JP5103356B2 - Substrate cleaning brush, substrate processing apparatus, and substrate cleaning method - Google Patents

Substrate cleaning brush, substrate processing apparatus, and substrate cleaning method Download PDF

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JP5103356B2
JP5103356B2 JP2008281046A JP2008281046A JP5103356B2 JP 5103356 B2 JP5103356 B2 JP 5103356B2 JP 2008281046 A JP2008281046 A JP 2008281046A JP 2008281046 A JP2008281046 A JP 2008281046A JP 5103356 B2 JP5103356 B2 JP 5103356B2
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brush
substrate
cleaning
base
surface layer
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JP2010109225A (en
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省貴 石田
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Tokyo Electron Ltd
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Description

本発明は、基板の洗浄に用いる基板洗浄ブラシ及び同基板洗浄ブラシを用いた基板処理装置並びに基板洗浄方法に関するものである。   The present invention relates to a substrate cleaning brush used for substrate cleaning, a substrate processing apparatus using the substrate cleaning brush, and a substrate cleaning method.

従来より、半導体部品やフラットディスプレイなどを製造する場合には、半導体ウエハや液晶基板などの基板を洗浄処理やエッチング処理するために基板処理装置を用いて基板の各種処理を行っている。   2. Description of the Related Art Conventionally, when manufacturing a semiconductor component, a flat display, or the like, various types of substrate processing are performed using a substrate processing apparatus in order to perform cleaning processing or etching processing on a substrate such as a semiconductor wafer or a liquid crystal substrate.

この基板処理装置は、基板の洗浄処理を行うための基板洗浄ユニットを有しており、基板洗浄ユニットには、チャンバーの内部に基板を水平に保持しながら回転させるための基板回転保持機構と基板洗浄ブラシを基板の表面上で回転させながら移動させて基板の表面を洗浄する基板洗浄機構を収容し、チャンバー内で基板の洗浄を行うように構成している（たとえば、特許文献１参照。）。   This substrate processing apparatus has a substrate cleaning unit for performing a substrate cleaning process, and the substrate cleaning unit includes a substrate rotation holding mechanism and a substrate for rotating while holding the substrate horizontally in the chamber. A substrate cleaning mechanism for cleaning the surface of the substrate by moving the cleaning brush while rotating on the surface of the substrate is housed, and the substrate is cleaned in the chamber (for example, see Patent Document 1). .

そして、従来の基板処理装置では、基板洗浄ブラシとして、硬質のブラシ保持体に洗浄用の刷毛を密集させた状態で直接植毛した構造のものや、硬質のブラシ保持体に発泡体からなるスポンジを直接取付けた構造のものや、硬質のブラシ保持体に刷毛とスポンジとを直接取付けた構造のものが利用されている。   In the conventional substrate processing apparatus, as a substrate cleaning brush, a structure in which a hard brush holder is directly planted with a cleaning brush densely packed, or a hard brush holder with a foam sponge is used. A structure with a direct attachment or a structure with a brush and sponge directly attached to a hard brush holder is used.

実開平５−１１４４０号公報Japanese Utility Model Laid-Open No. 5-11440

ところが、上記従来の基板処理装置で用いられている基板洗浄ブラシでは、密集した刷毛の毛細管現象によって刷毛の基部にパーティクルが付着してしまったり、或いは、スポンジの吸着作用によってスポンジの表面にパーティクルが付着してしまい、洗浄時に基板洗浄ブラシ自体にパーティクルが付着し、その後、基板洗浄ブラシに付着したパーティクルが他の基板に転写してしまうおそれがあった。   However, in the substrate cleaning brush used in the above conventional substrate processing apparatus, particles adhere to the base of the brush due to the capillary action of the dense brush, or particles on the surface of the sponge due to the adsorption action of the sponge. There is a possibility that particles adhere to the substrate cleaning brush itself during cleaning, and then the particles attached to the substrate cleaning brush may be transferred to another substrate.

そこで、請求項１に係る本発明では、基板の洗浄に用いる基板洗浄ブラシにおいて、弾性を有するブラシベース部と、ブラシベース部の表面に形成した疎水性を有するベース表層部と、ベース表層部に間隔をあけて植毛した洗浄刷毛部とを有し、前記ブラシベース部を吸水素材で形成するとともに、前記ブラシベース部に洗浄液を供給する洗浄液供給手段を設けることにした。
Accordingly, in the present invention according to claim 1, in the substrate cleaning brush used for cleaning the substrate, the brush base portion having elasticity, the hydrophobic base surface layer portion formed on the surface of the brush base portion, and the base surface layer portion are provided. It possesses a cleaning brush unit which is planted at intervals, thereby forming the brush base portion in water material, and the Rukoto provided a cleaning liquid supply means for supplying a cleaning liquid to the brush base portion.

