JP5023735B2 - Cold plate and electronic device - Google Patents

Cold plate and electronic device Download PDF

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JP5023735B2
JP5023735B2 JP2007040514A JP2007040514A JP5023735B2 JP 5023735 B2 JP5023735 B2 JP 5023735B2 JP 2007040514 A JP2007040514 A JP 2007040514A JP 2007040514 A JP2007040514 A JP 2007040514A JP 5023735 B2 JP5023735 B2 JP 5023735B2
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cooling plate
semiconductor device
coolant
flow path
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浩基 内田
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Description

本発明は、電子部品を冷却する冷却板、およびその冷却板により電子部品を冷却するように構成した電子装置に関する。   The present invention relates to a cooling plate for cooling an electronic component, and an electronic apparatus configured to cool an electronic component by the cooling plate.

近年、電子部品の高速化、高機能化が進み、電子部品を実装した半導体装置の発熱量は増加傾向にあり、効率のよい半導体装置の冷却方法の開発が要請されている。   2. Description of the Related Art In recent years, electronic components have been increased in speed and function, and the amount of heat generated by a semiconductor device on which the electronic component is mounted has been increasing. Thus, development of an efficient cooling method for a semiconductor device has been demanded.

従来、高発熱量の電子部品を冷却する方法として、電子部品の上面に放熱フィンを取り付けファンで冷却する強制空冷方式や、冷媒を循環させて電子部品を冷却する液冷方式が広く採用されている。しかし、電子部品の発熱量が５０Ｗ／ｃｍ2を超えるようになってくると、空冷方式では対応が難しく、液冷方式を採用する必要が生じる。 Conventionally, as a method of cooling an electronic component having a high calorific value, a forced air cooling method in which a radiating fin is attached to the upper surface of the electronic component and cooled by a fan, or a liquid cooling method in which a refrigerant is circulated to cool the electronic component has been widely adopted. Yes. However, when the calorific value of the electronic component exceeds 50 W / cm 2 , it is difficult to cope with the air cooling method, and it becomes necessary to adopt the liquid cooling method.

図９は、従来の液冷方式の電子部品冷却装置の一例を示す図である。   FIG. 9 is a diagram illustrating an example of a conventional liquid cooling electronic component cooling apparatus.

図９（ａ）には、電子部品９１の上面に、ＴＩＭ（Ｔｈｅｒｍａｌ Ｉｎｔｅｒｆａｃｅ Ｍａｔｅｒｉａｌ）９１ａを介して密着させた、内部に冷却液の流路が設けられた受熱部９３を備えた冷却装置９０が示されている。電子部品９１により加熱された受熱部９３内の冷却液はポンプ９７によって受熱部９３と放熱部９４との間を循環し、放熱部９４に取り付けられたフィン９５とファン９６によって冷却されるようになっている。   In FIG. 9A, a cooling device 90 having a heat receiving portion 93 provided with a cooling liquid flow path provided in close contact with an upper surface of an electronic component 91 via a TIM (Thermal Interface Material) 91a. It is shown. The coolant in the heat receiving portion 93 heated by the electronic component 91 is circulated between the heat receiving portion 93 and the heat radiating portion 94 by the pump 97, and is cooled by the fins 95 attached to the heat radiating portion 94 and the fan 96. It has become.

しかし、図９（ａ）に示す冷却装置９０では、電子部品９１とプリント配線基板９２とは熱抵抗の大きいＴＩＭ９１ａを介して熱接続されているので冷却効率が低い上に、電子部品９１の上面だけしか冷却されないため冷却が不十分であり、冷却手段としては限界に達している。   However, in the cooling device 90 shown in FIG. 9A, the electronic component 91 and the printed wiring board 92 are thermally connected via the TIM 91a having a large thermal resistance, so that the cooling efficiency is low and the top surface of the electronic component 91 is also high. The cooling is insufficient because it is only cooled, and the cooling means has reached its limit.

また、上記の冷却装置９０は、電子部品９１を冷却することはできるが、プリント配線基板９２上の電子部品を冷却することは難しいという問題がある。そこで、電子部品９１だけでなく、プリント配線基板９２を冷却できるようにした冷却装置が開示されている（例えば、特許文献１参照。）。   The cooling device 90 can cool the electronic component 91, but there is a problem that it is difficult to cool the electronic component on the printed wiring board 92. Therefore, a cooling device that can cool not only the electronic component 91 but also the printed wiring board 92 is disclosed (see, for example, Patent Document 1).

図９（ｂ）には、プリント配線基板９２’内の、電子部品９１’に対向する部位に、内部に冷却液が封入されたヒートシンク９３’を配備した冷却装置９０’が示されている。この冷却装置９０’は、ヒートシンク９３’および電子部品９１’側の金属部分に接触して熱結合を行う複数の金属柱状体９３ａを内蔵している。冷却液はポンプ９７によって受熱部９３と放熱部９４との間を循環し、放熱部９４に取り付けられたフィン９５およびファン９６によって冷却されるようになっている。
特許第３８１５２３９号明細書 FIG. 9B shows a cooling device 90 ′ in which a heat sink 93 ′ in which a cooling liquid is sealed is provided in a portion facing the electronic component 91 ′ in the printed wiring board 92 ′. The cooling device 90 ′ incorporates a plurality of metal columnar bodies 93a that are in thermal contact with the heat sink 93 ′ and the metal part on the electronic component 91 ′ side. The coolant circulates between the heat receiving portion 93 and the heat radiating portion 94 by the pump 97 and is cooled by the fins 95 and the fan 96 attached to the heat radiating portion 94.
Japanese Patent No. 3815239

しかし、上記の冷却装置９０’では、ヒートシンク９３’を埋め込んだ特殊なプリント配線基板９２’を必要とするため高コストとなりやすい。また、電子部品９１とプリント配線基板９２’との間の樹脂層による熱伝導の阻害を防止するために該樹脂層内に高熱伝導性のサーマルビアを配置する必要があり、プリント配線基板９２’の構造がさらに複雑となりコストをアップさせるという問題がある。   However, the above-described cooling device 90 ′ requires a special printed wiring board 92 ′ in which the heat sink 93 ′ is embedded, and thus tends to be expensive. Further, in order to prevent the heat conduction from being hindered by the resin layer between the electronic component 91 and the printed wiring board 92 ′, it is necessary to dispose a high thermal conductivity thermal via in the resin layer, and the printed wiring board 92 ′. There is a problem in that the structure becomes more complicated and the cost is increased.

