JP5209778B2 - Anisotropic conductive film and bonded body using the same - Google Patents
Anisotropic conductive film and bonded body using the same Download PDFInfo
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Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Description
本発明は、ＩＣチップ、液晶ディスプレイ（ＬＣＤ）における液晶パネル（ＬＣＤパネル）等の電子部品と基板や、基板同士を電気的かつ機械的に接続可能な異方性導電膜及びこれを用いた接合体に関する。 The present invention relates to an IC chip and an electronic component such as a liquid crystal panel (LCD panel) in a liquid crystal display (LCD) and a substrate, an anisotropic conductive film capable of electrically and mechanically connecting the substrates, and a bonding using the same. About the body.
従来より、電子部品等と回路基板とを接続する手段として、異方導電性接着フィルム（ＡＣＦ；Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）が用いられている。この異方導電性接着フィルムは、例えば、フレキシブルプリント基板（ＦＰＣ）やＩＣチップの端子と、ＬＣＤパネルのガラス基板上に形成されたＩＴＯ（Ｉｎｄｉｕｍ Ｔｉｎ Ｏｘｉｄｅ）電極とを接続する場合を始めとして、種々の端子同士を接着すると共に電気的に接続する場合に用いられている。 Conventionally, anisotropic conductive adhesive films (ACFs) have been used as means for connecting electronic components and circuit boards. This anisotropic conductive adhesive film, for example, when connecting a terminal of a flexible printed circuit board (FPC) or an IC chip and an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel, It is used when various terminals are bonded and electrically connected.
前記異方導電性接着フィルムとしては、一般に、エポキシ樹脂系の絶縁性接着剤層中に導電性粒子を分散させたものが使用されており、例えば、ＩＣチップの端子とガラス基板におけるＩＴＯ電極との間に、導電性粒子が挟まれて潰されることにより、前記ＩＣチップの端子と前記ＩＴＯ電極との電気的接続が実現されている。
近年、電子機器の小型化及び高機能化により、接合端子のファインピッチ化に伴う接合端子の面積が減少しているが、端子面積が狭くなっても、高い導通信頼性の確保が求められている。
しかし、前記異方導電性接着フィルムにおいては、前記導電性粒子が前記絶縁性接着剤層中に分散されているので、接続時の熱圧着により、絶縁性接着剤と共に導電性粒子が流動してしまうという問題があり、電気的接続を確実に行うためには、接続後に端子上に載っている導電性粒子の個数を一定以上にすることが必要となり、絶縁性接着剤層中に含有させる導電性粒子の個数を増大させなければならなかった。
As the anisotropic conductive adhesive film, generally, an epoxy resin-based insulating adhesive layer in which conductive particles are dispersed is used. For example, an IC chip terminal and an ITO electrode on a glass substrate are used. Between these, the conductive particles are sandwiched and crushed, thereby realizing electrical connection between the terminal of the IC chip and the ITO electrode.
In recent years, due to miniaturization and higher functionality of electronic equipment, the area of the junction terminal has been reduced due to the finer pitch of the junction terminal, but even when the terminal area is reduced, it is required to ensure high conduction reliability. Yes.
However, in the anisotropic conductive adhesive film, since the conductive particles are dispersed in the insulating adhesive layer, the conductive particles flow together with the insulating adhesive by thermocompression bonding at the time of connection. In order to ensure electrical connection, it is necessary to make the number of conductive particles on the terminal after the connection constant or more, and the conductive material contained in the insulating adhesive layer is required. The number of sex particles had to be increased.
そこで、前記絶縁性接着剤層の厚み方向における一方の面側に、前記導電性粒子を規則配列させることにより、該導電性粒子の流動を抑制し、前記端子への粒子捕捉率を増大させ、導通信頼性の向上を実現可能な異方導電性接着フィルムの開発が望まれている。
前記導電性粒子を規則配列させた異方導電性接着フィルムを製造する方法としては、例えば、以下に示す方法が知られている。
特許文献１には、導電性粒子を絶縁性接着剤層の表面に配置させた異方性接着フィルムが開示されており、前記導電性粒子を前記絶縁性接着剤層の表面層に均一配置させる方法としては、前記導電性粒子を同一電荷に帯電させて散布させる方式が提案されている。しかし、この方式では、前記導電性粒子の電荷は、僅か数十秒間程度で消滅するため、前記絶縁性接着剤層上に、前記導電性粒子を配列させた状態を維持するのが困難である。
Therefore, by regularly arranging the conductive particles on one surface side in the thickness direction of the insulating adhesive layer, the flow of the conductive particles is suppressed, and the rate of capturing particles to the terminals is increased. Development of an anisotropic conductive adhesive film capable of improving conduction reliability is desired.
As a method for producing an anisotropic conductive adhesive film in which the conductive particles are regularly arranged, for example, the following methods are known.
Patent Document 1 discloses an anisotropic adhesive film in which conductive particles are arranged on the surface of an insulating adhesive layer, and the conductive particles are uniformly arranged on the surface layer of the insulating adhesive layer. As a method, there has been proposed a method in which the conductive particles are charged to the same charge and dispersed. However, in this method, since the electric charge of the conductive particles disappears in only about several tens of seconds, it is difficult to maintain the state in which the conductive particles are arranged on the insulating adhesive layer. .
また、特許文献２には、導電性粒子が特定の領域にのみ配置された異方導電フィルムの製造方法が開示されており、前記導電性粒子を特定の領域にのみ配置させる方法としては、前記導電性粒子に電圧を印加し、基板上の電極に対応する領域のみが開口しているマスクを用いて、粘着層における前記電極に対応する領域のみに前記導電性粒子を散布する方法が提案されている。しかし、この方法では、粘着層の厚みが大きくなると、前記導電性粒子の電荷が拡散してしまい、前記電極に対応した微細な粒子配列を得ることができないことがある。 Patent Document 2 discloses a method for producing an anisotropic conductive film in which conductive particles are arranged only in specific regions, and the method for arranging the conductive particles only in specific regions is described above. A method is proposed in which a voltage is applied to the conductive particles, and the conductive particles are dispersed only in the region corresponding to the electrodes in the adhesive layer using a mask in which only the regions corresponding to the electrodes on the substrate are opened. ing. However, in this method, if the thickness of the adhesive layer is increased, the electric charge of the conductive particles may be diffused, and a fine particle arrangement corresponding to the electrode may not be obtained.
更に、特許文献３には、導電性粒子が規則的に配列した異方導電フィルム及びその製造方法が開示されており、前記導電性粒子を規則的に配列させる方法としては、基材上に絶縁性接着剤を塗工した絶縁性接着剤面上に、導電性粒子を噴霧し配列させた後、この上に、絶縁性接着剤を塗工する、あるいは、導電性粒子が絶縁性接着剤中に分散されたものを噴霧する方法が提案されている。しかし、この方法では、前記導電性粒子の配列間隔の狭小化を図ると、前記導電性粒子が凝集してしまい、前記導電性粒子を単層配列させることが困難である。 Furthermore, Patent Document 3 discloses an anisotropic conductive film in which conductive particles are regularly arranged, and a method for producing the same. As a method for regularly arranging the conductive particles, insulation is provided on a substrate. After the conductive particles are sprayed and arranged on the surface of the insulating adhesive coated with the conductive adhesive, the insulating adhesive is applied thereon, or the conductive particles are contained in the insulating adhesive. There has been proposed a method of spraying the dispersed material. However, in this method, when the arrangement interval of the conductive particles is reduced, the conductive particles are aggregated, and it is difficult to arrange the conductive particles in a single layer.
また、これらの方法のほか、例えば、特許文献４には、異方導電性シートの製造方法において、導電性磁性粒子を用いて、磁石により該導電性粒子を配列させる方法が提案されている。しかし、この方法では、現在市販の導電性粒子を用いることができず、汎用性に劣るという問題がある。 In addition to these methods, for example, Patent Document 4 proposes a method of using conductive magnetic particles and arranging the conductive particles with a magnet in a method for manufacturing an anisotropic conductive sheet. However, with this method, there is a problem that current commercially available conductive particles cannot be used and the versatility is poor.
したがって、絶縁性樹脂膜中に、導電性粒子を凝集させることなく、ミクロンオーダーの配列間隔で単層配列させることができ、しかも該導電性粒子の配列を、前記絶縁性樹脂膜の厚み方向における一方の面側に配置させることができる簡便な方法は、未だ提供されていないのが現状であり、電子部品等と基板との接続の際に、導電性粒子の流動を抑制して、高い粒子捕捉率を確保することにより、優れた導通信頼性を得ることができる異方性導電膜及びこれに関連する技術の開発が望まれている。 Accordingly, the insulating resin film can be arranged in a single layer at an arrangement interval of micron order without aggregating the conductive particles, and the arrangement of the conductive particles can be arranged in the thickness direction of the insulating resin film. A simple method that can be arranged on one side has not yet been provided, and suppresses the flow of conductive particles at the time of connection between an electronic component or the like and a substrate. Development of an anisotropic conductive film capable of obtaining excellent conduction reliability by securing a capture rate and a technology related thereto is desired.
