JP5047937B2 - Terminal board connection structure and connection method to circuit board - Google Patents

Terminal board connection structure and connection method to circuit board Download PDF

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JP5047937B2
JP5047937B2 JP2008327625A JP2008327625A JP5047937B2 JP 5047937 B2 JP5047937 B2 JP 5047937B2 JP 2008327625 A JP2008327625 A JP 2008327625A JP 2008327625 A JP2008327625 A JP 2008327625A JP 5047937 B2 JP5047937 B2 JP 5047937B2
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circuit board
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connection pattern
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JP2010153097A (en
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重正 高橋
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帝国通信工業株式会社
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Description

本発明は、回路基板への端子板接続構造および接続方法に関するものである。   The present invention relates to a terminal board connection structure and connection method to a circuit board.

従来、フレキシブル回路基板の一端辺近傍に形成した端子接続パターンに金属板製の端子板を電気的・機械的に取り付ける方法として、たとえば特許文献１の図１〜図３に示すように、フレキシブル回路基板（１０）の一端辺近傍に形成した端子接続パターン（２１）上に端子板（６０）の一端部分を当接し、この状態でこれらフレキシブル回路基板（１０）と端子板（６０）とを金型（１１０，１２０）内に配置し、その際フレキシブル回路基板（１０）の端子板（６０）が当接している接続部分の周囲を囲むキャビティー（１３０）を金型（１１０，１２０）内に形成し、このキャビティー（１３０）に溶融樹脂を充填して溶融樹脂が固化した後に金型（１１０，１２０）を取り外すことでケース（４０）を成形し、これによって端子接続パターン（２１）と端子板（６０）とを接続する方法が知られている。   Conventionally, as a method of electrically and mechanically attaching a metal plate terminal board to a terminal connection pattern formed near one end of a flexible circuit board, for example, as shown in FIGS. One end portion of the terminal plate (60) is brought into contact with the terminal connection pattern (21) formed in the vicinity of one end side of the substrate (10), and in this state, the flexible circuit board (10) and the terminal plate (60) are made of gold. A cavity (130) is placed in the mold (110, 120) and is disposed in the mold (110, 120), and surrounds the periphery of the connecting portion with which the terminal board (60) of the flexible circuit board (10) is in contact. After the molten resin is solidified by filling the cavity (130) and the molten resin is solidified, the case (40) is formed by removing the mold (110, 120). How to connect the pattern (21) terminal plate and (60) are known.

しかしながら上記従来のフレキシブル回路基板への端子板接続構造および接続方法においてその形状を小型化しようとすると、以下のような問題が生じていた。
（１）小型化によって端子接続パターンと端子板との接触面積が小さくなるため、両者間の電気的な接続状態が不安定になる。 However, when trying to reduce the size of the conventional terminal board connection structure and connection method to the flexible circuit board, the following problems have arisen.
(1) Since the contact area between the terminal connection pattern and the terminal plate is reduced by downsizing, the electrical connection state between the two becomes unstable.

（２）フレキシブル回路基板と端子板のケースによる機械的接続強度が、ケースの小型化・薄型化によって弱くなり、端子板にがたつきが生じたり、端子板に強い外力が加わった場合に端子板がケースから抜けてしまう恐れがあった。
特開２００３−１７３９０２号公報 (2) The mechanical connection strength of the flexible circuit board and the terminal board case is weakened by the downsizing / thinning of the case, causing the terminal board to rattle or when a strong external force is applied to the terminal board. There was a risk that the board would fall out of the case.
JP 2003-173902 A

本発明は上述の点に鑑みてなされたものでありその目的は、回路基板の端子接続パターンと端子板との電気的・機械的接続状態を確実に維持することができ、これによって更なる小型化の要求に答えることができる回路基板への端子板接続構造および接続方法を提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to reliably maintain the electrical and mechanical connection state between the terminal connection pattern of the circuit board and the terminal plate, thereby further reducing the size. It is an object of the present invention to provide a terminal board connection structure to a circuit board and a connection method that can meet the demands of making the circuit.

本願請求項１に記載の発明は、合成樹脂フイルムに端子接続パターンを形成してなる回路基板と、前記回路基板の端子接続パターン上に当接される当接部を有する端子板と、前記回路基板の前記端子板の当接部が当接している接続部分の周囲を囲むように成形される合成樹脂製のケースと、を具備する回路基板への端子板接続構造において、前記端子板の少なくとも当接部近傍位置に貫通孔を設け、前記回路基板の端子接続パターンを形成している面を前記貫通孔の少なくとも一部を覆う位置に配置するとともに、前記端子板の貫通孔を貫通してその上下に前記ケースを成形したことを特徴とする回路基板への端子板接続構造にある。   The invention according to claim 1 of the present application is a circuit board in which a terminal connection pattern is formed on a synthetic resin film, a terminal board having an abutting portion that abuts on the terminal connection pattern of the circuit board, and the circuit A synthetic resin case molded so as to surround the periphery of the connection portion with which the contact portion of the terminal plate of the substrate is in contact, and at least one of the terminal plates. A through hole is provided in the vicinity of the contact portion, the surface of the circuit board on which the terminal connection pattern is formed is disposed at a position covering at least a part of the through hole, and the through hole of the terminal plate is penetrated. In the terminal board connection structure to the circuit board, the case is formed above and below the case.

