JP4969469B2 - Component mounting apparatus and component mounting method - Google Patents

Component mounting apparatus and component mounting method Download PDF

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JP4969469B2
JP4969469B2 JP2008012662A JP2008012662A JP4969469B2 JP 4969469 B2 JP4969469 B2 JP 4969469B2 JP 2008012662 A JP2008012662 A JP 2008012662A JP 2008012662 A JP2008012662 A JP 2008012662A JP 4969469 B2 JP4969469 B2 JP 4969469B2
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substrate
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JP2009176873A (en
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祐樹 恒川
弘章 薄井
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Juki Corp
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Description

本発明は、プリント基板などに電子部品等を実装する部品実装装置および部品実装方法に関し、特に、基板に印刷された半田への部品押し込み量を、該半田の高さに応じて調整することができる部品実装装置および部品実装方法に関する。   The present invention relates to a component mounting apparatus and a component mounting method for mounting an electronic component or the like on a printed circuit board or the like, and in particular, it is possible to adjust a component pushing amount to solder printed on a substrate according to the height of the solder. The present invention relates to a component mounting apparatus and a component mounting method.

図７は、従来の部品実装装置の一例である部品実装装置１００を示す斜視図である。この部品実装装置１００は、図７に示すように、部品を吸着・搭載するヘッド部１０２と、ヘッド部１０２をＸ軸方向に移動させるＸ軸移動機構１０４と、ヘッド部１０２をＹ軸方向に移動させるＹ軸移動機構１０６と、搭載する部品を供給する部品供給部１０８と、部品が搭載される基板Ｓを搬送するとともに位置決めを行う搬送部１１０と、を主要な構成要素としている。   FIG. 7 is a perspective view showing a component mounting apparatus 100 as an example of a conventional component mounting apparatus. As shown in FIG. 7, the component mounting apparatus 100 includes a head unit 102 that sucks and mounts components, an X-axis moving mechanism 104 that moves the head unit 102 in the X-axis direction, and a head unit 102 in the Y-axis direction. The main components are a Y-axis moving mechanism 106 that moves, a component supply unit 108 that supplies components to be mounted, and a transport unit 110 that transports and positions the substrate S on which the components are mounted.

実際に部品の搭載が行われる工場においては、図８に示すように、先頭の半田印刷機１２０に続いて、部品実装装置１００が直列に複数配置され、さらに最後部の部品実装装置１００の後ろにリフロー装置１２２が配置されて、ライン１２４が構成されている。   In a factory where components are actually mounted, as shown in FIG. 8, a plurality of component mounting apparatuses 100 are arranged in series following the first solder printing machine 120, and further behind the last component mounting apparatus 100. The reflow device 122 is disposed in the line 124 to constitute the line 124.

このライン１２４による部品実装工程では、次のような作業がなされる。まず、半田印刷機１２０で基板Ｓに半田の印刷がなされる。半田が印刷された基板Ｓは、複数の部品実装装置１００に順次搬送され、それぞれの部品実装装置１００において、基板Ｓの所定の位置に所定の部品が搭載される。所定の位置に所定の部品が搭載された基板Ｓは、リフロー装置１２２に搬送されて、加熱される。この加熱により、基板Ｓ上に印刷された半田が溶融し、その後リフロー装置１２２から基板Ｓが搬出されると、溶融した半田が冷えて固まり、部品の電極部分と基板Ｓのランドとの半田付けが完了する。   In the component mounting process using the line 124, the following operations are performed. First, solder is printed on the substrate S by the solder printer 120. The board S on which the solder is printed is sequentially conveyed to a plurality of component mounting apparatuses 100, and predetermined components are mounted at predetermined positions on the board S in each of the component mounting apparatuses 100. The substrate S on which a predetermined component is mounted at a predetermined position is transferred to the reflow device 122 and heated. By this heating, the solder printed on the substrate S is melted, and then when the substrate S is taken out from the reflow device 122, the melted solder is cooled and solidified, and soldering between the electrode portion of the component and the land of the substrate S is performed. Is completed.

一方、近年、部品の微小化、基板の小型化が進み、基板に搭載する部品間の隣接距離が短くなってきている。このため、基板への部品搭載時に、基板上の半田に対して部品を過度に押し込んでしまうと、その半田が隣接するランドにまで広がってしまい、半田ブリッジが形成されてしまうなどの不具合が発生するという問題があった。   On the other hand, in recent years, miniaturization of components and miniaturization of substrates have progressed, and the adjacent distance between components mounted on a substrate has become shorter. For this reason, when a component is excessively pushed into the solder on the substrate when the component is mounted on the substrate, the solder spreads to adjacent lands and a solder bridge is formed. There was a problem to do.

これに対し、特許文献１に記載の技術では、搭載部品の電極と接触する地点（以下、接触点と記す）の半田の高さを全て測定して、部品の半田への最適な押し込み量を求めて、部品の搭載高さを制御することを行っている。   On the other hand, in the technique described in Patent Document 1, all the solder heights at points where the electrodes of the mounted parts are in contact (hereinafter referred to as contact points) are measured, and the optimum amount of pressing of the parts into the solder is determined. In search, the mounting height of the parts is controlled.

特開２００６−１９６８１９号公報JP 2006-196819 A

しかしながら、特許文献１に記載の技術では、接触点の半田の高さを全て測定して、部品の半田への押し込み量（以下、部品押し込み量と記すことがある）を決定しており、接触点の数が多くなればなるほどタクトが低下するという問題があった。例えば、チップ部品では、１部品につき２点の接触点があり、リード部品においては、リード本数分の接触点がある。   However, in the technique described in Patent Document 1, the height of the solder at the contact point is all measured to determine the amount of pressing of the component into the solder (hereinafter referred to as component pressing amount). There was a problem that the tact decreased as the number of points increased. For example, a chip component has two contact points per component, and a lead component has contact points for the number of leads.

