JP4989936B2 - Lighting device - Google Patents

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JP4989936B2
JP4989936B2 JP2006204738A JP2006204738A JP4989936B2 JP 4989936 B2 JP4989936 B2 JP 4989936B2 JP 2006204738 A JP2006204738 A JP 2006204738A JP 2006204738 A JP2006204738 A JP 2006204738A JP 4989936 B2 JP4989936 B2 JP 4989936B2
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blue led
white
emission peak
phosphor
led chip
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光春 宇津木
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Asahi Rubber Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Description

本発明は、ＬＥＤの光により蛍光体を励起して発光する照明装置に関する。   The present invention relates to an illumination device that emits light by exciting a phosphor with light from an LED.

近年、蛍光灯代替技術としてＬＥＤ（発光ダイオード：Light Emitting Diode）が注目され、ＬＥＤを用いた照明装置の研究が進められている。従来のＬＥＤは、照明装置として用いるには演色性が低かった。そこで、赤色と緑色と青色との三色（ＲＧＢ）のＬＥＤを組み合わせることで演色性を改善する技術が提案されていた（例えば、特許文献１参照）。以下、赤色をＲ、緑色をＧ、青色をＢと表現する場合がある。   In recent years, LED (Light Emitting Diode) has attracted attention as a fluorescent lamp alternative technology, and research on lighting devices using LEDs has been advanced. Conventional LEDs have low color rendering properties when used as lighting devices. Therefore, a technique for improving color rendering properties by combining LEDs of three colors (RGB) of red, green, and blue has been proposed (see, for example, Patent Document 1). Hereinafter, red may be expressed as R, green as G, and blue as B.

しかしながら、このような照明装置に用いられる赤色と緑色と青色との三色（ＲＧＢ）のＬＥＤは、三色のＬＥＤのそれぞれの経時変化が異なるため、長期間使用することで当初の白色発光の色調が経時的に変化してしまった。   However, the three color (RGB) LEDs of red, green, and blue used in such an illumination device have different temporal changes in the three color LEDs. The color has changed over time.

また、白色ＬＥＤと、緑色ＬＥＤと、赤色ＬＥＤと、を有し、各ＬＥＤから放射された光を混光させる拡散部を有する発光装置も提案されていた（例えば、特許文献２参照）。しかしながら、このような発光装置では、各ＬＥＤから放射された３種類の色を混色させるため、得られた昼光色は色むらがあった。
特開２００５−２０３３２６号公報 特開２００２−２７０８９９号公報 In addition, a light emitting device having a white LED, a green LED, and a red LED and having a diffusion unit that mixes light emitted from each LED has been proposed (for example, see Patent Document 2). However, in such a light-emitting device, since three kinds of colors emitted from each LED are mixed, the obtained daylight color has uneven color.
JP 2005-203326 A JP 2002-270899 A

そこで、本発明の目的は、明るく長期間安定した光を発光し、色むらの無い高演色性の照明装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a lighting device that emits bright and stable light for a long period of time and has no color unevenness.

そこで、本発明にかかる照明装置は、
４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する複数の青色ＬＥＤチップと、
前記青色ＬＥＤチップの光を吸収して発光する蛍光体を含む蛍光部と、
を有し、
前記複数の青色ＬＥＤチップは、
第１の発光ピーク波長（λｐ）を有する第１の青色ＬＥＤチップと、
第２の発光ピーク波長（λｐ）を有する第２の青色ＬＥＤチップと、
を含み、
前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有し、
前記蛍光部は、緑色蛍光体及び赤色蛍光体を含み、少なくとも前記第１の青色ＬＥＤチップ及び前記第２の青色ＬＥＤチップのいずれか一方の光を吸収して発光し、
照明色の平均演色評価数Ｒａが８５以上である。 Therefore, the lighting device according to the present invention is
A plurality of blue LED chips having an emission peak wavelength (λp) in the range of 420 nm to 480 nm;
A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
Have
The plurality of blue LED chips are:
A first blue LED chip having a first emission peak wavelength (λp);
A second blue LED chip having a second emission peak wavelength (λp);
Including
The first emission peak wavelength (λp) has a difference of 10 nm or more and 60 nm or less with respect to the second emission peak wavelength (λp),
The fluorescent part includes a green phosphor and a red phosphor, absorbs light of at least one of the first blue LED chip and the second blue LED chip, and emits light.
The average color rendering index Ra of the illumination color is 85 or more.

本発明にかかる照明装置によれば、４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する複数の青色ＬＥＤチップを有することで、紫外線を発生するＬＥＤよりも高出力で明るい発光を得ることができる。また、本発明にかかる照明装置によれば、少なくとも２種類以上の異なる発光ピーク波長（λｐ）を有する青色ＬＥＤチップを含むことで、高い演色性を得ることができる。さらに、本発明にかかる照明装置によれば、従来の三色（ＲＧＢ）のＬＥＤに比べて経時変化による演色性の影響がほとんどない。また、本発明にかかる照明装置によれば、発光ピーク波長（λｐ）の異なる複数の青色ＬＥＤチップによって複数の白色を混ぜることになり、色むらの少ない照明色を得ることができる。 According to the illumination device of the present invention, it has a plurality of blue LED chips having an emission peak wavelength (λp) in the range of 420 nm to 480 nm, thereby obtaining bright light emission with higher output than an LED that generates ultraviolet rays. be able to. Moreover, according to the illuminating device concerning this invention, high color rendering property can be acquired by including the blue LED chip which has at least 2 or more types of different light emission peak wavelengths ((lambda) p). Furthermore, according to the illuminating device according to the present invention, there is almost no influence of color rendering due to a change with time, as compared with a conventional three-color (RGB) LED. Further, according to the illumination device of the present invention, a plurality of whites are mixed by a plurality of blue LED chips having different emission peak wavelengths (λp), and an illumination color with little color unevenness can be obtained.

本発明にかかる照明装置において、
照明色の平均演色評価数Ｒａが９０以上であることができる。 In the lighting device according to the present invention,
The average color rendering index Ra of the illumination color can be 90 or more.

本発明にかかる照明装置において、
前記蛍光部は、黄色蛍光体をさらに含むことができる。 In the lighting device according to the present invention,
The fluorescent unit may further contains Mukoto a yellow phosphor.

本発明にかかる照明装置は、
４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する青色ＬＥＤチップと、
前記青色ＬＥＤチップの光を吸収して発光する蛍光体を含む蛍光部と、
を有する白色ＬＥＤを複数有し、
前記複数の白色ＬＥＤは、
前記第１の発光ピーク波長（λｐ）の第１の青色ＬＥＤチップを有する第1の白色ＬＥＤと、
前記第２の発光ピーク波長（λｐ）の第２の青色ＬＥＤチップを有する第２の白色ＬＥＤと、
を含み、
前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有し、
前記第１の白色ＬＥＤ及び前記第２の白色ＬＥＤの少なくとも一方の蛍光部は、緑色蛍光体及び赤色蛍光体を含み、該蛍光部を有する白色ＬＥＤにおける青色ＬＥＤチップの光を吸収して発光し、
照明色の平均演色評価数Ｒａが８５以上である。 The lighting device according to the present invention is
A blue LED chip having an emission peak wavelength (λp) in the range of 420 nm to 480 nm;
A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
A plurality of white LEDs having
The plurality of white LEDs are:
A first white LED having a first blue LED chip of the first emission peak wavelength (λp);
A second white LED having a second blue LED chip of the second emission peak wavelength (λp);
Including
The first emission peak wavelength (λp) has a difference of 10 nm or more and 60 nm or less with respect to the second emission peak wavelength (λp),
At least one fluorescent part of the first white LED and the second white LED includes a green fluorescent substance and a red fluorescent substance, and emits light by absorbing light of a blue LED chip in the white LED having the fluorescent part. ,
The average color rendering index Ra of the illumination color is 85 or more.

本発明にかかる照明装置によれば、４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する青色ＬＥＤチップを有することで、紫外線を発生するＬＥＤよりも高出力で明るい発光を得ることができる。また、本発明にかかる照明装置によれば、異なる発光ピーク波長（λｐ）を有する青色ＬＥＤチップを用いた少なくとも２種類以上の白色ＬＥＤによって、高い演色性を得ることができ、異なる複数種類の白色ＬＥＤの組合せで適宜所望の色調に調整できる。さらに、本発明にかかる照明装置によれば、従来の三色（ＲＧＢ）のＬＥＤに比べて経時変化による演色性の影響がほとんどない。また、本発明にかかる照明装置によれば、発光ピーク波長（λｐ）の異なる複数の青色ＬＥＤチップによって複数の白色を混ぜることになり、色むらの少ない照明色を得ることができる。 According to the illumination device of the present invention, by having the blue LED chip having the emission peak wavelength (λp) in the range of 420 nm to 480 nm, it is possible to obtain brighter light emission with higher output than the LED that generates ultraviolet rays. it can. Further, according to the illumination device of the present invention, high color rendering can be obtained by at least two or more types of white LEDs using blue LED chips having different emission peak wavelengths (λp), and a plurality of different types of white LEDs. A desired color tone can be appropriately adjusted by a combination of LEDs. Furthermore, according to the illuminating device according to the present invention, there is almost no influence of color rendering due to a change with time, as compared with a conventional three-color (RGB) LED. Further, according to the illumination device of the present invention, a plurality of whites are mixed by a plurality of blue LED chips having different emission peak wavelengths (λp), and an illumination color with little color unevenness can be obtained.

本発明にかかる照明装置において、
照明色の平均演色評価数Ｒａが９０以上であることができる。 In the lighting device according to the present invention,
The average color rendering index Ra of the illumination color can be 90 or more.

本発明にかかる照明装置において、
前記第１の白色ＬＥＤは、黄色蛍光体を含む第１の蛍光部を有し、
前記第２の白色ＬＥＤは、緑色蛍光体と、赤色蛍光体と、を含む第２の蛍光部を有する、照明装置。 In the lighting device according to the present invention,
The first white LED has a first fluorescent part including a yellow phosphor,
Said 2nd white LED is an illuminating device which has a 2nd fluorescence part containing a green fluorescent substance and a red fluorescent substance.

本発明にかかる照明装置において、
前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）よりも長波長である、照明装置。 In the lighting device according to the present invention,
The lighting device, wherein the first emission peak wavelength (λp) is longer than the second emission peak wavelength (λp).

本発明にかかる照明装置において、
前記第１の白色ＬＥＤは、緑色蛍光体と、赤色蛍光体と、を含む第１の蛍光部を有し、
前記第２の白色ＬＥＤは、緑色蛍光体と、赤色蛍光体と、を含む第２の蛍光部を有する、照明装置。 In the lighting device according to the present invention,
The first white LED has a first fluorescent part including a green phosphor and a red phosphor,
Said 2nd white LED is an illuminating device which has a 2nd fluorescence part containing a green fluorescent substance and a red fluorescent substance.

本発明にかかる照明装置において、
前記第１の白色ＬＥＤは、黄色蛍光体と、緑色蛍光体と、赤色蛍光体と、を含む第１の蛍光部を有し、
前記第２の白色ＬＥＤは、黄色蛍光体と、緑色蛍光体と、赤色蛍光体と、を含む第２の蛍光部を有する、照明装置。 In the lighting device according to the present invention,
The first white LED has a first fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor,
The second white LED is a lighting device having a second fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor.

本発明にかかる照明装置において、
前記第１の青色ＬＥＤチップは、第１の樹脂成形体内に封入され、
前記第２の青色ＬＥＤチップは、第２の樹脂成形体内に封入され、
前記第１の蛍光部及び前記第２の蛍光部は、前記第１の樹脂成形体及び前記第２の樹脂成形体の外側に被せられたキャップ状の成形体であることができる。 In the lighting device according to the present invention,
The first blue LED chip is enclosed in a first resin molded body,
The second blue LED chip is enclosed in a second resin molded body,
The first fluorescent part and the second fluorescent part may be cap-shaped molded bodies placed on the outer sides of the first resin molded body and the second resin molded body.

