JP5020671B2 - コンデンサ内蔵配線基板 - Google Patents
コンデンサ内蔵配線基板 Download PDFInfo
- Publication number
- JP5020671B2 JP5020671B2 JP2007080509A JP2007080509A JP5020671B2 JP 5020671 B2 JP5020671 B2 JP 5020671B2 JP 2007080509 A JP2007080509 A JP 2007080509A JP 2007080509 A JP2007080509 A JP 2007080509A JP 5020671 B2 JP5020671 B2 JP 5020671B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- conductor
- main surface
- current supply
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 207
- 239000004020 conductor Substances 0.000 claims description 252
- 239000010410 layer Substances 0.000 claims description 136
- 239000003985 ceramic capacitor Substances 0.000 claims description 78
- 239000000758 substrate Substances 0.000 claims description 58
- 239000007769 metal material Substances 0.000 claims description 13
- 239000011229 interlayer Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 description 61
- 239000011347 resin Substances 0.000 description 61
- 239000000463 material Substances 0.000 description 38
- 239000000919 ceramic Substances 0.000 description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 32
- 239000010949 copper Substances 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 27
- 239000003822 epoxy resin Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- 238000007747 plating Methods 0.000 description 16
- 230000004308 accommodation Effects 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000000945 filler Substances 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 239000002861 polymer material Substances 0.000 description 6
- 239000013067 intermediate product Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000000805 composite resin Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 101150004843 MCM21 gene Proteins 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Ceramic Capacitors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
11…コア基板
12…コア主面
13…コア裏面
14…導体形成部
15…電流供給用導体
19…電流供給用接続パッド
21…電子部品としてのマルチ・チップ・モジュール(MCM)
23…部品搭載領域
24,25…演算処理回路部としてのマイクロプロセッサチップ
26…共用回路部としてのメモリチップ
31…配線積層部としての第1ビルドアップ層
33,35…層間絶縁層としての樹脂絶縁層
39…配線積層部の表面
42…導体層
90…収容穴
100,101,182,183…コンデンサとしてのセラミックコンデンサ
102…コンデンサ主面
103…コンデンサ裏面
106…コンデンサ側面
107,181…切欠部
131…コンデンサ内ビア導体としての第1電源用コンデンサ内ビア導体
132…コンデンサ内ビア導体としての第1グランド用コンデンサ内ビア導体
133…コンデンサ内ビア導体としての第2電源用コンデンサ内ビア導体
134…コンデンサ内ビア導体としての第2グランド用コンデンサ内ビア導体
151…第1接続端子部
152,153…第2接続端子部
Claims (5)
- コア主面及びコア裏面を有し、前記コア裏面側及び前記コア主面側を導通させる電流供給用導体が形成された導体形成部を有し、少なくとも前記コア主面側にて開口する複数の収容穴が前記導体形成部を挟んで形成されたコア基板と、
コンデンサ主面、コンデンサ裏面及びコンデンサ側面を有しかつ前記コンデンサ側面に切欠部が存在する異型板状をなし、前記コア主面と前記コンデンサ主面とを同じ側に向けかつ前記切欠部を前記導体形成部側に向けた状態で前記複数の収容穴内にそれぞれ収容された複数のコンデンサと、
層間絶縁層及び導体層を前記コア主面上にて積層してなり、電子部品を搭載可能な部品搭載領域がその表面に設定され、その部品搭載領域内に前記電流供給用導体と電気的に接続された第1接続端子部が配置され、その第1接続端子部を挟んで複数の第2接続端子部が配置された配線積層部と
を備えることを特徴とするコンデンサ内蔵配線基板。 - 前記複数の第2接続端子部は、前記電子部品が有する複数の演算処理回路部に対してそれぞれ電気的に接続され、前記第1接続端子部は、前記複数の演算処理回路部によって共同で使用され、前記複数の演算処理回路部よりも大きな電流の供給を必要とする共用回路部に対して電気的に接続されることを特徴とする請求項1に記載のコンデンサ内蔵配線基板。
- 前記コンデンサは、複数のコンデンサ内ビア導体を有するビアアレイタイプのセラミックコンデンサであることを特徴とする請求項1または2に記載のコンデンサ内蔵配線基板。
- 前記電流供給用導体は、前記複数のコンデンサ内ビア導体よりも導電性の高い金属材料を用いて形成されていることを特徴とする請求項3に記載のコンデンサ内蔵配線基板。
- 前記電流供給用導体の端部には、前記電流供給用導体よりも径が大きい電流供給用接続パッドが設けられていることを特徴とする請求項1乃至4のいずれか1項に記載のコンデンサ内蔵配線基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007080509A JP5020671B2 (ja) | 2007-03-27 | 2007-03-27 | コンデンサ内蔵配線基板 |
US12/056,640 US20080239685A1 (en) | 2007-03-27 | 2008-03-27 | Capacitor built-in wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007080509A JP5020671B2 (ja) | 2007-03-27 | 2007-03-27 | コンデンサ内蔵配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008244030A JP2008244030A (ja) | 2008-10-09 |
JP5020671B2 true JP5020671B2 (ja) | 2012-09-05 |
Family
ID=39915030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007080509A Expired - Fee Related JP5020671B2 (ja) | 2007-03-27 | 2007-03-27 | コンデンサ内蔵配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5020671B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5286072B2 (ja) * | 2008-12-25 | 2013-09-11 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
JP5659042B2 (ja) * | 2011-02-28 | 2015-01-28 | 日本特殊陶業株式会社 | キャパシタ内蔵光電気混載パッケージ |
JP2014072279A (ja) * | 2012-09-28 | 2014-04-21 | Dainippon Printing Co Ltd | 部品内蔵配線基板の製造方法 |
WO2015083345A1 (ja) * | 2013-12-04 | 2015-06-11 | 日本特殊陶業株式会社 | 部品内蔵配線基板及びその製造方法 |
CN208016129U (zh) | 2015-09-02 | 2018-10-26 | 株式会社村田制作所 | 树脂电路基板、部件搭载树脂电路基板 |
JP7318305B2 (ja) * | 2019-05-17 | 2023-08-01 | 富士フイルムビジネスイノベーション株式会社 | 発光装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263619A (ja) * | 1994-03-17 | 1995-10-13 | Toshiba Corp | 半導体装置 |
JP4646371B2 (ja) * | 1999-09-02 | 2011-03-09 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
JP2003142628A (ja) * | 2001-11-08 | 2003-05-16 | Ngk Spark Plug Co Ltd | 配線基板 |
-
2007
- 2007-03-27 JP JP2007080509A patent/JP5020671B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2008244030A (ja) | 2008-10-09 |
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