JP5112492B2 - タッチパネル用透明導電膜及びその製造方法 - Google Patents
タッチパネル用透明導電膜及びその製造方法 Download PDFInfo
- Publication number
- JP5112492B2 JP5112492B2 JP2010231277A JP2010231277A JP5112492B2 JP 5112492 B2 JP5112492 B2 JP 5112492B2 JP 2010231277 A JP2010231277 A JP 2010231277A JP 2010231277 A JP2010231277 A JP 2010231277A JP 5112492 B2 JP5112492 B2 JP 5112492B2
- Authority
- JP
- Japan
- Prior art keywords
- touch panel
- transparent
- silver nanowires
- conductive film
- transparent electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
図1aから図1bは本発明の好ましい実施例によるタッチパネル用透明導電膜の斜視図であり、図2は図1aに図示されたタッチパネル用透明導電膜のA−A'線による断面図である。
110 透明基板
120 銀ナノワイヤ
130 透明電極
135 塗布液
140 印刷シリンダー
143 圧胴
145 補助シリンダー
147 ドクター
L 間隔
D 直径
Claims (10)
- 透明基板;
前記透明基板に一方向に相互平行に形成された多数の銀ナノワイヤ;及び
前記銀ナノワイヤを塗布するように前記透明基板に形成された透明電極;
を含み、
X軸方向の面抵抗とY軸方向の面抵抗が同一になるように、
前記透明電極のX軸方向の面抵抗がY軸方向の面抵抗より高い場合、前記多数の銀ナノワイヤはX軸方向に相互平行に形成され、
前記透明電極のY軸方向の面抵抗がX軸方向の面抵抗より高い場合、前記多数の銀ナノワイヤはY軸方向に相互平行に形成されることを特徴とするタッチパネル用透明導電膜。 - 前記透明電極は導電性高分子で形成されることを特徴とする請求項1に記載のタッチパネル用透明導電膜。
- 前記導電性高分子は、ポリ−3、4−エチレンジオキシチオフェン/ポリスチレンスルホネート(PEDOT/PSS)、ポリアニリン、ポリアセチレンまたはポリフェニレンビニレンを含むことを特徴とする請求項2に記載のタッチパネル用透明導電膜。
- 前記多数の銀ナノワイヤは相互同一の間隔で形成されることを特徴とする請求項1に記載のタッチパネル用透明導電膜。
- 前記多数の銀ナノワイヤは相互同一の直径で形成されることを特徴とする請求項1に記載のタッチパネル用透明導電膜。
- (A)透明基板を提供する段階;
(B)前記透明基板に一方向に相互平行な多数の銀ナノワイヤを形成する段階;及び
(C)前記透明基板を前記一方向と垂直に移送させて、前記銀ナノワイヤを塗布するように前記透明基板に透明電極を形成する段階;
を含み、
前記一方向の面抵抗と前記一方向に垂直方向の面抵抗は同一であることを特徴とするタッチパネル用透明導電膜の製造方法。 - 前記透明電極を形成する段階において、
前記透明電極は導電性高分子で形成されることを特徴とする請求項6に記載のタッチパネル用透明導電膜の製造方法。 - 前記導電性高分子は、ポリ−3、4−エチレンジオキシチオフェン/ポリスチレンスルホネート(PEDOT/PSS)、ポリアニリン、ポリアセチレンまたはポリフェニレンビニレンを含むことを特徴とする請求項7に記載のタッチパネル用透明導電膜の製造方法。
- 前記多数の銀ナノワイヤを形成する段階において、
前記多数の銀ナノワイヤを相互同一の間隔で形成することを特徴とする請求項6に記載のタッチパネル用透明導電膜の製造方法。 - 前記多数の銀ナノワイヤを形成する段階において、
前記多数の銀ナノワイヤを相互同一の直径で形成することを特徴とする請求項6に記載のタッチパネル用透明導電膜の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100071834A KR101119269B1 (ko) | 2010-07-26 | 2010-07-26 | 터치패널용 투명도전막 및 그 제조방법 |
KR10-2010-0071834 | 2010-07-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012027888A JP2012027888A (ja) | 2012-02-09 |
JP5112492B2 true JP5112492B2 (ja) | 2013-01-09 |
Family
ID=45492637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010231277A Expired - Fee Related JP5112492B2 (ja) | 2010-07-26 | 2010-10-14 | タッチパネル用透明導電膜及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120018200A1 (ja) |
JP (1) | JP5112492B2 (ja) |
KR (1) | KR101119269B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9755179B2 (en) | 2015-08-06 | 2017-09-05 | Samsung Electronics Co., Ltd. | Conductor and method of manufacturing the same |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102820074A (zh) * | 2012-05-07 | 2012-12-12 | 上海交通大学 | 一种用于光电子器件的导电基板及其制备方法 |
