JP5052819B2 - Electronic component element connection structure - Google Patents

Electronic component element connection structure Download PDF

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JP5052819B2
JP5052819B2 JP2006126940A JP2006126940A JP5052819B2 JP 5052819 B2 JP5052819 B2 JP 5052819B2 JP 2006126940 A JP2006126940 A JP 2006126940A JP 2006126940 A JP2006126940 A JP 2006126940A JP 5052819 B2 JP5052819 B2 JP 5052819B2
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electronic component
component element
mounting pattern
external electrode
electrode material
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JP2007300416A (en
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文生 藤崎
陽 三浦
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Kyocera Crystal Device Corp
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Description

本発明は、携帯用通信機器等の電子機器に用いられる圧電デバイスに搭載する電子部品素子の接続構造に関するものである。   The present invention relates to a connection structure for electronic component elements mounted on a piezoelectric device used in an electronic device such as a portable communication device.

かかる従来の圧電デバイスとしては、水晶基板の両主面に振動電極が形成された水晶振動素子２２と、該水晶振動素子２２と接続して発振回路を構成する集積回路素子２３及び電子部品素子２４と、前記水晶振動素子２２及び前記集積回路素子２３、電子部品素子２４を収容する容器体２１を封止するための蓋体２５から成る。
このとき、図６に示すように、電子部品素子の接続構造は、前記電子部品素子２４を搭載するための搭載パターンが、前記電子部品素子２４の外部電極面に対応する箇所に設けられている。 As such a conventional piezoelectric device, a crystal resonator element 22 having vibration electrodes formed on both main surfaces of a crystal substrate, an integrated circuit element 23 and an electronic component element 24 that are connected to the crystal resonator element 22 and constitute an oscillation circuit. And a lid 25 for sealing the container body 21 that houses the crystal resonator element 22, the integrated circuit element 23, and the electronic component element 24.
At this time, as shown in FIG. 6, in the electronic component element connection structure, the mounting pattern for mounting the electronic component element 24 is provided at a location corresponding to the external electrode surface of the electronic component element 24. .

特開平１０−０７５１２０号公報 なお出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。The applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

しかしながら、従来の電子部品素子の接続構造において、鉛フリー半田の使用により客先でのリフロー実装温度が高くなる傾向がみられ、従来の圧電デバイスにおいては、前記電子部品素子は前記容器体の搭載パターンと導電性接着剤により機械的及び電気的に接続されている場合、前記電子部品素子の外部電極材が溶融し、前記搭載パターンに接触している箇所から溶融した前記外部電極材が流れ、すでに硬化されている導電性接着剤と前記搭載パターンの間に流れ出た前記外部電極材分の間隙ができるので、接続強度が劣化してしまうといった欠点があった。   However, in the conventional electronic component element connection structure, the use of lead-free solder tends to increase the reflow mounting temperature at the customer. In the conventional piezoelectric device, the electronic component element is mounted on the container body. When the pattern and the conductive adhesive are mechanically and electrically connected, the external electrode material of the electronic component element is melted, and the melted external electrode material flows from the place in contact with the mounting pattern, Since a gap corresponding to the external electrode material that has flowed out between the already cured conductive adhesive and the mounting pattern is formed, there is a drawback in that the connection strength deteriorates.

また、前記電子部品素子の外部電極材が溶融し、流れ出した外部電極材が外部電極間で接触し、短絡を起こしてしまうといった欠点があった。   In addition, the external electrode material of the electronic component element is melted, and the external electrode material that has flowed out contacts between the external electrodes, causing a short circuit.

本発明は上記欠点に鑑み案出されたもので、その目的は、前記電子部品素子の接続強度を維持すると共に、外部電極間における短絡を防止することができる電子部品素子の接続構造を提供することにある。   The present invention has been devised in view of the above drawbacks, and an object thereof is to provide an electronic component element connection structure capable of maintaining the connection strength of the electronic component element and preventing a short circuit between external electrodes. There is.