本願請求項２に記載の発明は、請求項１に記載の回路基板への端子板接続構造において、前記回路基板の端辺近傍に前記端子接続パターンを形成するとともに、この端辺を前記貫通孔中に配置することで、前記貫通孔の一部を前記回路基板の端子接続パターンを形成している面で覆ったことを特徴とする回路基板への端子板接続構造にある。   The invention according to claim 2 of the present application is the terminal board connection structure to the circuit board according to claim 1, wherein the terminal connection pattern is formed in the vicinity of the edge of the circuit board, and the edge is formed in the through hole. The terminal board connection structure to the circuit board is characterized in that a part of the through hole is covered with a surface on which the terminal connection pattern of the circuit board is formed by being disposed inside.

本願請求項３に記載の発明は、合成樹脂フイルムに端子接続パターンを設けてなる回路基板と、前記回路基板の端子接続パターン上に当接される当接部を有する端子板とを用意し、前記端子板の当接部を前記回路基板の端子接続パターン上に当接した状態で、これら回路基板と端子板とを金型内に配置し、その際前記回路基板の前記端子板が当接している接続部分の周囲を囲むキャビティーを金型内に形成し、前記金型のキャビティーに溶融樹脂を充填して溶融樹脂が固化した後に前記金型を取り外すことでケースを成形する回路基板への端子板接続方法において、前記端子板の少なくとも当接部近傍位置に予め貫通孔を設けておき、前記端子板の当接部を前記回路基板の端子接続パターン上に当接した際に前記回路基板の端子接続パターンを形成している面を前記貫通孔の少なくとも一部を覆う位置に配置し、前記回路基板の前記端子板の貫通孔を覆っている部分がこの貫通孔内に押し込まれながらこの貫通孔を通過するように前記溶融樹脂を充填させることを特徴とする回路基板への端子板接続方法にある。   The invention according to claim 3 of the present application provides a circuit board in which a terminal connection pattern is provided on a synthetic resin film, and a terminal plate having an abutting portion that comes into contact with the terminal connection pattern of the circuit board. The circuit board and the terminal board are arranged in a mold in a state where the contact portion of the terminal board is in contact with the terminal connection pattern of the circuit board, and the terminal board of the circuit board is in contact with the circuit board. A circuit board for forming a case by forming a cavity surrounding the periphery of a connecting portion in a mold, filling the cavity of the mold with molten resin, and solidifying the molten resin after removing the mold In the terminal plate connection method, a through hole is provided in advance at least in the vicinity of the contact portion of the terminal plate, and when the contact portion of the terminal plate contacts the terminal connection pattern of the circuit board, Circuit board terminal connection pattern A surface to be formed is disposed at a position covering at least a part of the through hole, and a portion of the circuit board covering the through hole of the terminal plate passes through the through hole while being pushed into the through hole. Thus, there is a terminal board connection method to a circuit board characterized by filling the molten resin as described above.

本願請求項４に記載の発明は、請求項３に記載の回路基板への端子板接続方法において、前記回路基板の端辺近傍に前記端子接続パターンを形成しておき、前記端子板の当接部を前記回路基板の端子接続パターン上に当接した際に前記回路基板の端辺を前記貫通孔中に配置することで、前記回路基板の端子接続パターンを形成している面を前記貫通孔の一部を覆う位置に配置したことを特徴とする回路基板への端子板接続方法にある。   According to a fourth aspect of the present invention, in the method for connecting a terminal board to a circuit board according to the third aspect, the terminal connection pattern is formed in the vicinity of an edge of the circuit board, and the terminal board abuts. When the portion is brought into contact with the terminal connection pattern of the circuit board, the end of the circuit board is disposed in the through hole so that the surface forming the terminal connection pattern of the circuit board is formed in the through hole. The terminal board connecting method to the circuit board is characterized in that it is arranged at a position covering a part of the terminal board.

請求項１，請求項３に記載の発明によれば、端子板に設けた貫通孔の少なくとも一部を覆う位置に回路基板の端子接続パターンを形成している面を配置し、その上下にケースを成形しているので、可撓性を有する回路基板の端子接続パターンを形成している部分をケース成形の際にこの貫通孔内に押し込むことができ、たとえ端子接続パターンと端子板との接触面積が小さくても、両者間の電気的接続を確実に行なうことができる。同時にこの端子板の貫通孔を貫通してその上下にケースが成形されるので、この貫通孔を通して端子板の上下のケースが連結され、端子板のケースに対する機械的取付強度を強くできる。これらのことから回路基板の端子接続パターンと端子板との電気的・機械的接続状態を確実に維持することができ、この接続構造の小型化の要求に答えることができる。   According to the first and third aspects of the present invention, the surface on which the terminal connection pattern of the circuit board is formed is disposed at a position covering at least a part of the through hole provided in the terminal board, and the case is disposed above and below the surface. Therefore, the part forming the terminal connection pattern of the flexible circuit board can be pushed into this through-hole when molding the case, even if the terminal connection pattern and the terminal plate are in contact with each other. Even if the area is small, the electrical connection between the two can be reliably performed. At the same time, since the case is formed above and below the through hole of the terminal plate, the upper and lower cases of the terminal plate are connected through the through hole, and the mechanical attachment strength of the terminal plate to the case can be increased. As a result, the electrical / mechanical connection state between the terminal connection pattern of the circuit board and the terminal plate can be reliably maintained, and the demand for miniaturization of this connection structure can be met.

請求項２，請求項４に記載の発明によれば、回路基板の端辺が端子板の貫通孔の中に位置してそれより外方に突出しないので、回路基板の小型化が図れ、この接続構造のさらなる小型化が図れる。   According to the second and fourth aspects of the invention, since the edge of the circuit board is located in the through hole of the terminal board and does not protrude outwardly, the circuit board can be reduced in size. The connection structure can be further downsized.

