JP5088504B2 - Contact for board inspection and method for manufacturing the same - Google Patents

Contact for board inspection and method for manufacturing the same Download PDF

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JP5088504B2
JP5088504B2 JP2008509884A JP2008509884A JP5088504B2 JP 5088504 B2 JP5088504 B2 JP 5088504B2 JP 2008509884 A JP2008509884 A JP 2008509884A JP 2008509884 A JP2008509884 A JP 2008509884A JP 5088504 B2 JP5088504 B2 JP 5088504B2
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conductive
inspection
contact
elastic
conductive portion
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JPWO2007116963A1 (en
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清 沼田
穣 加藤
正美 山本
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Nidec Read Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Description

本発明は、被検査基板の配線パターン上に設定された所定の検査点に一対の端子を圧接し、この被検査基板と基板検査装置との間で検査信号の伝達を可能とする四端子測定法に用いる基板検査用接触子、それを用いる検査治具及び基板検査用接触子の製造方法に関する。   The present invention provides a four-terminal measurement that allows a pair of terminals to be pressed against predetermined inspection points set on a wiring pattern of a substrate to be inspected, and that inspection signals can be transmitted between the substrate to be inspected and the substrate inspection apparatus. The present invention relates to a substrate inspection contact used in a method, an inspection jig using the contact, and a method for manufacturing a substrate inspection contact.

尚、この発明は、プリント配線基板に限らず、例えば、フレキシブル基板、多層配線基板、液晶ディスプレイやプラズマディスプレイ用の電極板、及び半導体パッケージ用のパッケージ基板やフィルムキャリアなど種々の基板における電気的配線の検査に適用でき、この明細書では、それら種々の配線基板を総称して「基板」と称する。   The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In this specification, these various wiring boards are collectively referred to as “substrates”.

従来、回路基板上の配線パターンは、その回路基板に搭載されるIC等の半導体や抵抗器などの電気・電子部品に電気信号を正確に伝達する必要があるため、電気・電子部品を実装する前のプリント配線基板、液晶パネルやプラズマディスプレイパネルに配線パターンが形成された回路配線基板、或いは、半導体ウェハ等の基板に形成された配線パターンに対して、検査対象となる配線パターンに設けられた検査点間の抵抗値を測定して、その良否が判定されていた。   Conventionally, a wiring pattern on a circuit board has to mount an electric / electronic component because it is necessary to accurately transmit an electric signal to an electric / electronic component such as a semiconductor such as an IC or a resistor mounted on the circuit board. Provided in the wiring pattern to be inspected against the previous printed wiring board, the circuit wiring board on which the wiring pattern was formed on the liquid crystal panel or plasma display panel, or the wiring pattern formed on the substrate such as a semiconductor wafer The resistance value between the inspection points was measured, and the quality was judged.

特許文献１：特開平６−６６８３２号公報
特許文献２：特開２００５−３２１２１１号公報
特許文献３：特許第３６９０８０１号
例えば、回路基板上の各検査点に、それぞれ電流供給用端子と電圧測定用端子とを当接させ、各検査点にそれぞれ当接させた電流供給用端子間に測定用電流を供給すると共に、各検査点にそれぞれ当接させた電圧測定用端子間に生じた電圧を測定することにより、測定端子と検査点との間の接触抵抗の影響を抑制して高精度に抵抗値を測定する方法（いわゆる、４端子測定法あるいはケルビン法）が知られており、この方法を用いて配線パターンの検査を行う基板検査装置が知られている（例えば、特許文献１参照）。Patent Document 1: Japanese Patent Laid-Open No. 6-66832 Patent Document 2: Japanese Patent Laid-Open No. 2005-321212 Patent Document 3: Japanese Patent No. 3690801 For example, at each inspection point on a circuit board, a current supply terminal and a voltage measurement A measurement current is supplied between the current supply terminals that are brought into contact with the respective test points, and the voltage generated between the voltage measurement terminals that are brought into contact with the respective test points is measured. Therefore, a method of measuring the resistance value with high accuracy by suppressing the influence of the contact resistance between the measurement terminal and the inspection point (so-called four-terminal measurement method or Kelvin method) is known. There is known a substrate inspection apparatus that uses it to inspect a wiring pattern (for example, see Patent Document 1).

しかしながら、この特許文献１に開示される基板検査装置では、４端子測定法を用いて配線パターンの検査を行う場合、電流供給用端子及び電圧測定用端子の２つの端子を検査点毎に、移動制御させながら当接させる必要がある。一方、近年、回路基板の微細化が進み、検査点となるランドが狭小化しているため、一つのランドに２つの端子を互いに電気的に短絡することなく確実に検査点に当接させることが極めて困難であるという問題が生じていた。   However, in the board inspection apparatus disclosed in Patent Document 1, when the wiring pattern is inspected using the four-terminal measurement method, the current supply terminal and the voltage measurement terminal are moved for each inspection point. It is necessary to abut while controlling. On the other hand, since miniaturization of circuit boards has progressed in recent years and the lands that serve as inspection points have become narrower, two terminals can be reliably brought into contact with the inspection points without electrically shorting each other to one land. There was a problem that it was extremely difficult.

このような問題を解決するために、円柱状のピンとこの外周に配置されていて軸方向に摺動可能な螺旋状のバネとを備える接触子が知られている（特許文献２参照）。このように接触子を形成することにより、この二つの端子を微細な検査点に容易に当接させることを可能としている。   In order to solve such a problem, a contact provided with a cylindrical pin and a spiral spring disposed on the outer periphery and slidable in the axial direction is known (see Patent Document 2). By forming the contact in this way, the two terminals can be easily brought into contact with a fine inspection point.

しかしながら、この特許文献２に開示されるような接触子は、微細な螺旋状のバネやこのバネの両端に設けられる微細なプランジャを形成する必要があるため、複雑な構成を有していた。   However, the contact as disclosed in Patent Document 2 has a complicated structure because it is necessary to form a fine spiral spring and fine plungers provided at both ends of the spring.

このため、二つの端子を互いに電気的に短絡することなく微細な検査点に容易に当接させることができるとともに、単純で且つ廉価に製造することができる構成を有する四端子測定用の接触子の創出が要求されていた。   For this reason, the contact for measuring four terminals can be easily brought into contact with a minute inspection point without electrically short-circuiting the two terminals and can be manufactured at a low cost. Creation was required.

また、特許文献３には、接触子の絶縁被覆部分の外径が、検査治具のヘッド部の保持孔の内径よりも小さく形成された構成が開示されている。   Patent Document 3 discloses a configuration in which the outer diameter of the insulating coating portion of the contact is formed smaller than the inner diameter of the holding hole of the head portion of the inspection jig.

その構成は、接触ピンの保持孔への挿入やその保持孔からの抜き取りができるようにするためのものである。   The configuration is for enabling the contact pin to be inserted into and removed from the holding hole.

本発明は、このような実情に鑑みてなされたもので、二つの端子を互いに電気的に短絡することなく微細な検査点に容易に当接させることができるとともに、単純な構造で廉価に製造することができる構成を有する四端子測定用の基板検査用接触子、それを用いる検査治具及び基板検査用接触子の製造方法を提供することを目的とする。   The present invention has been made in view of such circumstances, and can easily abut a minute inspection point without electrically short-circuiting two terminals with each other, and can be manufactured inexpensively with a simple structure. An object of the present invention is to provide a substrate inspection contact for measuring four terminals, a test jig using the same, and a method for manufacturing the substrate inspection contact.

また、本発明は、接触子を検査治具に取り付けた際の撓みの影響を受けることなく、接触子が確実に検査点に接触できる基板検査用接触子を提供することを目的とする。   Another object of the present invention is to provide a contact for inspecting a substrate that allows the contact to reliably contact an inspection point without being affected by bending when the contact is attached to an inspection jig.

さらに、本発明は、一体的に弾性部が形成された基板検査用接触子を提供することを目的とする。   Another object of the present invention is to provide a contact for inspecting a substrate in which an elastic portion is integrally formed.

本発明に係る基板検査用接触子は、被検査基板の配線パターン上に設定される所定の検査点に接触する検査点接触部と検査装置の電極部に接触する検査電極接触部とをそれぞれ備える第一導電部及び第二導電部を有するとともに第一導電部又は第二導電部の一方が電圧測定に用いられ、他方が電流印加用に用いられ、端部が検査装置の検査治具のヘッド部に設けられた保持板の保持孔に挿入され保持される。   The substrate inspection contact according to the present invention includes an inspection point contact portion that contacts a predetermined inspection point set on the wiring pattern of the substrate to be inspected and an inspection electrode contact portion that contacts an electrode portion of the inspection apparatus. It has a first conductive part and a second conductive part, and one of the first conductive part or the second conductive part is used for voltage measurement, the other is used for current application, and the end is a head of an inspection jig of the inspection apparatus. It is inserted and held in a holding hole of a holding plate provided in the section.

この基板検査用接触子は、第一導電部が、可撓性及び導電性を有する長尺状の形状を有し、さらに、長手方向に伸縮する弾性部を有し、第二導電部が、第一導電部を内部に収容するとともに可撓性及び導電性を有する筒状部材により形成され、弾性部が、ヘッド部の保持孔に保持される際に、保持孔の内部に配置される部分に設けられることを特徴とする。   In this contact for inspection of a substrate, the first conductive portion has a long shape having flexibility and conductivity, and further has an elastic portion that expands and contracts in the longitudinal direction. A portion that is formed by a cylindrical member that accommodates the first conductive portion and has flexibility and conductivity, and is disposed inside the holding hole when the elastic portion is held in the holding hole of the head portion. It is provided in.

保持板は上部保持板及び下部保持板からなり、上部保持板又は下部保持板の一方の保持孔に挿入される第一導電部又は第二導電部の一方に弾性部が形成されていることが望ましい。   The holding plate is composed of an upper holding plate and a lower holding plate, and an elastic portion is formed in one of the first conductive portion and the second conductive portion inserted into one holding hole of the upper holding plate or the lower holding plate. desirable.

また、保持板が上部保持板及び下部保持板からなり、第一導電部に設けられた弾性部と第二導電部に設けられた弾性部とが、異なる保持板の保持孔に挿入される位置に形成されていることが望ましい。   The holding plate is composed of an upper holding plate and a lower holding plate, and the elastic portion provided in the first conductive portion and the elastic portion provided in the second conductive portion are inserted into the holding holes of different holding plates. It is desirable that it is formed.

弾性部は、第一導電部又は第二導電部と一体的に形成されていることが望ましい。   The elastic part is desirably formed integrally with the first conductive part or the second conductive part.

未使用時において、第一導電部が第二導電部よりも長く、又は、未使用時において、第二導電部が第一導電部よりも長くてもよい。   The first conductive part may be longer than the second conductive part when not used, or the second conductive part may be longer than the first conductive part when not used.

また、本発明に係る基板検査用接触子は、被検査基板の配線パターン上に設定される所定の検査点に接触する検査点接触部と検査装置の電極部に接触する検査電極接触部とを備え、端部が検査装置の検査治具のヘッド部に設けられた保持板の保持孔に挿入され保持されている。この基板検査用接触子は、可撓性及び導電性を有する長尺状の形状を有し、さらに、長手方向に伸縮する弾性部が一体的に形成されており、弾性部が、ヘッド部の保持孔に保持される際に、保持孔の内部に配置される部分に設けられることが望ましい。   The substrate inspection contact according to the present invention includes an inspection point contact portion that contacts a predetermined inspection point set on a wiring pattern of a substrate to be inspected and an inspection electrode contact portion that contacts an electrode portion of the inspection apparatus. Provided, and an end portion is inserted and held in a holding hole of a holding plate provided in a head portion of an inspection jig of the inspection apparatus. This contact for inspecting a substrate has a long shape having flexibility and conductivity, and further, an elastic part that expands and contracts in the longitudinal direction is integrally formed. When being held in the holding hole, it is desirable to be provided in a portion disposed inside the holding hole.

さらに、本発明に係る検査治具は、被検査基板の配線パターンの電気的特性を検査するために被検査基板の所定の検査点に接触させて電気信号を伝送する複数の接触子と複数の接触子を保持する保持体とからなる。この検査治具は、接触子が、可撓性及び導電性を有する第一導電部と第一導電部を内部に収容する可撓性及び導電性を有する第二導電部とからなり、保持体が、所定の検査点に接触子の一端を案内する第一保持孔と、接触子の他端を検査装置の電極部へ案内する第二保持孔を有し、第一導電部は、少なくとも一つの長手方向に伸縮する弾性部を有し、弾性部は、第一保持孔及び／又は第二保持孔内に配置されている。   Furthermore, the inspection jig according to the present invention includes a plurality of contacts for transmitting an electrical signal by contacting a predetermined inspection point of the substrate to be inspected in order to inspect the electrical characteristics of the wiring pattern of the substrate to be inspected. It consists of a holding body holding a contact. In this inspection jig, the contact includes a first conductive part having flexibility and conductivity, and a second conductive part having flexibility and conductivity in which the first conductive part is accommodated. Has a first holding hole that guides one end of the contact to a predetermined inspection point, and a second holding hole that guides the other end of the contact to the electrode part of the inspection device. One elastic part which expands and contracts in the longitudinal direction is provided, and the elastic part is arranged in the first holding hole and / or the second holding hole.

保持孔は被検査基板に対し直交する方向に形成されていて、弾性部は保持孔内において接触子の長手方向に直線的に伸縮自在であることが望ましい。   It is desirable that the holding hole is formed in a direction perpendicular to the substrate to be inspected, and the elastic portion is linearly expandable and contractable in the longitudinal direction of the contact in the holding hole.

第一保持孔又は第二保持孔の一方に挿入される第一導電部又は第二導電部の一方に弾性部が形成されていることを特徴とする。   An elastic part is formed in one of the first conductive part or the second conductive part inserted into one of the first holding hole or the second holding hole.

第一導電部に設けられた弾性部と第二導電部に設けられた弾性部とが、異なる保持孔に挿入される部分に形成されていることが望ましい。   It is desirable that the elastic portion provided in the first conductive portion and the elastic portion provided in the second conductive portion are formed in portions inserted into different holding holes.

弾性部は、第一導電部又は第二導電部と一体的に形成されていることが望ましい。   The elastic part is desirably formed integrally with the first conductive part or the second conductive part.

また、本発明に係る基板検査用接触子を製造する製造方法は、被検査基板の配線パターン上に設定される所定の検査点に夫々が圧接され、一方が電圧測定に用いられ、他方が電流印加用に用いられる第一導電部及び第二導電部を有する基板検査用接触子を製造する製造方法である。この製造方法は、導電性を有する長尺状の第一導電部の一部にレーザ光を照射して、一部を所定形状に加工して、第一導電部の長手方向に伸縮する弾性部を形成する弾性部形成工程と、弾性部が形成された第一導電部を、導電性を有する筒状部材により形成される第二導電部に収容する収容工程を有する。   Further, in the manufacturing method for manufacturing a substrate inspection contact according to the present invention, each of the predetermined inspection points set on the wiring pattern of the substrate to be inspected is press-contacted, one is used for voltage measurement, and the other is a current. It is a manufacturing method which manufactures the contact for a board | substrate test | inspection which has the 1st electroconductive part used for application, and a 2nd electroconductive part. In this manufacturing method, a part of a long first conductive part having conductivity is irradiated with laser light, a part is processed into a predetermined shape, and an elastic part that expands and contracts in the longitudinal direction of the first conductive part And an accommodating step of accommodating the first conductive portion on which the elastic portion is formed in the second conductive portion formed by a cylindrical member having conductivity.