本発明は、上記事情に鑑み、電子部品を効率よく冷却することのできる冷却板、およびその冷却板により効率よく電子部品が冷却される電子装置を提供することを目的とする。   An object of this invention is to provide the cooling plate which can cool an electronic component efficiently in view of the said situation, and the electronic apparatus by which an electronic component is cooled efficiently with the cooling plate.

上記目的を達成する本発明の第１の冷却板は、
信号入出力用の端子を備えた半導体装置と、該半導体装置が実装されるプリント配線基板との間に配置される冷却板であって、
内部に冷却液が流れる流路を有する絶縁材料からなる基体と、
上記流路を貫通して上記基体の表裏面双方に露出した、上記端子と上記プリント配線基板上の配線パターンとを電気的に接続する導体柱とを備えたことを特徴とする。 The first cooling plate of the present invention that achieves the above object is as follows.
A cooling plate disposed between a semiconductor device having terminals for signal input / output and a printed wiring board on which the semiconductor device is mounted,
A substrate made of an insulating material having a flow path through which a coolant flows;
Through the flow path is exposed on the front and back surfaces both said substrate, characterized by comprising a conductive column for electrically connecting the wiring pattern of the upper Symbol pin and the printed wiring board.

本発明の第１の冷却板によれば、冷却板内の流路を貫通する導体柱を介して半導体装置上およびプリント配線基板上の電子部品の熱が冷却液に伝えられるので電子部品を効率よく冷却することができる。   According to the first cooling plate of the present invention, the heat of the electronic components on the semiconductor device and the printed wiring board is transmitted to the coolant via the conductor pillars that pass through the flow passages in the cooling plate, so that the electronic components are efficiently used. Can cool well.

また、上記目的を達成する本発明の第１の電子装置は、
内部に冷却液が流れる流路を有する絶縁材料からなる基体と、上記流路を貫通して上記基体の表裏面双方に露出してなる導体柱とを有する冷却板と、
信号入出力用の端子を備え、該端子が上記導体柱の露出端面に電気接続されてなる半導体装置と、
上記半導体装置との間に上記冷却板を挟んだ位置に配置され、配線パターンが形成されて該配線パターンが上記導体柱の、上記端子が電気接続された露出端面とは反対側の露出端面に電気接続されてなるプリント配線基板と、
上記冷却板内の流路と接続され冷却液を循環させる冷却液循環経路と、
上記冷却液循環経路の途中に配備された、冷却液を該冷却液循環経路内で循環させるポンプと、
上記冷却液循環経路の途中に配備された、該冷却液循環経路内の熱を放熱する放熱部品とを備えたことを特徴とする。 In addition, a first electronic device of the present invention that achieves the above object is
A cooling plate having a base made of an insulating material having a flow path through which a cooling liquid flows, and a conductor column penetrating the flow path and exposed on both the front and back surfaces of the base;
A semiconductor device comprising a signal input / output terminal, wherein the terminal is electrically connected to the exposed end face of the conductor post;
Is arranged at a position sandwiching the cooling plate between the semiconductor device, the wiring pattern of the conductor post wiring pattern is formed on the exposed end face opposite to the exposed end face of the terminal is electrically connected a printed wiring board formed by connection conductive Kise',
A coolant circulation path connected to the flow path in the cooling plate and circulating the coolant;
A pump arranged in the middle of the coolant circulation path for circulating the coolant in the coolant circulation path;
And a heat dissipating component that dissipates heat in the coolant circulation path, disposed in the middle of the coolant circulation path.

本発明の第１の電子装置によれば、冷却板内の流路を貫通する導体柱を介して半導体装置上およびプリント配線基板上の電子部品の熱が冷却液に伝えられ、その冷却液はポンプにより冷却液循環経路を経て放熱部品に送られ、冷却液の熱は放熱部品により大気中に放熱されるので、電子部品を効率よく冷却することができる。   According to the first electronic device of the present invention, the heat of the electronic components on the semiconductor device and the printed wiring board is transmitted to the coolant via the conductor pillars that penetrate the flow path in the cooling plate, and the coolant is The pump is sent to the heat dissipation component through the coolant circulation path, and the heat of the coolant is dissipated into the atmosphere by the heat dissipation component, so that the electronic component can be efficiently cooled.

また、上記目的を達成する本発明の第２の冷却板は、
信号入出力用の柱状端子を備えた半導体装置と、該半導体装置が実装されるプリント配線基板との間に配置される冷却板であって、
内部に冷却液が流れる流路を有し表裏面を形成する絶縁材料からなるとともに上記半導体装置の柱状端子が挿通される、その流路を貫通してそれら表裏面双方に開口した貫通孔を有することを特徴とする。 The second cooling plate of the present invention that achieves the above object is
A cooling plate disposed between a semiconductor device having columnar terminals for signal input / output and a printed wiring board on which the semiconductor device is mounted,
With an insulating material for forming the organic and front and rear surfaces of the flow path through which cooling liquid flows inside the pole terminals of the semiconductor device is inserted, having a through the flow path through hole opened to their front and rear surfaces both It is characterized by that.

本発明の第２の冷却板によれば、冷却板内の流路を貫通する柱状端子を介して半導体装置上およびプリント配線基板上の電子部品の熱が冷却液に伝えられるので電子部品を効率よく冷却することができる。   According to the second cooling plate of the present invention, the heat of the electronic component on the semiconductor device and the printed wiring board is transmitted to the coolant via the columnar terminal that penetrates the flow path in the cooling plate, so that the electronic component is efficiently used. Can cool well.

