JP4917957B2 - Ultrasonic bonding apparatus and electronic component bonding method - Google Patents

Ultrasonic bonding apparatus and electronic component bonding method Download PDF

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JP4917957B2
JP4917957B2 JP2007118215A JP2007118215A JP4917957B2 JP 4917957 B2 JP4917957 B2 JP 4917957B2 JP 2007118215 A JP2007118215 A JP 2007118215A JP 2007118215 A JP2007118215 A JP 2007118215A JP 4917957 B2 JP4917957 B2 JP 4917957B2
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electronic component
ultrasonic
tool
bonding
ultrasonic vibration
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JP2008277487A (en
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博之 今村
博 那須
勝彦 渡邉
裕 蛯原
弘幸 小林
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

本発明は、セラミックやポリイミドなどの配線基板上の配線電極と、半導体チップなどの電子部品の電極とを、超音波振動を用いて接合させる超音波接合装置、および電子部品の接合方法に関する。   The present invention relates to an ultrasonic bonding apparatus that bonds a wiring electrode on a wiring board such as ceramic or polyimide and an electrode of an electronic component such as a semiconductor chip using ultrasonic vibration, and a method for bonding the electronic component.

電子部品上の電極と配線基板上の配線とを接合させる方法の１つとして、超音波振動を利用した接合方式が従来から利用されている。   As one method for joining electrodes on an electronic component and wiring on a wiring board, a joining method using ultrasonic vibration has been conventionally used.

図６は従来の超音波接合装置による電子部品と配線基板の接合を実施している状態を示す説明図であって、図６（ａ）は正面図、図６（ｂ）の右図は配線基板を除いた底面図、図６（ｂ）の左図は無荷重時のツール上の位置と超音波振幅との関係を示す説明図である。   6A and 6B are explanatory views showing a state in which the electronic component and the wiring board are being bonded by a conventional ultrasonic bonding apparatus. FIG. 6A is a front view, and the right view of FIG. The bottom view excluding the substrate and the left figure in FIG. 6B are explanatory diagrams showing the relationship between the position on the tool and the ultrasonic amplitude when there is no load.

図６（ａ）に示すように、超音波振動子１により発生した超音波振動は、超音波振動を伝達する超音波ホーン２と、搭載されている電子部品４に直接接触するツール３を介して電子部品４に伝達されて、電子部品４上の電極と配線基板１４上の配線電極が接合される。図６（ｂ）の左図に示す無荷重時の超音波振幅９は、荷重印加時の超音波振動の伝達量を近似的に表している。   As shown in FIG. 6A, the ultrasonic vibration generated by the ultrasonic vibrator 1 is transmitted through an ultrasonic horn 2 that transmits the ultrasonic vibration and a tool 3 that directly contacts the mounted electronic component 4. Are transmitted to the electronic component 4, and the electrode on the electronic component 4 and the wiring electrode on the wiring substrate 14 are joined. The ultrasonic amplitude 9 when there is no load shown in the left diagram of FIG. 6B approximately represents the transmission amount of ultrasonic vibration when the load is applied.

図７は電子部品の各接合部に負荷される荷重条件および超音波振動条件と電子部品の各接合部の良品・不良品の関係を示す図である。低荷重または低超音波振動領域では、負荷エネルギー不足により、接合強度不足による接続界面の剥離不良となり、高荷重または高超音波振動領域では、過負荷エネルギーにより電子部品４もしくは配線基板１４が破壊する。   FIG. 7 is a diagram illustrating a relationship between a load condition and an ultrasonic vibration condition applied to each joint portion of the electronic component and a non-defective product or a defective product of each joint portion of the electronic component. In the low load or low ultrasonic vibration region, due to insufficient load energy, the connection interface peels off due to insufficient bonding strength, and in the high load or high ultrasonic vibration region, the electronic component 4 or the wiring board 14 is destroyed due to overload energy.

よって、接合条件である荷重値および超音波振動値は、接合強度が確保できかつ電子部品４または配線基板１４の破壊が発生しない範囲で設定する必要がある。
特開２００４−３３０２２８号公報 Therefore, it is necessary to set the load value and the ultrasonic vibration value, which are the bonding conditions, within a range in which the bonding strength can be secured and the electronic component 4 or the wiring board 14 is not broken.
JP 2004-330228 A

前記従来の技術において、電子部品４の全面に一様に超音波振動を伝達するためには、ツール３は、接合させる電子部品４の全面に接触している必要があり、ツール３における超音波振動方向５に対して垂直方向の長さは、電子部品４における超音波振動方向５に対する垂直方向の長さ以上に大きいことが望ましい。   In the prior art, in order to transmit ultrasonic vibration uniformly to the entire surface of the electronic component 4, the tool 3 needs to be in contact with the entire surface of the electronic component 4 to be joined. The length in the direction perpendicular to the vibration direction 5 is desirably larger than the length in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4.

