JP5085512B2 - Method and apparatus for cleaning liquid material supply hose - Google Patents

Method and apparatus for cleaning liquid material supply hose Download PDF

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JP5085512B2
JP5085512B2 JP2008285422A JP2008285422A JP5085512B2 JP 5085512 B2 JP5085512 B2 JP 5085512B2 JP 2008285422 A JP2008285422 A JP 2008285422A JP 2008285422 A JP2008285422 A JP 2008285422A JP 5085512 B2 JP5085512 B2 JP 5085512B2
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cleaning
pressure
hose
material supply
liquid material
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JP2010110696A (en
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透 池田
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Nissei Plastic Industrial Co Ltd
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本発明は、液状材料供給用ホースの内壁に付着した汚れを除去する際に用いて好適な液状材料供給用ホースの洗浄方法及び装置に関する。   The present invention relates to a method and apparatus for cleaning a liquid material supply hose suitable for use in removing dirt adhering to an inner wall of a liquid material supply hose.

従来、液状シリコンゴム(LSR)等の液状樹脂材料(主剤)と液状硬化剤を含む二種以上の液状材料を加えた成形材料を射出シリンダに供給し、スクリュにより成形材料を混合計量して射出成形を行う液状材料成形用射出成形機は知られており、このような液状材料成形用射出成形機には、主剤と液状硬化剤を含む液状材料(成形材料)を射出成形機の材料供給口に供給する材料供給装置を備えている。   Conventionally, a molding material containing two or more liquid materials including a liquid resin material (main ingredient) such as liquid silicone rubber (LSR) and a liquid curing agent is supplied to an injection cylinder, and the molding material is mixed and measured by a screw and injected. 2. Description of the Related Art Injection molding machines for molding liquid materials that perform molding are known. In such an injection molding machine for molding liquid materials, a liquid material (molding material) containing a main agent and a liquid curing agent is supplied to a material supply port of the injection molding machine. A material supply device is provided.

この種の材料供給装置は、通常、第一の貯留タンクに収容される主剤と第二の貯留タンクに収容される液状硬化剤をそれぞれ液状材料供給用ホースにより合流部まで送り、合流部により主剤と液状硬化剤を合流(混合)させる機能を備えている。このような材料供給装置としては、特許文献1で開示される2液混合吐出装置が知られており、同文献1には、2液および洗浄液用の3つの液タンクを収納する油槽の下部に、3つの液タンクを直結する通液孔を個別に有しかつこれら通液孔を交互に開閉するスプールを有する弁装置を結合し、該弁装置に、スプールを介して2液を吸引し該スプールの回転に応じて通液孔の吸引側又は吐出側に選択的に吐出するプランジャポンプユニットと、プランジャポンプユニットから通液孔を介して圧送された2液を混合するミキサーとを結合してなる吐出機本体を備えて構成した2液混合吐出装置が開示されている。   This type of material supply apparatus normally sends the main agent stored in the first storage tank and the liquid curing agent stored in the second storage tank to the junction by the liquid material supply hose, respectively, and the main agent by the junction And a liquid curing agent are combined (mixed). As such a material supply device, a two-liquid mixing / discharging device disclosed in Patent Document 1 is known. In the same document 1, there is a lower part of an oil tank that houses three liquid tanks for two liquids and a cleaning liquid. A valve device having individual fluid passage holes that directly connect the three fluid tanks and having a spool that alternately opens and closes these fluid passage holes is coupled, and two fluids are sucked into the valve device through the spool, A plunger pump unit that selectively discharges to the suction side or discharge side of the liquid passage hole according to the rotation of the spool, and a mixer that mixes the two liquids pumped from the plunger pump unit through the liquid passage hole There is disclosed a two-liquid mixing / discharging device configured to include a discharger main body.

ところで、この種の材料供給装置(2液混合吐出装置)では、使用に伴って液状材料供給用ホースの内壁に付着残留した主剤又は液状硬化剤が次第に汚れとして蓄積し、最終的にはホース詰まりを起こしてしまう。したがって、このような汚れに対する対策が必要となり、特許文献1では、混合した2液の注入完了と同時に、スプールを90゜回転させてその周溝を吸引側に復帰させ、これにより、スプールの孔を、洗浄液用通液孔および2液用通液孔の吐出側に対向させるとともに、これに合わせてスプールを開き、第3の液タンクから洗浄液を、スプールの孔、2液用通液孔、ミキサー内の通液孔を通じて混合室に導入することにより2液の流路を洗浄する構成を採用している。
特公平8−22398号公報
By the way, in this type of material supply device (two-liquid mixing and discharging device), the main agent or the liquid curing agent adhering and remaining on the inner wall of the liquid material supply hose gradually accumulates as it is used and eventually becomes clogged. Will be caused. Accordingly, it is necessary to take measures against such contamination. In Patent Document 1, simultaneously with the completion of the injection of the two mixed liquids, the spool is rotated 90 ° to return the circumferential groove to the suction side, thereby Is opposed to the discharge side of the cleaning liquid flow hole and the two liquid flow hole, and the spool is opened in accordance with this, and the cleaning liquid is supplied from the third liquid tank to the spool hole, the two liquid flow holes, A configuration is adopted in which the flow path of the two liquids is washed by being introduced into the mixing chamber through a liquid passage hole in the mixer.
Japanese Patent Publication No. 8-22398

しかし、上述した2液混合吐出装置をはじめ、従来の材料供給装置は次のような問題点があった。   However, the conventional material supply apparatus including the above-described two-liquid mixing and discharging apparatus has the following problems.

即ち、特許文献1の場合、液状材料供給用ホースの汚れに対する対策として、2液混合吐出装置の吐出機本体に洗浄機構を一体に組込む構成を採用するが、このような洗浄機構は各吐出装置における専用の機構となるため、汎用性に欠け、各吐出装置のコストアップ及び大型化を招く要因になる。一方、一般的な材料供給装置(2液混合吐出装置)では、このような洗浄機構を組込まないタイプも少なくなく、通常、汚れた液状材料供給用ホースは寿命が尽きたものとして新品の液状材料供給用ホースと交換しているのが実情である。この場合、耐圧性を有する液状材料供給用ホースは高価であり、また、多品種少量生産では頻繁に交換する必要があり、ホース交換に伴うランニングコストは無視できない。   That is, in the case of Patent Document 1, as a countermeasure against contamination of the liquid material supply hose, a configuration in which a cleaning mechanism is integrally incorporated in the main body of the two-liquid mixing / discharging device is adopted. Since this is a dedicated mechanism, the versatility is lacking, and this increases the cost and size of each discharge device. On the other hand, there are not a few types of general material supply devices (two-liquid mixing and discharge devices) that do not incorporate such a cleaning mechanism. Normally, a dirty liquid material supply hose is a new liquid material because its life has expired. The fact is that it is replaced with a supply hose. In this case, the pressure-resistant liquid material supply hose is expensive, and it is necessary to replace it frequently in high-mix low-volume production, and the running cost associated with the hose replacement cannot be ignored.

このように、液状材料供給用ホースの汚れに対する従来の対策は、いずれもコスト削減や資源節減の観点からは不十分であり、液状材料供給用ホースの汚れに対する、特に、コスト削減及び資源節減を図る観点からより適切で望ましい対応策が要請されていた。   As described above, all of the conventional measures against the contamination of the liquid material supply hose are insufficient from the viewpoint of cost reduction and resource saving. Especially, the cost reduction and resource saving for the contamination of the liquid material supply hose are not achieved. There was a demand for a more appropriate and desirable countermeasure from the perspective of planning.

本発明は、このような背景技術に存在する課題を解決した液状材料供給用ホースの洗浄方法及び装置の提供を目的とするものである。   An object of the present invention is to provide a cleaning method and apparatus for a liquid material supply hose that solves the problems in the background art.

本発明に係る液状材料供給用ホースの洗浄方法は、上述した課題を解決するため、液状の成形材料Rを供給する液状材料供給用ホース(被洗浄ホース)Ha,Hb…の内壁に付着した汚れD…を溶かして洗浄する洗浄用溶剤Lcにより除去するに際し、被洗浄ホースHa,Hb…に対して所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成可能な第一圧力P1により、第一洗浄時間T1にわたり洗浄用溶剤Lcを循環させて粗洗浄を行う粗洗浄工程Sfと、この粗洗浄工程Sfが終了した被洗浄ホースHa…に、第一圧力P1に対して1/10以下の大きさとなる低圧に設定した第二圧力P2により、第一洗浄時間T1よりも長い時間に設定した第二洗浄時間T2にわたり洗浄用溶剤Lcを循環させて本洗浄を行う本洗浄工程Smとを経て被洗浄ホースHa…の洗浄を行うようにしたことを特徴とする。   In order to solve the above-described problems, the method for cleaning a liquid material supply hose according to the present invention is a stain adhered to the inner walls of liquid material supply hoses (washed hoses) Ha, Hb. When the cleaning solvent Lc that dissolves and cleans D ... is removed, the first pressure P1 that can form a flow passage Wf through which the cleaning solvent Lc of a predetermined flow rate or more flows through the to-be-washed hoses Ha, Hb, ... 1/10 or less with respect to 1st pressure P1 in rough washing process Sf which circulates solvent Lc for washing over the 1st washing time T1, and performs rough washing, and hose Ha to be washed which this rough washing process Sf finished A main cleaning step Sm for performing main cleaning by circulating the cleaning solvent Lc over a second cleaning time T2 set to a time longer than the first cleaning time T1 by a second pressure P2 set to a low pressure of After characterized in that to perform the object to be cleaned hose Ha ... of cleaning.

