JP5067060B2 - Cap-type partial cleaning and removal device - Google Patents

Cap-type partial cleaning and removal device Download PDF

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JP5067060B2
JP5067060B2 JP2007199408A JP2007199408A JP5067060B2 JP 5067060 B2 JP5067060 B2 JP 5067060B2 JP 2007199408 A JP2007199408 A JP 2007199408A JP 2007199408 A JP2007199408 A JP 2007199408A JP 5067060 B2 JP5067060 B2 JP 5067060B2
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cap
solvent
substrate
elastic ring
cleaning
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JP2009037776A (en
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祐一 伊藤
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Toppan Inc
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本発明は、有機太陽電池、有機ELディスプレイ等に用いられる有機正孔注入輸送材料、有機発光材料、有機電子輸送材料、電荷発生材料等の溶剤可溶性の有機膜や無機膜または有機無機複合膜からなる機能性膜を基板上に概略一面全体に成膜した後、不必要な膜部分を洗浄除去することによりパターンニングする装置に関するものである。   The present invention relates to a solvent-soluble organic film, an inorganic film, or an organic-inorganic composite film, such as an organic hole injection transport material, an organic light emitting material, an organic electron transport material, and a charge generation material used for an organic solar cell, an organic EL display, and the like. The present invention relates to an apparatus for patterning by forming a functional film to be formed on the entire surface of a substrate and cleaning and removing unnecessary film portions.

近年、高い導電性や発光性を有する高分子からなるキャリア輸送材料、および有機溶媒に可溶な共役系高分子からなる発光材料の開発が盛んに行なわれている。有機EL素子の成膜工程では大面積基板に対しても成膜が容易で、材料使用効率の高いインクジェット法(例えば非特許文献1、2、3、4参照)や凸版印刷法(例えば非特許文献5参照)を用いた発光層の赤、青、緑からなるサブピクセルの塗り分け技術の開発も行なわれている。 これらは、印刷法を用いて発光層を塗り分けることで、製造装置が真空蒸着法よりも低コストで済み、成膜速度も速いために大面積な有機ELカラーディスプレイの実現に有利と考えられる。   In recent years, development of a carrier transport material made of a polymer having high conductivity and light emission and a light-emitting material made of a conjugated polymer soluble in an organic solvent has been actively conducted. In the film formation process of the organic EL element, it is easy to form a film on a large area substrate, and the inkjet method (for example, see Non-Patent Documents 1, 2, 3, and 4) and the letterpress printing method (for example, Non-Patent Document) with high material use efficiency Development of a technique for separately painting sub-pixels made of red, blue, and green of a light emitting layer using a reference 5) is also underway. These are considered to be advantageous for realizing a large-area organic EL color display because the production device can be manufactured at a lower cost than the vacuum vapor deposition method and the film formation speed is high by separately applying the light emitting layer using a printing method. .