本発明は、従来における前記問題を解決し、以下の目的を達成することを課題とする。即ち、本発明は、電子部品等と基板との接続の際に、導電性粒子の流動を抑制して、高い粒子捕捉率を確保することにより、優れた導通信頼性を得ることができる異方性導電膜、及び該異方性導電膜を用い、粒子捕捉率が高く優れた導通信頼性を有する、電子部品等と基板との接合体を提供することを目的とする。 An object of the present invention is to solve the conventional problems and achieve the following objects. That is, the present invention is an anisotropic method that can obtain excellent conduction reliability by suppressing the flow of conductive particles and securing a high particle capture rate when connecting an electronic component or the like to a substrate. An object of the present invention is to provide a bonded body of an electronic component or the like and a substrate, using a conductive film and the anisotropic conductive film, having a high particle trapping rate and excellent conduction reliability.
前記課題を解決するための手段としては、以下の通りである。即ち、
＜１＞ 樹脂膜中であって、該樹脂膜の厚み方向における一方の面側に、導電性粒子が単層配列してなり、前記樹脂膜の厚み方向における一方の面と、前記導電性粒子の中心との距離の１０点平均が、９μｍ以下であることを特徴とする異方性導電膜である。
該＜１＞に記載の異方性導電膜においては、前記樹脂膜の厚み方向における一方の面側に前記導電性粒子が単層配列しており、しかも該導電性粒子の中心は、前記一方の面から９μｍ以下の距離に位置している。このため、該異方性導電膜を用いて電子部品等と基板とを接合すると、前記導電性粒子は、樹脂の流動の影響を受け難く、前記電子部品等における接合端子に高い割合で捕捉され、優れた導通信頼性が得られる。
＜２＞ 隣接する導電性粒子同士の中心間距離の１０点平均が、１μｍ〜３０μｍである前記＜１＞に記載の異方性導電膜である。
＜３＞ 一の噴霧手段を用いて噴出され、静電電位付与手段により静電電位が付与された導電性粒子と、他の噴霧手段を用いて噴出された樹脂粒子とを、被処理面上に同時に噴霧することにより、前記樹脂粒子で形成された樹脂膜中に、前記導電性粒子を単層配列させて得られる前記＜１＞から＜２＞のいずれかに記載の異方性導電膜である。
該＜３＞に記載の異方性導電膜においては、別々の前記噴霧手段を用いて噴出され、静電電位が付与された前記導電性粒子と、前記樹脂粒子とが、前記被処理面上に向かって同時に噴霧される。すると、前記導電性粒子の静電電位が損なわれることなく、前記被処理面における前記導電性粒子の位置安定性が確保された状態にて、前記樹脂粒子が堆積されて前記樹脂膜が形成される。その結果、前記樹脂膜の厚み方向における一方の面側に、ミクロンオーダーの配列間隔で前記導電性粒子が単層配列された異方性導電膜が得られる。
＜４＞ 樹脂膜が、エポキシ樹脂及びアクリル樹脂から選択される少なくとも１種の絶縁性樹脂からなる前記＜１＞から＜３＞のいずれかに記載の異方性導電膜である。
Means for solving the problems are as follows. That is,
<1> In the resin film, the conductive particles are arranged in a single layer on one surface side in the thickness direction of the resin film, the one surface in the thickness direction of the resin film, and the conductive particles An anisotropic conductive film characterized in that the average of 10 points of the distance from the center of the film is 9 μm or less.
In the anisotropic conductive film according to <1>, the conductive particles are arranged in a single layer on one surface side in the thickness direction of the resin film, and the center of the conductive particles is the one side It is located at a distance of 9 μm or less from the surface. For this reason, when the electronic component or the like and the substrate are bonded using the anisotropic conductive film, the conductive particles are hardly affected by the flow of the resin and are captured at a high rate by the bonding terminal in the electronic component or the like. Excellent conduction reliability can be obtained.
<2> The anisotropic conductive film according to <1>, wherein an average of 10 points of the distance between centers of adjacent conductive particles is 1 μm to 30 μm.
<3> Conductive particles ejected using one spraying means and applied with electrostatic potential by electrostatic potential applying means, and resin particles ejected using other spraying means on the surface to be treated The anisotropic conductive film according to any one of <1> to <2>, obtained by spraying simultaneously on the resin film formed by arranging the conductive particles in a single layer in the resin film formed of the resin particles It is.
In the anisotropic conductive film according to <3>, the conductive particles ejected using separate spraying means and provided with an electrostatic potential, and the resin particles are on the surface to be treated. Are sprayed at the same time. Then, the resin particles are deposited and the resin film is formed in a state in which the position stability of the conductive particles on the surface to be processed is ensured without impairing the electrostatic potential of the conductive particles. The As a result, an anisotropic conductive film is obtained in which the conductive particles are arranged in a single layer at an arrangement interval on the order of microns on one surface side in the thickness direction of the resin film.
<4> The anisotropic conductive film according to any one of <1> to <3>, wherein the resin film is made of at least one insulating resin selected from an epoxy resin and an acrylic resin.
＜５＞ 前記＜１＞から＜４＞のいずれかに記載の異方性導電膜を介して、電子部品及び基板から選択される２種以上が、電気的に接合されてなることを特徴とする接合体である。
該＜５＞に記載の接合体においては、本発明の前記異方性導電膜を用いて、前記電子部品及び前記基板から選択される２種以上が電気的に接合されているので、前記導電性粒子の粒子捕捉率が高く、導通信頼性に優れる。
＜６＞ 電子部品及び基板から選択される２種以上における接合端子の面積が、６００μｍ２以上１，８００μｍ２未満である前記＜５＞に記載の接合体である。
＜７＞ 電子部品が、ＩＣチップ及び液晶パネルから選択され、基板が、ＩＴＯガラス基板、フレキシブル基板、リジッド基板及びフレキシブルプリント基板から選択される前記＜５＞から＜６＞のいずれかに記載の接合体である。
<5> Two or more selected from an electronic component and a substrate are electrically joined via the anisotropic conductive film according to any one of <1> to <4>. It is a joined body.
In the joined body according to <5>, since the anisotropic conductive film of the present invention is used, two or more selected from the electronic component and the substrate are electrically joined. The particle capture rate of the conductive particles is high and the conduction reliability is excellent.
<6> the area of the electronic component and the bonding terminals in two or more selected from the substrate, an assembly according to the less than 600 .mu.m 2 or more 1,800μm 2 <5>.
<7> The electronic component is selected from an IC chip and a liquid crystal panel, and the substrate is selected from an ITO glass substrate, a flexible substrate, a rigid substrate, and a flexible printed substrate. It is a joined body.
本発明によると、従来における前記諸問題を解決でき、電子部品等と基板との接続の際に、導電性粒子の流動を抑制して、高い粒子捕捉率を確保することにより、優れた導通信頼性を得ることができる異方性導電膜、及び該異方性導電膜を用い、粒子捕捉率が高く優れた導通信頼性を有する、電子部品等と基板との接合体を提供することができる。 According to the present invention, it is possible to solve the above-mentioned problems in the prior art, and suppresses the flow of conductive particles and secures a high particle capture rate when connecting electronic components and the substrate, thereby providing excellent conduction reliability. An anisotropic conductive film capable of obtaining high performance, and a bonded body of an electronic component or the like and a substrate having a high particle capture rate and excellent conduction reliability using the anisotropic conductive film can be provided. .
（異方性導電膜）
本発明の異方性導電膜は、樹脂膜中であって、該樹脂膜の厚み方向における一方の面側に、導電性粒子が単層配列してなり、前記樹脂膜の厚み方向における一方の面と、前記導電性粒子の中心との距離の１０点平均が、９μｍ以下である。
本発明の前記異方性導電膜においては、前記樹脂膜の厚み方向における一方の面側に前記導電性粒子が単層配列しており、しかも該導電性粒子の中心は、前記一方の面から９μｍ以下の距離に位置しているので、電子部品等と基板との接続の際に、導電性粒子の流動の影響を受け難く、少ない粒子添加量で、高い粒子捕捉率を確保することができ、優れた導通信頼性を得ることができる。
(Anisotropic conductive film)
The anisotropic conductive film of the present invention is in a resin film, and conductive particles are arranged in a single layer on one surface side in the thickness direction of the resin film. The 10-point average of the distance between the surface and the center of the conductive particles is 9 μm or less.
In the anisotropic conductive film of the present invention, the conductive particles are arranged in a single layer on one surface side in the thickness direction of the resin film, and the center of the conductive particles is from the one surface. Since it is located at a distance of 9 μm or less, it is difficult to be affected by the flow of conductive particles when connecting electronic components and the substrate, and a high particle capture rate can be secured with a small amount of added particles. Excellent conduction reliability can be obtained.
前記異方性導電膜における、単層配列された前記導電性粒子の配列間隔としては、特に制限はなく、目的に応じて適宜選択することができるが、隣接する導電性粒子同士の中心間距離の１０点平均が、１〜３０μｍが好ましく、１〜１５μｍがより好ましく、１〜１０μｍが特に好ましい。これらの場合、接合端子のファインピッチ化に伴う、該接合端子の面積の狭小化に充分対応可能な点で、有利である。 The arrangement interval of the conductive particles arranged in a single layer in the anisotropic conductive film is not particularly limited and may be appropriately selected according to the purpose. Is preferably 1 to 30 μm, more preferably 1 to 15 μm, and particularly preferably 1 to 10 μm. In these cases, it is advantageous in that it can sufficiently cope with the narrowing of the area of the junction terminal accompanying the fine pitch of the junction terminal.