本発明にかかる照明装置において、
前記第１の蛍光部は、前記第１の青色ＬＥＤチップを覆うシート状の成形体であり、
前記第２の蛍光部は、前記第２の青色ＬＥＤチップを覆うシート状の成形体であることができる。 In the lighting device according to the present invention,
The first fluorescent part is a sheet-like molded body that covers the first blue LED chip,
The second fluorescent part may be a sheet-like molded body that covers the second blue LED chip.

本発明にかかる照明装置において、
前記第１の青色ＬＥＤチップは、前記第１の蛍光部を含む第１の樹脂成形体内に封入され、
前記第２の青色ＬＥＤチップは、前記第２の蛍光部を含む第２の樹脂成形体内に封入されることができる。 In the lighting device according to the present invention,
The first blue LED chip is enclosed in a first resin molded body including the first fluorescent part,
The second blue LED chip may be encapsulated in a second resin molded body including the second fluorescent part.

本発明にかかる照明装置において、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３２７４，０．３６７３）、（０．３２８２，０．３２９７）、(０．２９９８，０．３３９６)、（０．３０６４，０．３０９１）の４点を結ぶ四辺形内の昼光色の色調であることができる。 In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3274, 0.3673), (0.3282, 0.3297), (0.2998, 0.3396), It can be a daylight color tone in a quadrilateral connecting four points (0.3064, 0.3091).

本発明にかかる照明装置において、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３６１６，０．３８７５）、（０．３５５２，０．３４７６）、(０．３３５３，０．３６５９)、（０．３３４５，０．３３１４）の４点を結ぶ四辺形内の昼白色の色調であることができる。 In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3616, 0.3875), (0.3552, 0.3476), (0.3353, 0.3659), It can be a neutral white tone in a quadrilateral connecting four points (0.3345, 0.3314).

本発明にかかる照明装置において、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３９３８，０．４０９７）、（０．３８０５，０．３６４２）、(０．３６５６，０．３９０５)、（０．３５８４，０．３４９９）の４点を結ぶ四辺形内の白色の色調であることができる。 In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3938, 0.4097), (0.3805, 0.3642), (0.3656, 0.3905), It can be a white color tone in a quadrilateral connecting four points (0.3584, 0.3499).

本発明にかかる照明装置において、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．４３４１，０．４２３３）、（０．４１７１，０．３８４６）、(０．４０２１，０．４０７６)、（０．３９０３，０．３７１９）の４点を結ぶ四辺形内の温白色の色調であることができる。 In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4341, 0.4233), (0.4171, 0.3846), (0.4021, 0.4076), It can be a warm white color tone in a quadrilateral connecting four points (0.3903, 0.3719).

本発明にかかる照明装置において、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．４７７５，０．４２８３）、（０．４５９４，０．３９７１）、(０．４３４８，０．４１８５)、（０．４２１４，０．３８８７）の４点を結ぶ四辺形内の電球色の色調であることができる。 In the lighting device according to the present invention,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4775, 0.4283), (0.4594, 0.3971), (0.4348, 0.4185), It can be the color tone of the light bulb color in the quadrilateral connecting four points (0.4214, 0.3887).

以下、本発明の実施形態について図面を参照しながら詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、第１の実施形態である照明装置１を模式的に示す部分縦断面図である。図２は、第２の実施形態である照明装置２を模式的に示す部分縦断面図である。図３は、第３の実施形態である照明装置３を模式的に示す部分縦断面図である。図４は、第４の実施形態である照明装置４を模式的に示す部分縦断面図である。図５は、第５の実施形態である照明装置５を模式的に示す部分縦断面図である。図６は、第６の実施形態である照明装置６を模式的に示す部分縦断面図である。図７は、第７の実施形態である照明装置７を模式的に示す部分縦断面図である。   FIG. 1 is a partial longitudinal sectional view schematically showing a lighting device 1 according to the first embodiment. FIG. 2 is a partial longitudinal sectional view schematically showing the lighting device 2 according to the second embodiment. FIG. 3 is a partial longitudinal sectional view schematically showing the illumination device 3 according to the third embodiment. FIG. 4 is a partial longitudinal sectional view schematically showing the illumination device 4 according to the fourth embodiment. FIG. 5 is a partial vertical cross-sectional view schematically showing the illumination device 5 according to the fifth embodiment. FIG. 6 is a partial vertical cross-sectional view schematically showing the illumination device 6 according to the sixth embodiment. FIG. 7 is a partial longitudinal sectional view schematically showing a lighting device 7 according to the seventh embodiment.

本発明の実施形態にかかる照明装置は、４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する複数の青色ＬＥＤチップと、前記青色ＬＥＤチップの光を吸収して発光する蛍光体を含む蛍光部と、を有し、前記複数の青色ＬＥＤチップは、第１の発光ピーク波長（λｐ）を有する第１の青色ＬＥＤチップと、第２の発光ピーク波長（λｐ）を有する第２の青色ＬＥＤチップと、を含み、前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有し、前記蛍光部は、緑色蛍光体及び赤色蛍光体を含み、少なくとも前記第１の青色ＬＥＤチップ及び前記第２の青色ＬＥＤチップのいずれか一方の光を吸収して発光し、照明色の平均演色評価数Ｒａが８５以上である。 An illumination device according to an embodiment of the present invention includes a plurality of blue LED chips having an emission peak wavelength (λp) in a range of 420 nm to 480 nm, and a phosphor that emits light by absorbing the light of the blue LED chip. A plurality of blue LED chips, a first blue LED chip having a first emission peak wavelength (λp) and a second blue color having a second emission peak wavelength (λp). The first emission peak wavelength (λp) has a difference of 10 nm or more and 60 nm or less with respect to the second emission peak wavelength (λp), and the fluorescent portion is a green phosphor. And at least one of the first blue LED chip and the second blue LED chip to emit light, and the average color rendering index Ra of the illumination color is 85 or more.

また、本発明の実施形態にかかる照明装置は、４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する青色ＬＥＤチップと、前記青色ＬＥＤチップの光を吸収して発光する蛍光体を含む蛍光部と、を有する白色ＬＥＤを複数有し、前記複数の白色ＬＥＤは、前記第１の発光ピーク波長（λｐ）の第１の青色ＬＥＤチップを有する第1の白色ＬＥＤと、前記第２の発光ピーク波長（λｐ）の第２の青色ＬＥＤチップを有する第２の白色ＬＥＤと、を含み、前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有し、前記第１の白色ＬＥＤ及び前記第２の白色ＬＥＤの少なくとも一方の蛍光部は、緑色蛍光体及び赤色蛍光体を含み、該蛍光部を有する白色ＬＥＤにおける青色ＬＥＤチップの光を吸収して発光し、照明色の平均演色評価数Ｒａが８５以上である。 An illumination device according to an embodiment of the present invention includes a blue LED chip having a light emission peak wavelength (λp) in a range of 420 nm to 480 nm, and a phosphor that absorbs and emits light from the blue LED chip. A plurality of white LEDs having a fluorescent portion, wherein the plurality of white LEDs includes a first white LED having a first blue LED chip having the first emission peak wavelength (λp), and the second white LED. A second white LED having a second blue LED chip having an emission peak wavelength (λp), wherein the first emission peak wavelength (λp) is 10 nm with respect to the second emission peak wavelength (λp). More than 60 nm difference, and at least one fluorescent part of the first white LED and the second white LED includes a green fluorescent substance and a red fluorescent substance, and the blue color in the white LED having the fluorescent part The LED chip absorbs light and emits light, and the average color rendering index Ra of the illumination color is 85 or more.

１．第１の実施形態
図１に示すように、第１の実施形態にかかる照明装置１は、白色ＬＥＤ１０，１２を複数例えば２個有する。第１の白色ＬＥＤ１０と第２の白色ＬＥＤ１２は、４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する青色ＬＥＤチップ３０、３２と、青色ＬＥＤチップ３０の光を吸収して発光する蛍光体Ｙ（黄色）を含む蛍光部４０と、青色ＬＥＤチップ３２の光を吸収して発光する蛍光体Ｇ（緑色），Ｒ（赤色）を含む蛍光部４２と、を有する。青色ＬＥＤチップ３０，３２は、２種類以上の異なる発光ピーク波長（λｐ）を有する。第１の白色ＬＥＤ１０及び第２の白色ＬＥＤ１２は、基台１００上に固定配置されている。第１の白色ＬＥＤ１０及び第２の白色ＬＥＤ１２は、基本的に同じ構成を有しており、ベース部材２０のほぼ中央に設けられたステム２２上に載置された発光する第１の青色ＬＥＤチップ３０及び第２の青色ＬＥＤチップ３２が例えば樹脂成形体２４中に封入されている。樹脂成形体２４の外側には、樹脂成形体２４を覆うようにキャップ状の第１の蛍光部４０及び第２の蛍光部４２が被せられている。樹脂成形体２４の材質としては、シリコーン樹脂が好ましいが、透光性の樹脂例えばアクリル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ポリエステル樹脂、エポキシ樹脂などを用いることができる。なお、各実施形態の説明図において、樹脂成形体及び蛍光部の一部は、断面図であるが、わかりやすくするためにハッチングを省略した。 1. First Embodiment As shown in FIG. 1, a lighting device 1 according to a first embodiment has a plurality of, for example, two white LEDs 10 and 12. The first white LED 10 and the second white LED 12 are blue LED chips 30 and 32 having a light emission peak wavelength (λp) in the range of 420 nm to 480 nm, and fluorescence emitted by absorbing light from the blue LED chip 30. The fluorescent part 40 including the body Y (yellow) and the fluorescent part 42 including the fluorescent substances G (green) and R (red) that absorb and emit light from the blue LED chip 32 are included. The blue LED chips 30 and 32 have two or more different emission peak wavelengths (λp). The first white LED 10 and the second white LED 12 are fixedly arranged on the base 100. The first white LED 10 and the second white LED 12 have basically the same configuration, and are a first blue LED chip that emits light and is placed on a stem 22 provided substantially at the center of the base member 20. 30 and the second blue LED chip 32 are enclosed in a resin molded body 24, for example. A cap-shaped first fluorescent part 40 and a second fluorescent part 42 are covered outside the resin molded body 24 so as to cover the resin molded body 24. As a material of the resin molding 24, a silicone resin is preferable, but a translucent resin such as an acrylic resin, a polycarbonate resin, a polystyrene resin, a polyester resin, an epoxy resin, or the like can be used. In the explanatory diagrams of the respective embodiments, the resin molded body and a part of the fluorescent part are cross-sectional views, but hatching is omitted for easy understanding.

第１の白色ＬＥＤ１０は、第１の発光ピーク波長（λｐ）の第１の青色ＬＥＤチップ３０を有する。第２の白色ＬＥＤ１２は、第１の発光ピーク波長（λｐ）とは異なる第２の発光ピーク波長（λｐ）の第２の青色ＬＥＤチップ３２を有する。第１の発光ピーク波長（λｐ）及び第２の発光ピーク波長（λｐ）は、４２０ｎｍ〜４８０ｎｍの範囲から適宜選択された異なる発光ピーク波長（λｐ）である。このような青色ＬＥＤチップとすることで、高出力で明るい発光を得ることができる。第１の発光ピーク波長（λｐ）は、第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有する。第１の発光ピーク波長（λｐ）は、第２の発光ピーク波長（λｐ）よりも長波長であることが好ましい。このように発光ピーク波長（λｐ）が大きくずれた２種類の青色ＬＥＤチップを用いることで、高い演色性を得ることができる。なお、波長の規格にはピーク波長であるλｐと主波長もしくはドミナント波長であるλｄとの２種類があるが、本発明における発光ピーク波長はλｐである。第１、第２の青色ＬＥＤチップ３０、３２としては市販されている公知のＬＥＤを使用することができる。例えば、ＧａＮ系ＬＥＤ、ＳｉＣ系ＬＥＤ、ＺｎＳｅ系ＬＥＤ、ＩｎＧａＮ系ＬＥＤ等を用いることができる。 The first white LED 10 includes a first blue LED chip 30 having a first emission peak wavelength (λp). The second white LED 12 includes a second blue LED chip 32 having a second emission peak wavelength (λp) different from the first emission peak wavelength (λp). The first emission peak wavelength (λp) and the second emission peak wavelength (λp) are different emission peak wavelengths (λp) appropriately selected from the range of 420 nm to 480 nm . With blue LED chips, such as this, it is possible to obtain a bright light with high output. The first emission peak wavelength (λp) has a difference of 10 nm to 60 nm with respect to the second emission peak wavelength (λp). The first emission peak wavelength (λp) is preferably longer than the second emission peak wavelength (λp). Thus, high color rendering properties can be obtained by using two types of blue LED chips whose emission peak wavelengths (λp) are greatly shifted. Although there are two types of wavelength standards, λp, which is a peak wavelength, and λd, which is a dominant wavelength or a dominant wavelength, the emission peak wavelength in the present invention is λp. As the first and second blue LED chips 30 and 32, commercially available LEDs can be used. For example, GaN-based LEDs, SiC-based LEDs, ZnSe-based LEDs, InGaN-based LEDs, and the like can be used.

