JP5026968B2 - Ledランプシステム - Google Patents
Ledランプシステム Download PDFInfo
- Publication number
- JP5026968B2 JP5026968B2 JP2007524455A JP2007524455A JP5026968B2 JP 5026968 B2 JP5026968 B2 JP 5026968B2 JP 2007524455 A JP2007524455 A JP 2007524455A JP 2007524455 A JP2007524455 A JP 2007524455A JP 5026968 B2 JP5026968 B2 JP 5026968B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- led lamp
- led
- chamber
- lamp system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 29
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 239000012780 transparent material Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910003480 inorganic solid Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Claims (10)
- LEDランプシステムであって、
− 光の放射のための少なくとも1つのLED素子、
− 少なくとも一部分は高反射型であるよう設計される内側側壁面と、放射される前記光のための光入射面と、前記チャンバ内へ放射される前記光及び前記内側側壁面から反射される前記光のための出射開口部とを備えるチャンバ、及び
− 前記チャンバの前記出射開口部に配設され、前記出射開口部に対向するアウトカップリング開口部であって前記光入射面と同じ寸法を有するアウトカップリング開口部を持つコリメータ、
を有するLEDランプシステム。 - 前記チャンバの前記光入射面がLED放射面によって形成されることを特徴とする請求項1に記載のLEDランプシステム。
- 前記チャンバの前記光入射面が、LED放射面と間隔をあけられていることを特徴とする請求項1に記載のLEDランプシステム。
- 担持体であって、波長フィルタ及び/又は該担持体の上及び/又は中に設けられる蛍光物質を備える担持体が、前記放射面から或る距離を置いて配設されることを特徴とする請求項3に記載のLEDランプシステム。
- 前記光入射面が、前記チャンバの前記出射開口部より大きいことを特徴とする請求項1乃至4のいずれか一項に記載のLEDランプシステム。
- 前記チャンバの前記内側側壁面が、前記光入射面の方に傾斜していることを特徴とする請求項1乃至5のいずれか一項に記載のLEDランプシステム。
- 請求項1乃至6のいずれか一項に記載のLEDランプシステムを複数備えるLEDランプアレイ。
- 複数の前記LEDランプシステムが共通の途切れのない担持体を持つことを特徴とする請求項7に記載のLEDランプアレイ。
- 複数のLEDランプシステムの前記LED素子が共通ベースプレート上に配設されることを特徴とする請求項7又は8に記載のLEDランプアレイ。
- 前記LEDランプアレイの様々なLEDランプシステムにおいて様々な波長特性のLED素子が用いられることを特徴とする請求項7乃至9のいずれか一項に記載のLEDランプアレイ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04103785 | 2004-08-06 | ||
EP04103785.4 | 2004-08-06 | ||
PCT/IB2005/052585 WO2006016326A2 (en) | 2004-08-06 | 2005-08-02 | Led lamp system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008509551A JP2008509551A (ja) | 2008-03-27 |
JP5026968B2 true JP5026968B2 (ja) | 2012-09-19 |
Family
ID=35058211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007524455A Expired - Fee Related JP5026968B2 (ja) | 2004-08-06 | 2005-08-02 | Ledランプシステム |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080298059A1 (ja) |
EP (1) | EP1776721A2 (ja) |
JP (1) | JP5026968B2 (ja) |
KR (1) | KR101163091B1 (ja) |
CN (1) | CN100521266C (ja) |
TW (1) | TWI430469B (ja) |
WO (1) | WO2006016326A2 (ja) |
Families Citing this family (31)
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US7330319B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | High brightness LED package with multiple optical elements |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
CN101467274B (zh) * | 2006-06-12 | 2012-02-29 | 3M创新有限公司 | 具有再发射半导体构造和光学元件的led装置 |
EP2036135A4 (en) * | 2006-06-12 | 2013-11-13 | 3M Innovative Properties Co | LED ARRANGEMENT WITH REASSEMBLING SEMICONDUCTOR CONSTRUCTION AND CONVERGING OPTICAL ELEMENT |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
KR100904178B1 (ko) * | 2007-07-27 | 2009-06-23 | 삼성전기주식회사 | 조명 기구 |
ATE506630T1 (de) | 2007-08-01 | 2011-05-15 | Koninkl Philips Electronics Nv | Kollimierendes modul und einrichtung für zero- overfill-beleuchtungsanwendungen mit strahlbreitensteuerung |
US9263651B2 (en) * | 2007-09-20 | 2016-02-16 | Koninklijke Philips N.V. | Collimator |
US20090154137A1 (en) * | 2007-12-14 | 2009-06-18 | Philips Lumileds Lighting Company, Llc | Illumination Device Including Collimating Optics |
JP5105165B2 (ja) * | 2007-12-18 | 2012-12-19 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
JP5348455B2 (ja) * | 2008-04-09 | 2013-11-20 | カシオ計算機株式会社 | 光源装置、プロジェクタ、及び光源装置の製造方法 |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8585251B2 (en) | 2008-12-12 | 2013-11-19 | Bridgelux, Inc. | Light emitting diode lamp |
US8585240B2 (en) | 2008-12-12 | 2013-11-19 | Bridgelux, Inc. | Light emitting diode luminaire |
JP5490821B2 (ja) * | 2009-01-05 | 2014-05-14 | コーニンクレッカ フィリップス エヌ ヴェ | 照明アセンブリ及び自動車用ヘッドランプ装置 |
JP2011224042A (ja) * | 2010-04-15 | 2011-11-10 | Fujifilm Corp | 光源装置及びこれを用いた内視鏡装置 |