また、超音波ホーン２とツール３を大きくすると、超音波振動子１で発生した超音波振動エネルギーが消費される部位が多くなるため、超音波振動を伝達しやすくするためには、超音波ホーン２とツール３はなるべく小さい方がよい。よって、従来の技術では、超音波振動方向５に対して垂直方向の電子部品４の長さ８、および超音波振動方向５に対して垂直方向のツール３の長さ７は同じ長さとしていた。   Further, when the ultrasonic horn 2 and the tool 3 are enlarged, the portion where the ultrasonic vibration energy generated by the ultrasonic vibrator 1 is consumed increases. Therefore, in order to easily transmit the ultrasonic vibration, the ultrasonic horn 2 and tool 3 should be as small as possible. Therefore, in the prior art, the length 8 of the electronic component 4 perpendicular to the ultrasonic vibration direction 5 and the length 7 of the tool 3 perpendicular to the ultrasonic vibration direction 5 are the same length. .

しかし近年、ＡｕＳｎ共晶接合や半田接合などの他の接合方式と比べて、短時間で低温の電子部品４の接合が可能である超音波接合方式の優位性が認められ、多くの電子部品の接合形態への適用が期待されている。特に、画像表示用駆動ドライバーＩＣなどの大型でかつ電極の狭ピッチ化が見込まれる電子部品の接合形態では、温度負荷による各構成部材の熱膨張によって接合位置ずれなどの不具合が生じるため、低温での接合が可能な超音波接合方式の適用が最も期待されている。   However, in recent years, the superiority of the ultrasonic bonding method capable of bonding the low-temperature electronic component 4 in a short time compared to other bonding methods such as AuSn eutectic bonding and solder bonding has been recognized. Application to bonding forms is expected. In particular, in the case of electronic component joining forms such as image display drive driver ICs, which are expected to have a narrow electrode pitch, problems such as misalignment of the joining position occur due to thermal expansion of each component due to temperature load. The application of an ultrasonic bonding method capable of bonding is most expected.

しかし、図６（ｂ）の右図に示す超音波振動子１の中心線１７から、該中心線１７に対して垂直方向に遠ざかったツール３の部位ほど超音波振動の伝達が悪くなる。つまり、図６（ｂ）の左図に示すように、ツール３の中央部とツール３の端部とで超音波振幅、つまりは超音波振動の伝達に差が生じ、特にツール３の端部で極端に超音波振動の伝達が小さくなる。   However, the transmission of the ultrasonic vibration becomes worse as the part of the tool 3 moves away from the center line 17 of the ultrasonic transducer 1 shown in the right diagram of FIG. 6B in the direction perpendicular to the center line 17. That is, as shown in the left diagram of FIG. 6B, there is a difference in the transmission of ultrasonic amplitude, that is, ultrasonic vibration, between the center portion of the tool 3 and the end portion of the tool 3. The transmission of ultrasonic vibration becomes extremely small.

さらに、超音波振動子１は、通常、圧電素子により構成されているが、この圧電素子の成型加工が１５ｍｍ以上となると作製が困難である。しかし、画像表示用駆動ドライバーＩＣは長辺が１５ｍｍ以上の大きさの電子部品４で構成された製品が多くあるため、超音波振動方向５に対して垂直方向の超音波振動子１の長さが、超音波振動方向５に対して垂直方向の電子部品４の長さより小さくなることがある。この場合には、ツール３および電子部品４の中央部と端部の超音波振動の差がさらに大きくなる。   Furthermore, the ultrasonic vibrator 1 is usually composed of a piezoelectric element, but it is difficult to produce the piezoelectric element when the forming process of the piezoelectric element is 15 mm or more. However, since many image display driver ICs are composed of electronic parts 4 having a long side of 15 mm or more, the length of the ultrasonic transducer 1 in the direction perpendicular to the ultrasonic vibration direction 5 is long. However, it may be smaller than the length of the electronic component 4 in the direction perpendicular to the ultrasonic vibration direction 5. In this case, the difference in ultrasonic vibration between the central portion and the end portion of the tool 3 and the electronic component 4 is further increased.