KR20130129020A (ko) * | 2012-05-18 | 2013-11-27 | 엘지이노텍 주식회사 | 터치 패널 및 전극 형성 방법 |
EP2900409B1 (en) | 2012-09-27 | 2019-05-22 | Rhodia Operations | Process for making silver nanostructures and copolymer useful in such process |
US9295153B2 (en) | 2012-11-14 | 2016-03-22 | Rohm And Haas Electronic Materials Llc | Method of manufacturing a patterned transparent conductor |
TWI498780B (zh) * | 2013-01-22 | 2015-09-01 | Henghao Technology Co Ltd | 觸控面板 |
KR20140100089A (ko) * | 2013-02-05 | 2014-08-14 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 그 제조 방법 |
KR102116483B1 (ko) | 2013-10-18 | 2020-05-29 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 그 제조방법 |
US9925616B2 (en) * | 2013-12-23 | 2018-03-27 | Samsung Display Co., Ltd. | Method for fusing nanowire junctions in conductive films |
KR102183655B1 (ko) | 2014-01-28 | 2020-11-27 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102355326B1 (ko) | 2014-07-24 | 2022-01-26 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 그 제조방법 |
KR102248460B1 (ko) | 2014-08-08 | 2021-05-07 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 그 제조 방법 |
KR20160066634A (ko) | 2014-12-02 | 2016-06-13 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조방법 |
KR102264037B1 (ko) | 2014-12-11 | 2021-06-11 | 삼성디스플레이 주식회사 | 투명 전극 패턴, 그 제조 방법 및 이를 포함한 터치 센서 |
KR102241773B1 (ko) | 2014-12-18 | 2021-04-19 | 삼성디스플레이 주식회사 | 터치 센서 장치 |
KR102264259B1 (ko) | 2015-01-05 | 2021-06-15 | 삼성디스플레이 주식회사 | 터치 스크린 패널의 제조방법 |
KR102270037B1 (ko) | 2015-02-02 | 2021-06-28 | 삼성디스플레이 주식회사 | 터치 스크린 패널 |
KR102338748B1 (ko) | 2015-04-21 | 2021-12-15 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 이의 제조 방법 |
WO2018093014A1 (ko) * | 2016-11-18 | 2018-05-24 | 울산과학기술원 | 은 나노와이어 필름 및 그 제조방법, 터치스크린 패널 및 그 제조방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI463713B (zh) * | 2006-11-09 | 2014-12-01 | Nanosys Inc | 用於奈米導線對準及沈積的方法 |
KR101456838B1 (ko) * | 2007-04-20 | 2014-11-04 | 캄브리오스 테크놀로지즈 코포레이션 | 복합 투명 도전체 및 그 제조 방법 |
JP2009205924A (ja) * | 2008-02-27 | 2009-09-10 | Kuraray Co Ltd | 透明導電膜、透明導電部材、銀ナノワイヤ分散液および透明導電膜の製造方法 |
JP2009252437A (ja) * | 2008-04-03 | 2009-10-29 | Konica Minolta Holdings Inc | 透明導電性フィルム |
US8198796B2 (en) * | 2008-07-25 | 2012-06-12 | Konica Minolta Holdings, Inc. | Transparent electrode and production method of same |
JP5397377B2 (ja) * | 2008-08-11 | 2014-01-22 | コニカミノルタ株式会社 | 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法 |
JP5397376B2 (ja) * | 2008-08-11 | 2014-01-22 | コニカミノルタ株式会社 | 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法 |
JP5306760B2 (ja) * | 2008-09-30 | 2013-10-02 | 富士フイルム株式会社 | 透明導電体、タッチパネル、及び太陽電池パネル |
