JP5105391B2 - Polishing pad - Google Patents

Polishing pad Download PDF

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JP5105391B2
JP5105391B2 JP2005174827A JP2005174827A JP5105391B2 JP 5105391 B2 JP5105391 B2 JP 5105391B2 JP 2005174827 A JP2005174827 A JP 2005174827A JP 2005174827 A JP2005174827 A JP 2005174827A JP 5105391 B2 JP5105391 B2 JP 5105391B2
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hole
polishing pad
polishing
scratches
slurry
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JP2006346798A (en
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智之 戸田
真一 羽場
豊治 杉田
光一 吉田
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Nitta DuPont Inc
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Nitta Haas Inc
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Description

本発明は、シリコンウエハ等の半導体基板、ガラス、アルミディスク等の被研磨物の研磨に使用する研磨パッドに関する。   The present invention relates to a polishing pad used for polishing an object to be polished such as a semiconductor substrate such as a silicon wafer, glass or an aluminum disk.

半導体ウエハの精密研磨に用いられる研磨パッドとしては不織布にウレタン樹脂を含浸し、湿式凝固させて製造される多孔質ウレタンパッド、ウレタン樹脂を発泡させて得られる発泡ポリウレタンパッド、微小中空球体をウレタン樹脂に含有させた硬質ポリウレタンパッドが知られている。多孔質ウレタンパッドとしてはニッタ・ハース社製のＳＵＢＡシリーズ等があり、独立発泡ポリウレタンパッドとしてはニッタ・ハース社製のＭＨシリーズがあり、また、硬質ウレタンパッドとしてはニッタ・ハース社製のＩＣシリーズ等がある。   Polishing pads used for precision polishing of semiconductor wafers include porous urethane pads produced by impregnating urethane resin into a nonwoven fabric and wet coagulating, foamed polyurethane pads obtained by foaming urethane resin, and micro hollow spheres made of urethane resin Hard polyurethane pads contained in are known. Porous urethane pads include SUBA series manufactured by Nitta Haas, etc., independent foamed polyurethane pads include MH series manufactured by Nitta Haas, and hard urethane pads as IC series manufactured by Nitta Haas. Etc.

これらの研磨パッドにおいては、溝加工や孔加工を施して、研磨レートを向上させることや、研磨加工を行う際の研磨スラリーの保持性能を高めることや、過剰の研磨スラリーを排除することが多くなされている。   In these polishing pads, groove processing and hole processing are performed to improve the polishing rate, to increase the holding performance of the polishing slurry during polishing processing, and to eliminate excessive polishing slurry in many cases. Has been made.

孔加工を施した研磨パッドの例としては特許文献１が知られている。特許文献１の研磨パッドは外周に近い第１の領域と外周から離れた第２の領域とからなっており、後者は前者に比べて複数の開口部もしくはそれより大きい平均気孔を有することを特徴とする。その目的は基材の研磨均一性を改善することにある。また、複数のスラリー導入用の貫通孔と複数のスラリー供給用の貫通孔とを設けた上層研磨パッドと、スラリー導入部とスラリー通路用溝部を設けた下層研磨パッドとを積層した積層研磨パッドを用いてＣＭＰ(化学的機械研磨)を行う例が特許文献２で知られている。特許文献２では、その目的はスクラッチの原因となるスラリーの凝固を防ぎ被加工物の面内均一性を向上させることにある。さらに、研磨パッドに長孔の貫通孔を複数設けることにより、研磨後に被加工物を取り除くことを容易にすると共に、研磨パッドが摩耗しても従来知られている溝加工を施したパッドと比較して長孔がなくなることが無いのでパッド寿命が延びる、その結果製造コストを低減できるとしている例も特許文献３で知られている。   Patent Document 1 is known as an example of a polishing pad subjected to hole machining. The polishing pad of Patent Document 1 includes a first region close to the outer periphery and a second region separated from the outer periphery, and the latter has a plurality of openings or larger average pores than the former. And The purpose is to improve the polishing uniformity of the substrate. Also, a laminated polishing pad in which an upper layer polishing pad provided with a plurality of slurry introduction through holes and a plurality of slurry supply through holes and a lower layer polishing pad provided with a slurry introduction part and a slurry passage groove are laminated. An example in which CMP (Chemical Mechanical Polishing) is used is known from Patent Document 2. In Patent Document 2, the object is to prevent the solidification of the slurry causing scratches and improve the in-plane uniformity of the workpiece. In addition, by providing multiple through holes in the polishing pad, it is easy to remove the workpiece after polishing, and even if the polishing pad is worn, it is compared with a pad that has been subjected to groove processing that has been conventionally known. In addition, Patent Document 3 also discloses an example in which the life of the pad is extended because the long hole is not lost, and as a result, the manufacturing cost can be reduced.