前述したように、電子部品４の接合条件は、電子部品４と配線基板１４が接合しかつ破壊しない条件にする必要があるが、電子部品４の中央部と端部との電極部への超音波振動の伝達に差が生じると、電子部品４内の各接合部に実際に負荷される接合条件は、例えば図７に示すような範囲を有し、電子部品４内の全接合部において接合強度確保と、電子部品４と配線基板１４の接合部分の非破壊の両方を満たす接合条件を見出すことができない。   As described above, the bonding condition of the electronic component 4 needs to be a condition in which the electronic component 4 and the wiring substrate 14 are not bonded and destroyed. When a difference occurs in the transmission of the sonic vibration, the bonding condition actually applied to each bonding portion in the electronic component 4 has a range as shown in FIG. 7, for example, and bonding is performed at all the bonding portions in the electronic component 4. It is not possible to find a joining condition that satisfies both strength securing and non-destructiveness of the joining portion of the electronic component 4 and the wiring board 14.

本発明の目的は、前記従来の課題を解決し、電子部品の中央部と端部の超音波振動の差が十分許容される領域内で、電子部品と配線基板を接合することを可能にする超音波接合装置および電子部品の接合方法を提供することにある。   The object of the present invention is to solve the above-mentioned conventional problems and to join the electronic component and the wiring board in a region where the difference in ultrasonic vibration between the central portion and the end portion of the electronic component is sufficiently allowed. An object of the present invention is to provide an ultrasonic bonding apparatus and an electronic component bonding method.

前記目的を達成するため、請求項１に記載の超音波接合装置に係る発明は、超音波ホーンの長手方向の端部に配置され前記長手方向に超音波振動する超音波振動子から発生した前記超音波振動を、前記超音波ホーンの最大振幅点に配置したツールから配線基板上の電子部品に伝達し、前記電子部品と前記配線基板とを接合させる超音波接合装置において、前記超音波振動子における超音波振動方向に対して垂直方向の長さが、接合させる電子部品における超音波振動方向に対して垂直方向の長さよりも小さく、かつ前記ツールと前記超音波ホーンにおける超音波振動方向に対して垂直な方向の長さが、共に前記電子部品における超音波振動方向に対して垂直方向の長さよりも大きくなるように設定したことを特徴とする。 To achieve the above object, the invention according to the ultrasonic bonding apparatus according to claim 1, wherein the generated from the ultrasonic vibrator vibrates ultrasonically in the longitudinal direction are arranged in the longitudinal direction of the end portion of the ultrasonic horn ultrasonic vibration, said transmitted from the tool placed on the maximum amplitude point of the ultrasonic horn to the electronic components on the wiring board, the ultrasonic bonding device for bonding the wiring board and the electronic component, the ultrasonic transducer The length in the direction perpendicular to the ultrasonic vibration direction in the electronic component is smaller than the length in the direction perpendicular to the ultrasonic vibration direction in the electronic component to be joined, and the ultrasonic vibration direction in the tool and the ultrasonic horn. The length in the vertical direction is set to be larger than the length in the vertical direction with respect to the ultrasonic vibration direction in the electronic component.

請求項２に記載の発明は、請求項１記載の超音波接合装置において、前記ツールの電子部品との接触面の端部以外に前記電子部品が配置されていることを特徴とする。 According to a second aspect of the present invention, in the ultrasonic bonding apparatus according to the first aspect, the electronic component is disposed at a portion other than an end portion of a contact surface of the tool with the electronic component .

請求項３に記載の発明は、請求項１または２記載の超音波接合装置において、超音波ホーンが超音波振動の影響を受けない超音波ホーンのノーダル部のみで支持部材により固定されていることを特徴とする。   According to a third aspect of the present invention, in the ultrasonic bonding apparatus according to the first or second aspect, the ultrasonic horn is fixed by the support member only at the nodal portion of the ultrasonic horn that is not affected by the ultrasonic vibration. It is characterized by.

請求項４に記載の発明は、請求項１〜３いずれか１項記載の超音波接合装置において、ツールに荷重を印加する荷重印加部材の超音波ホーンとの接触部が、超音波ホーンの最大振幅点であるツールの設置位置上に配置され、荷重印加部材の接触部と超音波ホーンとが接触して電子部品に超音波を印加する構成にしたことを特徴とする。   The invention according to claim 4 is the ultrasonic bonding apparatus according to any one of claims 1 to 3, wherein the contact portion of the load application member that applies a load to the tool with the ultrasonic horn is the maximum of the ultrasonic horn. It is arrange | positioned on the installation position of the tool which is an amplitude point, and it was set as the structure which contacts the contact part of a load application member, and an ultrasonic horn, and applies an ultrasonic wave to an electronic component.