本発明は、かかる問題点に鑑みてなされたものであって、基板に印刷された半田の高さに応じた部品押し込み量の制御を行っても、タクトを従来ほど低下させずに部品搭載を行うことができる、部品実装装置および部品実装方法を提供することを課題とする。   The present invention has been made in view of such a problem, and even if the amount of component push-in is controlled in accordance with the height of the solder printed on the substrate, the component mounting can be performed without reducing the tact as much as in the past. It is an object to provide a component mounting apparatus and a component mounting method that can be performed.

部品の押し込みによる半田ブリッジの形成は、過度に部品が半田内に押し込まれた場合に発生する。この過度の押し込みは、基板上に印刷された半田の量が所定の量よりも多くなって、半田の高さが所定の高さよりも高くなっている場合に発生しやすい。このため、半田ブリッジの形成を防ぐためには、基板に印刷された半田の高さを測定して、部品押し込み量を制御することが必要である。しかし、前述のように、接触点の半田の高さを全て測定して部品押し込み量を決定して部品搭載を行うと、タクトが低下してしまう。   The formation of a solder bridge due to the pressing of the component occurs when the component is excessively pressed into the solder. This excessive pressing tends to occur when the amount of solder printed on the substrate is larger than a predetermined amount and the solder height is higher than the predetermined height. For this reason, in order to prevent the formation of a solder bridge, it is necessary to measure the height of the solder printed on the substrate and to control the amount of component pushing. However, as described above, if all the solder heights at the contact points are measured to determine the component push-in amount and component mounting is performed, the tact time decreases.

一方、基板に印刷された半田の高さがばらつく原因としては、例えば、図１（Ａ）に示すように、半田１を印刷する時の基板Ｓと半田印刷機１２０の印刷面１２０Ａとの平行が取れていないことや、図１（Ｂ）に示すように、基板Ｓが歪んでいることが考えられる。   On the other hand, the cause of the variation in the height of the solder printed on the substrate is, for example, the parallelism between the substrate S when printing the solder 1 and the printing surface 120A of the solder printer 120 as shown in FIG. It is conceivable that the substrate S is not removed and the substrate S is distorted as shown in FIG.

基板に印刷された半田の高さがばらつくこれらの要因に鑑みると、基板Ｓを所定の大きさ以下の領域に区切り、その領域内で考えれば、印刷された半田の高さのばらつきは小さくなる。   In view of these factors that cause variations in the height of the solder printed on the substrate, if the substrate S is divided into regions of a predetermined size or less and considered within that region, the variation in the height of the printed solder is reduced. .

そこで、本発明者は、接触点ごとに半田高さを測定して部品押し込み量の制御を行うのではなく、部品を搭載する基板上の領域を分割し、その分割した領域ごとにいくつかの代表点について半田高さを測定し、その平均値をその分割した領域における半田高さとして決定して、半田への部品の押し込み量を制御することにより、タクトの低下を抑えつつ、半田ブリッジ等の不具合を発生させない部品搭載が可能であると考え、研究開発を進め、本発明をするに至った。   Therefore, the present inventor does not control the amount of pushing the component by measuring the solder height for each contact point, but divides the region on the board on which the component is mounted, Measure the solder height for the representative points, determine the average value as the solder height in the divided area, and control the amount of parts pushed into the solder to control the decrease in tact, while reducing the solder bridge etc. Therefore, it was thought that it would be possible to mount components that do not cause the above-mentioned problems, and research and development proceeded to arrive at the present invention.

即ち、本発明に係る部品実装装置は、基板に印刷された半田の高さを測定することにより、部品搭載時における部品の該半田への押し込み量を制御して部品を基板上に搭載する部品実装装置であって、基板上の所定の領域内の半田の高さを測定する半田高さ測定手段と、前記所定の領域を設定するとともに、該領域内において複数の代表点を決定して、該複数の代表点について前記半田高さ測定手段に半田高さを測定させ、その測定値のばらつきが許容範囲内であればその測定値に基づき該領域内の半田高さを設定し、その測定値のばらつきが許容範囲内になければ、前記所定の領域を分割して、分割後の領域内において複数の代表点を決定して、該複数の代表点について前記半田高さ測定手段に半田高さを測定させ、その測定値のばらつきを求め、所定の分割回数以内であれば、該ばらつきが許容範囲内となるまで前記所定の領域の分割を繰返し行わせ、該ばらつきが許容範囲内となった段階で、分割後の領域内の複数の代表点についての半田高さの測定値に基づき該領域内の半田高さを設定し、設定した該半田高さに基づいて基板上へ部品を搭載する際の前記押し込み量を制御して、部品を基板上に搭載させる制御手段と、を備えたことを特徴とする。   That is, the component mounting apparatus according to the present invention measures the height of the solder printed on the substrate, thereby controlling the amount of the component pushed into the solder when mounting the component, and mounting the component on the substrate. In the mounting apparatus, the solder height measuring means for measuring the solder height in a predetermined area on the substrate, and setting the predetermined area, and determining a plurality of representative points in the area, The solder height measuring means measures the solder height for the plurality of representative points, and if the variation in the measured value is within an allowable range, the solder height in the region is set based on the measured value, and the measurement is performed. If the variation in value is not within the allowable range, the predetermined area is divided, a plurality of representative points are determined in the divided area, and the solder height measuring means is connected to the solder height measuring means for the plurality of representative points. Variation of the measured value If the number of divisions is within the predetermined number of divisions, the predetermined region is repeatedly divided until the variation is within the allowable range, and when the variation is within the allowable range, a plurality of divisions in the divided region are performed. Set the solder height in the region based on the measured value of the solder height for the representative point, and control the push-in amount when mounting the component on the substrate based on the set solder height, And a control means for mounting the component on the board.

