JP5117027B2 - Insulated wire - Google Patents

Insulated wire Download PDF

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JP5117027B2
JP5117027B2 JP2006275832A JP2006275832A JP5117027B2 JP 5117027 B2 JP5117027 B2 JP 5117027B2 JP 2006275832 A JP2006275832 A JP 2006275832A JP 2006275832 A JP2006275832 A JP 2006275832A JP 5117027 B2 JP5117027 B2 JP 5117027B2
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film
conductor
resin
layer
insulated wire
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JP2008097888A (en
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正和 目崎
哲郎 川喜田
壮平 山田
泰州 持溝
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THE FURUKAW ELECTRIC CO., LTD.
Asmo Co Ltd
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THE FURUKAW ELECTRIC CO., LTD.
Asmo Co Ltd
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本発明は、モータあるいはトランス等のコイルに好適に使用される絶縁電線に関し、詳しくは導体との密着性に優れた絶縁塗料及びその塗料を塗布焼付して形成した絶縁皮膜を有し且つ導体に接しない絶縁皮膜の層内の密着力を低くする絶縁電線に関する。   The present invention relates to an insulated wire suitably used for a coil of a motor or a transformer, and more specifically, has an insulating paint excellent in adhesion to a conductor and an insulating film formed by applying and baking the paint, and the conductor The present invention relates to an insulated wire that lowers the adhesion within an insulating film layer that does not contact.

近年、自動車、電機、電子等多くの分野における機器の小型化・軽量化の傾向に伴い、それら機器に用いられるコイルもより小型、軽量で、しかも高い電気特性、機械特性、長期耐熱性等の性能を保ちつつ低コストで製造することが要求されるようになってきた。そのため、コイルを形成する巻線を、より小さいコアに高密度でしかも高速で捲き付ける必要があり、巻線の絶縁皮膜に損傷が生じ、機器の電気特性が悪化したり、生産の歩留まりが低下したりするという問題が発生している。   In recent years, along with the trend toward smaller and lighter devices in many fields such as automobiles, electrical machinery, and electronics, coils used in these devices are also smaller and lighter, yet have high electrical properties, mechanical properties, long-term heat resistance, etc. There has been a demand for manufacturing at low cost while maintaining performance. Therefore, it is necessary to squeeze the windings that form the coil onto a smaller core at high density and at high speed, resulting in damage to the insulation film of the windings, deteriorating the electrical characteristics of the device, and reducing the production yield. The problem of doing is occurring.

通常の小型モータやトランスのコイルコアは、薄板のケイ素鋼板をプレス打ち抜きして、積層することによりコイルコアを作製することが一般的である。モータなどのコイルは、ケイ素鋼板などの鉄板を積層したコアにエナメル線を巻き付けて(コイル加工)行うが、そのコイル加工工程において、エナメル線にかかるテンションや巻き付け時の摩擦などで、皮膜が破壊され、コアと電線の導体間で短絡が起き、コイルとしての性能を果たさない。このことは、ケイ素鋼板のプレス加工の際のバリが発生し、直接コアに電線を巻き付けると電線皮膜がそのバリにより損傷を受け絶縁不良(コイル−コア間の絶縁不良)の問題である。このため、コイルコアには必ず、絶縁加工(絶縁塗装やインシュレータフィルムの挿入)がなされている。   In general, the coil core of a small motor or transformer is generally manufactured by press punching and laminating a thin silicon steel plate. Coils for motors and the like are made by winding enameled wire around a core made of laminated steel plates such as silicon steel sheets (coil processing). In the coil processing process, the film breaks down due to tension applied to the enameled wire and friction during winding. As a result, a short circuit occurs between the core and the conductor of the electric wire, and the performance as a coil is not achieved. This is a problem of burrs when the silicon steel plate is pressed, and when an electric wire is wound directly around the core, the electric wire coating is damaged by the burrs, resulting in an insulation failure (insulation failure between the coil and the core). For this reason, the coil core is always subjected to insulation processing (insulation coating or insertion of an insulator film).

これに対応するために、絶縁電線の絶縁皮膜の機械的強度を向上させたり、表面の滑り性を良くしたりといった対策が行われている。
例えば、特許文献1には、ポリアミドイミド、ポリイミド、芳香族ポリアミドの耐熱性絶縁皮膜について、引張強さ、引張弾性率、密着力、ピアノ線に対する静摩擦係数を設定することにより、皮膜の耐加工性を向上させる技術が記載されている。
また特許文献2には、導体上に、トリアルキルアミン及び/又は5〜20質量部のアルキル化メラミン樹脂を含んでなるポリアミドイミド系樹脂塗料を塗布焼付けして形成した下層、ポリイミド系樹脂塗料を塗布焼付けして形成した中間層及び自己潤滑型ポリアミドイミド系樹脂塗料を塗布焼付けして形成した上層の少なくとも3層からなる絶縁皮膜を有する絶縁電線の記述があり、絶縁皮膜が薄肉であっても、厳しい条件下でのコイル加工時の皮膜損傷が防止できる絶縁電線を提供することが記載されている。
しかしながら、これらの方法をとったとしても現在の高い占積率を確保するための厳しい巻線方法に対しては、根本的に対応することはできなかった。
さらに近年の要求として、コイル巻きする芯材(コア)の絶縁を省略するといった動きがあり、このためにも絶縁電線の皮膜の絶縁破壊電圧などの電気特性の完全な確保のためには、絶縁皮膜がコイル巻線時に破壊しない必要がますます高くなっている。
特開平6−196025号公報 特開平10−247422号公報 特開平6−194304号公報 特開2005−203334号公報
In order to cope with this, measures are taken such as improving the mechanical strength of the insulating film of the insulated wire and improving the slipperiness of the surface.
For example, in Patent Document 1, the heat resistance insulation film of polyamideimide, polyimide, and aromatic polyamide is set to have a tensile strength, a tensile elastic modulus, an adhesion force, and a static friction coefficient with respect to a piano wire. Techniques for improving the performance are described.
Patent Document 2 discloses a lower layer polyimide resin paint formed by applying and baking a polyamideimide resin paint containing a trialkylamine and / or 5 to 20 parts by mass of an alkylated melamine resin on a conductor. There is a description of an insulated wire having an insulating film consisting of at least three layers of an intermediate layer formed by coating and baking and an upper layer formed by coating and baking a self-lubricating polyamideimide resin paint. Even if the insulating film is thin It is described that an insulated wire that can prevent film damage during coil processing under severe conditions is provided.
However, even if these methods are adopted, the current strict winding method for securing a high space factor cannot be fundamentally dealt with.
Furthermore, as a recent requirement, there is a movement to omit insulation of a core material (core) to be wound with a coil. For this reason, in order to ensure complete electrical characteristics such as a dielectric breakdown voltage of a film of an insulated wire, insulation is required. The coating is getting higher and higher need not to be destroyed during coil winding.
JP-A-6-196025 Japanese Patent Laid-Open No. 10-247422 JP-A-6-194304 JP 2005-203334 A