また、湿式法有機EL素子においては、正孔注入輸送層としてポリ(3,4−エチレンジオキシチオフェン)とポリスチレンスルホン酸との複合体(以後、PEDOT:PSSと略する)等のポリチオフェン系やポリアニリン系の導電性高分子の水分散液が使われている。それらの正孔注入輸送層をインクジェット法で成膜した場合には生産性に問題があり、樹脂版を用いた凸版印刷法で行なった場合には水性インキにより版が吸水し変形したり、基板上でインクがはじき膜の平滑性に問題が生じ易かった。
また、スリットコート法で基板一面に概略全面塗布する方法で成膜した場合には、凸版印刷法で生じるアニロクスロールのセルのパターンによる膜厚ムラ等も無く膜の均一性が高く、インクジェット法よりも成膜時間は短い利点があった。しかし塗り始めと終わりの膜厚が変動する数cmの範囲の部分、封止ガラス板や封止缶を接着するための接着しろ部、および電極端子を形成する部分上等に成膜された不必要部の膜を除去する必要が生じた。
従来の除去方法では、綿棒や布テープ等に溶剤を付けて拭き取る拭き取り法、レーザーアブレーション法、酸素プラズマ洗浄法、紫外線オゾン洗浄法等があったが、高価な装置が必要になったり、除去時間が遅い等の問題があった。
特に大型基板上に有機EL素子等を多面付けで作製する場合には、従来の方法では拭き取り除去の時間と手間が極めて大きく湿式法によるEL素子の生産性を落とす原因となっていた。
また、有機太陽電池(例えば非特許文献6参照)や光電池においても正孔輸送層にPEDOT:PSS等の導電性高分子が使われ有機EL素子を作製する場合と同様の問題が生じていた。
T.FUNAMOTO, Y. Matsueda, O. Yokoyama, A. Tsuda, H. Takeshita, A. Miyashita, SID 02 DIGEST, 27.5L(2002). T. Shimoda, SID 03 DIGEST, 39.1(2003). David Albertalli, SID 05 DIGEST, 30.3(2005). Tadashi Gohda, Yuhki Kobayashi, Kiyoshi Okano, Satoshi Inoue, Ken Okamoto,Satoshi Hashimoto, Emi Yamamoto, Haruyuki Morita, Seiichi Mitsui and Mitsuhiro Koden, SID 06 DIGEST, 58.3(2006). E. Kitazume, K. Takeshita, K. Murata, Y. Qian, Y. Abe, M. Yokoo, K. Oota, T. Taguchi,SID06DIGEST, 41.2(2006). Chu-Jung Ko,Yi-Kai Lin,Fang-Chung Chen and Chi-Wei Chu,Appl.Phys.Lett.,90,063509-1(2007).
In the wet method organic EL element, a polythiophene-based compound such as a composite of poly (3,4-ethylenedioxythiophene) and polystyrene sulfonic acid (hereinafter abbreviated as PEDOT: PSS) is used as a hole injecting and transporting layer. An aqueous dispersion of a polyaniline-based conductive polymer is used. When these hole injection and transport layers are formed by the ink jet method, there is a problem in productivity, and when performed by the relief printing method using a resin plate, the plate absorbs water due to water-based ink and is deformed. Above, the ink was likely to have a problem with the smoothness of the repelling film.
In addition, when the film is formed by applying almost the entire surface to the entire surface by the slit coating method, there is no film thickness unevenness due to the cell pattern of the anilox roll generated by the relief printing method, and the film uniformity is high. There was an advantage that the film formation time was shorter than that. However, the film is not formed on the part of the range of several centimeters where the film thickness at the beginning and end of coating changes, the part for bonding the sealing glass plate and the sealing can, and the part for forming the electrode terminal. It was necessary to remove the necessary film.
Conventional removal methods include wiping methods to wipe off swabs and cloth tape with a solvent, laser ablation method, oxygen plasma cleaning method, ultraviolet ozone cleaning method, etc., but expensive equipment is required or removal time There were problems such as being slow.
In particular, when organic EL elements or the like are produced on a large substrate by multiple impositions, the conventional method requires a large amount of time and labor for wiping and removing, which causes a reduction in productivity of EL elements by a wet method.
Also, in organic solar cells (see, for example, Non-Patent Document 6) and photovoltaic cells, problems similar to those in the case of producing an organic EL element using a conductive polymer such as PEDOT: PSS for the hole transport layer have occurred.
T.FUNAMOTO, Y. Matsueda, O. Yokoyama, A. Tsuda, H. Takeshita, A. Miyashita, SID 02 DIGEST, 27.5L (2002). T. Shimoda, SID 03 DIGEST, 39.1 (2003). David Albertalli, SID 05 DIGEST, 30.3 (2005). Tadashi Gohda, Yuhki Kobayashi, Kiyoshi Okano, Satoshi Inoue, Ken Okamoto, Satoshi Hashimoto, Emi Yamamoto, Haruyuki Morita, Seiichi Mitsui and Mitsuhiro Koden, SID 06 DIGEST, 58.3 (2006). E. Kitazume, K. Takeshita, K. Murata, Y. Qian, Y. Abe, M. Yokoo, K. Oota, T. Taguchi, SID06DIGEST, 41.2 (2006). Chu-Jung Ko, Yi-Kai Lin, Fang-Chung Chen and Chi-Wei Chu, Appl. Phys. Lett., 90, 063509-1 (2007).

しかしながら、有機太陽電池、有機ELディスプレイ等の有機膜等の機能性膜を基板上に多面付け形成する際に、従来スピンコート法やスリットコート法等の基板一面に高速で一括成膜できる方法で有機機能性膜を成膜する方法を採用した場合、後で不要な部分の膜を除去する必要があり、素子の多面付けの際等に所望の形の膜に人手で拭き取り整形するためには多大な時間とコストがかかる問題があった。   However, when functional films such as organic films for organic solar cells, organic EL displays, etc. are formed on a substrate in a multifaceted manner, the conventional spin coating method or slit coating method can be used to form a film on the entire surface at a high speed. When adopting the method of forming an organic functional film, it is necessary to remove the unnecessary part of the film later, and in order to wipe and shape the film in the desired shape manually when applying multiple elements There was a problem that took a lot of time and cost.

そこで本発明は、膜除去工程を低コストで高速処理可能な装置化することが可能なキャップ式部分洗浄除去装置を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide a cap-type partial cleaning / removing apparatus capable of forming an apparatus capable of high-speed processing at a low cost at a film removing process.

上述の目的を達成するため、本発明のキャップ式部分洗浄除去装置は、少なくとも片面に1つ以上の弾性リングを設けたキャップ板と、機能性膜を成膜した基板とを、前記弾性リングと前記機能性膜とが密着するように対向させ、前記基板と前記キャップ板とを位置合わせして重ね合わせる機構と、前記基板と前記キャップ板とが積層された積層体を、前記機能性膜を溶解または分散させる溶剤中に浸漬することにより、前記弾性リングで囲まれた範囲外の不要な機能性膜を洗浄除去する機構とを備え、前記洗浄除去する機構は、前記キャップ板と前記基板とを前記弾性リングを介して密着させた状態で溶剤中に浸漬し洗浄する1つ以上の洗浄槽と、前記洗浄槽内の溶剤に超音波をかける機構とを有し、前記キャップ板は、前記キャップ板と前記弾性リングで囲まれた部分以外を乾燥するための通風乾燥用の管を有することを特徴とする。
In order to achieve the above-mentioned object, the cap-type partial cleaning and removing apparatus of the present invention includes a cap plate provided with at least one elastic ring on at least one surface, a substrate on which a functional film is formed, and the elastic ring. A mechanism in which the functional film is opposed so that the functional film is in close contact, the substrate and the cap plate are aligned and overlapped, and a laminate in which the substrate and the cap plate are laminated, A mechanism for cleaning and removing unnecessary functional films outside the range surrounded by the elastic ring by immersing in a solvent to be dissolved or dispersed, and the mechanism for cleaning and removing includes the cap plate and the substrate. possess one or more cleaning tank immersion washing in a solvent, and a mechanism for applying an ultrasonic wave to the solvent in the cleaning tank with a state of being in close contact via the elastic ring, the cap plate, the With cap plate And having a tube for ventilation drying for drying other than the portion surrounded by the in serial elastic ring.