この場合、発明の好適な態様により、被洗浄ホースHa…には、液状材料成形用射出成形機Mに成形材料Rを供給する材料供給装置60に使用した液状材料供給用ホースを適用することができる。なお、洗浄用溶剤Lcによる洗浄後、被洗浄ホースHa…に対して圧力エアAを所定時間循環させるエアパージ処理(S12)を行うことが望ましい。   In this case, according to a preferred aspect of the invention, the liquid material supply hose used in the material supply device 60 for supplying the molding material R to the liquid material molding injection molding machine M may be applied to the hose Ha to be cleaned. it can. In addition, after the cleaning with the cleaning solvent Lc, it is desirable to perform an air purge process (S12) in which the pressure air A is circulated through the hose Ha to be cleaned for a predetermined time.

一方、本発明に係る液状材料供給用ホースの洗浄装置1は、上述した課題を解決するため、液状の成形材料Rを供給する被洗浄ホースHa…の内壁に付着した汚れD…を溶かして洗浄する洗浄用溶剤Lcにより除去する洗浄装置であって、被洗浄ホースHa…に対して所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成可能な第一圧力P1により、第一洗浄時間T1にわたり洗浄用溶剤Lcを循環させる第一洗浄手段2と、被洗浄ホースHa…に、第一圧力P1に対して1/10以下の大きさとなる低圧に設定した第二圧力P2により、第一洗浄時間T1よりも長い時間に設定した第二洗浄時間T2にわたり洗浄用溶剤Lcを循環させる第二洗浄手段3を備えることを特徴とする。   On the other hand, in order to solve the above-described problem, the liquid material supply hose cleaning device 1 according to the present invention melts and cleans the dirt D attached to the inner wall of the to-be-cleaned hose Ha that supplies the liquid molding material R. A cleaning device that removes with a cleaning solvent Lc that performs a first cleaning time by a first pressure P1 that can form a flow passage Wf through which a cleaning solvent Lc of a predetermined flow rate or more flows with respect to the hose Ha to be cleaned. The first cleaning means 2 that circulates the cleaning solvent Lc over T1 and the second pressure P2 that is set to a low pressure of 1/10 or less of the first pressure P1 in the cleaned hose Ha. A second cleaning means 3 is provided for circulating the cleaning solvent Lc over a second cleaning time T2 set to a time longer than the cleaning time T1.

この場合、発明の好適な態様により、洗浄装置1には、液状材料成形用射出成形機Mに成形材料Rを供給する材料供給装置60に使用した被洗浄ホースHa…の一端が接続可能であって、洗浄用溶剤Lcを吐出する吐出用接続口4e,4ef,4esと、当該被洗浄ホースHa…の他端が接続可能であって、当該被洗浄ホースHa…を流通した洗浄用溶剤Lcが戻される戻し用接続口4r,4rf,4rsを設けることができる。また、第一洗浄手段2に、第一圧力P1により洗浄用溶液Lcを循環させる第一圧送ポンプ6fを設けるとともに、第二洗浄手段3に、第二圧力P2により洗浄用溶液Lcを循環させる、第一圧力ポンプ6fよりも定格出力の小さい第二圧送ポンプ6sを設けて構成してもよいし、或いは出力を変更可能な一台の圧送ポンプ6を設け、当該圧送ポンプ6の出力を変更することにより、第一圧力P1により洗浄用溶液Lcを循環させる第一洗浄手段2又は第二圧力P2により洗浄用溶液Lcを循環させる第二洗浄手段3に切換えてもよい。   In this case, according to a preferred aspect of the invention, the cleaning apparatus 1 can be connected to one end of the hose Ha to be cleaned used in the material supply apparatus 60 that supplies the molding material R to the liquid material molding injection molding machine M. Thus, the discharge connection ports 4e, 4ef, 4es for discharging the cleaning solvent Lc can be connected to the other ends of the to-be-cleaned hoses Ha ..., and the cleaning solvent Lc flowing through the to-be-cleaned hoses Ha ... Return connection ports 4r, 4rf, and 4rs can be provided. The first cleaning means 2 is provided with a first pump 6f for circulating the cleaning solution Lc with the first pressure P1, and the cleaning solution Lc is circulated with the second pressure P2 in the second cleaning means 3. The second pressure feed pump 6s having a smaller rated output than the first pressure pump 6f may be provided, or one pressure feed pump 6 capable of changing the output is provided, and the output of the pressure feed pump 6 is changed. Accordingly, the first cleaning means 2 for circulating the cleaning solution Lc with the first pressure P1 or the second cleaning means 3 for circulating the cleaning solution Lc with the second pressure P2 may be switched.

このような本発明に係る液状材料供給用ホースの洗浄方法及び装置1によれば、次のような顕著な効果を奏する。   According to such a method and apparatus 1 for cleaning a liquid material supply hose according to the present invention, the following remarkable effects can be obtained.

(1) 被洗浄ホースHa…に対して所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成可能な第一圧力P1により洗浄用溶剤Lcを第一洗浄時間T1にわたり循環させて粗洗浄を行う粗洗浄工程Sfと、この粗洗浄工程Sfが終了した被洗浄ホースHa…に対して第一圧力P1よりも低圧となる第二圧力P2により洗浄用溶剤Lcを第二洗浄時間T2にわたり循環させて本洗浄を行う本洗浄工程Smとを経るようにしたため、一台の洗浄装置1を多数の材料供給装置60…に共用できるとともに、被洗浄ホースHa…を有効に再生することができ、大幅なコスト削減、更には資源節減を実現できる。   (1) The cleaning solvent Lc is circulated over the first cleaning time T1 by the first pressure P1 capable of forming the flow passage Wf through which the cleaning solvent Lc of a predetermined flow rate or more flows with respect to the hose Ha to be cleaned. The cleaning solvent Lc is circulated over the second cleaning time T2 by the rough cleaning step Sf for performing the cleaning and the second pressure P2 lower than the first pressure P1 with respect to the hose Ha to be cleaned after the rough cleaning step Sf. Since the main cleaning step Sm for performing the main cleaning is performed, the single cleaning device 1 can be shared by a large number of material supply devices 60, and the cleaned hose Ha can be effectively regenerated, Significant cost savings and resource savings can be realized.

(2) 粗洗浄工程Sfと本洗浄工程Smを有するため、予め粗洗浄工程Sfにより所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを確保することにより、本洗浄工程Smにおいて効率的な洗浄を行うことができるという相乗効果を得ることができる。即ち、一般に洗浄用溶剤Lcは汚れD…を溶かして洗浄するため、高圧高速となる第一圧力P1により洗浄用溶剤Lcを循環させる粗洗浄工程Sfは、所定の流通路Wfを形成する能力は高くなるが、汚れD…に対する洗浄能力は低くなる。他方、低圧低速となる第二圧力P2により洗浄用溶剤Lcを循環させる本洗浄工程Smは、所定の流通路Wfを形成する能力は低くなるが、汚れD…に対する洗浄能力は高くなる。したがって、粗洗浄工程Sfと本洗浄工程Smの組合わせにより効率的な洗浄(汚れ落とし)が可能となり、特に、汚れD…の粘度が高い場合や被洗浄ホースHa…が長い場合に有益となる。   (2) Since the rough cleaning step Sf and the main cleaning step Sm are provided, the rough cleaning step Sf is effective in the main cleaning step Sm by securing the flow path Wf through which the cleaning solvent Lc of a predetermined flow rate or more flows in advance. A synergistic effect that cleaning can be performed can be obtained. That is, since the cleaning solvent Lc is generally cleaned by dissolving the dirt D ..., the rough cleaning step Sf in which the cleaning solvent Lc is circulated by the first pressure P1 at a high pressure and high speed has the ability to form a predetermined flow path Wf. Although it becomes high, the cleaning ability with respect to dirt D ... becomes low. On the other hand, in the main cleaning step Sm in which the cleaning solvent Lc is circulated by the second pressure P2 at a low pressure and a low speed, the ability to form the predetermined flow path Wf is lowered, but the ability to clean the dirt D is increased. Therefore, the combination of the rough cleaning step Sf and the main cleaning step Sm enables efficient cleaning (dirt removal), and is particularly beneficial when the dirt D ... has a high viscosity or the hose Ha to be cleaned is long. .