本発明は、コイル巻加工時に電線皮膜の一部を能動的に破壊させることによって、下層皮膜を保護することのできる絶縁電線を提供することを目的とする。   An object of this invention is to provide the insulated wire which can protect a lower layer membrane | film | coat by actively destroying a part of electric wire membrane | film | coat at the time of coil winding.

上記目的を達成するために、本発明者らは絶縁電線のコイル巻加工時の傷の付き方を観察し、その破壊のメカニズムの解明をおこなった。その結果、従来の絶縁電線の皮膜の弾性率や導体との密着性、あるいは電線表面の潤滑性等の改善のみでは、現行の厳しいコイル巻加工に対して不十分であることを確認し、その結果として本発明をおこなうこととなったものである。
それは、導体と絶縁皮膜を従来通り密着させることと、電線にかかる負荷を絶縁皮膜内で分散させる構造とすることを同時に実現する必要があることを見出した。
そのためには、絶縁皮膜を特定の多層構造とすることにより上記の点を実現できることを見出し、この知見に基づき本発明を完成するに至った。
In order to achieve the above-mentioned object, the present inventors have observed the way of scratching during coil winding of an insulated wire, and have clarified the mechanism of the destruction. As a result, it was confirmed that the improvement in the elastic modulus of the conventional insulated wire coating, the adhesion to the conductor, or the lubricity of the wire surface was not sufficient for the current severe coil winding process. As a result, the present invention has been carried out.
It has been found that it is necessary to simultaneously realize the structure in which the conductor and the insulating film are brought into close contact with each other and the load applied to the electric wire is dispersed in the insulating film.
For that purpose, it discovered that said point was realizable by making an insulating film into a specific multilayer structure, and came to complete this invention based on this knowledge.

すなわち本発明は、
(1)導体および該導体に被覆された多層絶縁皮膜を有する絶縁電線であって、該多層絶縁皮膜の導体に接する最下層皮膜と導体との密着力が、該多層絶縁皮膜を形成する各層皮膜間の密着力より高く、該多層絶縁皮膜、皮膜厚比率が最下層:上層=40:60〜80:20の2層構成、または、中間層の皮膜が全層の皮膜に対して、6〜25%の厚さを持つ3層構成とし、
前記多層絶縁皮膜の導体に接する最下層皮膜と導体との密着力を30g/mm以上とし、且つ、前記多層絶縁皮膜を形成する各層皮膜間の密着力を10g/mm以下とした
ことを特徴とする絶縁電線、
(2)前記導体に接する最下層皮膜がポリアミドイミド系樹脂、ポリエステル系樹脂、H種ポリエステル系樹脂、およびポリエステルイミド系樹脂からなる群から選ばれた1種の樹脂からなる皮膜であることを特徴とする()記載の絶縁電線、
)前記導体に接する最下層皮膜の上に形成する皮膜が該最下層に接する皮膜から、ポリイミド系樹脂皮膜、ポリアミドイミド系樹脂皮膜の順に皮膜を形成したことを特徴とする()記載の絶縁電線、
)前記導体に接する最下層皮膜の上に形成する皮膜が該最下層に接する皮膜から、剥離剤添加ポリアミドイミド系樹脂皮膜、ポリアミドイミド系樹脂皮膜の順に皮膜を形成したことを特徴とする()記載の絶縁電線、
)前記導体に接する最下層皮膜の上に形成する皮膜が、ポリイミド系樹脂皮膜あるいはエポキシ系樹脂皮膜であることを特徴とする()記載の絶縁電線、および
)(1)〜()のいずれか1項に記載の絶縁電線が、積層コアのスロットに巻回された電機子を備えたことを特徴とする回転電機
を提供するものである。
That is, the present invention
(1) An insulated wire having a conductor and a multi-layer insulation film coated on the conductor, each layer film having an adhesion force between the lowermost layer film in contact with the conductor of the multi-layer insulation film and the conductor forms the multi-layer insulation film The multi-layer insulating film is higher than the adhesive strength between the two layers, and the film thickness ratio is the lowest layer: upper layer = 40: 60 to 80:20. A three-layer structure with a thickness of ~ 25% ,
The adhesion between the lowermost layer film in contact with the conductor of the multilayer insulation film and the conductor is 30 g / mm or more, and the adhesion between each layer film forming the multilayer insulation film is 10 g / mm or less. Insulated wires, characterized by
(2) The lowermost layer film in contact with the conductor is a film made of one resin selected from the group consisting of a polyamideimide resin, a polyester resin, an H-type polyester resin, and a polyesterimide resin. ( 1 ) Insulated wire according to
( 3 ) The film formed on the lowermost layer film in contact with the conductor is formed in the order of the polyimide resin film and the polyamideimide resin film from the film in contact with the lowermost layer ( 2 ). Insulated wire,
( 4 ) The film formed on the lowermost layer film in contact with the conductor is formed in the order of the release agent-added polyamideimide resin film and the polyamideimide resin film from the film in contact with the lowermost layer. ( 2 ) the insulated wire according to the description,
( 5 ) The insulated wire according to ( 2 ), wherein the film formed on the lowermost film in contact with the conductor is a polyimide resin film or an epoxy resin film, and ( 6 ) (1) to ( 6 ) ( 5 ) The insulated electric wire according to any one of ( 5 ) is provided with an armature wound around a slot of a laminated core.