また、上記目的を達成する本発明の第２の電子装置は、
信号入出力用の柱状端子を備えた半導体装置と、
内部に冷却液が流れる流路を有し表裏面を形成する絶縁材料からなるとともに上記半導体装置の柱状端子が挿通される、その流路を貫通してそれら表裏面双方に開口した貫通孔を有する冷却板であって上記半導体装置が配置され上記柱状端子が上記貫通孔を貫通する冷却板と、
配線パターンが形成され上記冷却板に配置されて該配線パターンが上記柱状端子に電気的に接続されてなるプリント配線基板と、
上記冷却板内の流路と接続され冷却液を循環させる冷却液循環経路と、
上記冷却液循環経路の途中に配備された、冷却液を該冷却液循環経路内で循環させるポンプと、
上記冷却液循環経路の途中に配備された、該冷却液循環経路内の冷却液の熱を放熱する放熱部品とを備えたことを特徴とする。 The second electronic device of the present invention that achieves the above object is
A semiconductor device having columnar terminals for signal input and output;
With an insulating material for forming the organic and front and rear surfaces of the flow path through which cooling liquid flows inside the pole terminals of the semiconductor device is inserted, having a through the flow path through hole opened to their front and rear surfaces both A cooling plate in which the semiconductor device is disposed and the columnar terminal penetrates the through hole; and
A printed wiring board in which a wiring pattern is formed and disposed on the cooling plate, and the wiring pattern is electrically connected to the columnar terminals;
A coolant circulation path connected to the flow path in the cooling plate and circulating the coolant;
A pump arranged in the middle of the coolant circulation path for circulating the coolant in the coolant circulation path;
And a heat dissipating part that dissipates heat of the coolant in the coolant circulation path, which is disposed in the middle of the coolant circulation path.

本発明の第２の電子装置によれば、冷却板内の流路を貫通する柱状端子を介して半導体装置上およびプリント配線基板上の電子部品の熱が冷却液に伝えられ、その冷却液はポンプにより冷却液循環経路を経て放熱部品に送られ、冷却液の熱は放熱部品により大気中に放熱されるので、電子部品を効率よく冷却することができる。   According to the second electronic device of the present invention, the heat of the electronic components on the semiconductor device and the printed wiring board is transmitted to the coolant via the columnar terminals penetrating the flow path in the cooling plate, and the coolant is The pump is sent to the heat dissipation component through the coolant circulation path, and the heat of the coolant is dissipated into the atmosphere by the heat dissipation component, so that the electronic component can be efficiently cooled.

本発明によれば、電子部品を効率よく冷却することのできる冷却板、およびその冷却板により効率よく電子部品が冷却される電子装置を実現することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic device by which an electronic component can be efficiently cooled with the cooling plate which can cool an electronic component efficiently, and the cooling plate is realizable.

以下図面を参照して本発明の実施の形態を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は、本発明の第１の電子装置の概略構成図である。   FIG. 1 is a schematic configuration diagram of a first electronic device of the present invention.

図１に示すように、この電子装置１０は、内部に冷却液が流れる流路３３を有する絶縁材料からなる板状の基体３１と、流路３３を貫通して基体３１の表裏面双方に露出してなる導体柱３２とを有する冷却板３０と、電子部品を実装したパッケージの裏面２１ｂに外部との間の信号入出力用の端子２２を備え、該裏面２１ｂが冷却板３０の表面に接して該端子２２が導体柱３２の冷却板３０表面３０ａの露出端面に電気接続されてなる半導体装置２０と、配線パターン４１が形成され、表面が冷却板３０の裏面３０ｂと接して配線パターン４１が導体柱３２の冷却板の裏面３０ｂ側の露出端面に電気的に接続されてなるプリント配線基板４０と、冷却板３０内の流路３３と接続され冷却液を循環させる冷却液循環経路８１と、冷却液循環経路８１の途中に配備された、冷却液を冷却液循環経路８１内で循環させるポンプ８２と、冷却液循環経路８１の途中に配備され、冷却液循環経路８１内の熱を放熱する放熱部品８３とを備えている。   As shown in FIG. 1, the electronic device 10 is exposed to both a plate-like base 31 made of an insulating material having a flow path 33 through which a coolant flows, and the front and back surfaces of the base 31 through the flow path 33. The cooling plate 30 having the conductive pillars 32 and the back surface 21b of the package on which the electronic components are mounted are provided with terminals 22 for signal input / output between the outside, and the back surface 21b is in contact with the surface of the cooling plate 30. Thus, the semiconductor device 20 in which the terminal 22 is electrically connected to the exposed end surface of the surface 30a of the cooling plate 30 of the conductor pillar 32 and the wiring pattern 41 are formed, and the wiring pattern 41 is in contact with the back surface 30b of the cooling plate 30. A printed wiring board 40 electrically connected to the exposed end surface of the back surface 30b of the cooling plate of the conductor pillar 32; a cooling liquid circulation path 81 connected to the flow path 33 in the cooling plate 30 and circulating the cooling liquid; Coolant circulation path 1, a pump 82 that circulates the coolant in the coolant circulation path 81, and a heat dissipating component 83 that is disposed in the middle of the coolant circulation path 81 and radiates heat in the coolant circulation path 81. It has.

本実施形態における絶縁材料からなる基体３１としては、プラスチックやＦＲ４（Ｆｌａｍｅ Ｒｅｔａｒｄａｎｔ Ｔｙｐｅ ４）などの電気絶縁材料を用いることができる。   As the substrate 31 made of an insulating material in the present embodiment, an electrical insulating material such as plastic or FR4 (Frame Regentant Type 4) can be used.

また、冷却液は、低誘電率で不活性な液体であるフロリナート（３Ｍ製）や、同じく低誘電率で不活性かつ温暖化係数の小さいノベック（３Ｍ製）などを用いることができる。   As the coolant, Fluorinert (manufactured by 3M), which is an inert liquid with a low dielectric constant, Novec (manufactured by 3M), which is also low dielectric constant, inactive, and has a small warming coefficient can be used.

本実施形態における放熱部品８３として、図１には、放熱用フィン８３ｃが取り付けられ、内部に冷却液が流れる流路８３ｂを有する放熱部８３ａと、放熱用フィン８３ｃを冷却するファン８３ｄとが示されているが、本発明における放熱部品は必ずしも上記構成に限られるものではなく、要は冷却液循環経路内の冷却液の熱を効率的に放熱することができるものであればどのような構成のものであってもよい。   As the heat radiation component 83 in this embodiment, FIG. 1 shows a heat radiation portion 83a having a flow path 83b in which a heat radiation fin 83c is attached and through which a coolant flows, and a fan 83d that cools the heat radiation fin 83c. However, the heat dissipating component in the present invention is not necessarily limited to the above-described configuration. In short, any configuration can be used as long as it can efficiently dissipate the heat of the coolant in the coolant circulation path. It may be.