US8269235B2 (en) * | 2010-04-26 | 2012-09-18 | Koninklijke Philips Electronics N.V. | Lighting system including collimators aligned with light emitting segments |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
JP5759198B2 (ja) * | 2011-02-10 | 2015-08-05 | セイコーエプソン株式会社 | 発光素子、光源装置及びプロジェクター |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
DE102011112222A1 (de) * | 2011-09-02 | 2013-03-07 | Osram Ag | Beleuchtungseinheit mit optischen System |
ITTO20120988A1 (it) * | 2012-11-14 | 2014-05-15 | Light In Light S R L | Sistema di illuminazione artificiale per simulare un'illuminazione naturale |
JP6234157B2 (ja) * | 2013-10-17 | 2017-11-22 | 株式会社小糸製作所 | 車両用灯具 |
JP2015026851A (ja) * | 2014-09-16 | 2015-02-05 | 株式会社小糸製作所 | 発光モジュール |
US10679975B2 (en) * | 2016-11-17 | 2020-06-09 | Signify Holding B.V. | Lighting device with UV LED |
DE102017129623B4 (de) * | 2017-12-12 | 2024-03-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Licht emittierendes Halbleiterbauelement |
WO2020212111A1 (en) * | 2019-04-18 | 2020-10-22 | Lumileds Holding B.V. | Lighting device |
CA3130367A1 (en) | 2020-09-10 | 2022-03-10 | Saco Technologies Inc. | Lens and prism combination for directing light toward a projector lens |
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DE2356573C2 (de) * | 1973-11-13 | 1982-04-01 | Agfa-Gevaert Ag, 5090 Leverkusen | Beleuchtungseinrichtung für ein Negativ in einem fotografischen Kopiergerät |
CA1274613A (en) * | 1986-12-24 | 1990-09-25 | Leendert Vriens | Projection device and associated display device |
JPH0964420A (ja) * | 1995-08-23 | 1997-03-07 | Toshiba Transport Eng Kk | フルカラー発光ダイオード装置 |
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JP2002532893A (ja) * | 1998-12-17 | 2002-10-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 光エンジン |
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JP2000231344A (ja) * | 1999-02-10 | 2000-08-22 | Toshiba Corp | 投写型表示装置の照明装置 |
JP2001085745A (ja) * | 1999-09-14 | 2001-03-30 | Toshiba Corp | 発光装置 |
US6676279B1 (en) * | 1999-10-04 | 2004-01-13 | David A. Hubbell | Area lighting device using discrete light sources, such as LEDs |
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US20030076034A1 (en) * | 2001-10-22 | 2003-04-24 | Marshall Thomas M. | Led chip package with four led chips and intergrated optics for collimating and mixing the light |
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JP4172196B2 (ja) * | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
US7112916B2 (en) * | 2002-10-09 | 2006-09-26 | Kee Siang Goh | Light emitting diode based light source emitting collimated light |
EP1420462A1 (en) * | 2002-11-13 | 2004-05-19 | Heptagon Oy | Light emitting device |
JP2004335992A (ja) * | 2003-04-18 | 2004-11-25 | Victor Co Of Japan Ltd | 光源装置及びこの光源装置を適用した投射型表示装置 |
CN1993826B (zh) * | 2004-08-06 | 2010-06-23 | 皇家飞利浦电子股份有限公司 | Led灯*** |
CN100530711C (zh) * | 2004-08-06 | 2009-08-19 | 皇家飞利浦电子股份有限公司 | 高性能led灯*** |
-
2005
- 2005-08-02 JP JP2007524455A patent/JP5026968B2/ja not_active Expired - Fee Related
- 2005-08-02 WO PCT/IB2005/052585 patent/WO2006016326A2/en active Application Filing
- 2005-08-02 KR KR1020077005237A patent/KR101163091B1/ko not_active IP Right Cessation
- 2005-08-02 EP EP05773346A patent/EP1776721A2/en not_active Withdrawn
- 2005-08-02 US US11/573,042 patent/US20080298059A1/en not_active Abandoned
- 2005-08-02 CN CNB2005800266574A patent/CN100521266C/zh not_active Expired - Fee Related
- 2005-08-03 TW TW094126450A patent/TWI430469B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2008509551A (ja) | 2008-03-27 |
US20080298059A1 (en) | 2008-12-04 |
WO2006016326A2 (en) | 2006-02-16 |
CN100521266C (zh) | 2009-07-29 |
CN1993839A (zh) | 2007-07-04 |
KR101163091B1 (ko) | 2012-07-20 |
TWI430469B (zh) | 2014-03-11 |
TW200618351A (en) | 2006-06-01 |
EP1776721A2 (en) | 2007-04-25 |
WO2006016326A3 (en) | 2006-05-11 |
KR20070053736A (ko) | 2007-05-25 |
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