以上のように研磨パッドに孔加工を施した例はいくつか知られているが、その孔の形は貫通孔であり数及び配列については示されているが、孔形状に関して特に開示されたものは見当たらない。また、その孔は研磨面に対して垂直な孔形状であるために、半導体ウエハやガラスの研磨工程において、そのような孔加工を施した研磨パッドを使用した場合、その先鋭なエッジ部分により被研磨物にスクラッチ(研磨傷)が発生し易いという課題がある。 As described above, several examples of drilling a polishing pad are known, but the shape of the hole is a through hole and the number and arrangement are shown, but those disclosed specifically with respect to the hole shape Is not found . Further, since the hole has a shape perpendicular to the polishing surface, when a polishing pad subjected to such hole processing is used in the polishing process of a semiconductor wafer or glass, the sharp edge portion covers the hole. There is a problem that scratches (polishing scratches) are likely to occur in the polished article.

このスクラッチに関して、孔は溝とは異なった課題がある。溝は、研磨スラリーの供給・排出性に優れているため、研磨スラリーの排出と共に研磨屑も排出され、研磨レートがある程度高く、また、スクラッチも少なめであり、バランスが取れた表面加工が可能である。   With regard to this scratch, the hole has a different problem from the groove. The groove is excellent in supplying and discharging the polishing slurry, so that polishing scraps are discharged together with the polishing slurry, the polishing rate is high to a certain extent, and there are few scratches, enabling a balanced surface treatment. is there.

しかしながら、孔は溝とは異なり、互いに独立しているために、研磨スラリーを十分量確保することができるのであるが、その反面、孔に一旦入った研磨スラリーは容易に孔から排出されにくいという特有の課題がある構造のために、研磨レートは高いものの、スクラッチが溝と比較して多めである、という溝とは全く相違した課題が存在している。
米国特許５，３２９，７３４ 特開２００４−８２２７０ 特開２００３−３００１４０ However, since the holes are independent of each other, unlike the grooves, a sufficient amount of polishing slurry can be secured. On the other hand, the polishing slurry once entering the holes is not easily discharged from the holes. Although the polishing rate is high due to the structure having a specific problem, there is a problem that is completely different from the groove that the scratch is larger than the groove.
US Pat. No. 5,329,734 JP 2004-82270 A JP 2003-300140 A

本発明は、研磨面に開口した貫通孔を有する研磨パッドにおいて、スクラッチ低減と研磨レート向上とを両立可能としたものである。 The present invention makes it possible to achieve both reduction of scratches and improvement of the polishing rate in a polishing pad having a through- hole opened in the polishing surface.

本発明による研磨パッドは、研磨面に開口したスラリーを保持する貫通孔を有する研磨パッドにおいて、少なくともその貫通孔の開口のエッジ部にその全周にわたり傾斜が付けられており、裏面またはこれと平行な線（基準線）と貫通孔内壁面とで挟む角度が９０ ° 未満であり、貫通孔は、当該研磨パッドのライフとされる厚みまでが直線状ないしは曲線状に傾斜して開口していることを特徴とするものである。 The polishing pad according to the present invention is a polishing pad having a through- hole that holds slurry opened on the polishing surface, and at least the edge of the opening of the through- hole is inclined over the entire circumference, and the back surface or parallel to this. Ri a line angle of 90 ° below der sandwiching between (baseline) and the through hole wall surface, the through hole, to a thickness which is of the polishing pad life opened inclined linearly or curved It is characterized by being.

また、本発明による研磨パッドは、研磨面に開口したスラリーを保持する貫通孔を有する研磨パッドにおいて、少なくともその貫通孔の開口のエッジ部にその全周にわたり傾斜が付けられており、裏面またはこれと平行な線（基準線）と貫通孔内壁面とで挟む角度が９０ ° 未満であり、貫通孔が、その内部途中部から当該研磨パッド表面方向に広がる貫通孔形状とし、また、その内部途中部から当該研磨パッド裏面方向に広がる貫通孔形状であることを特徴とするものである。Further, the polishing pad according to the present invention is a polishing pad having a through-hole for holding slurry opened on the polishing surface, and at least the edge portion of the opening of the through-hole is inclined over the entire periphery thereof, The angle between the line parallel to the base line (reference line) and the inner wall surface of the through hole is less than 90 °, and the through hole has a through hole shape that extends from the middle part of the through hole toward the surface of the polishing pad. It is a through-hole shape which spreads in the back surface direction of the said polishing pad from a part.