(3) 第二洗浄時間T2を、第一洗浄時間T1よりも長い時間に設定し、また、第二圧力P2を、第一圧力P1に対して1/10以下の大きさに設定したため、相対的に時間の長い第二洗浄時間T2の間、低圧低速となる第二圧力P2により循環させる洗浄用溶剤Lcにより、十分な洗浄(汚れ落とし)を行うことができる。   (3) Since the second cleaning time T2 is set to a time longer than the first cleaning time T1, and the second pressure P2 is set to 1/10 or less of the first pressure P1, relative In particular, during the long second cleaning time T2, sufficient cleaning (dirt removal) can be performed by the cleaning solvent Lc circulated by the second pressure P2 which is low pressure and low speed.

(4) 好適な態様により、被洗浄ホースHa…として、液状材料成形用射出成形機Mに液状の成形材料Rを供給する材料供給装置60に使用した液状材料供給用ホースを適用すれば、液状材料成形用射出成形機Mを使用する生産工場等におけるコスト削減及び資源節減に寄与できる。   (4) According to a preferred embodiment, if the liquid material supply hose used in the material supply device 60 for supplying the liquid molding material R to the liquid material molding injection molding machine M is applied as the to-be-cleaned hose Ha. This can contribute to cost reduction and resource saving in production factories that use the injection molding machine M for material molding.

(5) 好適な態様により、洗浄用溶剤Lcによる洗浄後、被洗浄ホースHa…に対して圧力エアAを所定時間循環させるエアパージ処理(S12)を行うようにすれば、残留する洗浄用溶剤Lcを被洗浄ホースHa…から効率的に除去することができる。   (5) According to a preferred embodiment, after the cleaning with the cleaning solvent Lc, if the air purge process (S12) for circulating the pressure air A through the hose Ha to be cleaned for a predetermined time is performed, the remaining cleaning solvent Lc Can be efficiently removed from the hose Ha to be cleaned.

(6) 好適な態様により、洗浄装置1に、液状材料成形用射出成形機Mに液状の成形材料Rを供給する材料供給装置60に使用した被洗浄ホースHa…の一端が接続可能であって、洗浄用溶剤Lcを吐出する吐出用接続口4e…と、当該被洗浄ホースHa…の他端が接続可能であって、当該被洗浄ホースHa…を流通した洗浄用溶剤Lcが戻される戻し用接続口4r…を設ければ、被洗浄ホースHa…をそのまま接続して容易に洗浄することができるとともに、各接続口4e…,4r…にアタッチメント等を付ければ、様々なサイズ及び形式の被洗浄ホースHa…の洗浄を行うことが可能となり、汎用性及び発展性に優れる。   (6) According to a preferred embodiment, the cleaning device 1 can be connected to one end of the hose Ha to be cleaned used in the material supply device 60 for supplying the liquid molding material R to the liquid material molding injection molding machine M. The discharge connection port 4e for discharging the cleaning solvent Lc and the other end of the to-be-cleaned hose Ha can be connected, and the return to which the cleaning solvent Lc flowing through the to-be-cleaned hose Ha is returned If the connection ports 4r are provided, the to-be-cleaned hoses Ha can be connected as they are for easy cleaning, and if attachments or the like are attached to the connection ports 4e, 4r, etc., various sizes and types of covers can be provided. The cleaning hose Ha can be cleaned, and is excellent in versatility and developability.

(7) 好適な態様により、第一洗浄手段2に、第一圧力P1により洗浄用溶剤Lcを循環させる第一圧送ポンプ6fを設けるとともに、第二洗浄手段3に、第二圧力P2により洗浄用溶剤Lcを循環させる、第一圧送ポンプ6fよりも定格出力の小さい第二圧送ポンプ6sを設ければ、廉価な圧送ポンプの組合わせにより構成することができ、全体のコスト面における有利性を高めることができる。   (7) According to a preferred embodiment, the first cleaning means 2 is provided with a first pressure feed pump 6f for circulating the cleaning solvent Lc at the first pressure P1, and the second cleaning means 3 is cleaned at the second pressure P2. If the second pumping pump 6s that circulates the solvent Lc and has a smaller rated output than the first pumping pump 6f is provided, the second pumping pump 6s can be configured by a combination of inexpensive pumping pumps, thereby improving the overall cost advantage. be able to.

(8) 好適な態様により、出力を変更可能な一台の圧送ポンプ6を設け、当該圧送ポンプ6の出力を変更することにより、第一圧力P1により洗浄用溶剤Lcを循環させる第一洗浄手段2又は第二圧力P2により洗浄用溶剤Lcを循環させる第二洗浄手段3に切換えるようにすれば、一台の圧送ポンプで足りるため、全体のサイズ面における有利性を高めることができる。   (8) According to a preferred embodiment, a first cleaning unit that circulates the cleaning solvent Lc with the first pressure P1 by providing a single pumping pump 6 whose output can be changed and changing the output of the pumping pump 6 By switching to the second cleaning means 3 that circulates the cleaning solvent Lc by 2 or the second pressure P2, one pressure feed pump is sufficient, so that the advantage in terms of the overall size can be increased.

次に、本発明に係る最良の実施形態を挙げ、図面に基づき詳細に説明する。   Next, the best embodiment according to the present invention will be given and described in detail with reference to the drawings.

まず、本実施形態に係る液状材料供給用ホースの洗浄方法及び装置1の理解を助けるため、液状材料供給用ホースを有する材料供給装置を含む液状材料成形用射出成形機Mについて、図4及び図5を参照して説明する。   First, in order to facilitate understanding of the method and apparatus 1 for cleaning a liquid material supply hose according to the present embodiment, a liquid material molding injection molding machine M including a material supply apparatus having a liquid material supply hose will be described with reference to FIGS. This will be described with reference to FIG.

図4中、Mは液状材料成形用射出成形機の概略構成であり、機台Mbと、この機台Mb上に設置された射出装置Mi及び型締装置Mcを備える。型締装置Mcは可動型及び固定型から構成する金型51を支持する。一方、射出装置Miは射出シリンダ52を備え、この射出シリンダ52の前端には射出ノズル53(図5)を有するとともに、射出シリンダ52の後部には材料供給装置60を接続する。また、射出シリンダ52には、図5に示すスクリュ54を内蔵するとともに、射出シリンダ52の後端側にはスクリュ駆動部55を配設する。スクリュ駆動部55は、少なくとも、回転駆動機構によりスクリュ54を回転させて成形材料Rに対する計量を行うとともに、進退駆動機構によりスクリュ3を前進させて成形材料Rを射出ノズル53から射出する機能を備える。さらに、機台Mb上にはディスプレイ56を配設する。このディスプレイ56は、タッチパネル式により各種設定を行うことができる設定部を兼ねている。   In FIG. 4, M is a schematic configuration of an injection molding machine for molding a liquid material, and includes a machine base Mb, an injection device Mi and a mold clamping device Mc installed on the machine base Mb. The mold clamping device Mc supports a mold 51 composed of a movable mold and a fixed mold. On the other hand, the injection device Mi includes an injection cylinder 52. The injection cylinder 52 has an injection nozzle 53 (FIG. 5) at the front end thereof, and a material supply device 60 is connected to the rear portion of the injection cylinder 52. Further, the injection cylinder 52 incorporates a screw 54 shown in FIG. 5, and a screw driving portion 55 is disposed on the rear end side of the injection cylinder 52. The screw drive unit 55 has at least a function of rotating the screw 54 by a rotational drive mechanism to measure the molding material R, and advancing the screw 3 by an advance / retreat drive mechanism to inject the molding material R from the injection nozzle 53. . Further, a display 56 is disposed on the machine base Mb. The display 56 also serves as a setting unit capable of performing various settings by a touch panel type.

