JP5035653B2 - Hybrid laser processing equipment - Google Patents

Hybrid laser processing equipment Download PDF

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Publication number
JP5035653B2
JP5035653B2 JP2005079458A JP2005079458A JP5035653B2 JP 5035653 B2 JP5035653 B2 JP 5035653B2 JP 2005079458 A JP2005079458 A JP 2005079458A JP 2005079458 A JP2005079458 A JP 2005079458A JP 5035653 B2 JP5035653 B2 JP 5035653B2
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inclined surface
liquid
laser
nozzle
workpiece
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JP2006255768A (en
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良治 小関
基 佐々木
吉博 河原
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Shibuya Corp
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Shibuya Corp
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Priority to JP2005079458A priority Critical patent/JP5035653B2/en
Priority to PCT/JP2005/019298 priority patent/WO2006100798A1/en
Priority to US11/885,854 priority patent/US7705266B2/en
Priority to CN2005800491587A priority patent/CN101142050B/en
Priority to KR1020077021127A priority patent/KR101198341B1/en
Priority to EP05795416.6A priority patent/EP1859890B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for pressure control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/006—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material without particles or pellets for deburring, removal of extended surface areas or jet milling of local recessions, e.g. grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor

Description

本発明はハイブリッドレーザ加工装置に関し、具体的には、噴射ノズルが噴射した液柱にレーザ光を導光して被加工物の加工を行うハイブリッドレーザ加工装置に関する。   The present invention relates to a hybrid laser processing apparatus, and more specifically, to a hybrid laser processing apparatus that processes a workpiece by guiding laser light to a liquid column ejected by an ejection nozzle.

従来、噴射孔を有する噴射ノズルと、当該噴射ノズルに高圧の液体を供給する液体供給手段と、レーザ光を発振するレーザ発振器と、該レーザ発振器から発振されたレーザ光を集光する集光レンズとを備え、上記液体供給手段から供給された液体を噴射孔から液柱にして外部に噴射させると共に、集光レンズによって上記液柱にレーザ光を導光して、被加工物の加工を行うハイブリッドレーザ加工装置が知られている。
このようなハイブリッドレーザ加工装置として、加工ヘッドの先端に液柱ビームを噴射するノズル通路の形成されたノズルブロックを設け、フォーカスレンズがレーザ光を上記ノズル通路の入口開口に集光することで、ノズル通路より噴出する液体ビームにレーザビームを導光するものが知られている。（特許文献１）
また、他のハイブリッドレーザ加工装置として、加工ヘッドの内部に被加工物に向けて縮径する円錐面と円筒面とを形成し、上記円筒面の先端より柱状に水を噴射させるとともに、レーザ光をこれら上記円錐面および円筒面に反射させることで、レーザ光を噴射された水に導光するものが知られている。（特許文献２）
特表平１０−５００９０３号公報 特開２００１−３２１９７７号公報 Conventionally, an injection nozzle having an injection hole, liquid supply means for supplying high-pressure liquid to the injection nozzle, a laser oscillator that oscillates laser light, and a condensing lens that condenses the laser light oscillated from the laser oscillator The liquid supplied from the liquid supply means is made into a liquid column from the injection hole and ejected to the outside, and a laser beam is guided to the liquid column by a condenser lens to process the workpiece. A hybrid laser processing apparatus is known.
As such a hybrid laser processing apparatus, a nozzle block formed with a nozzle passage for injecting a liquid column beam is provided at the tip of the processing head, and the focus lens focuses the laser light on the inlet opening of the nozzle passage. One that guides a laser beam to a liquid beam ejected from a nozzle passage is known. (Patent Document 1)
Further, as another hybrid laser processing apparatus, a conical surface and a cylindrical surface that are reduced in diameter toward the workpiece are formed inside the processing head, and water is ejected in a columnar shape from the tip of the cylindrical surface, and laser light is emitted. The laser beam is guided to the jetted water by reflecting the laser beam on the conical surface and the cylindrical surface. (Patent Document 2)
Japanese National Patent Publication No. 10-500903 JP 2001-321977 A

しかしながら、特許文献１の場合、フォーカスレンズはレーザビームの焦点を上記ノズル通路の入口開口に位置させなければならず、入口開口を小径にすればするほど、レーザビームの焦点の調整が困難となる。
また、特許文献２の場合、レーザ光が円錐面および円筒面で反射を繰り返す結果、噴射された水柱に導光されるレーザ光は、当該水柱の境界面への入射角が小さくなりすぎてしまい、レーザ光が水柱の外部に飛び出してしまうといった問題がある。
さらに、上記円錐面および円筒面でレーザ光を何度も反射させているので、これら円錐面および円筒面の全体に鏡面加工等の処理を施す必要があり、加工ヘッドのコストが高いという問題がある。
このような問題に鑑み、本発明は集光レンズによるレーザ光の焦点位置の調整が容易で、導光されたレーザ光が液柱より外部に飛び出すことがなく、しかも製造コストを低廉にすることの可能なハイブリッドレーザ加工装置を提供するものである。 However, in the case of Patent Document 1, the focus lens must position the focal point of the laser beam at the inlet opening of the nozzle passage, and the smaller the inlet opening, the more difficult the adjustment of the focal point of the laser beam. .
In the case of Patent Document 2, as a result of the laser beam being repeatedly reflected by the conical surface and the cylindrical surface, the incident angle of the laser beam guided to the jetted water column to the boundary surface of the water column becomes too small. There is a problem that the laser beam jumps out of the water column.
Furthermore, since the laser beam is reflected many times by the conical surface and the cylindrical surface, it is necessary to perform a process such as mirror finishing on the entire conical surface and the cylindrical surface, and there is a problem that the cost of the processing head is high. is there.
In view of such problems, the present invention makes it easy to adjust the focal position of the laser beam by the condenser lens, so that the guided laser beam does not jump out of the liquid column, and the manufacturing cost is reduced. The present invention provides a hybrid laser processing apparatus capable of the following.

