JP5123618B2 - 容器清浄度計測装置、基板処理システム及び容器清浄度計測方法 - Google Patents
容器清浄度計測装置、基板処理システム及び容器清浄度計測方法 Download PDFInfo
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- JP5123618B2 JP5123618B2 JP2007232644A JP2007232644A JP5123618B2 JP 5123618 B2 JP5123618 B2 JP 5123618B2 JP 2007232644 A JP2007232644 A JP 2007232644A JP 2007232644 A JP2007232644 A JP 2007232644A JP 5123618 B2 JP5123618 B2 JP 5123618B2
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- 239000000758 substrate Substances 0.000 title claims description 78
- 230000003749 cleanliness Effects 0.000 title claims description 77
- 238000000034 method Methods 0.000 title claims description 53
- 238000012545 processing Methods 0.000 title claims description 40
- 239000002245 particle Substances 0.000 claims description 303
- 230000001737 promoting effect Effects 0.000 claims description 74
- 238000005259 measurement Methods 0.000 claims description 71
- 238000000926 separation method Methods 0.000 claims description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
- 238000004140 cleaning Methods 0.000 claims description 20
- 239000012071 phase Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 14
- 238000004299 exfoliation Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000007791 liquid phase Substances 0.000 claims description 7
- 239000007790 solid phase Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- 238000012790 confirmation Methods 0.000 claims description 2
- 230000032798 delamination Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 37
- 239000000523 sample Substances 0.000 description 32
- 238000007689 inspection Methods 0.000 description 24
- 238000012546 transfer Methods 0.000 description 9
- 230000001747 exhibiting effect Effects 0.000 description 8
- 238000005411 Van der Waals force Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N1/2202—Devices for withdrawing samples in the gaseous state involving separation of sample components during sampling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N1/2202—Devices for withdrawing samples in the gaseous state involving separation of sample components during sampling
- G01N1/2208—Devices for withdrawing samples in the gaseous state involving separation of sample components during sampling with impactors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
- G01N15/0606—Investigating concentration of particle suspensions by collecting particles on a support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
- G01N15/065—Investigating concentration of particle suspensions using condensation nuclei counters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N1/2202—Devices for withdrawing samples in the gaseous state involving separation of sample components during sampling
- G01N1/2214—Devices for withdrawing samples in the gaseous state involving separation of sample components during sampling by sorption
- G01N2001/2217—Devices for withdrawing samples in the gaseous state involving separation of sample components during sampling by sorption using a liquid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