弾性部形成工程において一部に弾性部を形成する第一導電部及び第二導電部は、全体として可撓性を有することが望ましい。   It is desirable that the first conductive portion and the second conductive portion that form the elastic portion in part in the elastic portion forming step have flexibility as a whole.

弾性部形成工程は、第一導電部の一部にレーザ光を照射して所定厚みの板状部を形成する第一形成工程と、板状部にレーザ光を照射して、板状部の幅方向外側から内側に向って、交互に反対側から複数の所定の形状を作成するための切欠部を形成する第二形成工程を有することが望ましい。   The elastic portion forming step includes a first forming step of irradiating a part of the first conductive portion with laser light to form a plate-like portion having a predetermined thickness, and irradiating the plate-like portion with laser light to It is desirable to have a second forming step of forming notches for creating a plurality of predetermined shapes alternately from the opposite side from the outside in the width direction to the inside.

弾性部は、板状部の一部を幅方向に交互に切欠いて波形状に形成され、弾性部は、板状部の一部を幅方向に切欠いて矩形波状に形成され、弾性部は、板状部の幅方向の外側部分を切欠いて細棒状に形成され、又は、弾性部は、板状部上で板状部の中心点に関し点対称となるように形成され、さらに、弾性部形成工程の後に、第一導電部の外周に絶縁膜を形成する工程を有し、さらに、収容工程の後に、第二導電部の端部を先細り形状に形成する工程を有することが望ましい。   The elastic part is formed in a wave shape by alternately cutting out a part of the plate-like part in the width direction, and the elastic part is formed in a rectangular wave shape by cutting out a part of the plate-like part in the width direction. The outer portion in the width direction of the plate-like portion is cut out to be formed into a thin rod shape, or the elastic portion is formed so as to be point-symmetric with respect to the center point of the plate-like portion on the plate-like portion. It is desirable to have a step of forming an insulating film on the outer periphery of the first conductive portion after the step, and further, a step of forming the end portion of the second conductive portion in a tapered shape after the accommodating step.

また、本発明に係る基板検査用接触子は、被検査基板の配線パターン上に設定される所定の検査点に夫々が圧接され、一方が電圧測定に用いられ、他方が電流印加用に用いられる第一導電部及び第二導電部を有する。この基板検査用接触子は、第一導電部は、導電性を有する長尺状の形状を有するとともに、第一導電部の一部分にレーザ光を照射して形成される長手方向に収縮する弾性部を有し、第二導電部は、第一導電部を内部に収容するとともに導電性を有する筒状部材により形成される。   Further, the substrate inspection contact according to the present invention is in pressure contact with a predetermined inspection point set on the wiring pattern of the substrate to be inspected, one is used for voltage measurement, and the other is used for current application. It has a first conductive part and a second conductive part. In this contact for inspecting a substrate, the first conductive portion has a long shape having conductivity, and an elastic portion that contracts in the longitudinal direction formed by irradiating a part of the first conductive portion with laser light. The second conductive part is formed of a cylindrical member that houses the first conductive part and has conductivity.

本発明によると、二つの端子を互いに電気的に短絡することなく微細な検査点に容易に当接させることができるとともに、単純な構造で廉価に製造することができる構成を有する四端子測定用の基板検査用接触子を提供することができる。   According to the present invention, the two terminals can be easily brought into contact with a fine inspection point without being electrically short-circuited with each other, and can be manufactured at a low cost with a simple structure. The substrate inspection contact can be provided.

一本の第一導電部や第二導電部の一部に弾性部を一体的に形成するので、接続部材や接続材などを必要とすることなく基板検査用接触子を製造することなくできる。それにより、耐久性に優れた基板検査用接触子に優れた耐久性を与えることができる。   Since the elastic portion is integrally formed on a part of the first conductive portion or the second conductive portion, it is possible to manufacture a contact for inspection of a substrate without requiring a connecting member or a connecting material. Thereby, the outstanding durability can be given to the contactor for substrate inspection excellent in durability.

その弾性部の形成のためにレーザ加工を用いてもよく、レーザ加工を用いると、レーザ光はそのビーム径を絞ることにより、微細な加工が可能であるため、そのことを利用して元々微細な四端子接触子の導電部に加工を施し、弾性部を形成することにより、本体と弾性部とが一体となった導電部を得ることが可能となる。   Laser processing may be used to form the elastic portion. When laser processing is used, the laser beam can be finely processed by reducing its beam diameter. By processing the conductive portion of the four-terminal contact and forming the elastic portion, it is possible to obtain a conductive portion in which the main body and the elastic portion are integrated.

また、本発明によると、接触子の弾性部をヘッド部の保持孔内部に配置できる位置に形成したので、接触子を検査治具に取り付けた際の接触子の撓みの影響を受けることがなく、それにより、弾性部が確実に保持孔内で伸縮することができて、接触子が検査点に確実に接触できる基板検査用接触子を提供することができる。   Further, according to the present invention, since the elastic portion of the contact is formed at a position where it can be placed inside the holding hole of the head portion, it is not affected by the deflection of the contact when the contact is attached to the inspection jig. As a result, it is possible to provide a contact for inspecting a substrate in which the elastic portion can surely expand and contract in the holding hole, and the contact can reliably contact the inspection point.

図１は、本発明に係る第一実施形態の基板検査接触子を示し、図１（ａ）は分解図、図１（ｂ）は組立図である。1A and 1B show a substrate inspection contact according to a first embodiment of the present invention. FIG. 1A is an exploded view and FIG. 1B is an assembly view. 図２は、本発明に係る第一実施形態の基板検査用接触子の一端の断面図である。FIG. 2 is a cross-sectional view of one end of the substrate inspection contact according to the first embodiment of the present invention. 図３（ａ）から図３（ｃ）は、第一実施形態の基板検査用接触子を検査装置の電極と被検査基板の検査点との間に取り付ける工程を説明するための図である。FIG. 3A to FIG. 3C are diagrams for explaining a process of attaching the substrate inspection contact according to the first embodiment between the electrode of the inspection apparatus and the inspection point of the substrate to be inspected. 図４は、本発明に係る第二実施形態の基板検査接触子を示し、図４（ａ）は分解図、図４（ｂ）は組立図である。4A and 4B show a substrate inspection contact according to a second embodiment of the present invention. FIG. 4A is an exploded view and FIG. 4B is an assembly view. 図５は、本発明に係る第三実施形態の基板検査接触子を示し、図５（ａ）は分解図、図５（ｂ）は組立図である。5A and 5B show a substrate inspection contact according to a third embodiment of the present invention. FIG. 5A is an exploded view and FIG. 5B is an assembly view. 図６は、本発明に係る第三実施形態の基板検査用接触子を電極と検査点との間に取り付けた状態を示す側面図である。FIG. 6 is a side view showing a state in which the substrate inspection contact according to the third embodiment of the present invention is attached between an electrode and an inspection point. 図７は、本発明に係る第三実施形態の基板検査用接触子の一部変形例を電極と検査点との間に取り付けた状態を示す側面図である。FIG. 7 is a side view showing a state in which a partial modification of the substrate inspection contact according to the third embodiment of the present invention is attached between an electrode and an inspection point. 図８は、本発明に係る第四実施形態の基板検査接触子を示し、図８（ａ）は分解図、図８（ｂ）は組立図である。8A and 8B show a substrate inspection contact according to a fourth embodiment of the present invention. FIG. 8A is an exploded view and FIG. 8B is an assembly view. 図９は、本発明に係る第五実施形態の基板検査接触子を示す側面図である。FIG. 9 is a side view showing the substrate inspection contact according to the fifth embodiment of the present invention. 図１０は、本発明に係る第六実施形態の基板検査接触子を示す側面図である。FIG. 10 is a side view showing a substrate inspection contact according to the sixth embodiment of the present invention. 図１１（ａ）から図１１（ｄ）は、第一実施形態の基板検査用接触子の第一導電部の各製造工程における形状を示す側面図である。FIG. 11A to FIG. 11D are side views showing the shapes in the respective manufacturing steps of the first conductive portion of the substrate inspection contact according to the first embodiment. 図１２は、基板検査用接触子の弾性部を形成するためのレーザ装置の概略構成図である。FIG. 12 is a schematic configuration diagram of a laser device for forming an elastic portion of the substrate inspection contact. 図１３は、レーザ装置を用いて基板検査用接触子の弾性部を形成するための工程を説明するためのフローチャートである。FIG. 13 is a flowchart for explaining a process for forming an elastic portion of the substrate inspection contact using the laser device. 図１４は、基板検査用接触子の弾性部のさまざまな形状の例示を説明するための概略図である。FIG. 14 is a schematic diagram for explaining examples of various shapes of the elastic portion of the contact for inspecting a substrate.

符号の説明Explanation of symbols

１・・・・・第一実施形態の基板検査用接触子
１１・・・・第一導電部
１２・・・第二導電部
１３・・・・棒状部分
１３１・・・貫入部
１４・・・・弾性部
５１，６１，７１，８１・・・・第一導電部
５４，６４，７４，８４・・・弾性部
１００・・・レーザ装置
２００・・・第二実施形態の基板検査用接触子
２１１・・・第一導電部
２１２・・・第二導電部
２１３・・・棒状部材
２１４・・・弾性部
３００・・・第三実施形態の基板検査用接触子
３１１・・・第一導電部
３１２・・・第二導電部
３１４・・・弾性部
４００・・・第四実施形態の基盤検査用接触子
４１１・・・第一導電部
４１２・・・第二導電部
４１３・・・棒状部材
４１４・・・弾性部
５００・・・第五実施形態の基盤検査用接触子
５１１・・・第一導電部
５１２・・・第二導電部
５１４・・・弾性部
６００・・・第六実施形態の基盤検査用接触子
６１１・・・第一導電部
６１４・・・弾性部DESCRIPTION OF SYMBOLS 1 ... Board inspection contact 11 of 1st embodiment ...... 1st electroconductive part 12 ... 2nd electroconductive part 13 ...... rod-shaped part 131 ... penetration part 14 ... -Elastic part 51, 61, 71, 81 ...... 1st electroconductive part 54, 64, 74, 84 ... Elastic part 100 ... Laser apparatus 200 ... Contact for substrate inspection of 2nd embodiment 211 ... 1st electroconductive part 212 ... 2nd electroconductive part 213 ... stick-shaped member 214 ... elastic part 300 ... contactor 311 for board | substrate inspection of 3rd embodiment ... 1st electroconductive part 312 ... second conductive part 314 ... elastic part 400 ... contact for inspection 411 of the fourth embodiment ... first conductive part 412 ... second conductive part 413 ... rod-shaped member 414... Elastic portion 500... Base inspection contact 511 of the fifth embodiment. First conductive portion 512. Conductive portions 514 ... elastic portion 600 ... base test contactor 611 ... first conductive section 614 ... elastic portion of the sixth embodiment

［第一実施形態の基板検査用接触子の構造］
本発明に係る第一実施形態の基板検査用接触子１について説明する。[Structure of Contact for Board Inspection of First Embodiment]
A substrate inspection contact 1 according to a first embodiment of the present invention will be described.

図１及び図２は、基板検査用接触子１の構造を示す。図１（ａ）は分解図、図１（ｂ）は組立図である。図２は、基板検査用接触子１の一端の一部断面図である。   1 and 2 show the structure of the substrate inspection contact 1. FIG. 1A is an exploded view, and FIG. 1B is an assembly view. FIG. 2 is a partial cross-sectional view of one end of the substrate inspection contact 1.

基板検査用接触子１は、第一導電部１１及び第二導電部１２を有していて、第二導電部１２は、図１（ｂ）に示すように、第一導電部１１を内部に収容する筒状に形成されている。   The board inspection contact 1 has a first conductive part 11 and a second conductive part 12, and the second conductive part 12 has the first conductive part 11 inside as shown in FIG. It is formed in a cylindrical shape to accommodate.

第二導電部１２は、可撓性の素材で形成されていて、使用時に、被検査基板の配線パターン上の検査点と検査装置の電極部との間に両端が挟まれると撓み、その弾力性によって、その両端を検査点及び電極部に圧接する。第二導電部１２の素材として、ニッケル（Ni）やステンレス鋼等を用いることができるが、特にそれらに限定されるものではなく、可撓性及び導電性を有するものであればどのようなものでもよい。図示していないが第二導電部１２の外側表面に絶縁層を設けることが好ましい。   The second conductive portion 12 is formed of a flexible material, and bends when both ends are sandwiched between the inspection point on the wiring pattern of the substrate to be inspected and the electrode portion of the inspection device during use. Depending on the nature, both ends thereof are pressed against the inspection point and the electrode part. Nickel (Ni), stainless steel, or the like can be used as the material of the second conductive portion 12, but is not particularly limited thereto, and any material having flexibility and conductivity can be used. But you can. Although not shown, it is preferable to provide an insulating layer on the outer surface of the second conductive portion 12.

また、第二導電部１２は、超微細電鋳パイプ１２２から形成された筒状のものから構成されていて、内部に第一導電部１１を収容する空間が形成されている。例えば、その内径は約７０μｍであり、外径は９０μｍである。組立は、図１（ｂ）に示すように、その内部に第一導電部１１を収容した後、端部１２１を先細り形状に形成することによって行う。なお、この先細り形状は、第一導電部１１を第二導電部１２に収容した後、例えば、第二導電部１２の先端部を外側周縁から押圧することにより形成することができる。   The second conductive portion 12 is formed of a cylindrical shape formed from the ultrafine electroformed pipe 122, and a space for accommodating the first conductive portion 11 is formed therein. For example, the inner diameter is about 70 μm and the outer diameter is 90 μm. As shown in FIG. 1B, the assembly is performed by forming the end 121 in a tapered shape after the first conductive portion 11 is accommodated therein. The tapered shape can be formed by, for example, pressing the tip of the second conductive portion 12 from the outer peripheral edge after the first conductive portion 11 is accommodated in the second conductive portion 12.

第一導電部１１は、棒状又は針状に形成される長尺状の部材から形成されている。この第一導電部１１は、第二導電部１２と同軸に設けられるので、円柱状に形成されることが好ましい。   The 1st electroconductive part 11 is formed from the elongate member formed in rod shape or needle shape. Since the first conductive portion 11 is provided coaxially with the second conductive portion 12, it is preferably formed in a columnar shape.