第１の白色ＬＥＤ１０は、全体に分散された黄色蛍光体Ｙを含む第１の蛍光部４０を有し、第２の白色ＬＥＤ１２は、全体に分散された緑色蛍光体Ｇ及び赤色蛍光体Ｒを含む第２の蛍光部４２を有する。第１、第２の蛍光部４０、４２は、それぞれ樹脂成形体２４の外側に被せられた高分子物質からなるキャップ状の成形体である。第１、第２の蛍光部４０、４２の材料としても、シリコーン系樹脂を用いることが好ましいが、例えば透光性の高分子物質であるアクリル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ポリエステル樹脂、エポキシ樹脂、ポリプロピレン樹脂、ポリエチレン樹脂、シリコーン樹脂、環状オレフィン樹脂、シリコーン系エラストマー、ポリスチレン系熱可塑性エラストマー、ポリオレフィン系熱可塑性エラストマー、ポリウレタン系熱可塑性エラストマーなどを用いることもできる。   The first white LED 10 has a first fluorescent part 40 including a yellow phosphor Y dispersed throughout, and the second white LED 12 includes a green phosphor G and a red phosphor R dispersed throughout. The second fluorescent part 42 is included. The first and second fluorescent portions 40 and 42 are cap-shaped molded bodies each made of a polymer material that is placed on the outside of the resin molded body 24. As the material of the first and second fluorescent portions 40 and 42, it is preferable to use a silicone resin. For example, an acrylic resin, a polycarbonate resin, a polystyrene resin, a polyester resin, and an epoxy resin, which are translucent polymer substances, are used. Polypropylene resin, polyethylene resin, silicone resin, cyclic olefin resin, silicone-based elastomer, polystyrene-based thermoplastic elastomer, polyolefin-based thermoplastic elastomer, polyurethane-based thermoplastic elastomer, and the like can also be used.

第1の青色ＬＥＤチップ３０の第１の発光ピーク波長（λｐ）は、第２の青色ＬＥＤチ
ップ３２の第２の発光ピーク波長（λｐ）よりも長波長であることが蛍光体との組合せとして好ましい。例えば、第１の青色ＬＥＤチップ３０の第１の発光ピーク波長（λｐ）を４７０ｎｍとして、第２の青色ＬＥＤチップ３２の第２の発光ピーク波長（λｐ）を４３０ｎｍとすることができる。第２の青色ＬＥＤチップ３２の発光ピーク波長（λｐ）を短波長側例えば４３０ｎｍとすることで、緑色蛍光体Ｇ及び赤色蛍光体Ｒの発光特性が向上し、より明るい照明装置を得ることができる。また、第１の青色ＬＥＤチップ３０の発光ピーク波長（λｐ）を長波長側例えば４７０ｎｍとすることで、黄色蛍光体Ｙの発光特性を損わず、演色性を飛躍的に向上することができる。 As a combination with the phosphor, the first emission peak wavelength (λp) of the first blue LED chip 30 is longer than the second emission peak wavelength (λp) of the second blue LED chip 32. preferable. For example, the first emission peak wavelength (λp) of the first blue LED chip 30 can be set to 470 nm, and the second emission peak wavelength (λp) of the second blue LED chip 32 can be set to 430 nm. By setting the emission peak wavelength (λp) of the second blue LED chip 32 to the short wavelength side, for example, 430 nm, the emission characteristics of the green phosphor G and the red phosphor R are improved, and a brighter illumination device can be obtained. . In addition, by setting the emission peak wavelength (λp) of the first blue LED chip 30 to the long wavelength side, for example, 470 nm, the color rendering property can be dramatically improved without impairing the emission characteristics of the yellow phosphor Y. .

第１の青色ＬＥＤチップ３０から出射された光は、キャップ状の第１の蛍光部４０内の黄色蛍光体Ｙにより一部吸収され、黄色蛍光体Ｙが励起される。黄色蛍光体Ｙが励起されると、その性質に応じて所定の分光スペクトル分布を有する蛍光を発光し、第１の白色光が出力される。また、第２の青色ＬＥＤチップ３２から出射された光は、キャップ状の第２の蛍光部４２内の緑色蛍光体Ｇ及び赤色蛍光体Ｒにより一部吸収され、各蛍光体が励起される。緑色蛍光体Ｇ及び赤色蛍光体Ｒが励起されると、その性質に応じて所定の分光スペクトル分布を有する蛍光を発光し、第２の白色光が出力される。このように、発光ピーク波長（λｐ）が４２０ｎｍ〜４８０ｎｍの青色発光と黄色蛍光体Ｙを利用した第１の白色光と、発光ピーク波長（λｐ）が４２０ｎｍ〜４８０ｎｍの青色発光と緑色蛍光体Ｇ及び赤色蛍光体Ｒを利用した第２の白色光とを組み合わせることにより、従来のＬＥＤでは得られなかった演色性の高い白色光を得ることが可能となる。しかも、このように２種類以上の白色光を組み合わせることによって、色むらの無い白色光を得ることができる。蛍光体としては、蛍光を発する無機蛍光体、顔料、有機蛍光染料、擬似顔料などが挙げられ、例えば、発光色が黄色の（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕ、ＹＡＧ、Ｓｒ（Ｂａ）ＳｉＯ４、ＳｒＡｌ２Ｏ４：Ｅｕ２＋などの黄色蛍光体Ｙ、発光色が緑色のＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ２＋，Ｍｎ２＋、ＺｎＳ：Ｃｕ，Ａｌ，Ａｕ、ＳｒＡｌ２Ｏ４：Ｅｕ２＋、Ｚｎ２Ｓｉ（Ｇｅ）Ｏ４：Ｅｕ２＋などの緑色蛍光体Ｇ、発光色が赤色のＹ２Ｏ２Ｓ：Ｅｕ３＋、３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ、ＬｉＥｕＷ２Ｏ８、ＢａＯ・Ｇｄ２Ｏ３・Ｔａ２Ｏ５：Ｍｎ、Ｋ５Ｅｕ２．５（ＷＯ４）６．２５などの赤色蛍光体Ｒを好適に用いることができる。これらの蛍光体の種類及び量は、より演色性が高く、所望する白色に近い発色が得られるように調整することができる。 The light emitted from the first blue LED chip 30 is partially absorbed by the yellow phosphor Y in the cap-shaped first phosphor section 40, and the yellow phosphor Y is excited. When the yellow phosphor Y is excited, it emits fluorescence having a predetermined spectral distribution according to its property, and first white light is output. Further, the light emitted from the second blue LED chip 32 is partially absorbed by the green phosphor G and the red phosphor R in the cap-shaped second phosphor part 42, and each phosphor is excited. When the green phosphor G and the red phosphor R are excited, fluorescence having a predetermined spectral spectrum distribution is emitted according to the properties, and second white light is output. As described above, the blue light emission with the emission peak wavelength (λp) of 420 nm to 480 nm, the first white light using the yellow phosphor Y, the blue light emission with the emission peak wavelength (λp) of 420 nm to 480 nm, and By combining with the second white light using the green phosphor G and the red phosphor R, it is possible to obtain white light with high color rendering that cannot be obtained with a conventional LED. In addition, by combining two or more types of white light in this way, white light with no color unevenness can be obtained. Examples of the fluorescent material include inorganic fluorescent materials that emit fluorescence, pigments, organic fluorescent dyes, pseudo pigments, and the like. For example, (Ca, Sr, Ba) 2 SiO 4 : Eu, YAG, Sr (Ba) having a yellow emission color. ) Yellow phosphor Y such as SiO 4 , SrAl 2 O 4 : Eu 2+ , green emission color BaMg 2 Al 16 O 27 : Eu 2+ , Mn 2+ , ZnS: Cu, Al, Au, SrAl 2 O 4 : Eu 2+ , green phosphor G such as Zn 2 Si (Ge) O 4 : Eu 2+ , Y 2 O 2 S: Eu 3+ whose emission color is red, 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, LiEuW 2 A red phosphor R such as O 8 , BaO · Gd 2 O 3 · Ta 2 O 5 : Mn, K 5 Eu 2.5 (WO 4 ) 6.25 can be suitably used. The type and amount of these phosphors can be adjusted such that the color rendering property is higher and a desired color near white is obtained.

このようにして得られた照明装置１の照明色の色調は、ＪＩＳ Ｚ ９１１２「蛍光ランプの光源色及び演色性による区分」に規定された昼光色、昼白色、白色、温白色または電球色の色度範囲である。照明装置１の照明色の色調は、ｘｙ色度図上における（ｘ、ｙ）が（０．３２７４，０．３６７３）、（０．３２８２，０．３２９７）、(０．２９９８，０．３３９６)、（０．３０６４，０．３０９１）の４点を結ぶ四辺形内の昼光色であることが好ましい。照明装置１の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３６１６，０．３８７５）、（０．３５５２，０．３４７６）、(０．３３５３，０．３６５９)、（０．３３４５，０．３３１４）の４点を結ぶ四辺形内の昼白色の色調であることが好ましい。照明装置１の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３９３８，０．４０９７）、（０．３８０５，０．３６４２）、(０．３６５６，０．３９０５)、（０．３５８４，０．３４９９）の４点を結ぶ四辺形内の白色の色調であることが好ましい。照明装置１の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．４３４１，０．４２３３）、（０．４１７１，０．３８４６）、(０．４０２１，０．４０７６)、（０．３９０３，０．３７１９）の４点を結ぶ四辺形内の温白色の色調であることが好ましい。照明装置１の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．４７７５，０．４２８３）、（０．４５９４，０．３９７１）、(０．４３４８，０．４１８５)、（０．４２１４，０．３８８７）の４点を結ぶ四辺形内の電球色の色調であることが好ましい。また、照明装置１の照明色は、演色性のなかでも特に一般照明において重要な平均演色評価数Ｒａがよく、平均演色評価数Ｒａが８５以上である。また、照明装置１の照明色は、発光ピーク波長（λｐ）の異なる複数の青色ＬＥＤチップによって複数の白色を混ぜることにより、色むらが少ない。さらに、照明装置１の照明色がＪＩＳ Ｚ ９１１２に規定された昼光色、昼白色、白色または温白色であるとき、平均演色評価数Ｒａが９０以上であることが好ましい。   The color of the illumination color of the illuminating device 1 thus obtained is a daylight color, a neutral white color, a white color, a warm white color or a light bulb color as defined in JIS Z 9112 “Classification by light source color and color rendering of fluorescent lamp”. The degree range. As for the color tone of the illumination color of the illumination device 1, (x, y) on the xy chromaticity diagram is (0.3274, 0.3673), (0.3282, 0.3297), (0.2998, 0.3396). ) And (0.3064, 0.3091) are preferably daylight colors in a quadrilateral connecting four points. The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.3616, 0.3875), (0.3552, 0.3476), (0.3353, 0.3659), It is preferable to have a neutral white tone in a quadrilateral connecting four points (0.3345, 0.3314). The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.3938, 0.4097), (0.3805, 0.3642), (0.3656, 0.3905), A white color tone in a quadrilateral connecting four points (0.3584, 0.3499) is preferable. The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.4341, 0.4233), (0.4171, 0.3846), (0.4021, 0.4076), It is preferably a warm white color tone in a quadrilateral connecting four points (0.3903, 0.3719). The illumination color of the illumination device 1 is such that (x, y) on the xy chromaticity diagram is (0.4775, 0.4283), (0.4594, 0.3971), (0.4348, 0.4185), It is preferable that the color tone of the light bulb color in a quadrilateral connecting four points (0.4214, 0.3887). Moreover, the illumination color of the lighting device 1 has an average color rendering index Ra that is particularly important in general lighting among the color rendering properties, and the average color rendering index Ra is 85 or more. Moreover, the illumination color of the illuminating device 1 has little color unevenness by mixing a plurality of whites with a plurality of blue LED chips having different emission peak wavelengths (λp). Furthermore, when the illumination color of the illumination device 1 is daylight color, neutral white color, white color or warm white color defined in JIS Z 9112, the average color rendering index Ra is preferably 90 or more.