本発明に係る部品実装方法は、印刷された半田の高さを測定する基板上の所定の領域を設定するとともに、該領域内において複数の代表点を決定して、該複数の代表点について半田高さを測定し、その測定値のばらつきが許容範囲内であればその測定値に基づき該領域内の半田高さを設定し、その測定値のばらつきが許容範囲内になければ、前記所定の領域を分割して、分割後の領域内において複数の代表点を決定して、該複数の代表点について半田高さを測定し、その測定値のばらつきを求め、所定の分割回数以内であれば、該ばらつきが許容範囲内となるまで前記所定の領域の分割を繰返し行い、該ばらつきが許容範囲内となった段階で、分割後の領域内の複数の代表点についての半田高さの測定値に基づき該領域内の半田高さを設定し、設定した該半田高さに基づいて基板上へ部品を搭載する際の前記押し込み量を制御して、部品を基板上に搭載することを特徴とする。   The component mounting method according to the present invention sets a predetermined area on the board for measuring the height of printed solder, determines a plurality of representative points in the area, and solders the plurality of representative points. The height is measured, and if the variation of the measured value is within the allowable range, the solder height in the region is set based on the measured value. If the variation of the measured value is not within the allowable range, the predetermined value is set. Divide the area, determine a plurality of representative points in the divided area, measure the solder height for the plurality of representative points, determine the variation in the measured values, and if within a predetermined number of divisions , The division of the predetermined area is repeated until the variation is within the allowable range, and when the variation is within the allowable range, the measured values of the solder heights for a plurality of representative points in the divided region Set the solder height in the area based on By controlling the amount of pushing when mounting the component onto the substrate based on solder height the set, characterized by mounting components on a substrate.

本発明によれば、基板に部品を搭載する領域内の接触点（代表点）の半田高さのばらつきが、分割した領域ごとに許容範囲内となるまで分割を繰り返し、その分割後の領域ごと（半田高さのばらつきが許容範囲内となった領域ごと）に半田高さを設定するので、その分割後の領域ごとに設定する部品ごとの半田への押し込み量は適切なものとなり、半田ブリッジ等の不具合を発生させないで部品搭載を行うことができる。   According to the present invention, the division is repeated until the variation in the solder height of the contact point (representative point) in the area where the component is mounted on the board is within the allowable range for each divided area, and for each area after the division. Since the solder height is set (for each area where the solder height variation is within the allowable range), the amount of pushing into the solder for each part set for each divided area is appropriate, and the solder bridge It is possible to mount components without causing problems such as these.

また、特許文献１に記載の技術のように、搭載部品の電極と接触する半田の接触点の全てについて半田高さを測定するようなことはしなくてもよく、分割後の領域内における所定の接触点（代表点）のみについて半田高さを測定すればよいので、搭載する部品ごとに押し込み量の補正を行っても、部品搭載時のタクト低下を抑制することができる。   Further, as in the technique described in Patent Document 1, it is not necessary to measure the solder height for all of the contact points of the solder that contacts the electrodes of the mounted component. Since it is only necessary to measure the solder height for only the contact points (representative points), even if the push amount is corrected for each component to be mounted, it is possible to suppress the tact reduction at the time of component mounting.

また、半田高さを測定する領域の分割を許容分割回数まで行っても、依然として半田高さのばらつきが許容範囲内に入らない場合には、基板への半田印刷が不良であると判断でき、部品を搭載する前に不良基板を検出することができ、無駄な部品搭載を防止することができる。   Also, even if the solder height measurement area is divided up to the allowable number of divisions, if the variation in the solder height still does not fall within the allowable range, it can be determined that the solder printing on the board is defective, A defective board can be detected before mounting a component, and unnecessary component mounting can be prevented.

以下、図面を参照して、本発明に係る実施形態について詳細に説明する。   Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

図２は、本実施形態に係る部品実装装置１０を示す斜視図であり、同図に示すように、この部品実装装置１０は、従来の部品実装装置１００と同様に、部品を吸着・搭載するヘッド部１２と、ヘッド部１２をＸ軸方向に移動させるＸ軸移動機構１４と、ヘッド部１２をＹ軸方向に移動させるＹ軸移動機構１６と、搭載する部品を供給する部品供給部１８と、部品が搭載される基板Ｓを搬送するとともに位置決めを行う搬送部２０と、を主要な構成要素としている。   FIG. 2 is a perspective view showing the component mounting apparatus 10 according to the present embodiment. As shown in the figure, the component mounting apparatus 10 sucks and mounts components in the same manner as the conventional component mounting apparatus 100. Head unit 12, X-axis moving mechanism 14 for moving head unit 12 in the X-axis direction, Y-axis moving mechanism 16 for moving head unit 12 in the Y-axis direction, and component supply unit 18 for supplying components to be mounted The main component is a transport unit 20 that transports a substrate S on which components are mounted and performs positioning.

他方、本実施形態に係る部品実装装置１０では、ヘッド部１２において、基板認識カメラ１２Ａの横に、半田高さ測定装置１２Ｂが配置されている。半田高さ測定装置１２Ｂは、レーザによる三角測量を測定原理とする高さ測定装置であり、ヘッド部１２に搭載できるコンパクトな大きさの装置である。そして、本実施形態に係る部品実装装置１０では、所定の領域に区切られた基板Ｓの領域ごとに、この半田高さ測定装置１２Ｂにより代表点について半田高さを測定し、その領域ごとに半田高さの平均値を求め、その平均値をその領域における半田高さとして用いて、部品搭載時に、部品の半田への押し込み量を制御できるようになっている。   On the other hand, in the component mounting apparatus 10 according to the present embodiment, a solder height measuring device 12B is arranged in the head portion 12 next to the board recognition camera 12A. The solder height measuring device 12 </ b> B is a height measuring device that uses triangulation with a laser as a measurement principle, and is a compact device that can be mounted on the head unit 12. In the component mounting apparatus 10 according to the present embodiment, for each region of the substrate S divided into predetermined regions, the solder height is measured at the representative point by the solder height measuring device 12B, and the solder is measured for each region. An average value of the height is obtained, and the average value is used as the solder height in the region, so that the amount of the component pushed into the solder can be controlled when the component is mounted.