第一導電部１１も、第二導電部１２と同様に、導電性で且つ可撓性を有する部材から形成されている。第一導電部１１が導電性の部材から構成されることによって、測定装置の電極と被検査基板の検査点との間で電気信号を受信及び送信することができる。また、この第一導電部１１が可撓性を有することによって、後述するように、使用時に、第二導電部１２が両端側からの押圧に伴い撓む場合に、その撓みに応じて第一導電部１１も撓むことができる。   The first conductive portion 11 is also formed of a conductive and flexible member, like the second conductive portion 12. By configuring the first conductive portion 11 from a conductive member, an electrical signal can be received and transmitted between the electrode of the measuring apparatus and the inspection point of the substrate to be inspected. Further, since the first conductive portion 11 has flexibility, as will be described later, when the second conductive portion 12 bends due to the pressure from both ends during use, the first conductive portion 11 responds to the bending. The conductive part 11 can also be bent.

図１（ａ）又は図１（ｂ）に示すように、第一導電部１１は、検査点に接触する側の端部に、検査点に貫入することのできる尖鋭形状の貫入部１３１を有する。   As shown in FIG. 1 (a) or FIG. 1 (b), the first conductive portion 11 has a sharp penetrating portion 131 that can penetrate the inspection point at the end portion on the side in contact with the inspection point. .

そのように貫入部１３１を尖鋭形状に形成すると、第一導電部１１の貫入部１３１が検査点へ容易に貫入することができるとともに、接触している間、検査点との間の接触抵抗を小さくすることができる。また、接触を行うごとの接触抵抗値のばらつきを防いで抵抗値を安定的に一定範囲内に収めることができる。   When the penetration part 131 is formed in such a sharp shape as described above, the penetration part 131 of the first conductive part 11 can easily penetrate into the inspection point, and the contact resistance between the inspection point and the inspection point can be reduced while in contact. Can be small. In addition, it is possible to prevent a variation in contact resistance value every time contact is performed, and to stably keep the resistance value within a certain range.

この実施例では、貫入部１３１の形状は円錐形状に形成しているが、四角錐や三角錐等の角錐状のものでもよい。また、貫入部１３１の先端形状を尖鋭形状でなくて球形形状とし、その形状の貫入部を検査点に押し付けることによって接触を確実にするようにしてもよい。   In this embodiment, the shape of the penetration portion 131 is a conical shape, but it may be a pyramid shape such as a quadrangular pyramid or a triangular pyramid. Further, the tip shape of the penetration portion 131 may be a spherical shape instead of a sharp shape, and the contact portion may be pressed by pressing the penetration portion of the shape against the inspection point.

第一導電部１１は、貫入部１３１が、図１（ｂ）に示すように、尖鋭形状を有する場合に、第二導電部１２の端部よりも所定量ｄ１１分だけ突出するように配置される。このように貫入部１３１を所定量ｄ１１だけ突出させた場合には、詳しくは後述するように、基板検査用接触子１を両端から押圧して検査点に圧接させると、まず、この所定量ｄ１１分だけ第一導電部１１が検査点へ貫入してから第二導電部１２が検査点に当接することになる。そして、更に両端から圧接されることによって、第二導電部１２が撓んでその端部が検査点及び電極に圧接されるようになる。そのため、突出の量ｄ１１は、貫入部１３１の貫入量と、第一導電部１１及び第二導電部１２の撓み量等を考慮して決定される。   The first conductive portion 11 is disposed so as to protrude by a predetermined amount d11 from the end of the second conductive portion 12 when the penetration portion 131 has a sharp shape as shown in FIG. The When the penetration portion 131 is protruded by the predetermined amount d11 in this way, as will be described in detail later, when the board inspection contact 1 is pressed from both ends and is brought into pressure contact with the inspection point, first, the predetermined amount d11. After the first conductive portion 11 has penetrated into the inspection point, the second conductive portion 12 comes into contact with the inspection point. Further, by being pressed from both ends, the second conductive portion 12 is bent, and the end is pressed against the inspection point and the electrode. Therefore, the protrusion amount d11 is determined in consideration of the penetration amount of the penetration portion 131, the deflection amounts of the first conductive portion 11 and the second conductive portion 12, and the like.

図２に示すように、第一導電部１１の外側表面には絶縁層１５が被覆されている。この絶縁層は、第一導電部１１と第二導電部１２とが電気的に短絡することを防止するためである。   As shown in FIG. 2, the outer surface of the first conductive portion 11 is covered with an insulating layer 15. This insulating layer is for preventing the first conductive part 11 and the second conductive part 12 from being electrically short-circuited.

絶縁層１５は、貫入部１３１を形成する傾斜面１３２の一部までを被覆することが好ましい。このように被覆することにより第一及び第二導電部の短絡を確実に防止できるようになる。   The insulating layer 15 preferably covers up to a part of the inclined surface 132 that forms the penetration part 131. By covering in this way, a short circuit between the first and second conductive parts can be reliably prevented.

この絶縁層１５には、例えば、テフロン（登録商標）やポリウレタンを用いることができる。   For example, Teflon (registered trademark) or polyurethane can be used for the insulating layer 15.

また、図１（ａ）に示すように、第一導電部１１の中央部には、のこぎり形状の弾性部１４が形成されている。弾性部１４は、基板検査用接触子１の長軸方向に伸縮しまた基板検査用接触子１の湾曲とともに撓み、付勢状態となる。そのように収縮及び湾曲するような部材であれば、弾性部１４を導電性のゴムや合成樹脂など、どのようなものから形成してもよい。弾性部１４を非導電性部材から形成した場合には、第一導電部１１の外周と絶縁膜１５との間に導電層を形成するか、または第二導電部１２の内面に導電層を形成して、第一導電部の両端部の２つの貫入部１３１を電気的に相互に接続するようにする。   As shown in FIG. 1A, a saw-shaped elastic portion 14 is formed at the center of the first conductive portion 11. The elastic portion 14 expands and contracts in the major axis direction of the board inspection contact 1 and bends together with the curvature of the board inspection contact 1 to be in a biased state. The elastic portion 14 may be formed of any material such as conductive rubber or synthetic resin as long as it is a member that shrinks and curves. When the elastic portion 14 is formed from a non-conductive member, a conductive layer is formed between the outer periphery of the first conductive portion 11 and the insulating film 15, or a conductive layer is formed on the inner surface of the second conductive portion 12. Then, the two penetration portions 131 at both ends of the first conductive portion are electrically connected to each other.

第一導電部１１及び第二導電部１２を組み立てて基板検査用接触子１を形成するに当たっては、まず、上記の如く、第一導電部１１を第二導電部１２の内部に収容して、貫入部１３１を所定量ｄ１１分だけ第二導電部１２の端部から突出させる。次に、第二導電部１２の両端部を押圧して図１（ｂ）及び図２に示すように内側に絞り込む。   In assembling the first conductive portion 11 and the second conductive portion 12 to form the contactor 1 for substrate inspection, first, as described above, the first conductive portion 11 is accommodated inside the second conductive portion 12, The penetration part 131 is projected from the end of the second conductive part 12 by a predetermined amount d11. Next, both end portions of the second conductive portion 12 are pressed and narrowed inward as shown in FIGS.

その絞込みにより、図２に示すように、第二導電部１２の端部は、所定の傾斜で内側方向へ延設された延設部１２３を有し、内部に収縮する先細りのテーパ形状になっている。このように内側方向へ延設される延設部１２３を形成することによって、第一導電部１１が第二導電部１２の端部の開口から外側へ抜け出ることを防止することができるとともに、第一導電部の検査点に接触する端部の位置と第二導電部の検査点に接触する端部の位置とを近づけることができる。これにより、より小さな検査点であっても、第一及び第二導電部１１、１２をそのような検査点に接触させることができるようになる。   As a result of the narrowing down, as shown in FIG. 2, the end of the second conductive portion 12 has an extending portion 123 extending inward with a predetermined inclination, and has a tapered shape that shrinks to the inside. ing. By forming the extending portion 123 extending inward in this way, the first conductive portion 11 can be prevented from slipping out from the opening of the end portion of the second conductive portion 12, and the first The position of the end contacting the inspection point of the one conductive part can be brought close to the position of the end contacting the inspection point of the second conductive part. Thereby, even if it is a smaller test | inspection point, the 1st and 2nd electroconductive parts 11 and 12 can be made to contact such an inspection point.

この延設部１２３が有する内側表面の傾斜面１２４は、第一導電部１１の貫入部１３１の傾斜面１３２及びその傾斜面１３２の部位を被覆する絶縁層１５の傾斜面１５１またはそれらのいずれか一方の傾斜面と略平行となるように形成されることが好ましい。   The inclined surface 124 of the inner surface of the extending portion 123 includes the inclined surface 132 of the penetration portion 131 of the first conductive portion 11 and the inclined surface 151 of the insulating layer 15 covering the portion of the inclined surface 132 or any one of them. It is preferably formed so as to be substantially parallel to one of the inclined surfaces.

延設部１２３の傾斜面１２４と貫入部１３１の傾斜面１３２及び／又は絶縁部１５の傾斜面１５１とが略平行となるように形成されることによって、第一導電部１１と第二導電部１２とが被検査点に接触する場合に、両方の端部は傾斜した平行のままの状態で被検査点に接触することになるので、第一導電部１１と第二導電部１２とが開口部近傍において接触することを防止することができる。   By forming the inclined surface 124 of the extending portion 123 and the inclined surface 132 of the penetration portion 131 and / or the inclined surface 151 of the insulating portion 15 to be substantially parallel, the first conductive portion 11 and the second conductive portion. 12 and the inspected point, both end portions are in contact with the inspected point while being inclined and parallel, so that the first conductive portion 11 and the second conductive portion 12 are opened. It is possible to prevent contact in the vicinity of the portion.

基板検査用接触子１の寸法は、例えば、第一導電部１１の外径ｗ１が40〜50μｍ、第二導電部１２の外径ｗ２が80〜100μｍ、第二導電部１２の内径ｗ３が60〜70μｍ、延設部１２３の開口径ｗ４が40〜60μｍ、第一導電部１１の絶縁層１３が被覆された外径ｗ５が50〜70μｍ、第一導電部１１と第二導電部１２とのクリアランスｗ６が1〜10μｍである。このように、第一導電部１１の長さ方向の全周にわたって第二導電部１２との間に空間が形成されている。   The dimensions of the substrate inspection contact 1 are, for example, that the outer diameter w1 of the first conductive portion 11 is 40 to 50 μm, the outer diameter w2 of the second conductive portion 12 is 80 to 100 μm, and the inner diameter w3 of the second conductive portion 12 is 60. ˜70 μm, the opening diameter w4 of the extending portion 123 is 40 to 60 μm, the outer diameter w5 coated with the insulating layer 13 of the first conductive portion 11 is 50 to 70 μm, and the first conductive portion 11 and the second conductive portion 12 The clearance w6 is 1 to 10 μm. In this manner, a space is formed between the first conductive portion 11 and the second conductive portion 12 over the entire circumference in the length direction.

尚、これらの数値は、約±5μｍの範囲のズレは許容範囲に入るものとすることができる。   Incidentally, these numerical values can be set within an allowable range of deviation of about ± 5 μm.

また、貫入部１３１の突出量ｄ１１は、2〜15μｍ、好ましくは7〜13μｍ、更に好ましくは約10μｍに設定されている。   Further, the protruding amount d11 of the penetration part 131 is set to 2 to 15 μm, preferably 7 to 13 μm, and more preferably about 10 μm.

上記の例のように突出量ｄ１１を適切な値に設定することによって、第二導電部１２の貫入部１３１の先端が検査点の中心を外れて当接した場合であっても、確実に第二導電部１２の延設部１２３も検査点に接触することになる。   By setting the protrusion amount d11 to an appropriate value as in the above example, even if the tip of the penetration portion 131 of the second conductive portion 12 comes out of contact with the center of the inspection point, it is ensured. The extending portion 123 of the second conductive portion 12 is also in contact with the inspection point.

また、第一導電部１１の外側表面に絶縁層を被覆したり、第二導電部１２の内側表面に絶縁層を被覆したり、又は、それらの両方に絶縁層を被覆したりすることによって、各導電部を流れる電気信号が確実に送受信される。   Also, by covering the outer surface of the first conductive part 11 with an insulating layer, covering the inner surface of the second conductive part 12 with an insulating layer, or covering both of them with an insulating layer, The electric signal flowing through each conductive part is reliably transmitted and received.

［第一実施形態の基板検査用接触子の取り付け］
図３（ａ），図３（ｂ）及び図３（ｃ）は、基板検査用接触子１を用いて、被検査基板Ｋ上の所定の２つの検査点Ｂの間の抵抗を測定するために、第一導電部１を検査装置の電極部ＥＰと被検査基板Ｋの検査点Ｂとの間に固定するまでの概略の工程を示す。なお、図３（ａ），図３（ｂ）及び図３（ｃ）においては、説明の簡略化のために、第二導電部１２の図示は省略してある。[Attaching the contact for inspecting the substrate of the first embodiment]
3 (a), 3 (b) and 3 (c) are diagrams for measuring a resistance between two predetermined inspection points B on the substrate K to be inspected using the substrate inspection contact 1. FIG. The schematic steps for fixing the first conductive portion 1 between the electrode portion EP of the inspection apparatus and the inspection point B of the substrate K to be inspected are shown. In FIG. 3A, FIG. 3B, and FIG. 3C, the second conductive portion 12 is not shown for simplicity of explanation.

まず、図３（ａ）に示すように、上側の棒状部材１３の端部を電極部ＥＰに接触させるとともに、下側の棒状部材１３の端部を検査点Ｂに接触させるように、第一導電部１１を電極部ＥＰと検査点Ｂとの間に配置する。   First, as shown in FIG. 3A, the end of the upper bar 13 is brought into contact with the electrode part EP, and the end of the lower bar 13 is brought into contact with the inspection point B. The conductive portion 11 is disposed between the electrode portion EP and the inspection point B.

次に、図３（ｂ）に示すように、電極部ＥＰが固定されているプレート及び検査点Ｂの被検査基板Ｋの双方又は一方を移動して、電極部ＥＰと検査点Ｂとの間の間隔を狭めて、第一導電部１１の両端部を長軸方向に沿って中央に向かって押し付ける。この押圧力によって、第一導電部１１の弾性部１４が長軸方向に沿って収縮する。一方、その弾性部１４の付勢力によって、第一導電部１１の貫入部１３１が検査点Ｂに貫入される。さらに押圧力が加えられて弾性部１４がさらに収縮すると、第二導電部１２が検査点Ｂに圧接することになる（図３（ｂ）、ただし、第二導電部１２は図示していない）。   Next, as shown in FIG. 3 (b), both or one of the plate on which the electrode part EP is fixed and the substrate K to be inspected at the inspection point B are moved to move between the electrode part EP and the inspection point B. The both ends of the first conductive portion 11 are pressed toward the center along the long axis direction. By this pressing force, the elastic portion 14 of the first conductive portion 11 contracts along the long axis direction. On the other hand, the penetration portion 131 of the first conductive portion 11 is penetrated into the inspection point B by the urging force of the elastic portion 14. When the pressing force is further applied and the elastic portion 14 further contracts, the second conductive portion 12 comes into pressure contact with the inspection point B (FIG. 3B, however, the second conductive portion 12 is not shown). .

