JP5057388B2

JP5057388B2 - connector

Info

Publication number: JP5057388B2
Application number: JP2008057766A
Authority: JP
Inventors: 琢男佐々木; 宏明石井; 貴行西村; 龍男木村; 和幸南
Original assignee: Japan Aviation Electronics Industry Ltd
Current assignee: Japan Aviation Electronics Industry Ltd
Priority date: 2008-03-07
Filing date: 2008-03-07
Publication date: 2012-10-24
Anticipated expiration: 2028-03-07
Also published as: JP2009217969A

Description

この発明はコネクタに関し、特に２つの接続対象物によって挟まれた状態でその２つの接続対象物を電気的に接続するコネクタに関する。 The present invention relates to a connector, and more particularly to a connector that electrically connects the two connection objects while being sandwiched between the two connection objects.

従来、この種のコネクタとして、下記特許文献１に記載されたものが知られている。このコネクタは絶縁性樹脂基板と複数の導電接点素子とを備えている。 Conventionally, what was described in following patent document 1 is known as this kind of connector. This connector includes an insulating resin substrate and a plurality of conductive contact elements.

絶縁性樹脂基板はＰＰＳ（ポリフェニレンスルフィド）やＰＥＳ（ポリエーテルサルホン）等のエンジニアプラスチックで形成されている。絶縁性樹脂基板は素子配置部とエンドストッパーとを有する。素子配置部には複数の貫通孔が等間隔に並べられている。 The insulating resin substrate is formed of engineer plastic such as PPS (polyphenylene sulfide) or PES (polyethersulfone). The insulating resin substrate has an element placement portion and an end stopper. A plurality of through holes are arranged at equal intervals in the element arrangement portion.

エンドストッパーはほぼフレーム状であり、素子配置部を囲むように素子配置部に結合されている。エンドストッパーは素子配置部よりも厚い。エンドストッパーは導電接点素子が２つの接続対象物によって圧縮されたとき、２つの接続対象物に突き当たり、導電接点素子が過剰に圧縮されることを防止する。 The end stopper has a substantially frame shape and is coupled to the element arrangement portion so as to surround the element arrangement portion. The end stopper is thicker than the element placement portion. When the conductive contact element is compressed by two connection objects, the end stopper hits the two connection objects and prevents the conductive contact element from being excessively compressed.

導電接点素子はほぼ円柱状である。導電接点素子は絶縁性エラストマ材料に導電性粒子を配合分散させた弾性を有する導電性組成物で形成されている。導電接点素子の高さはエンドストッパーよりも少し高く、導電接点素子の中間部の外径は絶縁性樹脂基板の貫通孔の内径よりも少し大きい。導電接点素子は貫通孔に挿入され、その中間部が素子配置部によって保持されている。 The conductive contact element is substantially cylindrical. The conductive contact element is formed of a conductive composition having elasticity in which conductive particles are blended and dispersed in an insulating elastomer material. The height of the conductive contact element is slightly higher than the end stopper, and the outer diameter of the intermediate part of the conductive contact element is slightly larger than the inner diameter of the through hole of the insulating resin substrate. The conductive contact element is inserted into the through hole, and an intermediate part thereof is held by the element arrangement part.

このコネクタを２つの接続対象物で挟むと、導電接点素子は圧縮され、その復帰力により、導電接点素子の一端部は一方の接続対象物のパッドに接触し、導電接点素子の他端部は他方の接続対象物のパッドに接触する。その結果、２つの接続対象物は接続される。
特開２００５−５６７９１号公報（段落００１０、００１１、００１６、図４参照） When this connector is sandwiched between two connection objects, the conductive contact element is compressed, and due to its restoring force, one end of the conductive contact element contacts the pad of one connection object, and the other end of the conductive contact element is It contacts the pad of the other connection object. As a result, the two connection objects are connected.
Japanese Patent Laying-Open No. 2005-56791 (see paragraphs 0010, 0011, 0016, FIG. 4)

例えば、２つの接続対象物の絶縁性樹脂基板がそれぞれ同じ方向に反っていると、コネクタを２つの接続対象物で挟んだとき、素子配置部の一方の面と一方の接続対象物とが強く接触するが、素子配置部の他方の面と他方の接続対象物とは接触しない（接触したとしても接触力が小さい）という現象が起きる。このため、導電接点素子の一端部と一方の接続対象物との接触力が過剰になり、導電接点素子の他端部と他方の接続対象物との接触力が不足し、接触不良が起きる虞がある。 For example, if the insulating resin substrates of two connection objects are respectively warped in the same direction, when the connector is sandwiched between two connection objects, one surface of the element placement portion and one connection object are strongly A phenomenon occurs in which the other surface of the element placement portion and the other connection object do not contact each other (the contact force is small even if contacted). For this reason, the contact force between one end of the conductive contact element and one connection object becomes excessive, the contact force between the other end of the conductive contact element and the other connection object is insufficient, and a contact failure may occur. There is.

この発明はこのような事情に鑑みてなされたもので、その課題は接続対象物が変形していても、接触不良を抑制することができるコネクタを提供することである。 This invention is made | formed in view of such a situation, The subject is providing the connector which can suppress a contact failure, even if the connection target object has deform | transformed.

前述の課題を解決するため請求項１の発明は、それぞれ複数の接続部を有する２つの接続対象物間に配置される絶縁部材と、前記絶縁部材に保持され、前記２つの接続対象物の接続部同士を導通させる弾性変形可能な複数の導電部材と、前記２つの接続対象物間の距離を調整する複数の距離調整部材とを備え、前記複数の距離調整部材は、それぞれ独立して前記絶縁部材の厚み方向へ移動可能に前記絶縁部材に取り付けられていることを特徴とする。 In order to solve the above-mentioned problem, the invention of claim 1 is characterized in that an insulating member disposed between two connection objects each having a plurality of connection portions, and a connection between the two connection objects held by the insulating member. comprising a plurality of conductive members elastically deformable to conduct a part to each other, and a plurality of length adjusting member for adjusting the distance between the front SL two connection object, wherein the plurality of length adjusting member, said independently The insulating member is attached to the insulating member so as to be movable in the thickness direction of the insulating member .

上述のように、距離調整部材が絶縁板にその厚み方向へ移動可能に取り付けられているので、絶縁板は２つの接続対象物の変形に応じて距離調整部材に対して相対的に移動できる。 As described above, since the distance adjusting member is attached to the insulating plate so as to be movable in the thickness direction, the insulating plate can be moved relative to the distance adjusting member according to the deformation of the two connection objects.

請求項２の発明は、請求項１記載の電気接続装置において、前記距離調整部材が、前記絶縁部材に対して着脱可能であることを特徴とする。 According to a second aspect of the present invention, in the electrical connection device according to the first aspect, the distance adjusting member is detachable from the insulating member.

請求項３の発明は、請求項１又は２記載の電気接続装置において、前記絶縁部材が弾性を有し、前記絶縁部材が、板状部と、この板状部に直交するように設けられ、前記導電部材の両端部以外の部分の外周面を覆う筒状の被覆部とを有することを特徴とする。 The invention according to claim 3 is the electrical connection device according to claim 1 or 2, wherein the insulating member has elasticity, the insulating member is provided so as to be orthogonal to the plate-like portion and the plate-like portion, and having a cylindrical covering portion that covers the outer peripheral surface of a portion other than the both end portions of the conductive members.

請求項４の発明は、請求項１〜３のいずれか１項記載の電気接続装置において、前記導電部材が、所定の材料で柱状に形成され、前記距離調整部材が、柱状に形成された前記導電部材の材料よりも縦弾性係数が大きい材料で柱状に形成されていることを特徴とする。 According to a fourth aspect of the present invention, in the electrical connection device according to any one of the first to third aspects, the conductive member is formed in a columnar shape with a predetermined material, and the distance adjusting member is formed in a columnar shape. It is characterized by being formed in a columnar shape with a material having a longitudinal elastic modulus larger than that of the material of the conductive member.

