JP5025616B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP5025616B2 JP5025616B2 JP2008271963A JP2008271963A JP5025616B2 JP 5025616 B2 JP5025616 B2 JP 5025616B2 JP 2008271963 A JP2008271963 A JP 2008271963A JP 2008271963 A JP2008271963 A JP 2008271963A JP 5025616 B2 JP5025616 B2 JP 5025616B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- cavity
- container
- electronic component
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
2,52 ・・・キャビティ
3,53・・・ バンプ
4,54 ・・・ICチップ
5,55・・・ 樹脂
10・・・ 電子部品
Claims (3)
- 容器のキャビティ内に、該キャビティの底面にフリップチップ実装されたIC素子と該IC素子の周囲に配置される熱硬化性樹脂とを収容した電子部品であって、
前記キャビティは、その開口部よりも下方位置であって且つ前記IC素子の下面の高さ位置よりも高い位置に前記底面と対向する対向面を有しており、前記キャビティ内の残部空間であって前記対向面の高さ位置よりも高い位置から前記底面の間に前記熱硬化性樹脂が充填されていることを特徴とする電子部品。 - 請求項1に記載の電子部品であって、
前記対向面は、前記キャビティの内壁面に沿って周回するように形成されていることを特徴とする電子部品。 - 請求項1に記載の電子部品であって、
前記対向面の高さ位置は、前記IC素子の上面高さ位置と下面高さ位置との間に位置することを特徴とする電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008271963A JP5025616B2 (ja) | 2008-10-22 | 2008-10-22 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008271963A JP5025616B2 (ja) | 2008-10-22 | 2008-10-22 | 電子部品 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000231937A Division JP4234889B2 (ja) | 2000-07-31 | 2000-07-31 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009016884A JP2009016884A (ja) | 2009-01-22 |
JP5025616B2 true JP5025616B2 (ja) | 2012-09-12 |
Family
ID=40357309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008271963A Expired - Fee Related JP5025616B2 (ja) | 2008-10-22 | 2008-10-22 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5025616B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112018003419T5 (de) | 2017-07-03 | 2020-08-20 | Mitsubishi Electric Corporation | Halbleiterbauelement |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04274350A (ja) * | 1991-03-01 | 1992-09-30 | Fuji Electric Co Ltd | 半導体装置 |
JPH08148629A (ja) * | 1994-09-20 | 1996-06-07 | Fujitsu Ltd | 半導体装置及びその製造方法及び半導体装置用基板 |
JP3457895B2 (ja) * | 1998-10-30 | 2003-10-20 | 京セラ株式会社 | 電子部品 |
JP4234889B2 (ja) * | 2000-07-31 | 2009-03-04 | 京セラ株式会社 | 電子部品 |
-
2008
- 2008-10-22 JP JP2008271963A patent/JP5025616B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009016884A (ja) | 2009-01-22 |
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