すなわち、本発明のハイブリッドレーザ加工装置は、噴射孔を有する噴射ノズルと、当該噴射ノズルに高圧の液体を供給する液体供給手段と、レーザ光を発振するレーザ発振器と、該レーザ発振器から発振されたレーザ光を集光する集光レンズと、上記噴射ノズルと集光レンズとが設けられた加工ヘッドとを備え、上記液体供給手段から供給された液体を噴射孔から液柱にして外部に噴射させると共に、集光レンズによって上記液柱にレーザ光を導光して、被加工物の加工を行うハイブリッドレーザ加工装置において、
上記噴射ノズルの上記噴射孔に、被加工物に向けて縮径する第１傾斜面と、当該第１傾斜面の最小径部に接続されるともに上記第１傾斜面よりも被加工物側に形成されて被加工物に向けて拡径する第２傾斜面とを形成し、
上記集光レンズの焦点を上記第１傾斜面の最小径部よりも被加工物側に超えた位置に設定するとともに上記噴射孔より噴射された液柱の内部に設定し、かつ上記噴射孔内に照射されたレーザ光のうち、上記第１傾斜面によって遮られる部分を該第１傾斜面で一度だけ反射させてから上記液柱に導光するように設定するとともに、上記第２傾斜面によって上記液柱を囲繞するエアポケットを形成することを特徴としている。 In other words, the hybrid laser processing apparatus of the present invention is generated by an injection nozzle having an injection hole, a liquid supply means for supplying high-pressure liquid to the injection nozzle, a laser oscillator that oscillates laser light, and the laser oscillator. A condensing lens for condensing the laser beam; and a processing head provided with the ejection nozzle and the condensing lens; and the liquid supplied from the liquid supply means is ejected to the outside from the ejection hole as a liquid column. At the same time, in the hybrid laser processing apparatus for processing the workpiece by guiding the laser beam to the liquid column by the condenser lens,
The injection hole of the injection nozzle is connected to a first inclined surface that is reduced in diameter toward the workpiece, and is connected to a minimum diameter portion of the first inclined surface, and closer to the workpiece than the first inclined surface. Forming a second inclined surface that is formed and expands toward the workpiece;
The focal point of the condensing lens is set at a position beyond the minimum diameter portion of the first inclined surface on the workpiece side, set inside the liquid column ejected from the ejection hole , and in the ejection hole of the laser beam irradiated to a portion to be intercepted by the first inclined surface and sets to guide the by reflecting only once the first inclined surface to the liquid column, by the second inclined surface An air pocket surrounding the liquid column is formed.

上記発明によれば、上記噴射孔に形成された傾斜面の最小径部の径で液柱が噴射されるが、上記集光レンズはレーザ光を上記最小径部よりも小さく集光する必要は無く、少なくともレーザ光を噴射孔の入口より小さくして、上記傾斜面で反射するように集光すれば良いので、レーザ光の焦点位置の調整が容易となる。
また、レーザ光の焦点を上記傾斜面の最小径部よりも被加工物側に設定し、レーザ光を上記傾斜面に反射させようとすると、上記傾斜面の円錐角よりも集光されるレーザ光の円錐角のほうが小さくなり、これによりレーザ光が傾斜面で反射する回数を抑えることができる。
このため、液柱に導光されるレーザ光の液柱と外気との境界面への入射角が大きくなり、レーザ光が液柱より外部に飛び出すのが防止され、さらには噴射ノズル内部の鏡面加工等の範囲を少なくして噴射ノズルのコストを低廉にすることができる。 According to the invention, the liquid column is ejected with the diameter of the smallest diameter portion of the inclined surface formed in the ejection hole, but the condensing lens needs to collect the laser beam smaller than the smallest diameter portion. However, at least the laser beam is made smaller than the entrance of the injection hole and condensed so as to be reflected by the inclined surface, so that the focal position of the laser beam can be easily adjusted.
In addition, when the focal point of the laser beam is set on the workpiece side with respect to the minimum diameter portion of the inclined surface, and the laser beam is reflected on the inclined surface, the laser beam is collected more than the cone angle of the inclined surface. The cone angle of the light becomes smaller, which can reduce the number of times the laser light is reflected by the inclined surface.
For this reason, the incident angle of the laser beam guided to the liquid column to the boundary surface between the liquid column and the outside air is increased, the laser beam is prevented from jumping out of the liquid column, and further the mirror surface inside the injection nozzle The range of processing and the like can be reduced, and the cost of the injection nozzle can be reduced.