本発明によると、貫通孔の開口のエッジ部が先鋭ではなく傾斜が付けられているので、被研磨物表面を研磨する際、スクラッチを低減することができる。このスクラッチの低減においては、溝とは異なり、貫通孔のエッジ部にその全周にわたり傾斜が付けられているので、被研磨物と研磨パッドとがどのように接触しても被研磨物表面の研磨を行う際にスクラッチの発生を抑制することができる。したがって、本発明によるときは、貫通孔の特徴である研磨スラリーの高い保持性能による高研磨レートを維持しつつこれとトレードオフの関係であるスクラッチの発生を抑制することができる。 According to the present invention, since the edge portion of the opening of the through hole is not sharp but is inclined, scratches can be reduced when polishing the surface of the workpiece. In reducing the scratch, unlike the groove, the edge of the through- hole is inclined over the entire circumference, so that the surface of the object to be polished is no matter how the object contacts the polishing pad. The occurrence of scratches can be suppressed when polishing. Therefore, according to the present invention, it is possible to suppress the occurrence of scratches which are in a trade-off relationship with maintaining a high polishing rate due to the high holding performance of the polishing slurry, which is a characteristic of the through hole.

本発明はまた、貫通孔開口のエッジ部にその全周にわたり傾斜が付けられているので、溝のように被研磨物表面の研磨に方向性があるものとは異なって、被研磨物表面の研磨に際して研磨方向のいかんにかかわらず高研磨レートを維持しつつスクラッチ発生を抑制することができるという優れた効果を発揮することができるものである。 In the present invention, since the edge of the through- hole opening is inclined over the entire circumference, the surface of the object to be polished is different from that having a direction for polishing the surface of the object to be polished like a groove. It is possible to exhibit an excellent effect that the generation of scratches can be suppressed while maintaining a high polishing rate regardless of the polishing direction during polishing.

特に本発明の場合、貫通孔が研磨面側に広がる傾斜面を開口エッジ部に備えたことにより、被研磨物が貫通孔の上を通過するときの研磨布の変形に起因するポンプ効果により、貫通孔内外の研磨スラリーの入れ替わりが大きくなる。そのために、貫通孔内部に蓄積された研磨スラリーが入れ替わって、新しい研磨スラリーが研磨に使用されるとともに、貫通孔に捕捉されていた研磨屑が排出されることになり、研磨レートが向上し、さらにスクラッチも低減されるようになる。 In particular, in the case of the present invention, by providing the opening edge portion with an inclined surface in which the through hole extends to the polishing surface side, due to the pump effect caused by the deformation of the polishing cloth when the workpiece passes over the through hole, The exchange of the polishing slurry inside and outside the through hole is increased. Therefore, the polishing slurry accumulated in the through hole is replaced, and a new polishing slurry is used for polishing, and polishing scraps captured in the through hole are discharged, and the polishing rate is improved. Furthermore, scratches are also reduced.

上記傾斜角度は、貫通孔が表面から裏面全体にかけて傾斜している場合、貫通孔外側で裏面と貫通孔内壁面とで挟む角度が９０°未満に傾斜している。貫通孔が表面から裏面までの途中までが傾斜している場合、貫通孔外側でその途中部を裏面に対して平行に通る線（基準線）と貫通孔内壁面とで挟む角度が９０°未満で傾斜している。９０°以上であると、研磨レートが低下し、スクラッチの発生も低減しにくくなる。 The inclination angle, the through hole may have inclined throughout the back side from the surface, the angle sandwiched by the rear surface and the through-hole wall surface in the through Anasotogawa is inclined less than 90 °. If halfway from the through-hole surface to the back surface is inclined, the angle is less than 90 ° sandwiching between a line passing through the parallel and the middle portion with respect to the rear surface with through-Anasotogawa (reference line) and the through hole wall face It is inclined at. When it is 90 ° or more, the polishing rate is lowered, and the occurrence of scratches is difficult to reduce.

本発明の研磨パッドは、不織布タイプまたは発泡樹脂タイプまたは硬質樹脂タイプのいずれかであることが好ましい。   The polishing pad of the present invention is preferably either a nonwoven fabric type, a foamed resin type or a hard resin type.

上記貫通孔は、当該研磨パッドの表面から裏面にかけて直線状または曲線状に傾斜していることが好ましい。厚みが薄く研磨パッドのライフがその厚みのほぼ全体までの場合、そのライフに至るまで被研磨物表面の研磨に際してのスクラッチの発生を低減することができる。 The through hole is preferably inclined linearly or curvedly from the front surface to the back surface of the polishing pad. When the thickness of the polishing pad is thin and the life of the polishing pad is almost the entire thickness, the generation of scratches during polishing of the surface of the object to be polished can be reduced until the life is reached.