本発明の絶縁電線は高いコイル巻時の耐加工性を有し、過酷なコイル加工の条件下で高い負荷がかかっても傷が導体まで達しにくく、絶縁不良を起こしにくい。このため信頼性の高いコイルが提供でき、コイルを用いる機器の低コスト化、信頼性向上に寄与するという優れた効果を奏する。また、本発明の回転電機は、用いる絶縁電線の絶縁被膜を薄くできるので、巻線量を増大でき、信頼性及び性能を向上させることができる。   The insulated wire of the present invention has a high workability at the time of coil winding, and even if a high load is applied under severe coil machining conditions, the scratch is unlikely to reach the conductor and hardly cause poor insulation. For this reason, a highly reliable coil can be provided, and the outstanding effect that it contributes to the cost reduction and the reliability improvement of the apparatus using a coil is produced. Moreover, since the rotary electric machine of this invention can make thin the insulation film of the insulated wire to be used, it can increase the amount of windings and can improve reliability and performance.

本発明の絶縁電線は、導体および該導体に被覆された多層絶縁皮膜を有する絶縁電線であって、該多層絶縁皮膜の導体に接する最下層皮膜と導体との密着力が、該多層絶縁皮膜内の各層皮膜間の密着力より高いものである。前記多層絶縁皮膜の導体に接する最下層皮膜と導体との密着力は30g/mm以上であり、40g/mm以上であることがさらに好ましい。また、前記多層絶縁皮膜を形成する各層の皮膜間の密着力が10g/mm以下であり、7.0g/mm以下がさらに好ましい
The insulated wire of the present invention is an insulated wire having a conductor and a multilayer insulation film coated on the conductor, and the adhesion between the lowermost layer film in contact with the conductor of the multilayer insulation film and the conductor is within the multilayer insulation film. It is higher than the adhesion between each layer film. The adhesion between the lowermost layer film in contact with the conductor of the multilayer insulating film and the conductor is 30 g / mm or more, and more preferably 40 g / mm or more. Moreover, the adhesive force between the films of the respective layers forming the multilayer insulating film is 10 g / mm or less, and more preferably 7.0 g / mm or less .

本発明においては、該多層絶縁皮膜は2層または3層構造である。2層構造である場合、各層は、導体側から順に、最下層、上層で構成される。また、3層構造の場合は、導体側から順に、最下層、中層、上層で構成される。なお、最下層のことを、以下単に「下層」という場合がある。   In the present invention, the multilayer insulating film has a two-layer or three-layer structure. In the case of a two-layer structure, each layer is composed of a lowermost layer and an upper layer in order from the conductor side. In the case of a three-layer structure, the lowermost layer, the middle layer, and the upper layer are formed in this order from the conductor side. The lowermost layer may be simply referred to as “lower layer” hereinafter.

本発明を実現するために、いくつかの構成要件について材料の好ましい組み合わせがについて説明する。
まず、導体に接する最下層を形成する絶縁皮膜は、導体との密着強度が高い樹脂皮膜を選定する必要がある。最下層皮膜は、ポリアミドイミド系樹脂、ポリエステル系樹脂、H種ポリエステル系樹脂、およびポリエステルイミド系樹脂からなる群から選ばれた1種の樹脂からなる皮膜であることが好ましい。
In order to realize the present invention, a preferred combination of materials will be described with respect to several components.
First, it is necessary to select a resin film having high adhesion strength with the conductor as the insulating film forming the lowermost layer in contact with the conductor. The lowermost layer film is preferably a film made of one kind of resin selected from the group consisting of a polyamideimide resin, a polyester resin, an H-type polyester resin, and a polyesterimide resin.

例えば、最下層がポリアミドイミド系樹脂の場合、ポリアミドイミド樹脂100質量部に対し、0.05〜1.0質量部のトリアルキルアミン及び/又は5〜20質量部のアルキル化メラミン樹脂を含んでなるポリアミドイミド系樹脂塗料を導体上に塗布焼付けして形成することが好ましい。   For example, when the lowermost layer is a polyamideimide resin, 0.05 to 1.0 parts by mass of a trialkylamine and / or 5 to 20 parts by mass of an alkylated melamine resin is included with respect to 100 parts by mass of the polyamideimide resin. It is preferable that the polyamide imide resin coating is formed on the conductor by baking.

ここで使用されるトリアルキルアミンは、好ましくはトリメチルアミン、トリエチルアミン、トリプロピルアミン、トリブチルアミン等の低級アルキルのトリアルキルアミンが使用できる。この中でも可とう性および密着性の点でトリメチルアミン、トリエチルアミンが最も好ましい。ポリアミドイミド樹脂に対する配合割合はポリアミドイミド樹脂100質量部に対し、通常0.05〜1.0質量部、好ましくは0.1〜1質量部である。トリアルキルアミンが1.0質量部を越えて配合すると、皮膜の耐熱性が低下し、0.05質量部より少ないと、密着性に寄与しない。   The trialkylamine used here is preferably a lower alkyl trialkylamine such as trimethylamine, triethylamine, tripropylamine or tributylamine. Among these, trimethylamine and triethylamine are most preferable in terms of flexibility and adhesion. The compounding ratio with respect to the polyamide-imide resin is usually 0.05 to 1.0 part by mass, preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the polyamide-imide resin. When the trialkylamine exceeds 1.0 part by mass, the heat resistance of the film is lowered, and when it is less than 0.05 part by mass, it does not contribute to adhesion.