以下図示実施例について説明すると、図１には本発明にかかるハイブリッドレーザ加工装置１を示し、液体の噴射により形成した液柱Ｗにレーザ光Ｌを導光することで、被加工物２を所要形状に切断加工する装置となっている。
このハイブリッドレーザ加工装置１は、上記被加工物２を支持する加工テーブル３と、レーザ光Ｌを発振するレーザ発振器４と、水等の液体を供給する液体供給手段としての高圧ポンプ５と、被加工物２に向けて液体を液柱Ｗとして噴射するとともに、レーザ光Ｌを上記液柱Ｗに導光する加工ヘッド６とを備えている。
上記加工テーブル３は従来公知であるので詳細な説明をしないが、上記被加工物２を加工ヘッド６に対して水平方向に移動させるようになっており、また上記加工ヘッド６は図示しない昇降手段によって垂直方向に移動するようにされている。
本実施例では、上記被加工物２として板厚の薄い半導体ウエハを切断加工し、この他にもエポキシ樹脂板や樹脂と金属からなる複合材料なども切断加工することができる。また、切断加工のほかにも、被加工物２表面に対して溝加工を行うことも可能である。
また上記レーザ発振器４はＹＡＧレーザであり、加工に応じてＣＷ発振又はパルス発振が可能であり、またその出力やパルスの発振周期を適宜調整できるようになっている。
さらに、レーザ発振器４としてこの他にも半導体レーザやＣＯ２レーザ等を用いることも可能であるが、ＣＯ２レーザのように照射されるレーザ光Ｌが水に吸収されやすい波長である場合には、加工ヘッド６より噴射される液体をレーザ光Ｌが吸収されないような液体にすればよい。 The illustrated embodiment will be described below. FIG. 1 shows a hybrid laser processing apparatus 1 according to the present invention. A laser beam L is guided to a liquid column W formed by jetting a liquid, so that a workpiece 2 is required. It is a device that cuts into a shape.
The hybrid laser processing apparatus 1 includes a processing table 3 that supports the workpiece 2, a laser oscillator 4 that oscillates laser light L, a high-pressure pump 5 that serves as a liquid supply unit that supplies a liquid such as water, A processing head 6 that injects liquid toward the workpiece 2 as a liquid column W and guides the laser beam L to the liquid column W is provided.
The processing table 3 is conventionally known and will not be described in detail. However, the workpiece 2 is moved in the horizontal direction with respect to the processing head 6, and the processing head 6 is not shown. It is intended to move vertically.
In the present embodiment, a thin semiconductor wafer can be cut as the workpiece 2, and an epoxy resin plate or a composite material made of resin and metal can also be cut. In addition to the cutting process, it is also possible to perform a groove process on the surface of the workpiece 2.
The laser oscillator 4 is a YAG laser, which can perform CW oscillation or pulse oscillation according to processing, and can appropriately adjust its output and pulse oscillation period.
In addition to this, a semiconductor laser, a CO 2 laser, or the like can be used as the laser oscillator 4. However, when the laser light L irradiated has a wavelength that is easily absorbed by water, such as a CO 2 laser. The liquid ejected from the processing head 6 may be a liquid that does not absorb the laser light L.

次に上記加工ヘッド６について説明すると、加工ヘッド６は図示しない昇降手段に固定された平板状のフレーム１１と、上記レーザ光Ｌを集光する集光レンズ１２と、上記高圧ポンプ５より供給された液体を液柱Ｗにして噴射するとともに、当該液柱Ｗにレーザ光Ｌを導光する噴射ノズル１３と、上記集光レンズ１２と噴射ノズル１３の相対位置や角度を調整する調整手段１４とを備えている。
なお図１では、説明のため図示下方側（後述する第６プレート４１より下方）の断面図は、図２におけるＩ−Ｉの断面で切断した断面図となっている。
上記フレーム１１はレーザ発振器４によって発振されるレーザ光Ｌの光軸上に設けられており、レーザ光Ｌの光軸が通過する位置には円形の貫通孔１１ａが形成されている。
上記集光レンズ１２はレーザ光Ｌの光軸上に配置され、円筒状のレンズホルダ２１の下端に保持されるとともに、このレンズホルダ２１は略十字型（図２参照）の取付ステー２２を介してフレーム１１の下面に固定されている。
なお、図２は、図１におけるＩＩ−ＩＩの断面で切断した断面図となっているが、説明のため、下記第２保持円筒２８ｂについては表示を省略している。
また上記噴射ノズル１３もレーザ光Ｌの光軸上に配置されており、この噴射ノズル１３は円筒状のノズルホルダ２３の下端に保持されると共に、当該ノズルホルダ２３は上記調整手段１４によって移動するようになっている。 Next, the processing head 6 will be described. The processing head 6 is supplied from a flat frame 11 fixed to a lifting means (not shown), a condensing lens 12 for condensing the laser light L, and the high-pressure pump 5. The liquid nozzle W to eject the liquid to the liquid column W and guide the laser light L to the liquid column W; and adjusting means 14 to adjust the relative position and angle of the condenser lens 12 and the ejection nozzle 13; It has.
In FIG. 1, a cross-sectional view on the lower side of the drawing (below a sixth plate 41 described later) is a cross-sectional view taken along the line II in FIG.
The frame 11 is provided on the optical axis of the laser beam L oscillated by the laser oscillator 4, and a circular through hole 11a is formed at a position where the optical axis of the laser beam L passes.
The condenser lens 12 is disposed on the optical axis of the laser beam L, and is held at the lower end of a cylindrical lens holder 21. The lens holder 21 is attached via a substantially cross-shaped (see FIG. 2) mounting stay 22. Are fixed to the lower surface of the frame 11.
FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1, but for the sake of explanation, the following second holding cylinder 28 b is not shown.
The ejection nozzle 13 is also disposed on the optical axis of the laser beam L. The ejection nozzle 13 is held at the lower end of a cylindrical nozzle holder 23 and the nozzle holder 23 is moved by the adjusting means 14. It is like that.

図３は上記噴射ノズル１３およびノズルホルダ２３の拡大図を示し、上記ノズルホルダ２３には被加工物２側から順に、小径部２３ａ、中径部２３ｂ、大径部２３ｃが形成され、上記噴射ノズル１３は上記小径部２３ａの下端にリング状の保持部材２４を用いて固定されている。
上記噴射ノズル１３はステンレス製で、噴射ノズル１３の中央には噴射孔１３ａが形成され、該噴射孔１３ａには、被加工物２に向けて縮径する第１傾斜面１３ｂと、当該第１傾斜面１３ｂよりも被加工物２側に形成されて被加工物２に向けて拡径する第２傾斜面１３ｃとが形成されている。
上記第１傾斜面１３ｂと第２傾斜面１３ｃとは、最小径部１３ｄで接続されており、上記第１傾斜面１３ｂには、レーザ光Ｌを反射させるための鏡面加工が施されている。
また、後に詳述するように、上記第１傾斜面１３ｂの角度は、上記集光レンズ１２によって集光されるレーザ光Ｌの円錐角よりも大きくなるように設定されている。 FIG. 3 is an enlarged view of the injection nozzle 13 and the nozzle holder 23. A small diameter portion 23a, a medium diameter portion 23b, and a large diameter portion 23c are formed on the nozzle holder 23 in this order from the workpiece 2 side. The nozzle 13 is fixed to the lower end of the small diameter portion 23a using a ring-shaped holding member 24.
The injection nozzle 13 is made of stainless steel, and an injection hole 13 a is formed at the center of the injection nozzle 13. The injection hole 13 a has a first inclined surface 13 b that decreases in diameter toward the workpiece 2, and the first A second inclined surface 13c that is formed closer to the workpiece 2 than the inclined surface 13b and expands toward the workpiece 2 is formed.
The first inclined surface 13b and the second inclined surface 13c are connected by a minimum diameter portion 13d, and the first inclined surface 13b is mirror-finished for reflecting the laser light L.
As will be described in detail later, the angle of the first inclined surface 13b is set to be larger than the cone angle of the laser light L condensed by the condenser lens 12.