請求項５の発明は、請求項１〜４のいずれか１項記載の電気接続装置において、耐引張性が高く熱膨張係数が低い材料で形成され、前記絶縁部材を支持する支持基板を備え、前記絶縁部材を配置する孔が、前記支持基板に形成されていることを特徴とする。 The electrical connection device according to any one of claims 1 to 4, further comprising a support substrate that is formed of a material having high tensile resistance and a low coefficient of thermal expansion, and that supports the insulating member. A hole for arranging the insulating member is formed in the support substrate.

請求項６の発明は、それぞれ複数の接続部を有する２つの接続対象物間に配置される支持基板と、前記２つの接続対象物の接続部同士を導通させる弾性変形可能な複数の導電部材と、前記支持基板に支持され、前記導電部材を保持する絶縁部材と、前記２つの接続対象物間の距離を調整する複数の距離調整部材とを備え、前記複数の距離調整部材は、それぞれ独立して前記支持基板の厚み方向へ移動可能に前記支持基板又は前記絶縁部材に取り付けられていることを特徴とする。 The invention according to claim 6 is a support substrate disposed between two connection objects each having a plurality of connection parts, and a plurality of elastically deformable conductive members that electrically connect the connection parts of the two connection objects. the supported by the supporting substrate, the insulating member for holding the conductive member, and a plurality of length adjusting member for adjusting the distance between the front SL two connection object, wherein the plurality of length adjusting member are independently And it is attached to the support substrate or the insulating member so as to be movable in the thickness direction of the support substrate .

請求項７の発明は、請求項６記載の電気接続装置において、前記距離調整部材が、前記支持基板又は前記絶縁部材に対して着脱可能であることを特徴とする。 According to a seventh aspect of the present invention, in the electrical connection device according to the sixth aspect, the distance adjusting member is detachable from the support substrate or the insulating member.

請求項８の発明は、請求項６又は７記載の電気接続装置において、前記絶縁部材が弾性を有し、前記絶縁部材が、板状部と、この板状部に直交するように設けられ、前記導電部材の両端部以外の部分の外周面を覆う筒状の被覆部とを有することを特徴とする。 The invention according to claim 8 is the electrical connection device according to claim 6 or 7, wherein the insulating member has elasticity, the insulating member is provided so as to be orthogonal to the plate-like portion, and the plate-like portion, It has a cylindrical covering part which covers the outer peripheral surface of parts other than the both ends of the conductive member.

請求項９の発明は、請求項６〜８のいずれか１項記載の電気接続装置において、前記支持基板が、耐引張性が高く熱膨張係数が低い材料で形成され、前記絶縁部材を配置する孔が、前記支持基板に形成されていることを特徴とする。 According to a ninth aspect of the present invention, in the electrical connection device according to any one of the sixth to eighth aspects, the support substrate is formed of a material having a high tensile resistance and a low thermal expansion coefficient, and the insulating member is disposed. A hole is formed in the support substrate.

請求項１０の発明は、請求項１〜９のいずれか１項記載の電気接続装置において、前記距離調整部材が、前記導電部材の材料よりも熱伝導率の高い材料で形成されていることを特徴とする。 According to a tenth aspect of the present invention, in the electrical connection device according to any one of the first to ninth aspects, the distance adjusting member is formed of a material having a higher thermal conductivity than the material of the conductive member. Features.

この発明によれば、２つの接続対象物が変形していても、接触不良を抑制することができる。 According to this invention, even if two connection objects are deformed, contact failure can be suppressed.

以下、この発明の実施の形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１はこの発明の第１実施形態のコネクタの斜視図、図２は図１に示すコネクタのＡ部の拡大図、図３は図１に示すコネクタの一部の断面図、図４は図１に示すコネクタ、評価基板ユニット、押さえユニット及び半導体パッケージの断面図である。ただし、スペーサと導電部材の断面が分かるような位置で断面にした図である（以下の断面図も同様）。 1 is a perspective view of a connector according to a first embodiment of the present invention, FIG. 2 is an enlarged view of a portion A of the connector shown in FIG. 1, FIG. 3 is a sectional view of a part of the connector shown in FIG. 1 is a cross-sectional view of a connector, an evaluation board unit, a pressing unit, and a semiconductor package shown in FIG. However, it is the figure made into the cross section in the position which can understand the cross section of a spacer and an electrically-conductive member (the following cross-sectional views are also the same).

図１〜図４に示すように、コネクタ（電気接続装置）１は半導体パッケージ２１と評価基板ユニット２２の評価基板２２２とを電気的に接続するためのコネクタである。半導体パッケージ２１は押さえユニット２３によって押さえられる。 As shown in FIGS. 1 to 4, the connector (electrical connection device) 1 is a connector for electrically connecting the semiconductor package 21 and the evaluation board 222 of the evaluation board unit 22. The semiconductor package 21 is pressed by the pressing unit 23.

評価基板ユニット２２はベース板２２１と評価基板２２２とを備える。ベース基板２２１には位置決めピン２２３が取り付けられ、位置決めピン２２３には筒状部材２２４が装着されている。位置決めピン２２３はベース板２２１に対して評価基板２２２、コネクタ１及び押さえユニット２３を位置決めする。筒状部材２２４はベース板２２１とコネクタ１との間隔を一定に保つ。 The evaluation board unit 22 includes a base plate 221 and an evaluation board 222. Positioning pins 223 are attached to the base substrate 221, and a cylindrical member 224 is attached to the positioning pins 223. The positioning pins 223 position the evaluation board 222, the connector 1, and the pressing unit 23 with respect to the base plate 221. The cylindrical member 224 keeps the distance between the base plate 221 and the connector 1 constant.

押さえユニット２３はソケット部材２３１と固定部材（図示せず）と板状部材２３２とを備える。ソケット部材２３１は板状であり、収容孔２３１ａと位置決め孔２３１ｂとを有する。収容孔２３１ａには半導体パッケージ２１がソケット部材２３１の厚さ方向へ移動可能に収容される。位置決め孔２３１ｂには位置決めピン２２３が通される。板状部材２３２はほぼリング状であり、孔２３２ａを有する。孔２３２ａには位置決めピン２２３が通される。板状部材２３２は孔２３２ａと位置決め孔２３１ｂとが相対するようにソケッ部材２３１の底面に取り付けられる。固定部材（図示せず）はソケット部材２３１の収容孔２３１ａに挿入され、半導体パッケージ２１を押圧する凸部を有する。固定部材（図示せず）は収容孔２３１ａ内の半導体パッケージ２１をコネクタ１に押した状態でソケット部材２３１に係止される。 The holding unit 23 includes a socket member 231, a fixing member (not shown), and a plate-like member 232. The socket member 231 is plate-shaped and has a receiving hole 231a and a positioning hole 231b. The semiconductor package 21 is accommodated in the accommodation hole 231a so as to be movable in the thickness direction of the socket member 231. Positioning pins 223 are passed through the positioning holes 231b. The plate-like member 232 is substantially ring-shaped and has a hole 232a. The positioning pin 223 is passed through the hole 232a. The plate-like member 232 is attached to the bottom surface of the socket member 231 so that the hole 232a and the positioning hole 231b face each other. The fixing member (not shown) is inserted into the accommodation hole 231 a of the socket member 231 and has a convex portion that presses the semiconductor package 21. The fixing member (not shown) is locked to the socket member 231 in a state where the semiconductor package 21 in the accommodation hole 231a is pushed against the connector 1.

コネクタ１は支持基板３と導電部材５と絶縁部材７とスペーサ（距離調整部材）９とを備える。スペーサ（距離調整部材）９は、２つの接続対象物間の距離を一定に保つ役目をするものである。 The connector 1 includes a support substrate 3, a conductive member 5, an insulating member 7, and a spacer (distance adjusting member) 9. The spacer (distance adjusting member) 9 serves to keep the distance between the two connection objects constant.