図２は、本発明の第１の冷却板の概略構成図である。   FIG. 2 is a schematic configuration diagram of the first cooling plate of the present invention.

図２に示すように、この第１の冷却板３０は、電子部品を実装したパッケージの裏面２１ｂに外部との間の信号入出力用の端子２２を備えた半導体装置２０と該半導体装置２０が実装されるプリント配線基板４０との間に配置されるものであって、内部に冷却液が流れる流路３３を有する絶縁材料からなる板状の基体３１と、流路３３を貫通して基体３１の表裏面双方に露出した、上記電子部品の端子２２と上記プリント配線基板４０上の配線パターン４１との間の電気的配線を担う導体柱３２とを備えている。   As shown in FIG. 2, the first cooling plate 30 includes a semiconductor device 20 having a signal input / output terminal 22 between the semiconductor device 20 and the back surface 21b of the package on which electronic components are mounted. A plate-like base 31 made of an insulating material having a flow path 33 through which a coolant flows, and a base 31 passing through the flow path 33 are arranged between the printed wiring board 40 to be mounted. Are provided on both the front and back surfaces of the electronic component, and a conductor column 32 for carrying out electrical wiring between the terminal 22 of the electronic component and the wiring pattern 41 on the printed wiring board 40.

この第１の冷却板３０を介して半導体装置２０とプリント配線基板４０とを電気的に接続するために、本実施形態では、半導体装置２０の外部との間の信号入出力用の端子２２および冷却板３０の導体柱３２のプリント配線基板４０側の外部との間の信号入出力用の端子３４をいわゆるＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）端子として構成しておき、半導体装置２０と冷却板３０とプリント配線基板４０とを重ね合わせた状態で半導体装置２０、冷却板３０、およびプリント配線基板４０をリフロー炉を用いてはんだ付け実装する。   In this embodiment, in order to electrically connect the semiconductor device 20 and the printed wiring board 40 via the first cooling plate 30, in this embodiment, a signal input / output terminal 22 between the semiconductor device 20 and the outside A terminal 34 for signal input / output between the conductor pillar 32 of the cooling plate 30 and the outside on the printed wiring board 40 side is configured as a so-called BGA (Ball Grid Array) terminal, and the semiconductor device 20, the cooling plate 30 and the printed circuit board are printed. The semiconductor device 20, the cooling plate 30, and the printed wiring board 40 are soldered and mounted using a reflow furnace in a state where the wiring board 40 is overlaid.

これにより、ＢＧＡ端子２２およびＢＧＡ端子３４のはんだが溶融して半導体装置２０の外部との間の信号入出力用の端子２２と導体柱３２とがはんだ付けされるとともに、導体柱３２とプリント配線基板４０の配線パターン４１とがはんだ付けされ、半導体装置２０とプリント配線基板４０とは導体柱３２を介して電気的に接続される。   Thereby, the solder of the BGA terminal 22 and the BGA terminal 34 is melted, and the signal input / output terminal 22 and the conductor pillar 32 between the outside of the semiconductor device 20 are soldered, and the conductor pillar 32 and the printed wiring are also soldered. The wiring pattern 41 of the board 40 is soldered, and the semiconductor device 20 and the printed wiring board 40 are electrically connected via the conductor pillar 32.

このように構成された第１の冷却板３０を含む第１の電子装置１０によれば、半導体装置２０およびプリント配線基板４０で発生した熱は冷却板３０の導体柱３２を介して冷却板３０の流路３３内を流れる冷却液に伝えられ、冷却液に伝えられた熱は放熱部品８３によって大気中に放熱されるので、半導体装置２０上およびプリント配線基板４０上の電子部品を効率よく冷却することができる。   According to the first electronic device 10 including the first cooling plate 30 configured as described above, the heat generated in the semiconductor device 20 and the printed wiring board 40 is transferred to the cooling plate 30 via the conductor pillars 32 of the cooling plate 30. Since the heat transferred to the coolant flowing through the flow path 33 is transferred to the atmosphere by the heat dissipation component 83, the electronic components on the semiconductor device 20 and the printed wiring board 40 are efficiently cooled. can do.

以下に、本発明の第１の冷却板の実施例について説明する。
（実施例１）
図３は、本発明の第１の冷却板の一実施例の外観を示す平面図であり、図４は、本発明の第１の冷却板の一実施例の内部を示す切断図である。 Below, the Example of the 1st cooling plate of this invention is described.
Example 1
FIG. 3 is a plan view showing the appearance of an embodiment of the first cooling plate of the present invention, and FIG. 4 is a cutaway view showing the inside of the embodiment of the first cooling plate of the present invention.

この冷却板３０の基体３１は、４５ｍｍ×４５ｍｍ、厚さ５ｍｍ、ＦＲ４製の絶縁材料で作製されており、冷却板３０の表裏両面にはそれぞれ半導体装置２０に実装された電子回路の電極、およびプリント配線基板４０の端子と接続する銅箔の電極端子パターン３２ａが形成されている。この電極端子パターン３２ａと半導体装置２０の電子部品の端子とがはんだ付けされることによって、冷却板３０内の冷却液は密閉され漏洩が生じない構造となっている。   The substrate 31 of the cooling plate 30 is made of an insulating material made of 45 mm × 45 mm, thickness 5 mm, FR4, and the electrodes of the electronic circuit mounted on the semiconductor device 20 on both the front and back surfaces of the cooling plate 30, and A copper foil electrode terminal pattern 32 a connected to the terminal of the printed wiring board 40 is formed. By soldering the electrode terminal pattern 32a and the terminals of the electronic components of the semiconductor device 20, the cooling liquid in the cooling plate 30 is sealed and does not leak.