図３は、部品実装装置１０において部品搭載時の部品押し込み量の制御をする際の制御ブロック図である。   FIG. 3 is a control block diagram for controlling the component push-in amount at the time of component mounting in the component mounting apparatus 10.

制御部３０は、Ｘ軸移動機構１４およびＹ軸移動機構１６によってヘッド部１２の位置を制御する。また、ヘッド部１２に指令を発し、基板認識カメラ１２Ａに基板Ｓを撮像させ、その撮像結果に基づき、基板Ｓの位置を認識する。また、基板Ｓ上に搭載する部品の位置データに基づき、半田高さを測定する基板Ｓ上の長方形の領域Ｔを決定して記憶部３０Ａに記憶する。さらに、領域Ｔ内および領域Ｔの分割後の領域内の複数の接触点（代表点）を決定して記憶部３０Ａに記憶するとともに、その代表点の半田高さを半田高さ測定装置１２Ｂに測定させ、その測定値のばらつきが許容範囲内であれば、その平均値を算出し、算出した平均値をその領域内の半田高さとして決定して記憶部３０Ａに記憶する。半田高さの測定値のばらつきが許容範囲を超えていれば、分割後の領域内の接触点（代表点）の半田高さのばらつきが許容範囲内になるまで領域Ｔの分割を行って、分割後の領域についての半田高さを決定して記憶部３０Ａに記憶する。そして、決定した半田高さに基づいて、その領域内での部品搭載時の部品押し込み量を部品ごとに決定して記憶部３０Ａに記憶する。そして、決定した部品押し込み量に基づいて部品搭載時の吸着ノズル１２Ｃの下降量を決定して、ヘッド部１２に指令を発して基板Ｓに部品の搭載を行わせる。   The control unit 30 controls the position of the head unit 12 by the X-axis moving mechanism 14 and the Y-axis moving mechanism 16. Further, a command is issued to the head unit 12 to cause the substrate recognition camera 12A to image the substrate S, and the position of the substrate S is recognized based on the imaging result. Further, based on the position data of the components mounted on the substrate S, a rectangular region T on the substrate S for measuring the solder height is determined and stored in the storage unit 30A. Further, a plurality of contact points (representative points) in the region T and in the region after the division of the region T are determined and stored in the storage unit 30A, and the solder height of the representative point is stored in the solder height measuring device 12B. If the variation of the measured value is within an allowable range, the average value is calculated, and the calculated average value is determined as the solder height in the region and stored in the storage unit 30A. If the variation in the measured value of the solder height exceeds the allowable range, the region T is divided until the variation in the solder height of the contact point (representative point) in the divided region is within the allowable range, The solder height for the divided region is determined and stored in the storage unit 30A. Then, based on the determined solder height, the component push-in amount at the time of component mounting in the region is determined for each component and stored in the storage unit 30A. Then, the lowering amount of the suction nozzle 12C at the time of component mounting is determined based on the determined component push-in amount, and a command is issued to the head unit 12 to mount the component on the substrate S.

次に、部品押し込み量の制御を行って基板Ｓに部品搭載を行う際の手順について、図４のフローチャートを用いてさらに詳細に説明する。   Next, a procedure for performing component mounting on the substrate S by controlling the component push-in amount will be described in more detail with reference to the flowchart of FIG.

まず、基板Ｓ上に部品を搭載するための実際の動作に入る前に、制御部３０に、領域Ｔ内および領域Ｔの分割後の領域内の半田高さを測定する接触点（代表点）の測定点数、測定した半田高さのばらつきの許容範囲、領域Ｔの許容分割回数、基板Ｓ上に搭載する部品の位置データを入力し、記憶部３０Ａに記憶させる（ステップＳ１）。このデータ入力は、基板Ｓを変更するごとに行う。   First, before entering an actual operation for mounting a component on the substrate S, the control unit 30 causes the contact point (representative point) to measure the solder height in the region T and in the region after the region T is divided. Are input to the storage unit 30A and stored in the storage unit 30A (step S1). This data input is performed every time the substrate S is changed.

次に、制御部３０は、基板認識カメラ１２Ａによる撮像結果に基づき、基板Ｓの位置を認識し、Ｘ軸移動機構１４およびＹ軸移動機構１６に指令を発して、ヘッド部１２を基板Ｓの上方の所定の位置に移動させる（ステップＳ２）。   Next, the control unit 30 recognizes the position of the substrate S based on the imaging result of the substrate recognition camera 12A, issues a command to the X-axis movement mechanism 14 and the Y-axis movement mechanism 16, and moves the head unit 12 over the substrate S. It is moved to a predetermined upper position (step S2).

制御部３０は、基板Ｓ上に搭載する部品の位置データに基づき、半田高さを測定する長方形の領域Ｔを自動で決定して記憶部３０Ａに記憶する（ステップＳ３）。ステップＳ３で決定された領域Ｔは、分割回数が０回（分割回数ｎ＝０）のときの領域となる。   The control unit 30 automatically determines a rectangular area T for measuring the solder height based on the position data of the components mounted on the substrate S, and stores it in the storage unit 30A (step S3). The region T determined in step S3 is a region when the number of divisions is 0 (division number n = 0).