本発明の前記異方性導電膜の製造方法としては、特に制限はなく、目的に応じて適宜選択することができるが、従来の異方性導電膜の一般的な製造方法では、樹脂中に導電性粒子が分散されてなる樹脂組成物を塗布することにより製造するので、１０μｍ以下の厚みで異方性導電膜を連続生産するのが困難であり、塗布ヘッド部分に発生した増粘部分、粒子溜まりなどの影響によるスジ、ムラ等の不良が発生し易いという問題がある。
これに対し、以下に説明する方法により異方性導電膜を製造すると、これらの不良の発生が抑制される点で、有利である。即ち、本発明の前記異方性導電膜の製造方法としては、一の噴霧手段を用いて噴出され、静電電位付与手段により静電電位が付与された導電性粒子と、他の噴霧手段を用いて噴出された樹脂粒子とを、被処理面上に同時に噴霧することにより、前記樹脂粒子で形成された樹脂膜中に、前記導電性粒子を単層配列させる工程を含んでいるのが好ましく、更に必要に応じて適宜選択したその他の工程を含んでいてもよい。
There is no restriction | limiting in particular as the manufacturing method of the said anisotropic conductive film of this invention, Although it can select suitably according to the objective, In the general manufacturing method of the conventional anisotropic conductive film, in resin Since it is manufactured by applying a resin composition in which conductive particles are dispersed, it is difficult to continuously produce an anisotropic conductive film with a thickness of 10 μm or less, and a thickened portion generated in the coating head portion, There is a problem that defects such as streaks and unevenness are easily generated due to the influence of particle accumulation.
On the other hand, when an anisotropic conductive film is manufactured by the method described below, it is advantageous in that the occurrence of these defects is suppressed. That is, as the method for producing the anisotropic conductive film of the present invention, the conductive particles ejected using one spraying means and applied with the electrostatic potential by the electrostatic potential applying means, and the other spraying means are used. It is preferable to include a step of arranging the conductive particles in a single layer in the resin film formed of the resin particles by simultaneously spraying the resin particles ejected using the resin particles on the surface to be processed. In addition, other steps appropriately selected as necessary may be included.
−導電性粒子−
前記導電性粒子としては、特に制限はなく、公知のものの中から適宜選択することができ、例えば、半田、ニッケル、金等の金属粒子；金属（ニッケル、金、アルミニウム、銅等）で被覆（メッキ）された、樹脂粒子、ガラス粒子あるいはセラミック粒子；などが挙げられる。
前記導電性粒子の平均粒径としては、例えば、体積平均粒径で、２〜１０μｍが好ましく、２〜４μｍがより好ましい。
前記体積平均粒径が、２μｍ未満であると、分級処理及び入手が困難であり、１０μｍを超えると、接合端子のファインピッチ化に伴う、該接合端子の狭小化への対応が困難となることがある。
前記導電性粒子の比重としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば、１．５〜３．０が好ましい。
前記比重が、１．５未満であると、前記被処理面上での前記導電性粒子の位置安定性を確保することが困難になることがあり、３．０を超えると、前記導電性粒子を単層配列させるためには、より高い静電電位の付与が必要となることがある。
-Conductive particles-
There is no restriction | limiting in particular as said electroconductive particle, It can select suitably from well-known things, For example, it coat | covers with metal particles (nickel, gold | metal | money, aluminum, copper, etc.); Resin particles, glass particles, or ceramic particles plated).
As an average particle diameter of the said electroconductive particle, 2-10 micrometers is preferable with a volume average particle diameter, for example, and 2-4 micrometers is more preferable.
If the volume average particle size is less than 2 μm, classification treatment and acquisition are difficult, and if it exceeds 10 μm, it becomes difficult to cope with the narrowing of the junction terminals due to the fine pitch of the junction terminals. There is.
There is no restriction | limiting in particular as specific gravity of the said electroconductive particle, Although it can select suitably according to the objective, For example, 1.5-3.0 are preferable.
When the specific gravity is less than 1.5, it may be difficult to ensure the positional stability of the conductive particles on the surface to be processed. When the specific gravity exceeds 3.0, the conductive particles In order to arrange the layers in a single layer, it may be necessary to apply a higher electrostatic potential.
前記導電性粒子は、溶剤に溶解乃至分散させることにより調製したスラリー溶液の状態で、前記噴霧手段を用いて噴出させるのが好ましい。
前記スラリー溶液における前記導電性粒子の含有量としては、特に制限はなく、目的に応じて適宜選択することができるが、２０〜４０質量％が好ましい。
前記含有量が、２０質量％未満であると、噴霧時間が長くなり、製造効率が低下することがあり、４０質量％を超えると、前記導電性粒子間で凝集が発生し易くなることがある。
前記溶剤としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば、トルエン、酢酸エチル、メチルエチルケトン（ＭＥＫ）、エタノールなどが好適に挙げられる。
The conductive particles are preferably ejected using the spraying means in the state of a slurry solution prepared by dissolving or dispersing in a solvent.
There is no restriction | limiting in particular as content of the said electroconductive particle in the said slurry solution, Although it can select suitably according to the objective, 20-40 mass% is preferable.
When the content is less than 20% by mass, the spraying time becomes long and the production efficiency may be reduced. When the content exceeds 40% by mass, aggregation may easily occur between the conductive particles. .
There is no restriction | limiting in particular as said solvent, Although it can select suitably according to the objective, For example, toluene, ethyl acetate, methyl ethyl ketone (MEK), ethanol etc. are mentioned suitably.
−樹脂粒子−
前記樹脂粒子は、樹脂を溶剤に溶解させて調製したスラリー溶液を、前記噴霧手段を用いてミスト状に噴出させることにより形成される。
また、前記樹脂粒子が、前記噴霧手段により前記被処理面に対して噴霧されることにより、堆積されて樹脂膜が形成される。
-Resin particles-
The resin particles are formed by ejecting a slurry solution prepared by dissolving a resin in a solvent into a mist using the spraying means.
Further, the resin particles are deposited on the surface to be treated by the spraying means to be deposited to form a resin film.
前記樹脂粒子の粒径としては、特に制限はなく、前記導電性粒子の粒径に応じて適宜選択することができるが、４〜６μｍが好ましい。
前記粒径が、４μｍ未満あるいは６μｍを超えると、前記導電性粒子の配列に乱れが生じることがある。
There is no restriction | limiting in particular as a particle size of the said resin particle, Although it can select suitably according to the particle size of the said electroconductive particle, 4-6 micrometers is preferable.
If the particle size is less than 4 μm or more than 6 μm, the arrangement of the conductive particles may be disturbed.
前記スラリー溶液における前記樹脂の含有量としては、特に制限はなく、目的に応じて適宜選択することができるが、１０〜３０質量％が好ましい。
前記含有量が、１０質量％未満であると、噴霧時間が長くなり、製造効率が低下することがあり、３０質量％を超えると、ミストを噴霧することが困難になることがある。
前記溶剤としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば、トルエン、酢酸エチル、メチルエチルケトン（ＭＥＫ）、エタノールなどが好適に挙げられる。
There is no restriction | limiting in particular as content of the said resin in the said slurry solution, Although it can select suitably according to the objective, 10-30 mass% is preferable.
When the content is less than 10% by mass, the spraying time becomes long and the production efficiency may decrease. When the content exceeds 30% by mass, it may be difficult to spray mist.
There is no restriction | limiting in particular as said solvent, Although it can select suitably according to the objective, For example, toluene, ethyl acetate, methyl ethyl ketone (MEK), ethanol etc. are mentioned suitably.
前記樹脂粒子（該樹脂粒子から形成される樹脂膜）は、エポキシ樹脂及びアクリル樹脂から選択される少なくとも１種の絶縁性樹脂からなるのが好ましい。
前記エポキシ樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ノボラック型エポキシ樹脂などが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。
The resin particles (resin film formed from the resin particles) are preferably made of at least one insulating resin selected from epoxy resins and acrylic resins.
There is no restriction | limiting in particular as said epoxy resin, According to the objective, it can select suitably, For example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolak type epoxy resin etc. are mentioned. These may be used individually by 1 type and may use 2 or more types together.
前記アクリル樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、２−ヒドロキシ−１，３−ジアクリロキシプロパン、２，２−ビス[４−（アクリロキシメトキシ）フェニル]プロパン、２，２−ビス[４−（アクリロキシエトキシ）フェニル]プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロキシエチル）イソシアヌレート、ウレタンアクリレートなどが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。
また、前記アクリレートをメタクリレートにしたものが挙げられ、これらは、１種単独で使用してもよいし、２種以上を併用してもよい。
The acrylic resin is not particularly limited and may be appropriately selected depending on the intended purpose. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol Propane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2, 2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) isocyanurate And urethane acrylate. These may be used individually by 1 type and may use 2 or more types together.
Moreover, what made the said acrylate into the methacrylate is mentioned, These may be used individually by 1 type and may use 2 or more types together.