他方、材料供給装置60は、材料供給部60sと材料貯留部60tを備え、材料貯留部60tは材料供給ライン60hを介して材料供給部60sに接続する。図5に、材料供給部60s及び材料貯留部60tの系統構成を示す。材料供給部60sは、液状樹脂材料(主剤)Aを供給する供給シリンダ61aと液状硬化剤Bを供給する供給シリンダ61bを備える。各供給シリンダ61a,61bは、内外に貫通する吐出プランジャ62a,62bをそれぞれ備え、各吐出プランジャ62a,62bの外端は連結プレート63に結合する。この連結プレート63には吐出シリンダ(エアシリンダ)64のラム64rを結合する。また、各供給シリンダ61a,61bはそれぞれ吐出口と給入口を備え、各吐出口にはそれぞれ吐出ストップ弁66a,66bを接続するとともに、各吐出ストップ弁66a,66bはそれぞれ液状材料供給用ホースHc,Hdを介して合流部67に接続する。そして、合流部67は供給圧センサ68と材料シャット弁69の直列回路を介して射出シリンダ52の後部に設けた材料供給口52iに接続する。さらに、材料貯留部60tは、主剤Aを貯留する貯留タンク70aと液状硬化剤Bを貯留する貯留タンク70bを備える。各貯留タンク70a,70bには、それぞれ送出ポンプ71a,71bを付設し、各送出ポンプ71a,71bはそれぞれ液状材料供給用ホースHa,Hbを介して給入ストップ弁72a,72bに接続するとともに、各給入ストップ弁72a,72bはそれぞれ供給シリンダ61a,61bの給入口に接続する。したがって、送出ポンプ71a,71bと給入ストップ弁72a,72bを接続する液状材料供給用ホースHa,Hbは、上述した材料供給ライン60hを構成する。   On the other hand, the material supply device 60 includes a material supply unit 60s and a material storage unit 60t, and the material storage unit 60t is connected to the material supply unit 60s via a material supply line 60h. FIG. 5 shows a system configuration of the material supply unit 60s and the material storage unit 60t. The material supply unit 60s includes a supply cylinder 61a for supplying the liquid resin material (main agent) A and a supply cylinder 61b for supplying the liquid curing agent B. The supply cylinders 61a and 61b are respectively provided with discharge plungers 62a and 62b penetrating inward and outward, and the outer ends of the discharge plungers 62a and 62b are coupled to the connecting plate 63. A ram 64r of a discharge cylinder (air cylinder) 64 is coupled to the connecting plate 63. The supply cylinders 61a and 61b are each provided with a discharge port and a supply port, and discharge discharge valves 66a and 66b are connected to the discharge ports, respectively. The discharge stop valves 66a and 66b are respectively connected to the liquid material supply hose Hc. , Hd to connect to the junction 67. The junction 67 is connected to a material supply port 52 i provided at the rear of the injection cylinder 52 via a series circuit of a supply pressure sensor 68 and a material shut valve 69. Furthermore, the material storage unit 60t includes a storage tank 70a for storing the main agent A and a storage tank 70b for storing the liquid curing agent B. The storage tanks 70a and 70b are respectively provided with delivery pumps 71a and 71b, and the delivery pumps 71a and 71b are connected to the supply stop valves 72a and 72b via the liquid material supply hoses Ha and Hb, respectively. Each feed stop valve 72a, 72b is connected to a feed inlet of the supply cylinder 61a, 61b, respectively. Therefore, the liquid material supply hoses Ha and Hb connecting the delivery pumps 71a and 71b and the supply stop valves 72a and 72b constitute the material supply line 60h described above.

このような構成(系統)により、主剤Aは貯留タンク70aから送出ポンプ71aにより液状材料供給用ホースHaを介して供給シリンダ61aに送られるとともに、液状硬化剤Bは貯留タンク70bから送出ポンプ71bにより液状材料供給用ホースHbを介して供給シリンダ61bに送られる。また、供給シリンダ61aの主剤A及び供給シリンダ61bの液状硬化剤Bは、吐出シリンダ64によりそれぞれ液状材料供給用ホースHc,Hdを介して合流部67に送られる。したがって、主剤Aと液状硬化剤Bは、合流部67により合流し、射出シリンダ52の供給口52iから成形材料Rとして射出シリンダ52の内部に供給される。射出シリンダ52の内部ではスクリュ54の回転により成形材料Rが混合計量されるとともに、スクリュ54の前進により成形材料Rが射出ノズル53から射出される。   With such a configuration (system), the main agent A is sent from the storage tank 70a by the delivery pump 71a to the supply cylinder 61a via the liquid material supply hose Ha, and the liquid curing agent B is sent from the storage tank 70b by the delivery pump 71b. It is sent to the supply cylinder 61b through the liquid material supply hose Hb. Further, the main agent A of the supply cylinder 61a and the liquid curing agent B of the supply cylinder 61b are sent to the junction 67 by the discharge cylinder 64 via the liquid material supply hoses Hc and Hd, respectively. Therefore, the main agent A and the liquid curing agent B join together at the joining portion 67 and are supplied into the injection cylinder 52 as the molding material R from the supply port 52 i of the injection cylinder 52. Inside the injection cylinder 52, the molding material R is mixed and measured by the rotation of the screw 54, and the molding material R is injected from the injection nozzle 53 by the advancement of the screw 54.

次に、本実施形態に係る液状材料供給用ホースの洗浄装置1の構成について、図2,図3及び図6を参照して説明する。   Next, the configuration of the liquid material supply hose cleaning apparatus 1 according to the present embodiment will be described with reference to FIGS. 2, 3, and 6.

図3は洗浄装置1の外観構成を示す。洗浄装置1は台車11を備え、この台車11の底面には複数のキャスタ(車輪)12…を有するとともに、台車11の後端には上方に突出したハンドル13を有する。台車11の上面には、前側から、第一圧送ポンプ6f,第二圧送ポンプ6s,バルブ等を収容した溶剤回路ボックス14,電気系の回路を収容した制御回路ボックス15,溶剤タンク16を配設し、全体がハウジング17により覆われる。また、ハウジング17の側面には、操作パネル18及び接続パネル19を有し、この接続パネル19には、吐出用接続口4e,戻し用接続口4r,高圧エア接続口20を配設する。さらに、ハウジング17の上面には、溶剤タンク16に洗浄用溶剤Lcを収容する収容口部21を設けるとともに、ハウジング17の側面下部には、溶剤タンク16から洗浄用溶剤Lcを排出させるドレン口部22を設ける。   FIG. 3 shows an external configuration of the cleaning apparatus 1. The cleaning device 1 includes a carriage 11. The carriage 11 has a plurality of casters (wheels) 12 on the bottom surface of the carriage 11, and a handle 13 protruding upward at the rear end of the carriage 11. On the upper surface of the carriage 11, a first pressure pump 6f, a second pressure pump 6s, a solvent circuit box 14 containing valves, a control circuit box 15 containing electric circuits, and a solvent tank 16 are arranged from the front side. The whole is covered by the housing 17. In addition, an operation panel 18 and a connection panel 19 are provided on the side surface of the housing 17, and a discharge connection port 4 e, a return connection port 4 r, and a high-pressure air connection port 20 are disposed on the connection panel 19. Further, a storage port portion 21 for storing the cleaning solvent Lc in the solvent tank 16 is provided on the upper surface of the housing 17, and a drain port portion for discharging the cleaning solvent Lc from the solvent tank 16 at the lower side of the housing 17. 22 is provided.

図2は洗浄装置1の回路構成を示す。なお、図2において、図3と同一部分には同一符号を付してその構成を明確にした。図2中、16は洗浄用溶剤Lcを収容した溶剤タンクであり、溶剤タンク16は天面から開閉コック31を介して戻し用接続口4rに接続する。また、第一圧送ポンプ6fと第二圧送ポンプ6sを備え、第一圧送ポンプ6fと第二圧送ポンプ6sの吸入側はそれぞれ溶剤タンク16の底面に接続するとともに、第一圧送ポンプ6fと第一圧送ポンプ6sの吐出側はポンプ切換バルブ32における一対の流入ポートにそれぞれ接続する。さらに、ポンプ切換バルブ32の流出ポートは圧力エア供給バルブ33を介して吐出用接続口4eに接続する。一方、22はドレン口部であり、開閉コック35を介して溶剤タンク16の下部に接続する。なお、36はドレン受を示すとともに、37は外部の高圧エア供給装置であり、高圧エア接続口20に接続する。他方、34はシーケンス制御部であり、ポンプ切換バルブ32と圧力エア供給バルブ33はシーケンス制御部34によりそれぞれ切換制御される。また、6fmは第一圧送ポンプ6fのポンプモータ、6smは第二圧送ポンプ6sのポンプモータであり、各ポンプモータ6fm,6smは、シーケンス制御部34により制御(ON/OFF制御)される。   FIG. 2 shows a circuit configuration of the cleaning apparatus 1. In FIG. 2, the same parts as those in FIG. In FIG. 2, reference numeral 16 denotes a solvent tank that contains the cleaning solvent Lc, and the solvent tank 16 is connected to the return connection port 4 r through the open / close cock 31 from the top surface. Further, a first pressure-feed pump 6f and a second pressure-feed pump 6s are provided. The suction sides of the first pressure-feed pump 6f and the second pressure-feed pump 6s are connected to the bottom surface of the solvent tank 16, respectively. The discharge side of the pressure feed pump 6s is connected to a pair of inflow ports in the pump switching valve 32, respectively. Further, the outlet port of the pump switching valve 32 is connected to the discharge connection port 4e via the pressure air supply valve 33. On the other hand, a drain port 22 is connected to the lower part of the solvent tank 16 through an opening / closing cock 35. Reference numeral 36 denotes a drain receiver, and 37 is an external high-pressure air supply device which is connected to the high-pressure air connection port 20. On the other hand, 34 is a sequence control unit, and the pump switching valve 32 and the pressure air supply valve 33 are switched and controlled by the sequence control unit 34, respectively. Reference numeral 6fm denotes a pump motor of the first pressure-feed pump 6f, and 6sm denotes a pump motor of the second pressure-feed pump 6s. The pump motors 6fm and 6sm are controlled (ON / OFF control) by the sequence control unit 34.