本発明のキャップ式部分洗浄除去装置によれば、極めて低コストで生産性の高い成膜パターニング装置となり、有機EL素子や有機太陽電池に用いられる有機機能性膜の多面付け成膜パターニング工程の高速化、低コスト化を達成でき、かつ洗浄除去工程における基板の洗浄効率を上げることができる。 According to the cap-type partial cleaning and removal apparatus of the present invention, the film forming and patterning apparatus with extremely low cost and high productivity is achieved, and the high-speed film forming and patterning process of the organic functional film used in organic EL elements and organic solar cells is performed at high speed. reduction can be achieved at low cost, and Ru can be increased cleaning efficiency of the substrate in the cleaning removal step.

以下、本発明の実施の形態を詳細に説明する。
図1は本発明の実施の形態によるキャップ式部分洗浄除去装置に用いるキャップ板の例を示す斜視図であり、図2は同キャップ板を示すA−A断面図である。また、図3はキャップ板の他の例を示すA−A断面図である。
また、図4は本発明の実施の形態によるキャップ式部分洗浄除去装置に用いる全面に機能性膜を成膜した基板の例を示す斜視図である。
さらに、図5〜図9はキャップ式部分洗浄除去装置の作業工程を示す断面図および斜視図であり、図10はキャップ板に設ける弾性リング1の製法を説明する断面図である。
Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 is a perspective view showing an example of a cap plate used in a cap-type partial cleaning and removing apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA showing the cap plate. FIG. 3 is an AA cross-sectional view showing another example of the cap plate.
FIG. 4 is a perspective view showing an example of a substrate in which a functional film is formed on the entire surface used in the cap-type partial cleaning and removing apparatus according to the embodiment of the present invention.
5 to 9 are a cross-sectional view and a perspective view showing a working process of the cap-type partial cleaning and removing apparatus, and FIG. 10 is a cross-sectional view for explaining a method of manufacturing the elastic ring 1 provided on the cap plate.

本実施の形態によるキャップ式部分洗浄除去装置では、少なくとも片面に1つ以上の弾性リング1を設けたキャップ板2を用いる。ここで用いる弾性リング1は図2または図3に示すように、適当な太さと長さのO−リングや概略三角形状断面のリングを所望の形状でキャップ板に取り付けて用いることができる。
また、図4に示す機能性膜6が基板面上概略一面全体に成膜された基板7を、図5に示すように、基板支持台8に取り付け、キャップ板2に取り付けた弾性リング1の先端が基板面に密着するように対向させ重ね合わせ、機能性膜の必要な部分を保護密封する。次に、図6に示すように、機能性膜の必要な部分以外の膜を溶解または分散させる溶剤で洗浄除去する。その後、キャップ板と基板に付着した溶剤を乾燥した後、キャップ板と基板を図7のように分離することにより、図8の例に示すように、素子の多面付けに対応して機能性膜を配列した基板を容易に製造できる。
In the cap-type partial cleaning and removing apparatus according to this embodiment, a cap plate 2 provided with at least one elastic ring 1 on at least one surface is used. As shown in FIG. 2 or 3, the elastic ring 1 used here can be used by attaching an O-ring having an appropriate thickness and length or a ring having a substantially triangular cross section to the cap plate in a desired shape.
4 is attached to the substrate support 8 and attached to the cap plate 2, as shown in FIG. 5, the substrate 7 on which the functional film 6 shown in FIG. The tops are opposed so as to be in close contact with the substrate surface, and the necessary portions of the functional film are protected and sealed. Next, as shown in FIG. 6, the film other than the necessary part of the functional film is washed away with a solvent that dissolves or disperses the film. Thereafter, after the solvent attached to the cap plate and the substrate is dried, the cap plate and the substrate are separated as shown in FIG. Can be easily manufactured.

このようなキャップ式部分洗浄除去装置は、ガラス、金属、プラスチック等の板状またはフィルム状の板面上に概略一面全面に形成されなんらかの溶剤に可溶または分散できる機能性膜を所望の多面付け形状に分割パターン化したい場合に、基板、キャップ板および弾性リングに囲まれ密封保護された範囲外の膜を洗浄除去し機能性膜の配列パターンを形成するために好ましく用いることができる。
ここで、概略一面全面とは基板上全面で無くても、ストライプ状等に間隔を開けて膜が形成されていても良いことを表している。
機能性膜がトルエン等の芳香族系有機溶媒可溶性膜である場合は、芳香族系有機溶媒を用い、機能性膜が水溶性の有機化合物の場合は水およびエチルアルコール、イソプロピルアルコール、シラノール等のアルコール類を含む溶剤を用いて本発明の装置を適用できる。
膜の洗浄除去後の基板乾燥時間を速めるため、洗浄除去の際の溶剤の組成を、最初に水分濃度を高く、後に水よりも蒸気圧の高いアルコール濃度を増した組成に変化させた洗浄溶剤を用いることもできる。
Such a cap-type partial cleaning / removing apparatus is provided with a desired multi-faced functional film which is formed on the entire surface of a plate or film of glass, metal, plastic, etc. and can be dissolved or dispersed in any solvent. When it is desired to divide the pattern into shapes, it can be preferably used for forming an array pattern of functional films by washing and removing the film outside the range protected and sealed by the substrate, the cap plate and the elastic ring.
Here, the substantially entire surface indicates that the film may be formed in a striped manner or the like, not necessarily on the entire surface of the substrate.
When the functional membrane is an aromatic organic solvent-soluble membrane such as toluene, use an aromatic organic solvent. When the functional membrane is a water-soluble organic compound, water, ethyl alcohol, isopropyl alcohol, silanol, etc. The apparatus of the present invention can be applied using a solvent containing alcohols.
In order to speed up the drying time of the substrate after cleaning and removal of the film, the cleaning solvent was changed to a composition in which the concentration of the solvent was increased first and then the concentration of alcohol having a higher vapor pressure than water was increased. Can also be used.