本発明の電子部品素子の接続構造において、配線基板には、長さ方向の両端部の外周面に外部電極材が設けられたチップ型の電子部品素子を搭載するための搭載パターンが形成されており、前記電子部品素子を前記搭載パターンと接続されてなる電子部品素子の接続構造において、該搭載パターンは、該電子部品素子を搭載した際に該外部電極材と接触しない位置に設けられており、該外部電極材は、導電性接着剤を介してのみ、該搭載パターンと接続しており、該搭載パターン内には搭載パターン除去部が設けられており、該搭載パターン除去部の外周の大きさは、該電子部品素子を搭載した際に該電子部品素子の下面となる面に設けられた該外部電極材の大きさよりも大きく形成されており、該電子部品素子は、該外部電極材が該搭載パターン除去部内に位置するように配置されていることを特徴とするものである。 In the electronic component element connection structure of the present invention, a mounting pattern for mounting a chip-type electronic component element in which external electrode materials are provided on the outer peripheral surfaces of both end portions in the length direction is formed on the wiring board. In the electronic component element connection structure in which the electronic component element is connected to the mounting pattern, the mounting pattern is provided at a position that does not contact the external electrode material when the electronic component element is mounted. The external electrode material is connected to the mounting pattern only through a conductive adhesive , and a mounting pattern removal portion is provided in the mounting pattern, and the outer circumference of the mounting pattern removal portion is large. Is formed larger than the size of the external electrode material provided on the lower surface of the electronic component element when the electronic component element is mounted. The mounted pad And it is characterized in that it is arranged to be positioned over emissions removal portion.

本発明の電子部品素子の接続構造によれば、前記電子部品素子を搭載するために、前記容器体に設けられた搭載パターンを前記電子部品素子の外部電極材が接触しない箇所に配置する。そうすることで、母基板に鉛フリー半田を用いて前記圧電デバイスを実装する際に、実装時の温度が高くなり前記電子部品素子の外部電極材が溶融しても、前記搭載パターンに接触している箇所がないので、溶融した前記外部電極材が流れ、すでに硬化された導電性接着剤と搭載パターンの間に間隙ができることを防止し、接続強度を維持することが可能となる。   According to the electronic component element connection structure of the present invention, in order to mount the electronic component element, the mounting pattern provided on the container body is disposed at a location where the external electrode material of the electronic component element does not contact. By doing so, when mounting the piezoelectric device using lead-free solder on the mother board, even if the temperature at the time of mounting becomes high and the external electrode material of the electronic component element melts, it contacts the mounting pattern. Therefore, it is possible to prevent the melted external electrode material from flowing and create a gap between the already cured conductive adhesive and the mounting pattern, and maintain the connection strength.

また、本発明の電子部品素子の接続構造によれば、前記電子部品素子を搭載するために、前記容器体に設けられた搭載パターン内に除去部が設けられていることによって、母基板に実装する際に鉛フリー半田を用いることにより、客先の使用温度が高くなり、前記電子部品素子の外部電極材が溶融しても、前記電子部品素子の接続電極面の対向する位置に前記除去部が形成されているので、前記搭載パターンに接触している箇所がなく、溶融した前記外部電極材が流れることを防止する。
よって、硬化した導電性接着剤との間に間隙ができることを防止し、接続強度を維持することが可能となる。 Further, according to the electronic component element connection structure of the present invention, the electronic component element is mounted on the mother board by providing the removal portion in the mounting pattern provided in the container body in order to mount the electronic component element. When the lead-free solder is used, the use temperature of the customer is increased, and even if the external electrode material of the electronic component element is melted, the removal portion is located at a position facing the connection electrode surface of the electronic component element. Therefore, there is no portion in contact with the mounting pattern, and the molten external electrode material is prevented from flowing.
Therefore, it is possible to prevent a gap from being formed between the cured conductive adhesive and maintain the connection strength.