上記ノズルホルダ２３の中径部２３ｂには、シール部材２５を介してガラス板２６がはめ込まれ、このガラス板２６は上記中径部２３ｂの内周面に加工されたねじ部に螺合するナット２７によって固定されている。
また、上記小径部２３ａの位置には、小径部２３ａを中心に同心円上に等間隔に４つの接続口２３ｄが形成されており、この接続口２３ｄは液体通路２３ｅを介して小径部２３ａに連通し、上記高圧ポンプ５によって送液された液体は上記ガラス板２６よりも下方の小径部２３ａ内に供給される。
そして上記保持部材２４の中央には、上記第２傾斜面１３ｃよりも大径の貫通孔が設けられており、この貫通孔は上記第２傾斜面１３ｃと共に、噴射ノズル１３から噴射される液柱Ｗを囲繞するエアポケットＰを構成している。 A glass plate 26 is fitted into the middle diameter portion 23b of the nozzle holder 23 via a seal member 25, and the glass plate 26 is a nut that is screwed into a screw portion processed on the inner peripheral surface of the middle diameter portion 23b. 27 is fixed.
Further, at the position of the small diameter portion 23a, four connection ports 23d are formed at equal intervals on a concentric circle with the small diameter portion 23a as the center, and the connection ports 23d communicate with the small diameter portion 23a through the liquid passage 23e. The liquid fed by the high-pressure pump 5 is supplied into the small-diameter portion 23 a below the glass plate 26.
A through hole having a diameter larger than that of the second inclined surface 13c is provided in the center of the holding member 24. The through hole is a liquid column ejected from the injection nozzle 13 together with the second inclined surface 13c. An air pocket P surrounding W is formed.

上記調整手段１４は、上記ノズルホルダ２３を保持する保持円筒２８と、当該保持円筒２８を水平方向に移動させるＸＹ軸ステージ２９と、ＸＹ軸ステージ２９を垂直方向に移動させるＺ軸ステージ３０と、Ｚ軸ステージ３０の角度を変更させる角度調整ステージ３１とを備えている。
上記保持円筒２８は円筒状の第１保持円筒２８ａおよび第２保持円筒２８ｂから構成され、このうち第１保持円筒２８ａは上記ＸＹ軸ステージ２９に固定され、第２保持円筒２８ｂの下端には上記ノズルホルダ２３が固定されている。そして噴射ノズル１３における噴射孔１３ａの中心軸と第１，第２保持円筒２８ａ，２８ｂの中心軸とが一致するようになっている。
また、上記第２保持円筒２８ｂの内部には上記レンズホルダ２１が相互に接触しないように収容されており、第１保持円筒２８ａおよび第２保持円筒２８ｂは、上記レンズホルダ２１をフレーム１１に固定する上記取付ステー２２と干渉しないよう、上記４本の連結部材３２（図２参照）によって連結されている。 The adjusting means 14 includes a holding cylinder 28 that holds the nozzle holder 23, an XY axis stage 29 that moves the holding cylinder 28 in the horizontal direction, a Z axis stage 30 that moves the XY axis stage 29 in the vertical direction, An angle adjustment stage 31 that changes the angle of the Z-axis stage 30 is provided.
The holding cylinder 28 includes a cylindrical first holding cylinder 28a and a second holding cylinder 28b. The first holding cylinder 28a is fixed to the XY axis stage 29, and the lower end of the second holding cylinder 28b The nozzle holder 23 is fixed. The central axis of the injection hole 13a in the injection nozzle 13 and the central axes of the first and second holding cylinders 28a and 28b are made to coincide with each other.
The lens holder 21 is accommodated inside the second holding cylinder 28b so as not to contact each other. The first holding cylinder 28a and the second holding cylinder 28b fix the lens holder 21 to the frame 11. The four connecting members 32 (see FIG. 2) are connected so as not to interfere with the mounting stays 22.