上記貫通孔は、当該研磨パッドのライフとされる厚みまでが上記所定の傾斜角度で傾斜していることが好ましい。厚みが厚く研磨パッドのライフに至る厚みまでは被研磨物の表面の研磨に際してスクラッチの発生を低減することができる。 It is preferable that the through hole is inclined at the predetermined inclination angle up to the thickness that is assumed to be the life of the polishing pad. The generation of scratches during polishing of the surface of the object to be polished can be reduced up to a thickness that is thick and reaches the life of the polishing pad.

貫通孔は、その内部途中部から当該研磨パッド表面方向に広がる第１貫通孔形状とし、また、その内部途中部から当該研磨パッド裏面方向に広がる第２貫通孔形状であることが好ましい。第１貫通孔形状に至るまでは被研磨物表面の研磨を行うに際してスクラッチの発生を低減することができる一方で、第２貫通孔形状においては研磨スラリーを保持することができる。そのため、第１貫通孔形状だけにおいては研磨面側開口のエッジ部の傾斜角度を小さくしてスクラッチの発生抑制効果が高まるとともに、それに応じて研磨スラリーの保持性能が低下するというトレードオフの関係が発生するが、第２貫通孔形状において研磨スラリーの保持性能を高くすることができるので、当該貫通孔全体としては、スクラッチの発生を大きく抑制することができる傾斜角度に設定すると同時に、研磨スラリーの保持性能を十分に高く維持して研磨レートの向上を図ることができるという極めて性能に優れた研磨パッドを得ることができる。 It is preferable that the through- hole has a first through- hole shape extending from the inner middle portion toward the polishing pad surface and a second through-hole shape extending from the inner middle portion toward the back surface of the polishing pad. The generation of scratches can be reduced when polishing the surface of the workpiece until the first through- hole shape is reached, while the polishing slurry can be held in the second through- hole shape. Therefore, in the shape of the first through hole alone, there is a trade-off relationship that the effect of suppressing the generation of scratches is increased by reducing the inclination angle of the edge portion of the polishing surface side opening, and the holding performance of the polishing slurry is reduced accordingly. However, since the holding performance of the polishing slurry can be enhanced in the shape of the second through- hole, the entire through- hole is set at an inclination angle that can largely suppress the generation of scratches, and at the same time, It is possible to obtain a polishing pad with extremely excellent performance in which the holding performance can be maintained sufficiently high to improve the polishing rate.

なお、本発明の研磨パッドは単層に限定されるものでは何等なく、多層構造の研磨パッドにも及ぶものであり、上層に本発明の研磨パッドを配置したものはすべて本発明に含むことができる。   Note that the polishing pad of the present invention is not limited to a single layer, and extends to a polishing pad having a multilayer structure, and all the polishing pads according to the present invention disposed in the upper layer are included in the present invention. it can.

本発明においては、被研磨物表面の研磨に際してのスクラッチ量低減と研磨レート向上とを達成することができる。   In the present invention, it is possible to reduce the scratch amount and improve the polishing rate when polishing the surface of the workpiece.

以下、添付した図面を参照して本発明の実施の形態に係る研磨パッド及び参考例の研磨パッドを詳細に説明する。 Hereinafter, a polishing pad according to an embodiment of the present invention and a polishing pad of a reference example will be described in detail with reference to the accompanying drawings.

図１および図２は参考例の研磨パッドを示す。図１は研磨パッドの要部断面図、図２は図１の研磨パッドの要部平面図である。これらの図において、１は参考例の研磨パッドを示す。この研磨パッド１は、不織布タイプである。実施形態の研磨パッド１は独立発泡ウレタンタイプでも、硬質ウレタンタイプでもよい。 1 and 2 show a polishing pad of a reference example . 1 is a cross-sectional view of the main part of the polishing pad, and FIG. 2 is a plan view of the main part of the polishing pad of FIG. In these drawings, reference numeral 1 denotes a polishing pad of a reference example . This polishing pad 1 is a nonwoven fabric type. The polishing pad 1 of the embodiment may be an independent foamed urethane type or a rigid urethane type.

２は研磨パッド１の表面である研磨面、３は研磨パッド１の裏面、４は貫通孔である。この貫通孔４の研磨面側開口のエッジ部５は、その全周にわたり、貫通孔４の外側で裏面３と貫通孔内壁面とで挟む角度（傾斜角度）がαに傾斜している。この場合の貫通孔４の内壁面６は研磨面２から裏面３の全体にかけて直線状に傾斜している。 2 is a polishing surface which is the surface of the polishing pad 1, 3 is the back surface of the polishing pad 1, and 4 is a through hole. Edge portion 5 of the polishing surface-side opening of the through hole 4, over its entire circumference, the angle sandwiched by the rear surface 3 outside the through-hole 4 and the through-hole wall face (tilt angle) is inclined alpha. In this case, the inner wall surface 6 of the through hole 4 is linearly inclined from the polishing surface 2 to the entire back surface 3.

