JP4939545B2 - 連続方法における平面状薄型基板の湿式化学処理のための装置 - Google Patents
連続方法における平面状薄型基板の湿式化学処理のための装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Description
Claims (9)
- 平面状、薄型で破損しやすい基板、例えばマイクロエレクトロニクス部品、太陽電池など、の表面の湿式化学処理、殊にエッチング、ストリッピング、塗装、脱水、のための装置であって、
吸収性の微細孔ローラが前記基板の運搬並びにプロセス媒体による工程操作のために備えられており、前記ローラが前記基板の表面上で転動し、その際に、前記ローラ中に吸収された前記プロセス媒体を移して前記表面を濡らし、化学処理を行ない、個々の前記ローラの回転数が、個々に調整可能であることを特徴とする装置。 - 平面状、薄型で破損しやすい基板、例えばマイクロエレクトロニクス部品、太陽電池など、の表面の湿式化学処理、殊にエッチング、ストリッピング、塗装、脱水、のための装置であって、
吸収性の微細孔ローラが前記基板の運搬並びにプロセス媒体による工程操作のために備えられており、前記ローラが前記基板の表面上で転動し、その際に、前記ローラ中に吸収された前記プロセス媒体を移して前記表面を濡らし、化学処理を行ない、前記ローラの吸収された液体が、吸引によって前記ローラから導出可能であることを特徴とする装置。 - 媒体浴が備えられており、前記ローラが前記媒体浴に浸漬しかつ前記プロセス媒体を吸収することを特徴とする、請求項1又は請求項2に記載の装置。
- 噴霧装置が備えられており、前記ローラへの前記プロセス媒体の供給が前記ローラへの吹付けによって、及び/又は前記ローラ間の前記プロセス媒体の適量吐出によって行なわれることを特徴とする、請求項1又は請求項2に記載の装置。
- 前記ローラが上下に配置されており、かつ上下に配置された前記ローラの位置が任意であることを特徴とする、請求項1から請求項4までのいずれか1項に記載の装置。
- 下側の前記ローラに対する上側の前記ローラの距離及び/又は圧力が調整可能であることを特徴とする、請求項1から請求項5までのいずれか1項に記載の装置。
- 個々の前記ローラの回転方向は、異なるように選択可能であることを特徴とする、請求項1から請求項6までのいずれか1項に記載の装置。
- エッチング工程、洗浄工程、乾燥工程などを順次実施できるようにするために、複数の工程チャンバが前後して配置されていて1つの工程ラインとなっていることを特徴とする、請求項1から請求項7までのいずれか1項に記載の装置。
- 1つもしくは複数の前記プロセス媒体は、前記基板の片面と前記基板の縁部にのみ供給可能であることを特徴とする、請求項1から請求項8までのいずれか1項に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005057109.3 | 2005-11-26 | ||
DE102005057109A DE102005057109A1 (de) | 2005-11-26 | 2005-11-26 | Vorrichtung und Verfahren für mechanisches Prozessieren flacher, dünner Substrate im Durchlaufverfahren |
PCT/EP2006/011166 WO2007059925A1 (de) | 2005-11-26 | 2006-11-22 | Vorrichtung und verfahren für nasschemisches prozessieren flacher, dünner substrate im durchlaufverfahren |
Publications (2)
Publication Number | Publication Date |
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JP2009517854A JP2009517854A (ja) | 2009-04-30 |
JP4939545B2 true JP4939545B2 (ja) | 2012-05-30 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008541629A Expired - Fee Related JP4939545B2 (ja) | 2005-11-26 | 2006-11-22 | 連続方法における平面状薄型基板の湿式化学処理のための装置 |
Country Status (10)
Country | Link |
---|---|
US (2) | US20090032492A1 (ja) |
EP (1) | EP1952427B2 (ja) |
JP (1) | JP4939545B2 (ja) |
KR (1) | KR101371818B1 (ja) |
CN (1) | CN101313384B (ja) |
AT (1) | ATE532207T1 (ja) |
CA (1) | CA2630885C (ja) |
DE (1) | DE102005057109A1 (ja) |
PL (1) | PL1952427T5 (ja) |
WO (1) | WO2007059925A1 (ja) |
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JP2006196784A (ja) * | 2005-01-14 | 2006-07-27 | Sharp Corp | 基板表面処理装置 |
JP2006196783A (ja) * | 2005-01-14 | 2006-07-27 | Sharp Corp | 基板表面処理装置 |
JP2006245221A (ja) * | 2005-03-02 | 2006-09-14 | Sharp Corp | 基板の片面処理装置 |
-
2005
- 2005-11-26 DE DE102005057109A patent/DE102005057109A1/de not_active Withdrawn
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2006
- 2006-11-22 PL PL06829090T patent/PL1952427T5/pl unknown
- 2006-11-22 CA CA2630885A patent/CA2630885C/en not_active Expired - Fee Related
- 2006-11-22 CN CN2006800438467A patent/CN101313384B/zh not_active Expired - Fee Related
- 2006-11-22 WO PCT/EP2006/011166 patent/WO2007059925A1/de active Application Filing
- 2006-11-22 AT AT06829090T patent/ATE532207T1/de active
- 2006-11-22 JP JP2008541629A patent/JP4939545B2/ja not_active Expired - Fee Related
- 2006-11-22 EP EP20060829090 patent/EP1952427B2/de not_active Not-in-force
- 2006-11-22 KR KR1020087012422A patent/KR101371818B1/ko not_active IP Right Cessation
-
2008
- 2008-05-24 US US12/126,870 patent/US20090032492A1/en not_active Abandoned
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2014
- 2014-12-15 US US14/570,030 patent/US20150162225A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2007059925A1 (de) | 2007-05-31 |
EP1952427B2 (de) | 2015-05-13 |
CA2630885C (en) | 2014-02-18 |
ATE532207T1 (de) | 2011-11-15 |
KR101371818B1 (ko) | 2014-03-07 |
US20150162225A1 (en) | 2015-06-11 |
DE102005057109A1 (de) | 2007-05-31 |
CA2630885A1 (en) | 2007-05-31 |
CN101313384B (zh) | 2011-05-11 |
JP2009517854A (ja) | 2009-04-30 |
EP1952427B1 (de) | 2011-11-02 |
PL1952427T5 (pl) | 2015-10-30 |
US20090032492A1 (en) | 2009-02-05 |
EP1952427A1 (de) | 2008-08-06 |
KR20080084926A (ko) | 2008-09-22 |
CN101313384A (zh) | 2008-11-26 |
PL1952427T3 (pl) | 2012-04-30 |
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