またさらに、電極部ＥＰと検査点Ｂとの間の間隔が狭まるように、第一導電部１１及び第二導電部１２の両端部をそれぞれの長軸方向に沿って押圧すると、第一導電部１１が全体的に湾曲して撓む（図３（ｃ）、ただし、第二導電部１２は図示していない）
このような状態になると、第一導電部１１及び第二導電部１２の端部が、弾性部１４と湾曲した第一導電部１１及び第二導電部１２の本体部分との元の直線状に戻ろうとする力により、検査点Ｂ及び電極部ＥＰに強く圧接された状態となるので、確実に、検査点から電極部に電気信号を伝達することができるようになる。Furthermore, when both end portions of the first conductive portion 11 and the second conductive portion 12 are pressed along the respective major axis directions so that the distance between the electrode portion EP and the inspection point B is narrowed, the first conductive portion 11 is curved and bent as a whole (FIG. 3C, but the second conductive portion 12 is not shown).
If it becomes such a state, the edge part of the 1st electroconductive part 11 and the 2nd electroconductive part 12 will be in the original linear form with the main-body part of the elastic part 14 and the curved 1st electroconductive part 11 and the 2nd electroconductive part 12. Since the force to return is in a state of being strongly pressed against the inspection point B and the electrode part EP, an electric signal can be reliably transmitted from the inspection point to the electrode part.

［第二実施形態の基板検査用接触子の構造］
図４は、弾性部２１４を両端部の貫入部２３１の近くにそれぞれ有する第二実施形態に係る基板検査用接触子２００を示す。[Structure of Contact for Inspection of Board of Second Embodiment]
FIG. 4 shows the substrate inspection contact 200 according to the second embodiment having the elastic portions 214 near the penetration portions 231 at both ends.

基板検査用接触子２００は、図１に示す基板検査用接触子１と同様に、円柱状の第一導電部２１１及び円筒状の第二導電部２１２を備える。図４（ｂ）に示すように、第二導電部２１２の内部に第一導電部２１１を配置する際には、第一導電部２１１の貫入部２３１が、第二導電部２１２の端部よりも所定量ｄ２２分だけ突出するように配置される。   Similar to the substrate inspection contact 1 shown in FIG. 1, the substrate inspection contact 200 includes a columnar first conductive portion 211 and a cylindrical second conductive portion 212. As shown in FIG. 4B, when the first conductive portion 211 is arranged inside the second conductive portion 212, the penetration portion 231 of the first conductive portion 211 is moved from the end of the second conductive portion 212. Is also arranged to protrude by a predetermined amount d22.

第一導電部２１１及び第二導電部２１２は、図１に示す基板検査用接触子１と同様に、導電性及び可撓性を有する材料から形成されている。   The first conductive portion 211 and the second conductive portion 212 are formed of a material having conductivity and flexibility, like the substrate inspection contact 1 shown in FIG.

弾性部２１４は、基板検査用接触子１の弾性部１４と同様に、レーザ光によって第一導電部２１１を直接に加工して形成することができる。   The elastic portion 214 can be formed by directly processing the first conductive portion 211 with a laser beam, like the elastic portion 14 of the substrate inspection contact 1.

この基板検査用接触子２００を用いて、被検査基板Ｋ上の所定の２つの検査点Ｂの間の抵抗を測定するために、それを検査装置の電極部ＥＰと被検査基板Ｋの検査点Ｂとの間に固定するまでの概略の工程を説明すると、まず、基板検査用接触子２００をまっすぐな状態のままで、電極部ＥＰと検査点Ｂとの間に配置する。   In order to measure the resistance between two predetermined inspection points B on the substrate K to be inspected by using the substrate inspection contact 200, the inspection point between the electrode part EP of the inspection apparatus and the substrate K to be inspected is used. Explaining the general process until fixing to B, first, the substrate inspection contact 200 is placed between the electrode part EP and the inspection point B in a straight state.

次に、電極部ＥＰが固定されているプレート及び検査点Ｂの被検査基板Ｋの双方又は一方を移動して、電極部ＥＰと検査点Ｂとの間の間隔を狭めて、第一導電部２１１の両端の貫入部２３１を長軸方向に沿って中央に向かって押し付ける。この押圧力によって、第一導電部２１１の２つの弾性部２１４が長軸方向に沿って収縮する。その一方、それらの弾性部２１４の付勢力によって、第一導電部２１１の貫入部２３１が検査点Ｂに貫入される。さらに押圧力が加えられて弾性部２１４がさらに収縮すると、第二導電部２１２が検査点Ｂに圧接することになる。   Next, by moving both or one of the plate on which the electrode part EP is fixed and the substrate K to be inspected at the inspection point B, the interval between the electrode part EP and the inspection point B is narrowed, and the first conductive part The penetration parts 231 at both ends of 211 are pressed toward the center along the long axis direction. By this pressing force, the two elastic portions 214 of the first conductive portion 211 contract along the long axis direction. On the other hand, the penetration portion 231 of the first conductive portion 211 is penetrated into the inspection point B by the urging force of the elastic portion 214. When the pressing force is further applied and the elastic portion 214 is further contracted, the second conductive portion 212 comes into pressure contact with the inspection point B.

またさらに、電極部ＥＰと検査点Ｂとの間の間隔が狭まるように、第一導電部２１１及び第二導電部２１２の両端部をそれぞれの長軸方向に沿って押圧すると、第一導電部２１１が全体的に湾曲して撓む。   Furthermore, when both end portions of the first conductive portion 211 and the second conductive portion 212 are pressed along the respective major axis directions so that the distance between the electrode portion EP and the inspection point B is narrowed, the first conductive portion 211 is curved and bent as a whole.

このような状態になると、第一導電部２１１及び第二導電部２１２が、２つの弾性部２１４の弾力と湾曲した第一導電部２１１及び第二導電部２１２の本体部分の弾力とにより、それらの端部は検査点Ｂ及び電極部ＥＰに強く圧接された状態となるので、確実に、検査点から電極部に電気信号を伝達することができるようになる。   In such a state, the first conductive portion 211 and the second conductive portion 212 are caused by the elasticity of the two elastic portions 214 and the elasticity of the curved first conductive portion 211 and the main body portion of the second conductive portion 212. Since the end of is in a state of being strongly pressed against the inspection point B and the electrode part EP, an electric signal can be reliably transmitted from the inspection point to the electrode part.

［第三実施形態の基板検査用接触子の構造］
図５は、弾性部３１４を両端部の貫入部３３１の近くにそれぞれ有する第三実施形態に係る基板検査用接触子３００を示す。[Structure of Contact for Contact Inspection of Third Embodiment]
FIG. 5 shows a substrate inspection contact 300 according to the third embodiment having elastic portions 314 near the penetration portions 331 at both ends.

基板検査用接触子３００は、図４に示す基板検査用接触子２００と同様に、円柱状の第一導電部３１１及び円筒状の第二導電部３１２を備える。図５（ｂ）に示すように、第二導電部３１２の内部に第一導電部３１１を配置する際には、第一導電部３１１の貫入部３３１が、第二導電部３１２の端部よりも所定量ｄ３３分だけ突出するように配置される。   Similar to the substrate inspection contact 200 shown in FIG. 4, the substrate inspection contact 300 includes a columnar first conductive portion 311 and a cylindrical second conductive portion 312. As shown in FIG. 5B, when the first conductive part 311 is arranged inside the second conductive part 312, the penetration part 331 of the first conductive part 311 is more than the end of the second conductive part 312. Is also arranged to protrude by a predetermined amount d33.

また、第一導電部３１１及び第二導電部３１２は、図４に示す基板検査用接触子２００と同様に、導電性及び可撓性を有する材料から形成されている。   Moreover, the 1st electroconductive part 311 and the 2nd electroconductive part 312 are formed from the material which has electroconductivity and flexibility similarly to the contactor 200 for a board | substrate test | inspection shown in FIG.

図５に示すように、弾性部３１４はコイルスプリング状に形成されている。その弾性部３１４は、基板検査用接触子１の長軸方向に収縮することにより付勢状態となる。そのような部材であれば、弾性部３１４を導電性のゴムや合成樹脂など、どのようなものから形成してもよい。弾性部３１４を非導電性部材から形成した場合には、第一導電部３１１の外周とその周りに形成されている絶縁膜（図２の絶縁膜１５に相当するもの）との間に導電層を形成するか、または第二導電部３１２の内面に導電層を形成して、第一導電部の両端部の２つの貫入部３３１を電気的に相互に接続するようにする。   As shown in FIG. 5, the elastic part 314 is formed in a coil spring shape. The elastic part 314 is energized by contracting in the major axis direction of the board inspection contact 1. As long as it is such a member, the elastic portion 314 may be formed of any material such as conductive rubber or synthetic resin. When the elastic portion 314 is formed from a non-conductive member, a conductive layer is formed between the outer periphery of the first conductive portion 311 and an insulating film (corresponding to the insulating film 15 in FIG. 2) formed therearound. Or a conductive layer is formed on the inner surface of the second conductive portion 312 so that the two penetration portions 331 at both ends of the first conductive portion are electrically connected to each other.

弾性部３１４を形成する位置は、後述するように、この基板検査用接触子３００を検査装置の治具の治具ヘッド部の保持板Ｈ１，Ｈ２（図６）に取り付けた際に、その保持孔Ｈ１０，Ｈ２０（図６）の内部に配置される部分に対応する位置である。   As will be described later, the position where the elastic portion 314 is formed is held when the substrate inspection contact 300 is attached to the holding plates H1 and H2 (FIG. 6) of the jig head portion of the jig of the inspection apparatus. It is a position corresponding to a portion arranged in the holes H10 and H20 (FIG. 6).

第一導電部３１１及び第二導電部３１２を組み立てて基板検査用接触子３００を形成する工程は、上記の図１の基板検査用接触子１及び図４の基板検査用接触子２００の工程と同じである。   The steps of assembling the first conductive portion 311 and the second conductive portion 312 to form the substrate inspection contact 300 are the same as the steps of the substrate inspection contact 1 of FIG. 1 and the substrate inspection contact 200 of FIG. The same.

［第三実施形態に係る基板検査用接触子の取り付け］
次に、図６に基づいて、２つの基板検査用接触子３００を用いて被検査基板Ｋの所定の２つの検査点Ｂの間の配線の抵抗を測定するにあたって、基板検査用接触子３００の一つを検査装置の電極部ＥＰと被検査基板Ｋの検査点Ｂとの間に固定するまでの作業の流れを説明する。[Attachment of Contact for Board Inspection According to Third Embodiment]
Next, in measuring the resistance of the wiring between two predetermined inspection points B of the inspected substrate K using the two substrate inspection contacts 300 based on FIG. The flow of work until one is fixed between the electrode part EP of the inspection apparatus and the inspection point B of the substrate K to be inspected will be described.

まず、基板検査用接触子３００の第一導電部３１１の一方の貫入部３３１をヘッド部の保持板Ｈ１の保持孔Ｈ１０に挿入してその貫入部３３１の先端を電極部ＥＰに接触させる。また、他方の貫入部３３１をヘッド部Ｈ２（ガイド板）の保持孔Ｈ２０に挿入してその貫入部の先端を検査点Ｂに接触させる。これにより、基板検査用接触子３００を電極部ＥＰと検査点Ｂとの間に配置する。それらの保持孔は被検査基板Ｋに対し直交する方向に直線状に形成されている。   First, one penetration part 331 of the first conductive part 311 of the substrate inspection contact 300 is inserted into the holding hole H10 of the holding plate H1 of the head part, and the tip of the penetration part 331 is brought into contact with the electrode part EP. The other penetration part 331 is inserted into the holding hole H20 of the head part H2 (guide plate), and the tip of the penetration part is brought into contact with the inspection point B. Thus, the substrate inspection contact 300 is disposed between the electrode part EP and the inspection point B. These holding holes are linearly formed in a direction orthogonal to the substrate K to be inspected.

そのように基板検査用接触子３００を電極部ＥＰと検査点Ｂとの間に配置した段階では、第一導電部３１１及び第二導電部３１２はともに真っ直ぐであり、貫入部３３１の近くにある２つ弾性部３１４は、保持孔Ｈ１０及びＨ２０の内部に配置されている。   Thus, at the stage where the board inspection contact 300 is disposed between the electrode part EP and the inspection point B, the first conductive part 311 and the second conductive part 312 are both straight and close to the penetration part 331. The two elastic portions 314 are disposed inside the holding holes H10 and H20.

次に、電極部ＥＰが固定されているプレート及び検査点Ｂの被検査基板Ｋの双方又は一方を他方に近づく方向に移動して、電極部ＥＰと検査点Ｂとの間の間隔を狭め、第一導電部３１１の２つの貫入部３３１をそれぞれ電極部ＥＰ及び検査点Ｂに押し付けるようにする。この押圧力によって、第一導電部３１１の弾性部３１４が、図５（ｂ）の通常の取り付け前の状態から、図６に示すように、取り付けた状態では、長軸方向に沿って収縮して、貫入部３３１が第二導電部３１２の中に押し込まれるようになる。さらに押圧力を加えると、それらの弾性部３１４の付勢力によって、第一導電部３１１の貫入部３３１が検査点Ｂへ貫入され、さらに、その押圧力及び貫入部３３１の貫入に伴い、第二導電部３１２の端部が検査点Ｂに圧接されるようになる。   Next, both or one of the plate on which the electrode part EP is fixed and the substrate K to be inspected at the inspection point B are moved in the direction approaching the other to narrow the interval between the electrode part EP and the inspection point B, The two penetration portions 331 of the first conductive portion 311 are pressed against the electrode portion EP and the inspection point B, respectively. Due to this pressing force, the elastic portion 314 of the first conductive portion 311 contracts along the major axis direction in the attached state as shown in FIG. 6 from the state before the normal attachment in FIG. 5B. Thus, the penetration portion 331 is pushed into the second conductive portion 312. When a further pressing force is applied, the penetrating portion 331 of the first conductive portion 311 is penetrated to the inspection point B by the urging force of the elastic portion 314. Further, along with the pressing force and penetration of the penetrating portion 331, the second portion 331 is penetrated. The end portion of the conductive portion 312 comes into pressure contact with the inspection point B.

更に電極部ＥＰと検査点Ｂとの間の間隔を狭めて、基板検査用接触子３００を長軸方向に沿って押圧すると、図６に示すように、基板検査用接触子３００が全体的に撓んで中央部が湾曲するようになる。この場合、第一導電部３１１及び第二導電部３１２の可撓性に伴う弾力性により、それらの端部が、検査点Ｂと電極部ＥＰとにさらに圧接されることになる。   Further, when the distance between the electrode portion EP and the inspection point B is narrowed and the substrate inspection contact 300 is pressed along the long axis direction, the substrate inspection contact 300 is entirely formed as shown in FIG. The center portion is bent by bending. In this case, due to the elasticity accompanying the flexibility of the first conductive portion 311 and the second conductive portion 312, their end portions are further pressed into contact with the inspection point B and the electrode portion EP.