前記樹脂粒子により形成される前記樹脂膜の厚みとしては、前記導電性粒子を前記被処理面上に固定することができる限り特に制限はなく、前記導電性粒子の粒径に応じて、適宜選択することができるが、２〜２０μｍが好ましい。
前記厚みが、２μｍ未満であると、前記導電性粒子の固定化が困難になることがあり、２０μｍを超えると、噴霧時間が長くなり、製造効率が低下することがある。
The thickness of the resin film formed by the resin particles is not particularly limited as long as the conductive particles can be fixed on the surface to be processed, and is appropriately selected according to the particle size of the conductive particles. 2-20 μm is preferred.
When the thickness is less than 2 μm, it may be difficult to fix the conductive particles. When the thickness is more than 20 μm, the spraying time may be increased and the production efficiency may be lowered.
−噴霧手段−
前記噴霧手段は、前記導電性粒子及び前記樹脂粒子を、前記被処理面に対して噴霧する機能を有する。
前記噴霧手段は、前記一の噴霧手段と、前記他の噴霧手段との少なくとも２つが必要であり、これら別々の噴霧手段により、前記導電性粒子と前記樹脂粒子とを、前記被処理面に対して同時に噴霧することが必要である。これらの粒子を同時に噴霧しない場合、例えば、予め形成した樹脂膜上に、前記導電性粒子のみを噴霧する場合、後述する静電電位付与手段により前記導電性粒子に付与された静電電位を有していても、前記樹脂膜が存在することから、電気的な制御が不能となり、前記導電性粒子を単層配列させることができないことがある。
前記一の噴霧手段及び前記他の噴霧手段の形状、構造、大きさなどは、互いに同一であってもよいし、異なっていてもよい。
-Spraying means-
The spraying means has a function of spraying the conductive particles and the resin particles onto the surface to be processed.
The spraying means requires at least two of the one spraying means and the other spraying means. By these separate spraying means, the conductive particles and the resin particles are applied to the surface to be processed. Spraying at the same time. When these particles are not sprayed at the same time, for example, when only the conductive particles are sprayed onto a pre-formed resin film, the electrostatic potential applied to the conductive particles by the electrostatic potential applying means described later is provided. However, since the resin film exists, electrical control becomes impossible and the conductive particles may not be arranged in a single layer.
The shape, structure, size, etc. of the one spraying means and the other spraying means may be the same or different.
前記噴霧手段における、前記導電性粒子の噴出口と、前記被処理面との距離としては、特に制限はなく、前記噴霧手段の前記導電性粒子の噴出速度と、前記導電性粒子の前記被処理面への到達速度との関係に応じて、適宜選択することができる。
前記被処理面への前記導電性粒子の到達速度としては、特に制限はなく、目的に応じて適宜選択することができるが、０．３ｍ／ｍｉｎ以下が好ましい。
前記到達速度が、０．３ｍ／ｍｉｎを超えると、任意の場所に前記導電性粒子の配列を形成するのが困難になることがある。
There is no particular limitation on the distance between the conductive particle ejection port and the surface to be treated in the spraying means. The spraying speed of the conductive particles in the spraying means and the treatment of the conductive particles are not limited. It can be appropriately selected according to the relationship with the speed of reaching the surface.
There is no restriction | limiting in particular as the arrival speed of the said electroconductive particle to the said to-be-processed surface, Although it can select suitably according to the objective, 0.3 m / min or less is preferable.
When the reaching speed exceeds 0.3 m / min, it may be difficult to form the conductive particle array in an arbitrary place.
前記噴霧手段としては、前記導電性粒子及び前記樹脂粒子を噴霧することができる限り特に制限はなく、目的に応じて適宜選択することができるが、例えば、ノズルを有しているのが好ましい。
前記ノズルとしては、その形状、構造、大きさ、径としては、特に制限はなく、公知のものの中から適宜選択することができるが、前記ノズルの径としては、０．１〜１．０ｍｍが好ましい。
前記ノズルの径が、０．１ｍｍ未満であると、噴霧し難くなることがあり、１．０ｍｍを超えると、ミストの粒径制御が困難となることがある。
前記ノズルは、市販品であってもよいし、適宜作製したものであってもよく、前記市販品としては、例えば、図１に示す、二流体ノズル（「２流体スプレーノズル １／４ＪＡＵＣＯ」；スプレイイングシステムス（株）製）が挙げられる。
The spraying means is not particularly limited as long as the conductive particles and the resin particles can be sprayed, and can be appropriately selected according to the purpose. For example, it is preferable to have a nozzle.
The shape, structure, size, and diameter of the nozzle are not particularly limited and may be appropriately selected from known ones. The diameter of the nozzle is 0.1 to 1.0 mm. preferable.
When the diameter of the nozzle is less than 0.1 mm, it may be difficult to spray, and when it exceeds 1.0 mm, it may be difficult to control the particle diameter of the mist.
The nozzle may be a commercially available product or may be appropriately prepared. Examples of the commercially available product include a two-fluid nozzle (“two-fluid spray nozzle 1/4 JAUCO” shown in FIG. 1; Spraying Systems Co., Ltd.).
−静電電位付与手段−
前記静電電位付与手段は、前記導電性粒子に静電電位を付与する機能を有する。
前記静電電位付与手段は、前記導電性粒子が前記噴霧手段を用いて噴出された直後に、前記導電性粒子に静電電位を付与するのが好ましく、例えば、前記静電電位付与手段を、前記噴霧手段における前記導電性粒子の噴出口に隣接配設し、かつ特定の電圧を印加することにより、前記導電性粒子を帯電させることができる。
-Electrostatic potential applying means-
The electrostatic potential applying means has a function of applying an electrostatic potential to the conductive particles.
The electrostatic potential applying means preferably applies an electrostatic potential to the conductive particles immediately after the conductive particles are ejected using the spraying means. The conductive particles can be charged by being disposed adjacent to the conductive particle ejection port of the spraying means and applying a specific voltage.
前記静電電位付与手段における印加電圧としては、特に制限はなく、前記導電性粒子の種類に応じて適宜選択することができる。
前記静電電位付与手段により静電電位が付与された前記導電性粒子における、該静電電位の大きさとしては、特に制限はなく、目的に応じて適宜選択することができるが、３００〜１，５００Ｖが好ましい。
前記静電電位の大きさが、３００Ｖ未満であると、前記導電性粒子が配列し難いことがあり、１，５００Ｖを超えると、前記導電性粒子同士が反発し合い、配列構造を制御することができないことがある。
There is no restriction | limiting in particular as an applied voltage in the said electrostatic potential provision means, According to the kind of said electroconductive particle, it can select suitably.
There is no restriction | limiting in particular as the magnitude | size of this electrostatic potential in the said electroconductive particle to which the electrostatic potential was provided by the said electrostatic potential provision means, Although it can select suitably according to the objective, 300-1 500V is preferred.
When the magnitude of the electrostatic potential is less than 300 V, the conductive particles may be difficult to arrange, and when the electrostatic potential exceeds 1,500 V, the conductive particles repel each other to control the arrangement structure. May not be possible.
前記静電電位付与手段としては、特に制限はなく、公知のものの中から適宜選択することができ、例えば、電荷印加装置（直流高圧電源、「ＰＳＤ−２００」；春日電機（株）製）などが挙げられる。 There is no restriction | limiting in particular as said electrostatic potential provision means, It can select suitably from well-known things, For example, a charge application apparatus (DC high voltage power supply, "PSD-200"; Kasuga Electric Co., Ltd. product) etc. Is mentioned.
−被処理面−
前記被処理面は、前記導電性粒子を単層配列させる対象であり、該被処理面としては、各種部材の表面が挙げられ、例えば、基板の表面、各種膜（例えば、樹脂膜）の表面などが挙げられる。
-Surface to be treated-
The surface to be treated is an object on which the conductive particles are arranged in a single layer, and examples of the surface to be treated include the surface of various members, such as the surface of a substrate and the surface of various films (for example, resin films). Etc.
前記被処理面は、導電性パターンを有してなるのが好ましい。この場合、該導電性パターン上に、前記導電性粒子を選択的に配列させることができ、粒子の配列を容易に制御することができる点で、有利である。
前記導電性パターンとしては、導電性を有する限り特に制限はなく、目的に応じて適宜選択することができるが、その材質としては、金属が好適に挙げられ、パターン形状としては、ライン状のほか、目的に応じて各種模様を選択することができる。
The surface to be treated preferably has a conductive pattern. In this case, it is advantageous in that the conductive particles can be selectively arranged on the conductive pattern, and the arrangement of the particles can be easily controlled.
The conductive pattern is not particularly limited as long as it has conductivity, and can be appropriately selected according to the purpose. However, the material is preferably a metal, and the pattern shape is other than a line shape. Various patterns can be selected according to the purpose.
以上の工程により、別々の前記噴霧手段を用いて噴出され、前記静電電位付与手段により静電電位が付与された前記導電性粒子と、前記樹脂粒子とが、前記被処理面上に同時に噴霧されて、前記樹脂粒子で形成された前記樹脂膜中に前記導電性粒子が単層配列される。その結果、本発明の前記異方性導電膜が得られる。 Through the above steps, the conductive particles ejected by using the separate spraying means and applied with the electrostatic potential by the electrostatic potential applying means and the resin particles are sprayed simultaneously on the surface to be treated. The conductive particles are arranged in a single layer in the resin film formed of the resin particles. As a result, the anisotropic conductive film of the present invention is obtained.