参考例の研磨パッド１によると、貫通孔４の開口エッジ部５の全周にわたり傾斜（テーパー）が付いているので、この研磨パッド１を用いて被研磨物を研磨した場合、被研磨物表面のスクラッチを低減することができる。そのため、貫通孔４の特徴である高研磨レートを維持しつつスクラッチの発生を低減することができるようになる。また、溝に傾斜を付ける場合とは異なり、孔４の全周にわたり傾斜を付けているので、スクラッチの低減に方向性が無くなり、被研磨物表面の研磨に際して、研磨パッド１表面と被研磨物表面との接触関係がどのようになっていても、被研磨物表面の研磨に際して研磨レートを向上させつつ該被研磨物表面のスクラッチの発生を抑制ないしは低減することができるようになる。 According to the polishing pad 1 of the reference example , since the entire periphery of the opening edge portion 5 of the through hole 4 is inclined (tapered), when the object to be polished is polished using the polishing pad 1, the surface of the object to be polished It is possible to reduce the scratch. Therefore, it is possible to reduce the occurrence of scratches while maintaining the high polishing rate that is a characteristic of the through hole 4. Unlike the case where the groove is inclined, the groove 4 is inclined over the entire circumference, so that there is no direction in reducing scratches, and the surface of the polishing pad 1 and the object to be polished are removed when polishing the surface of the object to be polished. Whatever the contact relationship with the surface, it is possible to suppress or reduce the generation of scratches on the surface of the object to be polished while improving the polishing rate when polishing the surface of the object to be polished.

なお、上記傾斜角度αは、研磨パッド１が不織布タイプの場合も独立発泡ウレタンタイプの場合も硬質ウレタンタイプも、スクラッチ低減、研磨レート向上において、９０°未満であればよい。   The inclination angle α may be less than 90 ° in reducing scratches and improving the polishing rate in both the case where the polishing pad 1 is a nonwoven fabric type, the case of a closed foam urethane type and the case of a hard urethane type.

図３は参考例の研磨パッドを、図４は実施の形態に係る研磨パッドをそれぞれ示す。図３（ａ）（ｂ）は研磨パッドの要部断面図と要部平面図、図４（ａ）（ｂ）は実施の形態の研磨パッドの要部断面図、要部平面図である。これらの図において、図１および図２と対応する部分には同一の符号を付している。参考例の研磨パッド１においては、図３（ａ）（ｂ）で示す貫通孔４はその開口エッジ部５から内部途中部７ａまでの孔深さが浅く、実施の形態の研磨パッド１においては、図４（ａ）（ｂ）で示す貫通孔４はその開口エッジ部５から内部途中部７ｂまでの孔深さが深くしてある。これは、研磨パッド１のライフとされる厚みまで、すなわち、内部途中部７ａ，７ｂまで研磨パッド１が磨耗した後は寿命として研磨パッド１が交換されるので、この厚み以下の貫通孔４の形状は該傾斜部分は必ずしも必要ではなく孔内部途中部７ａ，７ｂより深い孔内部の内壁面６は垂直孔としている。この実施の形態の研磨パッドも、高研磨レートを維持しつつスクラッチの発生を低減することができる。この実施の形態の場合の傾斜角度αは、貫通孔外側で孔内部途中部７ａ，７ｂを裏面３に平行に通る線（基準線）と孔内壁面とで挟む角度である。 Figure 3 is a polishing pad reference example, FIG. 4 shows a polishing pad according to the shape condition of the embodiment, respectively. 3A and 3B are a cross-sectional view and a main part plan view of a main part of the polishing pad, and FIGS. 4A and 4B are a main part cross-sectional view and a main part plan view of the polishing pad of the embodiment . In these drawings, portions corresponding to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the polishing pad 1 of Reference Example, FIGS. 3 (a) through-hole 4 shown in (b) has a shallow hole depth from its opening edge portion 5 to the inner middle portion 7a, in the polishing pad 1 of the embodiment , FIGS. 4 (a) hole depth of the through hole 4 shown in (b) from the opening edge portion 5 to the inner middle portion 7b is are deeply. This, to a thickness which is of the polishing pad 1 life, i.e., inside the middle portion 7a, because the polishing pad 1 to 7b the polishing pad 1 is replaced as the service life after wear, the through-holes 4 below the thickness The shape of the inclined portion is not necessarily required, and the inner wall surface 6 inside the hole deeper than the hole intermediate portions 7a and 7b is a vertical hole. Also polishing pad in the form status of this embodiment, it is possible to reduce the scratches while maintaining a high polishing rate. The inclination angle α in the case of the form status of this embodiment, the angle sandwiched by the hole inside the middle portion 7a in the through Anasotogawa, line passing parallel to 7b on the back surface 3 (reference line) and downhole wall.

