JP5227827B2 - ガラス基板用容器 - Google Patents

ガラス基板用容器 Download PDF

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Publication number
JP5227827B2
JP5227827B2 JP2009032752A JP2009032752A JP5227827B2 JP 5227827 B2 JP5227827 B2 JP 5227827B2 JP 2009032752 A JP2009032752 A JP 2009032752A JP 2009032752 A JP2009032752 A JP 2009032752A JP 5227827 B2 JP5227827 B2 JP 5227827B2
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JP
Japan
Prior art keywords
glass substrate
reinforcing member
container
side wall
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009032752A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010189013A (ja
Inventor
義男 廣部
信介 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Kasei Co Ltd
Original Assignee
Sekisui Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Kasei Co Ltd filed Critical Sekisui Kasei Co Ltd
Priority to JP2009032752A priority Critical patent/JP5227827B2/ja
Priority to KR1020117010802A priority patent/KR101573301B1/ko
Priority to PCT/JP2010/051766 priority patent/WO2010092920A1/ja
Priority to CN2010900006164U priority patent/CN202089455U/zh
Priority to TW099104739A priority patent/TWI476134B/zh
Publication of JP2010189013A publication Critical patent/JP2010189013A/ja
Application granted granted Critical
Publication of JP5227827B2 publication Critical patent/JP5227827B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/07—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using resilient suspension means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009032752A 2009-02-16 2009-02-16 ガラス基板用容器 Active JP5227827B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009032752A JP5227827B2 (ja) 2009-02-16 2009-02-16 ガラス基板用容器
KR1020117010802A KR101573301B1 (ko) 2009-02-16 2010-02-08 유리 기판용 용기
PCT/JP2010/051766 WO2010092920A1 (ja) 2009-02-16 2010-02-08 ガラス基板用容器
CN2010900006164U CN202089455U (zh) 2009-02-16 2010-02-08 玻璃基板用容器
TW099104739A TWI476134B (zh) 2009-02-16 2010-02-12 玻璃基板用容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009032752A JP5227827B2 (ja) 2009-02-16 2009-02-16 ガラス基板用容器

Publications (2)

Publication Number Publication Date
JP2010189013A JP2010189013A (ja) 2010-09-02
JP5227827B2 true JP5227827B2 (ja) 2013-07-03

Family

ID=42561762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009032752A Active JP5227827B2 (ja) 2009-02-16 2009-02-16 ガラス基板用容器

Country Status (5)

Country Link
JP (1) JP5227827B2 (zh)
KR (1) KR101573301B1 (zh)
CN (1) CN202089455U (zh)
TW (1) TWI476134B (zh)
WO (1) WO2010092920A1 (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101920816B (zh) * 2010-08-24 2012-04-18 友达光电股份有限公司 包装缓冲装置
JP5826569B2 (ja) * 2011-09-12 2015-12-02 積水化成品工業株式会社 板状体の搬送用容器
CN102616488B (zh) * 2012-04-13 2014-04-02 深圳市华星光电技术有限公司 一种液晶玻璃包装盒
US8777007B2 (en) 2012-04-13 2014-07-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Packaging box for liquid crystal glass
TWI432367B (zh) * 2012-04-13 2014-04-01 Au Optronics Corp 緩衝包裝盒
JP2014009020A (ja) * 2012-06-29 2014-01-20 Sekisui Plastics Co Ltd 梱包材および梱包体
JP5917316B2 (ja) * 2012-06-29 2016-05-11 積水化成品工業株式会社 梱包材および梱包体
TWI462211B (zh) * 2012-06-29 2014-11-21 Au Optronics Corp 承載裝置與承載裝置及被載物之組合
CN102849355B (zh) * 2012-09-26 2015-02-25 深圳市华星光电技术有限公司 液晶玻璃面板包装结构
TWI447054B (zh) * 2012-10-09 2014-08-01 Au Optronics Corp 箱體及裝載顯示面板的箱體
CN102923394B (zh) * 2012-10-17 2016-03-30 深圳市华星光电技术有限公司 一种用于容纳板体的包装箱
KR200473820Y1 (ko) * 2012-11-29 2014-07-31 주식회사 삼일이노팩 디스플레이장치용 스티로폼 포장재
TWI561443B (en) * 2012-11-30 2016-12-11 Au Optronics Corp Packing box
CN103204291B (zh) * 2013-04-19 2015-09-09 深圳市华星光电技术有限公司 一种包装装置
KR101497422B1 (ko) * 2013-10-22 2015-03-02 주식회사 삼진엘앤디 디스플레이 패널 보호용 슬롯
TWM477042U (en) * 2013-12-05 2014-04-21 Sekisui Plastics Co Ltd Reinforcing member and panel transportation vessel
CN103723386B (zh) * 2014-01-08 2016-03-16 友达光电（苏州）有限公司 面板承载箱
CN104185415B (zh) * 2014-08-21 2018-01-16 昆山龙腾光电有限公司 基板定位承载装置、基板组立***及基板组立方法
CN104401598B (zh) * 2014-10-31 2017-02-01 京东方科技集团股份有限公司 显示面板的包装装置
JP3198009U (ja) * 2015-03-31 2015-06-11 積水化成品工業株式会社 梱包材及び梱包体
JP6892857B2 (ja) * 2016-05-18 2021-06-23 堺ディスプレイプロダクト株式会社 収納容器
KR101687758B1 (ko) * 2016-06-24 2016-12-19 (주) 다쓰테크 유연기판 또는 유리기판 위에 도금하기 위한 전기 도금장치용 스테이지
WO2018016077A1 (ja) * 2016-07-22 2018-01-25 堺ディスプレイプロダクト株式会社 収納容器
JP6357218B2 (ja) * 2016-12-28 2018-07-11 積水化成品工業株式会社 梱包材および梱包体
KR20220022003A (ko) 2020-08-14 2022-02-23 삼성디스플레이 주식회사 표시 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4601932B2 (ja) * 2003-09-16 2010-12-22 大日本印刷株式会社 基板収納ケース
TWM326523U (en) * 2007-08-08 2008-02-01 Ynidyi Entpr Co Ltd Packaging box for LCD panel with enhanced buffering function

Also Published As

Publication number Publication date
JP2010189013A (ja) 2010-09-02
CN202089455U (zh) 2011-12-28
TW201041788A (en) 2010-12-01
KR101573301B1 (ko) 2015-12-01
KR20110115997A (ko) 2011-10-24
WO2010092920A1 (ja) 2010-08-19
TWI476134B (zh) 2015-03-11

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