US20100101829A1 (en) * | 2008-10-24 | 2010-04-29 | Steven Verhaverbeke | Magnetic nanowires for tco replacement |
US20100101832A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Compound magnetic nanowires for tco replacement |
KR20100051434A (ko) * | 2008-11-07 | 2010-05-17 | 삼성전자주식회사 | 표시 장치의 제조 방법 |
CN101943965B (zh) * | 2009-07-08 | 2013-09-18 | 群康科技(深圳)有限公司 | 触摸屏及具有触摸屏的电子装置 |
KR101190206B1 (ko) * | 2009-12-21 | 2012-10-16 | (주)켐스 | 투명도전막 및 그 제조방법 |
KR101133951B1 (ko) * | 2010-06-01 | 2012-04-05 | 주식회사 모린스 | 오버코팅층을 형성시킨 윈도우 일체형 정전용량방식 터치스크린 패널 및 그 제조방법 |
-
2010
- 2010-07-26 KR KR1020100071834A patent/KR101119269B1/ko not_active IP Right Cessation
- 2010-10-11 US US12/901,690 patent/US20120018200A1/en not_active Abandoned
- 2010-10-14 JP JP2010231277A patent/JP5112492B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9755179B2 (en) | 2015-08-06 | 2017-09-05 | Samsung Electronics Co., Ltd. | Conductor and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
KR20120010359A (ko) | 2012-02-03 |
KR101119269B1 (ko) | 2012-03-16 |
US20120018200A1 (en) | 2012-01-26 |
JP2012027888A (ja) | 2012-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5112492B2 (ja) | タッチパネル用透明導電膜及びその製造方法 | |
US8760436B2 (en) | Mutual capacitive touch panel | |
KR101521681B1 (ko) | 터치패널 | |
KR101156782B1 (ko) | 터치패널 | |
US20120081329A1 (en) | Digital resistive type touch panel | |
JP2013137731A (ja) | タッチスクリーン | |
US20140104199A1 (en) | Touch panel and method for manufacturing the same | |
JP2013134768A (ja) | タッチパネルのセンシング電極パターン | |
US20120062478A1 (en) | Touch panel | |
JP2011258172A (ja) | タッチパネル | |
US20120032910A1 (en) | Touch panel and method of manufacturing the same | |
JP5006433B2 (ja) | タッチパネル製造装置 | |
US20110308929A1 (en) | Touch panel and method of manufacturing the same | |
KR20110133359A (ko) | 정전용량방식 터치패널 | |
JP2015018532A (ja) | タッチセンサ | |
KR101077424B1 (ko) | 터치패널 및 그 제조방법 | |
JP2012027894A (ja) | 静電容量方式のタッチパネル | |
JP2011175612A (ja) | タッチパネル | |
US20130154966A1 (en) | Touch panel | |
JP2014120149A (ja) | タッチパネル | |
KR20120055367A (ko) | 터치패널 | |
US8355011B2 (en) | Resistive touch screen | |
KR20120056464A (ko) | 터치패널 및 그 제조방법 | |
KR20110094999A (ko) | 디스플레이를 구비한 터치스크린 | |
KR20110095102A (ko) | 터치패널의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120614 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120619 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120911 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121002 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121010 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151019 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |