる。 1. The bulb envelope 30 is sealed:
The bulb envelope 30 is made entirely of glass and is seamless, the stem device 10 is seamlessly connected to the bulb envelope 30, and the opening of the pipe 13 is sealed, so that the bulb envelope 30 is completely sealed. . Since the bulb envelope 30 is sealed, the ambient humidity does not damage the LED device 20 and also extracts air in the bulb envelope 30 through the pipe 13 and nitrogen or inert into the bulb envelope 30 through the pipe 13. The step of filling with gas is feasible. As a result, the LED device 20 is not easily oxidized or moistened, the life of the sealed LED bulb can be extended, and the reliability of the sealed LED bulb can be improved.

２．電球エンベロープ３０の優れた汎用性：
電球エンベロープ３０は、全体としてガラスで作られるので、電球エンベロープ３０の形状は、電球エンベロープ３０を熱した後で容易に変更することができる。さらに、電球エンベロープ３０の形状は、異なる口金４０に合わせるのに融通性がある。 2. Excellent versatility of bulb envelope 30:
Since the bulb envelope 30 is made entirely of glass, the shape of the bulb envelope 30 can be easily changed after the bulb envelope 30 is heated. Further, the shape of the bulb envelope 30 is flexible to match different bases 40.

３．効率的な照明：
電球エンベロープ３０の内面の表面積が、光を広く外に放出するのに十分に大きいので、電球エンベロープ３０の内面の被覆膜は不要となる。さらに、ＬＥＤ装置２０から放たれた光は、放熱ハウジング６０によって遮断されないので、本発明に係る密閉型のＬＥＤ電球を組み立てる方法によって作られた密閉型ＬＥＤ電球は、効率的に照明することができる。 3. Efficient lighting:
Since the surface area of the inner surface of the bulb envelope 30 is sufficiently large to emit light widely outside, the coating film on the inner surface of the bulb envelope 30 is not necessary. Furthermore, since the light emitted from the LED device 20 is not blocked by the heat radiating housing 60, the sealed LED bulb made by the method of assembling the sealed LED bulb according to the present invention can be efficiently illuminated. .

４．優れた絶縁性：
前記密閉型ＬＥＤ電球は、従来の放熱ハウジング６０を有さず、ガラスで作られるので、絶縁性の密閉型ＬＥＤ電球は、ユーザの感電を防止し、安全である。 4). Excellent insulation:
Since the sealed LED bulb does not have the conventional heat radiating housing 60 and is made of glass, the insulating sealed LED bulb prevents a user's electric shock and is safe.

１０ ステム装置
１１ ベース
１２ ワイヤ
１３ パイプ
２０ ＬＥＤ装置
３０ 電球エンベロープ
３１ ネック部
４０ 口金
１１１ フランジ部
１２１ 支持端部
１２２ 接続端部 DESCRIPTION OF SYMBOLS 10 Stem apparatus 11 Base 12 Wire 13 Pipe 20 LED apparatus 30 Light bulb envelope 31 Neck part 40 Base 111 Flange part 121 Support end part 122 Connection end part

Claims (3)

