JP5254195B2 - 基板上に単結晶半導体層を作製する方法 - Google Patents
基板上に単結晶半導体層を作製する方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 78
- 239000000758 substrate Substances 0.000 title claims description 70
- 239000013078 crystal Substances 0.000 title claims description 54
- 238000000034 method Methods 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 88
- 229910052732 germanium Inorganic materials 0.000 claims description 39
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 37
- 238000000151 deposition Methods 0.000 claims description 26
- 230000008021 deposition Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000002019 doping agent Substances 0.000 claims description 12
- 238000005224 laser annealing Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 8
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 3
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 claims description 3
- 238000000231 atomic layer deposition Methods 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 2
- 238000001451 molecular beam epitaxy Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 88
- 229910052710 silicon Inorganic materials 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 239000007790 solid phase Substances 0.000 description 11
- 239000002356 single layer Substances 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 8
- 238000000137 annealing Methods 0.000 description 7
- 238000000348 solid-phase epitaxy Methods 0.000 description 7
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000000407 epitaxy Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000000560 X-ray reflectometry Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910020750 SixGey Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- QUZPNFFHZPRKJD-UHFFFAOYSA-N germane Chemical compound [GeH4] QUZPNFFHZPRKJD-UHFFFAOYSA-N 0.000 description 1
- 229910000078 germane Inorganic materials 0.000 description 1
- 229910052986 germanium hydride Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 235000015277 pork Nutrition 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/28—Deposition of only one other non-metal element
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/08—Germanium
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- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Description
基板を準備する工程と、
基板上に少なくとも1つの半導体材料の単分子層(monolayer)を含むテンプレートをエピタキシャル成長する工程と、その後に、
テンプレート上に半導体材料のアモルファス層を堆積する工程と、
熱処理またはレーザアニールを行い、半導体材料のアモルファス層を、半導体材料の単結晶層に完全に変える工程と、を含む。
好適な具体例では、少なくとも1つの単結晶は、その上に単結晶層が堆積される基板上の全ての部分を覆う。
基板(1)を準備する工程と、
少なくとも1つのGeの単分子層を含むテンプレートを、シリコン基板上にエピタキシャル成長する工程と、その後に、
テンプレート上にアモルファスGeの層(3)を堆積する工程と、
熱処理またはレーザアニールを行い、これによりアモルファスGeの層を完全に単結晶Geの層に変える工程とを含む。
基板(1)を準備する工程と、
少なくとも1つの半導体材料の単分子層を含み、または当該単分子層からなるテンプレート(2)を、基板上に、即ち、単結晶材料の層がその上に形成される基板の平坦な表面上にエピタキシャル成長する工程と、その後に、
テンプレート上に、アモルファス半導体材料(3)の層を堆積する(即ち、半導体材料のアモルファス層を堆積する)工程と、
熱処理またはレーザアニールを行い、これによりアモルファス層を完全に単結晶の半導体材料層(即ち、半導体材料の単結晶層)に変える工程とを含む。括弧内の参照符号は、図1に関する。アモルファス層を堆積する工程と、熱処理またはレーザアニールを行う工程は、実際には、テンプレート層の上で行われる固相成長である。本発明の方法にかかるプロセス手順は、図2のフローチャートにより模式的に示される。
(単結晶)シリコン基板を準備する工程と、
シリコン基板上に、少なくとも1つの単分子層のGeを含む、またはこれからなるテンプレートをエピタキシャル成長する工程と、その後に、
テンプレート上にアモルファスのGe層を堆積する工程と、