上記ＸＹ軸ステージ２９は、上記第１保持円筒２８ａを固定する第１プレート３３と、第１プレート３３を下方から保持する第２プレート３４と、第２プレート３４を下方から保持する第３プレート３５と、第１保持円筒２８ａを図示左右方向のＸ軸方向と、図示奥行き方向のＹ軸方向とに移動させるマイクロメータ３６，３７とを備えている。
上記第１〜第３プレート３３〜３５の中央にはそれぞれ貫通孔３３ａ〜３５ａが形成され、第１プレート３３の貫通孔３３ａには、第１プレート３３の上面に固定された固定部材３３ｂにより、上記第１保持円筒２８ａが垂下するように固定されている。
また図４に示すように、第１〜第３プレート３３〜３５は平面的に略正方形の形状を有し、その側面がそれぞれ上記Ｘ軸方向及びＹ軸方向を向くように設置されている。
さらに、上記第１プレート３３と第２プレート３４とは、Ｘ軸方向に形成された図示しないレールによってＸ軸方向に相対移動し、上記第２プレート３４と第３プレート３５とは、Ｙ軸方向に形成されたレール３５ｂ（図１参照）によってＹ軸方向に相対移動するようになっている。
そして上記マイクロメータ３６、３７は上記第２プレート３４の側面にそれぞれＸ軸方向及びＹ軸方向に向けて固定され、第１プレート３３の側面には、マイクロメータ３６によって押圧可能な位置に突起３３ｃが設けられ、上記第３プレート３５の側面には、上記マイクロメータ３７の先端によって押圧可能な位置に突起３５ｃが設けられている。
このような構成により、Ｘ軸方向を向いたマイクロメータ３６によって上記突起３３ｃを押圧することで、ノズルホルダ２３を保持円筒２８および第１プレート３３ごとＸ軸方向に移動させることができ、またＹ軸方向を向いたマイクロメータ３７を操作することで、ノズルホルダ２３を保持円筒２８および第１、第２プレート３３、３４ごとＹ軸方向に移動させることができる。 The XY axis stage 29 includes a first plate 33 that fixes the first holding cylinder 28a, a second plate 34 that holds the first plate 33 from below, and a third plate 35 that holds the second plate 34 from below. And micrometers 36 and 37 for moving the first holding cylinder 28a in the X-axis direction in the horizontal direction in the figure and the Y-axis direction in the depth direction in the figure.
Through holes 33a to 35a are formed at the centers of the first to third plates 33 to 35, respectively, and the through holes 33a of the first plate 33 are fixed by fixing members 33b fixed to the upper surface of the first plate 33. The first holding cylinder 28a is fixed so as to hang down.
As shown in FIG. 4, the first to third plates 33 to 35 have a substantially square shape in plan view, and are disposed so that the side surfaces thereof face the X-axis direction and the Y-axis direction, respectively.
Further, the first plate 33 and the second plate 34 are moved relative to each other in the X-axis direction by a rail (not shown) formed in the X-axis direction, and the second plate 34 and the third plate 35 are moved in the Y-axis direction. The rail 35b (see FIG. 1) formed on the Y-axis moves relative to each other.
The micrometers 36 and 37 are fixed to the side surfaces of the second plate 34 in the X-axis direction and the Y-axis direction, respectively, and the projections 33c are formed on the side surfaces of the first plate 33 at positions that can be pressed by the micrometer 36. On the side surface of the third plate 35, a projection 35c is provided at a position that can be pressed by the tip of the micrometer 37.
With such a configuration, the nozzle holder 23 can be moved together with the holding cylinder 28 and the first plate 33 in the X-axis direction by pressing the projection 33c with the micrometer 36 facing the X-axis direction. By operating the micrometer 37 facing the axial direction, the nozzle holder 23 can be moved in the Y-axis direction together with the holding cylinder 28 and the first and second plates 33 and 34.

上記Ｚ軸ステージ３０はその上面に上記第３プレート３５を固定する第４プレート３８と、上記角度調整ステージ３１の上面に固定された第５プレート３９と、第４、第５プレート３８，３９の間に設けられた２つのハンドル４０とを備え、第４、第５プレート３８，３９の中央には、移動する第１保持円筒２８ａと接触しない範囲で貫通孔３８ａ，３９ａが形成されている。
ここで、上記ハンドル４０は従来公知のジャッキスクリュー方式によって第４プレート３８を昇降させるものであり、その構成については詳細な説明を省略する。
そしてこのＺ軸ステージ３０によれば、上記ハンドル４０のいずれか一方を操作することで第４プレート３８は第５プレート３９に対して平行を保ったまま昇降し、上記ノズルホルダ２３を保持円筒２８及びＸＹ軸ステージ２９ごと昇降させることができる。 The Z-axis stage 30 has a fourth plate 38 for fixing the third plate 35 on its upper surface, a fifth plate 39 fixed on the upper surface of the angle adjusting stage 31, and fourth and fifth plates 38, 39. There are two handles 40 provided between them, and through holes 38a and 39a are formed in the center of the fourth and fifth plates 38 and 39 in a range not contacting the moving first holding cylinder 28a.
Here, the handle 40 raises and lowers the fourth plate 38 by a conventionally known jack screw system, and detailed description of the configuration is omitted.
According to the Z-axis stage 30, the fourth plate 38 is moved up and down while maintaining parallel to the fifth plate 39 by operating any one of the handles 40, and the nozzle holder 23 is held in the holding cylinder 28. The XY axis stage 29 can be moved up and down.