図５は参考例の研磨パッドを、図６は実施の形態の研磨パッドをそれぞれ示す。図５（ａ）（ｂ）は研磨パッドの要部断面図と要部平面図、図６（ａ）（ｂ）は実施の携帯の研磨パッドの要部断面図、要部平面図である。これらの図において、図１および図２と対応する部分には同一の符号を付している。参考例の研磨パッド１において、図５（ａ）（ｂ）で示す貫通孔４はその開口エッジ部５から内部途中部７ａまでの貫通孔形状は曲線状であり、実施の形態の研磨パッド１において、図６（ａ）（ｂ）で示す貫通孔４は図５（ａ）（ｂ）で示す貫通孔４よりもその開口エッジ部５から内部途中部７ｂまで深い位置までが曲線状である。これは、研磨パッド１のライフとされる厚みまで、すなわち、内部途中部７ａ，７ｂまで研磨パッド１が磨耗した後は寿命として研磨パッド１が交換されるので、この厚み以下の貫通孔４の形状は該傾斜部分は必ずしも必要ではなく孔内部途中部７ａ，７ｂより深い孔内部の内壁面６は垂直孔としている。これに加えて、貫通孔４の開口エッジ部５から内部途中部７ａまでの貫通孔形状を曲線状として、被研磨物の研磨に際してスクラッチの発生をより一層抑制することができるようにしている。この実施の形態の研磨パッドも、高研磨レートを維持しつつスクラッチの発生を低減することができる。この実施の形態の場合の傾斜角度αは孔内部途中部７ａ，７ｂを裏面３に平行に通る線（基準線）と孔内壁面とで挟む角度である。 Figure 5 is a polishing pad reference example, FIG. 6 shows a polishing pad of the embodiment, respectively. FIGS. 5A and 5B are a cross-sectional view and a main part plan view of the main part of the polishing pad, and FIGS. 6A and 6B are a main part cross-sectional view and a main part plan view of the portable polishing pad of the embodiment . In these drawings, portions corresponding to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the polishing pad 1 of the reference example, the through hole 4 shown in FIGS. 5 (a) and 5 (b) has a curved through hole shape from the opening edge portion 5 to the inner middle portion 7a, and the polishing pad 1 of the embodiment. 6A and 6B, the through hole 4 shown in FIGS. 6A and 6B has a curved shape from the opening edge portion 5 to a deeper position from the inner middle portion 7b than the through hole 4 shown in FIGS. . This, to a thickness which is of the polishing pad 1 life, i.e., inside the middle portion 7a, because the polishing pad 1 to 7b the polishing pad 1 is replaced as the service life after wear, the through-holes 4 below the thickness The shape of the inclined portion is not necessarily required, and the inner wall surface 6 inside the hole deeper than the hole intermediate portions 7a and 7b is a vertical hole. In addition to this, the shape of the through hole from the opening edge portion 5 of the through hole 4 to the inner middle portion 7a is curved so that the generation of scratches can be further suppressed during polishing of the workpiece. Also polishing pad of this embodiment, it is possible to reduce the scratches while maintaining a high polishing rate. In the case of this embodiment, the inclination angle α is an angle sandwiched between a line (reference line) passing through the hole middle portions 7a and 7b in parallel with the back surface 3 and the wall surface of the hole.

図７および図８は実施の形態に係る研磨パッドを示す。図７は研磨パッドの要部断面図、図８は図６の研磨パッドの要部平面図である。これらの図において、図１および図２と対応する部分には同一の符号を付している。この実施の形態の研磨パッド１においては、貫通孔４の形状をその内部途中部７から研磨面２方向に広がる貫通孔形状４ａとし、また、その内部途中部７から裏面３方向に広がる貫通孔形状４ｂになっている。貫通孔形状４ａにおいては傾斜角度αによりエッジ部５に傾斜を付けて被研磨物の研磨に際してスクラッチの発生を抑制し、貫通孔形状４ｂにおいては研磨スラリーを貯留し研磨レートの向上を図ることができる。この実施の形態の研磨パッドは、特に、研磨レートの向上とスクラッチの低減とが可能となる。なお、第１貫通孔形状の傾斜角度αは孔内部途中部７を裏面３に平行に通る線（基準線）と孔内壁面とで挟む角度である。 7 and 8 show a polishing pad according to the shape condition of the embodiment. 7 is a cross-sectional view of the main part of the polishing pad, and FIG. 8 is a plan view of the main part of the polishing pad of FIG. In these drawings, portions corresponding to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the polishing pad 1 of this embodiment, a through-hole shape 4a extending abrasive surface two directions the shape of the through-hole 4 from the inside middle portion 7, The through-hole extending from the inner middle portion 7 on the back three directions The shape is 4b. In the through hole shape 4a, the edge portion 5 is inclined at an inclination angle α to suppress the occurrence of scratches when polishing the object to be polished. In the through hole shape 4b, polishing slurry is stored to improve the polishing rate. it can. The polishing pad in the form status of this embodiment is particularly made possible the improvement and scratch reduction of polishing rate. The inclination angle α of the first through- hole shape is an angle between a line (reference line) passing through the hole middle part 7 in parallel with the back surface 3 and the hole inner wall surface.

