JP5108740B2 - Electrochemical devices - Google Patents

Electrochemical devices Download PDF

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JP5108740B2
JP5108740B2 JP2008314553A JP2008314553A JP5108740B2 JP 5108740 B2 JP5108740 B2 JP 5108740B2 JP 2008314553 A JP2008314553 A JP 2008314553A JP 2008314553 A JP2008314553 A JP 2008314553A JP 5108740 B2 JP5108740 B2 JP 5108740B2
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plate
conductor
via conductor
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terminal
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JP2010141026A (en
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日向子 美里
和志 八幡
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Taiyo Yuden Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Description

本発明は、回路基板等の実装相手に対する表面実装を可能とした電気二重層キャパシタ等の電気化学デバイスに関する。   The present invention relates to an electrochemical device such as an electric double layer capacitor that enables surface mounting on a mounting partner such as a circuit board.

特許文献１及び２には、リフロー半田付けによって回路基板等の実装相手に対する表面実装を可能とした電気二重層キャパシタが開示されている。両文献１及び２に開示された電気二重層キャパシタは、基本的には、電解液を含浸した蓄電素子と、該蓄電素子を収容した密封容器と、該密封容器の下面に設けられた第１端子及び第２端子と、蓄電素子と第１端子とを電気的に接続する第１引出導体と、蓄電素子と第２端子とを電気的に接続する第２引出導体とを具備している。   Patent Documents 1 and 2 disclose an electric double layer capacitor that can be surface-mounted on a mounting partner such as a circuit board by reflow soldering. The electric double layer capacitors disclosed in both Documents 1 and 2 are basically a power storage element impregnated with an electrolyte, a sealed container containing the power storage element, and a first container provided on the lower surface of the sealed container. A terminal and a second terminal; a first lead conductor that electrically connects the power storage element and the first terminal; and a second lead conductor that electrically connects the power storage element and the second terminal.

これら電気二重層キャパシタにあっては、第１端子，第２端子，第１引出導体及び第２引出導体の形成を容易とするため、密封容器の下壁をセラミック等の非金属材から成る別部品によって構成し、該別部品に導体ペーストを印刷し焼成することによってこれらを形成する手法が採用されている。   In these electric double layer capacitors, in order to facilitate the formation of the first terminal, the second terminal, the first lead conductor and the second lead conductor, the lower wall of the sealed container is made of a non-metallic material such as ceramic. A method is adopted in which a part is formed, and a conductor paste is printed and fired on the other part to form them.

第１引出導体及び第２引出導体がリフロー半田付け時や実装後に被り得る損傷、例えばクラックや腐食等を回避するには、該第１引出導体及び第２引出導体の露出面積を極力小さくすることが望ましいと言える。これを実現するため、特許文献２に開示された電気二重層キャパシタでは、第１引出導体及び第２引出導体の一方にビア導体部（孔に導体を充填したもの）を用いてその露出面積の低減を図っている。   To avoid damage that the first lead conductor and the second lead conductor may suffer during reflow soldering or after mounting, such as cracks or corrosion, the exposed areas of the first lead conductor and the second lead conductor should be made as small as possible. Is desirable. In order to realize this, in the electric double layer capacitor disclosed in Patent Document 2, a via conductor portion (a hole filled with a conductor) is used for one of the first lead conductor and the second lead conductor, and the exposed area of We are trying to reduce it.

しかしながら、第１引出導体及び第２引出導体の少なくとも一方にビア導体部を用いる場合には、該ビア導体部が設けられた部分の強度が他の部分に比べて低下するため、同部分がリフロー半田付け時の温度変化や実装後の温度変化等に伴う熱膨張収縮に基づいて生じる応力によって破損する恐れがある。
特開２００１−２１６９５２ 特開２００７−２０１３８２ However, when a via conductor portion is used for at least one of the first lead conductor and the second lead conductor, the strength of the portion where the via conductor portion is provided is lower than that of the other portion. There is a risk of breakage due to stress generated based on thermal expansion / contraction caused by temperature change during soldering or temperature change after mounting.
JP 2001-216852 A JP2007-20382A

本発明の目的は、引出導体にビア導体部を用いた場合でも、該ビア導体部が設けられた部分がリフロー半田付け時の温度変化や実装後の温度変化等に伴う熱膨張収縮に基づいて生じる応力によって破損することを防止できる電気化学デバイスを提供することにある。   The object of the present invention is based on thermal expansion / contraction caused by temperature change during reflow soldering or temperature change after mounting even when a via conductor part is used as a lead conductor. An object of the present invention is to provide an electrochemical device that can be prevented from being damaged by the stress generated.

前記目的を達成するため、本発明は、蓄電または発電が可能な電気化学素子を収容した密封容器の下面に少なくとも１対の端子を有し、且つ、電気化学素子と各端子とを電気的に接続する少なくとも１対の引出導体を有する電気化学デバイスであって、密封容器は、金属製の筒状部と、金属製のシールリングを介して筒状部の下端開口を閉塞する非金属製の板状部とから構成されており、各引出導体の少なくとも１つは板状部の厚さ方向に沿うビア導体部を有していて、該ビア導体部は板状部の中心からずれた位置に設けられている。   In order to achieve the above object, the present invention has at least one pair of terminals on the lower surface of a sealed container containing an electrochemical element capable of storing or generating electricity, and electrically connects the electrochemical element and each terminal. An electrochemical device having at least one pair of lead conductors to be connected, wherein the sealed container is made of a non-metallic member that closes a lower end opening of the cylindrical portion through a metallic cylindrical portion and a metallic seal ring. And at least one of the lead conductors has a via conductor portion along the thickness direction of the plate portion, and the via conductor portion is displaced from the center of the plate portion. Is provided.

この電気化学デバイスによれば、ビア導体部は、リフロー半田付け時の温度変化や実装後の温度変化等に伴う熱膨張収縮に基づいて生じる応力が集中し易い板状部の中心を避けて設けられているので、該熱膨張収縮に基づいて生じる応力が板状部に加わっても、該板状部のビア導体部が設けられた部分が該応力によって破損する恐れを確実に回避することができる。   According to this electrochemical device, the via conductor portion is provided avoiding the center of the plate-like portion where stress caused by thermal expansion and contraction due to temperature change during reflow soldering and temperature change after mounting is likely to concentrate. Therefore, even if stress generated based on the thermal expansion and contraction is applied to the plate-like portion, it is possible to reliably avoid the possibility that the portion of the plate-like portion provided with the via conductor is damaged by the stress. it can.

本発明によれば、引出導体にビア導体部を用いた場合でも、該ビア導体部が設けられた部分がリフロー半田付け時の温度変化や実装後の温度変化等に伴う熱膨張収縮に基づいて生じる応力によって破損することを防止できる電気化学デバイスを提供することができる。   According to the present invention, even when the via conductor portion is used as the lead conductor, the portion where the via conductor portion is provided is based on the thermal expansion / contraction caused by the temperature change during reflow soldering or the temperature change after mounting. An electrochemical device that can be prevented from being damaged by the generated stress can be provided.