以上の構成において、第一圧送ポンプ6fは、後述する粗洗浄工程Sfにおいて、第一圧力P1により洗浄用溶剤Lcを第一洗浄時間T1(例えば、30〔秒〕程度)にわたり循環させる機能を備える。第一圧力P1は、液状材料供給用ホース(被洗浄ホース)Ha…に対して洗浄用溶剤Lcを上記第一洗浄時間T1にわたり循環させた際に、図6(a)に示すような所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成することができる圧力を設定する。このような所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成することにより、この後に行う第二圧力P2による本洗浄を効率的に行うことができる。本実施形態では定格出力として、1〔MPa〕程度の高圧出力が可能な第一圧送ポンプ6fを選定した。一方、第二圧送ポンプ6sは、後述する本洗浄工程Smにおいて、第二圧力P2により洗浄用溶剤Lcを第二洗浄時間T2(例えば、10〔分〕程度)にわたり循環させる機能を備える。第二圧力P2は、第一圧力P1の1/10以下の大きさに選定する。本実施形態では定格出力として、0.05〔MPa〕程度の低圧出力が可能な第二圧送ポンプ6sを選定した。   In the above configuration, the first pump 6f has a function of circulating the cleaning solvent Lc over the first cleaning time T1 (for example, about 30 [seconds]) by the first pressure P1 in the later-described rough cleaning step Sf. . The first pressure P1 is a predetermined flow rate as shown in FIG. 6A when the cleaning solvent Lc is circulated through the liquid material supply hose (cleaning hose) Ha... Over the first cleaning time T1. The pressure at which the flow path Wf through which the cleaning solvent Lc flows can be formed is set. By forming the flow passage Wf through which the cleaning solvent Lc having a predetermined flow rate or higher flows, the main cleaning with the second pressure P2 performed thereafter can be performed efficiently. In the present embodiment, the first pump 6f that can output a high pressure of about 1 [MPa] is selected as the rated output. On the other hand, the second pump 6s has a function of circulating the cleaning solvent Lc over the second cleaning time T2 (for example, about 10 minutes) by the second pressure P2 in the main cleaning step Sm described later. The second pressure P2 is selected to be 1/10 or less of the first pressure P1. In the present embodiment, the second pump 6s that can output a low pressure of about 0.05 [MPa] is selected as the rated output.

このような構成により、洗浄装置1には、被洗浄ホースHa…に対して所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成可能な第一圧力P1により洗浄用溶剤Lcを第一洗浄時間T1にわたり循環させる第一洗浄手段2と、被洗浄ホースHa…に対して第一圧力P1よりも低圧となる第二圧力P2により洗浄用溶剤Lcを第二洗浄時間T2にわたり循環させる第二洗浄手段3が含まれる。以上の実施形態では、第一洗浄手段2に、第一圧力P1により洗浄用溶剤Lcを循環させる第一圧送ポンプ6fを設けるとともに、第二洗浄手段3に、第二圧力P2により洗浄用溶剤Lcを循環させる、第一圧送ポンプ6fよりも定格出力の小さい第二圧送ポンプ6sを設けるため、廉価な圧送ポンプの組合わせにより構成することができ、全体のコスト面における有利性を高めることができる。   With such a configuration, the cleaning apparatus 1 is supplied with the cleaning solvent Lc by the first pressure P1 capable of forming the flow passage Wf through which the cleaning solvent Lc having a predetermined flow rate or more flows with respect to the hose Ha to be cleaned. A second cleaning medium Lc is circulated over the second cleaning time T2 by the first cleaning means 2 circulated over the cleaning time T1 and the second pressure P2 which is lower than the first pressure P1 with respect to the hose Ha to be cleaned. A cleaning means 3 is included. In the above embodiment, the first cleaning means 2 is provided with the first pressure feed pump 6f that circulates the cleaning solvent Lc with the first pressure P1, and the second cleaning means 3 is provided with the cleaning solvent Lc with the second pressure P2. Since the second pumping pump 6s having a smaller rated output than the first pumping pump 6f is provided, it can be constituted by a combination of inexpensive pumping pumps, and the overall cost advantage can be increased. .

次に、本実施形態に係る洗浄装置1を用いた液状材料供給用ホースの洗浄方法について、図2〜図6を参照しつつ図1に示す工程図(フローチャート)に従って説明する。   Next, a method for cleaning the liquid material supply hose using the cleaning apparatus 1 according to the present embodiment will be described with reference to FIGS.

まず、洗浄装置1の収容口部21から溶剤タンク16に洗浄用溶剤Lcを収容する(ステップS1)。また、液状材料成形用射出成形機Mに備える材料供給装置60から四本の液状材料供給用ホースHa,Hb,Hc及びHdを取外す(ステップS2)。そして、取外した液状材料供給用ホース(被洗浄ホース)Ha,Hb,Hc及びHdは、図2に示すように順次連結(直列接続)して一本にするとともに、その両端を洗浄装置1の接続パネル19に配した吐出用接続口4eと戻し用接続口4rにそれぞれ接続する(ステップS3)。なお、被洗浄ホースHa,Hb,Hc及びHd同士は、そのまま接続できる場合はそのまま接続すればよいし、そのままでは接続できない場合には必要な継手(ジョイント)を介して接続すればよい。このように、洗浄装置1に、液状材料成形用射出成形機Mに液状の成形材料Rを供給する材料供給装置60に使用した被洗浄ホースHa…の一端が接続可能であって、洗浄用溶剤Lcを吐出する吐出用接続口4e…と、当該被洗浄ホースHa…の他端が接続可能であって、当該被洗浄ホースHa…を流通した洗浄用溶剤Lcが戻される戻し用接続口4r…を設ければ、被洗浄ホースHa…をそのまま接続して容易に洗浄することができるとともに、各接続口4e…,4r…にアタッチメント等を付ければ、様々なサイズ及び形式の被洗浄ホースHa…の洗浄を行うことが可能となり、汎用性及び発展性に優れる。   First, the cleaning solvent Lc is stored in the solvent tank 16 from the storage port 21 of the cleaning device 1 (step S1). Further, the four liquid material supply hoses Ha, Hb, Hc and Hd are removed from the material supply device 60 provided in the liquid material molding injection molding machine M (step S2). The removed liquid material supply hoses (hose to be cleaned) Ha, Hb, Hc and Hd are sequentially connected (in series connection) as shown in FIG. The discharge connection port 4e and the return connection port 4r arranged on the connection panel 19 are respectively connected (step S3). In addition, the to-be-cleaned hoses Ha, Hb, Hc, and Hd may be connected as they are if they can be connected as they are, and may be connected via a necessary joint (joint) if they cannot be connected as they are. Thus, one end of the to-be-cleaned hose Ha ... used for the material supply device 60 for supplying the liquid molding material R to the liquid material molding injection molding machine M can be connected to the cleaning device 1, and the cleaning solvent The discharge connection port 4e for discharging Lc and the other end of the to-be-cleaned hose Ha can be connected, and the return connection port 4r to which the cleaning solvent Lc flowing through the to-be-cleaned hose Ha is returned. If the hose Ha to be cleaned is connected as it is, it can be easily cleaned, and if the attachment ports are attached to the connection ports 4e, 4r, etc., the hoses Ha to be cleaned of various sizes and types are provided. It is possible to perform the cleaning, and is excellent in versatility and developability.

次いで、操作パネル18を操作して洗浄装置1の運転を開始する。これにより、シーケンス制御部34によるシーケンス制御が行われ、洗浄処理が進行する。最初に、粗洗浄工程Sfが行われる。粗洗浄工程Sfでは、ポンプ切換バルブ32がニュートラルポジションから第一圧送ポンプ6f側に切換えられ、かつ第一圧送ポンプ6fの運転が行われる(ステップS4,S5)。第一圧送ポンプ6fの運転により、溶剤タンク16内の洗浄用溶剤Lcは、第一圧送ポンプ6f,ポンプ切換バルブ32,圧力エア供給バルブ33を介して吐出用接続口4eから吐出する。そして、吐出した洗浄用溶剤Lcは、被洗浄ホースHd,Hc,Hb及びHaの内部を流通した後、戻し用接続口4rに至り、この戻し用接続口4rから開閉コック31を介して溶剤タンク16内に戻される粗洗浄工程Sfが行われる。粗洗浄工程Sfでは、第一圧力P1(1〔MPa〕)の高圧により洗浄用溶剤Lcが第一洗浄時間T1(30〔秒〕)にわたり高速で循環する(ステップS6)。これにより、被洗浄ホースHa…には、図6(a)に示すような所定流量以上の洗浄用溶剤Lcが流通可能な流通路Wfが形成される。また、第一圧送ポンプ6fの運転開始後、第一洗浄時間T1が経過したなら第一圧送ポンプ6fの運転を停止し、ポンプ切換バルブ32をニュートラルポジションに切換える(ステップS7)。これにより、粗洗浄工程Sfが終了する。   Next, the operation panel 18 is operated to start the operation of the cleaning device 1. Thereby, the sequence control by the sequence control unit 34 is performed, and the cleaning process proceeds. First, the rough cleaning process Sf is performed. In the rough cleaning step Sf, the pump switching valve 32 is switched from the neutral position to the first pressure feed pump 6f side, and the first pressure feed pump 6f is operated (steps S4 and S5). By the operation of the first pressure pump 6f, the cleaning solvent Lc in the solvent tank 16 is discharged from the discharge connection port 4e via the first pressure pump 6f, the pump switching valve 32, and the pressure air supply valve 33. The discharged cleaning solvent Lc flows through the inside of the hoses Hd, Hc, Hb, and Ha to be cleaned, and then reaches the return connection port 4r. The solvent tank is connected to the return connection port 4r through the open / close cock 31. The rough cleaning process Sf returned to 16 is performed. In the rough cleaning step Sf, the cleaning solvent Lc circulates at a high speed over the first cleaning time T1 (30 [seconds]) due to the high pressure of the first pressure P1 (1 [MPa]) (step S6). As a result, the flow path Wf through which the cleaning solvent Lc having a predetermined flow rate or more as shown in FIG. If the first cleaning time T1 has elapsed after the start of the operation of the first pump 6f, the operation of the first pump 6f is stopped and the pump switching valve 32 is switched to the neutral position (step S7). Thereby, the rough cleaning step Sf ends.

