JP5116643B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5116643B2 JP5116643B2 JP2008301865A JP2008301865A JP5116643B2 JP 5116643 B2 JP5116643 B2 JP 5116643B2 JP 2008301865 A JP2008301865 A JP 2008301865A JP 2008301865 A JP2008301865 A JP 2008301865A JP 5116643 B2 JP5116643 B2 JP 5116643B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- lead terminals
- package
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Led Device Packages (AREA)
Description
12 パッケージ
13 発光素子
14 ボンディングワイヤ
15 封入層
16 波長変換部材
Claims (4)
- 複数のリード端子と、
前記複数のリード端子の上に接合されており、一体形成されているとともに、下側凸部、上側凹部および複数の貫通孔を有しており、前記下側凸部が前記複数のリード端子の間に位置しており、前記上側凹部が前記複数のリード端子の上方に位置しており、前記複数の貫通孔が前記上側凹部および前記複数のリード端子の間に設けられている、パッケージと、
前記上側凹部の底面に設けられた発光素子と、
前記複数の貫通孔の内側を通っており、前記発光素子および前記複数のリード端子に接続された複数のボンディングワイヤと、
を備えた発光装置。 - 前記複数のリード端子の各々は、前記貫通孔の内側に挿入された凸部を有していることを特徴とする請求項1記載の発光装置。
- 前記リード端子の各々は、前記凸部に設けられており接合部材が入り込んだ溝部分を有していることを特徴とする請求項2記載の発光装置。
- 前記凹部の表面部分が、ポーラス状のセラミックスからなることを特徴とする請求項1記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008301865A JP5116643B2 (ja) | 2008-11-27 | 2008-11-27 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008301865A JP5116643B2 (ja) | 2008-11-27 | 2008-11-27 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010129713A JP2010129713A (ja) | 2010-06-10 |
JP5116643B2 true JP5116643B2 (ja) | 2013-01-09 |
Family
ID=42329917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008301865A Expired - Fee Related JP5116643B2 (ja) | 2008-11-27 | 2008-11-27 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5116643B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5659649B2 (ja) * | 2010-09-15 | 2015-01-28 | 住友電気工業株式会社 | 直流電源装置及び電力貯蔵システム |
JP5049382B2 (ja) * | 2010-12-21 | 2012-10-17 | パナソニック株式会社 | 発光装置及びそれを用いた照明装置 |
JP5732619B2 (ja) * | 2012-06-27 | 2015-06-10 | パナソニックIpマネジメント株式会社 | 発光装置及びそれを用いた照明装置 |
JP6125332B2 (ja) | 2013-05-31 | 2017-05-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100616695B1 (ko) * | 2005-10-04 | 2006-08-28 | 삼성전기주식회사 | 고출력 발광 다이오드 패키지 |
KR100735432B1 (ko) * | 2006-05-18 | 2007-07-04 | 삼성전기주식회사 | 발광소자 패키지 및 발광소자 패키지 어레이 |
-
2008
- 2008-11-27 JP JP2008301865A patent/JP5116643B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2010129713A (ja) | 2010-06-10 |
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