ステップＳ３で決定された半田高さを測定する領域ＴをＮ等分（Ｎ＝２ｎ（ｎは分割回数））した領域Ｔｎ−１、Ｔｎ−２、・・・・、Ｔｎ−Ｎのそれぞれについて、そのそれぞれの領域の４隅から最も距離的に近い接触点（合計で４点）を制御部３０が自動で決定して、代表点として取得し、記憶部３０Ａに記憶する（ステップＳ４）。半田高さを測定する領域Ｔを分割して得られる領域は、分割回数が０のときは、領域Ｔ０−１の１つであるが、分割回数が１回（２等分）のときは、領域Ｔ１−１、領域Ｔ１−２の２つになり、分割回数が２回（４等分）のときは、領域Ｔ２−１、領域Ｔ２−２、領域Ｔ２−３、領域Ｔ２−４の４つになり、分割回数が３回（８等分）のときは、領域Ｔ８−１、領域Ｔ８−２、領域Ｔ８−３、領域Ｔ８−４、領域Ｔ８−５、領域Ｔ８−６、領域Ｔ８−７、領域Ｔ８−８の８つになる。半田高さを測定する領域Ｔを１等分、２等分、４等分、８等分した状況をそれぞれ図５（Ａ）〜（Ｄ）に模式的に示す。なお、Ｎ等分する方法は、Ｎが２以上のとき（２等分以上のとき）複数あるが、Ｎ等分後の各領域の長辺と短辺の比が最も１に近くなる等分方法を選択するものとする。また、分割後の領域のうち、部品の電極との接触点がない領域については半田高さの測定は行わない。 A region T n−1 , T n−2 ,..., T n− obtained by dividing the region T for measuring the solder height determined in step S3 into N equal parts (N = 2 n (n is the number of divisions)). For each of N, the control unit 30 automatically determines the closest contact points (four points in total) from the four corners of each region, acquires them as representative points, and stores them in the storage unit 30A ( Step S4). The area obtained by dividing the area T for measuring the solder height is one of the areas T 0-1 when the division number is 0, but when the division number is 1 (divided into two equal parts). , Region T 1-1 and region T 1-2 , and when the number of divisions is two (4 equal divisions), region T 2-1 , region T 2-2 , region T 2-3 , When there are four areas T 2-4 and the number of divisions is 3 (equivalent to 8), the area T 8-1 , the area T 8-2 , the area T 8-3 , the area T 8-4 , the area T 8-5 , region T 8-6 , region T 8-7 , and region T 8-8 . FIGS. 5A to 5D schematically show the situation where the area T for measuring the solder height is divided into 1 part, 2 parts, 4 parts and 8 parts. In addition, there are a plurality of methods for equally dividing N, when N is 2 or more (when it is equal to or more than 2), the ratio of the long side to the short side of each region after N equal division is the closest to 1. A method shall be selected. In addition, the solder height is not measured in a region where there is no contact point with the component electrode in the divided region.

ステップＳ３で取得した領域Ｔｎ−１、Ｔｎ−２、・・・・、Ｔｎ−Ｎのそれぞれの領域における４つの代表点について、半田高さ測定装置１２Ｂにより半田高さの測定を行う（ステップＳ５）。 The solder height is measured by the solder height measuring device 12B for the four representative points in each of the regions T n−1 , T n− 2 ,..., T n−N acquired in step S3. (Step S5).

測定した半田高さの最大値から最小値を引いた値をばらつきとし、領域Ｔｎ−１、Ｔｎ−２、・・・・、Ｔｎ−Ｎのそれぞれの領域において、このばらつきが許容範囲内にあるかどうかを判断する（ステップＳ６）。ばらつきが許容範囲内であれば、測定した４点の半田高さの平均値を、その領域における半田高さとし、記憶部３０Ａに記憶する（ステップＳ７）。そして、この領域については、以降は分割を行わない。ばらつきが許容範囲を超えていれば、分割回数ｎが許容分割回数以下であるかどうかを判断し（ステップＳ６Ａ）、分割回数ｎが許容分割回数以下であれば分割回数ｎを１増やしてｎ＝ｎ＋１とし、ステップＳ４にもどる。分割回数ｎが許容分割回数を超えていれば、部品実装装置のディスプレイ（図示せず）にエラー表示をして（ステップＳ６Ｂ）、終了する。 The value obtained by subtracting the minimum value from the maximum value of the measured solder height and variation, region T n-1, T n- 2, ····, in each of the regions of the T n-N, the variation allowable range It is judged whether it is in (step S6). If the variation is within the allowable range, the average value of the measured solder heights at the four points is set as the solder height in that region and stored in the storage unit 30A (step S7). This area is not divided thereafter. If the variation exceeds the allowable range, it is determined whether or not the division number n is equal to or less than the allowable division number (step S6A). If the division number n is equal to or less than the allowable division number, the division number n is increased by 1 and n = Set n + 1 and return to step S4. If the number of divisions n exceeds the allowable number of divisions, an error is displayed on the display (not shown) of the component mounting apparatus (step S6B), and the process ends.

領域Ｔｎ−１、Ｔｎ−２、・・・・、Ｔｎ−Ｎのそれぞれの領域についてステップＳ７で得られた半田高さに基づき、それぞれの領域で、部品ごとに半田への押し込み量を決定して記憶部３０Ａに記憶する（ステップＳ８）。決定した部品押し込み量に基づき、それぞれの領域において、部品ごとにヘッド部１２の吸着ヘッド１２Ｃの下降量を決定して記憶部３０Ａに記憶し、基板Ｓ上に部品の搭載を行う（ステップＳ９）。基板Ｓ上に全ての部品の搭載が終われば（ステップＳ１０）、一連の作業は終了する。 Based on the solder height obtained in step S7 for each of the regions T n-1 , T n-2 ,..., T n-N , the amount of pushing into the solder for each component in each region Is stored in the storage unit 30A (step S8). Based on the determined component push-in amount, in each region, the descending amount of the suction head 12C of the head unit 12 is determined for each component, stored in the storage unit 30A, and mounted on the substrate S (step S9). . When all the components are mounted on the substrate S (step S10), the series of operations is completed.