また、第１の実施形態においては、第１の発光ピーク波長（λｐ）の第１の青色ＬＥＤチップ３０を有する第1の白色ＬＥＤ１０と、第２の発光ピーク波長（λｐ）の第２の青
色ＬＥＤチップ３２を有する第２の白色ＬＥＤ１２と、を含み、第１の発光ピーク波長（λｐ）は、第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有しているが、照明装置などの要求によって用いるＬＥＤチップの数及び組合せを適宜設定することによって、演色性が要求される用途に適した平均演色評価数Ｒａが８５以上の白色光を得ることができる。例えば、樹脂成形体中に複数個の青色ＬＥＤチップが含まれてもよいし、基板１００上に３個の第１の白色ＬＥＤ１０と７個の第２の白色ＬＥＤ１２とを配置してもよい。また、３個以上の青色ＬＥＤチップを用いる場合には、３種類以上の発光ピーク波長（λｐ）を有する青色ＬＥＤチップを用いてもよい。その場合、例えば、発光ピーク波長（λｐ）が４７０ｎｍの第１の青色ＬＥＤチップ３０と、発光ピーク波長（λｐ）が４３０ｎｍの第２の青色ＬＥＤチップ３２と、発光ピーク波長（λｐ）が４５０ｎｍの第３の青色ＬＥＤチップと、を用いることができる。 In the first embodiment, the first white LED 10 having the first blue LED chip 30 having the first emission peak wavelength (λp) and the second blue color having the second emission peak wavelength (λp) are used. A second white LED 12 having an LED chip 32, and the first emission peak wavelength (λp) has a difference of 10 nm or more and 60 nm or less with respect to the second emission peak wavelength (λp). By appropriately setting the number and combination of the LED chips used according to the requirements of the lighting device or the like, it is possible to obtain white light having an average color rendering index Ra of 85 or more suitable for applications requiring color rendering properties. For example, a plurality of blue LED chips may be included in the resin molded body, or three first white LEDs 10 and seven second white LEDs 12 may be arranged on the substrate 100. Moreover, when using 3 or more blue LED chips, you may use the blue LED chip which has 3 or more types of light emission peak wavelengths ((lambda) p). In that case, for example, the first blue LED chip 30 with an emission peak wavelength (λp) of 470 nm, the second blue LED chip 32 with an emission peak wavelength (λp) of 430 nm, and an emission peak wavelength (λp) of 450 nm A third blue LED chip can be used.

２．第２の実施形態
図２に示すように、第２の実施形態にかかる照明装置２は、基台１００上に固定配置された第１の白色ＬＥＤ１０ａと、第２の白色ＬＥＤ１２ａと、を有する。第１の実施形態の白色ＬＥＤがいわゆる砲弾型のＬＥＤであるのに対して、第２の実施形態の白色ＬＥＤは、ＬＥＤチップを実装するパッケージが小型化、薄型化されたＳＭＤ型（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｄｅｖｉｃｅ：表面実装型）ＬＥＤを用いた点で異なるが、基本的に第１の実施形態と同じ構成であり、同じ部品には同じ符号を用いて示す。ＳＭＤ型の第1の白色ＬＥＤ１０ａ及び第２の白色ＬＥＤ１２ａは、セラミック製の基台１００上にタングステン（Ｗ）等によってパターン形成された配線導体（アノードリード）１０８及び配線導体（カソードリード）１０９と、基台１００と一体的に成形された例えば無機材料の焼結体からなる本体１０４と、を有する。本体１０４は、略円筒状であり、横断面円形の内壁は第1の青色ＬＥＤチップ３０及び第２の青色ＬＥＤチップ３２の光が放射する方向に拡径された形状を有する側壁部１０６に形成されている。第1の青色ＬＥＤチップ３０及び第２の青色ＬＥＤチップ３２は、本体１０４の底部に露出した配線導体１０８、１０９にボンディングワイヤによって電気的に接続され、本体１０４の側壁部１０６内に充填された透光性樹脂の樹脂成形体２４によって封止されている。第1の青色ＬＥＤチップ３０及び第２の青色ＬＥＤチップ３２を覆うシート状例えば薄い円板状の第1の蛍光部４０ｓ及び第２の蛍光部４２ｓが各樹脂成形体２４の上面に密着して配置されている。 2. 2nd Embodiment As shown in FIG. 2, the illuminating device 2 concerning 2nd Embodiment has 1st white LED10a fixedly arrange | positioned on the base 100, and 2nd white LED12a. The white LED of the first embodiment is a so-called bullet-type LED, whereas the white LED of the second embodiment is an SMD type (Surface Mount) in which the package for mounting the LED chip is reduced in size and thickness. (Device: surface mount type) Although it is different in that an LED is used, the configuration is basically the same as that of the first embodiment, and the same components are denoted by the same reference numerals. The first white LED 10a and the second white LED 12a of the SMD type are composed of a wiring conductor (anode lead) 108 and a wiring conductor (cathode lead) 109 patterned on a ceramic base 100 with tungsten (W) or the like. And a main body 104 formed of a sintered body of, for example, an inorganic material, which is integrally formed with the base 100. The main body 104 has a substantially cylindrical shape, and an inner wall having a circular cross section is formed on a side wall portion 106 having a shape expanded in the direction in which light from the first blue LED chip 30 and the second blue LED chip 32 is emitted. Has been. The first blue LED chip 30 and the second blue LED chip 32 are electrically connected to the wiring conductors 108 and 109 exposed at the bottom of the main body 104 by bonding wires, and filled in the side wall portion 106 of the main body 104. It is sealed with a resin molded body 24 of translucent resin. Sheet-like, for example, thin, disk-shaped first fluorescent portions 40 s and second fluorescent portions 42 s that cover the first blue LED chip 30 and the second blue LED chip 32 are in close contact with the upper surface of each resin molded body 24. Has been placed.

第1の蛍光部４０ｓは、第１の青色ＬＥＤチップ３０の光により励起されて発光する黄色蛍光体Ｙを全体に分散されて含み、第２の蛍光部４２ｓは、第２の青色ＬＥＤチップ３２の光により励起されて発光する緑色蛍光体Ｇ及び赤色蛍光体Ｒを全体に分散されて含む。樹脂成形体２４、蛍光体Ｙ，Ｇ，Ｒ、青色ＬＥＤチップ３０，３２、第１の蛍光部４０ｓ及び第２の蛍光部４２ｓのマトリックス材料の材質は、第１の実施形態で例示したものを適宜用いることができる。従ってこの場合、第１の白色ＬＥＤ１０ａと第２の白色ＬＥＤ１２ａとは異なる発光ピーク波長（λｐ）の第１、第２の青色ＬＥＤチップ３０、３２を用いることで２種類の白色光を組み合わせることができ、演色性の高い照明装置２となる。また、第２の実施形態においても、２つの青色ＬＥＤチップを用いたが、照明装置などの要求によって用いる青色ＬＥＤチップの数及び組合せを適宜設定することができる。さらに、３個以上の青色ＬＥＤチップを用いる場合には、２種類に限らず３種類以上の発光ピーク波長（λｐ）を有する青色ＬＥＤチップを組み合わせてもよい。   The first fluorescent part 40 s includes yellow phosphors Y that are excited by the light of the first blue LED chip 30 to emit light, and the second fluorescent part 42 s includes the second blue LED chip 32. The green phosphor G and the red phosphor R which are excited by the light and emit light are dispersed throughout. The material of the matrix material of the resin molded body 24, the phosphors Y, G, and R, the blue LED chips 30 and 32, the first fluorescent part 40s, and the second fluorescent part 42s is the same as that exemplified in the first embodiment. It can be used as appropriate. Therefore, in this case, two types of white light can be combined by using the first and second blue LED chips 30 and 32 having different emission peak wavelengths (λp) from the first white LED 10a and the second white LED 12a. The illuminating device 2 can be made with high color rendering. Also, in the second embodiment, two blue LED chips are used, but the number and combination of blue LED chips to be used can be appropriately set according to the demand of the lighting device or the like. Further, when three or more blue LED chips are used, the blue LED chips having not only two types but also three or more types of emission peak wavelengths (λp) may be combined.

３．第３の実施形態
図３に示すように、第３の実施形態にかかる照明装置３は、基台１００上に固定配置された第１の白色ＬＥＤ１０ｂと、第２の白色ＬＥＤ１２と、を有する。第１の白色ＬＥＤ１０ｂは、緑色蛍光体Ｇ及び赤色蛍光体Ｒを含む第１の蛍光部４２を有し、第２の白色ＬＥＤ１２は、緑色蛍光体Ｇ及び赤色蛍光体Ｒを含む第２の蛍光部４２ａを有する。第１の蛍光部の蛍光体が緑色蛍光体Ｇ及び赤色蛍光体Ｒになったことを除けば、基本的に第１の実施形態と同じ構成であり、同じ部品には同じ符号を用いて示す。第１の蛍光体４２と第２の蛍光体４２ａの緑色蛍光体Ｇ及び赤色蛍光体Ｒは、同じ蛍光体を用いてもよいし、違う組成の蛍光体を用いてもよい。従ってこの場合、第１の白色ＬＥＤ１０ｂと第２の白色ＬＥＤ１２とは異なる発光ピーク波長（λｐ）の青色ＬＥＤチップ３０、３２を用いることで２種類の白色光を組み合わせることができ、演色性の高い照明装置３となる。また、第３の実施形態においても、２つの青色ＬＥＤチップを用いたが、照明装置などの要求によって用いる青色ＬＥＤチップの数及び組合せを適宜設定することができる。さらに、３個以上の青色ＬＥＤチップを用いる場合には、２種類に限らず３種類以上の発光ピーク波長（λｐ）を有する青色ＬＥＤを組み合わせてもよい。 3. 3rd Embodiment As shown in FIG. 3, the illuminating device 3 concerning 3rd Embodiment has 1st white LED10b fixedly arrange | positioned on the base 100, and 2nd white LED12. The first white LED 10b has a first fluorescent part 42 including a green phosphor G and a red phosphor R, and the second white LED 12 is a second fluorescence including a green phosphor G and a red phosphor R. It has a portion 42a. Except for the fact that the phosphors of the first fluorescent part are the green phosphor G and the red phosphor R, the configuration is basically the same as that of the first embodiment, and the same parts are denoted by the same reference numerals. . As the green phosphor G and the red phosphor R of the first phosphor 42 and the second phosphor 42a, the same phosphor may be used, or phosphors having different compositions may be used. Therefore, in this case, two types of white light can be combined using the blue LED chips 30 and 32 having different emission peak wavelengths (λp) from the first white LED 10b and the second white LED 12, and the color rendering property is high. The lighting device 3 is obtained. Also, in the third embodiment, two blue LED chips are used, but the number and combination of blue LED chips to be used can be set as appropriate according to the requirements of the lighting device or the like. Further, when three or more blue LED chips are used, not only two types but also three or more types of blue LEDs having emission peak wavelengths (λp) may be combined.