以下、本発明の実施形態を図面を参照して詳細に説明する。
〔第１実施形態〕
図１は本発明の第１実施形態にかかる回路基板への端子板接続構造および接続方法を用いて構成された電子部品用ケース１−１の斜視図、図２は電子部品用ケース１−１を裏面側から見た斜視図、図３は図１のＡ線部分の断面拡大矢視図である。これらの図に示すように電子部品用ケース１−１は、回路基板１０と３本の金属製の端子板６０（６０−１〜３）とをケース４０内にインサート成形することによって構成されている。なお以下の説明において、「上」とはケース４０が回路基板１０を載置している側をいい、「下」とはその反対方向をいうものとする。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a perspective view of an electronic component case 1-1 configured by using a terminal board connection structure and connection method to a circuit board according to the first embodiment of the present invention, and FIG. 2 is an electronic component case 1-1. FIG. 3 is a cross-sectional enlarged view of the A line portion of FIG. 1. As shown in these drawings, the electronic component case 1-1 is formed by insert-molding the circuit board 10 and the three metal terminal boards 60 (60-1 to 3) into the case 40. Yes. In the following description, “upper” refers to the side on which the case 40 is placed, and “lower” refers to the opposite direction.

図４は回路基板１０と端子板６０とを示す斜視図である。同図において回路基板１０は、略円形で外周から端子接続部１３を引き出してなる合成樹脂フイルム（たとえばポリエチレンテレフタレート〔ＰＥＴ〕フイルム）１１の中央に貫通孔１５を設け、その周囲にリング状の導電体パターン１７と円弧状の抵抗体パターン１９と、導電体パターン１７の外周及び抵抗体パターン１９の両端からそれぞれ端子接続部１３上に引き出される引出パターン２０と、引出パターン２０の先端に形成される端子接続パターン２１とを設けて構成されている。各端子接続パターン２１は引出パターン２０と同じ導電塗料層の上に弾性導電塗料層を重ね塗りして構成されており、合成樹脂フイルム１１の端子接続部１３先端の端辺（外周辺）１３ａ近傍に設けられている。弾性導電塗料層はたとえば熱硬化性の架橋型ウレタン樹脂に銀粉を混練して乾燥後でも所定のゴム弾性を有するものなどによって構成される。なおパターンの種類は、上記導電体パターン１７および抵抗体パターン１９に限定されず、電子部品に応じて種々の変更が可能であることは言うまでもなく、スイッチパターンなど、他の種々のパターンであってもよい。   FIG. 4 is a perspective view showing the circuit board 10 and the terminal board 60. In the figure, a circuit board 10 is substantially circular and has a through hole 15 in the center of a synthetic resin film (for example, polyethylene terephthalate [PET] film) 11 in which a terminal connecting portion 13 is drawn from the outer periphery, and a ring-shaped conductive film is formed around the periphery. The body pattern 17, the arc-shaped resistor pattern 19, the lead pattern 20 drawn on the terminal connection portion 13 from the outer periphery of the conductor pattern 17 and both ends of the resistor pattern 19, and the tip of the lead pattern 20 are formed. The terminal connection pattern 21 is provided. Each terminal connection pattern 21 is formed by repeatedly applying an elastic conductive paint layer on the same conductive paint layer as that of the lead-out pattern 20, and in the vicinity of the end side (outer periphery) 13 a of the terminal connection portion 13 of the synthetic resin film 11. Is provided. The elastic conductive paint layer is composed of, for example, a layer having a predetermined rubber elasticity even after drying by kneading silver powder in a thermosetting cross-linked urethane resin. The type of pattern is not limited to the conductor pattern 17 and the resistor pattern 19, and it is needless to say that various changes can be made according to electronic components. Also good.

ケース４０は図１，図２に示すように略矩形状であって、その上面中央に凹状であって図示しない摺動子を取り付けた回転体を回転自在に収納する回転体収納部４１を設け、回転体収納部４１の底に回路基板１０のパターン形成面を露出している。ケース４０は熱可塑性樹脂製であり、たとえば液晶ポリマーやポリブチレンテレフタレート（ＰＢＴ）、ナイロンなどで構成されている。ケース４０の回路基板１０の貫通孔１５に対向する位置には同一内径の貫通孔４３が設けられ、またケース４０の外周側壁上面の所定の２ヶ所にはこのケース４０上に図示しないカバーを取り付けるための突起状の取付部４５が設けられている。ケース４０の端子板６０−１〜３の端部を取り付けている部分は、端子板６０−１〜３の端部と回路基板１０の各端子接続パターン２１との当接接続部分の周囲を囲んでこれら端子板６０−１〜３の端部と回路基板１０間を挟持して固定する接続部取付部４７となっている。   As shown in FIGS. 1 and 2, the case 40 has a substantially rectangular shape, and is provided with a rotating body storage portion 41 that rotatably stores a rotating body that is concave at the center of the upper surface and that has a slider (not shown) attached thereto. The pattern forming surface of the circuit board 10 is exposed at the bottom of the rotating body storage portion 41. The case 40 is made of a thermoplastic resin and is made of, for example, a liquid crystal polymer, polybutylene terephthalate (PBT), nylon, or the like. A through hole 43 having the same inner diameter is provided at a position of the case 40 facing the through hole 15 of the circuit board 10, and a cover (not shown) is attached to the case 40 at two predetermined positions on the upper surface of the outer peripheral side wall. A protrusion-like mounting portion 45 is provided. The portion of the case 40 to which the end portions of the terminal plates 60-1 to 60-3 are attached surrounds the abutting connection portion between the end portions of the terminal plates 60-1 to 60-3 and the terminal connection patterns 21 of the circuit board 10. Thus, a connection portion mounting portion 47 is provided to sandwich and fix the end portions of the terminal boards 60-1 to 60-3 and the circuit board 10.

