JP4971404B2 - 有機発光表示装置 - Google Patents
有機発光表示装置 Download PDFInfo
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- JP4971404B2 JP4971404B2 JP2009223002A JP2009223002A JP4971404B2 JP 4971404 B2 JP4971404 B2 JP 4971404B2 JP 2009223002 A JP2009223002 A JP 2009223002A JP 2009223002 A JP2009223002 A JP 2009223002A JP 4971404 B2 JP4971404 B2 JP 4971404B2
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- organic light
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- 239000010408 film Substances 0.000 claims description 129
- 238000007789 sealing Methods 0.000 claims description 42
- 239000010409 thin film Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 23
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- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 5
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- 239000000945 filler Substances 0.000 claims 1
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- 239000004065 semiconductor Substances 0.000 description 12
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 229910004205 SiNX Inorganic materials 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005281 excited state Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- WMAXWOOEPJQXEB-UHFFFAOYSA-N 2-phenyl-5-(4-phenylphenyl)-1,3,4-oxadiazole Chemical compound C1=CC=CC=C1C1=NN=C(C=2C=CC(=CC=2)C=2C=CC=CC=2)O1 WMAXWOOEPJQXEB-UHFFFAOYSA-N 0.000 description 2
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 description 2
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- IIDFEIDMIKSJSV-UHFFFAOYSA-N dipropoxyphosphinothioyloxy-dipropoxy-sulfanylidene-$l^{5}-phosphane Chemical compound CCCOP(=S)(OCCC)OP(=S)(OCCC)OCCC IIDFEIDMIKSJSV-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 polyphenylene Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13069—Thin film transistor [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
10 スイッチング薄膜トランジスター
20 駆動薄膜トランジスター
70 有機発光素子(OLED)
80 蓄電素子
110 表示基板
111 基板部材
120 バッファー層
131 スイッチング半導体層
132 駆動半導体層
135 チャンネル領域
136 ソース領域
137 ドレイン領域
140 ゲート絶縁膜
151 ゲートライン
152 スイッチングゲート電極
155 駆動ゲート電極
158、178 蓄電板
160 層間絶縁膜
171 データライン
172 共通電源ライン
173 スイッチングソース電極
174 スイッチングドレイン電極
176 駆動ソース電極
177 駆動ドレイン電極
180 平坦化膜
182 接触孔
190 画素定義膜
210 封止部材
250 充填層
330 カバー層
500 カバーウィンドウ
710 画素電極
720 有機発光層
730 共通電極
Claims (6)
- 基板部材と、
ゲート電極、ソース電極、及びドレイン電極を有し、前記基板部材上に形成された薄膜トランジスターと、
前記ドレイン電極の一部を露出する接触孔を有して前記薄膜トランジスターの上に形成された平坦化膜と、
前記平坦化膜上に形成され、前記接触孔を通して前記薄膜トランジスターのドレイン電極と接続される画素電極と、
前記画素電極を露出する開口部を有して前記平坦化膜上に形成された有色の画素定義膜と、
前記画素電極及び前記画素定義膜上に形成され、前記画素定義膜と互いに異なる色相を有する有色物とを含み、
前記画素定義膜が有する色相と前記有色物が有する色相は互いに混合されると各々の色相より明度が低くなり、
前記画素定義膜が有する色相と前記有色物が有する色相は減算混合で互いに補色関係である
ことを特徴とする有機発光表示装置。 - 前記画素電極上に形成された有機発光層と、前記有機発光層上に形成された共通電極と、前記共通電極の直上に形成されて前記有機発光層及び共通電極を保護するカバー層をさらに含み、
前記有色物は前記カバー層である
ことを特徴とする請求項1に記載の有機発光表示装置。 - 前記画素電極及び前記画素定義膜を間において前記基板部材と合着して封止する封止部材をさらに含み、
