JP4985571B2 - 電子部品およびその製造方法 - Google Patents
電子部品およびその製造方法 Download PDFInfo
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- JP4985571B2 JP4985571B2 JP2008179839A JP2008179839A JP4985571B2 JP 4985571 B2 JP4985571 B2 JP 4985571B2 JP 2008179839 A JP2008179839 A JP 2008179839A JP 2008179839 A JP2008179839 A JP 2008179839A JP 4985571 B2 JP4985571 B2 JP 4985571B2
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- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
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- 238000005452 bending Methods 0.000 description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 229920000128 polypyrrole Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 239000011104 metalized film Substances 0.000 description 3
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- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
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- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
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- 238000007740 vapor deposition Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
以下、実施の形態1を用いて、本発明の特に請求項1〜4、7〜10に記載の発明について説明する。
以下、実施の形態2を用いて、本発明の特に請求項5、6に記載の発明について説明する。
11a、31a 端面
11b、31b 端面
12、32 正極集電体
13、33 負極集電体
12a、13a、32a、33a 集電部
12b、13b、32b、33b 端子部
12c、13c 端子先端部
12d、13d 突出部
12e、13e 立ち上げ部
14、34 外装体
14a、14b、14c、14d、34a、34b、34c、34d 角部
14e 凹部
15 陽極箔
16 陰極箔
17 セパレータ
18 溝部
18a 突起部
19 面取り部
20 搬送用基材
24 仮想方形体
24a、24b、24c、24d 角部
25 容器
26 電解質形成用溶液
Claims (10)
- 正負の電極を両端面から夫々取り出すように形成された巻回形の素子と、一端に設けた集電部が上記素子の一方の端面に接合されると共に、他端に外部接続用の端子部が設けられた正極集電体と、この正極集電体と同様に形成され、集電部が上記素子の他方の端面に接合された負極集電体と、上記正極集電体ならびに負極集電体に夫々設けられた端子部の少なくとも一部が外部に露呈する状態で上記素子ならびに正極集電体、負極集電体を一体に被覆して方形に形成された外装体からなり、上記正極集電体ならびに負極集電体に設けられた端子部が上記方形に形成された外装体の隣り合う角部に夫々配設された電子部品。
- 正極集電体ならびに負極集電体に設けられた各集電部が、素子の両端面に非対称になるように位置をずらして接合された請求項1に記載の電子部品。
- 正極集電体ならびに負極集電体に設けられた端子部の先端が夫々外装体の同一面から表出し、かつ、同一方向に向かうように構成された請求項1に記載の電子部品。
- 外装体の同一面から夫々表出した端子部の先端どうしを結ぶ線が、外装体に被覆された素子の両端面と略平行になるようにした請求項1に記載の電子部品。
- 外装体から表出した端子部を外装体の表面に沿って折り曲げた請求項1に記載の電子部品。
- 正極集電体ならびに負極集電体に設けられた夫々の端子部が配設された隣り合う角部を除く外装体の角部の少なくとも一つに面取り部を設けた請求項1に記載の電子部品。
- 正負の電極を両端面から夫々取り出すように形成された巻回形の素子が、陽極箔と陰極箔をその間にセパレータを介在させた状態で巻回すると共に、上記セパレータに電解質を保持させることにより形成されたものである請求項1に記載の電子部品。
- 正負の電極を両端面から夫々取り出すようにした巻回形の素子を作製する工程と、一端に集電部が、他端に外部接続用の端子部が設けられた正極集電体と、同様に形成された負極集電体の上記夫々の端子部が同一方向に向かうようにして上記正極集電体ならびに負極集電体に設けられた各集電部を上記素子の両端面に夫々接合する工程と、この素子に接合された正極集電体ならびに負極集電体に設けられた夫々の端子部を保持した状態で素子を電解質形成用溶液に浸漬して正負電極間に電解質を形成する工程と、この電解質が形成された素子の上記正極集電体ならびに負極集電体に夫々設けられた端子部の少なくとも一部が外部に露呈する状態で上記素子ならびに正極集電体、負極集電体を一体に被覆する方形の外装体を作製する工程とを有し、この方形に形成された外装体の隣り合う角部に上記正極集電体ならびに負極集電体に設けられた端子部が夫々配設されると共に、この端子部の先端が外装体の同一面から夫々表出し、かつ、同一方向に向かうようにした電子部品を作製する電子部品の製造方法。
- 正負電極間に電解質を形成する工程で用いる電解質形成用溶液が、重合性モノマーと酸化剤溶液を少なくとも含むものである請求項8に記載の電子部品の製造方法。
- 正負電極間に電解質を形成する工程で用いる電解質形成用溶液が、駆動用電解液を含むものである請求項8に記載の電子部品の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008179839A JP4985571B2 (ja) | 2008-07-10 | 2008-07-10 | 電子部品およびその製造方法 |
US12/498,572 US8130486B2 (en) | 2008-07-10 | 2009-07-07 | Electronic component and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008179839A JP4985571B2 (ja) | 2008-07-10 | 2008-07-10 | 電子部品およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010021316A JP2010021316A (ja) | 2010-01-28 |
JP4985571B2 true JP4985571B2 (ja) | 2012-07-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008179839A Active JP4985571B2 (ja) | 2008-07-10 | 2008-07-10 | 電子部品およびその製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4985571B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9991498B2 (en) * | 2013-09-09 | 2018-06-05 | Samsung Electronics Co., Ltd. | Electrode assembly and secondary battery including the same |
DE102017203106A1 (de) * | 2017-02-27 | 2018-08-30 | Bayerische Motoren Werke Aktiengesellschaft | Kondensator mit mehreren Kondensatoreinheiten |
JP6640772B2 (ja) * | 2017-03-01 | 2020-02-05 | 株式会社指月電機製作所 | コンデンサ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0636561Y2 (ja) * | 1989-08-28 | 1994-09-21 | 松下電器産業株式会社 | 固定抵抗器 |
JPH0645178A (ja) * | 1992-07-24 | 1994-02-18 | Nissei Denki Kk | 電子部品 |
JP2000114115A (ja) * | 1998-09-30 | 2000-04-21 | Nippon Chemicon Corp | 電解コンデンサ |
-
2008
- 2008-07-10 JP JP2008179839A patent/JP4985571B2/ja active Active
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JP2010021316A (ja) | 2010-01-28 |
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