そして角度調整ステージ３１は、その上面に上記Ｚ軸ステージ３０を固定する第６プレート４１と、上記フレーム１１を貫通し、その先端で第６プレート４１を下方から保持する支点ボルト４２と、同じく第６プレート４１を下方から保持する２本の調整ボルト４３（図５参照）とを備えている。
図２に示すように、上記第６プレート４１は略正方形の形状を有しており、上記支点ボルト４２は、第６プレート４１の四隅のうちのいずれかの隅部を下面から支持し、上記調整ボルト４３は、上記支点ボルト４２を挟んだ位置の隅部を下面から支持するようになっている。
図５に示すように、上記支点ボルト４２および調整ボルト４３の先端は半球状に加工され、その先端は第６プレート４１に埋設された受け部材４４の凹部４４ａに収容されるようになっている。
そして、上記調整ボルト４３はフレーム１１の下面側に位置するダイヤル４３ａによってボルトの先端を上下に移動させることができるようになっており、これら２つの調整ボルト４３を用いることで、第６プレート４１のフレーム１１に対する傾きを変更することができる。
すなわち、２つの調整ボルト４３により、上記ノズルホルダ２３のフレーム１１に対する傾きを、保持円筒２８およびＸＹ軸ステージ２９、Ｚ軸ステージ３０ごと調整することができる。
このような構成を有する調整手段１４によれば、ＸＹ軸ステージ２９および角度調整ステージ３１を用いることで、レーザ発振器４より照射されたレーザ光Ｌの光軸に対し、噴射ノズル１３より噴射される液柱Ｗの位置と角度とを一致させることができ、またＺ軸ステージ３０を用いることで、集光レンズ１２によって集光されるレーザ光Ｌの焦点位置を、液柱Ｗの方向に沿って移動させることができる。 The angle adjustment stage 31 has a sixth plate 41 that fixes the Z-axis stage 30 on the upper surface thereof, a fulcrum bolt 42 that passes through the frame 11 and holds the sixth plate 41 from below at the tip thereof, 6 plate 41 is provided with two adjusting bolts 43 (see FIG. 5) for holding from below.
As shown in FIG. 2, the sixth plate 41 has a substantially square shape, and the fulcrum bolt 42 supports any one of the four corners of the sixth plate 41 from the lower surface. The adjustment bolt 43 is configured to support a corner portion at a position sandwiching the fulcrum bolt 42 from the lower surface.
As shown in FIG. 5, the distal ends of the fulcrum bolt 42 and the adjustment bolt 43 are processed into a hemispherical shape, and the distal ends thereof are accommodated in the recesses 44 a of the receiving member 44 embedded in the sixth plate 41. .
The adjustment bolt 43 can be moved up and down by a dial 43 a located on the lower surface side of the frame 11. By using these two adjustment bolts 43, the sixth plate 41 can be moved. Can be changed with respect to the frame 11.
That is, the tilt of the nozzle holder 23 with respect to the frame 11 can be adjusted by the two adjusting bolts 43 together with the holding cylinder 28, the XY axis stage 29, and the Z axis stage 30.
According to the adjustment means 14 having such a configuration, the XY axis stage 29 and the angle adjustment stage 31 are used to inject from the injection nozzle 13 with respect to the optical axis of the laser light L irradiated from the laser oscillator 4. The position and angle of the liquid column W can be matched, and the focal position of the laser light L condensed by the condenser lens 12 can be adjusted along the direction of the liquid column W by using the Z-axis stage 30. Can be moved.

図６は上記噴射ノズル１３の拡大図を示しており、この図において、レーザ光Ｌの光軸と噴射ノズル１３より噴射される液柱Ｗの中心軸とは、上記調整手段１４のＸＹ軸ステージ２９及び角度調整ステージ３１によって一致するように調整されている。
本実施例では、噴射ノズル１３の噴射孔１３ａの第１傾斜面１３ｂの最小径部１３ｄの径は５０μｍ、最大径部１３ｅの径は８０μｍ、最小径部１３ｄから最大径部１３ｅまでのＺ軸方向の距離は１００μｍとなっており、また第１傾斜面の円錐角θ１は、集光レンズ１２によって集光されるレーザ光Ｌの円錐角θ２よりも大きくなるように設定されている。
この状態で上記高圧ポンプ５によってノズルホルダ２３内に液体を供給すると、当該液体はノズルホルダ２３の小径部２３ａ内を経て、上記噴射ノズル１３の噴射孔１３ａより被加工物２に向けて噴射される。
このとき、第１傾斜面１３ｂの下部には第２傾斜面１３ｃ及び保持部材２４の貫通孔によって、エアポケットＰが形成されているため、噴射された液体は拡散することなく、第１傾斜面１３ｂの最小径部１３ｄの径とほぼ同径の液柱Ｗとなって噴射される。
次に、レーザ発振器４よりレーザ光４が発振され、このレーザ光Ｌは集光レンズ１２によって集光された後、上記ガラス板２６とノズルホルダ２３の小径部２３ａ内に充満する液体とを透過して、上記噴射ノズル１３へと照射される。
本実施例では、上記Ｚ軸ステージ３０を調整することで、レーザ光Ｌの焦点が上記第１傾斜面１３ｂの最小径部１３ｄを越えた液柱Ｗ内に位置し、かつ、レーザ光Ｌが噴射孔１３ａの最大径部１３ｅよりも小さく集光されるようになっている。
なお、図６には破線により噴射ノズル１３がない場合のレーザ光Ｌの焦点を示している。
このようにして集光されたレーザ光Ｌは、最小径部１３ｄよりも外側の部分が上記第１傾斜面１３ｂによって遮られ、当該部分が一度だけ第１傾斜面１３ｂに反射した後、上記液柱Ｗにおける外気との境界面で臨界角より大きい入射角で反射を繰り返しながら被加工物２まで導光される。 FIG. 6 shows an enlarged view of the injection nozzle 13, in which the optical axis of the laser light L and the central axis of the liquid column W injected from the injection nozzle 13 are the XY axis stage of the adjusting means 14. 29 and the angle adjustment stage 31 are adjusted so as to coincide with each other.
In this embodiment, the diameter of the minimum diameter portion 13d of the first inclined surface 13b of the injection hole 13a of the injection nozzle 13 is 50 μm, the diameter of the maximum diameter portion 13e is 80 μm, and the Z axis from the minimum diameter portion 13d to the maximum diameter portion 13e. The distance in the direction is 100 μm, and the cone angle θ1 of the first inclined surface is set to be larger than the cone angle θ2 of the laser light L condensed by the condenser lens 12.
In this state, when a liquid is supplied into the nozzle holder 23 by the high-pressure pump 5, the liquid passes through the small diameter portion 23 a of the nozzle holder 23 and is sprayed toward the workpiece 2 from the spray hole 13 a of the spray nozzle 13. The
At this time, since the air pocket P is formed in the lower part of the first inclined surface 13b by the second inclined surface 13c and the through hole of the holding member 24, the injected liquid does not diffuse and the first inclined surface The liquid column W having the same diameter as that of the minimum diameter portion 13d of 13b is ejected.
Next, laser light 4 is oscillated from the laser oscillator 4, and this laser light L is condensed by the condenser lens 12 and then transmitted through the glass plate 26 and the liquid filling the small diameter portion 23 a of the nozzle holder 23. Then, the spray nozzle 13 is irradiated.
In the present embodiment, by adjusting the Z-axis stage 30, the focal point of the laser beam L is located in the liquid column W beyond the minimum diameter portion 13d of the first inclined surface 13b, and the laser beam L is The light is condensed smaller than the maximum diameter portion 13e of the injection hole 13a.
In FIG. 6, the focal point of the laser beam L when there is no injection nozzle 13 is indicated by a broken line.
The laser light L thus collected is shielded by the first inclined surface 13b at a portion outside the minimum diameter portion 13d, and the portion is reflected by the first inclined surface 13b only once. The light is guided to the workpiece 2 while being repeatedly reflected at an incident angle larger than the critical angle at the boundary surface between the column W and the outside air.