支持基板３には窓孔（孔）３１と位置決め孔３２とを有する。窓孔３１の周辺部分により絶縁部材７が支持される（図３参照）。位置決め孔３２には位置決めピン２２３が通される。支持基板３はＳＵＳで形成されている。位置決め孔３２は機械加工ではなく、フォトリソグラフィー法によるエッチング加工によって形成される。エッチング加工によれば、ミクロン単位の加工精度を出すことができる。支持基板３の材料としてはＸＹ方向の伸展を防止するための耐引張性が高く、熱膨張係数の低い材料が好ましい。例えばポリイミド、アラミドの板や金属板が適する。 The support substrate 3 has window holes (holes) 31 and positioning holes 32. The insulating member 7 is supported by the peripheral portion of the window hole 31 (see FIG. 3). A positioning pin 223 is passed through the positioning hole 32. The support substrate 3 is made of SUS. The positioning hole 32 is formed not by machining but by etching using a photolithography method. According to the etching process, it is possible to obtain a processing accuracy in units of microns. The material of the support substrate 3 is preferably a material having high tensile resistance for preventing extension in the XY directions and a low thermal expansion coefficient. For example, polyimide and aramid plates and metal plates are suitable.

導電部材５はほぼ円柱状であり、弾性及び導電性を有する。導電部材５は半導体パッケージ２１のパッド２１ａと評価基板２２２のパッド２２２ａとに接触し、パッド２１ａ，２２２ａ同士を導通させる。導電部材５の材料としては、例えばシリコーン樹脂等の弾性樹脂材料にＡｕ，Ａｇ，Ｃｕ，Ｐｂ，Ｓｎ等の導電性金属微粒子を混入したものが挙げられる。導電部材５の弾性率は絶縁部材７の弾性率よりも高い。 The conductive member 5 has a substantially cylindrical shape, and has elasticity and conductivity. The conductive member 5 is in contact with the pad 21a of the semiconductor package 21 and the pad 222a of the evaluation substrate 222, and makes the pads 21a and 222a conductive. Examples of the material of the conductive member 5 include a material in which conductive metal fine particles such as Au, Ag, Cu, Pb, and Sn are mixed in an elastic resin material such as silicone resin. The elastic modulus of the conductive member 5 is higher than the elastic modulus of the insulating member 7.

絶縁部材７は絶縁性及び弾性を有する。絶縁部材７は板状部７１と複数の筒状部（被覆部）７２とを有する。絶縁部材７の材料としては、例えばシリコーン系、フッ素系、ウレタン系のゴム（ゲル）があり、特に透明なゴム（ゲル）が適する。 The insulating member 7 has insulating properties and elasticity. The insulating member 7 has a plate-like part 71 and a plurality of cylindrical parts (covering parts) 72. Examples of the material of the insulating member 7 include silicone-based, fluorine-based, and urethane-based rubbers (gels), and transparent rubbers (gels) are particularly suitable.

板状部７１の四隅には収容孔７１ａが形成されている。収容孔７１ａの内径はスペーサ９の外径よりも小さいが、絶縁部材７は弾性を有するので、収容孔７１ａには、スペーサ９が絶縁部材７の厚さ方向へ移動可能かつ着脱可能に挿入されている。各収容孔７１ａに収容された各スペーサはそれぞれ独立して絶縁部材７の厚さ方向へ移動できる。板状部７１の外周面には環状の溝７１ｂが形成されている。溝７１ｂは支持基板３の窓孔３１の周辺部分を受け容れる。これにより、絶縁部材７は支持基板３に取り付けられる。 Accommodating holes 71 a are formed at the four corners of the plate-like portion 71. Although the inner diameter of the accommodating hole 71a is smaller than the outer diameter of the spacer 9, the insulating member 7 has elasticity, so that the spacer 9 is inserted into the accommodating hole 71a so as to be movable and detachable in the thickness direction of the insulating member 7. ing. Each spacer accommodated in each accommodation hole 71a can move independently in the thickness direction of the insulating member 7. An annular groove 71 b is formed on the outer peripheral surface of the plate-like portion 71. The groove 71b accepts the peripheral portion of the window hole 31 of the support substrate 3. Thereby, the insulating member 7 is attached to the support substrate 3.

複数の筒状部７２は板状部７１に二次元配列されるように形成されている。筒状部７２はスペーサ９よりも高く、導電部材５よりも低い（図４参照）。筒状部７２は導電部材５の両端部以外の部分の外周面を覆っている。 The plurality of cylindrical portions 72 are formed to be two-dimensionally arranged on the plate-like portion 71. The cylindrical portion 72 is higher than the spacer 9 and lower than the conductive member 5 (see FIG. 4). The cylindrical portion 72 covers the outer peripheral surface of a portion other than both end portions of the conductive member 5.

スペーサ９はほぼ円柱状である。スペーサ９の材料としては、導電部材５よりも熱伝導率が高く、縦弾性係数の大きい材料、例えばステンレス、アルミ、銅等の金属材料が挙げられる。 The spacer 9 is substantially cylindrical. Examples of the material of the spacer 9 include materials having higher thermal conductivity than the conductive member 5 and a large longitudinal elastic coefficient, for example, metal materials such as stainless steel, aluminum, and copper.

図５は図４に示す評価基板ユニット上にコネクタ、押さえユニット及び半導体パッケージを配置した状態を示す断面図、図６は半導体パッケージをコネクタに押圧する前の状態を示す断面図、図７は図６に示す半導体パッケージをコネクタに押圧した状態を示す断面図である。 5 is a cross-sectional view showing a state where the connector, the holding unit, and the semiconductor package are arranged on the evaluation board unit shown in FIG. 4, FIG. 6 is a cross-sectional view showing a state before the semiconductor package is pressed against the connector, and FIG. 6 is a cross-sectional view showing a state where the semiconductor package shown in FIG.

コネクタ１を用いて半導体パッケージ２１と評価基板２２２とを電気的に接続するには、まず、図４に示すように、評価基板ユニット２２上にコネクタ１をのせる。このとき、コネクタ１の支持基板３の位置決め穴３２に評価基板ユニット２２の位置決めピン２２３を相対的に通す。 In order to electrically connect the semiconductor package 21 and the evaluation board 222 using the connector 1, first, the connector 1 is placed on the evaluation board unit 22 as shown in FIG. 4. At this time, the positioning pins 223 of the evaluation board unit 22 are relatively passed through the positioning holes 32 of the support board 3 of the connector 1.

また、評価基板２２２のパッド２２２ａとコネクタ１の導電部材５とがより精密に一致するように図示しない顕微鏡を用いて評価基板２２２に対するコネクタ１の位置を微調整する。 Further, the position of the connector 1 with respect to the evaluation board 222 is finely adjusted using a microscope (not shown) so that the pads 222a of the evaluation board 222 and the conductive member 5 of the connector 1 are more precisely matched.

その後、図５に示すように、コネクタ１が移動しないように、ソケット部材２３１の位置決め孔２３１ｂに評価基板ユニット２２の位置決めピン２２３を相対的に通し、コネクタ１をソケット部材２３１で押さえる。 Thereafter, as shown in FIG. 5, the positioning pins 223 of the evaluation board unit 22 are relatively passed through the positioning holes 231 b of the socket member 231 so that the connector 1 does not move, and the connector 1 is pressed by the socket member 231.

次に、ソケット部材２３１の収容孔２３１ａに半導体パッケージ２１を収容する。 Next, the semiconductor package 21 is accommodated in the accommodation hole 231 a of the socket member 231.

図６に示す状態では、まだ、半導体パッケージ２１は押圧されていない。 In the state shown in FIG. 6, the semiconductor package 21 is not yet pressed.

その後、ソケット部材２３１の収容孔２３１ａに図示しない固定部材の凸部を挿入し、図７の矢印で示すように、半導体パッケージ２１を押圧する。このとき固定部材はソケット部材２３１に係止される。この結果、コネクタ１の導電部材５は評価基板２２２のパッド２２２ａと半導体パッケージ２１のパッド２１ａとで圧縮され、そのときの復帰力でパッド２１ａ，２２２ａと導電部材５の両端部との間に適度な接触力が生じ、パッド２１ａ，２２２ａ間が導電部材５によって導通する。 Thereafter, a convex portion of a fixing member (not shown) is inserted into the accommodation hole 231a of the socket member 231, and the semiconductor package 21 is pressed as indicated by an arrow in FIG. At this time, the fixing member is locked to the socket member 231. As a result, the conductive member 5 of the connector 1 is compressed by the pad 222a of the evaluation board 222 and the pad 21a of the semiconductor package 21, and the return force at that time causes an appropriate gap between the pads 21a, 222a and both ends of the conductive member 5. A large contact force is generated, and the pads 21a and 222a are electrically connected by the conductive member 5.