本発明の前記目的とそれ以外の目的と、構成特徴と、作用効果は、以下の説明と添付図面によって明らかとなる。   The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

図１〜図７は本発明に係る電気化学デバイスを示すもので、図１は電気化学デバイスの上面図、図２は図１のｘ１−ｘ１線に沿う断面図、図３は図１に示した電気化学デバイスの下面図、図４は図１から蓄電素子，筒状部及びシールリングを除外した図、図５は図４から板状部の上層を除外した図、図６は図２及び図４に示したビア導体部の位置を説明するための図、図７は図２及び図４に示したビア導体部の位置の変形例を示す図である。尚、以下の説明では、図１における左右方向を長さ方向、上下方向を幅方向と称する。   1 to 7 show an electrochemical device according to the present invention. FIG. 1 is a top view of the electrochemical device, FIG. 2 is a sectional view taken along line x1-x1 in FIG. 1, and FIG. 3 is shown in FIG. 4 is a bottom view of the electrochemical device, FIG. 4 is a diagram excluding the storage element, the cylindrical portion and the seal ring from FIG. 1, FIG. 5 is a diagram excluding the upper layer of the plate-like portion from FIG. 4 is a view for explaining the position of the via conductor portion shown in FIG. 4, and FIG. 7 is a view showing a modification of the position of the via conductor portion shown in FIGS. In the following description, the horizontal direction in FIG. 1 is referred to as a length direction, and the vertical direction is referred to as a width direction.

まず、図面に示した構造の電気化学デバイスを角型のＰＡＳ（ポリアセン系有機半導体）キャパシタとして用いた場合について説明する。   First, the case where the electrochemical device having the structure shown in the drawings is used as a square PAS (polyacene organic semiconductor) capacitor will be described.

このＰＡＳキャパシタは、図１〜図５に示すように、電解液を含浸した蓄電素子１０と、該蓄電素子１０を収容した密封容器２０と、該密封容器２０の下面に設けられた第１端子３０及び第２端子４０と、蓄電素子１０と第１端子３０とを電気的に接続する第１引出導体５０と、蓄電素子１０と第２端子４０とを電気的に接続する第２引出導体６０とを具備している。 As shown in FIGS. 1 to 5, the PAS capacitor includes a power storage element 10 impregnated with an electrolyte, a sealed container 20 containing the power storage element 10, and a first terminal provided on the lower surface of the sealed container 20. 30 and the 2nd terminal 40, the 1st extraction conductor 50 which electrically connects the electrical storage element 10 and the 1st terminal 30, and the 2nd extraction conductor 60 which electrically connects the electrical storage element 10 and the 2nd terminal 40 It is equipped with.

蓄電素子１０は、上面視形状が矩形の第１極性部１１及び第２極性部１２と、第１極性部１１と第２極性部１２との間に介装された上面視形状が矩形のセパレータ１３とから構成されている。第１極性部１１及び第２極性部１２はＰＡＳを主成分とした材料から成り、セパレータ１３は高イオン透過度を有する材料、例えばガラス繊維，セルロース，レーヨン等の繊維系材料や、ポリプロピレン，ポリエチレン，ポリアミド，ポリイミド等の合成樹脂材料や、その他の材料から成る。   The electrical storage element 10 includes a first polar part 11 and a second polar part 12 having a rectangular top view shape, and a separator having a rectangular top view interposed between the first polar part 11 and the second polar part 12. 13. The first polar part 11 and the second polar part 12 are made of a material mainly composed of PAS, and the separator 13 is a material having high ion permeability, for example, a fiber material such as glass fiber, cellulose, rayon, polypropylene, polyethylene, etc. , Synthetic resin materials such as polyamide and polyimide, and other materials.

第１極性部１１の下面は、後述する第１引出導体５０の第１導体部５１の上面に導電材を介して電気的に接合されている。また、第２極性部１２の上面は、後述する密封容器２０の筒状部２１の上壁２１ａの下面に導電材を介して電気的に接合されている。さらに、第１極性部１１，第２極性部１２及びセパレータ１３には、プロピレンカーボネート等の溶媒に硼弗化トリエチルメチルアンモニウム等の電解質を所定濃度で溶解して成る電解液が含浸されている。   The lower surface of the first polar part 11 is electrically joined to the upper surface of the first conductor part 51 of the first lead conductor 50 described later via a conductive material. Moreover, the upper surface of the 2nd polar part 12 is electrically joined to the lower surface of the upper wall 21a of the cylindrical part 21 of the sealed container 20 mentioned later via a electrically conductive material. Further, the first polar part 11, the second polar part 12 and the separator 13 are impregnated with an electrolytic solution obtained by dissolving an electrolyte such as triethylmethylammonium borofluoride in a predetermined concentration in a solvent such as propylene carbonate.

密封容器２０は、上面視形状が略矩形の筒状部２１と、上面視形状が略矩形の板状部２２と、筒状部２１と板状部２２との間に介装された上面視形状が矩形枠状のシールリング２３とから構成されている。筒状部２１は、ニッケルとコバルトと鉄の合金であるコバール（ＫＯＶＡＲ：米国登録商標），ニッケルと鉄の合金であるアロイ，銅，アルミニウム，ステンレス，ニッケル，金等の金属から成り、板状部２２はアルミナセラミックス等の非金属材から成り、シールリング２３は筒状部２１と同様の金属から成る。   The sealed container 20 includes a cylindrical portion 21 having a substantially rectangular shape in top view, a plate-like portion 22 having a substantially rectangular shape in top view, and a top view interposed between the cylindrical portion 21 and the plate-like portion 22. The seal ring 23 has a rectangular frame shape. The cylindrical portion 21 is made of a metal such as Kovar (KOVAR: US registered trademark), which is an alloy of nickel, cobalt, and iron, or an alloy of nickel, iron, copper, aluminum, stainless steel, nickel, gold, and the like. The part 22 is made of a non-metallic material such as alumina ceramics, and the seal ring 23 is made of the same metal as the cylindrical part 21.

筒状部２１は、上面視形状が矩形の上壁２１ａと、該上壁２１ａの外周縁から下向きに延びる矩形筒状の側壁２１ｂと、該側壁２１ｂの下縁から外側に横向きに延びる鍔２１ｃとを有している。また、鍔２１ｃの下面視幅は、シールリング２３の上面視幅と略一致している。さらに、鍔２１ｃの下面は、シールリング２３の上面に導電材を介して電気的に接合されている。さらに、シールリング２３の下面は、後述する第２引出導体６０の第１導体部６１の上面に導電材を介して電気的に接合されている。   The cylindrical portion 21 includes a rectangular upper wall 21a in a top view, a rectangular cylindrical side wall 21b extending downward from the outer peripheral edge of the upper wall 21a, and a flange 21c extending laterally outward from the lower edge of the side wall 21b. And have. Further, the bottom view width of the flange 21c is substantially the same as the top view width of the seal ring 23. Furthermore, the lower surface of the flange 21c is electrically joined to the upper surface of the seal ring 23 via a conductive material. Furthermore, the lower surface of the seal ring 23 is electrically joined to the upper surface of the first conductor portion 61 of the second lead conductor 60 described later via a conductive material.