またアルキル化メラミン樹脂としては、例えばブチル化メラミン樹脂、メチル化メラミン樹脂等の低級アルキル基で置換されたメラミン樹脂を用いることができ、樹脂の相溶性の点でメチル化メラミン樹脂が好ましい。市販品として、米国CYTEC社製CYMEL1301(n−ブチル化メラミン樹脂溶液)などがある。配合割合はポリアミドイミド樹脂100質量部に対し、通常固形分比で0.5〜2.0質量部、好ましくは1.0〜2.0質量部である。0.5質量部より少ないと密着性が十分得られず、2.0質量部を越えて配合すると皮膜の耐熱性が低下する。このようにして得たポリアミドイミド系樹脂塗料を導体に塗布、焼付けして、導体上に絶縁皮膜の下層を形成する。
トリアルキルアミン及び/又はアルキル化メラミン樹脂とともに用いられるポリアミドイミド樹脂としては、市販の通常のものが使用でき、日立化成工業(株)製HI−4064や大日精化工業(株)製AI−602等がある。
As the alkylated melamine resin, for example, a melamine resin substituted with a lower alkyl group such as a butylated melamine resin or a methylated melamine resin can be used, and a methylated melamine resin is preferable in terms of compatibility of the resins. Examples of commercially available products include CYMEL1301 (n-butylated melamine resin solution) manufactured by CYTEC, USA. The blending ratio is usually 0.5 to 2.0 parts by mass, preferably 1.0 to 2.0 parts by mass with respect to 100 parts by mass of the polyamideimide resin. When the amount is less than 0.5 parts by mass, sufficient adhesion cannot be obtained, and when the amount exceeds 2.0 parts by mass, the heat resistance of the film is lowered. The polyamideimide-based resin paint thus obtained is applied to a conductor and baked to form a lower layer of an insulating film on the conductor.
As the polyamide-imide resin used together with the trialkylamine and / or alkylated melamine resin, commercially available ordinary resins can be used, such as HI-4064 manufactured by Hitachi Chemical Co., Ltd. or AI-602 manufactured by Dainichi Seika Kogyo Co., Ltd. Etc.

最下層が、ポリエステル系樹脂、H種ポリエステル系樹脂、ポリエステルイミド系樹脂の場合、例えば、市販のこれらの樹脂塗料が使用出来る。ポリエステル系樹脂塗料としてライトン3642(東特塗料(株)製)、ポリエステルイミド系樹脂塗料としてNH8642AY(東特塗料(株)製)やEH402(大日精化工業(株)製)などがある。また、H種ポリエステル系樹脂塗料としてはNH8239AY(東特塗料(株)製)などがある。   When the lowermost layer is a polyester resin, a H-type polyester resin, or a polyesterimide resin, for example, these commercially available resin paints can be used. Examples of the polyester resin paint include Ryton 3642 (manufactured by Tohoku Paint Co., Ltd.) and examples of the polyesterimide resin paint include NH8642AY (manufactured by Tohoku Paint Co., Ltd.) and EH402 (manufactured by Dainichi Seika Kogyo Co., Ltd.). Moreover, NH8239AY (manufactured by Tohoku Paint Co., Ltd.) is available as the H-type polyester resin paint.

本発明において絶縁皮膜の中間層あるいは最上層には、ポリイミド系樹脂を好ましく用いることができる。ここで用いられるポリイミド系樹脂は、例えば、芳香族テトラカルボン酸二無水物と芳香族ジアミン類を極性溶媒中で反応させて得られるポリアミド酸溶液を用い、これを焼付け時の加熱処理によってイミド化させることによって得ることができる。また、市販品の樹脂溶液としては、IST社製のPyreML(ポリアミック酸樹脂溶液)などを用いても良い。このようなポリアミド酸溶液を下層の皮膜上に塗布、焼付けしてポリイミド樹脂皮膜からなる中間層とする。本発明においてこの中間層は、絶縁電線に外傷になるほどの大きな荷重が加えられた時に絶縁皮膜の下層に応力が直接伝わらないよう作用する。   In the present invention, a polyimide resin can be preferably used for the intermediate layer or the uppermost layer of the insulating film. The polyimide resin used here is, for example, a polyamic acid solution obtained by reacting an aromatic tetracarboxylic dianhydride and an aromatic diamine in a polar solvent, and imidizing it by a heat treatment during baking. Can be obtained. Further, as a commercially available resin solution, PyrML (polyamic acid resin solution) manufactured by IST may be used. Such a polyamic acid solution is applied onto the lower film and baked to form an intermediate layer made of a polyimide resin film. In the present invention, the intermediate layer acts so that stress is not directly transmitted to the lower layer of the insulating film when a load large enough to cause damage to the insulated wire is applied.