〔参考例〕
不織布タイプの研磨パッド（ニッタ・ハース(株)製ＳＵＢＡ）と独立発泡ウレタンタイプの研磨パッド（ニッタ・ハース(株)製ＭＨ）に対して、ポンチで任意の大きさの孔を開けた後、三次元加工機械（ＮＣルーター）によって設定角度専用の刃物で面取りを行い、貫通孔の開口の壁面に傾斜を付けて、図９に示す傾斜角付きの貫通孔を有する研磨パッドとした。図９は、不織布タイプの研磨パッドと、独立発泡ウレタンタイプの研磨パッドとを共用して示す。そして、両タイプの研磨パッドは、その貫通孔の傾斜角度を８種類（２０°、３０°、４０°、５０°、６０°、７０°、８０°、９０°）に変え、各傾斜角度の貫通孔を有する研磨パッドそれぞれを、１つずつ、片面研磨機（Ｇ＆Ｐ社製Ｐｏｌｙ−５００）の下定盤に両面粘着テープを介して貼付し、その表面にこれと対向するキャリァーヘッドに保持された被研磨物であるウエハを押し付けながらその界面に研磨スラリーを供給しつつ研磨を行って、ウエハのスクラッチ量をウエハ表面検査装置（日立ハイテク電子エンジニアリング(株)製ＬＳ６６００）を用いて測定した。
以上の測定結果を表１に示す。 [ Reference example ]
After opening a hole of any size with a punch for a non-woven type polishing pad (Nitta Haas Co., Ltd. SUBA) and an independent foam urethane type polishing pad (Nitta Haas Co., Ltd. MH), Chamfering was performed with a blade for exclusive use of a set angle by a three-dimensional processing machine (NC router), and the wall surface of the opening of the through hole was inclined to obtain a polishing pad having a through hole with an inclined angle shown in FIG. FIG. 9 shows a non-woven fabric type polishing pad and a closed foam urethane type polishing pad in common. In both types of polishing pads, the inclination angle of the through hole is changed to 8 types (20 °, 30 °, 40 °, 50 °, 60 °, 70 °, 80 °, 90 °), Each polishing pad having a through- hole is attached to a lower surface plate of a single-side polishing machine (Poly-500 manufactured by G & P) via a double-sided adhesive tape, and the surface of the polishing pad held by a carrier head facing the surface is attached. Polishing was performed while supplying a polishing slurry to the interface while pressing the wafer as a polished product, and the scratch amount of the wafer was measured using a wafer surface inspection device (LS6600 manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.).
The above measurement results are shown in Table 1.

Figure 0005105391
Figure 0005105391

表１に示す測定結果から明らかであるように、貫通孔の開口エッジ部の全周にわたり傾斜をつけた研磨パッドにより、被研磨物に対する研磨レートの向上とスクラッチの抑制とができた。 As is clear from the measurement results shown in Table 1, the polishing pad with an inclination over the entire circumference of the opening edge portion of the through hole was able to improve the polishing rate and suppress scratches on the object to be polished.

詳細には、スクラッチに関しては９０°を１（単位表面領域当たりのスクラッチ量（例えばスクラッチ本数）を１）とすると、不織布タイプの場合、傾斜角度αが小さくなるほど、スクラッチが低減し８０°以下、２０°以上で０．９８から０．７３まで低減し、独立発泡ウレタンタイプの場合も傾斜角度αが小さくなるほど、スクラッチが低減し、８０°以下、２０°以上で０．９３から０．６３まで低減した。   Specifically, regarding the scratch, when 90 ° is 1 (the scratch amount per unit surface area (for example, the number of scratches) is 1), in the case of the nonwoven fabric type, the smaller the inclination angle α, the lower the scratch is 80 ° or less. Reduced from 0.98 to 0.73 at 20 ° or more, and in the case of closed-cell foamed urethane type, the smaller the inclination angle α, the smaller the scratch, and 80 ° or less, from 0.93 to 0.63 at 20 ° or more. Reduced.