また、機能性膜がトルエン等の芳香族系有機溶媒に可溶な膜である場合は、トルエン、キシレン、テトラリン等の芳香族系有機溶媒を含む溶剤を用いて本発明の装置を適用できる。
また、機能性膜が無機化合物から成る膜や有機と無機の複合膜の場合においても水または有機溶剤等何らかの可溶な材料であれば本発明の装置が適用できる。
水に溶ける機能性膜と芳香族有機溶媒に溶ける機能性膜の積層膜に対しても、水と芳香族有機溶媒を順番にまたは交互に用いて不溶部の膜を洗浄除去することにより本発明の装置を適用することができる。
その際、最後に水よりも蒸気圧の高い芳香族系有機溶剤で洗浄を行なうと乾燥時間を短縮できる。
除去すべき膜の対象毎の手順を装置内の記憶装置にプログラムし自動運転できるようにすることが望ましい。
When the functional film is a film soluble in an aromatic organic solvent such as toluene, the apparatus of the present invention can be applied using a solvent containing an aromatic organic solvent such as toluene, xylene, or tetralin.
Even when the functional film is a film made of an inorganic compound or an organic-inorganic composite film, the apparatus of the present invention can be applied if it is any soluble material such as water or an organic solvent.
Even in the case of a laminated film of a functional film that is soluble in water and a functional film that is soluble in an aromatic organic solvent, the film of the insoluble portion is washed and removed by using water and an aromatic organic solvent in order or alternately. Can be applied.
At that time, if the washing is finally performed with an aromatic organic solvent having a higher vapor pressure than water, the drying time can be shortened.
It is desirable that the procedure for each target of the film to be removed is programmed in a storage device in the apparatus so that it can be automatically operated.

従来のスピンコート法、スリットコート法等の基板面上に一括塗布成膜する方法は、成膜速度が速い利点があるが、膜の不必要な部分の拭き取りに手間と時間がかかり、パターンニングが必要な膜の形成には問題があった。
そこで、本実施の形態によるキャップ式部分洗浄除去装置と組み合わせて適用することにより、極めて低コストで生産性の高い成膜パターニング装置となり、有機EL素子や有機太陽電池に用いられる有機機能性膜の多面付け成膜パターニング工程の高速化、低コスト化に役立てることができる。
Conventional methods such as spin coating, slit coating, etc., which perform batch coating on the substrate surface, have the advantage of high deposition speed, but it takes time and effort to wipe off unnecessary portions of the film, and patterning is required. However, there was a problem in the formation of a film that required the above.
Therefore, when applied in combination with the cap-type partial cleaning and removal apparatus according to the present embodiment, it becomes a very low-cost and highly productive film-forming patterning apparatus, and an organic functional film used in organic EL elements and organic solar cells. This can be used to increase the speed and cost of the multi-sided film forming patterning process.

以下、本例のキャップ式部分洗浄除去装置をさらに図を用いて詳しく説明する。
図1に示すキャップ板2は、ステンレス板、チタン板、セラミック板、樹脂板等の洗浄溶剤に耐性のある材料を用いて作製する。
キャップ板2の少なくとも片面には、断面が円形のO−リングまたは、概略三角形型の弾性リング1が配置される。各弾性リングの配置位置は図に示すように基板と合わせた際に基板面の素子の多面取り配置に合うようにする。具体的には、EL素子の発光画面部や太陽電池の光電変換部よりも外側、かつガラス板等を接着封止するための接着しろよりも内側に密着するよう通常は方形に曲げて複数配置される。ただし、方形以外にも、素子形状に合わせて円形、三角形等の所望の形状に弾性リング1を曲げて用いることが可能である。
洗浄溶剤が弾性リング1で囲まれた範囲内に入り込み必要な膜の部分を溶解することを防ぐため、キャップ板の弾性リング1と基板7は完全に密着させる必要がある。
そこで、例えばキャップ板と対向する基板支持台間を加圧することにより基板7と弾性リング1を密着させるか、あるいは、キャップ板2および弾性リング1と基板7で囲まれた閉空間を真空ポンプ等により減圧することにより密着させても良い。
その際、弾性リング1がつぶれて基板7上の必要な部分の膜6とキャップ板2との接触を防止するとともに、不必要な部分の膜6を洗浄除去する際の溶剤の流れや、乾燥する時のエアの流れを良くするため、図2および図3の断面図のように、弾性リング1を設けた部分に沿った部分以外はキャップ板2の基板7側の面を少なくとも1mm以上掘り込んでおくことが好ましい。
Hereinafter, the cap-type partial cleaning and removing apparatus of this example will be described in detail with reference to the drawings.
The cap plate 2 shown in FIG. 1 is manufactured using a material resistant to a cleaning solvent such as a stainless plate, a titanium plate, a ceramic plate, and a resin plate.
On at least one side of the cap plate 2, an O-ring having a circular cross section or an elastic ring 1 having a substantially triangular shape is disposed. As shown in FIG. 5 , the arrangement positions of the elastic rings are set so as to match the multi-cavity arrangement of elements on the substrate surface when they are combined with the substrate. Specifically, multiple arrangements are usually made by bending in a square shape so that it adheres more to the outside than the light emitting screen part of the EL element and the photoelectric conversion part of the solar cell, and inside the bonding margin for adhesively sealing the glass plate etc. Is done. However, it is possible to bend and use the elastic ring 1 in a desired shape such as a circle or a triangle according to the element shape other than the square shape.
In order to prevent the cleaning solvent from entering the range surrounded by the elastic ring 1 and dissolving the necessary film portion, the elastic ring 1 of the cap plate and the substrate 7 must be brought into close contact with each other.
Therefore, for example, the substrate 7 and the elastic ring 1 are brought into close contact with each other by pressurizing between the substrate support tables facing the cap plate, or the closed space surrounded by the cap plate 2 and the elastic ring 1 and the substrate 7 is vacuum pumped or the like. You may make it closely_contact | adhere by decompressing by.
At that time, the elastic ring 1 is crushed to prevent contact between the necessary portion of the film 6 on the substrate 7 and the cap plate 2, and at the same time, the solvent flow when the unnecessary portion of the film 6 is removed by washing or drying. In order to improve the air flow at the time of performing, the surface on the substrate 7 side of the cap plate 2 is dug at least 1 mm or more except for the portion along the portion where the elastic ring 1 is provided as shown in the cross-sectional views of FIGS. Preferably.