また本発明において絶縁皮膜の中間層に好ましく用いることができるポリアミドイミド樹脂は、さらに好ましくは剥離剤入りポリアミドイミド樹脂である。剥離剤入りポリアミドイミド樹脂は、通常のポリアミドイミド樹脂溶液に剥離性能を持たせることによって得ることが出来る。この剥離性能は、ポリエチレン樹脂やシリコーン樹脂、あるいはフッ素系樹脂などの他の樹脂との接着性能が極端に悪化する様な剥離剤(樹脂)を樹脂溶液中に添加することによって得ることが出来る。分散、混合されるワックスとしては、通常用いられるものを特に制限なく使用することができ、例えば、ポリエチレンワックス、石油ワックス、パラフィンワックス等の合成ワックスおよびカルナバワックス、キャデリラワックス、ライスワックス等の天然ワックス等が挙げられる。潤滑剤についても特に制限はなく、例えば、シリコーン、シリコーンマクロモノマー、フッ素樹脂等を用いることができる。例えばポリエチレン樹脂として樹脂溶液中に分散がしやすいものとして、極性溶媒に微粒子状に分散したディスパージョン等を使用することが簡便である。またシリコーン樹脂等を使用する場合は、樹脂溶液中に液状のシリコーン樹脂をそのまま添加する方法が簡便である。市販のシリコーン樹脂としてチッソ(株)製マクロモノマー3325(ポリシロキサンマクロモノマー)等がある。   In the present invention, the polyamideimide resin that can be preferably used for the intermediate layer of the insulating film is more preferably a polyamideimide resin containing a release agent. A polyamideimide resin containing a release agent can be obtained by imparting release performance to an ordinary polyamideimide resin solution. This release performance can be obtained by adding a release agent (resin) in the resin solution that significantly deteriorates the adhesive performance with other resins such as polyethylene resin, silicone resin, or fluororesin. As the wax to be dispersed and mixed, those usually used can be used without particular limitation. For example, synthetic waxes such as polyethylene wax, petroleum wax, paraffin wax, and natural waxes such as carnauba wax, cadilla wax, and rice wax. A wax etc. are mentioned. There is no restriction | limiting in particular also about a lubricant, For example, silicone, a silicone macromonomer, a fluororesin etc. can be used. For example, as a polyethylene resin that is easily dispersed in a resin solution, it is convenient to use a dispersion or the like dispersed in a polar solvent in the form of fine particles. Moreover, when using silicone resin etc., the method of adding a liquid silicone resin as it is to a resin solution is simple. As a commercially available silicone resin, there is a macromonomer 3325 (polysiloxane macromonomer) manufactured by Chisso Corporation.

さらに最上層に好ましく用いられるエポキシ系樹脂としては、フェノキシ樹脂をベースとしたものが一般的である。このフェノキシ樹脂は単独であるいはその他の熱可塑性樹脂との混合系で使用することができ、例えばポリエーテルサルホン樹脂等を混合することが出来る。市販のフェノキシ系樹脂として東都化成(株)製YP−50等がある。また絶縁用途としての市販品としてSB−432(大日精化工業(株))がある。
また、最上層に好ましく用いられるポリアミドイミド系樹脂としては、市販の通常のものが使用でき、日立化成工業(株)製HI−4064や大日精化工業(株)製AI−602等がある。
Further, an epoxy resin preferably used for the uppermost layer is generally based on a phenoxy resin. This phenoxy resin can be used alone or in a mixed system with other thermoplastic resins. For example, a polyethersulfone resin or the like can be mixed. Examples of commercially available phenoxy resins include YP-50 manufactured by Toto Kasei Co., Ltd. There is SB-432 (Daiichi Seika Kogyo Co., Ltd.) as a commercially available product for insulation use.
Moreover, as a polyamide-imide-type resin preferably used for the uppermost layer, commercially available ordinary resins can be used, and there are HI-4064 manufactured by Hitachi Chemical Co., Ltd. and AI-602 manufactured by Dainichi Seika Kogyo Co., Ltd.

なお、本発明の絶縁電線において、絶縁皮膜の各層を形成するための樹脂塗料の塗布及び焼付けの条件、方法には特に制限はなく、公知の各種の方法によって行うことができる。また、導体についても特に制限はない。   In addition, in the insulated wire of this invention, there is no restriction | limiting in particular in the application | coating and baking conditions of the resin coating material for forming each layer of an insulating film, It can carry out by various well-known methods. Moreover, there is no restriction | limiting in particular also about a conductor.

本発明の絶縁電線は、前述のような多層構造の絶縁皮膜を有することにより、絶縁皮膜の各層の層間において外部からかかる応力を分散させること、導体と、導体に直接接する絶縁皮膜の下層との接着を強固にすることを同時に実現させたものである。
本発明においては絶縁電線の皮膜が、2層構成の場合はその皮膜厚比率が下層:上層=50:50〜80:20であり、好ましくは65:35〜70:30である。3層構成の場合は、その中間層の皮膜が全層の皮膜に対して、6〜25%、好ましくは10〜20%の厚さである。
The insulated wire of the present invention has an insulating film having a multilayer structure as described above to disperse the stress applied from the outside between the layers of the insulating film, and between the conductor and the lower layer of the insulating film in direct contact with the conductor. At the same time, it is possible to strengthen the adhesion.
In the present invention, when the coating of the insulated wire has a two-layer configuration, the coating thickness ratio is lower layer: upper layer = 50: 50 to 80:20, preferably 65:35 to 70:30. In the case of a three-layer structure, the intermediate layer has a thickness of 6 to 25%, preferably 10 to 20%, based on the total layer.

2層構成の場合、その皮膜比率のうち、上層皮膜比率が20%より小さいと、本願が要求している外的な傷に対しての防御が不十分であり、逆に50%を超える場合には、下層の皮膜が薄くなることから上層での外的な傷に対しての防御は十分ではあるが、電気特性が不十分である可能性が高くなる。
3層構成の場合、その皮膜構成のうち中層の皮膜厚さが全層の皮膜厚さに対して、6%より小さい場合、上層が受けた外的な傷に対しての下層への衝撃吸収能力が低く、25%を超える場合には、上層と下層それぞれの皮膜厚さが薄くなり、上層の皮膜厚さが薄くなった場合には外的な傷に対しての衝撃吸収能力が低くなってしまい、また下層の皮膜厚さが薄くなった場合には、外的な衝撃吸収能力は十分ではあるが、下層皮膜厚さが薄くなってしまうため、その電気特性が十分ではなく、電線としての要求特性を満足出来ないと考えられる。
In the case of a two-layer structure, if the upper layer coating ratio is less than 20% of the coating ratio, the protection against external scratches required by the present application is insufficient, and conversely exceeds 50%. In this case, since the lower layer film is thin, protection against external scratches in the upper layer is sufficient, but there is a high possibility that the electrical characteristics are insufficient.
In the case of a three-layer structure, when the film thickness of the middle layer in the film structure is less than 6% of the film thickness of all layers, the shock absorption to the lower layer against external scratches received by the upper layer When the capacity is low and exceeds 25%, the film thickness of the upper layer and the lower layer is reduced, and when the film thickness of the upper layer is reduced, the impact absorbing ability against external scratches is reduced. In addition, when the lower layer film thickness is reduced, the external shock absorption capability is sufficient, but the lower layer film thickness is decreased. It is considered that the required characteristics cannot be satisfied.