また、研磨レートに関しては９０°を１とすると、不織布タイプの場合、傾斜角度αが小さくなるほど、研磨レートが向上し８０°以下、２０°以上で１．００から１．０８に向上し、独立発泡ウレタンタイプの場合も、傾斜角度αが小さくなるほど、研磨レートが向上し、８０°以下、２０°以上で１．０２から１．０９に向上した。   As for the polishing rate, assuming that 90 ° is 1, in the case of the nonwoven fabric type, the smaller the inclination angle α, the higher the polishing rate and the improvement from 1.00 to 1.08 at 80 ° or less and 20 ° or more. In the case of the urethane foam type as well, the polishing rate improved as the inclination angle α decreased, and improved from 1.02 to 1.09 at 80 ° or less and 20 ° or more.

なお、測定データは傾斜角度αを８種類変えて行なったものであり、傾斜角度αが９０°未満であればよく、上記８種類に限定されない。   Note that the measurement data is obtained by changing eight types of inclination angles α, and the inclination data α is not limited to the above eight types as long as the inclination angle α is less than 90 °.

参考例の研磨パッドの要部断面図である。It is principal part sectional drawing of the polishing pad of a reference example . 図１の研磨パッドの要部平面図である。It is a principal part top view of the polishing pad of FIG. （ａ）参考例の研磨パッドの要部断面図、（ｂ）図３（ａ）の平面図である。(A) It is principal part sectional drawing of the polishing pad of a reference example , (b) It is a top view of Fig.3 (a). （ａ）本発明の実施の形態の研磨パッドの要部断面図、（ｂ）図４（ａ）の平面図である。(A) It is principal part sectional drawing of the polishing pad of embodiment of this invention, (b) It is a top view of Fig.4 (a). （ａ）参考例の研磨パッドの要部断面図、（ｂ）図５（ａ）の平面図である。(A) It is principal part sectional drawing of the polishing pad of a reference example , (b) It is a top view of Fig.5 (a). （ａ）本発明の実施の形態の研磨パッドの要部断面図、（ｂ）図６（ａ）の平面図である。(A) Main part sectional drawing of the polishing pad of embodiment of this invention, (b) It is a top view of Fig.6 (a). 本発明の実施の形態の研磨パッドの要部断面図である。It is principal part sectional drawing of the polishing pad of embodiment of this invention. 図７の研磨パッドの要部平面図である。It is a principal part top view of the polishing pad of FIG. 参考例に用いた研磨パッドの要部断面図である。It is principal part sectional drawing of the polishing pad used for the reference example .

１ 研磨パッド
２ 研磨面（表面）
３ 裏面
４ 貫通孔
５ 開口エッジ部 1 Polishing pad 2 Polishing surface (surface)
3 Back 4 Through hole 5 Open edge

Claims (3)

研磨面に開口したスラリーを保持する貫通孔を有する研磨パッドにおいて、少なくともその貫通孔の開口のエッジ部にその全周にわたり傾斜が付けられており、
裏面またはこれと平行な線（基準線）と貫通孔内壁面とで挟む角度が９０ ° 未満であり、
貫通孔は、当該研磨パッドのライフとされる厚みまでが直線状ないしは曲線状に傾斜して開口している、
ことを特徴とする研磨パッド。 In the polishing pad having a through- hole that holds the slurry opened on the polishing surface, at least the edge of the opening of the through- hole is inclined over the entire circumference,
Ri angle is 90 ° less than Der sandwiching in the back or its line parallel (baseline) and the through hole wall surface,
The through-hole is opened in a linear or curved manner up to the thickness assumed to be the life of the polishing pad,
A polishing pad characterized by that. 研磨面に開口したスラリーを保持する貫通孔を有する研磨パッドにおいて、少なくともその貫通孔の開口のエッジ部にその全周にわたり傾斜が付けられており、
裏面またはこれと平行な線（基準線）と貫通孔内壁面とで挟む角度が９０ ° 未満であり、
貫通孔が、その内部途中部から当該研磨パッド表面方向に広がる貫通孔形状とし、また、その内部途中部から当該研磨パッド裏面方向に広がる貫通孔形状である、
ことを特徴とする研磨パッド。 In the polishing pad having a through-hole that holds the slurry opened on the polishing surface, at least the edge of the opening of the through-hole is inclined over the entire circumference,
The angle between the back surface or a line parallel to this (reference line) and the inner wall surface of the through hole is less than 90 °,
The through-hole has a through-hole shape that extends in the direction of the polishing pad surface from the middle part of the inside, and a through-hole shape that extends in the direction of the back surface of the polishing pad from the middle part of the inside.
A polishing pad characterized by that . 研磨パッドが不織布タイプ、発泡樹脂タイプまたは硬質樹脂タイプのいずれかであることを特徴とする請求項１または２に記載の研磨パッド。 The polishing pad according to claim 1 or 2, wherein the polishing pad is of a nonwoven fabric type, a foamed resin type or a hard resin type .
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