３本の端子板６０−１〜３は図４に示すようにいずれも金属（たとえば鉄）製の平板を略帯状に形成して構成されており、それらの一端部はそれぞれ端子接続パターン２１に当接される当接部６１となっている。そして中央の端子板６０−２は略直線状であってその当接部６１から直線状に回路基板１０から離れる方向に延びている。両側の端子板６０−１，３はその当接部６１から中央の端子板６０−２と同じ方向に少し伸びた後に端子板６０−２から離れる方向に略直角に屈曲しさらに直角に屈曲することで端子板６０−２と同一方向（平行な方向）を向き直線状に延びている。そしてこれら各端子板６０−１〜３の当接部６１となる一端近傍位置にはそれぞれ貫通孔６３が設けられている。各貫通孔６３はいずれも略小判形状（略長円形状）で同一寸法形状である。   As shown in FIG. 4, the three terminal plates 60-1 to 60-3 are each formed by forming a flat plate made of metal (for example, iron) in a substantially band shape, and one end portions thereof are respectively connected to the terminal connection pattern 21. The contact portion 61 is in contact. The central terminal board 60-2 is substantially linear and extends linearly from the contact portion 61 away from the circuit board 10. The terminal plates 60-1, 3 on both sides extend slightly from the contact portion 61 in the same direction as the central terminal plate 60-2, and then bend at a substantially right angle in a direction away from the terminal plate 60-2, and further bend at a right angle. Thus, it extends in the same direction (parallel direction) as the terminal board 60-2. And the through-hole 63 is each provided in the one end vicinity position used as the contact part 61 of each of these terminal boards 60-1-3. Each of the through holes 63 has a substantially oval shape (substantially oval shape) and the same size and shape.

電子部品用ケース１−１を製造するには図５に示すように、各端子板６０の当接部６１を、回路基板１０の各端子接続パターン２１上に当接する。このとき同図に示すように、回路基板１０の端子接続パターン２１を形成している端辺１３ａを貫通孔６３中に配置することによって、回路基板１０の端子接続パターン２１を形成している面が貫通孔６３の一部を覆うようにする。   To manufacture the electronic component case 1-1, the contact portions 61 of the terminal boards 60 are brought into contact with the terminal connection patterns 21 of the circuit board 10, as shown in FIG. At this time, as shown in the figure, the surface on which the terminal connection pattern 21 of the circuit board 10 is formed by arranging the end side 13a forming the terminal connection pattern 21 of the circuit board 10 in the through hole 63. Covers a part of the through-hole 63.

次にこれら回路基板１０と端子板６０の上下を図６に示す第１，第２金型１１０，１２０によって挟持する。すなわち図６は第１，第２金型１１０，１２０によって挟持した際の、前記図３と同一部分の拡大断面図である。なお以下主として図６に示す端子板６０−２の部分について説明するが、他の端子板６０−１，３の部分についても同様である。すなわち図６に示すように回路基板１０と端子板６０−２とを第１，第２金型１１０，１２０内に挟持した際、第１，第２金型１１０，１２０の間にケース４０と同一形状のキャビティーＣ（Ｃ１，Ｃ２を含む）が形成される。また第１金型１１０に設けた基板当接面１１１が回路基板１０のパターン形成面に当接する。同時に前記回路基板１０と端子板６０−２の当接部６１とを当接している部分の上下は、前記基板当接面１１１の外周近傍部分と第２金型１２０の底面から突出する押圧凸部１２１とによって挟持される。なお図２に示すケース４０の３つの凹部４９はこの押圧凸部１２１によって形成されるものである。そして前記端子板６０−２の貫通孔６３の上下にもキャビティーＣ１，Ｃ２が位置している。そして図６からも明らかなように貫通孔６３中に回路基板１０の端子接続パターン２１（図６では記載を省略）を形成している端辺１３ａを配置することで、貫通孔６３の一部が回路基板１０の端子接続パターン２１を形成している面によって覆われている。またキャビティーＣ内に溶融樹脂を充填するピンゲートＰ１は、第２金型１２０の底面の前記回路基板１０と端子板６０の当接部分近傍位置に接続されている。   Next, the upper and lower sides of the circuit board 10 and the terminal board 60 are sandwiched between the first and second molds 110 and 120 shown in FIG. That is, FIG. 6 is an enlarged cross-sectional view of the same part as FIG. 3 when sandwiched between the first and second molds 110 and 120. In the following description, the portion of the terminal plate 60-2 shown in FIG. 6 will be mainly described, but the same applies to the portions of the other terminal plates 60-1 and 60-3. That is, as shown in FIG. 6, when the circuit board 10 and the terminal board 60-2 are sandwiched between the first and second molds 110 and 120, the case 40 and the first and second molds 110 and 120 are A cavity C having the same shape (including C1 and C2) is formed. Further, the substrate contact surface 111 provided on the first mold 110 contacts the pattern formation surface of the circuit board 10. At the same time, the upper and lower portions of the portion where the circuit board 10 and the contact portion 61 of the terminal board 60-2 are in contact with each other are pressing protrusions protruding from the vicinity of the outer periphery of the substrate contact surface 111 and the bottom surface of the second mold 120. It is clamped by the part 121. Note that the three concave portions 49 of the case 40 shown in FIG. 2 are formed by the pressing convex portions 121. The cavities C1 and C2 are also located above and below the through hole 63 of the terminal plate 60-2. As is clear from FIG. 6, a part of the through hole 63 is formed by arranging the end side 13 a forming the terminal connection pattern 21 (not shown in FIG. 6) of the circuit board 10 in the through hole 63. Is covered with the surface of the circuit board 10 on which the terminal connection pattern 21 is formed. The pin gate P <b> 1 that fills the cavity C with the molten resin is connected to a position near the contact portion between the circuit board 10 and the terminal plate 60 on the bottom surface of the second mold 120.