粗洗浄工程Sfの終了により、本洗浄工程Smが行われる。本洗浄工程Smでは、ポンプ切換バルブ32がニュートラルポジションから第二圧送ポンプ6s側に切換えられ、かつ第二圧送ポンプ6sの運転が行われる(ステップS8,S9)。第二圧送ポンプ6sの運転により、溶剤タンク16内の洗浄用溶剤Lcは、第二圧送ポンプ6s,ポンプ切換バルブ32,圧力エア供給バルブ33を介して吐出用接続口4eから吐出する。そして、吐出した洗浄用溶剤Lcは、被洗浄ホースHd,Hc,Hb及びHaの内部を流通した後、戻し用接続口4rに至り、この戻し用接続口4rから開閉コック31を介して溶剤タンク16内に戻される本洗浄工程Smが行われる。本洗浄工程Smでは、第二圧力P2(0.05〔MPa〕)の低圧により洗浄用溶剤Lcが第二洗浄時間T2(10〔分〕)にわたり低速で循環する(ステップS10)。この場合、第二洗浄時間T2は、前述した第一洗浄時間T1よりも長い時間を設定する。これにより、図6(b)に示すように、被洗浄ホースHa…の内壁に付着した汚れD…が効率的に除去される。図6(b)において、Wは洗浄途中における流通路を示す。このように、本洗浄工程Smにおいて、第二洗浄時間T2を、第一洗浄時間T1よりも長い時間に設定し、第二圧力P2を、第一圧力P1に対して1/10以下の大きさに設定すれば、洗浄用溶剤Lcは、相対的に時間の長い第二洗浄時間T2の間、低圧低速となる第二圧力P2により循環するため、十分な洗浄(汚れ落とし)を行うことができる。また、第二圧送ポンプ6sの運転開始後、第二洗浄時間T2が経過したなら第二圧送ポンプ6sの運転を停止し、ポンプ切換バルブ32をニュートラルポジションに切換える(ステップS11)。これにより、本洗浄工程が終了する。   The main cleaning step Sm is performed by the end of the rough cleaning step Sf. In the main cleaning step Sm, the pump switching valve 32 is switched from the neutral position to the second pumping pump 6s side, and the second pumping pump 6s is operated (steps S8 and S9). By the operation of the second pressure pump 6s, the cleaning solvent Lc in the solvent tank 16 is discharged from the discharge connection port 4e via the second pressure pump 6s, the pump switching valve 32, and the pressure air supply valve 33. The discharged cleaning solvent Lc flows through the inside of the hoses Hd, Hc, Hb, and Ha to be cleaned, and then reaches the return connection port 4r. The solvent tank is connected to the return connection port 4r through the open / close cock 31. The main cleaning step Sm returned to the inside 16 is performed. In the main cleaning step Sm, the cleaning solvent Lc circulates at a low speed over the second cleaning time T2 (10 [min]) due to the low pressure of the second pressure P2 (0.05 [MPa]) (step S10). In this case, the second cleaning time T2 is set to be longer than the first cleaning time T1 described above. As a result, as shown in FIG. 6B, the dirt D attached to the inner wall of the hose Ha to be cleaned is efficiently removed. In FIG. 6B, W indicates a flow path in the middle of cleaning. Thus, in the main cleaning step Sm, the second cleaning time T2 is set to a time longer than the first cleaning time T1, and the second pressure P2 is 1/10 or less of the first pressure P1. In this case, the cleaning solvent Lc is circulated by the second pressure P2 at a low pressure and a low speed during the relatively long second cleaning time T2, so that sufficient cleaning (dirt removal) can be performed. . If the second cleaning time T2 has elapsed after the operation of the second pump 6s has started, the operation of the second pump 6s is stopped and the pump switching valve 32 is switched to the neutral position (step S11). Thereby, this cleaning process is completed.

この後、圧力エア供給バルブ33を、高圧エア接続口20側に、予め設定した所定時間(10〔秒〕程度)だけ切換える。これにより、高圧エア接続口20に接続された高圧エア供給装置37から圧力エアAが供給され、この圧力エアAは、高圧エア接続口20,圧力エア供給バルブ33を介して吐出用接続口4eに至り、この吐出用接続口4eから被洗浄ホースHd,Hc,Hb及びHaの内部に吐出するエアパージ処理が行われる(ステップS12)。このように、洗浄用溶剤Lcによる洗浄後、被洗浄ホースHa…に対して圧力エアAを所定時間循環させるエアパージ処理を行うようにすれば、残留する洗浄用溶剤Lcを被洗浄ホースHa…から効率的に除去することができる。   Thereafter, the pressure air supply valve 33 is switched to the high pressure air connection port 20 side for a predetermined time (about 10 seconds) set in advance. As a result, pressure air A is supplied from the high pressure air supply device 37 connected to the high pressure air connection port 20, and this pressure air A is connected to the discharge connection port 4 e via the high pressure air connection port 20 and the pressure air supply valve 33. Thus, an air purge process is performed to discharge from the discharge connection port 4e into the cleaned hoses Hd, Hc, Hb and Ha (step S12). As described above, after the cleaning with the cleaning solvent Lc, if the air purge process is performed to circulate the pressure air A for a predetermined time with respect to the hose Ha to be cleaned, the remaining cleaning solvent Lc is removed from the hose Ha to be cleaned. It can be removed efficiently.

エアパージ処理が終了したなら、被洗浄ホースHa…を洗浄装置1の吐出用接続口4eと戻し用接続口4rから取外す(ステップS13)。そして、被洗浄ホースHa…の外表面を拭き洗浄するなどの必要な後処理を行った後、被洗浄ホースHa…を液状材料成形用射出成形機Mに備える材料供給装置60に接続する(ステップS14,S15)。一方、洗浄装置1の溶剤タンク16に収容された使用済の洗浄用溶剤Lcは、ドレン口部22から排出し、ドレン受36により回収する(ステップS16)。以上により、被洗浄ホース(液状材料供給用ホース)Ha…に対する一連の洗浄処理が終了する。   When the air purge process is completed, the hose Ha to be cleaned is removed from the discharge connection port 4e and the return connection port 4r of the cleaning device 1 (step S13). Then, after performing necessary post-processing such as wiping and cleaning the outer surface of the hose Ha to be cleaned, the hose Ha to be cleaned is connected to the material supply device 60 provided in the injection molding machine M for molding liquid material (step) S14, S15). On the other hand, the used cleaning solvent Lc stored in the solvent tank 16 of the cleaning device 1 is discharged from the drain port 22 and collected by the drain receiver 36 (step S16). Thus, a series of cleaning processes for the to-be-cleaned hose (liquid material supply hose) Ha.