本例のキャップ式部分洗浄除去装置に用いる基板7上に、機能性膜6の下に陰極蒸着時のライン分離用の逆テーパーレジスト隔壁が形成されていても良く、また発光領域の周囲にインクジェットや印刷成膜時のインク流出防止用のバンク(土手)が形成されていても良い。さらに薄膜トランジスタや配線等の駆動回路が形成されていても良いが、弾性リング1との密着性向上のため、できるだけ表面を平滑化してあることが望ましい。
また、弾性リング1は耐有機溶剤性、耐酸性のフッ素系ゴムやエチレン−プロピレン系ゴム、シリコーンゴム等や、ばね弾性が発揮されるように断面をC形状とした金属にテフロン(登録商標)コーティングを施したものや、断面をC形状とした合成樹脂等が使用できる。有機溶剤を洗浄溶剤に用いる場合は膨潤し難いフッ素系の架橋ゴムが好ましく用いられる。
この弾性リング1の断面の巾は4mm以下とし、より好ましくは0.5mm〜2mmである。0.5mmより細いと、弾性リング1の強度不足や変形が生じたり、水密シール性が不十分となる。
また、4mmより巾が広いとディスプレイパネルの額縁面積が大きくなってしまう問題がある。基板との接触面積を狭くし、リングの強度を上げるために断面が三角形状を用いることがより望ましい。
また、弾性リング1はキャップ板2に溝2Aを加工してはめ込み、接着剤で接着、固定することができる。
また、より好ましい他の方法では、固体の弾性リング1をはめ込むのではなく、図10に示すようにキャップ板2に奥が広がった溝2Bを形成し、例えば2液硬化性のスリーボンド1119等のフッ素系液状ガスケットをディスペンサー(自動供給装置)11による供給ノズル11Aを用いて流し込み、架橋硬化させて弾性リング1とすることにより、外れ難くかつ任意の形状と細さのリングを容易に作ることができる。
On the substrate 7 used in the cap type partial cleaning and removing apparatus of this example, a reverse taper resist partition for line separation at the time of cathode deposition may be formed under the functional film 6, and an ink jet is formed around the light emitting region. In addition, a bank (bank) may be formed for preventing ink leakage during printing film formation. Further, a driving circuit such as a thin film transistor or wiring may be formed, but it is desirable that the surface be smoothed as much as possible in order to improve the adhesion to the elastic ring 1.
The elastic ring 1 is made of Teflon (registered trademark) made of organic solvent-resistant and acid-resistant fluorine-based rubber, ethylene-propylene-based rubber, silicone rubber, etc., or a metal having a C-shaped cross section so that spring elasticity can be exerted. A coated resin or a synthetic resin having a C-shaped cross section can be used. When an organic solvent is used as a cleaning solvent, a fluorine-based crosslinked rubber that is difficult to swell is preferably used.
The width of the cross section of the elastic ring 1 is 4 mm or less, and more preferably 0.5 mm to 2 mm. If it is thinner than 0.5 mm, the elastic ring 1 will be insufficient in strength or deformed, and the watertight sealability will be insufficient.
Further, if the width is larger than 4 mm, there is a problem that the frame area of the display panel becomes large. It is more desirable to use a triangular cross section in order to reduce the contact area with the substrate and increase the strength of the ring.
Further, the elastic ring 1 can be fitted into the cap plate 2 by processing the groove 2A, and can be bonded and fixed with an adhesive.
Further, in another more preferable method, the solid elastic ring 1 is not fitted, but a groove 2B having a deep back is formed in the cap plate 2 as shown in FIG. 10, for example, a two-liquid curable three bond 1119 or the like. By pouring a fluorine-based liquid gasket using a supply nozzle 11A by a dispenser (automatic supply device) 11 and cross-linking and curing to form an elastic ring 1, it is possible to easily make a ring having an arbitrary shape and thinness that is difficult to come off. it can.