以下、本発明を添付図面に基づいて詳細に説明する。
図１は本発明の一実施形態に係る圧電デバイスの斜視図、図２は図１の圧電デバイスの断面図であり、これらの図に示す圧電デバイスは、大略的に、容器体１と、圧電振動素子としての水晶振動素子５と、発振回路および周波数調整用回路としての集積回路素子６と電子部品素子７で構成されている。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view of a piezoelectric device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the piezoelectric device of FIG. 1. The piezoelectric device shown in these drawings is roughly composed of a container body 1 and a piezoelectric device. It comprises a crystal resonator element 5 as a resonator element, an integrated circuit element 6 and an electronic component element 7 as an oscillation circuit and a frequency adjusting circuit.

圧電デバイスの１つとして、電圧制御水晶発振器（ＶＣＸＯ）が挙げられる。電圧制御水晶発振器は、外部制御電圧により、出力周波数を可変する機能を付加したものであり、水晶振動素子５に直列に可変容量ダイオードを接続し、容量を変化させることによって周波数を可変させる。   One example of a piezoelectric device is a voltage controlled crystal oscillator (VCXO). The voltage controlled crystal oscillator is provided with a function of changing the output frequency by an external control voltage. A variable capacitance diode is connected in series to the crystal resonator element 5 and the frequency is changed by changing the capacitance.

容器体１は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料から成る容器体１と、４２アロイやコバール，リン青銅等の金属から成る蓋体４とから成り、容器体１の外周壁の上面に、タングステン（Ｗ）、モリブデン（Ｍｏ）等のメタライズ層を形成し、メタライズ層の上面には、ニッケル（Ｎｉ）、金（Ａｕ）をメッキした封止用導体パターン３が設けられ、封止用導体パターン３の上面に蓋体４を載置・固定させることによって容器体１が構成されており、容器体１の内側に形成された第１のキャビティ８に水晶振動素子５及び集積回路素子６が実装され、第２のキャビティ９には、電子部品素子７が実装されている。   The container body 1 is composed of, for example, a container body 1 made of a ceramic material such as glass-ceramic or alumina ceramic, and a lid body 4 made of a metal such as 42 alloy, Kovar, or phosphor bronze. A metallized layer of tungsten (W), molybdenum (Mo) or the like is formed on the upper surface, and a sealing conductor pattern 3 plated with nickel (Ni) or gold (Au) is provided on the upper surface of the metallized layer. The container body 1 is configured by placing and fixing the lid body 4 on the upper surface of the stopping conductor pattern 3, and the crystal resonator element 5 and the integrated circuit are formed in the first cavity 8 formed inside the container body 1. An element 6 is mounted, and an electronic component element 7 is mounted in the second cavity 9.

一方、容器体１の内部に収容される水晶振動素子５は、所定の結晶軸でカットした水晶片の両主面に一対の振動電極を被着・形成してなり、外部からの変動電圧が一対の励振用電極を介して水晶片に印加されると、所定の周波数で厚みすべり振動を起こす。
また、水晶片には、凹部が形成されており、凹部には、励振用電極が形成されている逆メサ型の水晶振動素子５と言うものがあり、高周波用として使用されている。
このような形状に加工した水晶片に、圧電振動領域部の凹部に励振用電極と、この励振用電極から接続部を介して引き出した引出電極と、接続部の外周辺のうち一辺の表裏縁部近傍に形成した引出電極と電気的に接続した容器接続用電極とを形成することで水晶振動素子５を形成している。 On the other hand, the quartz resonator element 5 housed in the container body 1 is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis, and a fluctuation voltage from the outside is generated. When applied to a quartz crystal piece via a pair of excitation electrodes, a thickness shear vibration occurs at a predetermined frequency.
Further, the quartz piece has a concave portion, and the concave portion includes a reverse mesa type quartz vibrating element 5 in which an excitation electrode is formed, and is used for a high frequency.
A quartz piece processed into such a shape, an excitation electrode in the recess of the piezoelectric vibration region portion, an extraction electrode drawn from the excitation electrode through the connection portion, and the front and back edges of one side of the outer periphery of the connection portion The crystal resonator element 5 is formed by forming the extraction electrode formed in the vicinity of the portion and the container connection electrode electrically connected.