＜その他の工程＞
前記その他の工程としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば、前記導電性粒子が単層配列された前記樹脂膜を加熱し、前記溶剤を乾燥させる工程などが挙げられる。
<Other processes>
The other steps are not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a step of heating the resin film in which the conductive particles are arranged in a single layer and drying the solvent. Is mentioned.
ここで、本発明の前記異方性導電膜の製造方法の一例を、図面を用いて説明する。
図２に示すように、一の噴霧手段１０を用いて噴出された導電性粒子１２と、他の噴霧手段２０を用いて噴出された樹脂粒子２２とを、被処理面４０上に同時に噴霧する。このとき、一の噴霧手段１０と被処理面４０との間であって、一の噴霧手段１０における導電性粒子１２の噴出口に、静電電位付与手段３０が隣接配置されており、導電性粒子１２は、一の噴霧手段１０を用いて噴出された直後、静電電位付与手段３０により電圧が印加されて、静電電位が付与される。
このように、別々の噴霧手段（噴霧手段１０及び噴霧手段２０）を用いて噴出された導電性粒子１２と、樹脂粒子２２とが、同時に被処理面４０上に噴霧されるので、導電性粒子１２は、静電電位が損なわれることなく被処理面４０上にて単層配列され、しかも導電性粒子１２の位置安定性が確保された状態にて、樹脂粒子２２が堆積されて樹脂膜２４が形成される。その結果、樹脂膜２４中であって、樹脂膜２４の厚み方向における一方の面側に、導電性粒子１２が、ミクロンオーダーの配列間隔で単層配列された異方性導電膜が得られる。該異方性導電膜においては、樹脂膜２４の厚み方向における一方の面と、導電性粒子１２の中心との距離の１０点平均が、９μｍ以下となっている。
Here, an example of the method for producing the anisotropic conductive film of the present invention will be described with reference to the drawings.
As shown in FIG. 2, the conductive particles 12 ejected using one spraying means 10 and the resin particles 22 ejected using another spraying means 20 are sprayed simultaneously on the surface to be treated 40. . At this time, the electrostatic potential applying means 30 is disposed adjacent to the ejection port of the conductive particles 12 in the one spraying means 10 between the one spraying means 10 and the surface to be processed 40, so Immediately after the particles 12 are ejected by using one spraying means 10, a voltage is applied by the electrostatic potential applying means 30 to apply an electrostatic potential.
Thus, since the conductive particles 12 and the resin particles 22 ejected using different spraying means (spraying means 10 and spraying means 20) are simultaneously sprayed on the surface to be treated 40, the conductive particles. 12 are arranged in a single layer on the surface to be processed 40 without impairing the electrostatic potential, and the resin particles 22 are deposited and the resin film 24 in a state where the positional stability of the conductive particles 12 is ensured. Is formed. As a result, an anisotropic conductive film is obtained in which the conductive particles 12 are arranged in a single layer at an arrangement interval in the micron order on one surface side in the thickness direction of the resin film 24 in the resin film 24. In the anisotropic conductive film, the 10-point average of the distance between one surface in the thickness direction of the resin film 24 and the center of the conductive particles 12 is 9 μm or less.
本発明の異方性導電膜は、前記樹脂膜の厚み方向における一方の面から９μｍ以内に、前記導電性粒子が単層配列しているので、電子部品等と基板との接続に用いると、接続の際に、前記導電性粒子の流動を抑制してショートの発生を防止すると共に、少ない粒子添加量で、高い粒子捕捉率を確保することができ、優れた導通信頼性が得られる。
このため、本発明の前記異方性導電膜は、各種電子部品と基板、基板同士などの接合に好適に使用することができ、例えば、ＩＣタグ、ＩＣカード、メモリーカード、フラットパネルディスプレイなどの製造に好適に使用することができる。
In the anisotropic conductive film of the present invention, since the conductive particles are arranged in a single layer within 9 μm from one surface in the thickness direction of the resin film, when used for connecting an electronic component or the like to a substrate, At the time of connection, the flow of the conductive particles is suppressed to prevent the occurrence of a short circuit, and a high particle capture rate can be ensured with a small amount of added particles, and excellent conduction reliability can be obtained.
Therefore, the anisotropic conductive film of the present invention can be suitably used for joining various electronic components and substrates, substrates, etc., for example, IC tags, IC cards, memory cards, flat panel displays, etc. It can be suitably used for production.
（接合体）
本発明の接合体は、本発明の前記異方性導電膜を介して、電子部品及び基板から選択される２種以上が、電気的に接合されてなる。即ち、前記電子部品における接合端子と、前記基板における電極又は接合端子との間、或いは前記基板同士における接合端子間に、前記導電性粒子が挟まれて潰されることにより、前記接合端子と前記電極等との導通が図られている。
なお、本発明の前記異方性導電膜の詳細については、上述した通りである。
(Joint)
The joined body of the present invention is formed by electrically joining two or more selected from electronic components and substrates through the anisotropic conductive film of the present invention. That is, when the conductive particles are sandwiched and crushed between the junction terminal in the electronic component and the electrode or the junction terminal in the substrate, or between the junction terminals in the substrates, the junction terminal and the electrode Etc. are established.
The details of the anisotropic conductive film of the present invention are as described above.
前記電子部品としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ＩＣチップ、例えば、フラットパネルディスプレイ（ＦＰＤ）における液晶画面制御用ＩＣチップ、液晶パネルなどが挙げられる。
前記基板としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ＩＴＯガラス基板、フレキシブル基板、リジッド基板、フレキシブルプリント基板などが挙げられる。
There is no restriction | limiting in particular as said electronic component, According to the objective, it can select suitably, For example, IC chip, IC chip for liquid crystal screen control in a flat panel display (FPD), a liquid crystal panel etc. are mentioned, for example.
There is no restriction | limiting in particular as said board | substrate, According to the objective, it can select suitably, For example, an ITO glass substrate, a flexible substrate, a rigid substrate, a flexible printed circuit board etc. are mentioned.
前記電子部品及び前記基板から選択される２種以上における接合端子の面積としては、特に制限はなく、目的に応じて適宜選択することができるが、電子機器の小型化及び高機能化に伴う接合端子のファインピッチ化の技術動向に対応可能な点で、６００μｍ２以上１，８００μｍ２未満が好ましく、６００〜１，２００μｍ２がより好ましい。 The area of the junction terminal in the two or more types selected from the electronic component and the substrate is not particularly limited and can be appropriately selected according to the purpose. in terms adaptable to technical trend of finer pitch of the terminals, 600 .mu.m 2 or more 1,800μm than 2 are preferred, 600～1,200Myuemu 2 is more preferable.
本発明の前記接合体は、本発明の前記異方性導電膜を用いているので、前記導電性粒子の粒子捕捉率が高く、優れた導通信頼性を有する。 Since the bonded body of the present invention uses the anisotropic conductive film of the present invention, the conductive particles have a high particle capture rate and have excellent conduction reliability.
以下、本発明の実施例について説明するが、本発明は下記実施例に何ら限定されるものではない。 Examples of the present invention will be described below, but the present invention is not limited to the following examples.
（実施例１）
−異方性導電膜の作製−
前記導電性粒子としてのＮｉ−Ａｕメッキ樹脂粒子（「ミクロパール ＡＵ」；積水化学工業（株）製、粒径４μｍ、以下、「金粒子」と称する。）９質量部に、前記溶剤としてのトルエンを加えて、導電性粒子の４０質量％スラリー溶液を調製した。以下、このスラリー溶液を、「Ａ液」と称する。
次に、前記絶縁性樹脂としての液状エポキシ樹脂（「ＥＰ８２８」；ジャパンエポキシレジン（株）製）３０質量部、フェノキシ樹脂（「ＰＫＨＨ」；インケム（株）製）３０質量部、シランカップリング剤（「Ａ−１８７」；日本ユニカー（株）製）１質量部、及びイミダゾール系潜在性硬化剤（「３９４１ＨＰ」；旭化成ケミカルズ社製）３０質量部を混合して樹脂組成物を調製し、これに前記溶剤としてのトルエンを加えて、樹脂の１０質量％トルエン溶液を調製した。以下、このトルエン溶液を、「Ｂ液」と称する。
Example 1
-Production of anisotropic conductive film-
9 parts by mass of Ni—Au plated resin particles (“Micropearl AU”; manufactured by Sekisui Chemical Co., Ltd., hereinafter referred to as “gold particles”) as the conductive particles were used as the solvent. Toluene was added to prepare a 40 mass% slurry solution of conductive particles. Hereinafter, this slurry solution is referred to as “liquid A”.
Next, 30 parts by mass of a liquid epoxy resin (“EP828”; manufactured by Japan Epoxy Resin Co., Ltd.) as the insulating resin, 30 parts by mass of a phenoxy resin (“PKHH”; manufactured by Inchem Co., Ltd.), and a silane coupling agent A resin composition was prepared by mixing 1 part by mass (“A-187”; manufactured by Nihon Unicar Co., Ltd.) and 30 parts by mass of an imidazole-based latent curing agent (“3941HP”; manufactured by Asahi Kasei Chemicals). Toluene was added as a solvent to prepare a 10% by mass toluene solution of the resin. Hereinafter, this toluene solution is referred to as “Liquid B”.