板状部２２は、上層２２ａ及び下層２２ｂを有する２層構造を有しており、シールリング２３を介して筒状部２１の下面開口を閉塞している。また、上層２２ａ及び下層２２ｂの４つの角には、上面視形状が１／４円形の切欠き２２ａ１及び２２ｂ１がそれぞれ形成されている。さらに、下層２２ｂにおける長さ方向で対向する２辺の中央には、各辺から内側に窪んだ凹所２２ｂ２が形成されている。   The plate-like portion 22 has a two-layer structure having an upper layer 22a and a lower layer 22b, and closes the lower surface opening of the tubular portion 21 via a seal ring 23. In addition, cutouts 22a1 and 22b1 whose top view shape is a quarter circle are formed at four corners of the upper layer 22a and the lower layer 22b, respectively. Furthermore, a recess 22b2 that is recessed inward from each side is formed at the center of the two sides facing each other in the length direction of the lower layer 22b.

各凹所２２ｂ２は、図５に示すように、窪み深さＤａが小さな部分（以下第１窪み部分Ｄａと言う）と、該第１窪み部分Ｄａの両側に存する窪み深さＤｂが大きな部分（以下第２窪み部分Ｄｂと言う）とを有している。また、各第１窪み部分Ｄａの幅Ｗａは、各凹所２２ｂ２の幅Ｗｂよりも小さい。   As shown in FIG. 5, each recess 22b2 includes a portion having a small recess depth Da (hereinafter referred to as a first recess portion Da) and a portion having a large recess depth Db on both sides of the first recess portion Da ( Hereinafter referred to as a second indented portion Db). Moreover, the width Wa of each 1st hollow part Da is smaller than the width Wb of each recessed part 22b2.

第１端子３０は、下面視形状が矩形で、板状部２２の下面（下層２２ｂの下面）の長さ方向一端部に設けられている。第２端子４０は、下面視形状が矩形で、第１端子３０との間に間隔が空くように板状部２２の下面（下層２２ｂの下面）の長さ方向他端部に設けられている。第１端子３０及び第２端子４０は、筒状部２１と同様に、コバール，アロイ，銅，アルミニウム，ステンレス，ニッケル，金等の金属から成る。   The first terminal 30 has a rectangular shape when viewed from the bottom, and is provided at one end in the length direction of the lower surface of the plate-like portion 22 (the lower surface of the lower layer 22b). The second terminal 40 has a rectangular shape when viewed from the bottom, and is provided at the other end in the length direction of the lower surface of the plate-like portion 22 (the lower surface of the lower layer 22b) so as to be spaced from the first terminal 30. . The first terminal 30 and the second terminal 40 are made of a metal such as kovar, alloy, copper, aluminum, stainless steel, nickel, gold, etc., like the cylindrical portion 21.

第１端子３０及び第２端子４０の一方には、極性を区別するための指標（図面では第１端子３０の１つの角に設けた切除箇所３０ａ）が設けられている。また、第１端子３０の外側縁は、板状部２２の下層２２ｂにおける一方の凹所２２ｂ２の第１窪み部分Ｄａに達していて、後述する第１引出導体５０の第３導体部５４の下縁と電気的に接続している。さらに、第２端子４０の外側縁は、板状部２２の下層２２ｂにおける他方の凹所２２ｂ２の第１窪み部分Ｄａに達していて、後述する第２引出導体６０の第４導体部６４の下縁と電気的に接続している。   One of the first terminal 30 and the second terminal 40 is provided with an index for distinguishing polarities (in the drawing, an excision location 30a provided at one corner of the first terminal 30). Further, the outer edge of the first terminal 30 reaches the first recessed portion Da of the one recess 22b2 in the lower layer 22b of the plate-like portion 22, and is below the third conductor portion 54 of the first lead conductor 50 described later. It is electrically connected to the rim. Furthermore, the outer edge of the second terminal 40 reaches the first recessed portion Da of the other recess 22b2 in the lower layer 22b of the plate-like portion 22, and is below the fourth conductor portion 64 of the second lead conductor 60 described later. It is electrically connected to the rim.

第１端子３０及び第２端子４０の外側縁を除く幅は、前記幅Ｗａよりも大きく、且つ、前記幅Ｗｂよりも小さい。また、第１端子３０及び第２端子４０の外側縁の幅は、前記幅Ｗａと略一致している。   The width of the first terminal 30 and the second terminal 40 excluding the outer edges is larger than the width Wa and smaller than the width Wb. The widths of the outer edges of the first terminal 30 and the second terminal 40 are substantially the same as the width Wa.

第１引出導体５０は、板状部２２の上層２２ａの上面中央に設けられ、且つ、上面視形状が矩形の第１導体部５１と、板状部２２の上層２２ａに設けられ、且つ、上面視形状が円形のビア導体部５２（上層２２ａの孔に導体を充填したもの）と、板状部２２の上層２２ａと下層２２ｂとの間に設けられ、且つ、上面視形状が略Ｔ字形の第２導体部５３と、板状部２２の下層２２ｂにおける一方の凹所２２ｂ２の第１窪み部分Ｄａの側壁に設けられた第３導体部５４とから構成されている。つまり、第１引出導体５０は、密封容器２０の板状部２２の厚さ方向に沿うビア導体部５２を有している。第１導体部５１，ビア導体部５２，第２導体部５３及び第３導体部５４は、筒状部２１と同様に、コバール，アロイ，銅，アルミニウム，ステンレス，ニッケル，金等の金属から成る。   The first lead conductor 50 is provided in the center of the upper surface 22a of the upper layer 22a of the plate-like portion 22, and is provided in the first conductor portion 51 whose upper surface shape is rectangular and the upper layer 22a of the plate-like portion 22, and the upper surface thereof. The via conductor portion 52 having a circular shape (provided with a conductor filled in the hole of the upper layer 22a) and the upper layer 22a and the lower layer 22b of the plate-like portion 22, and the upper surface shape having a substantially T-shape. The second conductor portion 53 and the third conductor portion 54 provided on the side wall of the first recess portion Da of the one recess 22b2 in the lower layer 22b of the plate-like portion 22 are configured. That is, the first lead conductor 50 has a via conductor portion 52 along the thickness direction of the plate-like portion 22 of the sealed container 20. The first conductor portion 51, the via conductor portion 52, the second conductor portion 53, and the third conductor portion 54 are made of a metal such as kovar, alloy, copper, aluminum, stainless steel, nickel, gold, etc., like the cylindrical portion 21. .

第１導体部５１の上面視形状は、蓄電素子１０の第１極性部１１の下面視形状と略一致している。また、第２導体部５３は、ビア導体部５２よりも直径が大きな円形部分５３ａと、該円形部分５３ａの外周縁と連続する長さ方向の帯状部分５３ｂと、該帯状部分５３ｂの端と連続し、且つ、一方の凹所２２ｂ２の第１窪み部分Ｄａに達する矩形部分５３ｃとを有している。さらに、矩形部分５３ｃの幅は、第３導体部５４の幅、つまり、前記幅Ｗａと略一致している。   The top view shape of the first conductor portion 51 substantially matches the bottom view shape of the first polarity portion 11 of the power storage element 10. The second conductor portion 53 is continuous with a circular portion 53a having a diameter larger than that of the via conductor portion 52, a longitudinal strip portion 53b continuous with the outer peripheral edge of the circular portion 53a, and an end of the strip portion 53b. And a rectangular portion 53c reaching the first hollow portion Da of the one recess 22b2. Furthermore, the width of the rectangular portion 53c substantially matches the width of the third conductor portion 54, that is, the width Wa.