本発明の絶縁電線の一つの好ましい態様では、多層絶縁皮膜が、導体に接する最下層皮膜の上に形成する皮膜が該最下層に接する皮膜から、ポリイミド系樹脂皮膜、ポリアミドイミド系樹脂皮膜の順に皮膜を形成したものである。   In one preferred embodiment of the insulated wire of the present invention, the multilayer insulating film is formed in the order of a polyimide resin film and a polyamide-imide resin film from a film in which the film formed on the lowermost film in contact with the conductor contacts the lowermost layer. A film is formed.

本発明の絶縁電線の一つの好ましい態様では、多層絶縁皮膜が、導体に接する最下層皮膜の上に形成する皮膜が該最下層に接する皮膜から、剥離剤添加ポリアミドイミド系樹脂皮膜、ポリアミドイミド系樹脂皮膜の順に皮膜を形成したものである。   In one preferred embodiment of the insulated wire of the present invention, the multilayer insulating film is formed of a film formed on the lowermost layer film in contact with the conductor and the film in contact with the lowermost layer. A film is formed in the order of the resin film.

本発明の絶縁電線において、導体としては通常、銅またはその合金からなるものを用いる。また、絶縁被膜の全膜厚についても特に限定されない。全膜厚で、導体径(直径)の3〜5%とすることが好ましい。例えば直径1.0mmの導体の場合、絶縁被膜の全膜厚は30〜50μmが好ましい   In the insulated wire of the present invention, the conductor is usually made of copper or an alloy thereof. Further, the total film thickness of the insulating coating is not particularly limited. The total film thickness is preferably 3 to 5% of the conductor diameter (diameter). For example, in the case of a conductor having a diameter of 1.0 mm, the total thickness of the insulating coating is preferably 30 to 50 μm.

上記の絶縁電線を用いた回転電機の実施態様として、図1に示すようなモータ1の電機子2に適用し、特に図2には部分図として示した積層コア3のスロット4に絶縁電線5を巻回した例を示している。もちろん、この構造のモータに限定されるものではなく、中央部にマグネットローラを配置し、その周りに積層コアのスロットに絶縁電線が巻回された電機子を構成するプラシレスモータ、さらには発電機等、あらゆるタイプの回転電機に適用できるものである。   As an embodiment of the rotating electric machine using the above-described insulated wire, it is applied to the armature 2 of the motor 1 as shown in FIG. 1, and in particular, the insulated wire 5 is inserted into the slot 4 of the laminated core 3 shown as a partial view in FIG. The example which wound is shown. Of course, the motor is not limited to this structure. A plus-less motor that constitutes an armature in which a magnet roller is arranged in the center and an insulated wire is wound around a slot of a laminated core around the magnet roller. It can be applied to all types of rotating electrical machines such as machines.

以下に、本発明を実施例に基づきさらに詳細に説明するが、本発明はこれに限定されるものではない。   Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

(参考例1)
絶縁塗料1の調製
ポリアミドイミド系樹脂塗料のうち、下層に使用される樹脂塗料の絶縁塗料1を以下のとおり調製した。
市販のポリアミドイミド樹脂塗料HI−4064(日立化成工業(株)製)1245gにトリメチルアミン1.8g(ポリアミドイミド樹脂100質量部に対して0.45質量部)を加え、n−ブチル化メラミン樹脂溶液CYMEL1301(米国CYTEC社製)7.97g(ポリアミドイミド樹脂100質量部に対して1.2質量部)を加え、1時間撹拌し、絶縁皮膜の下層用のポリアミドイミド系樹脂塗料を得た。
(Reference Example 1)
Preparation of Insulating Paint 1 Among polyamideimide resin paints, an insulating paint 1 of a resin paint used for the lower layer was prepared as follows.
1.8 g of trimethylamine (0.45 parts by mass with respect to 100 parts by mass of polyamideimide resin) is added to 1245 g of commercially available polyamideimide resin paint HI-4064 (manufactured by Hitachi Chemical Co., Ltd.), and an n-butylated melamine resin solution CYMEL1301 (manufactured by CYTEC, USA) 7.97 g (1.2 parts by mass with respect to 100 parts by mass of the polyamideimide resin) was added and stirred for 1 hour to obtain a polyamideimide resin coating for the lower layer of the insulating film.

(参考例2)
絶縁塗料2の調製
ポリアミドイミド系樹脂塗料のうち、中層に使用される剥離剤入り樹脂塗料の絶縁塗料2を、以下の通り調製した。
市販のポリアミドイミド系樹脂塗料HI4064(日立化成工業(株)製)1000gに市販のポリエチレンワックス131P(三洋化成工業(株)製)を6.4g(ポリアミドイミド樹脂100質量部に対し2質量部)配合し、70℃にて加熱攪拌を2時間行ったのち室温まで冷却し、中層用の剥離剤入りポリアミドイミド系樹脂塗料を得た。
(Reference Example 2)
Preparation of Insulating Paint 2 Among the polyamideimide resin paints, an insulating paint 2 of a releaser-containing resin paint used for the middle layer was prepared as follows.
6.4 g of commercially available polyamidoimide resin coating HI4064 (manufactured by Hitachi Chemical Co., Ltd.) and 6.4 g of polyethylene wax 131P (manufactured by Sanyo Chemical Industries Co., Ltd.) (2 parts by mass with respect to 100 parts by mass of polyamideimide resin) After mixing and heating and stirring at 70 ° C. for 2 hours, the mixture was cooled to room temperature to obtain a polyamideimide resin paint containing a release agent for the middle layer.

