JP5029821B2 - フレキシブル配線体及び液滴吐出ヘッド - Google Patents
フレキシブル配線体及び液滴吐出ヘッド Download PDFInfo
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- JP5029821B2 JP5029821B2 JP2007161119A JP2007161119A JP5029821B2 JP 5029821 B2 JP5029821 B2 JP 5029821B2 JP 2007161119 A JP2007161119 A JP 2007161119A JP 2007161119 A JP2007161119 A JP 2007161119A JP 5029821 B2 JP5029821 B2 JP 5029821B2
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- wiring
- electrical load
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- flexible wiring
- connection terminal
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- 239000000463 material Substances 0.000 claims description 75
- 238000010030 laminating Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14217—Multi layer finger type piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2002/14306—Flow passage between manifold and chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Ink Jet (AREA)
- Coating Apparatus (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
つまり、電気的負荷に接続されるべきバンプ体は、複数の配線材に分かれて形成されているから、配線材1つ当たりに形成されるバンプ体の数を少なくすることができる。換言すれば、電気的負荷の駆動に必要な導線数に対して、配線材1つ当たりに配線する導線数を少なくできるので、配線密度を下げ、線幅を太くできる。従って、電気的負荷に駆動部が高密度に備えられていても、片面のみに配線された配線材を使い、個々の配線材の配線密度を下げることができるので、配線材の部品コストの削減を図ることができる。
2 キャリッジ
3 吐出ヘッド
4 フレキシブル配線体
7 ノズル
32 アクチュエータ
39 表面電極
41 第1配線材
42 第2配線材
43 貫通穴
44 出力用電極
44a 第1バンプ体
44b 第2バンプ体
50 回路素子
51 補助配線材
52 放熱体
55 基材
56 導線
57 被覆材
Claims (3)
- 電気的負荷の接続端子と外部信号源側とを接続するフレキシブル配線体において、
基材の一方の広幅面に多数の導線が配線され、前記導線及び前記一方の広幅面に絶縁性の被覆材を積層してなる配線材が複数備えられ、前記電気的負荷に対して、前記複数の配線材が広幅面同士を重ねて積層されており、
前記各配線材における前記電気的負荷と対向する側の広幅面には前記導線を露出させた部位に前記電気的負荷の前記接続端子と接続するための突起状のバンプ体がそれぞれ設けられ、
前記電気的負荷に対して他の配線材を介して重なる配線材の前記バンプ体は、前記電気的負荷に積層方向で最も近い配線材における前記基材及び被覆材に穿設された貫通穴を介して前記電気的負荷の前記接続端子に向かって突出するように形成されており、
前記貫通穴を介して突出するバンプ体における前記電気的負荷の前記接続端子に対向する被覆材の広幅面から突出された突出量と、前記電気的負荷に最も近い配線材に設けられたバンプ体における前記電気的負荷の前記接続端子に対向する被覆材の広幅面から突出された突出量とが同じになるように、各配線材毎に、バンプ体の高さが調節されていることを特徴とするフレキシブル配線体。 - 前記広幅面同士を重ねて積層された複数の前記配線材は、その各配線材毎に設けられた前記バンプ体が、その積層方向からの平面視で相互に分散するように配置されていることを特徴とする請求項1に記載のフレキシブル配線体。
- 前記複数の配線材は前記電気的負荷から同じ方向に引き出され、前記各配線材の前記引き出された領域には回路素子がそれぞれ実装されており、前記外部信号源側からの信号が前記回路素子を介して前記電気的負荷の前記接続端子に入力されることを特徴とする請求項1または2に記載のフレキシブル配線体。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007161119A JP5029821B2 (ja) | 2007-06-19 | 2007-06-19 | フレキシブル配線体及び液滴吐出ヘッド |
US12/142,722 US8469493B2 (en) | 2007-06-19 | 2008-06-19 | Flexible wiring member, liquid droplet jetting head, and method for connecting flexible wiring member and device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007161119A JP5029821B2 (ja) | 2007-06-19 | 2007-06-19 | フレキシブル配線体及び液滴吐出ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009004419A JP2009004419A (ja) | 2009-01-08 |
JP5029821B2 true JP5029821B2 (ja) | 2012-09-19 |
Family
ID=40136024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007161119A Active JP5029821B2 (ja) | 2007-06-19 | 2007-06-19 | フレキシブル配線体及び液滴吐出ヘッド |
Country Status (2)
Country | Link |
---|---|
US (1) | US8469493B2 (ja) |
JP (1) | JP5029821B2 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4854770B2 (ja) * | 2009-07-10 | 2012-01-18 | 富士通株式会社 | プリント基板ユニット及び電子機器 |
JP5218464B2 (ja) * | 2010-03-31 | 2013-06-26 | ブラザー工業株式会社 | 配線基板ユニット |
JP5067440B2 (ja) | 2010-03-31 | 2012-11-07 | ブラザー工業株式会社 | 配線基板 |