また、請求項２に係る本発明では、基板の洗浄に用いる基板洗浄ブラシにおいて、弾性を有するブラシベース部と、ブラシベース部の表面に形成した疎水性を有するベース表層部と、ベース表層部に間隔をあけて植毛した洗浄刷毛部とを有し、前記洗浄刷毛部に刷毛を、ｔ≧２・Ｔ・COSθ／（ρ・ｇ・ｈ） （ここで、ｔは刷毛の間隔、Ｔは洗浄液の表面張力、θは刷毛と基板との間の接触角度、ρは洗浄液の密度、ｇは重力加速度、ｈは刷毛の長さ。）となる間隔で植毛することにした。
In the present invention according to claim 2 , in the substrate cleaning brush used for cleaning the substrate, the brush base portion having elasticity, the hydrophobic base surface layer portion formed on the surface of the brush base portion, and the base surface layer portion A cleaning brush portion planted at intervals, and a brush on the cleaning brush portion , t ≧ 2 · T · COSθ / (ρ · g · h) (where t is the interval between the brushes, and T is the cleaning liquid) ) Is the contact angle between the brush and the substrate, ρ is the density of the cleaning solution, g is the acceleration of gravity, and h is the length of the brush.

また、請求項３に係る本発明では、基板洗浄ブラシを用いて基板の洗浄を行う基板処理装置において、基板洗浄ブラシは、弾性を有するブラシベース部と、ブラシベース部の表面に形成した疎水性を有するベース表層部と、ベース表層部に間隔をあけて植毛した洗浄刷毛部とを有し、前記ブラシベース部を吸水素材で形成するとともに、前記ブラシベース部に洗浄液を供給する洗浄液供給手段を設けることにした。
In the present invention according to claim 3 , in the substrate processing apparatus for cleaning a substrate using the substrate cleaning brush, the substrate cleaning brush includes an elastic brush base portion and a hydrophobic surface formed on the surface of the brush base portion. a base surface portion having, together possess a cleaning brush unit which is planted at intervals in the base surface portion, to form the brush base portion in water material, the cleaning liquid supply means for supplying a cleaning liquid to the brush base portion provided was Rukoto.

また、請求項４に係る本発明では、基板洗浄ブラシを用いて基板の洗浄を行う基板処理装置において、基板洗浄ブラシは、弾性を有するブラシベース部と、ブラシベース部の表面に形成した疎水性を有するベース表層部と、ベース表層部に間隔をあけて植毛した洗浄刷毛部とを有し、前記洗浄刷毛部に刷毛を、ｔ≧２・Ｔ・COSθ／（ρ・ｇ・ｈ） （ここで、ｔは刷毛の間隔、Ｔは洗浄液の表面張力、θは刷毛と基板との間の接触角度、ρは洗浄液の密度、ｇは重力加速度、ｈは刷毛の長さ。）となる間隔で植毛することにした。
According to a fourth aspect of the present invention, in the substrate processing apparatus for cleaning a substrate using the substrate cleaning brush, the substrate cleaning brush includes an elastic brush base portion and a hydrophobic surface formed on the surface of the brush base portion. And a cleaning brush portion planted at intervals in the base surface layer portion, and a brush is applied to the cleaning brush portion , t ≧ 2 · T · COSθ / (ρ · g · h) (here Where t is the distance between the brushes, T is the surface tension of the cleaning liquid, θ is the contact angle between the brush and the substrate, ρ is the density of the cleaning liquid, g is the acceleration of gravity, and h is the length of the brush. I decided to plant hair.

また、請求項５に係る本発明では、基板洗浄ブラシを用いて基板の洗浄を行う基板洗浄方法において、弾性を有するブラシベース部に疎水性を有するベース表層部を介して刷毛を形成した基板洗浄ブラシを用い、基板に洗浄液を供給しながら洗浄し、前記洗浄液を吸水素材で形成したブラシベース部に供給しながら基板の洗浄を行うことにした。
Further, in the present invention according to claim 5 , in the substrate cleaning method for cleaning a substrate using a substrate cleaning brush, the substrate is cleaned by forming a brush on an elastic brush base portion through a hydrophobic base surface layer portion. The substrate was cleaned using a brush while supplying the cleaning liquid to the substrate, and the cleaning liquid was supplied to the brush base portion formed of the water-absorbing material .