第１導体部５１の下面はビア導体部５２の上面と電気的に接続し、該ビア導体部５２の下面は第２導体部５３の円形部分５３ａの上面と電気的に接続し、該第２導体５３の矩形部分５３ｃの外縁は第３導体部５４の上縁と電気的に接続している。即ち、密封容器２０に収容された蓄電素子１０の第１極性部１１は、第１引出導体５０を介して第１端子３０に電気的に接続されている。   The lower surface of the first conductor portion 51 is electrically connected to the upper surface of the via conductor portion 52, and the lower surface of the via conductor portion 52 is electrically connected to the upper surface of the circular portion 53 a of the second conductor portion 53, The outer edge of the rectangular portion 53 c of the conductor 53 is electrically connected to the upper edge of the third conductor portion 54. That is, the first polar part 11 of the electricity storage element 10 accommodated in the sealed container 20 is electrically connected to the first terminal 30 via the first lead conductor 50.

第２引出導体６０は、板状部２２の上層２２ａの上面外周に設けられ、且つ、上面視形状が矩形枠状の第１導体部６１と、板状部２２の上層２２ａにおける２つの切欠き２２ａ１の内側面に設けられた第２導体部６２と、板状部２２の上層２２ａと下層２２ｂとの間に設けられ、且つ、上面視形状が略Ｔ字形の第３導体部６３と、板状部２２の下層２２ｂにおける他方の凹所２２ｂ２の第１窪み部分Ｄａの側壁に設けられた第４導体部６４とから構成されている。第１導体部６１，第２導体部６２，第３導体部６３及び第４導体部６４は、筒状部２１と同様に、コバール，アロイ，銅，アルミニウム，ステンレス，ニッケル，金等の金属から成る。   The second lead conductor 60 is provided on the upper surface outer periphery of the upper layer 22a of the plate-like portion 22, and the first conductor portion 61 whose top view shape is a rectangular frame shape, and two notches in the upper layer 22a of the plate-like portion 22. A second conductor portion 62 provided on the inner surface of 22a1, a third conductor portion 63 provided between the upper layer 22a and the lower layer 22b of the plate-like portion 22 and having a substantially T-shaped top view, and a plate It is comprised from the 4th conductor part 64 provided in the side wall of 1st hollow part Da of the other recessed part 22b2 in the lower layer 22b of the shape part 22. FIG. The first conductor portion 61, the second conductor portion 62, the third conductor portion 63, and the fourth conductor portion 64 are made of a metal such as kovar, alloy, copper, aluminum, stainless steel, nickel, gold, and the like, like the cylindrical portion 21. Become.

第１導体部６１の上面視幅は、シールリング２３の上面視幅と略一致している。また、第３導体部６３は、第２導体部６２が設けられた切欠き２２ｂに沿う２つの円弧部分６３と、両円弧部分６３を結ぶ幅方向の帯状部分６３ｂと、該帯状部分６３ｂの中央と連続し、且つ、他方の凹所２２ｂ２の第１窪み部分Ｄａに達する矩形部分６３ｃとを有している。さらに、矩形部分６３ｃの幅は、第４導体部６４の幅、つまり、前記幅Ｗａと略一致している。   The top view width of the first conductor portion 61 is substantially the same as the top view width of the seal ring 23. The third conductor portion 63 includes two arc portions 63 along the notch 22b in which the second conductor portion 62 is provided, a band-shaped portion 63b in the width direction connecting both arc portions 63, and the center of the band-shaped portion 63b. And a rectangular portion 63c that reaches the first hollow portion Da of the other recess 22b2. Further, the width of the rectangular portion 63c substantially matches the width of the fourth conductor portion 64, that is, the width Wa.

第１導体部６１の切欠き２２ａ１に沿う部分は各第２導体部６２の上端と電気的に接続し、該各第２導体部６２の下端は第３導体部６３の各円弧部分６３の外縁と電気的に接続し、該第３導体６３の矩形部分６３ｃの外縁は第４導体部６４の上縁と電気的に接続している。即ち、密封容器２０に収容された蓄電素子１０の第２極性部１２は、密封容器２０の筒状部２１及びシールリング２３と第２引出導体６０を介して第２端子４０に電気的に接続されている。   The portion along the notch 22 a 1 of the first conductor portion 61 is electrically connected to the upper end of each second conductor portion 62, and the lower end of each second conductor portion 62 is the outer edge of each arc portion 63 of the third conductor portion 63. The outer edge of the rectangular portion 63 c of the third conductor 63 is electrically connected to the upper edge of the fourth conductor portion 64. That is, the second polar part 12 of the electricity storage device 10 accommodated in the sealed container 20 is electrically connected to the second terminal 40 via the cylindrical part 21 and the seal ring 23 of the sealed container 20 and the second lead conductor 60. Has been.

前記ＰＡＳキャパシタをリフロー半田付けによって回路基板等の実装相手に対して表面実装するとき、クリーム半田を予め塗布した金属パッド等の被接続箇所に第１端子３０及び第２端子４０が接触するようにＰＡＳキャパシタを実装相手に搭載し、搭載後のものをリフロー炉に投入して所期の半田付けを行う。 When paired with a surface mounted said PAS capacitor implementation partner such as a circuit board by reflow soldering, so that the first terminal 30 and second terminal 40 is in contact with the connection portion such as a pre-coated metal pads cream solder The PAS capacitor is mounted on the mounting partner, and the mounted one is put into a reflow furnace to perform the desired soldering.

ここで、図２，図４，図６及び図７を参照して、密封容器２０の板状部２２（上層２２ａ）に設けられた第１引出導体５０のビア導体部５２の位置について説明する。   Here, the position of the via conductor portion 52 of the first lead conductor 50 provided on the plate-like portion 22 (upper layer 22a) of the sealed container 20 will be described with reference to FIGS. .

密封容器２０はリフロー半田付け時の温度変化や実装後の温度変化等に伴って熱膨張収縮する。密封容器２０の板状部２２は筒状部２１及びシールリング２３と別部品であり、しかも、筒状部２１及びシールリング２３と異材質であることから、該板状部２２の熱膨張収縮の挙動は筒状部２１及びシールリング２３と異なったものとなる。また、板状部２２のビア導体部５２が設けられた部分は、孔によって連続性が断たれているために他の部分に比べて強度が低下する。   The sealed container 20 expands and contracts due to a temperature change during reflow soldering, a temperature change after mounting, and the like. Since the plate-like portion 22 of the sealed container 20 is a separate part from the tubular portion 21 and the seal ring 23 and is made of a different material from the tubular portion 21 and the seal ring 23, the thermal expansion and contraction of the plate-like portion 22 is performed. This behavior is different from that of the cylindrical portion 21 and the seal ring 23. Further, the portion of the plate-like portion 22 provided with the via conductor portion 52 has a lower strength than other portions because the continuity is cut off by the holes.