導電性粒子を配列させる対象（前記被処理面）として、ポリエチレンテレフタレート（ＰＥＴ）からなるフィルム（ＰＥＴ層）を用意した。
次いで、図１に示す二流体ノズル（「２流体スプレーノズル １／４ＪＡＵＣＯ」；スプレイイングシステムス（株）製）を接続した噴霧装置を、導電性粒子噴霧用と、樹脂粒子噴霧用との２つ用意し、それぞれのノズルの噴出口とＰＥＴ層表面との離間距離が、１ｍとなるように配置した。また、導電性粒子噴霧用の噴霧装置とＰＥＴ層表面との間に、電荷印加装置（直流高圧電源、「ＰＳＤ−２００」；春日電機（株）製）を配置した。
そして、噴霧装置を用いて、Ａ液及びＢ液を、ノズル径０．６ｍｍ、噴霧時間０．５秒間、金粒子及び樹脂粒子のＰＥＴ層への到達速度０．３ｍ／ｍｉｎの条件で、別々のノズルから噴霧した。このとき、ノズルから噴出されたＡ液中の金粒子に対して、前記電荷印加装置により、５００Ｖの電圧を印加することにより、静電電位が付与されて、金粒子は、帯電（静電電位３００Ｖ）した状態にて、ＰＥＴ層の表面上に噴霧された。また、ノズルから噴出された、Ｂ液により形成された樹脂粒子が、ＰＥＴ層の表面上に噴霧されて堆積された。
A film (PET layer) made of polyethylene terephthalate (PET) was prepared as a target for arranging conductive particles (the surface to be treated).
Next, two spray devices connected to the two-fluid nozzle shown in FIG. 1 (“2-fluid spray nozzle 1/4 JAUCO”; manufactured by Spraying Systems Co., Ltd.) are used for conductive particle spraying and resin particle spraying. Were prepared and arranged such that the separation distance between the nozzle outlet of each nozzle and the surface of the PET layer was 1 m. Further, a charge application device (DC high-voltage power supply, “PSD-200”; manufactured by Kasuga Electric Co., Ltd.) was disposed between the spray device for spraying conductive particles and the surface of the PET layer.
Then, using the spray device, the liquid A and the liquid B are separately separated under the conditions that the nozzle diameter is 0.6 mm, the spray time is 0.5 seconds, and the arrival speed of gold particles and resin particles to the PET layer is 0.3 m / min Sprayed from the nozzle. At this time, an electrostatic potential is applied to the gold particles in the liquid A ejected from the nozzle by applying a voltage of 500 V by the charge applying device, and the gold particles are charged (electrostatic potential). 300V) and sprayed on the surface of the PET layer. Further, the resin particles formed from the B liquid ejected from the nozzle were sprayed and deposited on the surface of the PET layer.
その結果、ＰＥＴ層の表面上に、エポキシ樹脂中に金粒子が単層配列されたエポキシ樹脂塗布膜（前記異方性導電膜）が形成された。
得られたエポキシ樹脂塗布膜を、６０℃、１５分間の条件にて、オーブン中で加熱し、トルエンを乾燥させ、金粒子が単層配列したエポキシ樹脂膜（厚み２０μｍ）を得た。
As a result, an epoxy resin coating film (the anisotropic conductive film) in which gold particles were arranged in a single layer in an epoxy resin was formed on the surface of the PET layer.
The obtained epoxy resin coating film was heated in an oven at 60 ° C. for 15 minutes to dry toluene, and an epoxy resin film (thickness 20 μm) in which gold particles were arranged in a single layer was obtained.
得られたエポキシ樹脂膜中の金粒子の存在位置を測定したところ、該エポキシ樹脂膜の厚み方向における金粒子の存在する側の面（ＰＥＴ層との境界面）と、金粒子の中心との距離の１０点平均が、５μｍであった。
また、金粒子の配列間隔を測定したところ、隣接する金粒子同士の中心間距離の１０点平均が、１０μｍであった。
When the presence position of the gold particle in the obtained epoxy resin film was measured, the surface on the side where the gold particle exists in the thickness direction of the epoxy resin film (boundary surface with the PET layer) and the center of the gold particle The average of 10 points of distance was 5 μm.
Moreover, when the arrangement | positioning space | interval of gold particle was measured, the 10-point average of the distance between centers of adjacent gold particles was 10 micrometers.
（実施例２）
−異方性導電膜の作製−
実施例１において、前記導電性粒子のスラリー溶液（Ａ液）、及び前記樹脂のトルエン溶液（Ｂ液）の組成を、下記組成に変えて調製した以外は、実施例１と同様にして、異方性導電膜を作製した。
(Example 2)
-Production of anisotropic conductive film-
In Example 1, except that the composition of the slurry solution of the conductive particles (liquid A) and the toluene solution of the resin (liquid B) were changed to the following compositions, the same procedure as in Example 1 was performed. A isotropic conductive film was produced.
導電性粒子のスラリー溶液（Ａ液）は、前記導電性粒子としてのＮｉ−Ａｕメッキ樹脂粒子（「ミクロパール ＡＵ」；積水化学工業（株）製、粒径４μｍ）１０質量部に、前記溶剤としてのトルエンを加えて、導電性粒子の４０質量％スラリー溶液とした。
樹脂のトルエン溶液（Ｂ液）は、前記絶縁性樹脂としての液状アクリル樹脂（「３００２Ａ」；共栄社化学（株）製）３５質量部、フェノキシ樹脂（「ＰＫＨＨ」；インケム（株）製）４５質量部、シランカップリング剤（「Ａ−１７２」；日本ユニカー（株）製）２質量部、及びラジカル開始剤（「パーヘキサ３Ｍ」；日本油脂（株）製）８質量部を混合して樹脂組成物を調製し、前記溶剤としてのトルエンを加えて、樹脂の１０質量％トルエン溶液とした。
The slurry solution (liquid A) of conductive particles is obtained by adding 10 parts by mass of the solvent to the Ni—Au plated resin particles (“Micropearl AU”; particle size 4 μm, manufactured by Sekisui Chemical Co., Ltd.) as the conductive particles. As a result, toluene was added to obtain a 40 mass% slurry solution of conductive particles.
The toluene solution (liquid B) of the resin was 35 parts by mass of liquid acrylic resin (“3002A”; manufactured by Kyoeisha Chemical Co., Ltd.) as the insulating resin, and 45 masses of phenoxy resin (“PKHH”; manufactured by Inchem Co., Ltd.). Part, 2 parts by mass of a silane coupling agent (“A-172”; manufactured by Nihon Unicar Co., Ltd.) and 8 parts by mass of a radical initiator (“Perhexa 3M”; manufactured by Nippon Oil & Fats Co., Ltd.) The product was prepared, and toluene as the solvent was added to make a 10% by mass toluene solution of the resin.
その結果、ＰＥＴ層の表面上に、アクリル樹脂中に金粒子が単層配列されたアクリル樹脂膜（前記異方性導電膜）を得た。該アクリル樹脂膜中の金粒子の存在位置を測定したところ、該アクリル樹脂膜の厚み方向における金粒子の存在する側の面（ＰＥＴ層との境界面）と、金粒子の中心との距離の１０点平均が、５μｍであった。
また、金粒子の配列間隔を測定したところ、隣接する金粒子同士の中心間距離の１０点平均が、１０μｍであった。
As a result, an acrylic resin film (said anisotropic conductive film) in which gold particles were arranged in a single layer in an acrylic resin was obtained on the surface of the PET layer. When the location of the gold particles in the acrylic resin film was measured, the distance between the surface of the gold resin in the thickness direction of the acrylic resin film (the boundary surface with the PET layer) and the center of the gold particles was measured. The 10-point average was 5 μm.
Moreover, when the arrangement | positioning space | interval of gold particle was measured, the 10-point average of the distance between centers of adjacent gold particles was 10 micrometers.
（比較例１）
−異方性導電膜の作製−
イミダゾール系潜在性硬化剤（「３９４１ＨＰ」；旭化成ケミカルズ社製）４０質量部、液状エポキシ樹脂（「ＥＰ８２８」；ジャパンエポキシレジン（株）製）１４質量部、フェノキシ樹脂（「ＰＫＨＨ」；インケム（株）製）３５質量部、及びシランカップリング剤（「Ａ−１８７」；日本ユニカー（株）製）１質量部を混合し、これに、導電性粒子として、Ｎｉ−Ａｕメッキ樹脂粒子（「ミクロパール ＡＵ」；積水化学工業（株）製、粒径４μｍ）１０質量部を分散させて、導電性粒子含有樹脂組成物を調製した。
得られた導電性粒子含有樹脂組成物を、ポリエチレンテレフタレート（ＰＥＴ）からなるフィルム（ＰＥＴ層）上に、バーコーターを用いて塗布し、厚み２０μｍのエポキシ樹脂塗布膜（前記異方性導電膜）を作製した。
得られたエポキシ樹脂塗布膜を、６０℃、１５分間の条件にて、オーブン中で加熱し、トルエンを乾燥させ、金粒子が分散されたエポキシ樹脂膜を得た。
(Comparative Example 1)
-Production of anisotropic conductive film-
Imidazole-based latent curing agent (“3941HP”; manufactured by Asahi Kasei Chemicals), 40 parts by mass, liquid epoxy resin (“EP828”; manufactured by Japan Epoxy Resin Co., Ltd.), 14 parts by mass, phenoxy resin (“PKHH”; Inchem Corporation) )) 35 parts by mass and 1 part by mass of a silane coupling agent (“A-187”; manufactured by Nihon Unicar Co., Ltd.), and Ni—Au plated resin particles (“micro”) as conductive particles. 10 parts by mass of “Pearl AU” (manufactured by Sekisui Chemical Co., Ltd., particle size 4 μm) was dispersed to prepare a conductive particle-containing resin composition.