このように、本実施例のハイブリッドレーザ加工装置１によれば、レーザ光Ｌの焦点を噴射ノズル１３における第１傾斜面１３ｂの最小径部１３ｄを越えた液柱Ｗ内に設定し、最小径部１３ｂより外側に位置するレーザ光Ｌは上記第１傾斜面１３ｂに反射して液柱Ｗ内に導光されるので、レーザ光Ｌの焦点位置がＺ軸方向に多少ずれていても、レーザ光Ｌを液柱Ｗに導光することができ、上記Ｚ軸ステージ３０によるレーザ光Ｌの焦点位置の調整が容易となる。
これに対し、上記特許文献１では、噴射ノズルの開口部にレーザ光の焦点を設定しなければならず、焦点位置がＺ軸方向にずれてしまうと、噴射ノズルにレーザ光が反射して液柱内にレーザ光が導光されないばかりか、レーザ光が予期しない壁面に照射されてしまい、加工ヘッド自体が損傷してしまうおそれがあった。
また、レーザ光Ｌは第１傾斜面１３ｂに一度だけ反射するようになっているので、噴射ノズル１３に対する鏡面加工等の範囲を少なくすることができ、また本実施例の場合、レーザ光Ｌの反射によって噴射ノズル１３の反射面が損傷しても、ノズルホルダ２３の先端に設けられた噴射ノズル１３だけを交換すれば良いので、製造コストとランニングコストを低減することができる。
これに対し、上記特許文献２では噴射ノズル内で何度もレーザ光を反射させているので、鏡面加工等の範囲を広くする必要があり、またレーザ光の反射によって噴射ノズルが損傷した場合、噴射ノズル全体の交換・修理が必要となるので、製造コストとランニングコストが高いものとなっていた。
さらに、レーザ光Ｌは第１傾斜面１３ｂに一度だけ反射するようになっているので、液柱Ｗ内の外気との境界面で反射するレーザ光Ｌの入射角が必要以上に小さくなることは無く、液柱の境界面におけるレーザ光の入射角を臨界角よりも大きくすることができるので、レーザ光Ｌが液柱Ｗより外気中に飛び出してしまうことはない。
これに対し、上記特許文献２では噴射ノズル内で何度もレーザ光を反射させており、反射のたびに噴射ノズル内壁面での入射角が小さくなってしまうことから、液柱の境界面におけるレーザ光の入射角が臨界角よりも小さくなってしまい、レーザ光が外気中に飛び出してしまうおそれがあった。 Thus, according to the hybrid laser processing apparatus 1 of the present embodiment, the focal point of the laser light L is set in the liquid column W beyond the minimum diameter portion 13d of the first inclined surface 13b in the injection nozzle 13, and the minimum diameter is set. Since the laser beam L located outside the portion 13b is reflected by the first inclined surface 13b and guided into the liquid column W, the laser beam L can be obtained even if the focal position of the laser beam L is slightly shifted in the Z-axis direction. The light L can be guided to the liquid column W, and the adjustment of the focal position of the laser light L by the Z-axis stage 30 is facilitated.
On the other hand, in Patent Document 1, the focal point of the laser beam must be set at the opening of the ejection nozzle. When the focal position is shifted in the Z-axis direction, the laser beam is reflected by the ejection nozzle and the liquid Not only is the laser beam not guided into the column, but the laser beam is irradiated to an unexpected wall surface, which may damage the machining head itself.
Further, since the laser beam L is reflected only once on the first inclined surface 13b, the range of mirror surface processing or the like for the injection nozzle 13 can be reduced, and in this embodiment, the laser beam L Even if the reflection surface of the injection nozzle 13 is damaged due to reflection, it is only necessary to replace the injection nozzle 13 provided at the tip of the nozzle holder 23, so that the manufacturing cost and running cost can be reduced.
On the other hand, in the above-mentioned Patent Document 2, since the laser light is reflected many times in the injection nozzle, it is necessary to widen the range such as mirror finishing, and when the injection nozzle is damaged by the reflection of the laser light, Since the entire injection nozzle needs to be replaced and repaired, the manufacturing cost and running cost were high.
Furthermore, since the laser light L is reflected only once on the first inclined surface 13b, the incident angle of the laser light L reflected at the boundary surface with the outside air in the liquid column W is less than necessary. In addition, since the incident angle of the laser beam at the boundary surface of the liquid column can be made larger than the critical angle, the laser beam L does not jump out of the liquid column W into the outside air.
On the other hand, in the above-mentioned Patent Document 2, the laser beam is reflected many times in the injection nozzle, and the incident angle on the inner wall surface of the injection nozzle is reduced every time the reflection is performed. There is a possibility that the incident angle of the laser beam becomes smaller than the critical angle and the laser beam jumps out into the outside air.