以上説明したように、本実施形態では、基板Ｓに部品を搭載する領域内の接触点（代表点）の半田高さのばらつきが、分割した領域ごとに許容範囲内となるまで分割を繰り返し、その分割後の領域ごと（半田高さのばらつきが許容範囲内となった領域ごと）に半田高さを設定するので、その分割後の領域ごとに設定する部品ごとの半田への押し込み量は適切なものとなり、半田ブリッジ等の不具合を発生させないで部品搭載を行うことができる。   As described above, in the present embodiment, the division is repeated until the variation in the solder height of the contact point (representative point) in the region where the component is mounted on the substrate S is within the allowable range for each divided region. Since the solder height is set for each divided area (each area where the variation in solder height is within the allowable range), the amount of pushing into the solder for each component set for each divided area is appropriate. Therefore, it is possible to mount components without causing problems such as solder bridges.

また、特許文献１に記載の技術のように、搭載部品の電極と接触する半田の接触点の全てについて半田高さを測定するようなことはしなくてもよく、分割後の領域内における所定の接触点（代表点）のみについて半田高さを測定すればよいので、搭載する部品ごとに押し込み量の補正を行っても、部品搭載時のタクト低下を抑制することができる。   Further, as in the technique described in Patent Document 1, it is not necessary to measure the solder height for all of the contact points of the solder that contacts the electrodes of the mounted component. Since it is only necessary to measure the solder height for only the contact points (representative points), even if the push amount is corrected for each component to be mounted, it is possible to suppress the tact reduction at the time of component mounting.

また、半田高さを測定する領域の分割を許容分割回数まで行っても、依然として半田高さのばらつきが許容範囲内に入らない場合には、部品実装装置のディスプレイ（図示せず）にエラー表示をするようになっているので、部品を搭載する前に不良基板を検出することができ、無駄な部品搭載を行うことを防止することができる。   If the solder height variation is still not within the allowable range even after the solder height measurement area is divided up to the allowable number of divisions, an error is displayed on the display (not shown) of the component mounting device. Therefore, it is possible to detect a defective board before mounting components, and to prevent unnecessary component mounting.

なお、以上説明した実施形態では、半田高さのばらつきが許容範囲内にある領域については分割を行わず、半田高さのばらつきが許容範囲を超えている領域のみについて分割を行うようにしているので、例えば１分割後の領域Ｔ１−１については半田高さのばらつきが許容範囲内となったが、１分割後のもう一方の領域Ｔ１−２については半田高さのばらつきが許容範囲を超えているような場合には、領域Ｔ１−２についてのみさらに分割を行うこととなる。領域Ｔ１−２についての半田高さのばらつきを許容範囲内にするため、領域Ｔ１−２を例えばさらに２回分割することが必要となった場合は、分割後の最終的な領域の状況は図６に示すようになる。 In the embodiment described above, the region where the solder height variation is within the allowable range is not divided, and only the region where the solder height variation exceeds the allowable range is divided. since, for example 1, but variations after dividing regions T 1-1 solder height about becomes within the allowable range, 1 other for the region T 1-2 allowable variation in solder height range after the division In such a case, the division is further performed only on the region T1-2 . To the dispersion of solder height of the region T 1-2 within the allowable range, if it becomes necessary to divide the area T 1-2 eg two more times, the status of the final areas of the divided Is as shown in FIG.

このように半田高さのばらつきが許容範囲を超えている領域のみについて分割を行うようにしたほうが、半田高さを測定する接触点（代表点）の数を全体として減らすことができるので、部品搭載におけるタクトへの悪影響を抑制することができる。また、ある領域のみ、許容分割回数内に半田高さのばらつきが許容範囲に入らなかった場合は、その領域に半田印刷の際の不良が生じていると推定でき、半田印刷機１２０の整備にフィードバックすることができる。   In this way, dividing only the region where the solder height variation exceeds the allowable range can reduce the number of contact points (representative points) for measuring the solder height as a whole. The adverse effect on the tact in mounting can be suppressed. Also, if the solder height variation does not fall within the allowable range within the allowable number of divisions in a certain area, it can be estimated that there is a defect during solder printing in that area, and the solder printer 120 can be maintained. You can give feedback.

また、以上説明した実施形態では、１つの領域において半田高さを測定する接触点（代表点）は、その領域の４隅から最も距離的に近い接触点とし、合計で４点としたが、半田高さを測定する接触点（代表点）の選定方法はこの方法に限られず、基板Ｓ上の半田印刷の状況によって適宜選定方法を変えてもよい。例えば、１つの領域において半田高さを測定する接触点（代表点）を、その領域の４隅から最も距離的に近い４つの接触点と、その領域の中心に最も距離的に近い１つの接触点との合計５点とする選定方法を用いてもよく、この場合、例えば、基板の中央部がたわんでいるような場合であっても、適切な半田高さを設定することが可能となる。さらに、分割回数が少ない場合（例えば分割回数ｎが１以下の場合）には、１つの領域における半田高さを測定する接触点（代表点）の数を５点とし、分割回数が多くなった場合（例えば分割回数ｎが２以上の場合）には、１つの領域における半田高さを測定する接触点（代表点）の数を４点としてもよい。   Further, in the embodiment described above, the contact points (representative points) for measuring the solder height in one region are the contact points closest in distance from the four corners of the region, and the total is four points. The method for selecting the contact point (representative point) for measuring the solder height is not limited to this method, and the selection method may be appropriately changed depending on the state of solder printing on the substrate S. For example, contact points (representative points) for measuring the solder height in one region are four contact points closest to the four corners of the region and one contact closest to the center of the region. A selection method of a total of 5 points may be used. In this case, for example, an appropriate solder height can be set even when the center portion of the substrate is bent. . Furthermore, when the number of divisions is small (for example, when the number of divisions n is 1 or less), the number of contact points (representative points) for measuring the solder height in one region is five, and the number of divisions increases. In some cases (for example, when the division number n is 2 or more), the number of contact points (representative points) for measuring the solder height in one region may be four.