４．第４の実施形態
図４に示すように、第４の実施形態にかかる照明装置４は、基台１００上に固定配置された第１の白色ＬＥＤ１０ｃと、第２の白色ＬＥＤ１２ｃと、を有する。第１の白色ＬＥＤ１０ｃは、黄色蛍光体Ｙと、緑色蛍光体Ｇと、赤色蛍光体Ｒと、を含む第１の蛍光部４３ａを有し、第２のＬＥＤ１２ｃは、黄色蛍光体Ｙと、緑色蛍光体Ｇと、赤色蛍光体Ｒと、を含む第２の蛍光部４３を有する。第１、第２の蛍光部の蛍光体が黄色蛍光体Ｙ、緑色蛍光体Ｇ及び赤色蛍光体Ｒの全てを含むになったことを除けば、基本的に第１の実施形態と同じ構成であり、同じ部品には同じ符号を用いて示す。第１の蛍光体４３ａと第２の蛍光体４３の黄色蛍光体Ｙ、緑色蛍光体Ｇ及び赤色蛍光体Ｒは、同じ蛍光体を用いてもよいし、違う組成の蛍光体を用いてもよい。従ってこの場合、第１の白色ＬＥＤ１０ｃと第２の白色ＬＥＤ１２ｃとは異なる発光ピーク波長（λｐ）の第１、第２の青色ＬＥＤ３０、３２を用いることで２種類の白色光を組み合わせることができ、演色性の高い照明装置４となる。また、第４の実施形態においても、２つの青色ＬＥＤチップを用いたが、照明装置などの要求によって用いる青色ＬＥＤチップの数及び組合せを適宜設定することができる。さらに、３個以上の青色ＬＥＤチップを用いる場合には、２種類に限らず３種類以上の発光ピーク波長（λｐ）を有する青色ＬＥＤを組み合わせてもよい。 4). 4th Embodiment As shown in FIG. 4, the illuminating device 4 concerning 4th Embodiment has 1st white LED10c fixedly arrange | positioned on the base 100, and 2nd white LED12c. The first white LED 10c has a first fluorescent part 43a including a yellow phosphor Y, a green phosphor G, and a red phosphor R, and the second LED 12c includes a yellow phosphor Y and a green phosphor. The second fluorescent part 43 including the fluorescent substance G and the red fluorescent substance R is included. Except that the phosphors of the first and second fluorescent parts include all of the yellow phosphor Y, the green phosphor G, and the red phosphor R, the configuration is basically the same as that of the first embodiment. The same parts are denoted by the same reference numerals. As the yellow phosphor Y, the green phosphor G, and the red phosphor R of the first phosphor 43a and the second phosphor 43, the same phosphor may be used, or phosphors having different compositions may be used. . Therefore, in this case, two types of white light can be combined by using the first and second blue LEDs 30 and 32 having different emission peak wavelengths (λp) from the first white LED 10c and the second white LED 12c. The lighting device 4 has high color rendering properties. Also, in the fourth embodiment, two blue LED chips are used, but the number and combination of blue LED chips to be used can be set as appropriate according to the demand of the lighting device or the like. Further, when three or more blue LED chips are used, not only two types but also three or more types of blue LEDs having emission peak wavelengths (λp) may be combined.

また、第１〜第４の実施形態のように蛍光部をキャップ状の成形体とするだけでなく、例えば樹脂成形体２４に蛍光部が含まれてもよい。その場合、例えば、樹脂成形体２４全体に蛍光体Ｙなどが分散されていてもよいし、樹脂成形体２４の一部のみを蛍光部としてもよい。具体的には、後述する図７に示す照明装置７の蛍光部のようにしてもよい。   Moreover, not only the fluorescent part is a cap-shaped molded body as in the first to fourth embodiments, but the fluorescent part may be included in the resin molded body 24, for example. In that case, for example, the phosphor Y or the like may be dispersed throughout the resin molded body 24, or only a part of the resin molded body 24 may be used as the fluorescent portion. Specifically, the fluorescent part of the illumination device 7 shown in FIG.

５．第５の実施形態
図５に示すように、第５の実施形態にかかる照明装置５は、筐体１１０の底部に配置された基板１０２上にモノシリックに直列接続された複数の第１、第２の青色ＬＥＤチップ３０、３２と、これら複数の第１、第２の青色ＬＥＤチップ３０，３２を覆うシート状の成形体からなる蛍光部４４と、を含む。蛍光部４４は、第１の実施形態の蛍光部と同様の透光性高分子材料を用いることができ、例えばシリコーン樹脂中に緑色蛍光体Ｇ及び赤色蛍光体Ｒを含み、複数の第１、第２の青色ＬＥＤ３０，３２の発光により白色に発光する。第１、第２の青色ＬＥＤチップ３０、３２は、４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有し、第１の青色ＬＥＤチップ３０の発光ピーク波長（λｐ）は、第２の青色ＬＥＤチップ３２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有する。第１の青色ＬＥＤ３０と第２の青色ＬＥＤ３２は、基本的に同じ構造のＧａＮ系ＬＥＤチップであり、基板１０２上に例えばｎ型ＧａＮ層３０１、ｐ型ＧａＮ層３０２、ｐ電極３０３、ｎ電極３０４を有している。隣り合う第１、第２の青色ＬＥＤチップ３０，３２は、ｐ電極３０３とｎ電極３０４とをエアブリッジ配線Ｌで接続されている。このように複数の青色ＬＥＤチップをモノリシックに形成して互いに直列接続することで、各青色ＬＥＤチップに流れる電流は同一となり、バンドギャップエネルギーに高低が生じてもフラットな発光スペクトルが得られる。筐体１１０の内部は、樹脂成形体２４によって封止され、第１の青色ＬＥＤ３０と第２の青色ＬＥＤ３２は樹脂成形体２４中にある。したがって、照明装置５は、筐体１１０の底部に基板１０２及び複数の第１、第２の青色ＬＥＤチップ３０、３２が配置された後、筐体１１０内に樹脂が筐体１１０の開口部１１２まで充填されて樹脂成形体２４を形成し、さらに開口部１１２にシート状の蛍光部４４が設置されてなる。 5. Fifth Embodiment As shown in FIG. 5, the lighting device 5 according to the fifth embodiment includes a plurality of first and second monolithically connected in series on a substrate 102 disposed at the bottom of a housing 110. Blue LED chips 30 and 32, and a fluorescent portion 44 made of a sheet-like molded body covering the plurality of first and second blue LED chips 30 and 32. The fluorescent part 44 can use the same transparent polymer material as that of the fluorescent part of the first embodiment. For example, the fluorescent part 44 includes a green fluorescent substance G and a red fluorescent substance R in a silicone resin, and includes a plurality of first, The second blue LEDs 30 and 32 emit white light. The first and second blue LED chips 30 and 32 have an emission peak wavelength (λp) in the range of 420 nm to 480 nm, and the emission peak wavelength (λp) of the first blue LED chip 30 is second. The blue LED chip 32 has a difference of 10 nm to 60 nm with respect to the emission peak wavelength (λp). The first blue LED 30 and the second blue LED 32 are basically GaN-based LED chips having the same structure. For example, an n-type GaN layer 301, a p-type GaN layer 302, a p-electrode 303, and an n-electrode 304 are formed on the substrate 102. have. Adjacent first and second blue LED chips 30 and 32 have a p-electrode 303 and an n-electrode 304 connected by an air bridge wiring L. Thus, by forming a plurality of blue LED chips monolithically and connecting them in series, the currents flowing through the blue LED chips are the same, and a flat emission spectrum can be obtained even if the band gap energy is high or low. The inside of the housing 110 is sealed by the resin molded body 24, and the first blue LED 30 and the second blue LED 32 are in the resin molded body 24. Therefore, in the lighting device 5, after the substrate 102 and the plurality of first and second blue LED chips 30 and 32 are disposed at the bottom of the housing 110, the resin is opened in the housing 110 and the opening 112 of the housing 110. To form a resin molded body 24, and further, a sheet-like fluorescent part 44 is installed in the opening 112.

第５の実施形態においては、２種類の発光ピーク波長（λｐ）を有する青色ＬＥＤチップを用いたが、照明装置などの要求によって用いる青色ＬＥＤチップの数、発光ピーク波長（λｐ）及びそれらの組合せを適宜設定することができる。例えば、発光ピーク波長（λｐ）が４３０ｎｍ、４５０ｎｍ、４７０ｎｍの３種類の青色ＬＥＤチップをそれぞれ複数個配置してもよい。また、蛍光部４４をシート状の成形体としたが、青色ＬＥＤチップの発光を漏れなく覆う形態であればよく、例えば開口部１１２を覆う蓋状の成形体であってもよく、あるいは樹脂成形体２４中に蛍光体を分散させて樹脂成形体２４そのものを蛍光部４４としてもよい。蛍光部４４には緑色蛍光体Ｇ及び赤色蛍光体Ｒが含まれたが、緑色蛍光体Ｇ及び赤色蛍光体Ｒに加えて黄色蛍光体Ｙを含んでもよい。いずれにしても、異なる発光ピーク波長（λｐ）を有する青色ＬＥＤチップを複数用いることで、複数の白色光を組み合わせて演色性がよく、かつ、色むらの無い白色光が得られる。   In the fifth embodiment, blue LED chips having two types of emission peak wavelengths (λp) are used. However, the number of blue LED chips, the emission peak wavelengths (λp), and combinations thereof used depending on the requirements of the lighting device or the like. Can be set as appropriate. For example, a plurality of three types of blue LED chips having emission peak wavelengths (λp) of 430 nm, 450 nm, and 470 nm may be arranged. Moreover, although the fluorescent part 44 was made into the sheet-like molded object, what is necessary is just the form which covers the light emission of a blue LED chip | tip without omission, for example, may be a lid-shaped molded object which covers the opening part 112, or resin molding The phosphor 24 may be dispersed in the body 24 and the resin molded body 24 itself may be used as the fluorescent portion 44. The fluorescent portion 44 includes the green phosphor G and the red phosphor R, but may include a yellow phosphor Y in addition to the green phosphor G and the red phosphor R. In any case, by using a plurality of blue LED chips having different emission peak wavelengths (λp), it is possible to obtain a white light with good color rendering and no color unevenness by combining a plurality of white lights.

６．第６の実施形態
図６に示すように、第６の実施形態にかかる照明装置６は、筐体１１０内の基台１００上に固定配置された３個の第１〜第３の青色ＬＥＤ１８ａ〜１８ｃを有する。３個の第１〜第３の青色ＬＥＤ１８ａ〜１８ｃは、それぞれ発光ピーク波長（λｐ）の異なる第１〜第３の青色ＬＥＤチップ３０、３２、３４を有し、それぞれの発光ピーク波長（λｐ）は４２０ｎｍ〜４８０ｎｍの範囲から適宜選択された異なるピーク波長である。また、いずれか１つの青色ＬＥＤチップの発光ピーク波長（λｐ）は、他の１つの青色ＬＥＤチップの発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有する。各青色ＬＥＤチップ３０、３２、３４がそれぞれ異なる発光ピーク波長（λｐ）を有していてもよいし、第１の青色ＬＥＤチップ３０が他の第２、第３の青色ＬＥＤチップ３２，４３に対して１０ｎｍ以上６０ｎｍ以下の差を有する発光ピーク波長（λｐ）を有していてもよい。基台１００に対向する筐体１１０の開口部１１２には、薄いシート状に形成された蛍光部４８が開口部１１２を覆うように固定されている。蛍光部４８には、黄色蛍光体Ｙと、緑色蛍光体Ｇと、赤色蛍光体Ｒと、が含まれる。蛍光部４８は、第１の実施形態で説明されたキャップ状の蛍光部と同じ材質を採用することができる。また、第６の実施形態においては、３つのＬＥＤを用いたが、照明装置などの要求によって用いるＬＥＤの数及び組合せを適宜設定することができる。
6). 6th Embodiment As shown in FIG. 6, the illuminating device 6 concerning 6th Embodiment is three 1st-3rd blue LED18a- fixedly arrange | positioned on the base 100 in the housing | casing 110-. 18c. The three first to third blue LEDs 18a to 18c have first to third blue LED chips 30, 32, and 34 having different emission peak wavelengths (λp), respectively, and the respective emission peak wavelengths (λp). Are different peak wavelengths appropriately selected from the range of 420 nm to 480 nm . Also, one of the emission peak wavelength of the blue LED chips (.lambda.p) has a difference of 60 nm or less than 10nm with respect to the emission peak wavelength of the other one blue LED chip (.lambda.p). Each blue LED chip 30, 32, 34 may have a different emission peak wavelength (λp), and the first blue LED chip 30 is connected to the other second and third blue LED chips 32, 43. On the other hand, it may have an emission peak wavelength (λp) having a difference of 10 nm to 60 nm. A fluorescent portion 48 formed in a thin sheet shape is fixed to the opening 112 of the housing 110 facing the base 100 so as to cover the opening 112. The fluorescent part 48 includes a yellow phosphor Y, a green phosphor G, and a red phosphor R. The fluorescent part 48 can employ the same material as the cap-shaped fluorescent part described in the first embodiment. Further, in the sixth embodiment, three LEDs are used. However, the number and combination of LEDs to be used can be set as appropriate according to a request from a lighting device or the like.