前記有色物は前記封止部材である
ことを特徴とする請求項1に記載の有機発光表示装置。 - 前記画素電極上に形成された有機発光層と、前記有機発光層上に形成された共通電極と、前記共通電極を間において前記基板部材と合着して封止する封止部材と、前記封止部材と前記共通電極の間に配置された充填層をさらに含み、
前記有色物は前記充填層である
ことを特徴とする請求項1に記載の有機発光表示装置。 - 前記画素電極及び前記画素定義膜を間において前記基板部材と合着して封止する封止部材と、前記封止部材上に形成されたカバーウィンドウをさらに含み、
前記有色物はカバーウィンドウである
ことを特徴とする請求項1に記載の有機発光表示装置。 - 前記ゲート電極、前記ソース電極、及び前記ドレイン電極の中の一つ以上の電極と同じ素材で同じ工程によって形成された導電膜をさらに含み、
前記導電膜の少なくとも一部は前記画素定義膜の下に配置された
ことを特徴とする請求項1に記載の有機発光表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090001162A KR100989135B1 (ko) | 2009-01-07 | 2009-01-07 | 유기 발광 표시 장치 |
KR10-2009-0001162 | 2009-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010161058A JP2010161058A (ja) | 2010-07-22 |
JP4971404B2 true JP4971404B2 (ja) | 2012-07-11 |
Family
ID=42200946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009223002A Active JP4971404B2 (ja) | 2009-01-07 | 2009-09-28 | 有機発光表示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8253128B2 (ja) |
EP (1) | EP2207207B1 (ja) |
JP (1) | JP4971404B2 (ja) |
KR (1) | KR100989135B1 (ja) |
CN (1) | CN101783359B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5173871B2 (ja) * | 2009-01-29 | 2013-04-03 | エルジー ディスプレイ カンパニー リミテッド | 有機elディスプレイ |
KR101811341B1 (ko) * | 2010-12-09 | 2017-12-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP5725337B2 (ja) * | 2011-03-24 | 2015-05-27 | ソニー株式会社 | 表示装置、表示装置の製造方法および電子機器 |
KR101851679B1 (ko) * | 2011-12-19 | 2018-04-25 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치와, 이의 제조 방법 |
GB2498072B (en) * | 2011-12-21 | 2015-03-18 | Lg Display Co Ltd | Display device and method for manufacturing of the same |
US9016894B2 (en) | 2012-03-09 | 2015-04-28 | General Electric Company | Color mixing using the reflective properties of OLEDs |
CN102916036B (zh) * | 2012-10-12 | 2015-05-13 | 京东方科技集团股份有限公司 | 一种有源矩阵有机电致发光显示器件及显示装置 |
CN102916037B (zh) * | 2012-10-12 | 2015-02-25 | 京东方科技集团股份有限公司 | 一种有源矩阵有机电致发光显示器件及显示装置 |
KR102021027B1 (ko) * | 2013-02-28 | 2019-09-16 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
JP6429465B2 (ja) * | 2013-03-07 | 2018-11-28 | 株式会社半導体エネルギー研究所 | 装置及びその作製方法 |
KR102181238B1 (ko) | 2014-02-12 | 2020-11-23 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
TWI581436B (zh) * | 2014-06-16 | 2017-05-01 | 元太科技工業股份有限公司 | 基板結構及其製作方法 |
KR102343768B1 (ko) * | 2014-08-14 | 2021-12-24 | 에스케이넥실리스 주식회사 | 배리어 필름 구조체 및 이를 구비하는 유기전자소자 |
CN104795429B (zh) * | 2015-04-13 | 2017-09-01 | 深圳市华星光电技术有限公司 | Oled显示器件 |
US9818343B2 (en) * | 2015-04-30 | 2017-11-14 | Samsung Display Co., Ltd. | Organic light emitting diode display and method for repairing the same |
KR102516053B1 (ko) * | 2015-10-22 | 2023-03-31 | 삼성디스플레이 주식회사 | 화합물 및 이를 포함하는 유기 발광 소자 |
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CN106848083B (zh) * | 2017-03-22 | 2018-10-30 | 上海天马有机发光显示技术有限公司 | 一种oled显示面板、制备方法及包含其的电子设备 |
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