次に前記キャビティーＣ内にピンゲートＰ１から溶融樹脂（溶融モールド樹脂）を注入することでキャビティーＣ内を溶融樹脂で満たす。ピンゲートＰ１からキャビティーＣ内に溶融樹脂を注入する際、まず主として第２金型１２０側のキャビティーＣ内に溶融樹脂が満たされた後、第１金型１１０側のキャビティーＣ内に溶融樹脂が満たされていく。したがってその際、図７に矢印で示すように第２金型１２０のキャビティーＣ２から端子板６０−２の貫通孔６３を通して第１金型１１０のキャビティーＣ１内に溶融樹脂が流入していくので、そのとき貫通孔６３の一部を覆っている可撓性を有する回路基板１０の部分は貫通孔６３内に少し押し込められる。したがってこのとき回路基板１０上に形成されている端子接続パターン２１（図７では図示していない。図５参照）は貫通孔６３の内周下辺の部分に強く押し付けられ、これによって端子接続パターン２１と端子板６０−２との電気的接続が確実になる。そして溶融樹脂が固化した後に第１，第２金型１１０，１２０を取り外せば、図１、図２に示す電子部品用ケース１−１が完成する。   Next, the cavity C is filled with molten resin by injecting molten resin (molten mold resin) from the pin gate P1 into the cavity C. When injecting molten resin from the pin gate P1 into the cavity C, first, the molten resin is mainly filled into the cavity C on the second mold 120 side, and then melted into the cavity C on the first mold 110 side. The resin fills up. Therefore, at that time, as indicated by an arrow in FIG. 7, the molten resin flows from the cavity C2 of the second mold 120 into the cavity C1 of the first mold 110 through the through hole 63 of the terminal plate 60-2. Therefore, the portion of the flexible circuit board 10 covering a part of the through hole 63 at that time is slightly pushed into the through hole 63. Accordingly, at this time, the terminal connection pattern 21 (not shown in FIG. 7; see FIG. 5) formed on the circuit board 10 is strongly pressed against the inner peripheral lower side portion of the through hole 63, thereby the terminal connection pattern 21. And the electrical connection between the terminal board 60-2 is ensured. When the first and second molds 110 and 120 are removed after the molten resin is solidified, the electronic component case 1-1 shown in FIGS. 1 and 2 is completed.

以上説明したようにこの実施形態によれば、可撓性を有する回路基板１０の端子接続パターン２１を形成している部分を端子板６０の貫通孔６３内に押し込むことができるので、端子接続パターン２１が貫通孔６３の内周辺の角部に強く当接し、たとえ端子接続パターン２１と端子板６０との接触面積が小さくても、両者間の電気的接続を確実に行なうことができる。同時にこの端子板６０の貫通孔６３を貫通してその上下にケース４０が成形されるので、この貫通孔６３を通して端子板６０の上下のケース４０が連結され、端子板６０のケース４０に対する機械的取付強度を強くできる。これらのことから回路基板１０の端子接続パターン２１と端子板６０との電気的・機械的接続状態を確実に維持することができ、これによってこの接続構造の小型化に対応できる。   As described above, according to this embodiment, the portion of the circuit board 10 having flexibility that forms the terminal connection pattern 21 can be pushed into the through hole 63 of the terminal board 60, so that the terminal connection pattern Thus, even if the contact area between the terminal connection pattern 21 and the terminal plate 60 is small, the electrical connection between the two can be reliably performed. At the same time, since the case 40 is formed above and below the through hole 63 of the terminal plate 60, the upper and lower cases 40 of the terminal plate 60 are connected through the through hole 63, and the terminal plate 60 is mechanically coupled to the case 40. Mounting strength can be increased. For these reasons, the electrical / mechanical connection state between the terminal connection pattern 21 of the circuit board 10 and the terminal plate 60 can be reliably maintained, and thus the connection structure can be reduced in size.

またこの実施形態によれば、回路基板１０の端辺１３ａが端子板６０の貫通孔６３の中に位置してそれより外方に突出しないので、回路基板１０の小型化が図れ、この点からもこの接続構造の小型化が図れる。   Further, according to this embodiment, since the end side 13a of the circuit board 10 is located in the through hole 63 of the terminal board 60 and does not protrude outwardly therefrom, the circuit board 10 can be reduced in size. However, this connection structure can be miniaturized.

さらにこの実施形態においては、端子板６０に貫通孔６３を設けることで、貫通孔６３の両側の部分６５，６５（図４の端子板６０−１参照）の幅寸法を細くでき、これによって端子板６０を半田付けなどする際にその熱が当接部６１側に伝導しにくくなり、これによって端子板６０と端子接続パターン２１との電気的・機械的接続状態をさらに確実に維持することができる。   Furthermore, in this embodiment, by providing the through hole 63 in the terminal plate 60, the width dimension of the portions 65, 65 (see the terminal plate 60-1 in FIG. 4) on both sides of the through hole 63 can be reduced, thereby the terminal. When the board 60 is soldered or the like, the heat is less likely to be transferred to the contact portion 61 side, so that the electrical and mechanical connection between the terminal board 60 and the terminal connection pattern 21 can be more reliably maintained. it can.