よって、このような本実施形態に係る液状材料供給用ホースの洗浄方法(洗浄装置1)によれば、被洗浄ホースHa…に対して所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを形成可能な第一圧力P1により洗浄用溶剤Lcを第一洗浄時間T1にわたり循環させて粗洗浄を行う粗洗浄工程Sfと、この粗洗浄工程Sfが終了した被洗浄ホースHa…に対して第一圧力P1よりも低圧となる第二圧力P2により洗浄用溶剤Lcを第二洗浄時間T2にわたり循環させて本洗浄を行う本洗浄工程Smとを経るようにしたため、一台の洗浄装置1を多数の材料供給装置60…に共用できるとともに、被洗浄ホースHa…を有効に再生することができ、大幅なコスト削減、更には資源節減を実現できる。また、粗洗浄工程Sfと本洗浄工程Smを有するため、予め粗洗浄工程Sfにより所定流量以上の洗浄用溶剤Lcが流通する流通路Wfを確保することにより、本洗浄工程Smにおいて効率的な洗浄を行うことができるという相乗効果を得ることができる。即ち、一般に洗浄用溶剤Lcは汚れD…を溶かして洗浄するため、高圧高速となる第一圧力P1により洗浄用溶剤Lcを循環させる粗洗浄工程Sfは、所定の流通路Wfを形成する能力は高くなるが、汚れD…に対する洗浄能力は低くなる。他方、低圧低速となる第二圧力P2により洗浄用溶剤Lcを循環させる本洗浄工程Smは、所定の流通路Wfを形成する能力は低くなるが、汚れD…に対する洗浄能力は高くなる。したがって、粗洗浄工程Sfと本洗浄工程Smの組合わせにより効率的な洗浄(汚れ落とし)が可能となり、特に、汚れD…の粘度が高い場合や被洗浄ホースHa…が長い場合に有益となる。さらに、本実施形態では、被洗浄ホースHa…として、液状材料成形用射出成形機Mに液状の成形材料Rを供給する材料供給装置60に使用した液状材料供給用ホースを適用すれば、液状材料成形用射出成形機Mを使用する生産工場等におけるコスト削減及び資源節減に寄与できる。   Therefore, according to the cleaning method (cleaning apparatus 1) of the liquid material supply hose according to the present embodiment, the flow path Wf through which the cleaning solvent Lc of a predetermined flow rate or more flows to the hose Ha to be cleaned. A rough cleaning step Sf in which the cleaning solvent Lc is circulated for a first cleaning time T1 with a first pressure P1 that can be formed to perform rough cleaning, and the hose Ha to be cleaned that has undergone the rough cleaning step Sf is first. Since the cleaning solvent Lc is circulated over the second cleaning time T2 by the second pressure P2 which is lower than the pressure P1, the main cleaning process Sm for performing the main cleaning is performed. The material supply devices 60 can be shared, and the to-be-cleaned hoses Ha can be effectively regenerated, so that significant cost reduction and further resource saving can be realized. In addition, since the rough cleaning step Sf and the main cleaning step Sm are provided, efficient cleaning is performed in the main cleaning step Sm by securing the flow path Wf through which the cleaning solvent Lc having a predetermined flow rate or more flows in advance in the rough cleaning step Sf. A synergistic effect can be obtained. That is, since the cleaning solvent Lc is generally cleaned by dissolving the dirt D ..., the rough cleaning step Sf in which the cleaning solvent Lc is circulated by the first pressure P1 at a high pressure and high speed has the ability to form a predetermined flow path Wf. Although it becomes high, the cleaning ability with respect to dirt D ... becomes low. On the other hand, in the main cleaning step Sm in which the cleaning solvent Lc is circulated by the second pressure P2 at a low pressure and a low speed, the ability to form the predetermined flow path Wf is lowered, but the ability to clean the dirt D is increased. Therefore, the combination of the rough cleaning step Sf and the main cleaning step Sm enables efficient cleaning (dirt removal), and is particularly beneficial when the dirt D ... has a high viscosity or the hose Ha to be cleaned is long. . Furthermore, in this embodiment, if the liquid material supply hose used in the material supply device 60 for supplying the liquid molding material R to the liquid material molding injection molding machine M is applied as the to-be-cleaned hose Ha ... This can contribute to cost reduction and resource saving in production factories using the injection molding machine M.

次に、本発明の変更実施形態に係る液状材料供給用ホースの洗浄装置1について、図7及び図8を参照して説明する。   Next, a cleaning apparatus 1 for a liquid material supply hose according to a modified embodiment of the present invention will be described with reference to FIGS.

図7に示す変更実施形態は、出力を変更可能な一台の圧送ポンプ6を備え、当該圧送ポンプ6の出力を変更することにより、第一圧力P1により洗浄用溶剤Lcを循環させる第一洗浄手段2又は第二圧力P2により洗浄用溶剤Lcを循環させる第二洗浄手段3に切換えるように構成したものである。図2に示した基本実施形態では、定格出力の異なる二台の圧送ポンプ6f,6sを使用したが、図7に示す変更実施形態は、一台の圧送ポンプ6により、二台の圧送ポンプ6f,6sの定格出力に対応する出力を切換出力できるようにしたものである。したがって、図7に示す変更実施形態の場合には、一台の圧送ポンプで足りるため、全体のサイズ面における有利性を高めることができる。   The modified embodiment shown in FIG. 7 includes a single pumping pump 6 whose output can be changed, and the first cleaning in which the cleaning solvent Lc is circulated by the first pressure P1 by changing the output of the pumping pump 6. It is configured to switch to the second cleaning means 3 for circulating the cleaning solvent Lc by means 2 or the second pressure P2. In the basic embodiment shown in FIG. 2, two pumping pumps 6f and 6s having different rated outputs are used. However, the modified embodiment shown in FIG. 7 uses two pumping pumps 6f by one pumping pump 6. The output corresponding to the rated output of 6 s can be switched and output. Therefore, in the case of the modified embodiment shown in FIG. 7, since one pumping pump is sufficient, the advantage in the overall size can be increased.

図8に示す変更実施形態は、図2に示した基本実施形態の回路構成をいわば手動タイプに置換するとともに、三方向切換バルブの使用を排して、より低コスト化を図ったものである。このため、二台の圧送ポンプ6f,6sの切換は、開閉コック41f,41sを切換えて行うとともに、圧力エアAの供給は、開閉コック43f,43sを切換えて行う。また、図2に示した吐出用接続口4e,戻し用接続口4r及び開閉コック31は、第一圧送ポンプ6fの回路系と第二圧送ポンプ6sの回路系に分け、第一圧送ポンプ6fの回路系には、吐出用接続口4ef,戻し用接続口4rf及び開閉コック31fを設けるとともに、第二圧送ポンプ6sの回路系には、吐出用接続口4es,戻し用接続口4rs及び開閉コック31sを設けた。したがって、粗洗浄工程Sfでは、吐出用接続口4efと戻し用接続口4rf間に被洗浄ホースHa…を接続するとともに、本洗浄工程Smでは吐出用接続口4esと戻し用接続口4rs間に被洗浄ホースHa…を接続変更する。なお、42f,42sは三方継手を示す。   The modified embodiment shown in FIG. 8 replaces the circuit configuration of the basic embodiment shown in FIG. 2 with a so-called manual type, and eliminates the use of a three-way switching valve, thereby further reducing the cost. . For this reason, the two pumps 6f and 6s are switched by switching the open / close cocks 41f and 41s, and the supply of the pressure air A is performed by switching the open / close cocks 43f and 43s. Further, the discharge connection port 4e, the return connection port 4r, and the open / close cock 31 shown in FIG. 2 are divided into a circuit system of the first pressure feed pump 6f and a circuit system of the second pressure feed pump 6s. The circuit system is provided with a discharge connection port 4ef, a return connection port 4rf, and an open / close cock 31f, and the circuit system of the second pumping pump 6s has a discharge connection port 4es, a return connection port 4rs, and an open / close cock 31s. Was provided. Therefore, in the rough cleaning step Sf, the hose Ha to be cleaned is connected between the discharge connection port 4ef and the return connection port 4rf, and in the main cleaning step Sm, the target port is connected between the discharge connection port 4es and the return connection port 4rs. Change connection of cleaning hose Ha. Reference numerals 42f and 42s denote three-way joints.

図7及び図8に示した変更実施形態の場合であっても、基本的な動作(機能)、即ち、洗浄手順や洗浄条件は、図1〜図6に示した基本実施形態と同様に実施できる。なお、図7及び図8において、図1〜図6と同一部分には同一符号を付して、その構成を明確にするとともに、その詳細な説明は省略する。   Even in the case of the modified embodiment shown in FIGS. 7 and 8, the basic operation (function), that is, the cleaning procedure and the cleaning conditions are the same as those of the basic embodiment shown in FIGS. it can. 7 and 8, the same parts as those in FIGS. 1 to 6 are denoted by the same reference numerals to clarify the configuration, and detailed description thereof is omitted.

以上、最良の実施形態(基本実施形態)及び変更実施形態について詳細に説明したが、本発明は、このような実施形態に限定されるものではなく、細部の構成,形状,素材,数量,数値.手法(手順)等において、本発明の要旨を逸脱しない範囲で、任意に変更,追加,削除することができる。例えば、望ましい形態として、洗浄用溶剤Lcによる洗浄後、被洗浄ホースHa…に対して圧力エアAを所定時間循環させるエアパージ処理を行う場合を例示したが、エアパージ処理を行わない場合を排除するものではない。なお、本発明に係る液状材料供給用ホースの洗浄方法及び装置1は、液状材料成形用射出成形機Mに液状の成形材料Rを供給する材料供給装置60に使用した液状材料供給用ホースを適用して最適であるが、その他、各種材料供給装置に有する液状材料供給用ホースの洗浄にも同様に利用することができる。   As described above, the best embodiment (basic embodiment) and the modified embodiment have been described in detail. However, the present invention is not limited to such an embodiment, and the detailed configuration, shape, material, quantity, and numerical values are not limited thereto. . The method (procedure) can be arbitrarily changed, added, or deleted without departing from the gist of the present invention. For example, as a desirable form, after cleaning with the cleaning solvent Lc, the case where the air purge process for circulating the pressure air A to the cleaned hose Ha... For a predetermined time is illustrated, but the case where the air purge process is not performed is excluded is not. The liquid material supply hose cleaning method and apparatus 1 according to the present invention is applied to the liquid material supply hose used in the material supply device 60 for supplying the liquid molding material R to the liquid material molding injection molding machine M. However, it can also be used for cleaning the liquid material supply hose of various material supply devices.