また、基板7を固定する基板支持台8は、ステンレス板、チタン板、セラミック板、樹脂板等の洗浄溶剤に耐性のある材料を用いて作製する。例えば基板7の形状に合わせた凹部を基板支持台8上に形成し基板をはめ込むガイドとし、突き当て等の方法で基板の位置を合わせ、吸引等の方法で基板を固定する。精度が要求される場合は、顕微鏡、カメラ等によりキャップ板2と基板の位置合わせと確認が容易にできるようにしてもよい。
具体的な洗浄方法の例としては、図9に示すように、洗浄槽9に水またはエチルアルコール、イソプロピルアルコール等のアルコール類、またはキシレン、テトラリン、シクロヘキシルベンゼン等の芳香族有機溶剤10を入れキャップ板2と基板7を浸漬し、まず浸漬洗浄を行なう。
なお、この洗浄除去工程の際にキャップ板2を支持棒5を中心に回転運動、上下運動、揺動運動を行ったり、超音波をかけて洗浄効率を上げることがより望ましい。
また、低沸点の溶剤を用いる場合は、洗浄槽の上部周囲を冷却して蒸気を還流させ揮散防止することが望ましい。
次にキャップ板2と基板7を洗浄槽から引き上げ密着させた状態でキャップ板2と基板7の間に汚染されていない新鮮な溶剤を流し、すすぎ洗浄を行なうことがより望ましい。
The substrate support 8 for fixing the substrate 7 is manufactured using a material resistant to a cleaning solvent such as a stainless plate, a titanium plate, a ceramic plate, or a resin plate. For example, a concave portion matching the shape of the substrate 7 is formed on the substrate support base 8 and used as a guide for fitting the substrate, the position of the substrate is aligned by a method such as abutment, and the substrate is fixed by a method such as suction. When accuracy is required, the cap plate 2 and the substrate may be easily aligned and confirmed with a microscope, a camera, or the like.
As an example of a specific cleaning method, as shown in FIG. 9, the cleaning tank 9 is filled with water or an alcohol such as ethyl alcohol or isopropyl alcohol, or an aromatic organic solvent 10 such as xylene, tetralin or cyclohexylbenzene. The plate 2 and the substrate 7 are immersed, and first, immersion cleaning is performed.
In this cleaning and removing step, it is more desirable to increase the cleaning efficiency by rotating the cap plate 2 around the support bar 5, moving up and down, and swinging, or applying ultrasonic waves.
Moreover, when using a low boiling point solvent, it is desirable to cool the upper periphery of a washing tank and to recirculate | steam and to prevent volatilization.
Next, it is more desirable to carry out rinsing by flowing a clean solvent that is not contaminated between the cap plate 2 and the substrate 7 in a state where the cap plate 2 and the substrate 7 are pulled up and brought into close contact with each other.

また、基板7からキャップ板2を分離する前の乾燥は、洗浄槽9から引き上げてキャップ板支持棒5を回転させ遠心力で水を吹き飛ばす。または/および、キャップ板2または基板支持台に取り付けた温水パイプ、電熱ヒーター、ペルチェ素子や、周辺に取り付けた赤外線ヒーター、温風ヒーター等によりキャップ板、基板、基板支持台を加熱する。または/および、乾燥する際にキャップ板2と弾性リング1で囲まれた範囲以外の部分に圧縮ガスを通したり、真空ポンプで吸引することにより、通風乾燥しても乾燥時間をより速める等の手段を取ることができる。
その際、通風乾燥用の管は洗浄液を流す管と個別に設けても良いし共用管4を使用してもよい。
Further, the drying before separating the cap plate 2 from the substrate 7 is pulled up from the washing tank 9 and the cap plate support rod 5 is rotated to blow off water by centrifugal force. Alternatively, the cap plate, the substrate, and the substrate support base 8 are heated by a hot water pipe, an electric heater, a Peltier element attached to the cap plate 2 or the substrate support base 8 , an infrared heater, a hot air heater, etc. attached to the periphery. Or / and when drying, by passing compressed gas through a part other than the range surrounded by the cap plate 2 and the elastic ring 1, or by sucking with a vacuum pump, the drying time is further increased. Can take measures.
In that case, the ventilation drying pipe may be provided separately from the pipe through which the cleaning liquid flows, or the common pipe 4 may be used.

以下、本発明の具体的な実施例について説明する。
ここでは、360mm×460mm角のガラス基板上にインジウム錫酸化物からなる透明導電膜をスパッタリング法で成膜し、塩化第二鉄(III)水溶液と塩酸の混合溶液によりエッチングを行ない、480(走査ライン)×640×赤、青、緑ライン(データライン)対応の対角5インチの単純マトリクスディスプレイ用ストライプ陽極を2行×3列の6面配置に形成した。
このストライプ電極上にポリイミドレジストによるバンクをフォトリソ法で2ミクロン厚で形成した後、紫外線オゾン洗浄を行なった後、ダイコート法で正孔注入輸送層としてPEDOT/PSS(BAYTRON P CH8000)を水、イソプロピルアルコールで適当に希釈したインクを用いて50nmの厚さで基板一面に形成した。
Hereinafter, specific examples of the present invention will be described.
Here, a transparent conductive film made of indium tin oxide is formed on a 360 mm × 460 mm square glass substrate by a sputtering method, and etching is performed with a mixed solution of ferric chloride (III) aqueous solution and hydrochloric acid. A stripe anode for a simple matrix display corresponding to 5 inches diagonal corresponding to (line) × 640 × red, blue and green lines (data lines) was formed in a 6-sided arrangement of 2 rows × 3 columns.
After forming a bank of polyimide resist on the stripe electrode with a thickness of 2 microns by photolithography, UV ozone cleaning was performed, and then PEDOT / PSS (BAYTRON P CH8000) was used as water and isopropyl as a hole injection / transport layer by die coating. The ink was appropriately diluted with alcohol and formed on the entire surface of the substrate with a thickness of 50 nm.