そのような状態になると、第一導電部３１１及び第二導電部３１２の端部が、それぞれの可撓性及び弾性部３１４の弾力性に伴う付勢力によって、検査点Ｂ及び電極部ＥＰに圧接された状態となるので、確実に、検査点Ｂと電極部ＥＰとの間で電気信号を伝達することができるようになる。   In such a state, the end portions of the first conductive portion 311 and the second conductive portion 312 are pressed against the inspection point B and the electrode portion EP by the urging forces associated with the flexibility and the elasticity of the elastic portion 314, respectively. Thus, an electric signal can be reliably transmitted between the inspection point B and the electrode part EP.

この基板検査用接触子３００では、弾性部３１４を検査装置のヘッド部の保持板の保持孔Ｈ１０，Ｈ２０の内部に配置される位置に形成した。これは次のような理由に基づく。例えば、図３（ｃ）に示すように、弾性部１４を第一導電部１１の中央部に設けた場合には、その接触子１を電極部ＥＰと検査点Ｂとの間に取り付けて、その接触子１に長軸方向に押圧力を加えると、第二導電部１２が湾曲するとともに第一導電部１１も湾曲する。その場合、弾性部１４もそれとともに湾曲することになる。そうなると、第二導電部１２の内面と第一導電部１１の弾性部１４及び棒状部分１３との間の摩擦により、棒状部分１３が第二導電部１２の内面を滑らかに移動することができず、弾性部１４の収縮が滑らかに行えないという状況が起こる場合がある。そのような状況下では、第一導電部１１の尖鋭形状の先端部を弾性部１４が効果的に付勢できなくなるため、その先端部が電極部ＥＰに貫入し難くなり、その結果、第二導電部１２の端部が電極部ＥＰや検査点Ｂと確実に接触できなくなることが起こり得る。   In the substrate inspection contact 300, the elastic portion 314 is formed at a position where the elastic portion 314 is disposed inside the holding holes H10 and H20 of the holding plate of the head portion of the inspection apparatus. This is based on the following reason. For example, as shown in FIG. 3C, when the elastic portion 14 is provided at the center of the first conductive portion 11, the contact 1 is attached between the electrode portion EP and the inspection point B, When a pressing force is applied to the contact 1 in the major axis direction, the second conductive portion 12 is bent and the first conductive portion 11 is also bent. In that case, the elastic part 14 will also bend along with it. Then, due to the friction between the inner surface of the second conductive portion 12 and the elastic portion 14 and the rod-shaped portion 13 of the first conductive portion 11, the rod-shaped portion 13 cannot move smoothly on the inner surface of the second conductive portion 12. In some cases, the elastic portion 14 cannot be contracted smoothly. Under such circumstances, the elastic portion 14 cannot effectively urge the sharp tip portion of the first conductive portion 11, so that the tip portion hardly penetrates into the electrode portion EP. It may happen that the end of the conductive part 12 cannot reliably contact the electrode part EP or the inspection point B.

そのため、この基板検査用接触子３００では、直線状に形成されたヘッド部の保持孔の内部に弾性部３１４が位置するように、第二導電部３１２の棒状部分３１３の端部に弾性部３１４を形成している。これにより、弾性部３１４とヘッド部の内壁との間に接触による摩擦抵抗が生じないので、弾性部３１４が第一導電部３１１の長軸方向に沿って伸縮自在となっている。   Therefore, in this board inspection contact 300, the elastic portion 314 is located at the end of the rod-shaped portion 313 of the second conductive portion 312 so that the elastic portion 314 is positioned inside the holding hole of the head portion formed in a straight line. Is forming. Thereby, since frictional resistance due to contact does not occur between the elastic portion 314 and the inner wall of the head portion, the elastic portion 314 can expand and contract along the major axis direction of the first conductive portion 311.

なお、本発明での検査点とは、導通及び／又は短絡を検査するために必要な被検査基板上に予め設定されるものである。特に、本基板検査用接触子は、チップのランド上などに盛られる金属の突起部で、インナーリードボンディングを容易にするバンプに好適に用いることができる。   The inspection point in the present invention is set in advance on a substrate to be inspected necessary for inspecting continuity and / or short circuit. In particular, the contact for inspecting the substrate can be suitably used for a bump that facilitates inner lead bonding at a metal protrusion on a land of a chip.

図６に示す基板検査用接触子３００では、第一導電部３１１の両端部に弾性部３１４を設けたが、どちらか一方の端部の近くに１つの弾性部３１４を設けるようにしてもよい。例えば、図７に示すように、弾性部３１４を検査点Ｂと接触する側の貫入部３３１の近くの治具ヘッド部の保持板Ｈ２の保持孔Ｈ２０内にある第一導電部３１１’の部分に設けてもよく、また、それとは逆に、弾性部３１４を検査装置の電極ＥＰと接触する側の貫入部３３１の近くの治具ヘッド部の保持板Ｈ１の保持孔Ｈ１０内にある第一導電部３１１’の部分に設けてもよい。   In the substrate inspection contact 300 shown in FIG. 6, the elastic portions 314 are provided at both ends of the first conductive portion 311, but one elastic portion 314 may be provided near either one of the end portions. . For example, as shown in FIG. 7, a portion of the first conductive portion 311 ′ in the holding hole H20 of the holding plate H2 of the jig head portion near the penetration portion 331 on the side where the elastic portion 314 contacts the inspection point B On the contrary, the elastic portion 314 is in the holding hole H10 of the holding plate H1 of the jig head portion near the penetration portion 331 on the side in contact with the electrode EP of the inspection apparatus. You may provide in the part of electroconductive part 311 '.

その場合には、弾性部３１４は、保持板Ｈ２の保持孔Ｈ２０の内部又は保持板Ｈ１の保持孔Ｈ１０に、直線状に保持されるため、第一導電部３１１’の長軸に沿って自在に収縮することができる。それによって、貫入部３３１を確実に検査点Ｂに貫入させて、第二導電部３１２の端部を確実に検査点Ｂに接触させることができる。   In that case, since the elastic portion 314 is held linearly inside the holding hole H20 of the holding plate H2 or in the holding hole H10 of the holding plate H1, it can be freely moved along the long axis of the first conductive portion 311 ′. Can shrink. Accordingly, the penetration portion 331 can be reliably penetrated into the inspection point B, and the end portion of the second conductive portion 312 can be reliably brought into contact with the inspection point B.

また、図５の第三実施態様に係る基板検査用接触子３００の第一導電部３１１の弾性部３１４はコイルスプリング状のものを用いたが、後述する図１４（ａ）から図１４（ｄ）に示すようなさまざまな形状の弾性部を用いてもよい。   Moreover, although the elastic part 314 of the 1st electroconductive part 311 of the board | substrate test | inspection contactor 300 which concerns on 3rd embodiment of FIG. 5 used the thing of a coil spring shape, FIG.14 (a) to FIG.14 (d) mentioned later is used. You may use the elastic part of various shapes as shown in FIG.

［第四実施形態の基板検査用接触子の構造］
図８（ａ）及び図８（ｂ）は、第四実施形態に係る基板検査用接触子４００を示す。図８（ａ）は分解図、図８（ｂ）は組立図である。[Structure of Contact for Board Inspection of Fourth Embodiment]
FIGS. 8A and 8B show a substrate inspection contact 400 according to the fourth embodiment. FIG. 8A is an exploded view, and FIG. 8B is an assembly view.

基板検査用接触子４００は、第一導電部４１１及び第二導電部４１２を有していて、第二導電部４１２は、図８（ｂ）に示すように、第一導電部４１１を内部に収容するように筒状に形成されている。   The board inspection contact 400 has a first conductive portion 411 and a second conductive portion 412, and the second conductive portion 412 has the first conductive portion 411 inside as shown in FIG. It is formed in a cylindrical shape so as to be accommodated.

第一導電部４１１は、棒状部分４１３と、弾性部４１４と、貫入部４３１とを備えるが、それに代えて、第一実施形態に係る第一導電部１、第二実施形態に係る第一導電部２１１又は第三実施形態に係る第一導電部３１１のいずれを用いてもよい。   The first conductive portion 411 includes a rod-shaped portion 413, an elastic portion 414, and a penetration portion 431. Instead, the first conductive portion 1 according to the first embodiment and the first conductive portion according to the second embodiment. Either the part 211 or the first conductive part 311 according to the third embodiment may be used.

第二導電部４１２は、図１に示す基板検査用接触子１の第二導電部１２と同様に、可撓性の素材で筒状に形成されていて、使用時に、被検査基板の配線パターン上の検査点と検査装置の電極部と間に両端が挟まれると撓み、その弾性力によって、その両端を検査点及び電極部に圧接する。第二導電部４１２の素材として、ニッケル（Ni）やステンレス鋼等を用いることができるが、特にそれらに限定されるものではなく、可撓性及び導電性を有するものであればどのようなものでもよい。図示していないが第二導電部４１２の外側表面に絶縁層を設けることが望ましい。   The second conductive portion 412 is formed in a cylindrical shape with a flexible material, similarly to the second conductive portion 12 of the substrate inspection contact 1 shown in FIG. When both ends are sandwiched between the upper inspection point and the electrode part of the inspection apparatus, the both ends are bent and the both ends are pressed against the inspection point and the electrode part by the elastic force. Nickel (Ni), stainless steel, or the like can be used as the material of the second conductive portion 412, but is not particularly limited thereto, and any material having flexibility and conductivity can be used. But you can. Although not shown, it is desirable to provide an insulating layer on the outer surface of the second conductive portion 412.

図８（ｂ）に示すように、第二導電部４１２の両端部４２３は、所定の傾斜を有して内側方向へ収縮する先細りのテーパー形状になっている。   As shown in FIG. 8B, both end portions 423 of the second conductive portion 412 have a tapered shape that has a predetermined inclination and contracts inward.

また、第二導電部４１２の両端部４２３の両端部４２３の近くには、弾性部４２４が形成されている。弾性部４２４は、第二導電部４１２の長軸方向に伸縮するように形成されており、例えば、コイルスプリングの形状に形成されている。弾性部４２４は、弾力性を発揮できるような形状であればどのような形状でもよい。この弾性部４２４も第一導電部４１１の弾性部４１４と同様にレーザ加工によって形成することができ、例えば、第二導電部４１２を長手方向の軸線を中心に回転させながら不要な部分を取り除くようにして形成してもよい。   Further, an elastic portion 424 is formed near both end portions 423 of both end portions 423 of the second conductive portion 412. The elastic part 424 is formed so as to expand and contract in the major axis direction of the second conductive part 412, and is formed, for example, in the shape of a coil spring. The elastic portion 424 may have any shape as long as it can exhibit elasticity. The elastic portion 424 can also be formed by laser processing in the same manner as the elastic portion 414 of the first conductive portion 411. For example, an unnecessary portion is removed while rotating the second conductive portion 412 around the longitudinal axis. May be formed.

その弾性部４２４を形成する位置は、例えば、基板検査用接触子４００を検査装置のヘッド部の保持板Ｈ１，Ｈ２（図６）に取り付けた際に、その保持孔Ｈ１０，Ｈ２０（図６）の内部に配置される部分に対応する位置である。   The positions where the elastic portions 424 are formed are, for example, the holding holes H10 and H20 (FIG. 6) when the substrate inspection contact 400 is attached to the holding plates H1 and H2 (FIG. 6) of the head portion of the inspection apparatus. It is a position corresponding to the part arrange | positioned inside.

第一導電部４１１及び第二導電部４１２を組み立てて基板検査用接触子４００を形成するに当たっては、まず、上記の如く、第一導電部４１１を第二導電部４１２の内部に収容して、貫入部４３１を所定量ｄ４４分だけ第二導電部４１２の端部から突出させる（図８（ｂ））。次に、第二導電部４１２の両端部を押圧して図８（ａ）及び図８（ｂ）に示すように内側に絞り込み、テーパー形状にする。   In assembling the first conductive portion 411 and the second conductive portion 412 to form the substrate inspection contact 400, first, as described above, the first conductive portion 411 is accommodated inside the second conductive portion 412. The penetration part 431 is protruded from the end part of the second conductive part 412 by a predetermined amount d44 (FIG. 8B). Next, both end portions of the second conductive portion 412 are pressed and narrowed inward as shown in FIGS. 8A and 8B to form a taper shape.

この基板検査用接触子４００を検査装置の電極部ＥＰと被検査基板Ｋの検査点Ｂとの間に固定する際には、上記の基板検査用接触子３００の場合と同様に、まず、基板検査用接触子４００の第一導電部４１１の一方の貫入部４３１をヘッド部の保持板Ｈ１の保持孔Ｈ１０に挿入してその貫入部４３１の先端を電極部ＥＰに接触させる。また、他方の貫入部４３１をヘッド部の保持板Ｈ２の保持孔Ｈ２０に挿入してその間入部の先端を検査点Ｂに接触させる。これにより、基板検査用接触子４００を電極部ＥＰと検査点Ｂとの間に配置する。それらの保持孔は被検査基板Ｋに対し直交する方向に直線状に形成されている。   When fixing the substrate inspection contact 400 between the electrode portion EP of the inspection apparatus and the inspection point B of the substrate K to be inspected, first, as in the case of the substrate inspection contact 300, first, the substrate One penetration part 431 of the first conductive part 411 of the inspection contact 400 is inserted into the holding hole H10 of the holding plate H1 of the head part, and the tip of the penetration part 431 is brought into contact with the electrode part EP. Further, the other penetration portion 431 is inserted into the holding hole H20 of the holding plate H2 of the head portion, and the tip of the insertion portion is brought into contact with the inspection point B. Accordingly, the substrate inspection contact 400 is disposed between the electrode portion EP and the inspection point B. These holding holes are linearly formed in a direction orthogonal to the substrate K to be inspected.

そのように基板検査用接触子４００を電極部ＥＰと検査点Ｂとの間に配置した段階では、第一導電部４１１及び第二導電部４１２はともに真っ直ぐであり、第二導電部４１２の２つの弾性部４２４及び貫入部４３１の近くにある２つの弾性部４１４は、保持孔Ｈ１０及びＨ２０の内部に配置されている。   Thus, at the stage where the substrate inspection contact 400 is disposed between the electrode part EP and the inspection point B, the first conductive part 411 and the second conductive part 412 are both straight, and the second conductive part 412 2 The two elastic parts 414 near the one elastic part 424 and the penetration part 431 are arranged inside the holding holes H10 and H20.

次に、電極部ＥＰが固定されているプレート及び検査点Ｂの被検査基板Ｋの双方又は一方を他方に近づく方向に移動して、電極部ＥＰと検査点Ｂとの間の間隔を狭め、第一導電部４１１の２つの貫入部４３１をそれぞれ電極部ＥＰ及び検査点Ｂに押し付けるようにする。この押圧力によって、第一導電部４１１の弾性部４１４が長軸方向に沿って収縮して、貫入部４３１が第二導電部４１２の中に押し込まれる。   Next, both or one of the plate on which the electrode part EP is fixed and the substrate K to be inspected at the inspection point B are moved in the direction approaching the other to narrow the interval between the electrode part EP and the inspection point B, The two penetration portions 431 of the first conductive portion 411 are pressed against the electrode portion EP and the inspection point B, respectively. By this pressing force, the elastic portion 414 of the first conductive portion 411 contracts along the long axis direction, and the penetration portion 431 is pushed into the second conductive portion 412.