- G01N15/0255—Investigating particle size or size distribution with mechanical, e.g. inertial, classification, and investigation of sorted collections
- G01N2015/0261—Investigating particle size or size distribution with mechanical, e.g. inertial, classification, and investigation of sorted collections using impactors
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- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Molecular Biology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
"FOUP洗浄装置"、[online]、2007年、株式会社テクノビジョン、[平成19年8月6日検索]、インターネット<URL:http://www.techvision.co.jp/products/foup.htm>
W ウエハ
10 フープ検査装置
13,40 開口部
14 フープオープナー
15,39 プローブノズル
18,18’ パーティクル剥離促進ノズル
19,19’ パーティクル採集ノズル
23,27 パーティクルカウンタ
28 パイプ
28a 屈曲部
29 感圧センサ
31 基板処理システム
34 プロセスモジュール
35 ローダーモジュール
90 フープ
94 担持部
Claims (17)
- パーティクルの剥離を促進する剥離促進部と、
剥離した前記パーティクルを採集する採集部と、
前記採集されたパーティクルの量を計測する計測部とを備え、
前記剥離促進部及び前記採集部は、前記パーティクルを計測する際に、基板を収容する容器内に進入することを特徴とする容器清浄度計測装置。 - 前記剥離促進部及び前記採集部はそれぞれ開口部を有する細長ノズル形状を呈することを特徴とする請求項1記載の容器清浄度計測装置。
- 前記採集部の開口部は前記剥離促進部の開口部を含むことを特徴とする請求項2記載の容器清浄度計測装置。
- 前記剥離促進部は少なくとも水蒸気を噴出することを特徴とする請求項1乃至3のいずれか1項に記載の容器清浄度計測装置。
- 前記採集部は排気装置に接続され、前記採集部及び前記排気装置の間に水分捕集装置が配されることを特徴とする請求項4記載の容器清浄度計測装置。
- 前記剥離促進部は加熱ガスを噴出することを特徴とする請求項1乃至3のいずれか1項に記載の容器清浄度計測装置。
- 前記剥離促進部は気相及び液相、又は気相及び固相の2つの相状態を呈する物質を噴出することを特徴とする請求項1乃至3のいずれか1項に記載の容器清浄度計測装置。
- 前記剥離促進部は流速をパルス波的に変動させてガスを噴出することを特徴とする請求項1乃至3のいずれか1項に記載の容器清浄度計測装置。
- 前記剥離促進部及び前記採集部は所定範囲の領域を走査することを特徴とする請求項1乃至8のいずれか1項に記載の容器清浄度計測装置。
- 前記計測部は、前記採集されたパーティクルにレーザ光が照射されて発生する散乱光を観測することを特徴とする請求項1乃至9のいずれか1項に記載の容器清浄度計測装置。
- 前記計測部は、前記採集されたパーティクルが内部を流れ且つ屈曲部を有する流路と、該流路における屈曲部に配された感圧部とを有することを特徴とする請求項1乃至9のいずれか1項に記載の容器清浄度計測装置。
- 基板を収容する容器が接続されて前記基板を受け入れる基板受入装置と、前記受け入れた基板に処理を施す基板処理装置とを備える基板処理システムにおいて、
前記基板受入装置は、パーティクルの剥離を促進する剥離促進部と、剥離した前記パーティクルを採集する採集部とを有し、
前記剥離促進部及び前記採集部は、前記パーティクルを計測する際に、前記接続された容器内に進入し、
基板処理システムは、前記採集されたパーティクルの量を計測する計測部をさらに備えることを特徴とする基板処理システム。 - 前記基板処理装置は、エッチング装置、CVD装置、熱処理装置、拡散処理装置及び基板洗浄装置のいずれかであることを特徴とする請求項12記載の基板処理システム。
- 基板を収容する容器内の清浄度を計測する容器清浄度計測方法であって、
前記パーティクルを計測する際に、パーティクルの剥離を促進する剥離促進部を前記容器内に進入させて、パーティクルの剥離を促進する剥離促進ステップと、
パーティクルを採集する採集部を前記容器内に進入させて、前記剥離促進ステップで剥離したパーティクルを採集する採集ステップと、
前記採集ステップで採集されたパーティクルの量を計測する計測ステップとを有することを特徴とする容器清浄度計測方法。 - 前記剥離促進ステップ及び前記採集ステップを繰り返すことを特徴とする請求項14記載の容器清浄度計測方法。
- 前記計測されたパーティクルの量が所定の基準値以上であるときに、前記剥離促進ステップ及び前記採集ステップを少なくとも1回再実行することを特徴とする請求項14又は15記載の容器清浄度計測方法。
- 前記剥離促進ステップに先立って、前記容器が前記基板を収容するか否かを確認する収容確認ステップをさらに有し、前記容器が前記基板を収容していないときに前記剥離促進ステップを実行することを特徴とする請求項14乃至16のいずれか1項に記載の容器清浄度計測方法。
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JP2007232644A JP5123618B2 (ja) | 2007-09-07 | 2007-09-07 | 容器清浄度計測装置、基板処理システム及び容器清浄度計測方法 |
US12/199,960 US8012303B2 (en) | 2007-09-07 | 2008-08-28 | Container cleanliness measurement apparatus and method, and substrate processing system |
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JP2007232644A JP5123618B2 (ja) | 2007-09-07 | 2007-09-07 | 容器清浄度計測装置、基板処理システム及び容器清浄度計測方法 |
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JP2009065029A JP2009065029A (ja) | 2009-03-26 |