The obtained conductive particle-containing resin composition was applied onto a film (PET layer) made of polyethylene terephthalate (PET) using a bar coater, and an epoxy resin coating film having a thickness of 20 μm (said anisotropic conductive film). Was made.
The obtained epoxy resin coating film was heated in an oven at 60 ° C. for 15 minutes to dry toluene and obtain an epoxy resin film in which gold particles were dispersed.
エポキシ樹脂膜中の金粒子の存在位置を測定したところ、該エポキシ樹脂膜の厚み方向における一方の面（ＰＥＴ層との境界面）と、金粒子の中心との距離の１０点平均が、１５μｍであった。
また、金粒子の配列間隔を測定したところ、隣接する金粒子同士の中心間距離の１０点平均が、４０μｍであった。
When the location of the gold particles in the epoxy resin film was measured, the 10-point average of the distance between one surface in the thickness direction of the epoxy resin film (the boundary surface with the PET layer) and the center of the gold particles was 15 μm. Met.
Moreover, when the arrangement | positioning space | interval of a gold particle was measured, the 10-point average of the distance between centers of adjacent gold particles was 40 micrometers.
（接合体の作製１）
実施例１〜２及び比較例１で作製した異方性導電膜を用いて、以下に示す評価用チップＡ及び評価用チップＢと、ＩＴＯパターンガラスとの接合体を作製した。
〔評価用チップＡ〕
材質：シリコン、外寸：２０ｍｍ×２ｍｍ、厚み：０．５ｍｍ
バンプ種類：金メッキバンプ、バンプ厚み：１５μｍ、バンプ数：８００／チップ、バンプサイズ：３０μｍ×１５０μｍ、バンプ間スペース：１８μｍ
〔評価用チップＢ〕
材質：シリコン、外寸：１５ｍｍ×１３ｍｍ、厚み：０．５ｍｍ
バンプ種類：金メッキバンプ、バンプ厚み：１５μｍ、バンプ数：７００／チップ、バンプサイズ：３０μｍ×１４０μｍ、バンプ間スペース：６μｍ
〔ＩＴＯパターンガラス〕
厚み：０．７ｍｍ
(Preparation of joined body 1)
Using the anisotropic conductive films prepared in Examples 1 and 2 and Comparative Example 1, a bonded body of evaluation chip A and evaluation chip B shown below and ITO pattern glass was prepared.
[Evaluation chip A]
Material: Silicone, outer dimensions: 20mm x 2mm, thickness: 0.5mm
Bump type: gold-plated bump, bump thickness: 15 μm, number of bumps: 800 / chip, bump size: 30 μm × 150 μm, space between bumps: 18 μm
[Evaluation chip B]
Material: Silicone, outer dimensions: 15mm x 13mm, thickness: 0.5mm
Bump type: gold-plated bump, bump thickness: 15 μm, number of bumps: 700 / chip, bump size: 30 μm × 140 μm, space between bumps: 6 μm
[ITO pattern glass]
Thickness: 0.7mm
異方性導電膜における導電性粒子が存在している側の面を、評価用チップにおけるバンプ側に、他方の面をＩＴＯパターンガラスにおける導体パターン側に、それぞれ配置した状態で、バンプと導体パターンとが対向するように、異方性導電膜を介して、評価用チップＡ及び評価用チップＢそれぞれと、ＩＴＯパターンガラスとを重ね、１８０℃及び２００℃の加熱条件にて、８０ＭＰａ／チップ、１０秒間の条件でそれぞれ加圧することにより圧着し、接合体を得た。 With the conductive conductive particle side of the anisotropic conductive film placed on the bump side of the evaluation chip and the other side placed on the conductive pattern side of the ITO pattern glass, the bump and the conductive pattern The evaluation chip A and the evaluation chip B are overlapped with the ITO pattern glass with an anisotropic conductive film so as to face each other, and 80 MPa / chip under heating conditions of 180 ° C. and 200 ° C., Each was pressed under pressure for 10 seconds to obtain a joined body.
ここで、実施例１の異方性導電膜を介して評価用チップＡとＩＴＯパターンガラスとが圧着されてなる接合体の断面ＳＥＭ写真を図３Ａに、比較例１の異方性導電膜を介して評価用チップＡとＩＴＯパターンガラスとが圧着されてなる接合体の断面ＳＥＭ写真を図３Ｂに、それぞれ示す。
実施例１の異方性導電膜における金粒子は、該膜の厚み方向における一方の面から極めて短い距離にて単層配列しているため、図３Ａに示すように、導通に寄与する導電性粒子の粒子捕捉率を格段に向上させることができることが判った。
一方、比較例１の異方性導電膜における金粒子は、単層配列することなく、膜中に分散しているため、評価用チップＡとＩＴＯパターンガラスとの圧着時に、樹脂の流動による影響を受け易く、図３Ｂに示すように、導通に寄与する導電性粒子の粒子捕捉率が低いことが判った。
Here, FIG. 3A is a cross-sectional SEM photograph of a joined body in which the evaluation chip A and ITO pattern glass are pressure-bonded via the anisotropic conductive film of Example 1, and FIG. 3A shows the anisotropic conductive film of Comparative Example 1. FIG. 3B shows cross-sectional SEM photographs of the joined bodies in which the evaluation chip A and the ITO pattern glass are pressure-bonded.
Since the gold particles in the anisotropic conductive film of Example 1 are arranged in a single layer at an extremely short distance from one surface in the thickness direction of the film, as shown in FIG. It was found that the particle capture rate of the particles can be remarkably improved.
On the other hand, since the gold particles in the anisotropic conductive film of Comparative Example 1 are dispersed in the film without being arranged in a single layer, the influence of the flow of the resin during the pressure bonding between the evaluation chip A and the ITO pattern glass. As shown in FIG. 3B, it was found that the particle capturing rate of the conductive particles contributing to conduction is low.
＜ＣＯＧ（Ｃｈｉｐ ｏｎ ｇｌａｓｓ）導通抵抗試験＞
次いで、各接合体について、ＪＥＩＴＡ ＥＩＡＪ ＥＤ−４７０１の試験規格に従い、導体パターン間の抵抗値を４端子法によって測定し、下記評価基準に基づいて評価した。結果を、評価用チップＡについては表１に、評価用チップＢについては表２に、それぞれ示す。
〔評価基準〕
○：圧着直後の抵抗値が５Ω以下であり、ショートの発生無し。
×：圧着直後の抵抗値が５Ωより大きく、ショートの発生有り。
<COG (Chip on glass) conduction resistance test>
Next, for each joined body, the resistance value between the conductor patterns was measured by a four-terminal method according to the test standard of JEITA EIAJ ED-4701, and evaluated based on the following evaluation criteria. The results are shown in Table 1 for the evaluation chip A and in Table 2 for the evaluation chip B, respectively.
〔Evaluation criteria〕
○: The resistance value immediately after crimping is 5Ω or less, and no short circuit occurs.
X: Resistance value immediately after crimping is larger than 5Ω, and short circuit occurs.
表１及び表２より、実施例１〜２で得られた異方性導電膜を用いると、圧着直後の接合体における導通抵抗値が低く、ショートの発生もなく、チップとＩＴＯパターンガラスとの接合が可能であることが確認された。このことは、実施例１〜２で得られた異方性導電膜は、導電性粒子が該膜の厚み方向における一方の面から極めて短い距離にて単層配列しているため、評価用チップＢのようにバンプ間スペースが６μｍと狭い場合であっても、導通に寄与する導電性粒子を確実に捕捉できることによるものである。
これに対し、比較例１で得られた異方性導電膜を用いると、評価用チップＡ（バンプ間スペース１８μｍ）とＩＴＯパターンガラスとを圧着した接合体については、圧着直後の接合体における導通抵抗値が低く、ショートの発生もなく、チップとＩＴＯパターンガラスとの接合が可能であるものの、評価用チップＢとＩＴＯパターンガラスとを圧着した接合体については、圧着直後の接合体における導通抵抗値が高く、ショートの発生があることが確認された。このことは、比較例１で得られた異方性導電膜は、導電性粒子が単層配列することなく、膜中に分散しているため、特に、評価用チップＢのようにバンプ間スペースが６μｍと狭い場合に、導通に寄与する導電性粒子を捕捉できないことによるものである。
From Table 1 and Table 2, when the anisotropic conductive film obtained in Examples 1 and 2 was used, the conduction resistance value in the bonded body immediately after the crimping was low, no short-circuit occurred, and the chip and the ITO pattern glass It was confirmed that joining was possible. This is because the anisotropic conductive films obtained in Examples 1 and 2 are arranged in a single layer at a very short distance from one surface in the thickness direction of the film. This is because even when the space between the bumps is as narrow as 6 μm as in B, the conductive particles contributing to conduction can be reliably captured.