図８は評価基板及び半導体パッケージが反っていないときの使用状態を示す断面図、図９は評価基板及び半導体パッケージが同じ方向へ反っているときの使用状態を示す概念図、図１０は評価基板及び半導体パッケージの両端部が変形しているときの使用状態を示す概念図である。 8 is a cross-sectional view showing a usage state when the evaluation board and the semiconductor package are not warped, FIG. 9 is a conceptual diagram showing a usage state when the evaluation board and the semiconductor package are warped in the same direction, and FIG. 10 is an evaluation board. It is a conceptual diagram which shows a use condition when the both ends of a semiconductor package are deform | transforming.

図８に示すように、半導体パッケージ２１及び評価基板２２２が変形していないとき、スペーサ９の高さ方向の中間位置と絶縁部材７の厚さ方向の中間位置とはほぼ一致している。このとき、複数の導電部材５の両端部はほぼ均一な力で半導体パッケージ２１及び評価基板２２２に接している。 As shown in FIG. 8, when the semiconductor package 21 and the evaluation substrate 222 are not deformed, the intermediate position in the height direction of the spacer 9 and the intermediate position in the thickness direction of the insulating member 7 substantially coincide. At this time, both ends of the plurality of conductive members 5 are in contact with the semiconductor package 21 and the evaluation substrate 222 with a substantially uniform force.

図９に示すように、半導体パッケージ２１及び評価基板２２２が同じ方向へ反っているとき、スペーサ９の高さ方向の中間位置が絶縁部材７の厚さ方向中間位置に対して上方へずれる。すなわち、スペーサ９が上方へ移動する。その結果、複数の導電部材５の両端部はほぼ均一な力で半導体パッケージ２１及び評価基板２２２に接する。 As shown in FIG. 9, when the semiconductor package 21 and the evaluation substrate 222 are warped in the same direction, the intermediate position in the height direction of the spacer 9 is shifted upward with respect to the intermediate position in the thickness direction of the insulating member 7. That is, the spacer 9 moves upward. As a result, both end portions of the plurality of conductive members 5 are in contact with the semiconductor package 21 and the evaluation substrate 222 with a substantially uniform force.

図１０に示すように、半導体パッケージ２１及び評価基板２２２の一端部が下方へ曲り、半導体パッケージ２１及び評価基板２２２の他端部が上方へ曲っているとき、一方のスペーサ９の高さ方向の中間位置は絶縁部材７の厚さ方向の中間位置に対して下方へずれ、他方のスペーサ９の高さ方向の中間位置は絶縁部材７の厚さ方向の中間位置に対して上方へずれる。その結果、複数の導電部材５の両端部はほぼ均一な力で半導体パッケージ２１及び評価基板２２２に接する。 As shown in FIG. 10, when one end of the semiconductor package 21 and the evaluation substrate 222 is bent downward and the other end of the semiconductor package 21 and the evaluation substrate 222 is bent upward, the height of one spacer 9 is increased. The intermediate position is shifted downward with respect to the intermediate position in the thickness direction of the insulating member 7, and the intermediate position in the height direction of the other spacer 9 is shifted upward with respect to the intermediate position in the thickness direction of the insulating member 7. As a result, both end portions of the plurality of conductive members 5 are in contact with the semiconductor package 21 and the evaluation substrate 222 with a substantially uniform force.

図１１は図１に示すコネクタのスペーサと半導体パッケージとの関係を示し導電部材が弾性変形したときの断面図、図１２は図１に示すコネクタのスペーサと他の種類の半導体パッケージとの関係を示し導電部材が弾性変形したときの断面図、図１３は図１に示すコネクタのスペーサと他の種類の半導体パッケージとの関係を示し導電部材が弾性変形したときの断面図である。 11 is a cross-sectional view showing the relationship between the spacer of the connector shown in FIG. 1 and the semiconductor package, and the conductive member is elastically deformed. FIG. 12 is a view showing the relationship between the spacer of the connector shown in FIG. FIG. 13 is a cross-sectional view when the conductive member is elastically deformed, and FIG. 13 is a cross-sectional view when the conductive member is elastically deformed showing the relationship between the spacer of the connector shown in FIG. 1 and another type of semiconductor package.

図１１に示す半導体パッケージ２１は図４に示す半導体パッケージ２１と同じものであり、オーガニックパッケージである。図１１に示すコネクタ１のスペーサ９の高さをＨ１とする。 The semiconductor package 21 shown in FIG. 11 is the same as the semiconductor package 21 shown in FIG. 4 and is an organic package. The height of the spacer 9 of the connector 1 shown in FIG.

図１２に示す半導体パッケージ３２１のパッド３２１ａの形状は、図１１に示す半導体パッケージ２１のパッド２１ａの形状と異なる。パッド３２１ａは球面を有し、パッド２１ａよりもやや低い。このため、半導体パッケージ３２１を接続するとき、図１１に示すスぺーサ９を用いると、導電部材５とパッド３２１ａとの間に隙間が生じてしまう。それを防ぐために、図１２に示すコネクタ１では、スペーサ９に代えてスペーサ２０９を用いている。スペーサ２０９の高さＨ２はスペーサ９の高さＨ１よりも低い。 The shape of the pad 321a of the semiconductor package 321 shown in FIG. 12 is different from the shape of the pad 21a of the semiconductor package 21 shown in FIG. The pad 321a has a spherical surface and is slightly lower than the pad 21a. For this reason, when the semiconductor package 321 is connected, if the spacer 9 shown in FIG. 11 is used, a gap is generated between the conductive member 5 and the pad 321a. In order to prevent this, a spacer 209 is used in place of the spacer 9 in the connector 1 shown in FIG. The height H2 of the spacer 209 is lower than the height H1 of the spacer 9.

図１３に示す半導体パッケージ４２１はソルダーレジスト４２１ｂを有する半導体パッケージ（オーガニックパッケージ）である。スペーサ９を用いると、パッド４２１ａと導電部材５との間に隙間が生じてしまう。それを防ぐために、図１３に示すコネクタ１では、スペーサ９に代えてスペーサ３０９を用いている。スペーサ３０９の高さＨ３はスペーサ２０９の高さＨ２よりも低い。 A semiconductor package 421 shown in FIG. 13 is a semiconductor package (organic package) having a solder resist 421b. When the spacer 9 is used, a gap is generated between the pad 421a and the conductive member 5. In order to prevent this, the connector 1 shown in FIG. 13 uses a spacer 309 instead of the spacer 9. The height H3 of the spacer 309 is lower than the height H2 of the spacer 209.

図１４は図１に示すコネクタの導電部材の荷重と変位との関係を示すグラフ、図１５は比較例のコネクタの導電部材の荷重と変位との関係を示すグラフである。この比較例のコネクタは、絶縁部材に筒状部が設けられておらず、絶縁部材の板状部に直接導電部材（導電部材５と同様のもの）が取り付けられ、しかも導電部材の両端部が絶縁部材から大きく突出している構造のコネクタである。 14 is a graph showing the relationship between the load and displacement of the conductive member of the connector shown in FIG. 1, and FIG. 15 is a graph showing the relationship between the load and displacement of the conductive member of the connector of the comparative example. In the connector of this comparative example, the insulating member is not provided with the cylindrical portion, the conductive member (similar to the conductive member 5) is directly attached to the plate-like portion of the insulating member, and both ends of the conductive member are The connector has a structure that protrudes greatly from the insulating member.