７．第７の実施形態
図７に示すように、第７の実施形態にかかる照明装置７は、基台１００上に固定配置された複数例えば２個の第１、第２の白色ＬＥＤ１０ｄ、１２ｄを有する。照明装置７の第１の白色ＬＥＤ１０ｄは、第１の青色ＬＥＤチップ３０が第１の蛍光部４０ｉを含む第１樹脂成形体２４ａ内に封入されている。また、照明装置７の第２の白色ＬＥＤ１２ｄは、第２の青色ＬＥＤチップ３２が第２の蛍光部４２ｉを含む第２樹脂成形体２４ｂ内に封入されている。より具体的には、ステム２２に形成された第１及び第２の青色ＬＥＤチップ３０、３２を設置する凹部２２０だけを覆うように第１及び第２の蛍光部４０ｉ、４２ｉが形成される。したがって、第７の実施形態は、蛍光体Ｙ（黄色）を含む第１の蛍光部４０ｉ及び蛍光体Ｇ（緑色）、Ｒ（赤色）を含む第２の蛍光部４２ｉを除けば第１の実施形態の照明装置１と同じである。 7). Seventh Embodiment As shown in FIG. 7, the illumination device 7 according to the seventh embodiment has a plurality of, for example, two first and second white LEDs 10d, 12d fixedly arranged on a base 100. . In the first white LED 10d of the illumination device 7, the first blue LED chip 30 is enclosed in the first resin molded body 24a including the first fluorescent part 40i. Further, the second white LED 12d of the lighting device 7 has the second blue LED chip 32 enclosed in the second resin molded body 24b including the second fluorescent part 42i. More specifically, the first and second fluorescent portions 40i and 42i are formed so as to cover only the concave portion 220 in which the first and second blue LED chips 30 and 32 are formed on the stem 22. Therefore, the seventh embodiment is the first implementation except for the first fluorescent part 40i including the phosphor Y (yellow) and the second fluorescent part 42i including the phosphors G (green) and R (red). It is the same as the illumination device 1 of the form.

第１及び第２の蛍光部４０ｉ，４２ｉは、第１及び第２の青色ＬＥＤチップ３０、３２からの光の放射を受ける領域に形成されていればよく、第１の実施形態のようなキャップ状の成形体や第２の実施形態のようなシート状の成形体などでもよく、本実施形態のような樹脂成形体中に配置されてもよい。   The first and second fluorescent portions 40i and 42i only need to be formed in regions that receive the radiation of light from the first and second blue LED chips 30 and 32, and the caps as in the first embodiment. It may be a sheet-like molded body, a sheet-like molded body as in the second embodiment, or the like, and may be disposed in a resin molded body as in this embodiment.

第１の実施形態〜第７の実施形態の照明装置の照明色は、平均演色評価数Ｒａが８５以上であるが、照明装置の用途などによって用いるＬＥＤチップの数や発光ピーク波長（λｐ）、蛍光体の種類や配合量、白色ＬＥＤの数やその組合せなどを適宜設定することによって、演色性が要求される用途に適した白色光を得ることができる。例えば、平均演色評価数Ｒａが９０以上の白色光を得ることもできるし、照明色がＪＩＳ Ｚ ９１１２に規定された昼光色、昼白色、白色、温白色または電球色とすることもできる。また、平均演色評価数Ｒａだけでなく、特殊演色評価数の内、例えばＲ９を８５以上とするように照明色を調整することもできる。   The illumination colors of the illumination devices according to the first to seventh embodiments have an average color rendering index Ra of 85 or more, but the number of LED chips and the emission peak wavelength (λp) used depending on the use of the illumination device, etc. By appropriately setting the type and blending amount of the phosphor, the number of white LEDs, and combinations thereof, white light suitable for applications requiring color rendering can be obtained. For example, white light having an average color rendering index Ra of 90 or more can be obtained, and the illumination color can be a daylight color, a daylight white color, a white color, a warm white color or a light bulb color as defined in JIS Z 9112. Further, not only the average color rendering index Ra, but also the illumination color can be adjusted so that, for example, R9 is 85 or more in the special color rendering index.

図８に示すような照明装置１ａを実施例１として試作し、平均演色評価数Ｒａ、色度座標、輝度分光スペクトル分布を分光放射輝度計６０で測定した。実施例１で試作した照明装置１ａの構成は、以下の通りであった。
第1の白色ＬＥＤ１０:第１の青色ＬＥＤチップ３０は、ＩｎＧａＮ系であって、発光ピーク波長（λｐ）がおよそ４７０ｎｍの日亜化学工業社製の青色ＬＥＤ「ＮＳＰＢ３１０Ａ（商品名）」を用いた。第1の蛍光部４０は、シリコーンゴム１００質量部に、黄色蛍光体Ｙとして無機蛍光体である（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕを２５質量部分散させ、加熱プレスして得られた厚さ０．５ｍｍの第1のキャップ状の成形体を用いた。
第２の白色ＬＥＤ１２：第２の青色ＬＥＤチップ３２は、ＡｌＩｎＧａＮ系であって、発光ピーク波長（λｐ）がおよそ４３０ｎｍのＪ ＲＥＰ Ｃｏｒｐｏｒａｔｉｏｎ社製の青色ＬＥＤ「ＳＳＬ-ＬＸ５０９３ＸＳＢＣ／Ｂ(商品名)」を用いた。第２の蛍光部４２は、キャップ状の成形体に換えて、シリコーンゴム１００質量部に、緑色蛍光体Ｇとして無機蛍光体であるＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ(根本特殊化学社製)を１５質量部と、赤色蛍光体Ｒとして無機蛍光体である３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ(根本特殊化学社製)を３５質量部と、を分散させ、加熱プレスして得られた厚さ０．５ｍｍの第２のキャップ状の成形体を用いた。
実施例１の照明装置１ａの分光放射輝度計６０による測定結果を表１に示した。 An illuminating device 1a as shown in FIG. 8 was prototyped as Example 1, and the average color rendering index Ra, chromaticity coordinates, and luminance spectral spectrum distribution were measured with a spectral radiance meter 60. The configuration of the lighting device 1a prototyped in Example 1 was as follows.
First white LED 10: The first blue LED chip 30 is an InGaN-based blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation having an emission peak wavelength (λp) of about 470 nm. . The first fluorescent part 40 is obtained by dispersing 25 parts by mass of inorganic phosphor (Ca, Sr, Ba) 2 SiO 4 : Eu as a yellow fluorescent substance Y in 100 parts by mass of silicone rubber, and heating and pressing. A first cap-shaped molded body having a thickness of 0.5 mm was used.
Second white LED 12: The second blue LED chip 32 is an AlInGaN-based blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by JREP Corporation having an emission peak wavelength (λp) of about 430 nm. Was used. The second fluorescent part 42 is replaced with 100 parts by mass of silicone rubber instead of a cap-shaped molded body, and BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.) which is an inorganic fluorescent substance as a green fluorescent substance G. ) And 35 parts by mass of 3.5MgO.0.5MgF 2 .GeO 2 : Mn (manufactured by Nemoto Special Chemical Co., Ltd.), which is an inorganic phosphor as red phosphor R, are heated and pressed. A second cap-shaped molded body having a thickness of 0.5 mm was used.
Table 1 shows the measurement results of the spectral radiance meter 60 of the illumination device 1a of Example 1.

Figure 0004989936
Figure 0004989936

第1の白色ＬＥＤ１０単体の測定結果は、平均演色評価数Ｒａが７３．２で色度座標がｘ=０．３３２、ｙ=０．３２０であった。この時の発光の分光スペクトル分布を図１０に波形Ａとして示した。第２の白色ＬＥＤ１２単体の測定結果は、平均演色評価数Ｒａが１３．３で色度座標がｘ=０．３３０、ｙ=０．３３６であった。この時の発光の分光スペクトル分布を図１１に波形Ｂとして示した。第１の白色ＬＥＤ１０を３個と、第２の白色ＬＥＤ１２を７個と、を組合せた照明装置１ａの分光スペクトル分布を図１２に波形Ｃで示した。また、この照明装置の平均演色評価数Ｒａは９３．３で色度座標がｘ=０．３３１、ｙ=０．３２３であった。第1の白色ＬＥＤ１０及び第２の白色ＬＥＤ１２はいずれも平均演色評価数Ｒａが高くないが、これらを最適に組み合わせることにより、平均演色評価数Ｒａは９３．３という極めて高い演色性を有する白色の照明装置１ａを得ることができた。 As a result of measurement of the first white LED 10 alone, the average color rendering index Ra was 73.2, and the chromaticity coordinates were x = 0.332 and y = 0.320. The spectral spectrum distribution of the light emission at this time is shown as a waveform A in FIG. The measurement results of the second white LED 12 alone were an average color rendering index Ra of 13.3, chromaticity coordinates of x = 0.330, and y = 0.336. The spectral spectrum distribution of light emission at this time is shown as a waveform B in FIG. The spectral spectrum distribution of the illuminating device 1a in which three first white LEDs 10 and seven second white LEDs 12 are combined is shown in FIG. The average color rendering index Ra of this lighting device was 93.3, and the chromaticity coordinates were x = 0.331 and y = 0.323. Neither the first white LED 10 nor the second white LED 12 has a high average color rendering index Ra, but by combining them optimally, the average color rendering index Ra is 93.3, which has a very high color rendering property of 93.3. The lighting device 1a could be obtained.

次に、図９に示すような照明装置６ａを実施例２〜６として試作し、平均演色評価数Ｒａ、色度座標、輝度分光スペクトル分布を分光放射輝度計６０で測定した。   Next, an illuminating device 6a as shown in FIG. 9 was prototyped as Examples 2 to 6, and the average color rendering index Ra, chromaticity coordinates, and luminance spectral spectrum distribution were measured with a spectral radiance meter 60.