JP5447404B2 (ja) * | 2011-02-10 | 2014-03-19 | ブラザー工業株式会社 | 液体吐出装置 |
US8585185B2 (en) * | 2011-09-22 | 2013-11-19 | Xerox Corporation | High density electrical interconnect using limited density flex circuits |
JP6056129B2 (ja) * | 2011-11-10 | 2017-01-11 | セイコーエプソン株式会社 | 液体噴射ヘッド、および、液体噴射装置 |
JP6011169B2 (ja) * | 2012-09-04 | 2016-10-19 | ブラザー工業株式会社 | 液滴吐出装置 |
US8888254B2 (en) | 2012-09-13 | 2014-11-18 | Xerox Corporation | High density three-dimensional electrical interconnections |
US9079392B2 (en) * | 2013-09-26 | 2015-07-14 | Xerox Corporation | Double sided flex for improved bump interconnect |
JP6331759B2 (ja) * | 2014-06-26 | 2018-05-30 | セイコーエプソン株式会社 | インクジェットプリンタ |
JP6345552B2 (ja) * | 2014-09-10 | 2018-06-20 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッド及び液体噴射装置 |
JP6386324B2 (ja) * | 2014-09-29 | 2018-09-05 | 京セラ株式会社 | インクジェットヘッド及びプリンタ |
US9679862B2 (en) * | 2014-11-28 | 2017-06-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device having conductive bumps of varying heights |
US10780192B2 (en) * | 2015-09-16 | 2020-09-22 | The Procter & Gamble Company | Microfluidic delivery cartridges and methods of connecting cartridges with microfluidic delivery systems |
US10272684B2 (en) | 2015-12-30 | 2019-04-30 | Stmicroelectronics, Inc. | Support substrates for microfluidic die |
US10350324B1 (en) | 2018-05-15 | 2019-07-16 | The Procter & Gamble Company | Microfluidic cartridge and microfluidic delivery device comprising the same |
US10322202B1 (en) | 2018-05-15 | 2019-06-18 | The Procter & Gamble Company | Microfluidic cartridge and microfluidic delivery device comprising the same |
US10307783B1 (en) * | 2018-05-15 | 2019-06-04 | The Procter & Gamble Company | Microfluidic cartridge and microfluidic delivery device comprising the same |
JP2020001201A (ja) * | 2018-06-26 | 2020-01-09 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置および配線基板 |
JP6798577B2 (ja) * | 2018-09-19 | 2020-12-09 | セイコーエプソン株式会社 | 液体吐出装置、液体吐出システム、及びプリントヘッド |
CN117044048A (zh) * | 2021-03-15 | 2023-11-10 | 阿尔卑斯阿尔派株式会社 | 旋转连接器 |
WO2024116976A1 (ja) * | 2022-11-29 | 2024-06-06 | ソニーセミコンダクタソリューションズ株式会社 | コネクタ装置、半導体装置、基板間接続構造、および電子機器 |
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JPH06112620A (ja) | 1992-09-29 | 1994-04-22 | Minolta Camera Co Ltd | 配線の接続方法及び配線の接続構造 |
JP2003309354A (ja) | 2002-04-16 | 2003-10-31 | Sharp Corp | プリント配線基板の接続方法及びプリント配線基板 |
JP2004303885A (ja) | 2003-03-31 | 2004-10-28 | Seiko Epson Corp | 実装基板および電子デバイス |
US7338152B2 (en) * | 2003-08-13 | 2008-03-04 | Brother Kogyo Kabushiki Kaisha | Inkjet head |
JP4243850B2 (ja) * | 2004-05-11 | 2009-03-25 | ブラザー工業株式会社 | 積層型圧電素子及びそれを備えたインクジェット記録ヘッド |
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2007
- 2007-06-19 JP JP2007161119A patent/JP5029821B2/ja active Active
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2008
- 2008-06-19 US US12/142,722 patent/US8469493B2/en active Active
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Publication number | Publication date |
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JP2009004419A (ja) | 2009-01-08 |
US8469493B2 (en) | 2013-06-25 |
US20080316255A1 (en) | 2008-12-25 |
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