さらに押圧力を加えると、それらの弾性部４１４の付勢力によって、第一導電部４１１の貫入部４３１が検査点Ｂへ貫入されるようになり、その押圧力及び貫入部４３１の貫入に伴い、第二導電部４１２の端部４２３が検査点Ｂに圧接される。   When further pressing force is applied, the urging force of the elastic portion 414 causes the penetration portion 431 of the first conductive portion 411 to penetrate into the inspection point B. With the pressing force and penetration of the penetration portion 431, An end portion 423 of the second conductive portion 412 is pressed against the inspection point B.

更に電極部ＥＰと検査点Ｂとの間の間隔を狭めて、基板検査用接触子４００を長軸方向に沿って押圧すると、第二導電部４１２の弾性部４２４が長軸方向に収縮する。   Further, when the distance between the electrode portion EP and the inspection point B is narrowed and the substrate inspection contact 400 is pressed along the long axis direction, the elastic portion 424 of the second conductive portion 412 contracts in the long axis direction.

この状態になると、弾性部４１４の付勢力によって第一導電部４１１の貫入部４３１が電極部ＥＰ及び検査点Ｂに押し付けられ、さらに、弾性部４２４の付勢力によって第二導電部４１２の端部４２３が電極部ＥＰ及び検査点Ｂに押し付けられるようになるため、確実に、第一導電部４１１及び第二導電部４１２によって検査点Ｂと電極部ＥＰとの間で電気信号を伝達することができるようになる。また、取り付け前では、第一導電部４１１が第二導電部４１２よりも長いため、取り付けた状態では、第一導電部４１１の第一導電部４１１の収縮の距離は、第二導電部４１２の弾性部４２４の収縮の距離よりも長い。   In this state, the penetrating portion 431 of the first conductive portion 411 is pressed against the electrode portion EP and the inspection point B by the biasing force of the elastic portion 414, and further, the end portion of the second conductive portion 412 is biased by the biasing force of the elastic portion 424. Since 423 comes to be pressed against the electrode part EP and the inspection point B, it is possible to reliably transmit an electric signal between the inspection point B and the electrode part EP by the first conductive part 411 and the second conductive part 412. become able to. In addition, since the first conductive portion 411 is longer than the second conductive portion 412 before the attachment, in the attached state, the contraction distance of the first conductive portion 411 of the first conductive portion 411 is the distance of the second conductive portion 412. It is longer than the contraction distance of the elastic part 424.

さらに、基板検査用接触子４００が、長軸方向に沿って押圧されて、図６の実施例の場合と同様に撓んで湾曲しても、第一導電部４１１の弾性部４１４及び第二導電部４１２の弾性部４２４は、ヘッド部の保持板Ｈ１の直線形状の保持孔Ｈ１０と、ヘッド部Ｈ２の直線形状の保持孔Ｈ２０の内部に配置されているので、長軸方向に自在に収縮することができる。そのため、更に確実に、検査点Ｂと電極部ＥＰとの間で電気信号を伝達することができる。   Furthermore, even if the substrate inspection contact 400 is pressed along the long axis direction and bent and bent in the same manner as in the embodiment of FIG. 6, the elastic portion 414 of the first conductive portion 411 and the second conductive portion Since the elastic portion 424 of the portion 412 is disposed inside the linear holding hole H10 of the holding plate H1 of the head portion and the linear holding hole H20 of the head portion H2, the elastic portion 424 contracts freely in the long axis direction. be able to. Therefore, an electrical signal can be more reliably transmitted between the inspection point B and the electrode part EP.

また、図示しないが、図７の基板検査用接触子３００’において、さらに、第二導電部３１２の保持孔Ｈ１０に挿入された部分に、図８に示す弾性部４２４のような弾性部を追加して形成してもよく、また、図７の基板検査用接触子３００’において、逆に、第一導電部３１１’の保持孔Ｈ１０内の部分に弾性部３１４を形成したものに、第二導電部３１２の保持孔Ｈ２０内の部分に図８に示す弾性部４２４のような弾性部を追加して形成してもよい。   Further, although not shown, an elastic part such as the elastic part 424 shown in FIG. 8 is further added to the part inserted into the holding hole H10 of the second conductive part 312 in the board inspection contact 300 ′ of FIG. In the substrate inspection contact 300 ′ of FIG. 7, the second conductive portion 311 ′ is formed with an elastic portion 314 in the holding hole H 10. An elastic portion such as the elastic portion 424 shown in FIG. 8 may be added to the portion of the conductive portion 312 in the holding hole H20.

第三及び第四の実施形態に示す弾性部３１４，４１４，４２４は、例示であり、それ以外にも、第一導電部３１１，３１１’に形成する弾性部の数及び位置と第二導電部３１２に形成する弾性部の数及び位置との組合せは任意である。   The elastic portions 314, 414, and 424 shown in the third and fourth embodiments are examples, and in addition, the number and position of the elastic portions formed in the first conductive portions 311 and 311 ′ and the second conductive portions. The combination of the number and position of the elastic portions formed in 312 is arbitrary.

つまり、第一導電部３１１及び第二導電部３１２のそれぞれの上下の位置に弾性部を形成する場合には、それぞれの位置において、弾性部を形成するか否かの２通りの選択が可能なので、第一導電部３１１の上下の２箇所の位置と第二導電部３１２の上下の位置の２箇所の合計４箇所の位置において、弾性部を形成するか否かの組合せは、２4＝１６通りある。ただし、弾性部を形成する位置は、第一導電部３１１及び第二導電部３１２において異なる位置が好ましい。例えば、第一導電部３１１及び第二導電部３１２の両方に弾性部を形成する場合に、第一導電部３１１の上の部分に弾性部を形成したときには、第二導電部３１２には下の部分に弾性部を形成することが望ましい。That is, when the elastic part is formed at the upper and lower positions of the first conductive part 311 and the second conductive part 312, it is possible to select two types of whether or not the elastic part is formed at each position. The combination of whether or not to form the elastic portion is 2 4 = 16 at a total of four positions including two positions above and below the first conductive portion 311 and two positions above and below the second conductive portion 312. There are streets. However, the positions where the elastic portions are formed are preferably different positions in the first conductive portion 311 and the second conductive portion 312. For example, when an elastic part is formed in both the first conductive part 311 and the second conductive part 312, when the elastic part is formed in the upper part of the first conductive part 311, the second conductive part 312 has a lower part. It is desirable to form an elastic part in the part.

図８の第三実施態様に係る基板検査用接触子４００の弾性部４１４はコイルスプリング状のものを用いたが、後述の図１４（ａ）から図１４（ｄ）に示すようなさまざまな形状の弾性部を用いてもよい。また、第二導電部４１２の弾性部４２４もコイルスプリング状のものを用いたが、弾性を発揮する形状のものであればどのようなものでもよく、例えば、複数の細木状のものを長手方向に沿って第二導電部の周面に沿って配置して弾性部を形成して、その弾性部によって端部４２３と中央の本体部とを接続するようにしてもよい。   Although the elastic part 414 of the board inspection contact 400 according to the third embodiment of FIG. 8 is a coil spring, various shapes as shown in FIGS. 14 (a) to 14 (d) described later are used. The elastic part may be used. Further, the elastic portion 424 of the second conductive portion 412 is also a coil spring shape, but may be any shape as long as it has a shape exhibiting elasticity, for example, a plurality of thin wood-like ones in the longitudinal direction. The elastic portion may be formed along the peripheral surface of the second conductive portion along the edge, and the end portion 423 and the central body portion may be connected by the elastic portion.

［第五実施形態の基板検査用接触子の構造］
図９は、第五の実施形態に係る基板検査用接触子５００を示す。[Structure of contactor for substrate inspection of the fifth embodiment]
FIG. 9 shows a substrate inspection contact 500 according to the fifth embodiment.

基板検査用接触子５００は、円柱状の第一導電部５１１及び円筒状の第二導電部５１２を備える。図９に示すように、この実施形態では、これまでの実施形態と異なり、円筒状の第二導電部５１２の長さが、円柱状の第一導電部５１１の長さよりも長い基板検査用接触子に本発明を適用している。   The substrate inspection contact 500 includes a columnar first conductive portion 511 and a cylindrical second conductive portion 512. As shown in FIG. 9, in this embodiment, unlike the previous embodiments, the length of the cylindrical second conductive portion 512 is longer than the length of the columnar first conductive portion 511. The present invention is applied to the child.

円筒状の第二導電部５１２には弾性部５１４が形成されている。弾性部５１４が形成されている位置は、検査装置のヘッド部の保持板Ｈ１の保持孔Ｈ１０に挿入される位置である。   An elastic portion 514 is formed on the cylindrical second conductive portion 512. The position where the elastic part 514 is formed is a position where it is inserted into the holding hole H10 of the holding plate H1 of the head part of the inspection apparatus.

［第五実施形態に係る基板検査用接触子の取り付け］
次に、基板検査用接触子５００の一つを検査装置の電極部ＥＰと被検査基板Ｋの検査点Ｂとの間に固定するまでの作業の流れを説明する。[Attachment of Contact for Board Inspection According to Fifth Embodiment]
Next, an operation flow until one of the substrate inspection contacts 500 is fixed between the electrode portion EP of the inspection apparatus and the inspection point B of the inspection substrate K will be described.

まず、基板検査用接触子５００の第二導電部５１２の一方の端部をヘッド部の保持板Ｈ１の保持孔Ｈ１０に挿入して電極部ＥＰに接触させる。また、第二導電部５１２の他方の端部をヘッド部Ｈ２（ガイド板）の保持孔Ｈ２０に挿入して検査点Ｂに接触させる。これにより、基板検査用接触子５００を電極部ＥＰと検査点Ｂとの間に配置する。それらの保持孔は被検査基板Ｋに対し直交する方向に直線状に形成されている。   First, one end of the second conductive portion 512 of the substrate inspection contact 500 is inserted into the holding hole H10 of the holding plate H1 of the head portion and brought into contact with the electrode portion EP. The other end of the second conductive portion 512 is inserted into the holding hole H20 of the head portion H2 (guide plate) and brought into contact with the inspection point B. Accordingly, the substrate inspection contact 500 is disposed between the electrode portion EP and the inspection point B. These holding holes are linearly formed in a direction orthogonal to the substrate K to be inspected.

そのように基板検査用接触子５００を電極部ＥＰと検査点Ｂとの間に配置した段階では、第一導電部５１１及び第二導電部５１２はともに真っ直ぐであり、第二導電部５１２の弾性部５１４は、保持孔Ｈ１０の内部に配置されている。   In such a stage where the substrate inspection contact 500 is disposed between the electrode part EP and the inspection point B, the first conductive part 511 and the second conductive part 512 are both straight, and the elasticity of the second conductive part 512 is determined. The part 514 is disposed inside the holding hole H10.

次に、電極部ＥＰが固定されているプレート及び検査点Ｂの被検査基板Ｋの双方又は一方を他方に近づく方向に移動して、電極部ＥＰと検査点Ｂとの間の間隔を狭め、第二導電部５１２の端部がそれぞれ電極部ＥＰ及び検査点Ｂに押し付けるようにする。この押圧力によって、第二導電部５１２の弾性部５１４が、長軸方向に沿って収縮すると、第一導電部５１１の上下の貫入部５３１がそれぞれ電極ＥＰ及び検査点Ｂに貫入される。   Next, both or one of the plate on which the electrode part EP is fixed and the substrate K to be inspected at the inspection point B are moved in the direction approaching the other to narrow the interval between the electrode part EP and the inspection point B, The end portions of the second conductive portion 512 are pressed against the electrode portion EP and the inspection point B, respectively. When the elastic portion 514 of the second conductive portion 512 contracts along the long axis direction by this pressing force, the upper and lower penetration portions 531 of the first conductive portion 511 are penetrated into the electrode EP and the inspection point B, respectively.

さらに、電極部ＥＰと検査点Ｂとの間の間隔を狭めて、基板検査用接触子５００を長軸方向に沿って中央方向に向けて押圧すると、第三実施形態の場合と同様に、基板検査用接触子５００は、全体的に撓んで中央部が湾曲し、第一導電部５１１及び第二導電部５１２の可撓性に伴う弾力性により、それらの端部が、検査点Ｂと電極部ＥＰとにさらに圧接されることになる。   Further, when the distance between the electrode portion EP and the inspection point B is narrowed and the substrate inspection contact 500 is pressed toward the center along the long axis direction, the substrate is the same as in the third embodiment. The inspection contact 500 is generally bent and has a central portion bent, and due to the elasticity associated with the flexibility of the first conductive portion 511 and the second conductive portion 512, the end portions thereof are connected to the inspection point B and the electrode. It is further pressed against the part EP.

そのような状態になると、第一導電部５１１及び第二導電部５１２の端部が、それぞれの可撓性及び弾性部５１４の弾力性に伴う付勢力によって、検査点Ｂ及び電極部ＥＰに圧接された状態となるので、確実に、検査点Ｂと電極部ＥＰとの間で電気信号を伝達することができるようになる。   In such a state, the end portions of the first conductive portion 511 and the second conductive portion 512 are pressed against the inspection point B and the electrode portion EP by the urging forces accompanying the respective flexibility and elasticity of the elastic portion 514. Thus, an electric signal can be reliably transmitted between the inspection point B and the electrode part EP.

第二導電部５１２の弾性部５１４はコイルスプリング状のものを用いたが、弾性を発揮させる形状のものであればどのようなものでもよく、例えば、複数の細木状のものを長手方向に沿って第二導電部の周面に沿って配置して弾性部を形成して、その弾性部によって端部と中央の本体部とを接続するようにしてもよい。   Although the elastic portion 514 of the second conductive portion 512 is a coil spring shape, any shape may be used as long as it has a shape that exerts elasticity, for example, a plurality of thin wood shapes along the longitudinal direction. The elastic portion may be formed by being arranged along the peripheral surface of the second conductive portion, and the end portion and the central body portion may be connected by the elastic portion.

［第六実施形態の基板検査用接触子］
図１０は、第六の実施形態に係る基板検査用接触子６００を示す。[Surface Inspection Contact of Sixth Embodiment]
FIG. 10 shows a substrate inspection contact 600 according to the sixth embodiment.

基板検査用接触子６００は、第五実施形態に係る基板検査用接触子５００の円柱状の第一導電部５１１を円柱状の第一導電部６１１と入れ替えたものである。円柱状の第一導電部６１１には、第二導電部５１２の弾性部５１４の位置に対応しない位置、つまり、図１０において下側の位置に、弾性部６１４が形成されている。   The substrate inspection contact 600 is obtained by replacing the cylindrical first conductive portion 511 of the substrate inspection contact 500 according to the fifth embodiment with a cylindrical first conductive portion 611. In the cylindrical first conductive portion 611, an elastic portion 614 is formed at a position not corresponding to the position of the elastic portion 514 of the second conductive portion 512, that is, at a lower position in FIG.