〔第２実施形態〕
図８は本発明の第２実施形態に用いる回路基板１０−２と３本の端子板６０−１〜３とを示す斜視図である。同図に示す回路基板１０−２および端子板６０−１〜３において、前記図１〜図７に示す実施形態にかかる回路基板１０および端子板６０−１〜３と同一又は相当部分には同一符号を付す。なお以下で説明する事項以外の事項については、前記図１〜図７に示す第１実施形態と同じである。 [Second Embodiment]
FIG. 8 is a perspective view showing a circuit board 10-2 and three terminal boards 60-1 to 60-3 used in the second embodiment of the present invention. In the circuit board 10-2 and the terminal boards 60-1 to 3 shown in the figure, the circuit board 10 and the terminal boards 60-1 to 3 according to the embodiment shown in FIGS. A sign is attached. Items other than those described below are the same as those in the first embodiment shown in FIGS.

この実施形態において第１実施形態と相違する点は、回路基板１０−２の端子接続部１３部分の構造のみである。すなわちこの実施形態に用いる回路基板１０−２の端子接続部１３の部分は、第１実施形態の端子接続部１３の半径方向外方に向かう長さよりもその長さを長く構成し、同時にこの端子接続部１３上に形成される端子接続パターン２１の長さも長く形成している。また回路基板１０−２の端子接続パターン２１を形成した部分内には縦方向（端子板６０−１〜３が突出する方向）に向けて１本ずつスリット２３が設けられている。スリット２３は回路基板１０−２を上下に貫通している。   This embodiment is different from the first embodiment only in the structure of the terminal connection portion 13 portion of the circuit board 10-2. That is, the portion of the terminal connection portion 13 of the circuit board 10-2 used in this embodiment is configured to have a length longer than the length of the terminal connection portion 13 of the first embodiment directed outward in the radial direction. The length of the terminal connection pattern 21 formed on the connection portion 13 is also long. Further, one slit 23 is provided in the portion of the circuit board 10-2 where the terminal connection pattern 21 is formed in the vertical direction (the direction in which the terminal plates 60-1 to 60-3 protrude). The slit 23 penetrates the circuit board 10-2 vertically.

そして電子部品用ケース（図示せず）を製造する方法は第１実施形態の方法と同一である。すなわちまず図９に示すように、各端子板６０−１〜３の当接部６１を、回路基板１０−２の各端子接続パターン２１上に当接するが、このとき同図に示すように、回路基板１０−２の端子接続パターン２１を形成している面が端子板６０の貫通孔６３の全部を覆う。同時に各貫通孔６３内にスリット２３を位置させる。   The method for manufacturing the electronic component case (not shown) is the same as the method of the first embodiment. That is, first, as shown in FIG. 9, the contact portions 61 of the terminal plates 60-1 to 60-3 abut on the terminal connection patterns 21 of the circuit board 10-2. At this time, as shown in FIG. The surface on which the terminal connection pattern 21 of the circuit board 10-2 is formed covers the entire through hole 63 of the terminal board 60. At the same time, the slit 23 is positioned in each through-hole 63.

そしてこれら回路基板１０−２と端子板６０の上下を第１実施形態で用いたのと同じ第１，第２金型１１０，１２０（図１０参照）によって挟持し、第２金型１２０に接続したピンゲートＰ１から溶融樹脂を注入することでキャビティーＣ内を溶融樹脂で満たす。その際、この実施形態においては、第２金型１２０のキャビティーＣ２から端子板６０−２の貫通孔６３を覆っている回路基板１０−２の端子接続部１３のスリット２３を通してキャビティーＣ１側に溶融樹脂が流入していくので、貫通孔６３を覆っている可撓性を有する回路基板１０−２のスリット２３の周囲の部分は貫通孔６３内に少し押し込められる。したがってこのとき回路基板１０−２上に形成されている端子接続パターン２１は貫通孔６３の内周下辺の角部の部分に強く押し付けられ、これによって端子接続パターン２１と端子板６０−２との電気的接続が確実になる。そして溶融樹脂が固化した後に第１，第２金型１１０，１２０を取り外せば、電子部品用ケースが完成する。   The upper and lower sides of the circuit board 10-2 and the terminal board 60 are sandwiched by the same first and second molds 110 and 120 (see FIG. 10) as used in the first embodiment and connected to the second mold 120. The cavity C is filled with the molten resin by injecting the molten resin from the pin gate P1. At this time, in this embodiment, the cavity C1 side passes through the slit 23 of the terminal connection portion 13 of the circuit board 10-2 covering the through hole 63 of the terminal board 60-2 from the cavity C2 of the second mold 120. Since the molten resin flows into the hole, the portion around the slit 23 of the flexible circuit board 10-2 covering the through hole 63 is slightly pushed into the through hole 63. Therefore, at this time, the terminal connection pattern 21 formed on the circuit board 10-2 is strongly pressed against the corner portion of the inner peripheral lower side of the through-hole 63, whereby the terminal connection pattern 21 and the terminal plate 60-2 are connected. Secure electrical connection. When the first and second molds 110 and 120 are removed after the molten resin is solidified, the electronic component case is completed.