例えば、コネクタ１の使用中に、温度の上昇によって導電部材５が膨張し、その後温度の下降によって導電部材５が収縮した場合、図１４に示すように、温度上昇時の変位量Ｄにおける導電部材５のパッドに対する荷重Ｌ１の値と温度下降時の変位量Ｄにおける導電部材５のパッドに対する荷重Ｌ２の値との間にあまり大きな差がない。このことは導電部材５の変位量の変化にともなう導電部材５のパッドに対する荷重の変化のヒステリシスが小さいことを示している。したがって、第１実施形態のコネクタでは、温度変化等によって導電部材５が収縮しても、導電部材５はほぼ同じ接触力でパッドに接触し、導電部材５の接触抵抗の増加を抑制できる。この作用は比較的ヒステリシスの大きい導電部材５をヒステリシスの小さい絶縁部材５の筒状部７２で覆うことによって生じる。 For example, when the conductive member 5 expands due to an increase in temperature and the conductive member 5 contracts due to a decrease in temperature during use of the connector 1, as shown in FIG. 14, the conductive member at a displacement D when the temperature increases. There is no significant difference between the value of the load L1 for the pad No. 5 and the value of the load L2 for the pad of the conductive member 5 at the displacement D when the temperature drops. This indicates that the hysteresis of the change in the load on the pad of the conductive member 5 due to the change in the displacement amount of the conductive member 5 is small. Therefore, in the connector of the first embodiment, even if the conductive member 5 contracts due to a temperature change or the like, the conductive member 5 contacts the pad with substantially the same contact force, and an increase in contact resistance of the conductive member 5 can be suppressed. This effect is generated by covering the conductive member 5 having relatively large hysteresis with the cylindrical portion 72 of the insulating member 5 having small hysteresis.

図１５に示すように、比較例では、温度上昇時の変位量Ｄにおける導電部材５のパッドに対する荷重Ｌ３の値と温度下降時の変位量Ｄにおける導電部材５のパッドに対する荷重Ｌ４の値との間に大きな差がある。このことは導電部材５の変位量の変化にともなう導電部材５のパッドに対する荷重の変化のヒステリシスが大きいことを示している。したがって、比較例では、温度変化等によって導電部材５が収縮すると、導電部材５はほぼ同じ接触力でパッドに接触することができず、導電部材５の収縮時、導電部材５の接触抵抗が増加してしまう。 As shown in FIG. 15, in the comparative example, the value of the load L3 on the pad of the conductive member 5 at the displacement amount D when the temperature rises and the value of the load L4 on the pad of the conductive member 5 at the displacement amount D when the temperature drops. There is a big difference between them. This indicates that the hysteresis of the change in load on the pad of the conductive member 5 with the change in the displacement amount of the conductive member 5 is large. Therefore, in the comparative example, when the conductive member 5 contracts due to a temperature change or the like, the conductive member 5 cannot contact the pad with substantially the same contact force, and the contact resistance of the conductive member 5 increases when the conductive member 5 contracts. Resulting in.

以上のように、この実施形態によれば、スペーサ９が絶縁部材７にその厚さ方向へ移動可能に取り付けられているので、半導体パッケージ２１や評価基板２２２が変形していたとしても導電部材５のパッド２１ａ，２２２ａに対する接触不良を抑制できる。 As described above, according to this embodiment, since the spacer 9 is attached to the insulating member 7 so as to be movable in the thickness direction, even if the semiconductor package 21 and the evaluation substrate 222 are deformed, the conductive member 5 is used. Contact failure to the pads 21a and 222a can be suppressed.

また、絶縁部材７が導電部材５の両端部以外の部分を覆っているので、温度変化等により、導電部材５が伸縮しても、導電部材５のパッド２１ａ，２２２ａに対する接触力をほぼ一定に保つことができ、導電部材５のパッド２１ａ，２２２ａに対する接触力の低下による導電部材５の接触抵抗の増加を抑制することができる。 In addition, since the insulating member 7 covers portions other than both ends of the conductive member 5, even if the conductive member 5 expands or contracts due to a temperature change or the like, the contact force of the conductive member 5 with respect to the pads 21a and 222a is substantially constant. Thus, an increase in the contact resistance of the conductive member 5 due to a decrease in the contact force of the conductive member 5 with respect to the pads 21a and 222a can be suppressed.

更に、スペーサ９，２０９，３０９が熱伝導率の高い材料で形成されているので、スペーサ９，２０９，３０９によって半導体パッケージ２１の熱を評価基板２２２側へ放熱することができる。 Furthermore, since the spacers 9, 209, and 309 are formed of a material having high thermal conductivity, the heat of the semiconductor package 21 can be radiated to the evaluation substrate 222 side by the spacers 9, 209, and 309.

また、スペーサ９を絶縁部材７に着脱自在に設けたので、半導体パッケージの種類に応じてスペーサ９，２０９，３０９を代えることによって、色々なタイプの半導体パッケージに対応することができる。 Further, since the spacer 9 is detachably provided on the insulating member 7, various types of semiconductor packages can be handled by replacing the spacers 9, 209, and 309 depending on the type of the semiconductor package.

更に、導電部材５の両端部を除き、導電部材５は絶縁部材７によって覆われているので、導電性異物による短絡、過荷重による短絡、マイグレーションによる短絡を抑制することができ、導電性ペーストを用いるに当たり銀フィラーを利用することができる。 Furthermore, since the conductive member 5 is covered with the insulating member 7 except for both end portions of the conductive member 5, it is possible to suppress a short circuit due to conductive foreign matter, a short circuit due to overload, and a short circuit due to migration. In use, a silver filler can be used.

図１６はこの発明の第２実施形態のコネクタの一部を示す断面図である。第１実施形態と共通する部分については同一符号を付してその説明を省略する。以下、第１施形態との主な相違部分についてだけ説明する。 FIG. 16 is a cross-sectional view showing a part of the connector according to the second embodiment of the present invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

第２実施形態のコネクタ２０１の絶縁部材２０７は筒状部が無く、板状部２７１だけで構成されている。板状部２７１には複数の収容孔２７１ｃが形成されている。収容孔２７１ｃは二次元的に配列され、収容孔２７１ｃに導電部材５が収容されている。導電部材５の高さ寸法は板状部２７１の厚さ寸法よりも大きく、導電部材５の両端部は収容孔２７１ｃから突出している。 The insulating member 207 of the connector 201 according to the second embodiment has only a plate-like portion 271 without a cylindrical portion. A plurality of receiving holes 271 c are formed in the plate-like portion 271. The accommodation holes 271c are two-dimensionally arranged, and the conductive member 5 is accommodated in the accommodation holes 271c. The height dimension of the conductive member 5 is larger than the thickness dimension of the plate-like portion 271, and both end portions of the conductive member 5 protrude from the accommodation hole 271 c.

第２実施形態は第１実施形態と同様の作用効果を奏する。 The second embodiment has the same effects as the first embodiment.

図１７はこの発明の第３実施形態のコネクタの一部を示す斜視図である。第１実施形態と共通する部分については同一符号を付してその説明を省略する。以下、第１施形態との主な相違部分についてだけ説明する。 FIG. 17 is a perspective view showing a part of the connector according to the third embodiment of the present invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

第３実施形態のコネクタ３０１の絶縁部材３０７も筒状部が無く、板状部３７１だけで構成されている。板状部３７１には複数の収容孔３７１ｃが形成されている。収容孔３７１ｃは板状部３７１に二次元的に配列されている。収容孔３７１ｃの内周面は球面に形成されている。収容孔３７１ｃにはほぼ球状の導電部材３０５が収容されている。導電部材３０５の両端部は収容孔３７１ｃから突出している。 The insulating member 307 of the connector 301 of the third embodiment also has only a plate-like portion 371 without a cylindrical portion. A plurality of receiving holes 371 c are formed in the plate-like portion 371. The accommodation holes 371c are two-dimensionally arranged in the plate-like portion 371. The inner peripheral surface of the accommodation hole 371c is formed into a spherical surface. A substantially spherical conductive member 305 is accommodated in the accommodation hole 371c. Both ends of the conductive member 305 protrude from the accommodation hole 371c.

第３実施形態は第１実施形態と同様の作用効果を奏するとともに、導電部材３０５が絶縁部材３０７から抜けにくい。 The third embodiment has the same effects as those of the first embodiment, and the conductive member 305 is unlikely to come off from the insulating member 307.