この第六実施形態に係る基板検査用接触子６００の取り付け方法は、上記の第五の実施形態に係る基板検査用接触子５００の場合と同じである。取り付けた場合には、第二導電部５１２の長さが、円柱状の第一導電部６１１の長さよりも長いため、第二導電部５１２の弾性部５１４の収縮の距離よりが、第一導電部６１１の弾性部６１４の収縮の距離よりも長い。   The mounting method of the substrate inspection contact 600 according to the sixth embodiment is the same as that of the substrate inspection contact 500 according to the fifth embodiment. When attached, since the length of the second conductive portion 512 is longer than the length of the columnar first conductive portion 611, the distance of the first conductive portion is less than the contraction distance of the elastic portion 514 of the second conductive portion 512. It is longer than the contraction distance of the elastic part 614 of the part 611.

第五及び第六の実施形態に示す弾性部５１４，６１４は、例示であり、それ以外にも、第一導電部６１１に形成する弾性部の数及び位置と第二導電部６１２に形成する弾性部の数及び位置との組合せは、第三及び第四実施形態の場合と同様に任意である。   The elastic portions 514 and 614 shown in the fifth and sixth embodiments are examples, and in addition, the number and position of the elastic portions formed in the first conductive portion 611 and the elasticity formed in the second conductive portion 612. The combination of the number and position of the parts is arbitrary as in the third and fourth embodiments.

つまり、第一導電部６１１の上下の２箇所の位置と第二導電部５１２の上下の位置の２箇所の合計４箇所の位置において、弾性部を形成するか否かの組合せは、２4＝１６通りある。That is, the combination of whether or not to form the elastic portion at a total of four positions including two positions above and below the first conductive portion 611 and two positions above and below the second conductive portion 512 is 2 4 = There are 16 ways.

図１０の第三実施態様に係る基板検査用接触子６００の弾性部６１４はコイルスプリング状のものを用いたが、後述の図１４（ａ）から図１４（ｄ）に示すようなさまざまな形状の弾性部を用いてもよい。   The elastic part 614 of the substrate inspection contact 600 according to the third embodiment of FIG. 10 is a coil spring-like one, but has various shapes as shown in FIGS. 14 (a) to 14 (d) described later. The elastic part may be used.

［弾性部のレーザ加工］
次に、図１１、図１２及び図１３を参照しながら、第一導電部１１の弾性部１４の形成方法について説明する。[Laser processing of elastic parts]
Next, a method for forming the elastic portion 14 of the first conductive portion 11 will be described with reference to FIGS. 11, 12, and 13.

図１２は、第一導電部１１に弾性部１４を形成するためのレーザ装置１００の概略の構成を示す。そのレーザ装置１００は、レーザビームを出力するレーザ発生器１０２を備える。このレーザ発生器として、ＳＨＧ−ＹＡＧレーザ装置を用いることができる。また、レーザ装置１００は、そのレーザ発生器１０２から出力されたレーザビームの一部を分岐するためのビームサンプラー１０６と、ビームを被加工物Ｃ（例えば、第一導電部１１）に偏向させるためのミラー１１０と、その偏向されたビームを集光するための集光レンズ１１２と、ビームサンプラー１０６から分岐されたビームの一部を測定するためのフォトセンサ１０８とを備える。フォトセンサ１０８は、測定したビームのパワーに関する信号を制御装置１０４に伝達する。被加工物Ｃは、その位置を制御するためのＸＹＺステージ１１４に載置されている。制御装置１０４は、フォトセンサ１０８からのパワー信号に基づいてレーザビームの出力の調整を行うとともに、ＸＹＺステージ１１４の位置の調整も行う。   FIG. 12 shows a schematic configuration of the laser device 100 for forming the elastic portion 14 in the first conductive portion 11. The laser apparatus 100 includes a laser generator 102 that outputs a laser beam. An SHG-YAG laser device can be used as this laser generator. The laser device 100 also deflects the beam to a workpiece C (for example, the first conductive portion 11) and a beam sampler 106 for branching a part of the laser beam output from the laser generator 102. Mirror 110, a condensing lens 112 for condensing the deflected beam, and a photosensor 108 for measuring a part of the beam branched from the beam sampler 106. The photo sensor 108 transmits a signal related to the measured beam power to the control device 104. The workpiece C is placed on an XYZ stage 114 for controlling its position. The control device 104 adjusts the output of the laser beam based on the power signal from the photosensor 108 and also adjusts the position of the XYZ stage 114.

ここで、図１３のフローチャートに従って、レーザ装置１００を用いて第一導電部１１の弾性部１４を形成するための工程を説明する。   Here, the process for forming the elastic part 14 of the 1st electroconductive part 11 using the laser apparatus 100 is demonstrated according to the flowchart of FIG.

まず、ステップＳ７１において、第一導電部１１の位置決めを行う。つまり、図１１（ａ）に示すように、第一導電部１１の弾性部１４を形成する位置に適切にレーザビームが照射されるように、ＸＹＺステージ１１４を移動して、その上に載置されている第一導電部１１の位置決めを行う。   First, in step S71, the first conductive portion 11 is positioned. That is, as shown in FIG. 11A, the XYZ stage 114 is moved and placed on the XYZ stage 114 so that the laser beam is appropriately irradiated to the position where the elastic portion 14 of the first conductive portion 11 is formed. The first conductive part 11 is positioned.

ステップＳ７２では、レーザビームの出力の大きさや出力タイミングを設定する。   In step S72, the output level and output timing of the laser beam are set.

ステップＳ７３では、ＸＹＺステージ１１４の駆動を行いながら、第一導電部１１にレーザビームを照射して、弾性部１４を形成する部分の所定の箇所を削り取る。つまり、弾性部１４を形成する部分から、図１１（ｂ）に示すように、２つの半円柱部分を切り取って、所定の厚さを有する板状部分を形成する。   In step S <b> 73, while driving the XYZ stage 114, the first conductive portion 11 is irradiated with a laser beam, and a predetermined portion of the portion where the elastic portion 14 is formed is scraped off. That is, as shown in FIG. 11B, two semi-cylindrical portions are cut out from the portion where the elastic portion 14 is formed to form a plate-like portion having a predetermined thickness.

ステップＳ７４では、その板状部分を有する第一導電部１１をその軸線を中心に９０度回転させて、図１１（ｃ）に示すように、平面に対しレーザ光が照射できるような状態にする。   In step S74, the first conductive portion 11 having the plate-like portion is rotated by 90 degrees around the axis so that the plane can be irradiated with laser light as shown in FIG. 11C. .

ステップＳ７５では、次のレーザ加工のために必要なレーザビームの出力の大きさ、出力タイミング、ＸＹＺステージ１１４の移動範囲を設定する。ただし、この設定は、ステップＳ７２において行ってもよい。   In step S75, the magnitude, output timing, and movement range of the XYZ stage 114 necessary for the next laser processing are set. However, this setting may be performed in step S72.

ステップＳ７６では、詳細は後述するように、その弾性部１４の板状部分に、レーザビームを照射して、不要な短冊状の部分を取り除いて、のこぎり状の部分を残す（図１１（ｄ））。   In step S76, as will be described in detail later, the plate-like portion of the elastic portion 14 is irradiated with a laser beam to remove unnecessary strip-like portions and leave a saw-like portion (FIG. 11D). ).

図１４（ａ）から図１４（ｄ）は、第一導電部にさまざまな形状の弾性部を形成した例を示す。   FIG. 14A to FIG. 14D show examples in which elastic portions having various shapes are formed in the first conductive portion.

図１４（ａ）は、第一導電部５１にのこぎり形状の弾性部５４を形成した例を示す。こののこぎり形状の弾性部５４は、第一導電部５１の軸線方向に沿って、交互にずらされて配置された複数の短冊状の部分５４ｂ（細長い矩形部分）を取り除いてのこぎり形状の部分５４ａを残したものである。   FIG. 14A shows an example in which a saw-shaped elastic portion 54 is formed on the first conductive portion 51. The saw-shaped elastic portion 54 is formed by removing a plurality of strip-shaped portions 54b (elongated rectangular portions) that are alternately shifted along the axial direction of the first conductive portion 51, thereby removing the saw-shaped portion 54a. It ’s left.

それを形成するにあたっては、その短冊状の部分５４ｂは交互に第一導電部５１の幅方向にずれているので、その幅方向に外側から内側に向かって順に短冊状の部分５４ｂをレーザ光によって切りとる。その場合、一方の側において順に短冊状の部分５４ｂをレーザ光によって切り取り、次に、他方の側において順に短冊状の部分５４ｂを切り取るようにしてもよく、または、左右の側の方向（図に向かって上下方向）から交互に短冊状の部分５４ｂを切り取るようにしてもよい。   In forming it, the strip-shaped portions 54b are alternately displaced in the width direction of the first conductive portion 51. Therefore, the strip-shaped portions 54b are sequentially moved in the width direction from the outside toward the inside by the laser beam. Cut it out. In that case, the strip-shaped portion 54b may be cut out sequentially on one side by laser light, and then the strip-shaped portion 54b may be cut off sequentially on the other side, or in the direction of the left and right sides (see FIG. Alternatively, the strip-shaped portions 54b may be alternately cut from the vertical direction.

そのように短冊状の部分５４ｂを取り除くと、図１１（ｄ）に示されているようなのこぎり状の部分５４ａが残されたのこぎり形状の弾性部５４が形成される。   If the strip-shaped portion 54b is removed in such a manner, the saw-shaped elastic portion 54 is formed in which the saw-shaped portion 54a is left as shown in FIG.

図１４（ｂ）は、第一導電部６１にジグザグ状の弾性部６４を形成した例を示す。このジグザグ状の弾性部６４は、第一導電部６１の側縁に軸線方向に沿って並んだ小さな三角形状の部分６４ｂを取り除いてジグザグ状の部分６４ａを残したものである。   FIG. 14B shows an example in which a zigzag elastic portion 64 is formed on the first conductive portion 61. The zigzag elastic portion 64 is obtained by removing the small triangular portion 64b arranged in the axial direction on the side edge of the first conductive portion 61 and leaving the zigzag portion 64a.

それを形成するにあたっては、その小さな三角形状の部分６４ｂは側縁に沿って並んでいるので、幅方向の外側からそれらの三角形状の部分６４ｂをレーザ光によって切り取る。その場合、一方の側に並ぶ三角形状の部分６４ｂをレーザ光によって切り取り、次に、他方の側に並ぶ三角形状の部分６４ｂを切り取るようにしてもよく、または、左右交互に三角形状の部分６４ｂを切り取るようにしてもよい。   In forming it, since the small triangular portions 64b are arranged along the side edges, the triangular portions 64b are cut out from the outside in the width direction by laser light. In that case, the triangular portions 64b arranged on one side may be cut out by laser light, and then the triangular portions 64b arranged on the other side may be cut out, or the triangular portions 64b alternately left and right. May be cut off.

図１４（ｃ）は、第一導電部７１の軸線の部分に沿って細い棒状の弾性部７４を形成した例を示す。この細い棒状の弾性部７４は、第一導電部７１の軸線に平行な２本の細長い棒状の部分７４ｂを取り除いて軸線部分に沿った細い棒状の部分７４ａを残したものである。   FIG. 14C shows an example in which a thin rod-like elastic portion 74 is formed along the axis portion of the first conductive portion 71. The thin rod-like elastic portion 74 is obtained by removing two elongated rod-like portions 74b parallel to the axis of the first conductive portion 71 and leaving a thin rod-like portion 74a along the axis portion.

それを形成するにあたっては、その２本の細長い棒状の部分７４ｂは、幅方向に並んでいるので、幅方向外側から各細長い棒状部分７４ｂをそれぞれレーザ光によって切り取る。   In forming it, the two elongated rod-shaped portions 74b are arranged in the width direction, and therefore each elongated rod-shaped portion 74b is cut out by laser light from the outside in the width direction.

図１４（ｄ）は、第一導電部８１に波形状の弾性部８４を形成した例を示す。この波形状の弾性部８４は、第一導電部８１の軸線方向に沿って側縁に並んだ小さな半円形状の部分８４ｂを取り除いて波形状の部分８４ａを残したものである。   FIG. 14D shows an example in which a wave-shaped elastic portion 84 is formed in the first conductive portion 81. The wave-shaped elastic portion 84 is obtained by removing the small semicircular portion 84b arranged on the side edge along the axial direction of the first conductive portion 81 and leaving the wave-shaped portion 84a.

それを形成するにあたっては、その小さな半円形状の部分８４ｂは側縁に沿って並んでいるので、幅方向からそれらの半円形状の部分８４ｂをレーザ光によって切り取る。その場合、一方の側に並ぶ半円形状の部分８４ｂをレーザ光によって切り取り、次に、他方の側に並ぶ半円形状の部分８４ｂを切り取るようにしてもよく、または、左右交互に半円形状の部分８４ｂを切り取るようにしてもよい。   In forming it, since the small semicircular portions 84b are arranged along the side edges, the semicircular portions 84b are cut out by laser light from the width direction. In that case, the semicircular portions 84b arranged on one side may be cut out by the laser beam, and then the semicircular portions 84b arranged on the other side may be cut out, or alternatively, the semicircular portions 84b arranged alternately on the left and right sides. The portion 84b may be cut off.

これらのさまざまな形状の弾性部のように、弾性部の形状を弾性部の中心に関して点対称に形成すると、伸縮の方向や湾曲の大きさがその点に関して対称的になるので、導電部を検査点や電極部に均等な力で圧接させることができる。   Like these variously shaped elastic parts, if the shape of the elastic part is point-symmetric with respect to the center of the elastic part, the direction of expansion and contraction and the magnitude of the curve become symmetrical with respect to that point, so the conductive part is inspected It is possible to press the point and the electrode part with equal force.

上記の各実施形態は、円柱状の第一導電部とそれを囲む円筒状の第二導電部とからなる四端子プローブ治具について説明したが、二端子プローブ治具にも、上記の各実施形態における第一導電部又は第二導電部と同様に、弾性部を任意の位置にプローブと一体に形成するようにしてもよい。   In each of the above embodiments, the four-terminal probe jig including the columnar first conductive portion and the cylindrical second conductive portion surrounding the first conductive portion has been described. Similarly to the first conductive portion or the second conductive portion in the embodiment, the elastic portion may be formed integrally with the probe at an arbitrary position.

上記の本発明の各実施形態に係る基板検査用接触子によると、弾性部が棒状部分と一体的に形成されているためそれらを接続する部材等が不要であり、また、導電部と一体であるため、耐久性に優れるという特徴を有している。また、レーザ加工によって一部を削り取るだけで容易に弾性部を形成することができる。   According to the board inspection contact according to each embodiment of the present invention described above, since the elastic portion is formed integrally with the rod-like portion, a member for connecting them is unnecessary, and the conductive portion is integrated. Therefore, it has a feature of excellent durability. In addition, the elastic portion can be easily formed by simply removing a part by laser processing.

また、弾性部の形状を弾性部の中心に関して点対称に形成することによって、伸縮及び湾曲の大きさや方向が均一になるので、導電部を検査点や電極部に均等な力で圧接させることができる。   Further, by forming the shape of the elastic portion point-symmetrically with respect to the center of the elastic portion, the size and direction of expansion and contraction and the direction become uniform, so that the conductive portion can be pressed against the inspection point and the electrode portion with an equal force. it can.