(参考例3)
絶縁塗料3の調製
市販のフェノキシ樹脂YP−50(東都化成社製)100g、市販のポリエーテルサルホン樹脂ビクトレックスPES(三井化学社製)100g、クレゾール800gを1リットルのセパラブルフラスコに仕込み、80℃で3時間加熱溶解させ、上層用エポキシ系樹脂塗料を得た。
(Reference Example 3)
Preparation of Insulating Paint 3 100 g of commercially available phenoxy resin YP-50 (manufactured by Toto Kasei), 100 g of commercially available polyethersulfone resin Victrex PES (manufactured by Mitsui Chemicals), and 800 g of cresol were charged into a 1 liter separable flask. An upper layer epoxy resin paint was obtained by heating and dissolving at 80 ° C. for 3 hours.

(実施例1〜6、比較例1〜
導体径1.0mmの銅線を用い、表1〜5記載のとおりの皮膜構成の絶縁皮膜を形成した。絶縁皮膜の形成には炉長8mの縦型焼付け炉を用いて複数回塗布焼付けすることを繰り返した。多層皮膜の各層を形成する絶縁ワニスとして上記の絶縁ワニス1〜3、並びに、上記のPyreML、HI4046,NH8642AYを用いた。
(Examples 1-6, Comparative Examples 1-8 )
Using a copper wire having a conductor diameter of 1.0 mm, an insulating film having a film structure as shown in Tables 1 to 5 was formed. The formation of the insulating film was repeated by applying and baking a plurality of times using a vertical baking furnace having a furnace length of 8 m. As the insulating varnish for forming each layer of the multilayer coating, the above insulating varnishes 1 to 3 and the above PireML, HI4046, NH8642AY were used.

(試験例1)
(往復摩耗)
往復摩耗は、該サンプル電線約40cmをおよそ1%伸長してまっすぐにして、電線の上を直径0.4mmのビーズ針を用いて電線の長手方向に10mmの範囲で往復に同一箇所を摩耗させる。本発明の場合は、1.0mmの電線を使用していることからビーズ針に掛ける荷重を600gとして摩耗させた。これらの測定は、JIS C3003−1976に記載の耐摩耗性(10.1項)に準拠した。
(往復摩耗後の絶縁破壊電圧)
前述の往復摩耗を実施したサンプルのうち、皮膜の剥離が確認された摩耗値にて該サンプルを取りだし、摩耗した箇所を摩耗を行っていない該電線との組み合わせでJIS C3003−1999に記載の絶縁破壊(11項の(2))2個より法にて実施した。
(皮膜−導体間の密着力、皮膜−皮膜間の密着力)
該電線の表面に形成された絶縁皮膜に電線の長手方向に沿って電線の直径の2/3以下で且つ0.3mm以上の間隔となるように、電線の導体に達する2本の並行な切り込みを入れて、切り込みの間の皮膜の剥離強度を測定した。導体からの剥離強度と、下層皮膜を残して上層あるいは中層皮膜の剥離強度の双方を測定した。これらの測定は、特開平06−194304号公報記載の方法に準拠した。
(Test Example 1)
(Reciprocating wear)
In the reciprocating wear, about 40 cm of the sample electric wire is elongated by about 1% and straightened, and the same portion is worn in a reciprocating manner within a range of 10 mm in the longitudinal direction of the electric wire using a bead needle having a diameter of 0.4 mm. . In the case of the present invention, since a 1.0 mm electric wire is used, the load applied to the bead needle was worn at 600 g. These measurements were based on the wear resistance (Section 10.1) described in JIS C3003-1976.
(Dielectric breakdown voltage after reciprocating wear)
Among the samples subjected to the above-described reciprocal wear, the sample is taken out at a wear value at which peeling of the film has been confirmed, and the insulation described in JIS C3003-1999 is combined with the wire that has not been worn at the worn portion. It carried out by the method from two destructions ((11) (2)).
(Adhesion between film and conductor, adhesion between film and film)
Two parallel cuts reaching the conductor of the electric wire so that the insulating film formed on the surface of the electric wire has a distance of 2/3 or less of the diameter of the electric wire and 0.3 mm or more along the longitudinal direction of the electric wire And the peel strength of the film during cutting was measured. Both the peel strength from the conductor and the peel strength of the upper layer or middle layer film were measured while leaving the lower layer film. These measurements were based on the method described in JP-A-06-194304.

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

(試験例2)
(コイルリーク電流値測定)
r=1.0で一辺が20mmの直方体形状の疑似コアを炭素鋼にて作成し、そのコアに前述の実施例1〜6、比較例1〜の該電線を巻き付ける電線の導体断面積1.0mmあたり6.0kgf(直径1.0mmの電線の場合、4.7kgf)のテンションを掛けて10回(10周)巻付けした後、電線に傷を付けないように巻ほぐし、その後JIS C3003−1984記載のピンホール(6項)試験を類似した濃度5重量%の食塩水中に対向電極とともに浸漬し、コイルを+極として12Vの直流電圧を印加してリークしてくる電流値を測定した。その結果を以下の表6〜10に記載した。
(Test Example 2)
(Measurement of coil leakage current value)
A rectangular parallelepiped-shaped pseudo core having a side of 20 mm with r = 1.0 is made of carbon steel, and the conductor cross-sectional area 1 of the electric wire in which the electric wires of Examples 1 to 6 and Comparative Examples 1 to 8 are wound around the core. After winding 10 times (10 laps) with a tension of 6.0 kgf per 0.0 mm 2 (4.7 kgf for an electric wire with a diameter of 1.0 mm), unwind the wires so that they are not damaged, and then JIS Immerse the pinhole (Clause 6) test described in C3003-1984 with a counter electrode in a similar concentration of 5% by weight saline, and measure the leaked current value by applying a DC voltage of 12V with the coil as the positive pole. did. The results are shown in Tables 6 to 10 below.