図１８はこの発明の第４実施形態のコネクタの一部を示す断面図である。第１実施形態と共通する部分については同一符号を付してその説明を省略する。以下、第１施形態との主な相違部分についてだけ説明する。 FIG. 18 is a sectional view showing a part of a connector according to a fourth embodiment of the present invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

第４実施形態のコネクタ４０１の絶縁部材４０７は上部絶縁部材４０７Ａと下部絶縁部材４０７Ｂとで構成されている。 The insulating member 407 of the connector 401 according to the fourth embodiment includes an upper insulating member 407A and a lower insulating member 407B.

上部絶縁部材４０７Ａは板状部４７１Ａと複数の筒状部４７２Ａとを有する。板状部４７１Ａは支持板４０３の上面に配置されている。複数の筒状部４７２Ａは板状部４７１Ａに二次元配列されている。筒状部４７２Ａは導電部材５の上端部を除き、導電部材５の上半分を覆う。板状部４７１Ｂは支持板４０３の下面に配置されている。複数の筒状部４７２Ｂは板状部４７１Ａ側の複数の筒状部４７２Ａに対応するように板状部４７１Ｂに二次元配列されている。筒状部４７２Ｂは導電部材５の下端部を除き、導電部材５の下半分を覆う。上部絶縁部材４０７Ａと下部絶縁部材４０７Ｂとは後述する孔４３３に収容された結合部（図示せず）によって結合されている。 The upper insulating member 407A has a plate-like portion 471A and a plurality of cylindrical portions 472A. The plate-like portion 471A is disposed on the upper surface of the support plate 403. The plurality of cylindrical portions 472A are two-dimensionally arranged on the plate-like portion 471A. The cylindrical portion 472A covers the upper half of the conductive member 5 except for the upper end portion of the conductive member 5. The plate-like portion 471B is disposed on the lower surface of the support plate 403. The plurality of cylindrical portions 472B are two-dimensionally arranged on the plate-like portion 471B so as to correspond to the plurality of cylindrical portions 472A on the plate-like portion 471A side. The cylindrical portion 472 B covers the lower half of the conductive member 5 except for the lower end portion of the conductive member 5. The upper insulating member 407A and the lower insulating member 407B are coupled by a coupling portion (not shown) accommodated in a hole 433 described later.

支持基板４０３には筒状部４７２Ａ，４７２Ｂに対応する複数の孔４３３が形成されている。孔４３３には導電部材５が通される。 A plurality of holes 433 corresponding to the cylindrical portions 472A and 472B are formed in the support substrate 403. The conductive member 5 is passed through the hole 433.

第４実施形態は第１実施形態と同様の作用効果を奏する。 The fourth embodiment has the same operational effects as the first embodiment.

図１９はこの発明の第５実施形態のコネクタの一部を示す断面図である。第１実施形態と第４実施形態とに共通する部分については同一符号を付してその説明を省略する。以下、第１施形態と第４実施形態との主な相違部分についてだけ説明する。 FIG. 19 is a sectional view showing a part of a connector according to a fifth embodiment of the present invention. Portions common to the first embodiment and the fourth embodiment are denoted by the same reference numerals and description thereof is omitted. Hereinafter, only the main differences between the first embodiment and the fourth embodiment will be described.

第５実施形態のコネクタ５０１の絶縁部材５０７は上部絶縁部材５０７Ａと下部絶縁部材５０７Ｂとで構成されている。 The insulating member 507 of the connector 501 of the fifth embodiment includes an upper insulating member 507A and a lower insulating member 507B.

上部絶縁部材５０７Ａは板状部５７１Ａだけで構成されている。板状部５７１Ａは支持板４０３の上面に配置されている。板状部５７１Ａは複数の収容孔５７１Ａｃを有する。収容孔５７１Ａｃは板状部５７１Ａに二次元配列されている。収容孔５７１Ａｃは導電部材５の上端部を除き、導電部材５の上半分を収容する。 The upper insulating member 507A is composed of only a plate-like portion 571A. The plate-like portion 571 A is disposed on the upper surface of the support plate 403. The plate-like portion 571A has a plurality of accommodation holes 571Ac. The accommodation holes 571Ac are two-dimensionally arranged in the plate-like portion 571A. The accommodation hole 571Ac accommodates the upper half of the conductive member 5 except for the upper end portion of the conductive member 5.

下部絶縁部材５０７Ｂは板状部５７１Ｂだけで構成されている。板状部５７１Ｂは支持板４０３の下面に配置されている。板状部５７１Ｂは複数の収容孔５７１Ｂｃを有する。収容孔５７１Ｂｃは板状部５７１Ａ側の複数の収容孔５７１Ａｃに対応するように板状部５７１Ｂに二次元配列されている。収容孔５７１Ｂｃは導電部材５の下端部を除き、導電部材５の下半分を収容する。上部絶縁部材５０７Ａと下部絶縁部材５０７Ｂとは支持基板４０３の孔４３３に収容された結合部（図示せず）によって結合されている。 The lower insulating member 507B is composed of only a plate-like portion 571B. The plate-like portion 571B is disposed on the lower surface of the support plate 403. The plate-like portion 571B has a plurality of accommodation holes 571Bc. The accommodation holes 571Bc are two-dimensionally arranged in the plate-like portion 571B so as to correspond to the plurality of accommodation holes 571Ac on the plate-like portion 571A side. The accommodation hole 571 Bc accommodates the lower half of the conductive member 5 except for the lower end portion of the conductive member 5. The upper insulating member 507A and the lower insulating member 507B are coupled by a coupling portion (not shown) accommodated in the hole 433 of the support substrate 403.

第５実施形態は第１実施形態と同様の作用効果を奏する。 The fifth embodiment has the same effects as the first embodiment.

図２０はこの発明の第６実施形態のコネクタの一部を示す斜視図、図２１は図２０に示すコネクタの一部を示す断面図である。第１実施形態と共通する部分については同一符号を付してその説明を省略する。以下、第１施形態との主な相違部分についてだけ説明する。 20 is a perspective view showing a part of a connector according to a sixth embodiment of the present invention, and FIG. 21 is a cross-sectional view showing a part of the connector shown in FIG. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

第６実施形態のコネクタでは、複数の絶縁部材６０７が支持基板４０３に支持されている。 In the connector of the sixth embodiment, a plurality of insulating members 607 are supported on the support substrate 403.

絶縁部材６０７はほぼ円筒状であり、上部筒状部６７２Ａと下部筒状部６７２Ｂとで構成されている。 The insulating member 607 is substantially cylindrical and includes an upper cylindrical portion 672A and a lower cylindrical portion 672B.

上部筒状部６７２Ａは支持板４０３の上面に配置されている。上部筒状部６７２Ａは導電部材５の上端部を除き、導電部材５の上半分を収容する。 The upper cylindrical portion 672A is disposed on the upper surface of the support plate 403. The upper cylindrical portion 672A accommodates the upper half of the conductive member 5 except for the upper end portion of the conductive member 5.

下部筒状部６７２Ｂは支持板４０３の下面に配置されている。下部筒状部６７２Ｂは導電部材５の下端部を除き、導電部材５の下半分を収容する。 The lower cylindrical portion 672B is disposed on the lower surface of the support plate 403. The lower cylindrical portion 672B accommodates the lower half of the conductive member 5 except for the lower end portion of the conductive member 5.

上部筒状部６７２Ａと下部筒状部６７２Ｂとは支持基板４０３の孔４３３に収容された結合部（図示せず）によって結合されている。 The upper cylindrical portion 672A and the lower cylindrical portion 672B are coupled by a coupling portion (not shown) accommodated in the hole 433 of the support substrate 403.

第６実施形態は第１実施形態と同様の作用効果を奏する。 The sixth embodiment has the same operational effects as the first embodiment.

図２２はこの発明の第７実施形態のコネクタの一部を示す断面図である。第１実施形態と共通する部分については同一符号を付してその説明を省略する。以下、第１施形態との主な相違部分についてだけ説明する。 FIG. 22 is a sectional view showing a part of a connector according to a seventh embodiment of the present invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

第７実施形態のコネクタでは、複数の絶縁部材７０７が支持基板４０３に支持されている。 In the connector of the seventh embodiment, a plurality of insulating members 707 are supported on the support substrate 403.