尚、本明細書中では、これらの二つの端子である電圧測定用端子及び電流印加用端子をそれぞれ第一導電部及び第二導電部として説明しているが、電圧測定用端子を第二導電部とし、電流印加用端子を第一導電部としてもよい。   In this specification, the voltage measuring terminal and the current applying terminal, which are these two terminals, are described as a first conductive part and a second conductive part, respectively. And the current application terminal may be the first conductive portion.

また、本発明での検査点とは、導通及び／又は短絡を検査するために必要な被検査基板上に予め設定されるものである。特に、本基板検査用接触子は、チップのランド上などに盛られる金属の突起部で、インナーリードボンディングを容易にするバンプに好適に用いることができる。   The inspection point in the present invention is set in advance on a substrate to be inspected necessary for inspecting conduction and / or short circuit. In particular, the contact for inspecting the substrate can be suitably used for a bump that facilitates inner lead bonding at a metal protrusion on a land of a chip.

Claims (17)

被検査基板の配線パターン上に設定される所定の検査点に接触する検査点接触部と検査装置の電極部に接触する検査電極接触部とをそれぞれ備える第一導電部及び第二導電部を有するとともに前記第一導電部又は第二導電部の一方が電圧測定に用いられ、他方が電流印加用に用いられ、端部が前記検査装置の検査治具のヘッド部に設けられた保持板の保持孔に挿入され保持される基板検査用接触子であって、
前記第一導電部は、可撓性及び導電性を有する長尺状の形状を有し、さらに、長手方向に伸縮する弾性部を有し、
前記第二導電部は、前記第一導電部を内部に収容するとともに可撓性及び導電性を有する筒状部材により形成され、
前記弾性部は、前記ヘッド部の前記保持孔に保持される際に、該保持孔の内部に配置される部分に設けられることを特徴とする基板検査用接触子。A first conductive portion and a second conductive portion each having an inspection point contact portion that contacts a predetermined inspection point set on the wiring pattern of the substrate to be inspected and an inspection electrode contact portion that contacts an electrode portion of the inspection apparatus; In addition, one of the first conductive portion and the second conductive portion is used for voltage measurement, the other is used for current application, and the end is held by a holding plate provided in the head portion of the inspection jig of the inspection apparatus. A substrate inspection contact inserted and held in a hole,
The first conductive portion has a long shape having flexibility and conductivity, and further has an elastic portion that expands and contracts in the longitudinal direction.
The second conductive part is formed of a cylindrical member that houses the first conductive part and has flexibility and conductivity,
When the elastic part is held in the holding hole of the head part, the elastic contact part is provided in a portion arranged inside the holding hole. 請求項１の基板検査用接触子において、
前記保持板が上部保持板及び下部保持板からなり、該上部保持板又は下部保持板の一方の前記保持孔に挿入される前記第一導電部又は第二導電部の一方に弾性部が形成されていることを特徴とする基板検査用接触子。The substrate inspection contact according to claim 1,
The holding plate includes an upper holding plate and a lower holding plate, and an elastic portion is formed in one of the first conductive portion and the second conductive portion inserted into one holding hole of the upper holding plate or the lower holding plate. A contact for inspecting a substrate. 請求項１の基板検査用接触子において、
前記保持板が上部保持板及び下部保持板からなり、前記第一導電部に設けられた弾性部と前記第二導電部に設けられた弾性部とが、異なる保持板の前記保持孔に挿入される位置に形成されていることを特徴とする基板検査用接触子。The substrate inspection contact according to claim 1,
The holding plate includes an upper holding plate and a lower holding plate, and an elastic portion provided in the first conductive portion and an elastic portion provided in the second conductive portion are inserted into the holding holes of different holding plates. A contact for inspecting a substrate, wherein the contact is formed at a position. 請求項１の基板検査用接触子において、
前記弾性部は、前記第一導電部又は第二導電部と一体的に形成されていることを特徴とする基板検査用接触子。The substrate inspection contact according to claim 1,
The elastic contact portion is formed integrally with the first conductive portion or the second conductive portion. 請求項１の基板検査用接触子において、検査治具のヘッド部への取り付け前では、前記第一導電部が前記第二導電部よりも長いことを特徴とする基板検査用接触子。  2. The substrate inspection contact according to claim 1, wherein the first conductive portion is longer than the second conductive portion before the inspection jig is attached to the head portion. 請求項１の基板検査用接触子において、検査治具のヘッド部への取り付け前では、前記第二導電部が前記第一導電部よりも長いことを特徴とする基板検査用接触子。  2. The substrate inspection contact according to claim 1, wherein the second conductive portion is longer than the first conductive portion before the inspection jig is attached to the head portion. 被検査基板の配線パターン上に設定される所定の検査点に接触する検査点接触部と検査装置の電極部に接触する検査電極接触部とを備え、端部が前記検査装置の検査治具のヘッド部に設けられた保持板の保持孔に挿入され保持される基板検査用接触子であって、
可撓性及び導電性を有する長尺状の形状を有する第一導電部と該第一導電部を内部に収容する可撓性及び導電性を有する第二導電部を有し、
前記第一導電部には、長手方向に伸縮する弾性部が一体的に形成されており、前記弾性部は、所定の厚みの板状部より複数の矩形部を、該板状部の両側から交互に除去することによって形成された１本の連続した帯状部材が折れ曲がった形状を有し、
前記弾性部が、前記ヘッド部の保持孔に保持される際に、該保持孔の内部に配置される部分に設けられることを特徴とする基板検査用接触子。An inspection point contact portion that contacts a predetermined inspection point set on the wiring pattern of the substrate to be inspected, and an inspection electrode contact portion that contacts an electrode portion of the inspection device, and an end portion of the inspection jig of the inspection device A substrate inspection contact inserted and held in a holding hole of a holding plate provided in the head part,
Having a second conductive portion having flexibility and conductivity for accommodating the first conductive portion and said one conductivity unit for chromatic elongated shape having flexibility and conductivity therein,
The first conductive portion is integrally formed with an elastic portion that expands and contracts in the longitudinal direction, and the elastic portion has a plurality of rectangular portions from a plate-like portion having a predetermined thickness from both sides of the plate-like portion. One continuous belt-like member formed by alternately removing has a bent shape,
A contact for inspecting a substrate, wherein the elastic portion is provided at a portion disposed inside the holding hole when the elastic portion is held in the holding hole of the head portion. 被検査基板の配線パターンの電気的特性を検査するために前記被検査基板の所定の検査点に接触させて電気信号を伝送する複数の接触子と該複数の接触子を保持する保持体とからなる検査治具であって、
前記接触子は、可撓性及び導電性を有する第一導電部と該第一導電部を内部に収容する可撓性及び導電性を有する第二導電部からなり、
前記保持体は、前記所定の検査点に前記接触子の一端を案内する第一保持孔と、前記接触子の他端を前記検査装置の電極部へ案内する第二保持孔を有し、
前記第一導電部は、少なくとも一つの長手方向に伸縮する弾性部を有し、
前記弾性部は、前記第一保持孔及び／又は第二保持孔内に配置されていることを特徴とする検査治具。In order to inspect the electrical characteristics of the wiring pattern of the board to be inspected, a plurality of contacts that transmit electrical signals by contacting a predetermined inspection point of the board to be inspected, and a holder that holds the plurality of contacts An inspection jig,
The contact consists of a first conductive part having flexibility and conductivity, and a second conductive part having flexibility and conductivity for accommodating the first conductive part inside,
The holding body has a first holding hole for guiding one end of the contact to the predetermined inspection point, and a second holding hole for guiding the other end of the contact to the electrode portion of the inspection device,
The first conductive portion has at least one elastic portion that expands and contracts in the longitudinal direction,
The elastic jig is arranged in the first holding hole and / or the second holding hole. 請求項８の検査治具において、前記保持孔は前記被検査基板に対し直交する方向に形成されていて、前記弾性部は該保持孔内において前記接触子の長手方向に直線的に伸縮自在であることを特徴とする検査治具。  9. The inspection jig according to claim 8, wherein the holding hole is formed in a direction orthogonal to the substrate to be inspected, and the elastic portion is linearly extendable in the longitudinal direction of the contact in the holding hole. An inspection jig characterized by being. 請求項８の検査治具において、
前記第一保持孔又は第二保持孔の一方に挿入される前記第一導電部又は第二導電部の一方に弾性部が形成されていることを特徴とする検査治具。The inspection jig according to claim 8,
An inspection jig, wherein an elastic part is formed in one of the first conductive part and the second conductive part inserted into one of the first holding hole or the second holding hole. 請求項８の検査治具において、
前記第一導電部に設けられた弾性部と前記第二導電部に設けられた弾性部とが、異なる前記保持孔に挿入される部分に形成されていることを特徴とする検査治具。The inspection jig according to claim 8,
An inspection jig, wherein an elastic portion provided in the first conductive portion and an elastic portion provided in the second conductive portion are formed in different portions inserted into the holding holes. 請求項８の検査治具において、
前記弾性部は、前記第一導電部又は第二導電部と一体的に形成されていることを特徴とする検査治具。The inspection jig according to claim 8,
The inspection jig, wherein the elastic part is formed integrally with the first conductive part or the second conductive part. 被検査基板の配線パターン上に設定される所定の検査点に夫々が圧接され、一方が電圧測定に用いられ、他方が電流印加用に用いられる第一導電部及び第二導電部を有する基板検査用接触子の製造方法であって、
導電性を有する長尺状の第一導電部の一部にレーザ光を照射して、該一部を所定形状に加工して、該第一導電部の長手方向に伸縮する弾性部を形成する弾性部形成工程と、
前記弾性部が形成された前記第一導電部を、導電性を有する筒状部材により形成される第二導電部に収容する収容工程を有し、
前記弾性部形成工程は、
前記第一導電部の一部にレーザ光を照射して所定厚みの板状部を形成する第一形成工程と、
前記板状部にレーザ光を照射して、前記板状部の幅方向外側から内側に向って、交互に反対側から複数の所定の形状を除去することによって前記板状部を所定の形に形成する第二形成工程を有することを特徴とする基板検査用接触子の製造方法。Substrate inspection having a first conductive portion and a second conductive portion, each of which is pressed against a predetermined inspection point set on the wiring pattern of the substrate to be inspected, one is used for voltage measurement, and the other is used for current application a manufacturing method of use contact,
A part of the long conductive first conductive part is irradiated with laser light, and the part is processed into a predetermined shape to form an elastic part that expands and contracts in the longitudinal direction of the first conductive part. An elastic part forming step;
Have a housing step of housing the resilient portion and the first conductive portion is formed, the second conductive part formed by a tubular member having conductivity,
The elastic part forming step includes
A first forming step of forming a plate-like portion having a predetermined thickness by irradiating a part of the first conductive portion with a laser beam;
By irradiating the plate-like portion with laser light, the plate-like portion is formed into a predetermined shape by removing a plurality of predetermined shapes from the opposite side alternately from the outside in the width direction to the inside. method of manufacturing a circuit board inspection contactor, characterized in that have a second formation step of forming. 請求項１３の基板検査用接触子の製造方法において、前記弾性部形成工程において一部に弾性部を形成する第一導電部及び第二導電部は、全体として可撓性を有することを特徴とする基板検査用接触子の製造方法。  14. The method of manufacturing a contact for inspecting a substrate according to claim 13, wherein the first conductive portion and the second conductive portion that form the elastic portion in part in the elastic portion forming step have flexibility as a whole. Of manufacturing a contact for inspecting a substrate. 請求項１３の基板検査用接触子の製造方法において、前記弾性部は、前記板状部の一部を幅方向に交互に切欠いて波形状に形成され、前記弾性部は、前記板状部の一部を幅方向に切欠いて矩形波状に形成され、前記弾性部は、前記板状部の幅方向の外側部分を切欠いて細棒状に形成され、又は、前記弾性部は、前記板状部上で該板状部の中心点に関し点対称となるように形成され、さらに、前記弾性部形成工程の後に、前記第一導電部の外周に絶縁膜を形成する工程を有し、さらに、前記収容工程の後に、前記第二導電部の端部を先細り形状に形成する工程を有することを特徴とする基板検査用接触子の製造方法。  14. The method for manufacturing a contact for inspecting a substrate according to claim 13, wherein the elastic part is formed in a wave shape by alternately cutting out a part of the plate-like part in the width direction, and the elastic part is formed of the plate-like part. Part of the elastic part is formed in a rectangular wave shape by cutting out in the width direction, and the elastic part is formed in a thin bar shape by cutting out an outer part in the width direction of the plate-like part, or the elastic part is formed on the plate-like part. And having a step of forming an insulating film on the outer periphery of the first conductive portion after the elastic portion forming step, and further including the housing. A method for manufacturing a contact for inspecting a substrate, comprising a step of forming an end of the second conductive portion in a tapered shape after the step. 被検査基板の配線パターン上に設定される所定の検査点に夫々が圧接され、一方が電圧測定に用いられ、他方が電流印加用に用いられる第一導電部及び第二導電部を有する基板検査用接触子であって、
前記第一導電部は、導電性を有する長尺状の形状を有するとともに、該第一導電部の一部分にレーザ光を照射して形成される長手方向に収縮する弾性部を有し、
前記第二導電部は、前記第一導電部を内部に収容するとともに導電性を有する筒状部材により形成され、更に長手方向に収縮する一体的に形成された弾性部を有し、
該基板検査用接触子を検査装置の検査治具のヘッド部に設けられた保持板の保持孔に挿入したとき、前記第一導電部の弾性部は、前記保持体の第一保持孔に配置され、前記第二導電部の弾性部は、前記保持体の第二保持孔に配置されることを特徴とする、基板検査用接触子。Substrate inspection having a first conductive portion and a second conductive portion, each of which is pressed against a predetermined inspection point set on the wiring pattern of the substrate to be inspected, one is used for voltage measurement, and the other is used for current application Contact for
The first conductive portion has a long shape having conductivity and an elastic portion that contracts in a longitudinal direction formed by irradiating a part of the first conductive portion with laser light,
The second conductive portion is formed of a cylindrical member having electrical conductivity while accommodating the first conductive portion therein , and further has an integrally formed elastic portion that contracts in the longitudinal direction,
When the substrate inspection contact is inserted into the holding hole of the holding plate provided in the head part of the inspection jig of the inspection apparatus, the elastic part of the first conductive part is arranged in the first holding hole of the holding body. is, the elastic portion of the second conductive section, it being disposed in the second holding hole of the holding member, the contact substrate inspection. 請求項１６記載の基板検査用接触子において、The contact for inspection of a substrate according to claim 16,
前記第一導電部の弾性部は、所定の厚みの板状部より複数の矩形部を、該板状部の両側から交互に除去することによって形成された１本の連続した帯状部材が折れ曲がった形状を有することを特徴とする、基板検査用接触子。  The elastic portion of the first conductive portion is formed by bending a single continuous belt-like member formed by alternately removing a plurality of rectangular portions from a plate-like portion having a predetermined thickness from both sides of the plate-like portion. A contact for inspecting a substrate, characterized by having a shape.
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