水晶振動素子５は、一対の振動電極に対し導電性接着剤１０を介して基板上面の対応する搭載パッドに電気的に接続させることによって容器体１の上面に搭載され、これによって水晶振動素子５と容器体１との電気的接続及び機械的接続が同時になされる。   The quartz resonator element 5 is mounted on the upper surface of the container body 1 by electrically connecting the pair of vibrating electrodes to a corresponding mounting pad on the upper surface of the substrate via the conductive adhesive 10, thereby the quartz resonator element 5. Electrical connection and mechanical connection between the container body 1 and the container body 1 are made at the same time.

導電性接着剤１０は、シリコーン樹脂の中に導電性フィラーが含有されているものであり、導電性粉末としては、アルミニウム（Ａｌ）、モリブデン（Ｍｏ）、タングステン（Ｗ）、白金（Ｐｔ）、パラジウム（Ｐｄ）、銀（Ａｇ）、チタン（Ｔｉ）、ニッケル（Ｎｉ）、ニッケル鉄（ＮｉＦｅ）、またはこれらの組み合わせを含むものが用いられている。   The conductive adhesive 10 contains a conductive filler in a silicone resin, and examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten (W), platinum (Pt), Palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used.

また蓋体４は従来周知の金属加工法を採用し、４２アロイ等の金属を所定形状に成形することによって製作され、蓋体４の上面には、ニッケル（Ｎｉ）層が形成され、更にニッケル（Ｎｉ）層の上面の封止用導体パターン３に対応する箇所に封止部材２である金錫（Ａｕ−Ｓｎ）層が形成される。金錫（Ａｕ−Ｓｎ）層の厚みは、１０μｍ〜４０μｍである。例えば、成分比率が、金が８０％、錫が２０％のものが使用されている。
また、このような封止部材２は、封止用導体パターン３の凹凸を緩和し、気密性の低下を防ぐことが可能となる。また、封止部材２が薄すぎると当該機能を充分に発揮しない。 The lid 4 is manufactured by adopting a conventionally well-known metal processing method and molding a metal such as 42 alloy into a predetermined shape, and a nickel (Ni) layer is formed on the upper surface of the lid 4. A gold-tin (Au—Sn) layer as the sealing member 2 is formed at a position corresponding to the sealing conductor pattern 3 on the upper surface of the (Ni) layer. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin.
Moreover, such a sealing member 2 can relieve unevenness of the sealing conductor pattern 3 and prevent a decrease in hermeticity. Moreover, if the sealing member 2 is too thin, the function is not sufficiently exhibited.

集積回路素子６は、容器体１の上面に形成されている電極と上面に形成された電極とをワイヤーボンディング法等で接続しているものであり、その回路形成面に、発振出力を生成する発振回路等が設けられており、発振回路で生成された発振出力は、例えば、クロック信号等の基準信号として利用される。   The integrated circuit element 6 is formed by connecting an electrode formed on the upper surface of the container body 1 and an electrode formed on the upper surface by a wire bonding method or the like, and generates an oscillation output on the circuit forming surface. An oscillation circuit or the like is provided, and the oscillation output generated by the oscillation circuit is used as a reference signal such as a clock signal, for example.

電子部品素子７は、可変容量ダイオード及びチップ部品等であり、発振周波数を調整するものである。可変容量ダイオードは、外部制御電圧を印加することによって発振周波数を調整する役割を担うほか、インダクタ素子は水晶振動素子５と直列に接続すると周波数の調整範囲を広げる役割があり、他にコンデンサ素子、抵抗素子等も付加することが考えられる。   The electronic component element 7 is a variable capacitance diode, a chip component or the like, and adjusts the oscillation frequency. The variable capacitance diode plays a role of adjusting the oscillation frequency by applying an external control voltage, and the inductor element has a role of expanding the frequency adjustment range when connected in series with the crystal vibrating element 5. It is conceivable to add a resistance element or the like.