ステム装置をＬＥＤ装置に接続するステップであって、
前記ステム装置は、ガラスで作られた中空のベースであって第１の端部、該第１の端部と反対側にある第２の端部及び該第２の端部から放射状に突出するフランジ部を有する中空のベースと、前記ベースに該ベースを通ってそれぞれ設置される２本のワイヤであって各ワイヤが前記ベースの前記第１の端部の外方にあって該端部に強固に設置され前記ＬＥＤ装置と電気的に強固に接続された支持端部、及び前記フランジ部に接する接続端部を有する２本のワイヤと、ガラスで作られ前記ベースに強固に設置され該ベースから突出し、２つの相対する開口を有するパイプとを備え、前記ステム装置を少なくとも１つのＬＥＤを有する前記ＬＥＤ装置に接続するステップと、
前記ＬＥＤ装置を乾燥するステップと、
前記ステム装置を電球エンベロープと接続するステップであって、前記電球エンベロープは、中空であり、全体にガラスで作られており、端部と、前記電球エンベロープの前記端部に形成され、前記フランジ部に接するネック部であって軸線方向に形成された開口部を有するネック部とを備え、前記フランジ部及び前記ネック部は、該フランジ部及びネック部が相互に継ぎ目なくかつ強固に接続されるように、前記電球エンベロープ及び前記ステム装置の同時の回転に伴なってトーチの炎によって溶かされ、また前記パイプの一方の前記開口は、該開口を通して前記電球エンベロープの内部空間を環境と連通すべく該電球エンベロープの外に位置している、前記ステム装置を前記電球エンベロープと接続するステップと、
前記パイプを通して前記電球エンベロープ内の空気を抜き出すステップと、
前記パイプを通して前記電球エンベロープ内に窒素又は不活性ガスを充填するステップと、
前記電球エンベロープを完全に密閉すべく該電球エンベロープの外方に位置する前記パイプの前記開口を封止するステップと、
口金を前記電球エンベロープと接続するステップであって前記口金は前記ネック部の回りに確実に取り付けられ対応する電極に応じた前記ワイヤの前記接続端部と電気的に接続される、接続ステップとを含み、
前記ステム装置を前記電球エンベロープと接続するステップは、前記電球エンベロープが立てられ、前記トーチは下方へ傾けられ、炎は前記フランジ部に向けられ、炎角度は前記炎と前記フランジ部が位置する水平線との間の角度として定義され、前記炎角度は５°から１５°である、密閉型ＬＥＤ電球の組立方法。 Connecting the stem device to the LED device,
The stem device is a hollow base made of glass and projects radially from a first end, a second end opposite to the first end, and the second end. A hollow base having a flange portion, and two wires respectively installed in the base through the base, each wire being outside the first end portion of the base and at the end portion Two wires having a support end portion that is firmly installed and electrically connected to the LED device, and a connection end portion that contacts the flange portion, and made of glass and firmly installed on the base Connecting the stem device to the LED device having at least one LED comprising: a pipe protruding from the pipe and having two opposed openings;
Drying the LED device;
Connecting the stem device to a bulb envelope, the bulb envelope being hollow and made entirely of glass, formed at an end and at the end of the bulb envelope, the flange portion And the neck portion having an opening formed in the axial direction, the flange portion and the neck portion are connected seamlessly and firmly to each other. In addition, the bulb envelope and the stem device are melted by the flame of the torch with the simultaneous rotation of the stem device, and one of the openings of the pipe passes through the opening to communicate the interior space of the bulb envelope with the environment. Connecting the stem device with the bulb envelope, located outside the bulb envelope;
Extracting air in the bulb envelope through the pipe;
Filling the bulb envelope with nitrogen or an inert gas through the pipe;
Sealing the opening of the pipe located outside the bulb envelope to completely seal the bulb envelope;
Connecting a base to the bulb envelope, wherein the base is securely attached around the neck and electrically connected to the connection end of the wire according to the corresponding electrode; seen including,
The step of connecting the stem device to the bulb envelope is to raise the bulb envelope, tilt the torch downward, direct the flame to the flange portion, and the flame angle is a horizontal line where the flame and the flange portion are located. A method of assembling a sealed LED bulb , wherein the flame angle is between 5 ° and 15 ° . 前記ＬＥＤ装置を乾燥させるステップで前記ＬＥＤ装置の乾燥時間は１０分から１５分であり、また前記ＬＥＤ装置を乾燥する温度は１２０℃から１２５℃である、請求項１に記載の密封型ＬＥＤ電球の組立方法。   The sealed LED bulb according to claim 1, wherein in the step of drying the LED device, a drying time of the LED device is 10 to 15 minutes, and a temperature of drying the LED device is 120 to 125 ° C. Assembly method. 前記ステム装置を前記電球エンベロープと接続するステップは、前記電球エンベロープが逆さまに立てられ、前記トーチは水平方向に設置され、炎は前記フランジ部に向けられる、請求項１又は２に記載の密封型ＬＥＤ電球の組立方法。   The sealed type according to claim 1 or 2, wherein the step of connecting the stem device to the bulb envelope includes the bulb envelope being upside down, the torch being installed in a horizontal direction, and a flame being directed to the flange portion. LED bulb assembly method.
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