実施例２で試作した照明装置６ａの構成は、以下の通りであった。
第１の青色ＬＥＤチップ３０は、発光ピーク波長（λｐ）がおよそ４７０ｎｍの日亜化学工業社製青色ＬＥＤ「ＮＳＰＢ３１０Ａ（商品名）」を用いた。第２の青色ＬＥＤチップ３２は、発光ピーク波長（λｐ）がおよそ４３０ｎｍのＪ ＲＥＰ Ｃｏｒｐｏｒａｔｉｏｎ製青色ＬＥＤ「ＳＳＬ−ＬＸ５０９３ＸＳＢＣ／Ｂ（商品名）」を用いた。蛍光部４８は、シリコーンゴム１００質量部に緑色蛍光体Ｇとして無機蛍光体であるＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ（根本特殊化学社製）を９質量部と、黄色蛍光体Ｙとして無機蛍光体である（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕを１１質量部と、赤色蛍光体Ｒとして無機蛍光体である３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ（根本特殊化学社製）を３０質量部と、を分散させ、加熱プレスして厚さ０．５ｍｍのシート状の成形体を得た。
実施例２の照明装置６ａの分光放射輝度計６０による測定結果を表２に示した。 The configuration of the illuminating device 6a prototyped in Example 2 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. Fluorescent portion 48, a silicone rubber 100 parts by weight of the green phosphor G as the inorganic phosphor at a BaMg 2 Al 16 O 27: Eu , Mn and (Nemoto Co., Ltd.) 9 parts by weight, the inorganic as a yellow phosphor Y 11 parts by mass of phosphor (Ca, Sr, Ba) 2 SiO 4 : Eu, and 3.5MgO · 0.5MgF 2 · GeO 2 : Mn (Nemoto Special Chemical Co., Ltd.) as an inorganic phosphor as red phosphor R 30 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 2.

Figure 0004989936
Figure 0004989936

実施例２の照明装置６ａは、平均演色評価数Ｒａが９４．３で色度座標がｘ＝０．３２４、ｙ＝０．３３１のＪＩＳ Ｚ ９１１２に規定された昼光色であった。 The illuminating device 6a of Example 2 was a daylight color defined in JIS Z 9112 having an average color rendering index Ra of 94.3 and chromaticity coordinates of x = 0.324 and y = 0.331.

実施例３で試作した照明装置６ａの構成は、以下の通りであった。
第１の青色ＬＥＤチップ３０は、発光ピーク波長（λｐ）がおよそ４７０ｎｍの日亜化学工業社製青色ＬＥＤ「ＮＳＰＢ３１０Ａ（商品名）」を用いた。第２の青色ＬＥＤチップ３２は、発光ピーク波長（λｐ）がおよそ４３０ｎｍのＪ ＲＥＰ Ｃｏｒｐｏｒａｔｉｏｎ製青色ＬＥＤ「ＳＳＬ−ＬＸ５０９３ＸＳＢＣ／Ｂ（商品名）」を用いた。蛍光部４８は、シリコーンゴム１００質量部に、緑色蛍光体Ｇとして無機蛍光体であるＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ（根本特殊化学社製）を９質量部と、黄色蛍光体Ｙとして無機蛍光体である（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕを１２質量部と、赤色蛍光体Ｒとして無機蛍光体である３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ（根本特殊化学社製）を３５質量部と、を分散させ、加熱プレスして厚さ０．５ｍｍのシート状の成形体を得た。
実施例３の照明装置６ａの分光放射輝度計６０による測定結果を表２に示した。
実施例３の照明装置６ａは、平均演色評価数Ｒａが９５．８で色度座標がｘ＝０．３５４、ｙ＝０．３５８のＪＩＳ Ｚ ９１１２に規定された昼白色であった。また、実施例３の照明装置６ａは、特殊演色評価数Ｒ９が８７．５であった。 The configuration of the illuminating device 6a prototyped in Example 3 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is composed of 100 parts by mass of silicone rubber, 9 parts by mass of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.) which is an inorganic fluorescent substance as a green fluorescent substance G, and a yellow fluorescent substance Y. 12 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as a red phosphor R (root special chemistry) 35 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 3.
The illuminating device 6a of Example 3 was day white as defined in JIS Z 9112 having an average color rendering index Ra of 95.8 and chromaticity coordinates of x = 0.354 and y = 0.358. In addition, in the lighting device 6a of Example 3, the special color rendering index R9 was 87.5.

実施例４で試作した照明装置６ａの構成は、以下の通りであった。
第１の青色ＬＥＤチップ３０は、発光ピーク波長（λｐ）がおよそ４７０ｎｍの日亜化学工業社製青色ＬＥＤ「ＮＳＰＢ３１０Ａ（商品名）」を用いた。第２の青色ＬＥＤチップ３２は、発光ピーク波長（λｐ）がおよそ４３０ｎｍのＪ ＲＥＰ Ｃｏｒｐｏｒａｔｉｏｎ製青色ＬＥＤ「ＳＳＬ−ＬＸ５０９３ＸＳＢＣ／Ｂ（商品名）」を用いた。蛍光部４８は、シリコーンゴム１００質量部に、緑色蛍光体Ｇとして無機蛍光体であるＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ（根本特殊化学社製）を１０質量部と、黄色蛍光体Ｙとして無機蛍光体である（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕを１２質量部と、赤色蛍光体Ｒとして無機蛍光体である３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ（根本特殊化学社製）を４０質量部と、を分散させ、加熱プレスして厚さ０．５ｍｍのシート状の成形体を得た。
実施例４の照明装置６ａの分光放射輝度計６０による測定結果を表２に示した。
実施例４の照明装置６ａは、平均演色評価数Ｒａが９５．０で色度座標がｘ＝０．３７２、ｙ＝０．３７８のＪＩＳ Ｚ ９１１２に規定された白色であった。また、実施例４の照明装置６ａは、特殊演色評価数Ｒ９が８５．１であった。 The configuration of the illuminating device 6a prototyped in Example 4 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is 10 parts by weight of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.), which is an inorganic fluorescent substance, as a green fluorescent substance G, and 100 parts by weight of silicone rubber. 12 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as a red phosphor R (root special chemistry) 40 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 4.
The illumination device 6a of Example 4 was white as defined in JIS Z 9112 having an average color rendering index Ra of 95.0 and chromaticity coordinates of x = 0.372 and y = 0.378. In addition, the lighting device 6a of Example 4 had a special color rendering index R9 of 85.1.

実施例５で試作した照明装置６ａの構成は、以下の通りであった。
第１の青色ＬＥＤチップ３０は、発光ピーク波長（λｐ）がおよそ４７０ｎｍの日亜化学工業社製青色ＬＥＤ「ＮＳＰＢ３１０Ａ（商品名）」を用いた。第２の青色ＬＥＤチップ３２は、発光ピーク波長（λｐ）がおよそ４３０ｎｍのＪ ＲＥＰ Ｃｏｒｐｏｒａｔｉｏｎ製青色ＬＥＤ「ＳＳＬ−ＬＸ５０９３ＸＳＢＣ／Ｂ（商品名）」を用いた。蛍光部４８は、シリコーンゴム１００質量部に、緑色蛍光体Ｇとして無機蛍光体であるＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ（根本特殊化学社製）を１０質量部と、黄色蛍光体Ｙとして無機蛍光体である（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕを１５質量部と、赤色蛍光体Ｒとして無機蛍光体である３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ（根本特殊化学社製）を５０質量部と、を分散させ、加熱プレスして厚さ０．５ｍｍのシート状の成形体を得た。
実施例５の照明装置６ａの分光放射輝度計６０による測定結果を表２に示した。
実施例５の照明装置６ａは、平均演色評価数Ｒａが９２．０で色度座標がｘ＝０．４０４、ｙ＝０．４０４のＪＩＳ Ｚ ９１１２に規定された温白色であった。また、実施例５の照明装置６ａは、特殊演色評価数Ｒ９が８５．５であった。 The configuration of the illuminating device 6a prototyped in Example 5 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is 10 parts by weight of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.), which is an inorganic fluorescent substance, as a green fluorescent substance G, and 100 parts by weight of silicone rubber. 15 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5 MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as red phosphor R 50 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 5.
The lighting device 6a of Example 5 was warm white as defined in JIS Z 9112 having an average color rendering index Ra of 92.0 and chromaticity coordinates of x = 0.404 and y = 0.404. In addition, the lighting device 6a of Example 5 had a special color rendering index R9 of 85.5.

実施例６で試作した照明装置６ａの構成は、以下の通りであった。
第１の青色ＬＥＤチップ３０は、発光ピーク波長（λｐ）がおよそ４７０ｎｍの日亜化学工業社製青色ＬＥＤ「ＮＳＰＢ３１０Ａ（商品名）」を用いた。第２の青色ＬＥＤチップ３２は、発光ピーク波長（λｐ）がおよそ４３０ｎｍのＪ ＲＥＰ Ｃｏｒｐｏｒａｔｉｏｎ製青色ＬＥＤ「ＳＳＬ−ＬＸ５０９３ＸＳＢＣ／Ｂ（商品名）」を用いた。蛍光部４８は、シリコーンゴム１００質量部に、緑色蛍光体Ｇとして無機蛍光体であるＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ（根本特殊化学社製）を１２質量部と、黄色蛍光体Ｙとして無機蛍光体である（Ｃａ，Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕを１７質量部と、赤色蛍光体Ｒとして無機蛍光体である３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ（根本特殊化学社製）を７０質量部と、を分散させ、加熱プレスして厚さ０．５ｍｍのシート状の成形体を得た。
実施例６の照明装置６ａの分光放射輝度計６０による測定結果を表２に示した。
実施例６の照明装置６ａは、平均演色評価数Ｒａが９０．０であり、色度座標がｘ＝０．４１５、ｙ＝０．４０８のＪＩＳ Ｚ ９１１２に規定された電球色であった。 The configuration of the illuminating device 6a prototyped in Example 6 was as follows.
As the first blue LED chip 30, a blue LED “NSPB310A (trade name)” manufactured by Nichia Corporation with an emission peak wavelength (λp) of about 470 nm was used. As the second blue LED chip 32, a blue LED “SSL-LX5093XSBC / B (trade name)” manufactured by J REP Corporation having an emission peak wavelength (λp) of about 430 nm was used. The fluorescent part 48 is composed of 100 parts by weight of silicone rubber, 12 parts by weight of BaMg 2 Al 16 O 27 : Eu, Mn (manufactured by Nemoto Special Chemical Co., Ltd.) that is an inorganic fluorescent substance as a green fluorescent substance G, and a yellow fluorescent substance Y. 17 parts by mass of (Ca, Sr, Ba) 2 SiO 4 : Eu, which is an inorganic phosphor, and 3.5 MgO · 0.5MgF 2 · GeO 2 : Mn, which is an inorganic phosphor as red phosphor R 70 parts by mass) was dispersed and heated and pressed to obtain a sheet-like molded body having a thickness of 0.5 mm.
Table 2 shows the measurement results obtained by the spectral radiance meter 60 of the illumination device 6a of Example 6.
The lighting device 6a of Example 6 had a light bulb color defined in JIS Z 9112 having an average color rendering index Ra of 90.0, and chromaticity coordinates of x = 0.415 and y = 0.408.

実施例２〜６の照明装置６ａによれば、ＪＩＳ Ｚ ９１１２に規定された一般照明の蛍光ランプの光源色に色調が調整されるとともに、それぞれの色調において平均演色評価数Ｒａが９０以上の高い演色性を実現した。また、実施例１においては平均演色評価数Ｒａが最大になるように複数の白色ＬＥＤを組み合わせたが、実施例３〜５のように各蛍光体の配合量を調整することで特殊演色評価数Ｒ９を８５以上とすることができた。   According to the illuminating devices 6a of Examples 2 to 6, the color tone is adjusted to the light source color of the fluorescent lamp for general illumination specified in JIS Z 9112, and the average color rendering index Ra is 90 or higher for each color tone. Realized color rendering. In Example 1, a plurality of white LEDs were combined so that the average color rendering index Ra was maximized, but the special color rendering index was adjusted by adjusting the blending amount of each phosphor as in Examples 3-5. R9 could be 85 or more.

第１の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 1st Embodiment. 第２の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 2nd Embodiment. 第３の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 3rd Embodiment. 第４の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 4th Embodiment. 第５の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 5th Embodiment. 第６の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 6th Embodiment. 第６の実施形態である照明装置を模式的に示す部分縦断面図である。It is a fragmentary longitudinal cross-sectional view which shows typically the illuminating device which is 6th Embodiment. 実施例１で試作した照明装置の測定方法を示す図である。It is a figure which shows the measuring method of the illuminating device made as an experiment in Example 1. FIG. 実施例２〜６で試作した照明装置の測定方法を示す図である。It is a figure which shows the measuring method of the illuminating device made as an experiment in Examples 2-6. 実施例１の第１の白色ＬＥＤによる発光の分光スペクトル分布を示す図である。FIG. 3 is a diagram showing a spectral spectrum distribution of light emission by the first white LED of Example 1. 実施例１の第２の白色ＬＥＤによる発光の分光スペクトル分布を示す図である。FIG. 3 is a diagram showing a spectral spectrum distribution of light emission by the second white LED of Example 1. 実施例１の照明装置による発光の分光スペクトル分布を示す図である。It is a figure which shows the spectral spectrum distribution of light emission by the illuminating device of Example 1. FIG.