前記熱膨張収縮に基づいて生じる応力は板状部２２の中心ＣＴ（図４参照）に最も集中し易いため、ビア導体部５２の位置が板状部２２の中心ＣＴと一致している場合は、該板状部２２のビア導体部５２が設けられた部分が該応力集中によって破損する恐れがある。   Since the stress generated based on the thermal expansion and contraction is most easily concentrated at the center CT (see FIG. 4) of the plate-like portion 22, when the position of the via conductor portion 52 coincides with the center CT of the plate-like portion 22. The portion of the plate-like portion 22 provided with the via conductor portion 52 may be damaged by the stress concentration.

この破損を回避するため、図２及び図４に示すように、ビア導体部５２を板状部２２の中心ＣＴからずれた位置に設けている。具体的には、ビア導体部５２を、その中心が板状部２２の中心ＣＴに対して長さ方向にＬｘだけずれ、且つ、幅方向にＬｙだけずれるように設けている。   In order to avoid this damage, the via conductor portion 52 is provided at a position shifted from the center CT of the plate-like portion 22 as shown in FIGS. Specifically, the via conductor portion 52 is provided such that the center thereof is shifted by Lx in the length direction and by Ly in the width direction with respect to the center CT of the plate-like portion 22.

また、前記熱膨張収縮に基づいて生じる応力値は、図６に示す第１〜第４仮想ラインＬ１〜Ｌ４上で高値となる傾向があるため、ビア導体部５２はこれら仮想ラインＬ１〜Ｌ４のそれぞれから外れるように位置させたほうが前記破損の恐れを回避する上で好ましい。因みに、第１仮想ラインＬ１は板状部２２の幅方向で相対する２辺の中央を通るライン、第２仮想ラインＬ２は板状部２２の他の２辺の中央を通るライン、第３仮想ラインＬ３は板状部２２の相対する２角の頂点（切欠き２２ａ１及び２２ｂ１があるためここでは仮想頂点）を通るライン、第４仮想ラインＬ４は板状部２２の他の２角の頂点（切欠き２２ａ１及び２２ｂ１があるためここでは仮想頂点）を通るラインである。 Moreover, since the stress value produced based on the said thermal expansion and contraction tends to become a high value on the 1st-4th virtual lines L1-L4 shown in FIG. 6, the via conductor part 52 of these virtual lines L1-L4 In order to avoid the risk of breakage, it is preferable to position them so as to be separated from each other. Incidentally, the first virtual line L1 is a line passing through the center of the two opposite sides in the width direction of the plate-like portion 22, the second virtual line L2 is a line passing through the center of the other two sides of the plate-like portion 22, and the third virtual line The line L3 is a line passing through the opposite two corner vertices of the plate-like portion 22 (the virtual vertices here because of the cutouts 22a1 and 22b1), and the fourth virtual line L4 is the other two corner vertices ( Since the notches 22a1 and 22b1 are present, the line passes through the virtual vertex).

さらに、前記第３，第４仮想ラインＬ３及びＬ４と直交するラインで切断したときの板状部２２の縦断面積は角に向かうに従って徐々に小さくなるため、該第３，第４仮想ラインＬ３及びＬ４に沿う応力を考えると角に近づくほど耐破損に不利となる。つまり、図６に示す第５〜第８仮想ラインＬ５〜Ｌ８によって画成される仮想矩形領域（第５〜第８仮想ラインＬ５〜Ｌ８を含む）の外側領域は前記縦断面積が小さく、且つ、耐破損に不利な領域であるため、ビア導体部５２は該仮想矩形領域の内側（第５〜第８仮想ラインＬ５〜Ｌ８を含まない）に位置させたほうが前記破損の恐れを回避する上で好ましい。因みに、第５仮想ラインＬ５は板状部２２の幅方向の１辺と第１仮想ラインＬ１が交差する点と板状部２２の長さ方向の１辺と第２仮想ラインＬ２が交差する点とを通るライン、第６仮想ラインＬ６は板状部２２の長さ方向の１辺と第２仮想ラインＬ２が交差する点と板状部２２の幅方向の他辺と第１仮想ラインＬ１が交差する点とを通るライン、第７仮想ラインＬ７は板状部２２の幅方向の他辺と第１仮想ラインＬ１が交差する点と板状部２２の長さ方向の他辺と第２仮想ラインＬ２が交差する点とを通るライン、第８仮想ラインＬ８は板状部２２の長さ方向の他辺と第２仮想ラインＬ２が交差する点と板状部２２の幅方向の１辺と第１仮想ラインＬ１が交差する点とを通るラインである。   Furthermore, since the longitudinal cross-sectional area of the plate-like portion 22 when it is cut along a line orthogonal to the third and fourth virtual lines L3 and L4 gradually decreases toward the corner, the third and fourth virtual lines L3 and L3 Considering the stress along L4, the closer to the corner, the more disadvantageous to damage resistance. That is, the outer area of the virtual rectangular area (including the fifth to eighth virtual lines L5 to L8) defined by the fifth to eighth virtual lines L5 to L8 shown in FIG. Since the via conductor portion 52 is located inside the virtual rectangular area (not including the fifth to eighth virtual lines L5 to L8) in order to avoid the possibility of the damage because it is a disadvantageous area for damage resistance. preferable. Incidentally, the fifth virtual line L5 is a point where one side in the width direction of the plate-like portion 22 and the first virtual line L1 intersect, and one side in the length direction of the plate-like portion 22 and a second virtual line L2. The sixth virtual line L6 is a point where one side in the length direction of the plate-like portion 22 and the second virtual line L2 intersect, the other side in the width direction of the plate-like portion 22 and the first virtual line L1. A line passing through the intersecting point, the seventh virtual line L7, is a point where the other side in the width direction of the plate-like part 22 intersects with the first virtual line L1, another side in the length direction of the plate-like part 22, and the second virtual line. A line passing through the point where the line L2 intersects, the eighth virtual line L8 is the other side in the length direction of the plate-like part 22, the point where the second virtual line L2 intersects and one side in the width direction of the plate-like part 22 This is a line that passes through the point where the first virtual line L1 intersects.

さらに、ビア導体部５２の位置が板状部２２の中心ＣＴから遠くなると、該中心ＣＴとビア導体部５２との距離に依存して蓄電素子１０の充放電能力にバラツキが生じる恐れがあるため、ビア導体部５２は板状部２２の中心ＣＴに近付けたほうが好ましい。   Furthermore, if the position of the via conductor portion 52 is far from the center CT of the plate-like portion 22, there is a possibility that the charge / discharge capability of the power storage element 10 may vary depending on the distance between the center CT and the via conductor portion 52. The via conductor portion 52 is preferably close to the center CT of the plate-like portion 22.