なお、上記実施例において、噴射ノズル１３はステンレス製であって第１傾斜面１３ｂに鏡面加工を施しているが、上記第１傾斜面１３ｂにレーザ光Ｌを反射させるコーティングを施せば、噴射ノズル１３の素材を他の素材とすることも可能である。
また、上記実施例では集光レンズ１２はフレーム１１に固定され、集光レンズ１２の位置や角度を調整できないようになっているが、別途調整手段を設けて、集光レンズ１２の位置や角度の調整をすることも可能である。 In the above embodiment, the injection nozzle 13 is made of stainless steel, and the first inclined surface 13b is mirror-finished. However, if the first inclined surface 13b is coated to reflect the laser light L, the injection nozzle 13 It is also possible to use 13 materials as other materials.
In the above embodiment, the condensing lens 12 is fixed to the frame 11 so that the position and angle of the condensing lens 12 cannot be adjusted. It is also possible to make adjustments.

本実施例におけるハイブリッドレーザ加工装置の断面図。Sectional drawing of the hybrid laser processing apparatus in a present Example. 図１のＩＩ―ＩＩ断面における平面図。The top view in the II-II cross section of FIG. 噴射ノズル及びノズルホルダについての断面図。Sectional drawing about an injection nozzle and a nozzle holder. ＸＹ軸ステージについての平面図。The top view about an XY-axis stage. 図２のＶ−Ｖ断面における断面図。Sectional drawing in the VV cross section of FIG. 噴射ノズルについての拡大断面図。The expanded sectional view about an injection nozzle.

符号の説明Explanation of symbols

１ ハイブリッドレーザ加工装置 ２ 被加工物
４ レーザ発振器 ５ 高圧ポンプ
６ 加工ヘッド １２ 集光レンズ
１３ 噴射ノズル １３ａ 噴射孔
１３ｂ 第１傾斜面 １３ｃ 第２傾斜面
１３ｄ 最小径部 １４ 調整手段
Ｌ レーザ光 Ｗ 液柱 DESCRIPTION OF SYMBOLS 1 Hybrid laser processing apparatus 2 Workpiece 4 Laser oscillator 5 High pressure pump 6 Processing head 12 Condensing lens 13 Injection nozzle 13a Injection hole 13b 1st inclined surface 13c 2nd inclined surface 13d Minimum diameter part 14 Adjustment means L Laser beam W Liquid Pillar

Claims (3)

噴射孔を有する噴射ノズルと、当該噴射ノズルに高圧の液体を供給する液体供給手段と、レーザ光を発振するレーザ発振器と、該レーザ発振器から発振されたレーザ光を集光する集光レンズと、上記噴射ノズルと集光レンズとが設けられた加工ヘッドとを備え、上記液体供給手段から供給された液体を噴射孔から液柱にして外部に噴射させると共に、集光レンズによって上記液柱にレーザ光を導光して、被加工物の加工を行うハイブリッドレーザ加工装置において、
上記噴射ノズルの上記噴射孔に、被加工物に向けて縮径する第１傾斜面と、当該第１傾斜面の最小径部に接続されるともに上記第１傾斜面よりも被加工物側に形成されて被加工物に向けて拡径する第２傾斜面とを形成し、
上記集光レンズの焦点を上記第１傾斜面の最小径部よりも被加工物側に超えた位置に設定するとともに上記噴射孔より噴射された液柱の内部に設定し、かつ上記噴射孔内に照射されたレーザ光のうち、上記第１傾斜面によって遮られる部分を該第１傾斜面で一度だけ反射させてから上記液柱に導光するように設定するとともに、上記第２傾斜面によって上記液柱を囲繞するエアポケットを形成することを特徴とするハイブリッドレーザ加工装置。 An injection nozzle having an injection hole, a liquid supply means for supplying high-pressure liquid to the injection nozzle, a laser oscillator that oscillates laser light, a condenser lens that condenses the laser light oscillated from the laser oscillator, A processing head provided with the jet nozzle and a condensing lens; the liquid supplied from the liquid supply means is ejected from the ejection hole as a liquid column and ejected to the outside; In a hybrid laser processing apparatus that guides light and processes a workpiece,
The injection hole of the injection nozzle is connected to a first inclined surface that is reduced in diameter toward the workpiece, and is connected to a minimum diameter portion of the first inclined surface, and closer to the workpiece than the first inclined surface. Forming a second inclined surface that is formed and expands toward the workpiece;
The focal point of the condensing lens is set at a position beyond the minimum diameter portion of the first inclined surface on the workpiece side, set inside the liquid column ejected from the ejection hole , and in the ejection hole of the laser beam irradiated to a portion to be intercepted by the first inclined surface and sets to guide the by reflecting only once the first inclined surface to the liquid column, by the second inclined surface A hybrid laser processing apparatus, wherein an air pocket surrounding the liquid column is formed. 上記噴射ノズルは上記第２傾斜面よりも大径の貫通孔の設けられた保持部材によって上記加工ヘッドに固定され、
上記貫通孔は上記第２傾斜面と共に上記液柱を囲繞するエアポケットを形成することを特徴とする請求項１に記載のハイブリッドレーザ加工装置。 The injection nozzle is fixed to the processing head by a holding member provided with a through hole having a diameter larger than that of the second inclined surface.
The hybrid laser processing apparatus according to claim 1 , wherein the through hole forms an air pocket surrounding the liquid column together with the second inclined surface . 上記加工ヘッドに、上記集光レンズと噴射ノズルとを相対移動させて、上記集光レンズによって集光されるレーザ光と、上記噴射ノズルより噴射される液柱との位置を調整する調整手段を設けることを特徴とする請求項１または請求項２のいずれかに記載のハイブリッドレーザ加工装置。 Adjusting means for adjusting the position of the laser beam condensed by the condenser lens and the liquid column ejected from the ejection nozzle by relatively moving the condenser lens and the ejection nozzle to the processing head. The hybrid laser processing apparatus according to claim 1 , wherein the hybrid laser processing apparatus is provided.
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