符号の説明Explanation of symbols

１、１ａ、２、３、４、５、６、６ａ、７ 照明装置
１０、１０ａ〜１０ｄ 第１の白色ＬＥＤ
１２、１２ａ〜１２ｄ 第２の白色ＬＥＤ
１８ａ，１８ｂ，１８ｃ 青色ＬＥＤ
２０ ベース部材
２２ ステム
２４ 樹脂成形体
３０、３２、３４ 青色ＬＥＤチップ
４０、４２、４３、４４、４６、４８ 蛍光部
４０ａ、４２ａ、４３ａ 蛍光部
４０ｂ 蛍光部
４０ｓ、４２ｓ、４０ｉ、４２ｉ 蛍光部
１００ 基台
１０２ 基板
１１０ 筐体
１１２ 開口部
２２０ 凹部
３０１ ｎ型ＧａＮ層
３０２ ｐ型ＧａＮ層
３０３ ｐ電極
３０４ ｎ電極
Ｙ 黄色蛍光体
Ｇ 緑色蛍光体
Ｒ 赤色蛍光体
Ｌ エアブリッジ配線 1, 1a, 2, 3, 4, 5, 6, 6a, 7 Lighting device 10, 10a to 10d First white LED
12, 12a to 12d Second white LED
18a, 18b, 18c Blue LED
20 Base member 22 Stem 24 Resin molded body 30, 32, 34 Blue LED chips 40, 42, 43, 44, 46, 48 Fluorescent part 40a, 42a, 43a Fluorescent part 40b Fluorescent part 40s, 42s, 40i, 42i Fluorescent part 100 Base 102 Substrate 110 Housing 112 Opening 220 Recess 301 N-type GaN layer 302 p-type GaN layer 303 p-electrode 304 n-electrode Y Yellow phosphor G Green phosphor R Red phosphor L Air bridge wiring

Claims (17)

４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する複数の青色ＬＥＤチップと、
前記青色ＬＥＤチップの光を吸収して発光する蛍光体を含む蛍光部と、
を有し、
前記複数の青色ＬＥＤチップは、
第１の発光ピーク波長（λｐ）を有する第１の青色ＬＥＤチップと、
第２の発光ピーク波長（λｐ）を有する第２の青色ＬＥＤチップと、
を含み、
前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有し、
前記蛍光部は、緑色蛍光体及び赤色蛍光体を含み、少なくとも前記第１の青色ＬＥＤチップ及び前記第２の青色ＬＥＤチップのいずれか一方の光を吸収して発光し、
照明色の平均演色評価数Ｒａが８５以上である照明装置。 A plurality of blue LED chips having an emission peak wavelength (λp) in the range of 420 nm to 480 nm;
A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
Have
The plurality of blue LED chips are:
A first blue LED chip having a first emission peak wavelength (λp);
A second blue LED chip having a second emission peak wavelength (λp);
Including
The first emission peak wavelength (λp) has a difference of 10 nm or more and 60 nm or less with respect to the second emission peak wavelength (λp),
The fluorescent part includes a green phosphor and a red phosphor, absorbs light of at least one of the first blue LED chip and the second blue LED chip, and emits light.
An illumination device having an average color rendering index Ra of 85 or more for illumination colors. 請求項１において、
前記照明色の平均演色評価数Ｒａが９０以上である照明装置。 In claim 1,
An illumination device having an average color rendering index Ra of 90 or more for the illumination color. 請求項１または２において、
前記蛍光部は、黄色蛍光体をさらに含む照明装置。 In claim 1 or 2,
The illuminator further includes a yellow phosphor. ４２０ｎｍ〜４８０ｎｍの範囲に発光ピーク波長（λｐ）を有する青色ＬＥＤチップと、
前記青色ＬＥＤチップの光を吸収して発光する蛍光体を含む蛍光部と、
を有する白色ＬＥＤを複数有し、
前記複数の白色ＬＥＤは、
前記第１の発光ピーク波長（λｐ）の第１の青色ＬＥＤチップを有する第1の白色ＬＥＤと、
前記第２の発光ピーク波長（λｐ）の第２の青色ＬＥＤチップを有する第２の白色ＬＥＤと、
を含み、
前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）に対し１０ｎｍ以上６０ｎｍ以下の差を有し、
前記第１の白色ＬＥＤ及び前記第２の白色ＬＥＤの少なくとも一方の蛍光部は、緑色蛍光体及び赤色蛍光体を含み、該蛍光部を有する白色ＬＥＤにおける青色ＬＥＤチップの光を吸収して発光し、
照明色の平均演色評価数Ｒａが８５以上である照明装置。 A blue LED chip having an emission peak wavelength (λp) in the range of 420 nm to 480 nm;
A fluorescent part including a phosphor that absorbs and emits light from the blue LED chip;
A plurality of white LEDs having
The plurality of white LEDs are:
A first white LED having a first blue LED chip of the first emission peak wavelength (λp);
A second white LED having a second blue LED chip of the second emission peak wavelength (λp);
Including
The first emission peak wavelength (λp) has a difference of 10 nm or more and 60 nm or less with respect to the second emission peak wavelength (λp),
At least one fluorescent part of the first white LED and the second white LED includes a green fluorescent substance and a red fluorescent substance, and emits light by absorbing light of a blue LED chip in the white LED having the fluorescent part. ,
An illumination device having an average color rendering index Ra of 85 or more for illumination colors. 請求項４において、
前記照明色の平均演色評価数Ｒａが９０以上である照明装置。 In claim 4,
An illumination device having an average color rendering index Ra of 90 or more for the illumination color. 請求項４または５において、
前記第１の白色ＬＥＤは、黄色蛍光体を含む第１の蛍光部を有し、
前記第２の白色ＬＥＤは、緑色蛍光体と、赤色蛍光体と、を含む第２の蛍光部を有する照明装置。 In claim 4 or 5,
The first white LED has a first fluorescent part including a yellow phosphor,
The second white LED is a lighting device having a second fluorescent part including a green phosphor and a red phosphor. 請求項４〜６のいずれかにおいて、
前記第１の発光ピーク波長（λｐ）は、前記第２の発光ピーク波長（λｐ）よりも長波長である照明装置。 In any one of Claims 4-6,
The lighting device in which the first emission peak wavelength (λp) is longer than the second emission peak wavelength (λp). 請求項４または５において、
前記第１の白色ＬＥＤは、緑色蛍光体と、赤色蛍光体と、を含む第１の蛍光部を有し、
前記第２の白色ＬＥＤは、緑色蛍光体と、赤色蛍光体と、を含む第２の蛍光部を有する照明装置。 In claim 4 or 5,
The first white LED has a first fluorescent part including a green phosphor and a red phosphor,
The second white LED is a lighting device having a second fluorescent part including a green phosphor and a red phosphor. 請求項４または５において、
前記第１の白色ＬＥＤは、黄色蛍光体と、緑色蛍光体と、赤色蛍光体と、を含む第１の蛍光部を有し、
前記第２の白色ＬＥＤは、黄色蛍光体と、緑色蛍光体と、赤色蛍光体と、を含む第２の蛍光部を有する照明装置。 In claim 4 or 5,
The first white LED has a first fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor,
The second white LED is an illumination device having a second fluorescent part including a yellow phosphor, a green phosphor, and a red phosphor. 請求項６〜９のいずれかにおいて、
前記第１の青色ＬＥＤチップは、第１の樹脂成形体内に封入され、
前記第２の青色ＬＥＤチップは、第２の樹脂成形体内に封入され、
前記第１の蛍光部及び前記第２の蛍光部は、前記第１の樹脂成形体及び前記第２の樹脂成形体の外側に被せられたキャップ状の成形体である照明装置。 In any one of Claims 6-9,
The first blue LED chip is enclosed in a first resin molded body,
The second blue LED chip is enclosed in a second resin molded body,
The first fluorescent part and the second fluorescent part are lighting devices that are cap-shaped molded bodies placed on the outer sides of the first resin molded body and the second resin molded body. 請求項６〜９のいずれかにおいて、
前記第１の蛍光部は、前記第１の青色ＬＥＤチップを覆うシート状の成形体であり、
前記第２の蛍光部は、前記第２の青色ＬＥＤチップを覆うシート状の成形体である照明装置。 In any one of Claims 6-9,
The first fluorescent part is a sheet-like molded body that covers the first blue LED chip,
The second fluorescent section is a lighting device that is a sheet-like molded body that covers the second blue LED chip. 請求項６〜９のいずれかにおいて、
前記第１の青色ＬＥＤチップは、前記第１の蛍光部を含む第１の樹脂成形体内に封入され、
前記第２の青色ＬＥＤチップは、前記第２の蛍光部を含む第２の樹脂成形体内に封入される照明装置。 In any one of Claims 6-9,
The first blue LED chip is enclosed in a first resin molded body including the first fluorescent part,
The lighting device in which the second blue LED chip is enclosed in a second resin molded body including the second fluorescent part. 請求項１〜１２のいずれかにおいて、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３２７４，０．３６７３）、（０．３２８２，０．３２９７）、(０．２９９８，０．３３９６)、（０．３０６４，０．３０９１）の４点を結ぶ四辺形内の昼光色の色調である照明装置。 In any one of Claims 1-12,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3274, 0.3673), (0.3282, 0.3297), (0.2998, 0.3396), An illumination device having a daylight color tone in a quadrilateral connecting four points (0.3064, 0.3091). 請求項１〜１２のいずれかにおいて、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３６１６，０．３８７５）、（０．３５５２，０．３４７６）、(０．３３５３，０．３６５９)、（０．３３４５，０．３３１４）の４点を結ぶ四辺形内の昼白色の色調である照明装置。 In any one of Claims 1-12,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3616, 0.3875), (0.3552, 0.3476), (0.3353, 0.3659), An illuminating device having a neutral white tone in a quadrilateral connecting four points (0.3345, 0.3314). 請求項１〜１２のいずれかにおいて、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．３９３８，０．４０９７）、（０．３８０５，０．３６４２）、(０．３６５６，０．３９０５)、（０．３５８４，０．３４９９）の４点を結ぶ四辺形内の白色の色調である照明装置。 In any one of Claims 1-12,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.3938, 0.4097), (0.3805, 0.3642), (0.3656, 0.3905), An illumination device having a white color tone in a quadrilateral connecting four points (0.3584, 0.3499). 請求項１〜１２のいずれかにおいて、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．４３４１，０．４２３３）、（０．４１７１，０．３８４６）、(０．４０２１，０．４０７６)、（０．３９０３，０．３７１９）の４点を結ぶ四辺形内の温白色の色調である照明装置。 In any one of Claims 1-12,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4341, 0.4233), (0.4171, 0.3846), (0.4021, 0.4076), An illumination device having a warm white color tone in a quadrilateral connecting four points (0.3903, 0.3719). 請求項１〜１２のいずれかにおいて、
前記照明装置の照明色は、ｘｙ色度図上における（ｘ、ｙ）が（０．４７７５，０．４２８３）、（０．４５９４，０．３９７１）、(０．４３４８，０．４１８５)、（０．４２１４，０．３８８７）の４点を結ぶ四辺形内の電球色の色調である照明装置。 In any one of Claims 1-12,
The illumination color of the illumination device is such that (x, y) on the xy chromaticity diagram is (0.4775, 0.4283), (0.4594, 0.3971), (0.4348, 0.4185), An illuminating device having a light bulb color tone in a quadrilateral connecting four points (0.4214, 0.3887).
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