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

Figure 0005117027
Figure 0005117027

表6〜10で示されるように、比較例の絶縁電線では、上記のコイルリーク電流値測定で、0.97mA以上の電流値が測定されたのに対し、実施例の絶縁電線では、いずれも0.03mA以下の電流値しか測定されず、本発明の絶縁電線は、高いコイル巻時の耐加工性を有し、絶縁不良を起こしにくいことがわかる。   As shown in Tables 6 to 10, in the insulated wire of the comparative example, a current value of 0.97 mA or more was measured in the above coil leakage current value measurement, whereas in the insulated wire of the example, both were measured. Only a current value of 0.03 mA or less is measured, and it can be seen that the insulated wire of the present invention has a high workability at the time of coil winding and hardly causes insulation failure.

モータの模式断面図である。It is a schematic cross section of a motor. モータの電機子の1例の部分模式断面図である。It is a partial schematic cross section of an example of an armature of a motor.

符号の説明Explanation of symbols

1 モータ
2 電機子
3 積層コア
4 スロット
5 絶縁電線
1 Motor 2 Armature 3 Laminated Core 4 Slot 5 Insulated Wire

Claims (6)

導体および該導体に被覆された多層絶縁皮膜を有する絶縁電線であって、該多層絶縁皮膜の導体に接する最下層皮膜と導体との密着力が、該多層絶縁皮膜を形成する各層皮膜間の密着力より高く、該多層絶縁皮膜、皮膜厚比率が最下層:上層=40:60〜80:20の2層構成、または、中間層の皮膜が全層の皮膜に対して、6〜25%の厚さを持つ3層構成とし、
前記多層絶縁皮膜の導体に接する最下層皮膜と導体との密着力を30g/mm以上とし、且つ、前記多層絶縁皮膜を形成する各層皮膜間の密着力を10g/mm以下とした
ことを特徴とする絶縁電線。
An insulated wire having a conductor and a multilayer insulation film coated on the conductor, wherein the adhesion between the lowermost layer film in contact with the conductor of the multilayer insulation film and the conductor is the adhesion between the respective layer films forming the multilayer insulation film It is higher than the force, and the multilayer insulating film has a two-layer structure in which the film thickness ratio is the lowermost layer: upper layer = 40: 60 to 80:20, or the film of the intermediate layer is 6 to 25% with respect to the film of all layers a three-layer structure having a thickness of,
The adhesion between the lowermost layer film in contact with the conductor of the multilayer insulation film and the conductor is 30 g / mm or more, and the adhesion between each layer film forming the multilayer insulation film is 10 g / mm or less. An insulated wire characterized by that.
前記導体に接する最下層皮膜がポリアミドイミド系樹脂、ポリエステル系樹脂、H種ポリエステル系樹脂、およびポリエステルイミド系樹脂からなる群から選ばれた1種の樹脂からなる皮膜であることを特徴とする請求項記載の絶縁電線。 The lowermost layer film in contact with the conductor is a film made of one resin selected from the group consisting of a polyamideimide resin, a polyester resin, an H-type polyester resin, and a polyesterimide resin. Item 1. An insulated wire according to item 1 . 前記導体に接する最下層皮膜の上に形成する皮膜が該最下層に接する皮膜から、ポリイミド系樹脂皮膜、ポリアミドイミド系樹脂皮膜の順に皮膜を形成したことを特徴とする請求項記載の絶縁電線。 The insulated wire according to claim 2, wherein the film formed on the lowermost layer film in contact with the conductor is formed in the order of the polyimide resin film and the polyamideimide resin film from the film in contact with the lowermost layer. . 前記導体に接する最下層皮膜の上に形成する皮膜が該最下層に接する皮膜から、剥離剤添加ポリアミドイミド系樹脂皮膜、ポリアミドイミド系樹脂皮膜の順に皮膜を形成したことを特徴とする請求項記載の絶縁電線。 Claim 2, characterized in that the film be formed on the lowermost layer coating in contact with the conductor from the film in contact with the outermost layer, the release agent added polyamideimide resin coating to form a film on the order of polyamide-imide resin film Insulated wire as described. 前記導体に接する最下層皮膜の上に形成する皮膜が、ポリイミド系樹脂皮膜あるいはエポキシ系樹脂皮膜であることを特徴とする請求項記載の絶縁電線。 The insulated wire according to claim 2 , wherein the film formed on the lowermost film in contact with the conductor is a polyimide resin film or an epoxy resin film. 請求項1〜のいずれか1項に記載の絶縁電線が、積層コアのスロットに巻回された電機子を備えたことを特徴とする回転電機。
A rotating electrical machine, wherein the insulated wire according to any one of claims 1 to 5 includes an armature wound around a slot of a laminated core.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9236318B1 (en) 2013-03-29 2016-01-12 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
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JPH04342904A (en) * 1991-05-20 1992-11-30 Fujikura Ltd Insulating wire
JPH0745130A (en) * 1993-07-27 1995-02-14 Sumitomo Electric Ind Ltd Insulated wire
JPH0773743A (en) * 1993-08-31 1995-03-17 Sumitomo Electric Ind Ltd Insulated electric wire
JP3717297B2 (en) * 1996-12-25 2005-11-16 古河電気工業株式会社 Insulated wire
JP4057230B2 (en) * 2000-10-03 2008-03-05 古河電気工業株式会社 Insulated conductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9236318B1 (en) 2013-03-29 2016-01-12 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device

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