絶縁部材７０７はほぼ円筒状であり、上部筒状部７７２Ａと下部筒状部７７２Ｂとで構成されている。 The insulating member 707 is substantially cylindrical and includes an upper cylindrical portion 772A and a lower cylindrical portion 772B.

上部筒状部７７２Ａは支持板４０３の上面に配置されている。上部筒状部７７２Ａは薄肉部７７２Ａａと厚肉部７７２Ａｂとを有する。上部筒状部７７２Ａは導電部材５の上端部を除き、導電部材５の上半分を収容する。 The upper cylindrical portion 772A is disposed on the upper surface of the support plate 403. The upper cylindrical portion 772A has a thin portion 772Aa and a thick portion 772Ab. The upper cylindrical portion 772 A accommodates the upper half of the conductive member 5 except for the upper end portion of the conductive member 5.

下部筒状部７７２Ｂは支持板４０３の下面に配置されている。下部筒状部７７２Ｂは薄肉部７７２Ｂａと厚肉部７７２Ｂｂとを有する。下部筒状部７７２Ｂは導電部材５の下端部を除き、導電部材５の下半分を収容する。 The lower cylindrical portion 772B is disposed on the lower surface of the support plate 403. The lower cylindrical portion 772B has a thin portion 772Ba and a thick portion 772Bb. The lower cylindrical portion 772B accommodates the lower half of the conductive member 5 except for the lower end portion of the conductive member 5.

上部筒状部７７２Ａと下部筒状部７７２Ｂとは支持基板４０３の孔４３３に収容された結合部（図示せず）によって結合されている。 Upper cylindrical portion 772A and lower cylindrical portion 772B are coupled by a coupling portion (not shown) accommodated in hole 433 of support substrate 403.

第７実施形態は第１実施形態と同様の作用効果を奏するとともに、薄肉部７７２Ａａ，７７２Ｂａを有するので、より低荷重で接続することができる。 The seventh embodiment has the same operational effects as the first embodiment, and has the thin portions 772Aa and 772Ba, and therefore can be connected with a lower load.

図２３はこの発明の第８実施形態のコネクタの一部を示す断面図である。第１実施形態と共通する部分については同一符号を付してその説明を省略する。以下、第１施形態との主な相違部分についてだけ説明する。 FIG. 23 is a sectional view showing a part of a connector according to an eighth embodiment of the present invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

第８実施形態のコネクタでは、複数の絶縁部材８０７が支持基板８０３に支持されている。 In the connector of the eighth embodiment, a plurality of insulating members 807 are supported on the support substrate 803.

絶縁部材８０７はほぼ円筒状であり、上部筒状部８７２Ａと下部筒状部８７２Ｂとで構成されている。 The insulating member 807 is substantially cylindrical and includes an upper cylindrical portion 872A and a lower cylindrical portion 872B.

上部筒状部８７２Ａは支持板８０３の上面に配置されている。上部筒状部８７２Ａは導電部材５の上端部を除き、導電部材５の上半分を収容する。 The upper cylindrical portion 872A is disposed on the upper surface of the support plate 803. The upper cylindrical portion 872 A accommodates the upper half of the conductive member 5 except for the upper end portion of the conductive member 5.

下部筒状部８７２Ｂは支持板８０３の下面に配置されている。下部筒状部８７２Ｂは導電部材５の下端部を除き、導電部材５の下半分を収容する。 The lower cylindrical portion 872B is disposed on the lower surface of the support plate 803. The lower cylindrical portion 872B accommodates the lower half of the conductive member 5 except for the lower end portion of the conductive member 5.

支持基板８０３には複数の孔８３３が二次元配列されている。導電部材５は孔８３３に通されるとともに孔８３３に保持される。したがって、この実施形態では、支持基板８０３は絶縁性を有する材料で形成されている。 A plurality of holes 833 are two-dimensionally arranged in the support substrate 803. The conductive member 5 is passed through the hole 833 and held in the hole 833. Therefore, in this embodiment, the support substrate 803 is formed of an insulating material.

第８実施形態は第１実施形態と同様の作用効果を奏する。 The eighth embodiment has the same operational effects as the first embodiment.

なお、上述の第１〜第８実施形態のコネクタは支持基板３，４０３，８０３を備えているが、支持基板３，４０３，８０３を省略することもできる。 In addition, although the connector of the above-mentioned 1st-8th embodiment is provided with the support substrates 3,403,803, the support substrates 3,403,803 can also be abbreviate | omitted.

また、上述の実施形態では、スペーサ９は絶縁部材７〜８０７にその厚み方向へ移動可能に設けられているが、支持基板３，４０３，８０３にスペーサ９を移動可能に設けてもよい。 In the above-described embodiment, the spacer 9 is provided on the insulating members 7 to 807 so as to be movable in the thickness direction. However, the spacer 9 may be provided on the support substrates 3, 403 and 803 so as to be movable.

なお、上述の実施形態のコネクタ１〜８０１は半導体パッケージ２１と評価基板２２２とを電気的に接続するものであるが、この発明のコネクタの接続対象物はこれらに限られない。 In addition, although the connectors 1-801 of the above-mentioned embodiment electrically connect the semiconductor package 21 and the evaluation board | substrate 222, the connection target object of the connector of this invention is not restricted to these.

図１はこの発明の第１実施形態のコネクタの斜視図である。FIG. 1 is a perspective view of a connector according to a first embodiment of the present invention. 図２は図１に示すコネクタのＡ部の拡大図である。FIG. 2 is an enlarged view of a portion A of the connector shown in FIG. 図３は図１に示すコネクタの一部の断面図である。FIG. 3 is a cross-sectional view of a part of the connector shown in FIG. 図４は図１に示すコネクタ、評価基板ユニット、押さえユニット及び半導体パッケージの断面図である。4 is a cross-sectional view of the connector, the evaluation board unit, the holding unit, and the semiconductor package shown in FIG. 図５は図４に示す評価基板ユニット上にコネクタ、押さえユニット及び半導体パッケージを配置した状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state in which a connector, a holding unit, and a semiconductor package are arranged on the evaluation board unit shown in FIG. 図６は半導体パッケージをコネクタに押圧する前の状態を示す断面図である。FIG. 6 is a cross-sectional view showing a state before the semiconductor package is pressed against the connector. 図７は図６に示す半導体パッケージをコネクタに押圧した状態を示す断面図である。FIG. 7 is a cross-sectional view showing a state where the semiconductor package shown in FIG. 6 is pressed against the connector. 図８は評価基板及び半導体パッケージが反っていないときの使用状態を示す断面図である。FIG. 8 is a cross-sectional view showing a use state when the evaluation substrate and the semiconductor package are not warped. 図９は評価基板及び半導体パッケージが同じ方向へ反っているときの使用状態を示す概念図である。FIG. 9 is a conceptual diagram showing a use state when the evaluation board and the semiconductor package are warped in the same direction. 図１０は評価基板及び半導体パッケージの両端部が変形しているときの使用状態を示す概念図である。FIG. 10 is a conceptual diagram showing a use state when both ends of the evaluation substrate and the semiconductor package are deformed. 図１１は図１に示すコネクタのスペーサと半導体パッケージとの関係を示す断面図である。FIG. 11 is a cross-sectional view showing the relationship between the spacer of the connector shown in FIG. 1 and the semiconductor package. 図１２は図１に示すコネクタのスペーサと他の種類の半導体パッケージとの関係を示す断面図である。12 is a cross-sectional view showing the relationship between the spacer of the connector shown in FIG. 1 and another type of semiconductor package. 図１３は図１に示すコネクタのスペーサと他の種類の半導体パッケージとの関係を示す断面図である。FIG. 13 is a cross-sectional view showing the relationship between the spacer of the connector shown in FIG. 1 and another type of semiconductor package. 図１４は図１に示すコネクタの導電部材の荷重と変位との関係を示すグラフである。FIG. 14 is a graph showing the relationship between the load and displacement of the conductive member of the connector shown in FIG. 図１５は比較例のコネクタの導電部材の荷重と変位との関係を示すグラフである。FIG. 15 is a graph showing the relationship between the load and displacement of the conductive member of the connector of the comparative example. 図１６はこの発明の第２実施形態のコネクタの一部を示す断面図である。FIG. 16 is a cross-sectional view showing a part of the connector according to the second embodiment of the present invention. 図１７はこの発明の第３実施形態のコネクタの斜視図である。FIG. 17 is a perspective view of a connector according to a third embodiment of the present invention. 図１８はこの発明の第４実施形態のコネクタの一部を示す断面図である。FIG. 18 is a sectional view showing a part of a connector according to a fourth embodiment of the present invention. 図１９はこの発明の第５実施形態のコネクタの一部を示す断面図である。FIG. 19 is a sectional view showing a part of a connector according to a fifth embodiment of the present invention. 図２０はこの発明の第６実施形態のコネクタの斜視図である。FIG. 20 is a perspective view of a connector according to a sixth embodiment of the present invention. 図２１は図２０に示すコネクタの一部を示す断面図である。21 is a cross-sectional view showing a part of the connector shown in FIG. 図２２はこの発明の第７実施形態のコネクタの一部を示す断面図である。FIG. 22 is a sectional view showing a part of a connector according to a seventh embodiment of the present invention. 図２３はこの発明の第８実施形態のコネクタの一部を示す断面図である。FIG. 23 is a sectional view showing a part of a connector according to an eighth embodiment of the present invention.