冷却板３０の内部には冷却液入口３９ａから冷却液出口３９ｂまで冷却液を案内する冷却液ガイド３９ｃによって冷却液が流れる流路３３が形成されている。この流路３３は、厚さ２．５ｍｍの２枚のＦＲ４板に深さ１．５ｍｍの流路の溝を対称に形成したものを張り合わせることで形成した。   Inside the cooling plate 30, a flow path 33 through which the cooling liquid flows is formed by a cooling liquid guide 39c for guiding the cooling liquid from the cooling liquid inlet 39a to the cooling liquid outlet 39b. The flow path 33 was formed by bonding two FR4 plates having a thickness of 2.5 mm and symmetrically forming a flow path groove having a depth of 1.5 mm.

図４に示すように、この冷却板３０内の流路３３内に、流路３３を貫通して冷却板３０の表裏両面の電極端子パターン３２ａ（図３参照）間に形成された導体柱３２が配備されており、この導体柱３２がその周囲を流れる冷却液によって冷却され、ひいては半導体装置２０上およびプリント配線基板４０上の電子部品が冷却される。   As shown in FIG. 4, the conductor pillar 32 formed between the electrode terminal patterns 32 a (see FIG. 3) on both the front and back surfaces of the cooling plate 30 through the flow channel 33 in the flow channel 33 in the cooling plate 30. The conductive pillar 32 is cooled by the coolant flowing around it, and the electronic components on the semiconductor device 20 and the printed wiring board 40 are cooled.

上記図３、図４に示した冷却板３０を作製し、図１に示したごとく、プリント配線基板４０上に冷却板３０を重ね、その上に、電子部品が実装された半導体装置２０を重ね合わせて実装した。半導体装置２０に実装された電子部品は、ＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）であり、電子部品のはんだボール端子は冷却板３０の電極端子パターン３２ａ（図３参照）にはんだ付けされる。   The cooling plate 30 shown in FIGS. 3 and 4 is manufactured. As shown in FIG. 1, the cooling plate 30 is stacked on the printed wiring board 40, and the semiconductor device 20 on which electronic components are mounted is stacked thereon. Implemented together. The electronic component mounted on the semiconductor device 20 is a BGA (Ball Grid Array), and the solder ball terminal of the electronic component is soldered to the electrode terminal pattern 32a (see FIG. 3) of the cooling plate 30.

また、冷却板３０下面の電極端子パターン３２ａには、はんだボールを設け、プリント配線基板４０上の端子にはんだ付けされる。   Also, solder balls are provided on the electrode terminal pattern 32 a on the lower surface of the cooling plate 30 and soldered to the terminals on the printed wiring board 40.

半導体装置２０、冷却板３０、およびプリント配線基板４０のはんだ付け実装は一般的に行われているリフロー炉を用いた表面実装方式により行った。   Soldering mounting of the semiconductor device 20, the cooling plate 30, and the printed wiring board 40 was performed by a surface mounting method using a reflow furnace which is generally performed.

冷却液は低誘電率で不活性な液体であるフロリナート（３Ｍ製）を用いた。   As the coolant, Fluorinert (manufactured by 3M), which is an inert liquid with a low dielectric constant, was used.

こうして、図１に示すように、冷却板３０と、半導体装置２０と、プリント配線基板４０と、冷却液循環経路８１と、ポンプ８２と、放熱部品８３とを備えた電子装置１０を構成した。   Thus, as shown in FIG. 1, the electronic device 10 including the cooling plate 30, the semiconductor device 20, the printed wiring board 40, the coolant circulation path 81, the pump 82, and the heat dissipation component 83 was configured.

これにより、半導体装置２０上およびプリント配線基板４０上の電子部品からの熱を導体柱３２を介して冷却板３０内の冷却液に効率的に伝えることができる電子装置１０が得られた。   As a result, the electronic device 10 that can efficiently transfer heat from the electronic components on the semiconductor device 20 and the printed wiring board 40 to the coolant in the cooling plate 30 via the conductor pillars 32 is obtained.

次に、本発明の第２の電子装置の実施の形態について説明する。   Next, an embodiment of the second electronic device of the present invention will be described.

図５は、本発明の第２の電子装置の概略構成図である。   FIG. 5 is a schematic configuration diagram of a second electronic device according to the present invention.

図５に示すように、この電子装置５０は、電子部品を実装したパッケージの裏面に外部との間の信号入出力用のＰＧＡ（Ｐｉｎ Ｇｒｉｄ Ａｒｒａｙ）型の柱状端子６１を備えた半導体装置６０と、内部に冷却液が流れる流路７３を有する絶縁材料からなるとともに半導体装置６０の柱状端子６１が挿通される貫通孔（後述）を有する冷却板であって該冷却板表面側に半導体装置６０が配備され柱状端子６１が上記貫通孔を貫通して該冷却板裏面から露出してなる状態の冷却板７０と、配線パターン４１が形成され冷却板７０の裏面側に配備されて該配線パターン４１が柱状端子６１の冷却板７０の裏面７０ｂから露出した部分に電気的に接続されてなるプリント配線基板４０と、冷却板７０内の流路７３と接続され冷却液を循環させる冷却液循環経路８１と、冷却液循環経路８１の途中に配備された、冷却液を冷却液循環経路８１内で循環させるポンプ８２と、冷却液循環経路８１の途中に配備された、該冷却液循環経路８１内の冷却液の熱を放熱する放熱部品８３とを備えている。   As shown in FIG. 5, the electronic device 50 includes a semiconductor device 60 having a PGA (Pin Grid Array) type columnar terminal 61 for signal input / output with the outside on the back surface of a package on which electronic components are mounted. A cooling plate made of an insulating material having a flow path 73 through which a cooling liquid flows and having a through hole (described later) through which a columnar terminal 61 of the semiconductor device 60 is inserted, and the semiconductor device 60 on the surface side of the cooling plate. A cooling plate 70 in a state where the columnar terminal 61 is exposed through the through hole and exposed from the back surface of the cooling plate, and a wiring pattern 41 is formed and disposed on the back surface side of the cooling plate 70 so that the wiring pattern 41 is Cooling that connects the printed wiring board 40 electrically connected to the portion exposed from the back surface 70b of the cooling plate 70 of the columnar terminal 61 and the flow path 73 in the cooling plate 70 to circulate the coolant. The liquid circulation path 81, the pump 82 provided in the middle of the cooling liquid circulation path 81, and the cooling liquid circulation provided in the middle of the cooling liquid circulation path 81. And a heat dissipating component 83 for dissipating the heat of the coolant in the path 81.