熱処理またはレーザアニールを行い、これによりアモルファスGeの層を、完全に単結晶Geの層に変える工程とを含む。単結晶シリコン基板は、汚染、粒子、および自然酸化物を除去するために化学的に洗浄される。その後にすぐ、試料は堆積チャンバ中に入れられる。追加のその場アニール工程(例えば、H2中でのアニール)は、テンプレートのエピタキシャル成長前に選択的に行われる。
Claims (9)
- 基板上に単結晶の半導体材料の層を形成する方法であって、
少なくとも部分的に露出した単結晶のシリコンからなる第2半導体材料、を含む基板を準備する工程と、
少なくとも単分子層で4分子層より少ない第1半導体材料を含むテンプレートを基板上にエピタキシャル成長する工程であって、第1半導体材料はゲルマニウムまたはSiGeであり、テンプレートは臨界膜厚より薄い膜厚を有し、臨界膜厚は転位の出現無しに第1半導体材料で達成できる最大の膜厚であり、テンプレートは第2半導体材料を覆って第2半導体材料と物理的に接続される工程と、
その後に、化学気相堆積により、テンプレート上に第1半導体材料のアモルファス層を堆積する工程と、
熱処理またはレーザアニールを行い、これにより全ての第1半導体材料のアモルファス層を、第1半導体材料の単結晶層に変える工程とを含み、
テンプレートをエピタキシャル成長する工程と、アモルファス層を堆積する工程とは、制御された雰囲気で、同じプロセスチャンバ中またはクラスタツール中で行われる方法。 - 第2半導体材料はSi(111)である請求項1に記載の方法。
- テンプレートをエピタキシャル成長する工程は、分子線エピタキシ、低圧化学気相堆積、大気圧化学気相堆積、プラズマ誘起化学気相堆積、および原子層堆積の1つを用いてテンプレートを成長する工程を含む請求項1に記載の方法。
- 熱処理またはレーザーアニールを行う工程は、窒素雰囲気中でレーザーアニールを行う工程を含む請求項1に記載の方法。
- 熱処理またはレーザーアニールを行う工程は、400℃と900℃との間の温度で熱処理を行う工程を含む請求項1に記載の方法。
- 更に、第1半導体材料のアモルファス層にドーパント元素を注入する工程を含む請求項1に記載の方法。
- 第1半導体材料のアモルファス層にドーパント元素を注入する工程は、ドーパント元素を有する第1半導体材料のアモルファス層を堆積しつつ、ドーパント元素を第1半導体材料のアモルファス層に注入する工程を含む請求項6に記載の方法。
- 第1半導体材料のアモルファス層にドーパント元素を注入する工程は、ドーパント元素を有する第1半導体材料のアモルファス層の堆積後で、熱処理またはレーザーアニールを行う前に、第1半導体材料のアモルファス層にドーパント元素を注入する工程を含む請求項6に記載の方法。
- 更に、第1半導体材料の単結晶層にドーパント元素を注入する工程を含む請求項1に記載の方法。
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US14050308P | 2008-12-23 | 2008-12-23 | |
US61/140,503 | 2008-12-23 |
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JP2010157721A JP2010157721A (ja) | 2010-07-15 |
JP2010157721A5 JP2010157721A5 (ja) | 2012-09-06 |
JP5254195B2 true JP5254195B2 (ja) | 2013-08-07 |
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US8598020B2 (en) * | 2010-06-25 | 2013-12-03 | Applied Materials, Inc. | Plasma-enhanced chemical vapor deposition of crystalline germanium |
US10043934B2 (en) * | 2011-06-08 | 2018-08-07 | International Business Machines Corporation | Silicon-containing heterojunction photovoltaic element and device |
US8735204B1 (en) | 2013-01-17 | 2014-05-27 | Alliance For Sustainable Energy, Llc | Contact formation and gettering of precipitated impurities by multiple firing during semiconductor device fabrication |
US8895416B2 (en) * | 2013-03-11 | 2014-11-25 | Alliance For Sustainable Energy, Llc | Semiconductor device PN junction fabrication using optical processing of amorphous semiconductor material |
JPWO2016031019A1 (ja) * | 2014-08-28 | 2017-06-15 | 国立大学法人九州大学 | レーザ照射装置及びレーザ照射方法 |
US9978748B2 (en) | 2015-12-09 | 2018-05-22 | International Business Machines Corporation | Method of cutting fins to create diffusion breaks for finFETs |
CN107658365A (zh) * | 2017-08-11 | 2018-02-02 | 西安科锐盛创新科技有限公司 | 基于LRC工艺的横向PiNGe光电探测器及其制备方法 |
US11521972B2 (en) | 2020-05-01 | 2022-12-06 | Tokyo Electron Limited | High performance multi-dimensional device and logic integration |
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JPS60202952A (ja) * | 1984-03-28 | 1985-10-14 | Fujitsu Ltd | 半導体装置の製造方法 |
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JP2003506883A (ja) * | 1999-08-10 | 2003-02-18 | シリコン ジェネシス コーポレイション | 低打ち込みドーズ量を用いて多層基板を製造するための劈開プロセス |
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EP2206808A1 (en) | 2010-07-14 |
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EP2206808B1 (en) | 2017-07-12 |
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