一方、キャップ板は斜視図、図1及び図3に示すような形状でステンレス板を加工して作製し、対角5インチディスプレイ6面分に対応し、発光領域から3mm外側に成る方形状に、深さ2mmの底が広がった台形溝を加工した。次にフッ素系液状ガスケット(スリーボンド1119)をディスペンサーから台形溝に充填し、高さ2mmの三角形状断面の弾性リング1になるよう注入した。その後、1週間放置しゴム状硬化させた。
次に基板を基板支持台に埋め込んだ多孔質板を通して吸引固定し、図1で示すキャップ板を基板と位置合わせし重ね合わせ、吸引口3から軽く減圧吸引し密着させた。次に、溶剤10として水を入れた洗浄槽9に浸漬し、ゆっくり回転し、不要部のPEDOT/PSS層を浸漬洗浄した。
On the other hand, the cap plate is made by processing a stainless steel plate in the shape as shown in the perspective view, FIG. 1 and FIG. 3, and corresponds to 6 diagonal 5 inch displays and has a square shape 3 mm outside the light emitting area. A trapezoidal groove with a 2 mm deep bottom was processed. Next, a fluorine-based liquid gasket (ThreeBond 1119) was filled from a dispenser into a trapezoidal groove and poured into an elastic ring 1 having a triangular cross section of 2 mm in height. Thereafter, it was allowed to stand for 1 week to be cured in a rubbery state.
Next, the substrate was sucked and fixed through a porous plate embedded in the substrate support, and the cap plate shown in FIG. Next, it was immersed in the washing tank 9 containing water as the solvent 10 and rotated slowly to dip and wash the unnecessary PEDOT / PSS layer.

次に洗浄槽9から引き上げ基板とキャップ板の隙間に洗浄および通風乾燥共用管4から純水を流しすすぎ洗浄し、次にエチルアルコールを流し通風乾燥した。基板とキャップ板を分離すると、図8に示すように、PEDOT/PSS正孔注入輸送層を多面付け配列にパターニングすることができた。
正孔注入輸送層上にはポリフルオレン系の赤、青、緑の発光材料のキシレン溶液からなるインクを用いて凸版印刷法により発光層のストライプラインをデータラインに合わせて画面形成領域内に各色のラインを順に形成した。
次にバリウム/アルミニウム積層膜からなる陰極ラインをデータラインに直交するようにマスク蒸着した後、封止ガラス板を接着することにより、ELディスプレイパネルとすることができた。
Next, the water was lifted from the washing tank 9 to the gap between the substrate and the cap plate and rinsed by flowing pure water from the common air-drying tube 4 and then dried by flowing ethyl alcohol. When the substrate and the cap plate were separated, as shown in FIG. 8, the PEDOT / PSS hole injection transport layer could be patterned into a multi-faceted arrangement.
On the hole injecting and transporting layer, using a polyfluorene-based ink made of xylene solution of red, blue and green light emitting materials, the stripe line of the light emitting layer is aligned with the data line by letterpress printing method, and each color in the screen formation area The lines were formed in order.
Next, a cathode line made of a barium / aluminum laminated film was mask-deposited so as to be orthogonal to the data line, and an EL display panel was obtained by adhering a sealing glass plate.

本発明の実施の形態によるキャップ式部分洗浄除去装置に用いるキャップ板の例を示す斜視図である。It is a perspective view which shows the example of the cap board used for the cap type partial washing | cleaning removal apparatus by embodiment of this invention. 図1に示すキャップ板の一例を示すA−A断面図である。It is AA sectional drawing which shows an example of the cap board shown in FIG. 図1に示すキャップ板の一例を示すA−A断面図である。It is AA sectional drawing which shows an example of the cap board shown in FIG. 本発明の実施の形態によるキャップ式部分洗浄除去装置に用いる全面に機能性膜を成膜した基板の例を示す斜視図である。It is a perspective view which shows the example of the board | substrate which formed the functional film into the whole surface used for the cap type partial washing | cleaning removal apparatus by embodiment of this invention. 図1〜図4に示すキャップ式部分洗浄除去装置の作業工程を示す断面図である。It is sectional drawing which shows the operation | work process of the cap-type partial washing | cleaning removal apparatus shown in FIGS. 図1〜図4に示すキャップ式部分洗浄除去装置の作業工程を示す断面図である。It is sectional drawing which shows the operation | work process of the cap-type partial washing | cleaning removal apparatus shown in FIGS. 図1〜図4に示すキャップ式部分洗浄除去装置の作業工程を示す断面図である。It is sectional drawing which shows the operation | work process of the cap-type partial washing | cleaning removal apparatus shown in FIGS. 図1〜図4に示すキャップ式部分洗浄除去装置の作業工程を示す斜視図である。It is a perspective view which shows the operation | work process of the cap-type partial washing | cleaning removal apparatus shown in FIGS. 図1〜図4に示すキャップ式部分洗浄除去装置の作業工程を示す断面図である。It is sectional drawing which shows the operation | work process of the cap-type partial washing | cleaning removal apparatus shown in FIGS. 図1に示すキャップ板に設ける弾性リング1の製法を説明する断面図である。It is sectional drawing explaining the manufacturing method of the elastic ring 1 provided in the cap board shown in FIG.

符号の説明Explanation of symbols

1……弾性リング1、2……キャップ板、3……吸引管口、4……洗浄および通風乾燥共用管、5……キャップ板支持棒兼吸引管、6……機能性膜、7……基板、8……基板支持板、9……洗浄槽、10……溶剤、11……ディスペンサー。   DESCRIPTION OF SYMBOLS 1 ... Elastic ring 1, 2 ... Cap board, 3 ... Suction pipe port, 4 ... Washing and ventilation drying common pipe, 5 ... Cap board support rod and suction pipe, 6 ... Functional membrane, 7 ... ... substrate, 8 ... substrate support plate, 9 ... cleaning tank, 10 ... solvent, 11 ... dispenser.

Claims (9)

少なくとも片面に1つ以上の弾性リングを設けたキャップ板と、機能性膜を成膜した基板とを、前記弾性リングと前記機能性膜とが密着するように対向させ、前記基板と前記キャップ板とを位置合わせして重ね合わせる機構と、
前記基板と前記キャップ板とが積層された積層体を、前記機能性膜を溶解または分散させる溶剤中に浸漬することにより、前記弾性リングで囲まれた範囲外の不要な機能性膜を洗浄除去する機構とを備え、
前記洗浄除去する機構は、前記キャップ板と前記基板とを前記弾性リングを介して密着させた状態で溶剤中に浸漬し洗浄する1つ以上の洗浄槽と、前記洗浄槽内の溶剤に超音波をかける機構とを有し、
前記キャップ板は、前記キャップ板と前記弾性リングで囲まれた部分以外を乾燥するための通風乾燥用の管を有する、
ことを特徴とするキャップ式部分洗浄除去装置。
A cap plate provided with at least one elastic ring on at least one surface and a substrate on which a functional film is formed are opposed so that the elastic ring and the functional film are in close contact, and the substrate and the cap plate And a mechanism for aligning and overlaying,
By immersing the laminate in which the substrate and the cap plate are laminated in a solvent for dissolving or dispersing the functional film, unnecessary functional films outside the range surrounded by the elastic ring are removed by washing. And a mechanism to
The cleaning and removing mechanism includes one or more cleaning tanks that are immersed and cleaned in a solvent in a state where the cap plate and the substrate are in close contact with each other via the elastic ring, and an ultrasonic wave is applied to the solvent in the cleaning tank. possess a mechanism to apply,
The cap plate has a ventilation drying tube for drying other than the portion surrounded by the cap plate and the elastic ring.
A cap-type partial cleaning and removal apparatus characterized by that.
前記機能性膜を溶解または分散させる溶剤として水およびアルコールを含む溶剤を使用することを特徴とする請求項1記載のキャップ式部分洗浄除去装置。   The cap-type partial cleaning and removing apparatus according to claim 1, wherein a solvent containing water and alcohol is used as a solvent for dissolving or dispersing the functional film. 前記機能性膜を溶解または分散させる溶剤として芳香族有機溶媒を含む溶剤を使用することを特徴とする請求項1記載のキャップ式部分洗浄除去装置。   2. The cap-type partial cleaning and removing apparatus according to claim 1, wherein a solvent containing an aromatic organic solvent is used as a solvent for dissolving or dispersing the functional film. 前記機能性膜を溶解または分散させる溶剤として水およびアルコールを含む溶剤と芳香族有機溶媒を含む溶剤とを使用することを特徴とする請求項1記載のキャップ式部分洗浄除去装置。   2. The cap-type partial cleaning and removing apparatus according to claim 1, wherein a solvent containing water and alcohol and a solvent containing an aromatic organic solvent are used as a solvent for dissolving or dispersing the functional film. 前記弾性リングがゴム製であることを特徴とする請求項1〜4のいずれか1項記載のキャップ式部分洗浄除去装置。   The cap-type partial cleaning and removing apparatus according to any one of claims 1 to 4, wherein the elastic ring is made of rubber. 前記弾性リングは、前記キャップ板に形成されたリング状溝に液状ガスケットを注入し硬化することにより前記キャップ板に一体成型されることを特徴とする請求項1〜5のいずれか1項記載のキャップ式部分洗浄除去装置。   The said elastic ring is integrally molded by the said cap board by inject | pouring a liquid gasket into the ring-shaped groove formed in the said cap board, and hardening. Cap-type partial cleaning and removal device. 前記弾性リングは円形または概略3角形の断面形状を呈することを特徴とする請求項1〜6のいずれか1項記載のキャップ式部分洗浄除去装置。   The cap-type partial cleaning and removing apparatus according to claim 1, wherein the elastic ring has a circular or substantially triangular cross-sectional shape. 前記弾性リングおよび前記キャップ板および前記基板で囲まれた閉空間を減圧することにより、該閉空間を密封する減圧機構または真空ポンプを有することを特徴とする請求項1〜7のいずれか1項記載のキャップ式部分洗浄除去装置。   The pressure-reducing mechanism or the vacuum pump that seals the closed space by depressurizing the closed space surrounded by the elastic ring, the cap plate, and the substrate is provided. The cap-type partial cleaning and removal apparatus as described. 前記キャップ板および前記基板を乾燥するための加熱機構を有することを特徴とする請求項1〜8のいずれか1項記載のキャップ式部分洗浄除去装置。   The cap-type partial cleaning and removing apparatus according to claim 1, further comprising a heating mechanism for drying the cap plate and the substrate.
JP2007199408A 2007-07-31 2007-07-31 Cap-type partial cleaning and removal device Expired - Fee Related JP5067060B2 (en)

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