本実施形態における放熱部品８３として、図５には、放熱用フィン８３ｃが取り付けられ、内部に冷却液が流れる流路８３ｂを有する放熱部８３ａと、放熱用フィン８３ｃを冷却するファン８３ｄとが示されているが、本発明における放熱部品は必ずしも上記構成に限られるものではなく、要は冷却液循環経路内の冷却液の熱を効率的に放熱することができるものであればどのような構成のものであってもよい。   As the heat radiation component 83 in this embodiment, FIG. 5 shows a heat radiation portion 83a having a flow path 83b in which a heat radiation fin 83c is attached and through which a coolant flows, and a fan 83d that cools the heat radiation fin 83c. However, the heat dissipating component in the present invention is not necessarily limited to the above-described configuration. In short, any configuration can be used as long as it can efficiently dissipate the heat of the coolant in the coolant circulation path. It may be.

図６は、本発明の第２の冷却板の概略構成図である。   FIG. 6 is a schematic configuration diagram of the second cooling plate of the present invention.

図６に示すように、この第２の冷却板７０は、電子部品を実装したパッケージの裏面に外部との間の信号入出力用の柱状端子６１を備えた半導体装置６０と該半導体装置６０が実装されるプリント配線基板４０との間に配置されるものであって、内部に冷却液が流れる流路７３を有する絶縁材料からなる板状の基体７５で構成されるとともに上記半導体装置６０の柱状端子６１が挿通される貫通孔７６と、貫通孔７６の周囲に形成された銅箔パターン７８を備えている。   As shown in FIG. 6, the second cooling plate 70 includes a semiconductor device 60 having a signal input / output columnar terminal 61 on the back surface of a package on which electronic components are mounted, and the semiconductor device 60. It is arranged between the printed wiring board 40 to be mounted, and is constituted by a plate-like base body 75 made of an insulating material having a flow path 73 through which a coolant flows, and is formed in a column shape of the semiconductor device 60. A through hole 76 through which the terminal 61 is inserted and a copper foil pattern 78 formed around the through hole 76 are provided.

この第２の冷却板７０を介して半導体装置６０とプリント配線基板４０とを電気的に接続するには、予め、半導体装置６０の柱状端子６１の周囲にはんだ層を形成しておき、半導体装置６０の柱状端子６１を冷却板７０の貫通孔７６に挿通し、プリント配線基板４０の上に重ねた状態で、半導体装置６０、冷却板７０、およびプリント配線基板４０をリフロー炉ではんだ付け実装する。これにより、柱状端子６１に形成されていたはんだ層が溶融して柱状端子６１と銅箔パターン７８とがはんだ付けされるとともに、柱状端子６１とプリント配線基板４０上の配線パターン４１とがはんだ付けされる。   In order to electrically connect the semiconductor device 60 and the printed wiring board 40 via the second cooling plate 70, a solder layer is formed around the columnar terminals 61 of the semiconductor device 60 in advance. The semiconductor device 60, the cooling plate 70, and the printed wiring board 40 are soldered and mounted in a reflow furnace in a state where the 60 columnar terminals 61 are inserted into the through holes 76 of the cooling plate 70 and overlaid on the printed wiring board 40. . As a result, the solder layer formed on the columnar terminal 61 is melted and the columnar terminal 61 and the copper foil pattern 78 are soldered, and the columnar terminal 61 and the wiring pattern 41 on the printed wiring board 40 are soldered. Is done.

こうして、半導体装置６０とプリント配線基板４０とは柱状端子６１を介して電気的に接続される。   Thus, the semiconductor device 60 and the printed wiring board 40 are electrically connected via the columnar terminals 61.

このように構成された第２の冷却板７０を含む第２の電子装置５０によれば、半導体装置６０およびプリント配線基板４０で発生した熱は冷却板７０の柱状端子６１を介して冷却板７０の流路７３内を流れる冷却液に伝えられ、冷却液に伝えられた熱は放熱部品８３によって大気中に放熱されるので、半導体装置６０上およびプリント配線基板４０上の電子部品を効率よく冷却することができる。   According to the second electronic device 50 including the second cooling plate 70 configured as described above, the heat generated in the semiconductor device 60 and the printed wiring board 40 is supplied to the cooling plate 70 via the columnar terminals 61 of the cooling plate 70. Since the heat transferred to the coolant flowing in the flow path 73 is transferred to the atmosphere by the heat dissipation component 83, the electronic components on the semiconductor device 60 and the printed wiring board 40 are efficiently cooled. can do.

以下に、本発明の第２の冷却板の実施例について説明する。
（実施例２）
図７は、本発明の第２の冷却板の一実施例の外観を示す平面図であり、図８は、本発明の第２の冷却板の一実施例の内部を示す切断図である。 Below, the Example of the 2nd cooling plate of this invention is described.
(Example 2)
FIG. 7 is a plan view showing the appearance of an embodiment of the second cooling plate of the present invention, and FIG. 8 is a cutaway view showing the inside of the embodiment of the second cooling plate of the present invention.

この冷却板７０の基体７１は、４５ｍｍ×４５ｍｍ、厚さ３．６ｍｍ、ＦＲ４製の絶縁材料で構成されるとともに半導体装置６０の柱状端子６１（図５参照）が挿通される貫通孔７６と、貫通孔７６の周囲に形成された銅箔パターン７８を備えている。この銅箔パターン７８と半導体装置６０の柱状端子６１とがはんだ付けされることによって、冷却板７０内の冷却液は密閉され漏洩が生じない構造となっている。     A base 71 of the cooling plate 70 is made of an insulating material of 45 mm × 45 mm, a thickness of 3.6 mm, and made of FR4, and has a through hole 76 through which the columnar terminal 61 (see FIG. 5) of the semiconductor device 60 is inserted. A copper foil pattern 78 formed around the through hole 76 is provided. By soldering the copper foil pattern 78 and the columnar terminals 61 of the semiconductor device 60, the cooling liquid in the cooling plate 70 is sealed and does not leak.