符号の説明Explanation of symbols

１，２０１，３０１，４０１，５０１，６０１，７０１，８０１コネクタ（電気接続装置）
３，４０３，８０３支持基板
３１窓孔（孔）
４３３，８３３孔
５導電部材
７，２０７，３０７，４０７，５０７，６０７，７０７，８０７絶縁部材
７２，４７２Ａ，４７２Ｂ筒状部（被覆部）
６７２Ａ，７７２Ａ，８７２Ｂ上部筒状部（被覆部）
６７２Ｂ，７７２Ｂ，８７２Ｂ下部筒状部（被覆部）
９，２０９，３０９スペーサ（距離調整部材）
２１，３２１，４２１半導体パッケージ（接続対象物）
２１ａ，３２１ａ，４２１ａパッド（接続部）
２２２評価基板
２２２ａパッド（接続部） 1,201,301,401,501,601,701,801 Connector (electrical connection device)
3,403,803 Support substrate 31 Window hole (hole)
433, 833 Hole 5 Conductive member 7,207,307,407,507,607,707,807 Insulating member 72,472A, 472B Cylindrical part (covering part)
672A, 772A, 872B Upper cylindrical part (covering part)
672B, 772B, 872B Lower cylindrical part (covering part)
9, 209, 309 Spacer (Distance adjustment member)
21,321,421 Semiconductor package (object to be connected)
21a, 321a, 421a Pad (connection part)
222 Evaluation board 222a Pad (connection part)

Claims

それぞれ複数の接続部を有する２つの接続対象物間に配置される絶縁部材と、
前記絶縁部材に保持され、前記２つの接続対象物の接続部同士を導通させる弾性変形可能な複数の導電部材と、
前記２つの接続対象物間の距離を調整する複数の距離調整部材とを備え、
前記複数の距離調整部材は、それぞれ独立して前記絶縁部材の厚み方向へ移動可能に前記絶縁部材に取り付けられている
ことを特徴とする電気接続装置。 An insulating member disposed between two connection objects each having a plurality of connection portions;
A plurality of elastically deformable conductive members that are held by the insulating member and electrically connect the connecting portions of the two connection objects;
And a plurality of length adjusting member for adjusting the distance between the front SL two connection object,
The plurality of distance adjusting members are attached to the insulating member so as to be independently movable in the thickness direction of the insulating member .

前記距離調整部材が、前記絶縁部材に対して着脱可能である
ことを特徴とする請求項１記載の電気接続装置。 The electrical connection device according to claim 1, wherein the distance adjusting member is detachable from the insulating member.

前記絶縁部材が弾性を有し、前記絶縁部材が、板状部と、この板状部に直交するように設けられ、前記導電部材の両端部以外の部分の外周面を覆う筒状の被覆部とを有する
ことを特徴とする請求項１又は２記載の電気接続装置。 The said insulating member has elasticity, the said insulating member is provided so that it may orthogonally cross a plate-shaped part and this plate-shaped part, and the cylindrical coating | coated part which covers the outer peripheral surface of parts other than the both ends of the said electrically-conductive member DOO electrical connecting device according to claim 1 or 2, wherein the having.

前記導電部材が、所定の材料で柱状に形成され、
前記距離調整部材が、柱状に形成された前記導電部材の材料よりも縦弾性係数が大きい材料で柱状に形成されている
ことを特徴とする請求項１〜３のいずれか１項記載の電気接続装置。 The conductive member is formed in a column shape with a predetermined material,
The electrical connection according to any one of claims 1 to 3, wherein the distance adjusting member is formed in a column shape with a material having a longitudinal elastic modulus larger than that of the material of the conductive member formed in a column shape. apparatus.

耐引張性が高く熱膨張係数が低い材料で形成され、前記絶縁部材を支持する支持基板を備え、
前記絶縁部材を配置する孔が、前記支持基板に形成されている
ことを特徴とする請求項１〜４のいずれか１項記載の電気接続装置。 Formed of a material having a high tensile resistance and a low coefficient of thermal expansion, comprising a support substrate for supporting the insulating member;
The electrical connection device according to claim 1, wherein a hole for arranging the insulating member is formed in the support substrate.

それぞれ複数の接続部を有する２つの接続対象物間に配置される支持基板と、
前記２つの接続対象物の接続部同士を導通させる弾性変形可能な複数の導電部材と、
前記支持基板に支持され、前記導電部材を保持する絶縁部材と、
前記２つの接続対象物間の距離を調整する複数の距離調整部材とを備え、
前記複数の距離調整部材は、それぞれ独立して前記支持基板の厚み方向へ移動可能に前記支持基板又は前記絶縁部材に取り付けられている
ことを特徴とする電気接続装置。 A support substrate disposed between two connection objects each having a plurality of connection portions;
A plurality of elastically deformable conductive members that electrically connect the connection portions of the two connection objects;
An insulating member supported by the support substrate and holding the conductive member;
And a plurality of length adjusting member for adjusting the distance between the front SL two connection object,
The plurality of distance adjusting members are attached to the support substrate or the insulating member so as to be independently movable in the thickness direction of the support substrate .

前記距離調整部材が、前記支持基板又は前記絶縁部材に対して着脱可能である
ことを特徴とする請求項６記載の電気接続装置。 The electrical connection device according to claim 6, wherein the distance adjusting member is detachable from the support substrate or the insulating member.

前記絶縁部材が弾性を有し、前記絶縁部材が、板状部と、この板状部に直交するように設けられ、前記導電部材の両端部以外の部分の外周面を覆う筒状の被覆部とを有する
ことを特徴とする請求項６又は７記載の電気接続装置。 The said insulating member has elasticity, the said insulating member is provided so that it may orthogonally cross a plate-shaped part and this plate-shaped part, and the cylindrical coating | coated part which covers the outer peripheral surface of parts other than the both ends of the said electrically-conductive member DOO electrical connecting device according to claim 6 or 7, wherein the having.

前記支持基板が、耐引張性が高く熱膨張係数が低い材料で形成され、
前記絶縁部材を配置する孔が、前記支持基板に形成されている
ことを特徴とする請求項６〜８のいずれか１項記載の電気接続装置。 The support substrate is formed of a material having a high tensile resistance and a low coefficient of thermal expansion;
The electrical connection device according to claim 6, wherein a hole in which the insulating member is disposed is formed in the support substrate.

前記距離調整部材が、前記導電部材の材料よりも熱伝導率の高い材料で形成されている
ことを特徴とする請求項１〜９のいずれか１項記載の電気接続装置。 The electrical connection device according to claim 1, wherein the distance adjusting member is formed of a material having higher thermal conductivity than the material of the conductive member.