また、以上説明したようにして設定された、分割された領域ごとの半田高さを用いて、基板Ｓに搭載する全部品について押し込み量を設定しなくてもよく、例えば、重要な部品については、従来技術のように、部品の電極が半田と接触する接触点の全てについて半田高さを測定して当該部品の押し込み量を決定してもよい。このようにすることで、重要部品については、精密な押し込み量制御を行いつつ、部品搭載作業の全体としてはタクトの改善を図ることができる。   Moreover, it is not necessary to set the pushing amount for all the parts mounted on the substrate S using the solder height for each divided area set as described above. For example, for important parts, As in the prior art, the amount of indentation of the component may be determined by measuring the solder height at all contact points where the electrode of the component contacts the solder. By doing so, it is possible to improve the tact of the entire component mounting operation while performing precise push-in amount control for important components.

また、部品を搭載しない領域が基板Ｓ上に存在する場合、ステップＳ３で決定する領域Ｔを、１つではなく複数とした方が全体として半田高さの測定点数を減らすことができることもあると考えられるが、この場合は領域Ｔを最初から複数設定して、設定したそれぞれの領域Ｔに対して、以上説明した手順に従って操作を行い、半田高さの設定を行えばよい。   In addition, when there is an area on which the component is not mounted on the substrate S, the number of measurement points of the solder height may be reduced as a whole when the area T determined in step S3 is plural rather than one. In this case, a plurality of regions T may be set from the beginning, and the solder height may be set by operating the set regions T according to the procedure described above.

また、以上説明した実施形態では、最初に設定する領域Ｔおよび分割後の領域を長方形としたが、最初に設定する領域Ｔおよび分割後の領域は長方形でなくてもよく、基板Ｓになされた半田印刷の状況に応じて適切な形状を選択することができる。   In the embodiment described above, the initially set region T and the divided region are rectangular. However, the first set region T and the divided region may not be rectangular and are formed on the substrate S. An appropriate shape can be selected according to the state of solder printing.

また、領域ＴをＮ等分する際、複数の等分方法がある場合には、Ｎ等分後の各領域の長辺と短辺の比が最も１に近くなる方法を選択するものとしたが、分割方法はこれに限定されない。例えば、基板Ｓになされた半田印刷の状況によっては、基板Ｓの長手方向のみについて分割する等分方法を採用した方が適切となる場合があると考えられる。さらに、領域Ｔを分割する方法は、等分でなくてもよい。   In addition, when there are a plurality of equal dividing methods when dividing the region T into N, the method in which the ratio of the long side to the short side of each region after N equal dividing is closest to 1 is selected. However, the dividing method is not limited to this. For example, depending on the situation of solder printing performed on the substrate S, it may be appropriate to adopt an equal dividing method in which only the longitudinal direction of the substrate S is divided. Furthermore, the method of dividing the region T may not be equally divided.

また、半田高さのばらつきは、測定した半田高さの最大値から最小値を引いた値としたが、半田高さのばらつきの評価方法はこれに限定されない。例えば、１つの領域における測定点数が多い場合には、標準偏差でばらつきを評価した方が適切となる場合があると考えられる。   The solder height variation is a value obtained by subtracting the minimum value from the maximum value of the measured solder height, but the method for evaluating the solder height variation is not limited to this. For example, when the number of measurement points in one region is large, it may be appropriate to evaluate the variation with the standard deviation.

また、以上説明した実施形態では、半田高さ測定装置１２Ｂを、レーザによる三角測量を測定原理とする高さ測定装置としたが、半田高さ測定装置１２Ｂはこれに限られず、異なる測定原理によるものでもよい。ただし、半田高さ測定装置１２Ｂの大きさは、ヘッド部１２に搭載できるコンパクトな大きさであることが好ましい。   In the embodiment described above, the solder height measuring device 12B is a height measuring device that uses triangulation with a laser as a measurement principle. However, the solder height measuring device 12B is not limited to this and has a different measurement principle. It may be a thing. However, the size of the solder height measuring device 12 </ b> B is preferably a compact size that can be mounted on the head unit 12.

基板の半田印刷の高さがばらつく原因を模式的に示す図A diagram schematically showing the cause of the variation in the solder printing height of the board 本発明の実施形態に係る部品実装装置を示す斜視図The perspective view which shows the component mounting apparatus which concerns on embodiment of this invention 前記装置において部品搭載時の部品押し込み量の制御をする際の制御ブロック図Control block diagram when controlling the amount of component push-in at the time of component mounting in the device 部品押し込み量の制御を行って基板に部品搭載を行う手順を示すフローチャートFlow chart showing the procedure for mounting components on the board by controlling the amount of component push-in 半田高さを測定する領域を分割した状況を模式的に示す図で、（Ａ）分割回数０回（１等分）の場合、（Ｂ）分割回数１回（２等分）の場合、（Ｃ）分割回数２回（４等分）の場合、（Ｂ）分割回数３回（４等分）の場合The figure which shows typically the condition which divided | segmented the area | region which measures solder height, (A) In the case of the division | segmentation frequency | count 0 times (1 equally), (B) C) When the number of divisions is 2 (4 equals), (B) When the number of divisions is 3 (4 equals) 半田高さを測定する領域を分割した状況の他の例を模式的に示す図The figure which shows typically the other example of the condition which divided | segmented the area | region which measures solder height 従来の部品実装装置の一例を示す斜視図A perspective view showing an example of a conventional component mounting apparatus 部品搭載の際のライン構成の一例を模式的に示す図The figure which shows typically an example of the line composition at the time of component mounting