冷却板７０の内部には冷却液入口７９ａから冷却液出口７９ｂまで冷却液を案内する冷却液ガイド７９ｃによって冷却液が流れる流路７３が形成されている。この流路７３は、厚さ１．８ｍｍの２枚のＦＲ４板に深さ１ｍｍの流路の溝を対称に形成したものを張り合わせて形成した。   Inside the cooling plate 70, a flow path 73 through which the cooling liquid flows is formed by a cooling liquid guide 79c that guides the cooling liquid from the cooling liquid inlet 79a to the cooling liquid outlet 79b. The flow path 73 was formed by bonding two FR4 plates having a thickness of 1.8 mm and symmetrically forming a flow path groove having a depth of 1 mm.

図８に示すように、この冷却板７０内の流路７３内に、流路７３を貫通する貫通孔７６が形成され、その貫通孔７６がその外側を流れる冷却液によって冷却されることにより、貫通孔７６内に挿通された半導体装置６０の柱状端子６１（図６参照）が冷却され、ひいては半導体装置６０上およびプリント配線基板４０上の電子部品が冷却される。   As shown in FIG. 8, a through hole 76 that penetrates the flow path 73 is formed in the flow path 73 in the cooling plate 70, and the through hole 76 is cooled by the coolant that flows outside the flow path 73. The columnar terminal 61 (see FIG. 6) of the semiconductor device 60 inserted into the through hole 76 is cooled, and thus the electronic components on the semiconductor device 60 and the printed wiring board 40 are cooled.

上記図７、図８に示した冷却板７０を作製し、図５に示したごとく、プリント配線基板４０上に冷却板７０を重ね、その上に、電子部品が実装された半導体装置６０を重ね合わせて実装した。半導体装置６０に実装された電子部品はＰＧＡ（Ｐｉｎ Ｇｒｉｄ Ａｒｒａｙ）であり、電子部品の端子は長さ５ｍｍのピン形状の柱状端子６１である。ＰＧＡ部品の柱状端子６１は冷却板７０の貫通孔７６を貫通してプリント配線基板４０上の端子にはんだ付けされると共に冷却板７０を密閉構造にする。   The cooling plate 70 shown in FIGS. 7 and 8 is manufactured. As shown in FIG. 5, the cooling plate 70 is stacked on the printed wiring board 40, and the semiconductor device 60 on which electronic components are mounted is stacked thereon. Implemented together. The electronic component mounted on the semiconductor device 60 is a PGA (Pin Grid Array), and the terminal of the electronic component is a pin-shaped columnar terminal 61 having a length of 5 mm. The columnar terminal 61 of the PGA component penetrates the through hole 76 of the cooling plate 70 and is soldered to the terminal on the printed circuit board 40, and the cooling plate 70 is made in a sealed structure.

半導体装置６０、冷却板７０、およびプリント配線基板４０のはんだ付け実装は一般的に行われているリフロー炉を用いた表面実装方式により行った。   The semiconductor device 60, the cooling plate 70, and the printed wiring board 40 were soldered and mounted by a surface mounting method using a reflow furnace that is generally performed.

冷却液は低誘電率で不活性な液体であるフロリナート（３Ｍ製）を用いた。   As the coolant, Fluorinert (manufactured by 3M), which is an inert liquid with a low dielectric constant, was used.

こうして、図５に示すように、冷却板７０と、半導体装置６０と、プリント配線基板４０と、冷却液循環経路８１と、ポンプ８２と、放熱部品８３とを備えた電子装置５０を構成した。   Thus, as shown in FIG. 5, the electronic device 50 including the cooling plate 70, the semiconductor device 60, the printed wiring board 40, the coolant circulation path 81, the pump 82, and the heat dissipation component 83 was configured.

これにより、半導体装置６０上およびプリント配線基板４０上の電子部品からの熱を柱状端子６１を介して冷却板７０内の冷却液に効率的に伝えることができる電子装置５０が得られた。   As a result, the electronic device 50 capable of efficiently transferring heat from the electronic components on the semiconductor device 60 and the printed wiring board 40 to the cooling liquid in the cooling plate 70 via the columnar terminals 61 was obtained.

本発明の第１の電子装置の概略構成図である。It is a schematic block diagram of the 1st electronic device of this invention. 本発明の第１の冷却板の概略構成図である。It is a schematic block diagram of the 1st cooling plate of this invention. 本発明の第１の冷却板の一実施例の外観を示す平面図である。It is a top view which shows the external appearance of one Example of the 1st cooling plate of this invention. 本発明の第１の冷却板の一実施例の内部を示す切断図である。It is a cutaway view showing the inside of one embodiment of the first cooling plate of the present invention. 本発明の第２の電子装置の概略構成図である。It is a schematic block diagram of the 2nd electronic device of this invention. 本発明の第２の冷却板の概略構成図である。It is a schematic block diagram of the 2nd cooling plate of this invention. 本発明の第２の冷却板の一実施例の外観を示す平面図である。It is a top view which shows the external appearance of one Example of the 2nd cooling plate of this invention. 本発明の第２の冷却板の一実施例の内部を示す切断図である。It is a cutaway view showing the inside of one embodiment of the second cooling plate of the present invention. 従来の液冷方式の電子部品冷却装置の一例を示す図である。It is a figure which shows an example of the conventional electronic component cooling device of a liquid cooling system.