JP5123618B2 true JP5123618B2 (ja) | 2013-01-23 |
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JP2007232644A Expired - Fee Related JP5123618B2 (ja) | 2007-09-07 | 2007-09-07 | 容器清浄度計測装置、基板処理システム及び容器清浄度計測方法 |
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US (1) | US8012303B2 (ja) |
JP (1) | JP5123618B2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2930675B1 (fr) * | 2008-04-24 | 2010-08-20 | Alcatel Lucent | Station de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs et procede de mesure correspondant |
US20130218518A1 (en) * | 2012-02-21 | 2013-08-22 | International Business Machines Corporation | Automated, three dimensional mappable environmental sampling system and methods of use |
FR2999016A1 (fr) * | 2012-11-30 | 2014-06-06 | Adixen Vacuum Products | Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs |
US9579697B2 (en) | 2012-12-06 | 2017-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method of cleaning FOUP |
CN104122119A (zh) * | 2014-07-24 | 2014-10-29 | 北京正拓气体科技有限公司 | 一种气体取样装置 |
FR3026185B1 (fr) * | 2014-09-18 | 2017-09-29 | Commissariat Energie Atomique | Systeme et procede de detection de particules |
JP2016066689A (ja) * | 2014-09-24 | 2016-04-28 | 東京エレクトロン株式会社 | 容器清掃装置及び容器清掃方法 |
CN107408520B (zh) * | 2015-03-03 | 2022-02-25 | 卢茨·瑞布斯道克 | 检查*** |
JP6607314B2 (ja) * | 2016-06-08 | 2019-11-20 | 村田機械株式会社 | 容器保管装置及び容器保管方法 |
US10115607B2 (en) * | 2016-09-16 | 2018-10-30 | Applied Materials, Inc. | Method and apparatus for wafer outgassing control |
CN108051347A (zh) * | 2017-11-28 | 2018-05-18 | 上海超硅半导体有限公司 | 一种用于检测储存硅片氮气柜内部环境颗粒的方法 |
JP7234527B2 (ja) * | 2018-07-30 | 2023-03-08 | Tdk株式会社 | センサー内蔵フィルタ構造体及びウエハ収容容器 |
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US2012640A (en) * | 1931-11-25 | 1935-08-27 | Shipman Bennet Carroll | Suction cleaner |
DE3431164A1 (de) * | 1984-02-08 | 1985-08-14 | Gerhard 7262 Althengstett Kurz | Staubsauger |
US4872920A (en) * | 1987-11-25 | 1989-10-10 | Flynn Tom S | Asbestos removal method and system |
JPH02170532A (ja) * | 1988-12-23 | 1990-07-02 | Matsushita Electric Ind Co Ltd | 基板乾燥装置および基板乾燥方法 |
US5238503A (en) * | 1991-04-09 | 1993-08-24 | International Business Machines Corporation | Device for decontaminating a semiconductor wafer container |
JP4095722B2 (ja) * | 1998-03-27 | 2008-06-04 | 株式会社藤森技術研究所 | 半導体ウエハのポッド洗浄装置 |
TW533503B (en) * | 2000-09-14 | 2003-05-21 | Nec Electronics Corp | Processing apparatus having particle counter and cleaning device, cleaning method, cleanliness diagnosis method and semiconductor fabricating apparatus using the same |
JP2006187680A (ja) * | 2004-12-28 | 2006-07-20 | Bridgestone Corp | 炭化ケイ素焼結体の洗浄方法 |
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2007
- 2007-09-07 JP JP2007232644A patent/JP5123618B2/ja not_active Expired - Fee Related
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US20090064760A1 (en) | 2009-03-12 |
JP2009065029A (ja) | 2009-03-26 |
US8012303B2 (en) | 2011-09-06 |
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