このような電子部品素子７を容器体１の第２のキャビティ９に搭載するために、搭載パターン１２を形成し、導電性接着剤１０にて、電子部品素子７を搭載パターン１２上に接続する。
この際、図３に示すように、電子部品素子７を搭載するために、容器体１に設けられた搭載パターン１２を電子部品素子７の外部電極材１３の対向面には設けられておらず接触しない箇所に配置する。
そうすることで、母基板に鉛フリー半田を用いて圧電デバイスを実装する際に、実装時の温度が高くなり電子部品素子７の外部電極材１３が溶融しても、搭載パターン１２に接触している箇所がないので、溶融した外部電極材１３が流れ、すでに硬化された導電性接着剤と搭載パターン１２の間に間隙ができることを防止し、接続強度を維持することが可能となる。 In order to mount such an electronic component element 7 in the second cavity 9 of the container body 1, a mounting pattern 12 is formed, and the electronic component element 7 is connected to the mounting pattern 12 with a conductive adhesive 10. .
At this time, as shown in FIG. 3, in order to mount the electronic component element 7, the mounting pattern 12 provided in the container body 1 is not provided on the opposing surface of the external electrode material 13 of the electronic component element 7. Place it where it will not touch.
By doing so, when the piezoelectric device is mounted on the mother board using lead-free solder, even if the temperature at the time of mounting becomes high and the external electrode material 13 of the electronic component element 7 is melted, it contacts the mounting pattern 12. Therefore, it is possible to prevent the melted external electrode material 13 from flowing and create a gap between the already hardened conductive adhesive and the mounting pattern 12 and maintain the connection strength.

また、図４に示すように、電子部品素子７を搭載するために、容器体１に設けられた搭載パターン内に搭載パターン除去部１４が設けられていることによって、母基板に実装する際に鉛フリー半田を用いることにより、客先の使用温度が高くなり、電子部品素子７の外部電極材１３が溶融しても、電子部品素子７の接続電極面の対向する位置に除去部が形成されているので、搭載パターン１２に接触している箇所がなく、溶融した外部電極材１３が流れることを防止する。なお、図４（ａ）は搭載パターンの一例であり、図４（ｂ）は搭載パターンに電子部品素子７を実装したときの概念図である。
本願発明によって、図５に示すように硬化した導電性接着剤との間に間隙ができることを防止し、接続強度を維持することが可能となる。 Further, as shown in FIG. 4, in order to mount the electronic component element 7, the mounting pattern removal portion 14 is provided in the mounting pattern provided in the container body 1, so that when mounting on the mother board. By using lead-free solder, the use temperature of the customer is increased, and even if the external electrode material 13 of the electronic component element 7 is melted, a removal portion is formed at a position facing the connection electrode surface of the electronic component element 7. Therefore, there is no portion in contact with the mounting pattern 12, and the molten external electrode material 13 is prevented from flowing. 4A is an example of a mounting pattern, and FIG. 4B is a conceptual diagram when the electronic component element 7 is mounted on the mounting pattern.
According to the present invention, it is possible to prevent a gap from being formed between the cured conductive adhesive and to maintain the connection strength as shown in FIG.

ここで容器体１の蓋体４を、容器体１の配線導体を介して容器体下面に配されるグランド端子用の外部端子１１に接続させておけば、その使用時、蓋体４がアースされることによりシールド機能が付与されることとなるため、水晶振動素子５や後述する集積回路素子６を外部からの不要な電気的作用より良好に保護することができる。
従って、容器体１の蓋体４は、グランド端子用の外部端子１１に接続させておくことが好ましい。 Here, if the lid body 4 of the container body 1 is connected to the external terminal 11 for the ground terminal disposed on the lower surface of the container body via the wiring conductor of the container body 1, the lid body 4 is grounded when used. As a result, a shielding function is imparted, so that the quartz resonator element 5 and the integrated circuit element 6 described later can be protected better than unnecessary electrical action from the outside.
Therefore, the lid 4 of the container body 1 is preferably connected to the external terminal 11 for the ground terminal.