そして、本発明では、弾性を有するブラシベース部とブラシベース部の表面に形成した疎水性を有するベース表層部とベース表層部に間隔をあけて植毛した洗浄刷毛部とを有する基板洗浄ブラシを用いているために、疎水性のベース表層部によってパーティクルの付着を防止して他の基板への転写を防止することができるとともに、基板に反りが生じていても弾性を有するブラシベース部が基板の反りに応じて柔軟に変形し、洗浄刷毛部で基板の洗浄を良好に行うことができる。   And in this invention, the board | substrate washing | cleaning brush which has the brush base part which has elasticity, the base surface layer part which has the hydrophobicity formed in the surface of the brush base part, and the washing | cleaning brush part which planted the base surface layer part at intervals is used. Therefore, the hydrophobic base surface layer portion can prevent adhesion of particles to prevent transfer to another substrate, and the brush base portion having elasticity even when the substrate warps, The substrate is deformed flexibly according to the warp, and the substrate can be satisfactorily cleaned with the cleaning brush portion.

以下に、本発明に係る基板処理装置の具体的な構成について図面を参照しながら説明する。   A specific configuration of the substrate processing apparatus according to the present invention will be described below with reference to the drawings.

図１に示すように、基板処理装置１は、基板としての半導体ウエハ（以下、「基板２」という。）を搬入及び搬出するための基板搬入出部３の後部に基板２を１枚ずつ搬送するための基板搬送部４を形成するとともに、この基板搬送部４の後部に基板２の洗浄や乾燥などの各種の処理を施すための基板処理部５を形成している。   As shown in FIG. 1, the substrate processing apparatus 1 transports the substrates 2 one by one to the rear of the substrate loading / unloading section 3 for loading and unloading a semiconductor wafer (hereinafter referred to as “substrate 2”) as a substrate. A substrate transport unit 4 is formed, and a substrate processing unit 5 for performing various processes such as cleaning and drying of the substrate 2 is formed at the rear of the substrate transport unit 4.

この基板処理部５は、基板搬送部４の後部に基板２の受け渡しを行うための基板受渡ユニット６を配置するとともに、この基板受渡ユニット６の後部に基板２を基板処理部５の内部で搬送するための主搬送ユニット７を配置し、この主搬送ユニット７の左右側部に基板２を洗浄処理するための基板洗浄ユニット8〜15を上下及び前後に２個ずつ並べて配置している。   The substrate processing unit 5 includes a substrate delivery unit 6 for delivering the substrate 2 at the rear of the substrate transport unit 4, and transports the substrate 2 to the rear of the substrate delivery unit 6 inside the substrate processing unit 5. A main transport unit 7 is disposed, and two substrate cleaning units 8 to 15 for cleaning the substrate 2 are arranged side by side on the left and right sides of the main transport unit 7 one above the other.

そして、基板処理装置１では、たとえば、基板搬入出部３に載置された複数枚の基板２を積載したキャリア17から基板２を一枚ずつ基板搬送部４で取り出して基板受渡ユニット６へ搬送し、主搬送ユニット７で基板受渡ユニット６から基板２を基板洗浄ユニット8〜15のいずれかに搬送し、この基板洗浄ユニット8〜15で基板２の表面側を処理し、再び主搬送ユニット７で基板２を基板受渡ユニット６へ搬送し、基板搬送部４で基板２を基板受渡ユニット６から基板搬入出部３のキャリア17へと搬出するようにしている。なお、ここでは基板２の表面（主面：回路形成面）を洗浄処理するようにしているが、これに限られず、基板２の裏面を洗浄処理するようにしてもよく、また、基板２を表裏反転させる機構を設けて基板２の表裏両面を洗浄処理するようにしてもよい。   In the substrate processing apparatus 1, for example, the substrates 2 are taken out one by one from the carrier 17 loaded with a plurality of substrates 2 placed on the substrate carry-in / out unit 3 and conveyed to the substrate delivery unit 6. Then, the main transport unit 7 transports the substrate 2 from the substrate delivery unit 6 to any one of the substrate cleaning units 8 to 15, and the substrate cleaning units 8 to 15 process the surface side of the substrate 2, and again the main transport unit 7 The substrate 2 is transported to the substrate delivery unit 6, and the substrate transport unit 4 transports the substrate 2 from the substrate delivery unit 6 to the carrier 17 of the substrate carry-in / out unit 3. Here, the front surface (main surface: circuit forming surface) of the substrate 2 is cleaned, but the present invention is not limited to this, and the back surface of the substrate 2 may be cleaned. A mechanism for reversing the front and back may be provided to clean the front and back surfaces of the substrate 2.

次に、上記基板処理装置１において、基板２の表面側の洗浄処理を行う基板洗浄ユニット8〜15の具体的な構造について説明する。なお、以下の説明では、上側の前側に配設した基板洗浄ユニット８の構造について説明するが、他の基板洗浄ユニット9〜15も概略同様の構成となっている。   Next, a specific structure of the substrate cleaning units 8 to 15 that perform the cleaning process on the surface side of the substrate 2 in the substrate processing apparatus 1 will be described. In the following description, the structure of the substrate cleaning unit 8 disposed on the upper front side will be described, but the other substrate cleaning units 9 to 15 have substantially the same configuration.

基板洗浄ユニット８は、図２及び図３に示すように、チャンバー18の内部に基板２を水平に保持しながら回転させる基板回転保持機構19と基板２の裏面側を洗浄処理するための基板洗浄機構20とを設けている。   As shown in FIGS. 2 and 3, the substrate cleaning unit 8 includes a substrate rotation holding mechanism 19 that rotates the substrate 2 while holding the substrate 2 horizontally inside the chamber 18 and a substrate cleaning for cleaning the back side of the substrate 2. A mechanism 20 is provided.

基板回転保持機構19は、チャンバー18の内部にモータ21を取付け、モータ21の出力軸22の先端部に円板状のターンテーブル23を水平に取付け、ターンテーブル23の上面外周部に基板２を保持する３個の保持体24を円周方向に間隔をあけて取付けている。   The substrate rotation holding mechanism 19 has a motor 21 mounted inside the chamber 18, a disc-shaped turntable 23 is horizontally mounted at the tip of the output shaft 22 of the motor 21, and the substrate 2 is mounted on the outer periphery of the upper surface of the turntable 23. Three holding bodies 24 to be held are attached at intervals in the circumferential direction.

また、基板回転保持機構19は、ターンテーブル23の外方にアウターカップ25を取付けるとともに、アウターカップ25にインナーカップ26を上下昇降自在に取付け、インナーカップ26に昇降手段27を接続している。   The substrate rotation holding mechanism 19 has an outer cup 25 attached to the outside of the turntable 23, an inner cup 26 attached to the outer cup 25 so as to be movable up and down, and an elevating means 27 connected to the inner cup 26.

そして、基板回転保持機構19は、ターンテーブル23の保持体24で基板２を水平に保持し、モータ21を駆動させることにより、基板２を回転させるようにしている。また、基板回転保持機構19は、インナーカップ26を上昇させた状態で処理を行って洗浄液の飛散を防ぎ、洗浄液をアウターカップ25で回収し、図示しない排液部に排出させる構造になっている。   The substrate rotation holding mechanism 19 rotates the substrate 2 by holding the substrate 2 horizontally by the holding body 24 of the turntable 23 and driving the motor 21. Further, the substrate rotation holding mechanism 19 has a structure in which the processing is performed with the inner cup 26 raised to prevent the cleaning liquid from splashing, the cleaning liquid is collected by the outer cup 25, and is discharged to a draining portion (not shown). .

基板洗浄機構20は、チャンバー18の内側後部に移動体28を左右に移動可能に設け、移動体28に前後方向に伸延させたアーム29の基端部を昇降可能に取付け、アーム29の先端下部にモータ（図示省略）の回転軸30を下方に向けて回動自在に取付け、回転軸30の下端部に円板状の硬質素材からなるブラシ保持体31を取付け、ブラシ保持体31の下面に基板洗浄ブラシ32を下方に向けて取付けている。   The substrate cleaning mechanism 20 is provided at the inner rear part of the chamber 18 so that the movable body 28 can be moved left and right, and the base end of the arm 29 extended in the front-rear direction is attached to the movable body 28 so as to be movable up and down. A rotary shaft 30 of a motor (not shown) is rotatably attached downward, a brush holder 31 made of a disk-like hard material is attached to the lower end of the rotary shaft 30, and the lower surface of the brush holder 31 is attached to the lower surface of the brush holder 31. The substrate cleaning brush 32 is attached facing downward.

基板洗浄ブラシ32は、図４に示すように、ブラシ保持体31の下面に取付けたブラシベース部33と、ブラシベース部33の下面に形成したベース表層部34と、ベース表層部34に形成した洗浄刷毛部35とで構成している。   As shown in FIG. 4, the substrate cleaning brush 32 is formed on the brush base portion 33 attached to the lower surface of the brush holder 31, the base surface layer portion 34 formed on the lower surface of the brush base portion 33, and the base surface layer portion 34. It comprises a cleaning brush portion 35.

ブラシベース部33は、弾性を有するとともに吸水性を有する素材からなる発泡体（スポンジ）によって円筒状に形成しており、中心部に表裏貫通する通水孔36を形成している。   The brush base portion 33 is formed in a cylindrical shape by a foam (sponge) made of a material having elasticity and water absorption, and a water passage hole 36 penetrating the front and back is formed in the center portion.

この通水孔36は、回転軸30及びブラシ保持体31の中心部に形成した連通孔37,38に連通しており、連通孔37,38を介して洗浄液の供給源（図示省略）に連通している。そして、供給源から洗浄液を供給すると、通水孔36を通って基板２の上面（表面）に洗浄液を供給することができるとともに、通水孔36からブラシベース部33の内部に洗浄液が浸透し、ブラシベース部33を洗浄液で膨潤させることができる。このように、基板洗浄ブラシ32には、ブラシベース部33の内部に洗浄液を供給するための洗浄液供給手段39が設けられている。   The water holes 36 communicate with communication holes 37 and 38 formed at the center of the rotary shaft 30 and the brush holder 31 and communicate with a cleaning liquid supply source (not shown) via the communication holes 37 and 38. is doing. When the cleaning liquid is supplied from the supply source, the cleaning liquid can be supplied to the upper surface (surface) of the substrate 2 through the water passage hole 36, and the cleaning liquid penetrates into the brush base portion 33 from the water passage hole 36. The brush base 33 can be swollen with the cleaning liquid. As described above, the substrate cleaning brush 32 is provided with the cleaning liquid supply means 39 for supplying the cleaning liquid into the brush base portion 33.

ベース表層部34は、疎水性（撥水性）を有する素材からなる皮膜によって円板状に形成しており、中心部に表裏貫通するとともにブラシベース部33の通水孔36に連通する開口40を形成している。この開口40から洗浄液を基板２に向けて吐出するようにしている。   The base surface layer portion 34 is formed in a disk shape by a film made of a hydrophobic (water repellent) material, and has an opening 40 that penetrates the front and back in the center and communicates with the water passage hole 36 of the brush base portion 33. Forming. The cleaning liquid is discharged from the opening 40 toward the substrate 2.

洗浄刷毛部35は、弾性を有する素材からなる刷毛41をベース表層部34の表面（下面）に間隔をあけて植毛して形成している。   The cleaning brush portion 35 is formed by flocking a brush 41 made of an elastic material on the surface (lower surface) of the base surface layer portion 34 with a gap.

この基板洗浄ブラシ32は、たとえば、ポリプロピレン樹脂の薄膜を裏面側から加熱しながら電界を与えることによって薄膜の表面に繊維状の刷毛41を吸着させてベース表層部34の表面に刷毛41を植毛させた洗浄刷毛部35を形成し、その後、ブラシベース部33の下面に貼着することによって一体的に形成することができる。   For example, the substrate cleaning brush 32 is configured to apply an electric field while heating a thin film of polypropylene resin from the back side so that the fibrous brush 41 is adsorbed on the surface of the thin film and the brush 41 is implanted on the surface of the base surface layer portion 34. The cleaning brush portion 35 can be formed and then adhered to the lower surface of the brush base portion 33 to be integrally formed.

また、基板洗浄ブラシ32では、洗浄刷毛部35に植毛した刷毛41の間隔をｔとし、洗浄液の表面張力をＴとし、刷毛41と基板２との間の接触角度をθとし、洗浄液の密度をρとし、重力加速度をｇとし、刷毛41の長さをｈとした場合に、刷毛41の間隔ｔが、
ｔ≧２・Ｔ・COSθ／（ρ・ｇ・ｈ） ・・・式（１）
となるようにしている。 In the substrate cleaning brush 32, the distance between the brushes 41 implanted in the cleaning brush portion 35 is t, the surface tension of the cleaning liquid is T, the contact angle between the brush 41 and the substrate 2 is θ, and the density of the cleaning liquid is When ρ, gravitational acceleration is g, and the length of the brush 41 is h, the interval t between the brushes 41 is
t ≧ 2 · T · COSθ / (ρ · g · h) (1)
It is trying to become.

これは、毛細管現象によって洗浄液が刷毛41の間を上昇する水頭高さＨが、
Ｈ＝２・Ｔ・COSθ／（ρ・ｇ・ｔ） ・・・式（２）
となるため、刷毛41の長さｈを上記水頭高さＨよりも大きく、すなわち、
ｈ≧Ｈ＝２・Ｔ・COSθ／（ρ・ｇ・ｔ） ・・・式（３）
とすることで、刷毛41の間の洗浄液に毛細管現象が作用しても、刷毛41の基部（ベース表層部34）にまでは洗浄液が上昇しないことになるからであり、式（３）を変形して式（１）を導き出したものである。 This is because the head height H at which the cleaning liquid rises between the brushes 41 due to capillary action is
H = 2 · T · COSθ / (ρ · g · t) (2)
Therefore, the length h of the brush 41 is larger than the head height H, that is,
h ≧ H = 2 · T · COSθ / (ρ · g · t) (3)
Therefore, even if capillary action acts on the cleaning liquid between the brushes 41, the cleaning liquid does not rise up to the base part (base surface layer part 34) of the brush 41, and the formula (3) is modified. Thus, equation (1) is derived.

したがって、刷毛41の間隔ｔが、式（１）を満たす値にすることで、刷毛41の間の洗浄液に毛細管現象が作用しても、刷毛41の基部（ベース表層部34）にまでは洗浄液が上昇せず、刷毛41の基部（ベース表層部34）に洗浄液とともにパーティクルが付着してしまうのを未然に防止することができる。   Therefore, by setting the interval t between the brushes 41 to a value satisfying the formula (1), even if capillary action acts on the cleaning liquid between the brushes 41, the cleaning liquid reaches the base part (base surface layer part 34) of the brush 41. It is possible to prevent the particles from adhering to the base portion (base surface layer portion 34) of the brush 41 together with the cleaning liquid.

そして、基板洗浄機構20は、モータによって基板洗浄ブラシ32を回転させながら、移動体28によって基板２の中央部上方から周縁部上方まで基板洗浄ブラシ32を移動させるとともに、基板洗浄ブラシ32の中心部から洗浄液を基板２に供給し、基板回転保持機構19によって水平に回転する基板２の裏面を基板洗浄ブラシ32で洗浄するようにしている。   Then, the substrate cleaning mechanism 20 moves the substrate cleaning brush 32 from above the central portion of the substrate 2 to above the peripheral portion by the moving body 28 while rotating the substrate cleaning brush 32 by the motor, and at the center of the substrate cleaning brush 32 Then, the cleaning liquid is supplied to the substrate 2, and the back surface of the substrate 2 rotated horizontally by the substrate rotation holding mechanism 19 is cleaned by the substrate cleaning brush 32.

以上に説明したように、基板処理装置１の基板洗浄ユニット８に設けた基板洗浄ブラシ32は、弾性を有するブラシベース部33と、ブラシベース部33の表面に形成した疎水性を有するベース表層部34と、ベース表層部34に間隔をあけて刷毛41を植毛した洗浄刷毛部35とを有する構成となっている。   As described above, the substrate cleaning brush 32 provided in the substrate cleaning unit 8 of the substrate processing apparatus 1 includes the elastic brush base portion 33 and the hydrophobic base surface layer portion formed on the surface of the brush base portion 33. 34 and a cleaning brush portion 35 in which the brush 41 is implanted with a space in the base surface layer portion 34.

そのため、上記構成の基板処理装置１では、基板洗浄ブラシ32のベース表層部34が疎水性を有しているために、刷毛41の基部（ベース表層部34）に洗浄液とともにパーティクルが付着するのを防止することができ、他の基板２へのパーティクルの転写を防止することができる。   Therefore, in the substrate processing apparatus 1 configured as described above, since the base surface layer portion 34 of the substrate cleaning brush 32 has hydrophobicity, particles adhere to the base portion (base surface layer portion 34) of the brush 41 together with the cleaning liquid. It is possible to prevent the transfer of particles to the other substrate 2.

しかも、上記基板処理装置１では、基板洗浄ブラシ32のブラシベース部33が弾性を有しているために、洗浄する基板２に反りが生じていてもブラシベース部33が弾性によって基板２の反りに応じて柔軟に変形し、洗浄刷毛部35の刷毛41を基板２に均等に接触させることができ、洗浄刷毛部35の刷毛41で基板２の洗浄を良好に行うことができる。   Moreover, in the substrate processing apparatus 1, since the brush base portion 33 of the substrate cleaning brush 32 has elasticity, even if the substrate 2 to be cleaned is warped, the brush base portion 33 is elastically warped. Accordingly, the brush 41 of the cleaning brush portion 35 can be evenly brought into contact with the substrate 2, and the substrate 2 can be well cleaned with the brush 41 of the cleaning brush portion 35.

さらに、上記基板処理装置１では、基板洗浄ブラシ32のブラシベース部33を吸水性を有する素材（吸水素材）で形成するとともに、ブラシベース部33に洗浄液を供給する洗浄液供給手段39を設けた構成としている。   Further, in the substrate processing apparatus 1, the brush base portion 33 of the substrate cleaning brush 32 is formed of a water-absorbing material (water absorbing material), and a cleaning liquid supply means 39 for supplying a cleaning liquid to the brush base portion 33 is provided. It is said.

そのため、上記構成の基板処理装置１では、基板洗浄ブラシ32のブラシベース部33の内部に洗浄液を浸透させてブラシベース部33を洗浄液で膨潤させることができるので、基板２に洗浄刷毛部35の刷毛41を柔軟に押圧させることができ、洗浄刷毛部35の刷毛41で基板２の洗浄をより一層良好に行うことができる。   Therefore, in the substrate processing apparatus 1 configured as described above, the cleaning liquid can be permeated into the brush base portion 33 of the substrate cleaning brush 32 and the brush base portion 33 can be swollen with the cleaning liquid. The brush 41 can be pressed flexibly, and the substrate 2 can be cleaned more satisfactorily with the brush 41 of the cleaning brush portion 35.

また、上記基板処理装置１では、基板洗浄ブラシ32の洗浄刷毛部35に植毛した刷毛41の間隔ｔが、上記式（１）を満たす値になるようにしている。   In the substrate processing apparatus 1, the interval t between the brushes 41 planted on the cleaning brush portion 35 of the substrate cleaning brush 32 is set to a value satisfying the above formula (1).

そのため、上記構成の基板処理装置１では、基板洗浄ブラシ32の洗浄刷毛部35に植毛した刷毛41の間の洗浄液に毛細管現象が作用しても、刷毛41の基部（ベース表層部34）にまでは洗浄液が上昇せず、刷毛41の基部（ベース表層部34）に洗浄液とともにパーティクルが付着してしまうのを未然に防止することができ、他の基板２へのパーティクルの転写を防止することができる。   Therefore, in the substrate processing apparatus 1 configured as described above, even if a capillary action acts on the cleaning liquid between the brushes 41 planted on the cleaning brush part 35 of the substrate cleaning brush 32, the base part (base surface part 34) of the brush 41 is reached. Can prevent the cleaning liquid from rising and prevent particles from adhering to the base part (base surface layer part 34) of the brush 41 together with the cleaning liquid, and can prevent the transfer of the particles to other substrates 2. it can.

本発明に係る基板処理装置を示す平面図。The top view which shows the substrate processing apparatus which concerns on this invention. 基板洗浄ユニットを示す平面断面図。FIG. 3 is a plan sectional view showing the substrate cleaning unit. 同側面断面図。FIG. 基板洗浄ブラシを示す正面図（ａ）及び正面断面図（ｂ）。The front view (a) and front sectional view (b) which show a substrate cleaning brush.

符号の説明Explanation of symbols

１ 基板処理装置 ２ 基板
３ 基板搬入出部 ４ 基板搬送部
５ 基板処理部 ６ 基板受渡ユニット
７ 主搬送ユニット 8〜15 基板洗浄ユニット
17 キャリア 18 チャンバー
19 基板回転保持機構 20 基板洗浄機構
21 モータ 22 出力軸
23 ターンテーブル 24 保持体
25 アウターカップ 26 インナーカップ
27 昇降手段 28 移動体
29 アーム 30 回転軸
31 ブラシ保持体 32 基板洗浄ブラシ
33 ブラシベース部 34 ベース表層部
35 洗浄刷毛部 36 通水孔
37,38 連通孔 39 洗浄液供給手段
40 開口 41 刷毛 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate 3 Substrate carrying in / out part 4 Substrate transport part 5 Substrate processing part 6 Substrate delivery unit 7 Main transport unit 8-15 Substrate cleaning unit
17 carrier 18 chamber
19 Substrate rotation holding mechanism 20 Substrate cleaning mechanism
21 Motor 22 Output shaft
23 Turntable 24 Holding body
25 Outer cup 26 Inner cup
27 Lifting means 28 Mobile
29 Arm 30 Rotating axis
31 Brush holder 32 Substrate cleaning brush
33 Brush base part 34 Base surface part
35 Cleaning brush part 36 Water passage hole
37,38 Communication hole 39 Cleaning fluid supply means
40 opening 41 brush

Claims (5)