この実施形態の場合も、可撓性を有する回路基板１０−２の端子接続パターン２１を形成している部分を端子板６０の貫通孔６３内に押し込むことができるので、端子接続パターン２１が貫通孔６３の内周辺の角部に強く当接し、たとえ端子接続パターン２１と端子板６０（６０−１〜３）との接触面積が小さくても、両者間の電気的接続を確実に行なうことができる。同時にこの端子板６０の貫通孔６３を貫通してその上下にケース４０が成形されるので、この貫通孔６３を通して端子板６０の上下のケース４０が連結され、端子板６０のケース４０に対する機械的取付強度を強くできる。これらのことから回路基板１０の端子接続パターン２１と端子板６０との電気的・機械的接続状態を確実に維持することができ、これによってこの接続構造の小型化に対応できる。   Also in this embodiment, the portion of the circuit board 10-2 having flexibility that forms the terminal connection pattern 21 can be pushed into the through hole 63 of the terminal board 60, so that the terminal connection pattern 21 penetrates. Even if the contact area between the terminal connection pattern 21 and the terminal plate 60 (60-1 to 60) is small, the electrical connection between the two can be reliably performed even if the corners around the inner periphery of the hole 63 are in strong contact. it can. At the same time, since the case 40 is formed above and below the through hole 63 of the terminal plate 60, the upper and lower cases 40 of the terminal plate 60 are connected through the through hole 63, and the terminal plate 60 is mechanically coupled to the case 40. Mounting strength can be increased. For these reasons, the electrical / mechanical connection state between the terminal connection pattern 21 of the circuit board 10 and the terminal plate 60 can be reliably maintained, and thus the connection structure can be reduced in size.

なおこの実施形態では端子接続パターン２１中にスリット２３を設けたが、スリット２３の代わりに他の各種形状の貫通穴を設けてもよい。設ける貫通穴の数が複数であってもよい。   In this embodiment, the slit 23 is provided in the terminal connection pattern 21, but other various shapes of through holes may be provided instead of the slit 23. A plurality of through holes may be provided.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば上記各実施形態では本発明にかかる回路基板への端子板接続構造を電子部品用ケースに適用した例を示したが、本発明がこれに限定されないことは言うまでもなく、たとえば帯状に形成された可撓性を有する合成樹脂フイルムに回路パターンを形成してその先端に端子接続パターンを形成してなるいわゆるフラットケーブルの前記端子接続パターンに端子板を取り付ける場合などにも同様に適用できる。また上記各実施形態では、回路基板の端辺近傍に至る位置に端子接続パターンを設けたが、端子接続パターンは回路基板の端辺近傍以外の各種位置に設けてもよい。また上記実施形態では、端子板の一端に当接部および貫通孔を設けたが、一端以外の位置に当接部および貫通孔を設けてもよい。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in each of the above-described embodiments, the example in which the terminal board connection structure to the circuit board according to the present invention is applied to the case for an electronic component has been shown, but it is needless to say that the present invention is not limited to this. The present invention can be similarly applied to a case where a terminal plate is attached to the terminal connection pattern of a so-called flat cable in which a circuit pattern is formed on a flexible synthetic resin film and a terminal connection pattern is formed at the tip thereof. In each of the above embodiments, the terminal connection pattern is provided at a position reaching the vicinity of the edge of the circuit board. However, the terminal connection pattern may be provided at various positions other than the vicinity of the edge of the circuit board. Moreover, in the said embodiment, although the contact part and the through-hole were provided in the end of the terminal board, you may provide a contact part and a through-hole in positions other than one end.

第１実施形態を用いて構成された電子部品用ケース１−１の斜視図である。It is a perspective view of case 1-1 for electronic parts constituted using a 1st embodiment. 電子部品用ケース１−１を裏面側から見た斜視図である。It is the perspective view which looked at case 1-1 for electronic components from the back side. 図１のＡ線部分の断面拡大矢視図である。It is a cross-sectional enlarged arrow view of the A line part of FIG. 回路基板１０と端子板６０（６０−１〜３）を示す斜視図である。It is a perspective view which shows the circuit board 10 and the terminal board 60 (60-1 to 3). 回路基板１０に端子板６０を当接した状態を示す斜視図である。2 is a perspective view showing a state in which a terminal board 60 is in contact with a circuit board 10. FIG. 回路基板１０と端子板６０−２とを当接した部分を金型１１０，１２０で挟持した状態を示す要部拡大断面図である。FIG. 5 is an enlarged cross-sectional view of a main part showing a state where a portion where the circuit board 10 and the terminal board 60-2 are in contact with each other is held between molds 110 and 120. キャビティーＣ内に溶融樹脂を注入する状態を示す図である。6 is a view showing a state in which a molten resin is injected into a cavity C. FIG. 回路基板１０−２と端子板６０（６０−１〜３）を示す斜視図である。It is a perspective view which shows the circuit board 10-2 and the terminal board 60 (60-1 to 3). 回路基板１０−２に端子板６０を当接した状態を示す斜視図である。It is a perspective view which shows the state which contacted the terminal board 60 to the circuit board 10-2. キャビティーＣ内に溶融樹脂を注入する状態を示す図である。6 is a view showing a state in which a molten resin is injected into a cavity C. FIG.