さらに、図４及び図５には第１接続導体５３の帯状部分５３ｂの長さを短くするためにビア導体部５２を図４中における板状部２２の中心ＣＴの右側に位置させたが、図７に示すように、ビア導体部５２を図７中における板状部２２の中心ＣＴの左側に位置させたような第１接続導体５３’の形態を採用しても良い。図７に示した第１接続導体５３’にあっては帯状部分５３ｂ’の長さが図４及び図５に示した第１接続導体５３の帯状部分５３ｂの長さよりも長くなるが、該帯状部分５３ｂ’の長さ方向及び幅方向の寸法比率を帯状部分５３ｂのそれと同じにすれば両帯状部分５３ｂ及び５３ｂ’の抵抗値を同じにすることができる。   Further, in FIGS. 4 and 5, the via conductor portion 52 is positioned on the right side of the center CT of the plate-like portion 22 in FIG. 4 in order to shorten the length of the band-like portion 53 b of the first connection conductor 53. As shown in FIG. 7, a form of a first connection conductor 53 ′ in which the via conductor portion 52 is positioned on the left side of the center CT of the plate-like portion 22 in FIG. 7 may be adopted. In the first connection conductor 53 ′ shown in FIG. 7, the length of the band-like portion 53b ′ is longer than the length of the band-like portion 53b of the first connection conductor 53 shown in FIG. 4 and FIG. If the dimensional ratio in the length direction and the width direction of the portion 53b ′ is made the same as that of the strip portion 53b, the resistance values of both the strip portions 53b and 53b ′ can be made the same.

換言すれば、第１接続導体５３及び５３’の帯状部分５３ｂ及び５３ｂ’は、前記ＰＡＳキャパシタのＥＳＲ（等価直列抵抗）の調整に利用できることになる。このＥＳＲの調整には、帯状部分５３ｂ及び５３ｂ’の長さ方向及び幅方向の寸法を可変する手法の他、帯状部分５３ｂ及び５３ｂ’を非直線形、例えばコ字形やＶ字形やＵ字形等として長さ方向の寸法を変えずに導電経路長を可変する手法が採用できる。   In other words, the strip portions 53b and 53b 'of the first connection conductors 53 and 53' can be used for adjusting the ESR (equivalent series resistance) of the PAS capacitor. For adjusting the ESR, in addition to the method of changing the length and width dimensions of the strip portions 53b and 53b ′, the strip portions 53b and 53b ′ are non-linear, for example, U-shaped, V-shaped, U-shaped, etc. For example, a method of varying the conductive path length without changing the dimension in the length direction can be adopted.

このように、前述のＰＡＳキャパシタにあっては、第１引出導体５０は板状部２２（上層２２ａ）の厚さ方向に沿うビア導体部５２を有していて、該ビア導体部５２は板状部２２の中心からずれた位置に設けられている。つまり、ビア導体部５２は、リフロー半田付け時の温度変化や実装後の温度変化等に伴う熱膨張収縮に基づいて生じる応力が集中し易い板状部２２の中心ＣＴを避けて設けられているので、該熱膨張収縮に基づいて生じる応力が板状部２２に加わっても、該板状部２２のビア導体部５２が設けられた部分が該応力によって破損する恐れを確実に回避することができる。これにより、第１引出導体５０にビア導体部５２を用いた場合でも、該ビア導体部５２が設けられた部分がリフロー半田付け時の温度変化や実装後の温度変化等に伴う熱膨張収縮に基づいて生じる応力によって破損することを防止できるＰＡＳキャパシタを提供することができる。   Thus, in the above-described PAS capacitor, the first lead conductor 50 has the via conductor portion 52 along the thickness direction of the plate-like portion 22 (upper layer 22a), and the via conductor portion 52 is a plate. It is provided at a position shifted from the center of the shape portion 22. That is, the via conductor portion 52 is provided avoiding the center CT of the plate-like portion 22 where stress generated due to thermal expansion and contraction due to temperature change during reflow soldering, temperature change after mounting, and the like tends to concentrate. Therefore, even if the stress generated based on the thermal expansion and contraction is applied to the plate-like portion 22, it is possible to reliably avoid the possibility that the portion provided with the via conductor portion 52 of the plate-like portion 22 is damaged by the stress. it can. As a result, even when the via conductor portion 52 is used for the first lead conductor 50, the portion where the via conductor portion 52 is provided is subject to thermal expansion and contraction due to a temperature change during reflow soldering, a temperature change after mounting, and the like. It is possible to provide a PAS capacitor that can be prevented from being damaged by the stress generated on the basis thereof.

また、ビア導体部５２は、板状部２２の相対する２辺の中央を通る第１仮想ラインＬ１と、板状部２２の他の２辺の中央を通る第２仮想ラインＬ２と、板状部２２の相対する２角の頂点を通る第３仮想ラインＬ３と、板状部２２の他の２角の頂点を通る第４仮想ラインＬ４のそれぞれから外れて位置している。つまり、前記熱膨張収縮により生じる応力値は第１〜第４仮想ラインＬ１〜Ｌ４上で高値となる傾向があるため、ビア導体部５２の位置をこれら仮想ラインＬ１〜Ｌ４のそれぞれから外れるように位置させることによって、板状部２２のビア導体部５２が設けられた部分が前記熱膨張収縮に基づいて生じる応力によって破損する恐れをより一層確実に回避することができる。 The via conductor portion 52 includes a first virtual line L1 that passes through the center of two opposite sides of the plate-like portion 22, a second virtual line L2 that passes through the center of the other two sides of the plate-like portion 22, and a plate-like shape. a third virtual line L3 that passes through the apex of the two opposite corners of the parts 22 are located off the respective fourth imaginary line L4 passing through the vertex of the other two corners of the plate portion 2 2. That is, since the stress value generated by the thermal expansion and contraction tends to be high on the first to fourth virtual lines L1 to L4, the position of the via conductor portion 52 is deviated from each of these virtual lines L1 to L4. By positioning, it is possible to more reliably avoid the possibility that the portion of the plate-like portion 22 provided with the via conductor portion 52 is damaged by the stress generated based on the thermal expansion and contraction.

さらに、ビア導体部５２は、板状部２２の相対する２辺と第１仮想ラインＬ１が交差する２つの点と他の２辺と第２仮想ラインが交差する２つの点とを順に通る第５〜第８仮想ラインＬ５〜Ｌ８によって画成された仮想矩形領域の内側に位置している。つまり、第３，第４仮想ラインＬ３及びＬ４と直交するラインで切断したときの板状部２２の縦断面積は角に向かうに従って徐々に小さくなることから、第５〜第８仮想ラインＬ５〜Ｌ８によって画成される仮想矩形領域（第５〜第８仮想ラインＬ５〜Ｌ８を含む）の外側領域は前記縦断面積が小さく、且つ、耐破損に不利な領域であるため、ビア導体部５２は該仮想矩形領域の内側（第５〜第８仮想ラインＬ５〜Ｌ８を含まない）に位置させることによって、板状部２２のビア導体部５２が設けられた部分が前記熱膨張収縮に基づいて生じる応力によって破損する恐れをより一層確実に回避することができる。   Further, the via conductor portion 52 passes through two points where the opposite two sides of the plate-like portion 22 and the first virtual line L1 intersect, and two points where the other two sides intersect the second virtual line in order. It is located inside the virtual rectangular area defined by the fifth to eighth virtual lines L5 to L8. That is, since the longitudinal cross-sectional area of the plate-like portion 22 when it is cut along a line orthogonal to the third and fourth virtual lines L3 and L4 gradually decreases toward the corner, the fifth to eighth virtual lines L5 to L8. Since the outer area of the virtual rectangular area defined by (including the fifth to eighth virtual lines L5 to L8) has a small vertical cross-sectional area and is disadvantageous for damage resistance, the via conductor portion 52 is Stress caused by positioning the via conductor portion 52 of the plate-like portion 22 based on the thermal expansion and contraction by being positioned inside the virtual rectangular region (not including the fifth to eighth virtual lines L5 to L8) The risk of breakage can be avoided more reliably.

