JP5202428B2 - 蒸着装置用マスク密着手段及びそれを用いた蒸着装置 - Google Patents
蒸着装置用マスク密着手段及びそれを用いた蒸着装置 Download PDFInfo
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- JP5202428B2 JP5202428B2 JP2009112811A JP2009112811A JP5202428B2 JP 5202428 B2 JP5202428 B2 JP 5202428B2 JP 2009112811 A JP2009112811 A JP 2009112811A JP 2009112811 A JP2009112811 A JP 2009112811A JP 5202428 B2 JP5202428 B2 JP 5202428B2
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- 238000007740 vapor deposition Methods 0.000 title claims description 31
- 230000008021 deposition Effects 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 229910001111 Fine metal Inorganic materials 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 20
- 239000000758 substrate Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 7
- 239000000696 magnetic material Substances 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
200 マスク組立体 210 パターンマスク
220 マスクフレーム 300 マスク密着手段
310 キャッププレート 320 マグネチック組立体
330 磁力制御手段
Claims (16)
- マグネチック組立体と、
前記マグネチック組立体の一側に位置するキャッププレートと、
前記マグネチック組立体の周縁と前記キャッププレートとの間に位置する磁力制御手段と、
を含み、
前記磁力制御手段は、前記キャッププレートと対向するマグネチック組立体の周縁に位置し、前記マグネチック組立体の周縁と中心部との磁力偏差を最小化することを特徴とする蒸着装置用マスク密着手段。 - 前記磁力制御手段は、磁力遮蔽材またはフェライト磁性物質を含むことを特徴とする請求項1に記載の蒸着装置用マスク密着手段。
- 前記磁力制御手段は、鋼鉄からなる薄膜シートであることを特徴とする請求項2に記載の蒸着装置用マスク密着手段。
- 前記キャッププレートは、内部に冷却通路が形成されることを特徴とする請求項1に記載の蒸着装置用マスク密着手段。
- 前記マグネチック組立体は、マグネチックプレート及び前記マグネチックプレートのキャッププレート側に位置する磁性体を含むことを特徴とする請求項1に記載の蒸着装置用マスク密着手段。
- 前記磁性体は、金属系であることを特徴とする請求項5に記載の蒸着装置用マスク密着手段。
- チャンバと、
前記チャンバ内部に位置する蒸着源と、
前記蒸着源上に位置するマスク組立体と、
前記マスク組立体上に位置するマスク密着手段と、を含み、
前記マスク密着手段は、キャッププレート、前記キャッププレート上に位置するマグネチック組立体、及び前記マグネチック組立体の周縁と前記キャッププレートとの間に位置する磁力制御手段を含み、
前記磁力制御手段は、前記キャッププレートと対向するマグネチック組立体の周縁に位置し、前記マグネチック組立体の周縁と中心部との磁力偏差を最小化することを特徴とする蒸着装置。 - 前記磁力制御手段は、磁力遮蔽材またはフェライト磁性物質を含むことを特徴とする請求項7に記載の蒸着装置。
- 前記磁力制御手段は、鋼鉄からなる薄膜シートであることを特徴とする請求項8に記載の蒸着装置。
- 前記キャッププレートは、内部に冷却通路が形成されることを特徴とする請求項7に記載の蒸着装置。
- 前記マグネチック組立体は、マグネチックプレート及び前記マグネチックプレートのキャッププレート側に位置する磁性体を含むことを特徴とする請求項7に記載の蒸着装置。
- 前記磁性体は、金属系であることを特徴とする請求項11に記載の蒸着装置。
- 前記マスク組立体は、開口部を有するマスクフレーム及び引っ張られて前記マスクフレームに固定される1つまたは複数のパターンマスクを含むことを特徴とする請求項7に記載の蒸着装置。
- 前記パターンマスクは、微細金属マスクであることを特徴とする請求項13に記載の蒸着装置。
- 前記マスク組立体を前記チャンバに結合させるためのマスクホルダをさらに含むことを特徴とする請求項7に記載の蒸着装置。
- 前記マスクホルダは、内部に冷却通路が形成されることを特徴とする請求項15に記載の蒸着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0013958 | 2009-02-19 | ||
KR1020090013958A KR101049804B1 (ko) | 2009-02-19 | 2009-02-19 | 증착 장치용 마스크 밀착 수단 및 이를 이용한 증착 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010189756A JP2010189756A (ja) | 2010-09-02 |
JP5202428B2 true JP5202428B2 (ja) | 2013-06-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009112811A Expired - Fee Related JP5202428B2 (ja) | 2009-02-19 | 2009-05-07 | 蒸着装置用マスク密着手段及びそれを用いた蒸着装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100206222A1 (ja) |
JP (1) | JP5202428B2 (ja) |
KR (1) | KR101049804B1 (ja) |
CN (1) | CN101812662A (ja) |
TW (1) | TW201031768A (ja) |
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KR101833234B1 (ko) | 2011-06-21 | 2018-03-02 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 프레임 어셈블리 |
JP2013095929A (ja) * | 2011-10-28 | 2013-05-20 | Hitachi High-Technologies Corp | 有機el成膜装置とそのメタルマスク冷却機構 |
JP5827344B2 (ja) * | 2011-12-15 | 2015-12-02 | キヤノンアネルバ株式会社 | 処理装置およびシールド |
US9496524B2 (en) | 2012-07-10 | 2016-11-15 | Samsung Display Co., Ltd. | Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method |
TWI624557B (zh) | 2013-04-12 | 2018-05-21 | 大日本印刷股份有限公司 | 蒸鍍遮罩、蒸鍍遮罩準備體、蒸鍍遮罩之製造方法、及有機半導體元件之製造方法 |
KR102036907B1 (ko) | 2013-04-17 | 2019-10-28 | 삼성디스플레이 주식회사 | 패턴 마스크 제작을 위한 금속 시트의 고정 장치 |
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KR20150034003A (ko) * | 2013-09-25 | 2015-04-02 | 삼성디스플레이 주식회사 | 마스크 고정장치 및 이를 포함하는 증착 설비 |
KR102218644B1 (ko) * | 2013-12-19 | 2021-02-23 | 삼성디스플레이 주식회사 | 증착 장치 |
KR102162797B1 (ko) * | 2013-12-23 | 2020-10-08 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 |
KR200489874Y1 (ko) * | 2014-05-15 | 2019-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 에지 마스킹 시스템 |
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-
2009
- 2009-02-19 KR KR1020090013958A patent/KR101049804B1/ko active IP Right Grant
- 2009-05-07 JP JP2009112811A patent/JP5202428B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-28 US US12/656,406 patent/US20100206222A1/en not_active Abandoned
- 2010-02-03 TW TW099103129A patent/TW201031768A/zh unknown
- 2010-02-10 CN CN201010114815A patent/CN101812662A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20100206222A1 (en) | 2010-08-19 |
KR20100094802A (ko) | 2010-08-27 |
TW201031768A (en) | 2010-09-01 |
JP2010189756A (ja) | 2010-09-02 |
KR101049804B1 (ko) | 2011-07-15 |
CN101812662A (zh) | 2010-08-25 |
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