本発明の最良の実施形態に係る液状材料供給用ホースの洗浄方法の処理手順を示すフローチャート、The flowchart which shows the process sequence of the washing | cleaning method of the hose for liquid material supply which concerns on the best embodiment of this invention, 本発明の最良の実施形態に係る液状材料供給用ホースの洗浄装置の回路構成図、The circuit block diagram of the washing | cleaning apparatus of the hose for liquid material supply which concerns on the best embodiment of this invention, 同洗浄装置の外観構成図、External configuration diagram of the cleaning device, 同洗浄装置により洗浄する液状材料供給用ホースを有する材料供給装置を含む液状材料成形用射出成形機の概略構成図、Schematic configuration diagram of a liquid material molding injection molding machine including a material supply device having a liquid material supply hose to be cleaned by the cleaning device, 同材料供給装置の材料供給部及び材料貯留部の系統構成図、System configuration diagram of material supply unit and material storage unit of the material supply device, 同液状材料供給用ホースの洗浄途中を示す断面図、Sectional drawing which shows the washing | cleaning middle of the liquid material supply hose, 本発明の変更実施形態に係る洗浄装置の一部を示す回路構成図、The circuit block diagram which shows a part of washing | cleaning apparatus which concerns on the modified embodiment of this invention, 本発明の他の変更実施形態に係る洗浄装置を示す回路構成図、The circuit block diagram which shows the washing | cleaning apparatus which concerns on other modified embodiment of this invention,

符号の説明Explanation of symbols

1:洗浄装置,2:第一洗浄手段,3:第二洗浄手段,4e:吐出用接続口,4ef:吐出用接続口,4es:吐出用接続口,4r:戻し用接続口,4rf:戻し用接続口,4rs:戻し用接続口,6:圧送ポンプ,6f:第一圧送ポンプ,6s:第二圧送ポンプ,60:材料供給装置,(S12):エアパージ処理,Ha…:液状材料供給用ホース(被洗浄ホース),D…:汚れ,Lc:洗浄用溶剤,Wf:流通路,P1:第一圧力,P2:第二圧力,T1:第一洗浄時間,T2:第二洗浄時間,Sf:粗洗浄工程,Sm:本洗浄工程,M:液状材料成形用射出成形機,R:成形材料,A:圧力エア   1: cleaning device, 2: first cleaning means, 3: second cleaning means, 4e: discharge connection port, 4ef: discharge connection port, 4es: discharge connection port, 4r: return connection port, 4rf: return Connection port, 4rs: return connection port, 6: pressure feed pump, 6f: first pressure feed pump, 6s: second pressure feed pump, 60: material supply device, (S12): air purge process, Ha ...: for liquid material supply Hose (washed hose), D ...: dirt, Lc: solvent for cleaning, Wf: flow path, P1: first pressure, P2: second pressure, T1: first cleaning time, T2: second cleaning time, Sf : Rough cleaning process, Sm: main cleaning process, M: injection molding machine for molding liquid material, R: molding material, A: pressure air

Claims (7)

液状の成形材料を供給する液状材料供給用ホース(被洗浄ホース)の内壁に付着した汚れを溶かして洗浄する洗浄用溶剤により除去する液状材料供給用ホースの洗浄方法において、前記被洗浄ホースに対して所定流量以上の前記洗浄用溶剤が流通する流通路を形成可能な第一圧力により、第一洗浄時間にわたり前記洗浄用溶剤を循環させて粗洗浄を行う粗洗浄工程と、この粗洗浄工程が終了した前記被洗浄ホースに、前記第一圧力に対して1/10以下の大きさとなる低圧に設定した第二圧力により、前記第一洗浄時間よりも長い時間に設定した第二洗浄時間にわたり前記洗浄用溶剤を循環させて本洗浄を行う本洗浄工程とを経て前記被洗浄ホースの洗浄を行うことを特徴とする液状材料供給用ホースの洗浄方法。   In the method of cleaning a liquid material supply hose, which is removed by a cleaning solvent that dissolves and cleans the dirt adhering to the inner wall of the liquid material supply hose (cleaning hose) for supplying a liquid molding material. A rough cleaning step in which rough cleaning is performed by circulating the cleaning solvent over a first cleaning time with a first pressure capable of forming a flow path through which the cleaning solvent of a predetermined flow rate or more flows. The second hose that has been set to a time longer than the first cleaning time by the second pressure set to a low pressure that is 1/10 or less of the first pressure is applied to the finished hose to be cleaned. A cleaning method for a liquid material supply hose, wherein the cleaning hose is cleaned through a main cleaning step of performing main cleaning by circulating a cleaning solvent. 前記被洗浄ホースは、液状材料成形用射出成形機に前記成形材料を供給する材料供給装置に使用した液状材料供給用ホースであることを特徴とする請求項1記載の液状材料供給用ホースの洗浄方法。   2. The liquid material supply hose according to claim 1, wherein the hose to be cleaned is a liquid material supply hose used in a material supply device for supplying the molding material to an injection molding machine for liquid material molding. Method. 前記洗浄用溶剤による洗浄後、前記被洗浄ホースに対して圧力エアを所定時間循環させるエアパージ処理を行うことを特徴とする請求項1又は2記載の液状材料供給用ホースの洗浄方法。   3. The method for cleaning a liquid material supply hose according to claim 1, wherein after the cleaning with the cleaning solvent, an air purge process is performed in which pressure air is circulated through the hose to be cleaned for a predetermined time. 液状の成形材料を供給する液状材料供給用ホース(被洗浄ホース)の内壁に付着した汚れを溶かして洗浄する洗浄用溶剤により除去する液状材料供給用ホースの洗浄装置において、前記被洗浄ホースに対して所定流量以上の前記洗浄用溶剤が流通する流通路を形成可能な第一圧力により、第一洗浄時間にわたり前記洗浄用溶剤を循環させる第一洗浄手段と、前記被洗浄ホースに、前記第一圧力に対して1/10以下の大きさとなる低圧に設定した第二圧力により、前記第一洗浄時間よりも長い時間に設定した第二洗浄時間にわたり前記洗浄用溶剤を循環させる第二洗浄手段を備えることを特徴とする液状材料供給用ホースの洗浄装置。   In a cleaning apparatus for a liquid material supply hose that dissolves and removes dirt adhering to an inner wall of a liquid material supply hose (cleaning hose) for supplying a liquid molding material, And a first cleaning means for circulating the cleaning solvent over a first cleaning time by a first pressure capable of forming a flow path through which the cleaning solvent of a predetermined flow rate or more flows, and the first hose to be cleaned A second cleaning means for circulating the cleaning solvent over a second cleaning time set to a time longer than the first cleaning time by a second pressure set to a low pressure of 1/10 or less of the pressure. A cleaning device for a liquid material supply hose, comprising: 液状材料成形用射出成形機に前記成形材料を供給する材料供給装置に使用した被洗浄ホースの一端が接続可能であって、前記洗浄用溶剤を吐出する吐出用接続口と、当該被洗浄ホースの他端が接続可能であって、当該被洗浄ホースを流通した前記洗浄用溶剤が戻される戻し用接続口を有することを特徴とする請求項4記載の液状材料供給用ホースの洗浄装置。   One end of a to-be-cleaned hose used in a material supply device that supplies the molding material to a liquid material molding injection molding machine can be connected, and a discharge connection port for discharging the cleaning solvent, 5. The apparatus for cleaning a liquid material supply hose according to claim 4, further comprising a return connection port to which the other end can be connected and to which the cleaning solvent flowing through the hose to be cleaned is returned. 前記第一洗浄手段は、前記第一圧力により洗浄用溶液を循環させる第一圧送ポンプを備えるとともに、前記第二洗浄手段は、前記第二圧力により洗浄用溶液を循環させる、前記第一圧力ポンプよりも定格出力の小さい第二圧送ポンプを備えることを特徴とする請求項4又は5記載の液状材料供給用ホースの洗浄装置。   The first pressure pump includes a first pump that circulates the cleaning solution with the first pressure, and the second cleaning unit circulates the cleaning solution with the second pressure. 6. The apparatus for cleaning a liquid material supply hose according to claim 4 or 5, further comprising a second pumping pump having a smaller rated output than the second pump. 出力を変更可能な一台の圧送ポンプを備え、当該圧送ポンプの出力を変更することにより、前記第一圧力により洗浄用溶液を循環させる前記第一洗浄手段又は前記第二圧力により洗浄用溶液を循環させる前記第二洗浄手段に切換えることを特徴とする請求項4又は5記載の液状材料供給用ホースの洗浄装置。   A single pressure feed pump capable of changing the output is provided, and by changing the output of the pressure feed pump, the washing solution is circulated by the first washing means for circulating the washing solution by the first pressure or the second pressure. 6. The apparatus for cleaning a liquid material supply hose according to claim 4, wherein the second cleaning means is circulated.
JP2008285422A 2008-11-06 2008-11-06 Method and apparatus for cleaning liquid material supply hose Expired - Fee Related JP5085512B2 (en)

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