さらに、板状部２２（仮想２２ｂ）の長さ方向で対向する２辺の中央に各辺から内側に窪んだ凹所２２ｂ２が形成され、各凹所２２ｂ２は窪み深さが小さな第１窪み部分Ｄａとと、該第１窪み部分Ｄａの両側に存する窪み深さが大きな第２窪み部分Ｄｂとを有している。また、第１端子３０の外側縁は一方の凹所２２ｂ２の第１窪み部分Ｄａに達していて、第１引出導体５０の第３導体部５４の下縁と電気的に接続し、一方、第２端子４０の外側縁は他方の凹所２２ｂ２の第１窪み部分Ｄａに達していて、第２引出導体６０の第４導体部６４の下縁と電気的に接続している。つまり、前記ＰＡＳキャパシタをリフロー半田付けによって回路基板等の実装相手に対する表面実装するときに、第１端子３０及び第４端子４０の外側縁両側に存する第２窪み部分Ｄｂをクリーム半田に含まれるフラックスの抜け道として利用することができるので、リフロー半田付け時に半田内にフラックスが残留し該残留フラックスの蒸発による気泡が半田内に残存して半田付け不良を生じる恐れを回避することができる。   Furthermore, a recess 22b2 that is recessed inward from each side is formed at the center of two sides facing each other in the length direction of the plate-like portion 22 (virtual 22b), and each recess 22b2 is a first recess portion having a small recess depth. Da and the 2nd hollow part Db with the large hollow depth which exists in the both sides of this 1st hollow part Da are provided. Further, the outer edge of the first terminal 30 reaches the first recessed portion Da of the one recess 22b2, and is electrically connected to the lower edge of the third conductor portion 54 of the first lead conductor 50, The outer edge of the two terminals 40 reaches the first recessed portion Da of the other recess 22b2 and is electrically connected to the lower edge of the fourth conductor portion 64 of the second lead conductor 60. That is, when the PAS capacitor is surface-mounted to a mounting partner such as a circuit board by reflow soldering, the flux contained in the cream solder with the second recessed portions Db existing on both outer edges of the first terminal 30 and the fourth terminal 40. Therefore, it is possible to avoid the possibility that a flux remains in the solder during reflow soldering and bubbles due to evaporation of the residual flux remain in the solder, resulting in poor soldering.

次に、図面に示した構造の電気化学デバイスを角型のリチウムイオンキャパシタとして用いた場合について説明する。   Next, the case where the electrochemical device having the structure shown in the drawings is used as a rectangular lithium ion capacitor will be described.

このリチウムイオンキャパシタは、図１〜図５に示すように、電解液を含浸した蓄電素子１０と、該蓄電素子１０を収容した密封容器２０と、該密封容器２０の下面に設けられた第１端子３０及び第２端子４０と、蓄電素子１０と第１端子３０とを電気的に接続する第１引出導体５０と、蓄電素子１０と第２端子４０とを第２引出導体６０とを具備している。   As shown in FIGS. 1 to 5, the lithium ion capacitor includes a power storage element 10 impregnated with an electrolyte, a sealed container 20 containing the power storage element 10, and a first surface provided on the lower surface of the sealed container 20. The terminal 30 and the second terminal 40, the first lead conductor 50 that electrically connects the power storage element 10 and the first terminal 30, and the second lead conductor 60 that includes the power storage element 10 and the second terminal 40 are provided. ing.

蓄電素子１０は、上面視形状が矩形の第１極性部１１及び第２極性部１２と、第１極性部１１と第２極性部１２との間に介装された上面視形状が矩形のセパレータ１３とから構成されている。第１極性部１１を陽極とし第２極性部１２を陰極とする場合、第１極性部１１は活性炭を主成分とした材料から成り、第２極性部１２はリチウムイオンを吸蔵可能な炭素材料を主成分とした材料から成っていて予め所定量のリチウムイオンがドーピングされた状態（リチウムプレドーピング）にある。このリチウムプレドーピングは、第２極性部１２の表面に所定量の金属リチウムを接触させた状態で電解液を含浸させることにより進行し、全ての金属リチウムがリチウムイオンとなって第２極性部１２内にドーピングされた時点で終了する。セパレータ１３は高イオン透過度を有する材料、例えばガラス繊維，セルロース，レーヨン等の繊維系材料や、ポリプロピレン，ポリエチレン，ポリアミド，ポリイミド等の合成樹脂材料や、その他の材料から成る。   The electrical storage element 10 includes a first polar part 11 and a second polar part 12 having a rectangular top view shape, and a separator having a rectangular top view interposed between the first polar part 11 and the second polar part 12. 13. When the first polar part 11 is an anode and the second polar part 12 is a cathode, the first polar part 11 is made of a material mainly composed of activated carbon, and the second polar part 12 is made of a carbon material that can store lithium ions. It is made of a material having a main component and is in a state in which a predetermined amount of lithium ions is doped in advance (lithium pre-doping). This lithium pre-doping proceeds by impregnating the electrolytic solution in a state where a predetermined amount of metallic lithium is in contact with the surface of the second polar portion 12, and all the metallic lithium becomes lithium ions to form the second polar portion 12. It ends when it is doped inside. The separator 13 is made of a material having a high ion permeability, for example, a fiber material such as glass fiber, cellulose, or rayon, a synthetic resin material such as polypropylene, polyethylene, polyamide, or polyimide, or other materials.

第１極性部１１の下面は、第１引出導体５０の第１導体部５１の上面に導電材を介して電気的に接合されている。また、第２極性部１２の上面は、密封容器２０の筒状部２１の上壁２１ａの下面に導電材を介して電気的に接合されている。さらに、第１極性部１１，第２極性部１２及びセパレータ１３には、プロピレンカーボネート等の溶媒に硼弗化リチウム等のリチウム電解質塩を所定濃度で溶解して成る電解液が含浸されている。   The lower surface of the first polar part 11 is electrically joined to the upper surface of the first conductor part 51 of the first lead conductor 50 via a conductive material. Further, the upper surface of the second polar part 12 is electrically joined to the lower surface of the upper wall 21a of the cylindrical part 21 of the sealed container 20 via a conductive material. Further, the first polar part 11, the second polar part 12 and the separator 13 are impregnated with an electrolytic solution obtained by dissolving a lithium electrolyte salt such as lithium borofluoride at a predetermined concentration in a solvent such as propylene carbonate.