なお、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。
上述した実施形態においては、圧電振動素子として水晶振動素子５を用いるようにしたが、他の圧電振動素子、例えばＳＡＷ（弾性表面波）素子等を用いて圧電発振器を構成する場合にも本発明は適用可能である。 In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
In the above-described embodiment, the crystal vibration element 5 is used as the piezoelectric vibration element. However, the present invention is also applicable to the case where the piezoelectric oscillator is configured by using another piezoelectric vibration element such as a SAW (surface acoustic wave) element. Is applicable.

本発明における一実施形態である圧電デバイスの分解斜視図である。It is a disassembled perspective view of the piezoelectric device which is one Embodiment in this invention. 本発明における一実施形態である圧電デバイスの断面図である。It is sectional drawing of the piezoelectric device which is one Embodiment in this invention. 本発明における一実施形態である圧電デバイスの搭載パターンを表す上面図である。It is a top view showing the mounting pattern of the piezoelectric device which is one Embodiment in this invention. 本発明における他の実施形態である圧電デバイスの搭載パターンを表す上面図である。It is a top view showing the mounting pattern of the piezoelectric device which is other embodiment in this invention. 本発明における他の実施形態である圧電デバイスの搭載パターンを表す断面図である。It is sectional drawing showing the mounting pattern of the piezoelectric device which is other embodiment in this invention. 従来における圧電デバイスの第２のキャビティに形成されている搭載パターンを表す上面図である。It is a top view showing the mounting pattern currently formed in the 2nd cavity of the conventional piezoelectric device.

符号の説明Explanation of symbols

１・・・・容器体
２・・・・封止部材
３・・・・封止用導体パターン
４・・・・蓋体
５・・・・水晶振動素子（圧電振動素子）
６・・・・集積回路素子
７・・・・電子部品素子
８・・・・第１のキャビティ
９・・・・第２のキャビティ
１０・・・導電性接着剤
１１・・・外部端子
１２・・・搭載パターン
１３・・・外部電極材
１４・・・除去部 DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Sealing member 3 ... Sealing conductor pattern 4 ... Lid body 5 ... Crystal vibrating element (piezoelectric vibrating element)
6... Integrated circuit element 7... Electronic component element 8... First cavity 9... Second cavity 10 ... Conductive adhesive 11 ... External terminal 12. ..Mounting pattern 13 ... External electrode material 14 ... Removal part

Claims (1)

配線基板には、長さ方向の両端部の外周面に外部電極材が設けられたチップ型の電子部品素子を搭載するための搭載パターンが形成されており、前記電子部品素子を前記搭載パターンと接続されてなる電子部品素子の接続構造において、
該搭載パターンは、該電子部品素子を搭載した際に該外部電極材と接触しない位置に設けられており、
該外部電極材は、導電性接着剤を介してのみ、該搭載パターンと接続しており、
該搭載パターン内には搭載パターン除去部が設けられており、
該搭載パターン除去部の外周の大きさは、該電子部品素子を搭載した際に該電子部品素子の下面となる面に設けられた該外部電極材の大きさよりも大きく形成されており、
該電子部品素子は、該外部電極材が該搭載パターン除去部内に位置するように配置されていることを特徴とする電子部品素子の接続構造。 On the wiring board, a mounting pattern for mounting a chip-type electronic component element provided with an external electrode material on the outer peripheral surface of both end portions in the length direction is formed, and the electronic component element is defined as the mounting pattern. In the connection structure of electronic component elements connected,
The mounting pattern is provided at a position not in contact with the external electrode material when the electronic component element is mounted,
The external electrode material is connected to the mounting pattern only through a conductive adhesive ,
A mounting pattern removal unit is provided in the mounting pattern,
The size of the outer periphery of the mounting pattern removal portion is formed to be larger than the size of the external electrode material provided on the lower surface of the electronic component element when the electronic component element is mounted,
The electronic component element connection structure, wherein the external electrode material is disposed so that the external electrode material is positioned in the mounting pattern removal portion .
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