符号の説明Explanation of symbols

１…半田
１０、１００…部品実装装置
１２、１０２…ヘッド部
１２Ａ…基板認識カメラ
１２Ｂ…半田高さ測定装置
１２Ｃ…吸着ノズル
１４、１０４…Ｘ軸移動機構
１６、１０６…Ｙ軸移動機構
１８、１０８…部品供給部
２０、１１０…搬送路
３０…制御部
３０Ａ…記憶部
１２０…半田印刷機
１２０Ａ…印刷面
１２２…リフロー装置
Ｓ…基板
Ｔ…領域 DESCRIPTION OF SYMBOLS 1 ... Solder 10, 100 ... Component mounting apparatus 12, 102 ... Head part 12A ... Board | substrate recognition camera 12B ... Solder height measuring device 12C ... Adsorption nozzle 14, 104 ... X-axis moving mechanism 16, 106 ... Y-axis moving mechanism 18, DESCRIPTION OF SYMBOLS 108 ... Parts supply part 20, 110 ... Conveyance path 30 ... Control part 30A ... Memory | storage part 120 ... Solder printer 120A ... Printing surface 122 ... Reflow apparatus S ... Board | substrate T ... Area | region

Claims (2)

基板に印刷された半田の高さを測定することにより、部品搭載時における部品の該半田への押し込み量を制御して部品を基板上に搭載する部品実装装置であって、
基板上の所定の領域内の半田の高さを測定する半田高さ測定手段と、
前記所定の領域を設定するとともに、該領域内において複数の代表点を決定して、該複数の代表点について前記半田高さ測定手段に半田高さを測定させ、その測定値のばらつきが許容範囲内であればその測定値に基づき該領域内の半田高さを設定し、その測定値のばらつきが許容範囲内になければ、前記所定の領域を分割して、分割後の領域内において複数の代表点を決定して、該複数の代表点について前記半田高さ測定手段に半田高さを測定させ、その測定値のばらつきを求め、所定の分割回数以内であれば、該ばらつきが許容範囲内となるまで前記所定の領域の分割を繰返し行わせ、該ばらつきが許容範囲内となった段階で、分割後の領域内の複数の代表点についての半田高さの測定値に基づき該領域内の半田高さを設定し、設定した該半田高さに基づいて基板上へ部品を搭載する際の前記押し込み量を制御して、部品を基板上に搭載させる制御手段と、
を備えたことを特徴とする部品実装装置。 By measuring the height of solder printed on a substrate, a component mounting apparatus for controlling the amount of the component pushed into the solder at the time of mounting the component and mounting the component on the substrate,
A solder height measuring means for measuring the height of the solder in a predetermined area on the substrate;
The predetermined area is set, a plurality of representative points are determined in the area, the solder height measuring means is measured for the plurality of representative points, and variations in the measured values are within an allowable range. If it is within, the solder height in the area is set based on the measured value, and if the variation in the measured value is not within the allowable range, the predetermined area is divided and a plurality of areas are divided in the divided area. A representative point is determined, and the solder height measuring means measures the solder height for the plurality of representative points, and a variation in the measured value is obtained. If the variation is within a predetermined number of divisions, the variation is within an allowable range. The division of the predetermined area is repeated until the variation becomes within the allowable range, and based on the measured values of the solder height for a plurality of representative points in the divided area, Set the solder height and By controlling the amount of pushing when mounting the component onto the substrate based on Ta Kou is, a control means for mounting components on a substrate,
A component mounting apparatus comprising: 印刷された半田の高さを測定する基板上の所定の領域を設定するとともに、該領域内において複数の代表点を決定して、該複数の代表点について半田高さを測定し、
その測定値のばらつきが許容範囲内であればその測定値に基づき該領域内の半田高さを設定し、
その測定値のばらつきが許容範囲内になければ、前記所定の領域を分割して、分割後の領域内において複数の代表点を決定して、該複数の代表点について半田高さを測定し、その測定値のばらつきを求め、所定の分割回数以内であれば、該ばらつきが許容範囲内となるまで前記所定の領域の分割を繰返し行い、該ばらつきが許容範囲内となった段階で、分割後の領域内の複数の代表点についての半田高さの測定値に基づき該領域内の半田高さを設定し、
設定した該半田高さに基づいて基板上へ部品を搭載する際の前記押し込み量を制御して、部品を基板上に搭載することを特徴とする部品実装方法。 While setting a predetermined area on the substrate for measuring the height of the printed solder, determining a plurality of representative points in the area, measuring the solder height for the plurality of representative points,
If the variation of the measured value is within the allowable range, set the solder height in the region based on the measured value,
If the variation of the measured value is not within the allowable range, the predetermined area is divided, a plurality of representative points are determined in the divided area, and the solder height is measured for the plurality of representative points, The variation of the measured value is obtained. If the variation is within the predetermined number of divisions, the predetermined area is repeatedly divided until the variation is within the allowable range. Set the solder height in the region based on the measured value of the solder height for a plurality of representative points in the region,
A component mounting method comprising: mounting a component on a substrate by controlling the push-in amount when the component is mounted on the substrate based on the set solder height.
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