基板の洗浄に用いる基板洗浄ブラシにおいて、
弾性を有するブラシベース部と、
ブラシベース部の表面に形成した疎水性を有するベース表層部と、
ベース表層部に間隔をあけて植毛した洗浄刷毛部と、
を有し、
前記ブラシベース部を吸水素材で形成するとともに、前記ブラシベース部に洗浄液を供給する洗浄液供給手段を設けたことを特徴とする基板洗浄ブラシ。 In the substrate cleaning brush used for substrate cleaning,
A brush base portion having elasticity;
A hydrophobic base surface layer formed on the surface of the brush base;
A cleaning brush portion planted at intervals in the base surface layer portion;
I have a,
A substrate cleaning brush , wherein the brush base portion is formed of a water-absorbing material, and cleaning liquid supply means for supplying a cleaning liquid to the brush base portion is provided . 基板の洗浄に用いる基板洗浄ブラシにおいて、
弾性を有するブラシベース部と、
ブラシベース部の表面に形成した疎水性を有するベース表層部と、
ベース表層部に間隔をあけて植毛した洗浄刷毛部と、
を有し、
前記洗浄刷毛部に刷毛を、
ｔ≧２・Ｔ・COSθ／（ρ・ｇ・ｈ）
ここで、ｔは刷毛の間隔、
Ｔは洗浄液の表面張力、
θは刷毛と基板との間の接触角度、
ρは洗浄液の密度、
ｇは重力加速度、
ｈは刷毛の長さ
となる間隔で植毛したことを特徴とする基板洗浄ブラシ。 In the substrate cleaning brush used for substrate cleaning,
A brush base portion having elasticity;
A hydrophobic base surface layer formed on the surface of the brush base;
A cleaning brush portion planted at intervals in the base surface layer portion;
Have
A brush on the washing brush,
t ≧ 2 ・ T ・ COSθ / (ρ ・ g ・ h)
Where t is the brush spacing,
T is the surface tension of the cleaning liquid,
θ is the contact angle between the brush and the substrate,
ρ is the density of the cleaning solution,
g is the acceleration of gravity,
h is a substrate cleaning brush characterized in that the hair is planted at intervals corresponding to the length of the brush. 基板洗浄ブラシを用いて基板の洗浄を行う基板処理装置において、
基板洗浄ブラシは、
弾性を有するブラシベース部と、
ブラシベース部の表面に形成した疎水性を有するベース表層部と、
ベース表層部に間隔をあけて植毛した洗浄刷毛部と、
を有し、
前記ブラシベース部を吸水素材で形成するとともに、前記ブラシベース部に洗浄液を供給する洗浄液供給手段を設けたことを特徴とする基板処理装置。 In a substrate processing apparatus for cleaning a substrate using a substrate cleaning brush,
Substrate cleaning brush
A brush base portion having elasticity;
A hydrophobic base surface layer formed on the surface of the brush base;
A cleaning brush portion planted at intervals in the base surface layer portion;
I have a,
A substrate processing apparatus , wherein the brush base portion is formed of a water-absorbing material, and cleaning liquid supply means for supplying a cleaning liquid to the brush base portion is provided . 基板洗浄ブラシを用いて基板の洗浄を行う基板処理装置において、
基板洗浄ブラシは、
弾性を有するブラシベース部と、
ブラシベース部の表面に形成した疎水性を有するベース表層部と、
ベース表層部に間隔をあけて植毛した洗浄刷毛部と、
を有し、
前記洗浄刷毛部に刷毛を、
ｔ≧２・Ｔ・COSθ／（ρ・ｇ・ｈ）
ここで、ｔは刷毛の間隔、
Ｔは洗浄液の表面張力、
θは刷毛と基板との間の接触角度、
ρは洗浄液の密度、
ｇは重力加速度、
ｈは刷毛の長さ
となる間隔で植毛したことを特徴とする基板処理装置。 In a substrate processing apparatus for cleaning a substrate using a substrate cleaning brush,
Substrate cleaning brush
A brush base portion having elasticity;
A hydrophobic base surface layer formed on the surface of the brush base;
A cleaning brush portion planted at intervals in the base surface layer portion;
Have
A brush on the washing brush,
t ≧ 2 ・ T ・ COSθ / (ρ ・ g ・ h)
Where t is the brush spacing,
T is the surface tension of the cleaning liquid,
θ is the contact angle between the brush and the substrate,
ρ is the density of the cleaning solution,
g is the acceleration of gravity,
A substrate processing apparatus characterized in that h is implanted at intervals corresponding to the length of the brush. 基板洗浄ブラシを用いて基板の洗浄を行う基板洗浄方法において、
弾性を有するブラシベース部に疎水性を有するベース表層部を介して刷毛を形成した基板洗浄ブラシを用い、基板に洗浄液を供給しながら洗浄し、
前記洗浄液を吸水素材で形成したブラシベース部に供給しながら基板の洗浄を行うことを特徴とする基板洗浄方法。
In a substrate cleaning method for cleaning a substrate using a substrate cleaning brush,
Using a substrate cleaning brush in which a brush is formed on the brush base portion having elasticity through a hydrophobic base surface layer portion, cleaning is performed while supplying a cleaning liquid to the substrate ,
A substrate cleaning method, wherein the substrate is cleaned while supplying the cleaning liquid to a brush base portion formed of a water-absorbing material .
JP2008281046A 2008-10-31 2008-10-31 Substrate cleaning brush, substrate processing apparatus, and substrate cleaning method Expired - Fee Related JP5103356B2 (en)

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