On the other hand, when the anisotropic conductive film obtained in Comparative Example 1 is used, the continuity in the bonded body immediately after the pressure bonding is obtained with respect to the bonded body obtained by pressure-bonding the evaluation chip A (bump space 18 μm) and the ITO pattern glass. Although the resistance value is low and there is no occurrence of a short circuit and the chip and the ITO pattern glass can be joined, for the joined body obtained by crimping the evaluation chip B and the ITO pattern glass, the conduction resistance in the joined body immediately after the crimping The value was high and it was confirmed that there was a short circuit. This is because, in the anisotropic conductive film obtained in Comparative Example 1, the conductive particles are dispersed in the film without being arranged in a single layer. This is because the conductive particles that contribute to conduction cannot be captured when N is as small as 6 μm.
（接合体の作製２）
接合体の作製１と同様にして、実施例１及び比較例１の異方性導電膜を用いて、評価用チップＡとＩＴＯパターンガラスとを圧着し、接合体を作製した。
(Preparation of joined body 2)
In the same manner as in Production 1 of the bonded body, using the anisotropic conductive film of Example 1 and Comparative Example 1, the evaluation chip A and ITO pattern glass were pressure-bonded to prepare a bonded body.
（接合体の作製３）
加熱条件を、１７０℃及び１９０℃に変えた以外は、接合体の作製１と同様にして、実施例２及び比較例１の異方性導電膜を用いて、評価用チップＡとＩＴＯパターンガラスとを圧着し、接合体を作製した。
(Preparation of joined body 3)
Except that the heating conditions were changed to 170 ° C. and 190 ° C., the evaluation chip A and ITO pattern glass were prepared using the anisotropic conductive film of Example 2 and Comparative Example 1 in the same manner as in Production 1 of the joined body. Were bonded together to prepare a joined body.
＜ＣＯＧ（Ｃｈｉｐ ｏｎ ｇｌａｓｓ）導通抵抗信頼性試験＞
次いで、前記接合体の作製２及び３で得られた各接合体について、ＪＥＩＴＡ ＥＩＡＪ ＥＤ−４７０１の試験規格に従い、導体パターン間の抵抗値を４端子法によって測定した。ここで、抵抗値は、温度８５℃、湿度８５％ＲＨの条件下にて、評価用チップＡとＩＴＯパターンガラスとの圧着直後及びエージング後（２５０時間経過後、５００時間経過後、及び１，０００時間経過後）において測定し、下記評価基準に基づいて評価した。結果を表３に示す。
〔評価基準〕
○：圧着直後の抵抗値が５Ω以下であり、エージング後の抵抗値が、圧着直後の抵抗値の３倍以下である。
×：圧着直後の抵抗値は５Ω以下であるが、エージング後の抵抗値が、圧着直後の抵抗値の３倍より大きい。
<COG (Chip on glass) conduction resistance reliability test>
Next, the resistance value between the conductor patterns was measured by the four-terminal method for each of the joined bodies obtained in Preparations 2 and 3 of the joined body according to the test standard of JEITA EIAJ ED-4701. Here, the resistance values are as follows: under the conditions of a temperature of 85 ° C. and a humidity of 85% RH, immediately after the pressure bonding between the evaluation chip A and the ITO pattern glass and after aging (after 250 hours, after 500 hours, and 1, 000 hours later) and evaluated based on the following evaluation criteria. The results are shown in Table 3.
〔Evaluation criteria〕
○: The resistance value immediately after crimping is 5Ω or less, and the resistance value after aging is 3 times or less of the resistance value immediately after crimping.
X: Although the resistance value immediately after crimping is 5Ω or less, the resistance value after aging is larger than three times the resistance value immediately after crimping.
表３より、実施例１及び実施例２の異方性導電膜は、エージング後の接合体における抵抗値が低く、実用上充分な電気的特性を示し、優れた接続信頼性が得られることが判った。これに対し、比較例１の異方性導電膜は、圧着直後の接合体における抵抗値は低いものの、２５０時間経過後には、抵抗値が圧着直後の抵抗値の３倍よりも大きくなってしまい、接合体を製品として使用することができず、実用性に劣ることが判った。 From Table 3, it can be seen that the anisotropic conductive films of Example 1 and Example 2 have a low resistance value in the bonded body after aging, show practically sufficient electrical characteristics, and have excellent connection reliability. understood. In contrast, the anisotropic conductive film of Comparative Example 1 has a low resistance value in the bonded body immediately after the pressure bonding, but after 250 hours, the resistance value becomes larger than three times the resistance value immediately after the pressure bonding. It was found that the joined body could not be used as a product and was inferior in practicality.
以上より、本発明の異方性導電膜は、噴霧装置を用いて導電性粒子と樹脂粒子とを同時に噴霧することにより形成することができるため、従来の異方性導電膜の製造における多層ラミネートが不要となり、製造工程の削減による大幅なコストダウンの実現が期待される。
また、本発明の異方性導電膜における、対応可能バンプスペースは、６μｍであり、対応可能バンプ面積は、６００μｍ２であった。これに対し、従来の異方性導電膜における、対応可能バンプスペースは、１８μｍであり、対応可能バンプ面積は、１，８００μｍ２であり、本発明の異方性導電膜は、バンプの狭ピッチ化の動向に充分対応可能であることが判った。
As described above, the anisotropic conductive film of the present invention can be formed by simultaneously spraying the conductive particles and the resin particles using a spraying device. Is not required, and it is expected to realize a significant cost reduction by reducing the manufacturing process.
In the anisotropic conductive film of the present invention, the applicable bump space was 6 μm, and the applicable bump area was 600 μm 2 . On the other hand, in the conventional anisotropic conductive film, the applicable bump space is 18 μm, the applicable bump area is 1,800 μm 2 , and the anisotropic conductive film of the present invention has a narrow bump pitch. It has been found that it can sufficiently cope with the trend of computerization.
また、本発明の異方性導電膜を用いた接合体における導電性粒子の粒子捕捉率（バンプの単位面積あたりの粒子捕捉率）は、約９８％と高いのに比して、従来の接合体における粒子捕捉率は、約４０％と低く、本発明の異方性導電膜は、従来の異方性導電膜に比して、導電性粒子の配合量が、１／２〜１／５程度と少ないにもかかわらず、粒子捕捉率が高く、低コストで優れた導通信頼性が得られることが判った。なお、本発明の異方性導電膜を用いた接合体は、ダイシェア信頼性試験における強度が、従来の異方性導電膜を用いた接合体と同等であり、充分な強度を有している。 In addition, in the bonded body using the anisotropic conductive film of the present invention, the particle capture rate of conductive particles (particle capture rate per unit area of bump) is about 98%, which is higher than that of the conventional bonding. The particle trapping rate in the body is as low as about 40%, and the anisotropic conductive film of the present invention has a conductive particle content of 1/2 to 1/5 as compared with the conventional anisotropic conductive film. In spite of the low degree, it was found that the particle capture rate is high, and excellent conduction reliability can be obtained at low cost. In addition, the joined body using the anisotropic conductive film of the present invention has sufficient strength in the die shear reliability test, which is equivalent to the joined body using the conventional anisotropic conductive film. .
本発明の異方性導電膜は、各種電子部品等と基板、基板同士などの接合に好適に使用することができ、例えば、ＩＣタグ、ＩＣカード、メモリーカード、フラットパネルディスプレイなどの製造に好適に使用することができる。
本発明の接合体は、導電性粒子の粒子捕捉率が高く、優れた導通信頼性を有する。
The anisotropic conductive film of the present invention can be suitably used for joining various electronic components and the like, substrates, substrates, etc., for example, suitable for manufacturing IC tags, IC cards, memory cards, flat panel displays, etc. Can be used for
The joined body of the present invention has a high particle capture rate of conductive particles and has excellent conduction reliability.
１０ 一の噴霧手段
１２ 導電性粒子
２０ 他の噴霧手段
２２ 樹脂粒子
２４ 樹脂膜
３０ 静電電位付与手段
４０ 被処理面
DESCRIPTION OF SYMBOLS 10 One spraying means 12 Conductive particle 20 Other spraying means 22 Resin particle 24 Resin film 30 Electrostatic potential provision means 40 To-be-processed surface
Claims (4)
前記樹脂粒子で形成された樹脂膜中であって、該樹脂膜の厚み方向における一方の面側に、前記導電性粒子が単層配列してなり、
前記樹脂膜の厚み方向における一方の面と、前記導電性粒子の中心との距離の１０点平均が、９μｍ以下であることを特徴とする異方性導電膜。 The conductive particles sprayed using one spraying means and applied with electrostatic potential by the electrostatic potential applying means and the resin particles ejected using other spraying means are sprayed simultaneously on the surface to be treated. Is obtained by
In the resin film formed of the resin particles, the conductive particles are arranged in a single layer on one surface side in the thickness direction of the resin film,
An anisotropic conductive film, wherein a 10-point average distance between one surface in the thickness direction of the resin film and the center of the conductive particles is 9 μm or less.
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