このリチウムイオンキャパシタにおける他の構成は先に述べたＰＡＳキャパシタと同じであるのでその説明を省略する。また、このリチウムイオンキャパシタで得られる作用，効果は先に述べたＰＡＳキャパシタと同じであるのでその説明を省略する。   Since the other configuration of this lithium ion capacitor is the same as that of the PAS capacitor described above, its description is omitted. Further, since the operations and effects obtained with this lithium ion capacitor are the same as those of the PAS capacitor described above, description thereof is omitted.

以上、図面に示した構造の電気化学デバイスをＰＡＳキャパシタとして用いた場合とリチウムイオンキャパシタとして用いた場合とについて説明したが、図面に示した構造の電気化学デバイスを前記ＰＡＳキャパシタ以外の電気二重層キャパシタとして用いた場合や前記リチウムイオンキャパシタ以外のレドックスキャパシタとして用いた場合でも前記同様の作用，効果を得ることができる。   Although the case where the electrochemical device having the structure shown in the drawing is used as a PAS capacitor and the case where it is used as a lithium ion capacitor has been described above, the electrochemical device having the structure shown in the drawing is used as an electric double layer other than the PAS capacitor. Even when used as a capacitor or as a redox capacitor other than the lithium ion capacitor, the same operation and effect as described above can be obtained.

また、本発明は図面に示した構造に限定されるものではなく、特許請求の範囲に包含される構造の電気化学デバイスであれば、例えば端子及び引出導体を２対以上備える電気二重層キャパシタ及びレドックスキャパシタ等や、電気二重層キャパシタ及びレドックスキャパシタと種類が異なるリチウムイオン電池等の電池等にも適用可能であり、該適用によって前記同様の作用，効果を得ることができる。要するに、本発明は、蓄電または発電が可能な電気化学素子を収容した密封容器の下面に少なくとも１対の端子を有し、且つ、電気化学素子と各端子とを電気的に接続する少なくとも１対の引出導体を有する電気化学デバイスに広く適用可能であり、該適用によって前記同様の作用，効果を得ることができる。   In addition, the present invention is not limited to the structure shown in the drawings. For example, an electric double layer capacitor having two or more pairs of terminals and lead conductors can be used as long as it is an electrochemical device having a structure included in the claims. The present invention can also be applied to a redox capacitor or the like, a battery such as an electric double layer capacitor and a lithium ion battery having a different kind from the redox capacitor, and the like. In short, the present invention has at least one pair of terminals on the lower surface of a sealed container containing an electrochemical element capable of storing or generating electricity, and at least one pair for electrically connecting the electrochemical element and each terminal. The present invention can be widely applied to electrochemical devices having a lead conductor, and the application can provide the same operations and effects as described above.

本発明に係る電気化学デバイスの上面図である。1 is a top view of an electrochemical device according to the present invention. 図１のｘ１−ｘ１線に沿う断面図である。It is sectional drawing which follows the x1-x1 line | wire of FIG. 図１に示した電気化学デバイスの下面図である。It is a bottom view of the electrochemical device shown in FIG. 図１から蓄電素子，筒状部及びシールリングを除外した図である。It is the figure which excluded the electrical storage element, the cylindrical part, and the seal ring from FIG. 図４から板状部の上層を除外した図である。It is the figure which excluded the upper layer of the plate-shaped part from FIG. 図２及び図４に示したビア導体部の位置を説明するための図である。FIG. 5 is a diagram for explaining the positions of via conductor portions shown in FIGS. 2 and 4. 図２及び図４に示したビア導体部の位置の変形例を示す図である。FIG. 5 is a diagram illustrating a modified example of the position of the via conductor portion illustrated in FIGS. 2 and 4.

符号の説明Explanation of symbols

１０…発電素子、１１…第１極性部、１２…第２極性部、１３…セパレータ、２０…密閉容器、２１…筒状部、２２…板状部、２３…シールリング、３０…第１端子、４０…第２端子、５０…第１引出導体、５１…第１導体部、５２…ビア導体部、５３，５３’…第２導体部、５４…第３導体部、６０…第２引出導体、６１…第１導体部、６２…第２導体部、６３…第３導体部、６４…第４導体部。   DESCRIPTION OF SYMBOLS 10 ... Power generation element, 11 ... 1st polarity part, 12 ... 2nd polarity part, 13 ... Separator, 20 ... Sealed container, 21 ... Cylindrical part, 22 ... Plate-like part, 23 ... Seal ring, 30 ... 1st terminal , 40 ... second terminal, 50 ... first lead conductor, 51 ... first conductor portion, 52 ... via conductor portion, 53, 53 '... second conductor portion, 54 ... third conductor portion, 60 ... second lead conductor 61 ... 1st conductor part, 62 ... 2nd conductor part, 63 ... 3rd conductor part, 64 ... 4th conductor part.

Claims (2)

蓄電または発電が可能な電気化学素子を収容した密封容器の下面に少なくとも１対の端子を有し、且つ、前記電気化学素子と前記各端子とを電気的に接続する少なくとも１対の引出導体を有する電気化学デバイスであって、
前記密封容器は、金属製の筒状部と、金属製のシールリングを介して前記筒状部の下端開口を閉塞する非金属製の板状部とから構成されており、
前記各引出導体の少なくとも１つは前記板状部の厚さ方向に沿うビア導体部を有していて、該ビア導体部は前記板状部の中心からずれた位置に設けられており、
前記板状部は上面視形状が矩形であり、
前記ビア導体部は、前記板状部の相対する２辺の中央を通る第１仮想ラインと、前記板状部の他の２辺の中央を通る第２仮想ラインと、前記板状部の相対する２角の頂点を通る第３仮想ラインと、前記板状部の他の２角の頂点を通る第４仮想ラインのそれぞれから外れて位置している、
ことを特徴とする電気化学デバイス。 At least one pair of terminals on the lower surface of the sealed container containing an electrochemical device capable of power storage or generator, and, at least one pair of the lead conductor which electrically connects the electrochemical element wherein the respective terminals An electrochemical device comprising:
The sealed container comprises a metallic tubular portion, which is composed of a non-metallic plate portion for closing the lower end opening of the cylindrical portion via a metal seal ring,
Wherein at least one of the lead conductors have a via conductor portions along the thickness direction of said plate-like portion, the via conductor unit is provided at a position displaced from the center of said plate-like portion,
The plate-like portion has a rectangular shape when viewed from above,
The via conductor portion includes a first virtual line that passes through the center of two opposite sides of the plate-like portion, a second virtual line that passes through the center of the other two sides of the plate-like portion, and a relative relationship between the plate-like portions. The third virtual line that passes through the two vertexes and the fourth virtual line that passes through the other two vertexes of the plate-like part.
An electrochemical device characterized by that . 前記ビア導体部は、前記板状部の相対する２辺と前記第１仮想ラインが交差する２つの点と前記板状部の他の２辺と前記第２仮想ラインが交差する２つの点とを順に通る第５〜第８仮想ラインによって画成された仮想矩形領域の内側に位置している、
ことを特徴とする請求項１に記載の電気化学デバイス。。 The via conductor section, two points and the other two sides and the second imaginary lines of the plate-like portion and the two points where the the two opposed sides of the plate-like portion first virtual line intersects intersect is located inside of a virtual rectangular region defined by the first through eighth imaginary line through the sequentially,
The electrochemical device according to claim 1 . .
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