符号の説明Explanation of symbols

１０，５０ 電子装置
２０，６０ 半導体装置
２１ｂ 裏面
２２ 端子
３０，７０ 冷却板
３０ｂ 裏面
３１，７５ 基体
３２ 導体柱
３２ａ 電極端子パターン
３３、７３ 流路
３４ ＢＧＡ端子
３９ａ，７９ａ 冷却液入口
３９ｂ，７９ｂ 冷却液出口
３９ｃ，７９ｃ 冷却液ガイド
４０ プリント配線基板
４１ 配線パターン
６１ 柱状端子
７６ 貫通孔
７８ 銅箔パターン
８１ 冷却液循環経路
８２ ポンプ
８３ 放熱部品
８３ａ 放熱部
８３ｂ 流路
８３ｃ 放熱用フィン
８３ｄ ファン
９０，９０’ 冷却装置
９１ 電子部品
９１ａ ＴＩＭ
９２，９２’ プリント配線基板
９３ 受熱部
９３’ ヒートシンク
９３ａ 金属柱状体
９４ 放熱部
９５ フィン
９６ ファン
９７ ポンプ 10, 50 Electronic device 20, 60 Semiconductor device 21b Back surface 22 Terminal 30, 70 Cooling plate 30b Back surface 31, 75 Base 32 Conductor column 32a Electrode terminal pattern 33, 73 Flow path 34 BGA terminal 39a, 79a Coolant inlet 39b, 79b Cooling Liquid outlet 39c, 79c Coolant guide 40 Printed wiring board 41 Wiring pattern 61 Column terminal 76 Through hole 78 Copper foil pattern 81 Coolant circulation path 82 Pump 83 Heat radiation component 83a Heat radiation portion 83b Flow path 83c Heat radiation fin 83d Fan 90, 90 '' Cooling device 91 Electronic component 91a TIM
92, 92 'Printed circuit board 93 Heat receiving portion 93' Heat sink 93a Metal column 94 Heat radiating portion 95 Fin 96 Fan 97 Pump

Claims (4)

信号入出力用の端子を備えた半導体装置と、該半導体装置が実装されるプリント配線基板との間に配置される冷却板であって、
内部に冷却液が流れる流路を有する絶縁材料からなる基体と、
前記流路を貫通して前記基体の表裏面双方に露出した、前記端子と前記プリント配線基板上の配線パターンとを電気的に接続する導体柱とを備えたことを特徴とする冷却板。 A cooling plate disposed between a semiconductor device having terminals for signal input / output and a printed wiring board on which the semiconductor device is mounted,
A substrate made of an insulating material having a flow path through which a coolant flows;
Cooling plate, characterized in that it includes a conductive column for electrically connecting the wiring pattern of said flow path was exposed on the front and back surfaces both of the substrate through, before Symbol pin and the printed circuit board . 内部に冷却液が流れる流路を有する絶縁材料からなる基体と、前記流路を貫通して前記基体の表裏面双方に露出してなる導体柱とを有する冷却板と、
信号入出力用の端子を備え、該端子が前記導体柱の露出端面に電気接続されてなる半導体装置と、
前記半導体装置との間に前記冷却板を挟んだ位置に配置され、配線パターンが形成されて該配線パターンが前記導体柱の、前記端子が電気接続された露出端面とは反対側の露出端面に電気接続されてなるプリント配線基板と、
前記冷却板内の流路と接続され冷却液を循環させる冷却液循環経路と、
前記冷却液循環経路の途中に配備された、冷却液を該冷却液循環経路内で循環させるポンプと、
前記冷却液循環経路の途中に配備された、該冷却液循環経路内の熱を放熱する放熱部品とを備えたことを特徴とする電子装置。 A cooling plate having a base made of an insulating material having a flow path through which a cooling liquid flows, and a conductor column penetrating the flow path and exposed on both the front and back surfaces of the base;
A semiconductor device comprising a terminal for signal input / output, wherein the terminal is electrically connected to the exposed end face of the conductor post;
Wherein disposed on the across the cooling plate located between the semiconductor device, the wiring pattern wiring pattern is formed is the conductor post, to the exposed end face opposite to the exposed end face of the terminal is electrically connected a printed wiring board formed by connection conductive Kise',
A coolant circulation path connected to the flow path in the cooling plate and circulating the coolant;
A pump provided in the middle of the coolant circulation path for circulating the coolant in the coolant circulation path;
An electronic device comprising: a heat dissipating component that dissipates heat in the coolant circulation path, disposed in the middle of the coolant circulation path. 信号入出力用の柱状端子を備えた半導体装置と、該半導体装置が実装されるプリント配線基板との間に配置される冷却板であって、
内部に冷却液が流れる流路を有し表裏面を形成する絶縁材料からなるとともに前記半導体装置の柱状端子が挿通される、該流路を貫通して該表裏面双方に開口した貫通孔を有することを特徴とする冷却板。 A cooling plate disposed between a semiconductor device having columnar terminals for signal input / output and a printed wiring board on which the semiconductor device is mounted,
Wherein with an insulating material for forming the organic and front and rear surfaces of the flow path through which cooling liquid flows inside the pole terminals of the semiconductor device is inserted, having a through hole which is open on said back surface both through the flow path A cooling plate characterized by that. 信号入出力用の柱状端子を備えた半導体装置と、
内部に冷却液が流れる流路を有し表裏面を形成する絶縁材料からなるとともに前記半導体装置の柱状端子が挿通される、該流路を貫通して該表裏面双方に開口した貫通孔を有する冷却板であって前記半導体装置が配置され前記柱状端子が前記貫通孔を貫通する冷却板と、
配線パターンが形成され前記冷却板に配置されて該配線パターンが前記柱状端子に電気的に接続されてなるプリント配線基板と、
前記冷却板内の流路と接続され冷却液を循環させる冷却液循環経路と、
前記冷却液循環経路の途中に配備された、冷却液を該冷却液循環経路内で循環させるポンプと、
前記冷却液循環経路の途中に配備された、該冷却液循環経路内の冷却液の熱を放熱する放熱部品とを備えたことを特徴とする電子装置。 A semiconductor device having columnar terminals for signal input and output;
Wherein with an insulating material for forming the organic and front and rear surfaces of the flow path through which cooling liquid flows inside the pole terminals of the semiconductor device is inserted, having a through hole which is open on said back surface both through the flow path A cooling plate in which the semiconductor device is disposed and the columnar terminal penetrates the through hole; and
A printed wiring board in which a wiring pattern is formed and disposed on the cooling plate, and the wiring pattern is electrically connected to the columnar terminals;
A coolant circulation path connected to the flow path in the cooling plate and circulating the coolant;
A pump provided in the middle of the coolant circulation path for circulating the coolant in the coolant circulation path;
An electronic device comprising: a heat dissipating component disposed in the middle of the coolant circulation path for dissipating heat of the coolant in the coolant circulation path.
JP2007040514A 2007-02-21 2007-02-21 Cold plate and electronic device Expired - Fee Related JP5023735B2 (en)

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