符号の説明Explanation of symbols

１−１ 電子部品用ケース
１０ 回路基板
１１ 合成樹脂フイルム
１３ 端子接続部
１３ａ 端辺
２１ 端子接続パターン
６０（６０−１〜３） 端子板
４０ ケース
６１ 当接部
６３ 貫通孔
１１０ 第１金型（金型）
１２０ 第２金型（金型）
Ｃ，Ｃ１，Ｃ２ キャビティー
１０−２ 回路基板
２３ スリット 1-1 Electronic Component Case 10 Circuit Board 11 Synthetic Resin Film 13 Terminal Connection Portion 13a End Side 21 Terminal Connection Pattern 60 (60-1 to 3) Terminal Board 40 Case 61 Contact Portion 63 Through Hole 110 First Mold ( Mold)
120 Second mold (mold)
C, C1, C2 Cavity 10-2 Circuit board 23 Slit

Claims (4)

合成樹脂フイルムに端子接続パターンを形成してなる回路基板と、
前記回路基板の端子接続パターン上に当接される当接部を有する端子板と、
前記回路基板の前記端子板の当接部が当接している接続部分の周囲を囲むように成形される合成樹脂製のケースと、を具備する回路基板への端子板接続構造において、
前記端子板の少なくとも当接部近傍位置に貫通孔を設け、前記回路基板の端子接続パターンを形成している面を前記貫通孔の少なくとも一部を覆う位置に配置するとともに、前記端子板の貫通孔を貫通してその上下に前記ケースを成形したことを特徴とする回路基板への端子板接続構造。 A circuit board formed with a terminal connection pattern on a synthetic resin film;
A terminal plate having an abutting portion that abuts on the terminal connection pattern of the circuit board;
In the terminal board connection structure to the circuit board, comprising a synthetic resin case molded so as to surround the periphery of the connection part with which the contact part of the terminal board of the circuit board is in contact,
A through hole is provided at least in the vicinity of the contact portion of the terminal board, and a surface of the circuit board on which the terminal connection pattern is formed is disposed at a position covering at least a part of the through hole, and the terminal board is penetrated A structure for connecting a terminal board to a circuit board, wherein the case is formed above and below the hole. 請求項１に記載の回路基板への端子板接続構造において、
前記回路基板の端辺近傍に前記端子接続パターンを形成するとともに、この端辺を前記貫通孔中に配置することで、前記貫通孔の一部を前記回路基板の端子接続パターンを形成している面で覆ったことを特徴とする回路基板への端子板接続構造。 In the terminal board connection structure to the circuit board according to claim 1,
The terminal connection pattern is formed in the vicinity of the edge of the circuit board, and the terminal connection pattern of the circuit board is formed on a part of the through hole by arranging the edge in the through hole. A terminal board connection structure to a circuit board, characterized by being covered with a surface. 合成樹脂フイルムに端子接続パターンを設けてなる回路基板と、前記回路基板の端子接続パターン上に当接される当接部を有する端子板とを用意し、
前記端子板の当接部を前記回路基板の端子接続パターン上に当接した状態で、これら回路基板と端子板とを金型内に配置し、その際前記回路基板の前記端子板が当接している接続部分の周囲を囲むキャビティーを金型内に形成し、
前記金型のキャビティーに溶融樹脂を充填して溶融樹脂が固化した後に前記金型を取り外すことでケースを成形する回路基板への端子板接続方法において、
前記端子板の少なくとも当接部近傍位置に予め貫通孔を設けておき、前記端子板の当接部を前記回路基板の端子接続パターン上に当接した際に前記回路基板の端子接続パターンを形成している面を前記貫通孔の少なくとも一部を覆う位置に配置し、前記回路基板の前記端子板の貫通孔を覆っている部分がこの貫通孔内に押し込まれながらこの貫通孔を通過するように前記溶融樹脂を充填させることを特徴とする回路基板への端子板接続方法。 A circuit board in which a terminal connection pattern is provided on a synthetic resin film, and a terminal board having an abutting portion that abuts on the terminal connection pattern of the circuit board are prepared,
The circuit board and the terminal board are arranged in a mold in a state where the contact portion of the terminal board is in contact with the terminal connection pattern of the circuit board, and the terminal board of the circuit board is in contact with the circuit board. Forming a cavity in the mold that surrounds the periphery of the connected part,
In the terminal board connection method to the circuit board for molding the case by removing the mold after the molten resin is solidified by filling the mold cavity with the molten resin,
A through hole is provided in advance at least in the vicinity of the contact portion of the terminal board, and the terminal connection pattern of the circuit board is formed when the contact portion of the terminal board contacts the terminal connection pattern of the circuit board. The surface that is covered is disposed at a position covering at least a part of the through-hole, and the portion of the circuit board covering the through-hole of the terminal plate passes through the through-hole while being pushed into the through-hole. A method for connecting a terminal board to a circuit board, comprising filling the molten resin with a resin. 請求項３に記載の回路基板への端子板接続方法において、
前記回路基板の端辺近傍に前記端子接続パターンを形成しておき、前記端子板の当接部を前記回路基板の端子接続パターン上に当接した際に前記回路基板の端辺を前記貫通孔中に配置することで、前記回路基板の端子接続パターンを形成している面を前記貫通孔の一部を覆う位置に配置したことを特徴とする回路基板への端子板接続方法。 In the terminal board connection method to the circuit board according to claim 3,
The terminal connection pattern is formed in the vicinity of the end side of the circuit board, and the end side of the circuit board is made to pass through the through-hole when the contact portion of the terminal board abuts on the terminal connection pattern of the circuit board. A method for connecting a terminal board to a circuit board, comprising: arranging a surface of the circuit board on which a terminal connection pattern is formed at a position covering a part of the through hole.
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