請求項５に記載の電子部品の接合方法に係る発明は、請求項１〜４いずれか１項記載の超音波接合装置を用いて電子部品と配線基板とを接合する接合方法であって、超音波振動方向に対して垂直な方向におけるツールの中心と電子部品の中心とが重なる位置で前記電子部品と前記配線基板とを接合させることを特徴とする。   The invention relating to the electronic component bonding method according to claim 5 is a bonding method for bonding an electronic component and a wiring board using the ultrasonic bonding apparatus according to any one of claims 1 to 4, The electronic component and the wiring board are joined at a position where the center of the tool and the center of the electronic component overlap in a direction perpendicular to the sound wave vibration direction.

本発明によれば、電子部品の中央部と端部との超音波振動の差が十分許容される領域内で、電子部品と配線基板とを接合することができ、電子部品と配線基板との十分な接合と非破壊とを同時に満たすことができるため、安定して電子部品と配線基板とを接合することが可能になる。   According to the present invention, the electronic component and the wiring board can be joined within a region where a difference in ultrasonic vibration between the central portion and the end portion of the electronic component is sufficiently allowed. Since sufficient bonding and nondestructiveness can be satisfied at the same time, it is possible to stably bond the electronic component and the wiring board.

以下、本発明の実施形態について、図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は本発明に係る超音波接合装置の実施形態の概略構成図である。   FIG. 1 is a schematic configuration diagram of an embodiment of an ultrasonic bonding apparatus according to the present invention.

図１に示すように、超音波接合装置は、配線基板１４を保持する配線基板保持部２４を備え、配線基板保持部２４の（＋Ｚ）方向側には、配線基板保持部２４に保持された配線基板１４に電子部品４を接合する接合機構２１が設けられる。配線基板保持部２４と接合機構２１との間には、電子部品４および配線基板１４を撮像する撮像機構２７が配設されている。また、電子部品４を接合機構２１に供給する供給機構（図示せず）が設置されている。本超音波接合装置では、これらの機構が制御部４０により制御されることにより、配線基板１４と電子部品４との接合が行われる。   As shown in FIG. 1, the ultrasonic bonding apparatus includes a wiring board holding unit 24 that holds the wiring board 14, and is held by the wiring board holding unit 24 on the (+ Z) direction side of the wiring board holding unit 24. A joining mechanism 21 for joining the electronic component 4 to the wiring board 14 is provided. An imaging mechanism 27 that images the electronic component 4 and the wiring board 14 is disposed between the wiring board holding unit 24 and the bonding mechanism 21. Further, a supply mechanism (not shown) for supplying the electronic component 4 to the joining mechanism 21 is installed. In this ultrasonic bonding apparatus, these mechanisms are controlled by the control unit 40, whereby the wiring board 14 and the electronic component 4 are bonded.

配線基板保持部２４は、配線基板１４を保持するステージ２５と、ステージ２５をＸ方向およびＹ方向に移動するステージ移動機構２６を備えている。接合機構２１は、接合ヘッド２３と、該接合ヘッド２３をＺ方向に移動する（昇降する）昇降機構２２を備えている。撮像機構２７は、電子部品４および配線基板１４を撮像する撮像ユニット２８と、Ｘ方向およびＹ方向に移動する撮像ユニット移動機構２９を備えている。   The wiring board holding unit 24 includes a stage 25 that holds the wiring board 14 and a stage moving mechanism 26 that moves the stage 25 in the X direction and the Y direction. The bonding mechanism 21 includes a bonding head 23 and a lifting mechanism 22 that moves (lifts) the bonding head 23 in the Z direction. The imaging mechanism 27 includes an imaging unit 28 that images the electronic component 4 and the wiring board 14, and an imaging unit moving mechanism 29 that moves in the X direction and the Y direction.

図２は、図１に示した超音波接合装置を用い、電子部品４を配線基板１４に接合させる動作に係るフロー図である。   FIG. 2 is a flowchart relating to the operation of bonding the electronic component 4 to the wiring board 14 using the ultrasonic bonding apparatus shown in FIG.

図２において、制御部４０のコントロールにて、まず、供給機構により供給された電子部品４を接合ヘッド２３で吸着する（Ｓ１１）。次に撮像ユニット２８が電子部品４および配線基板１４の間に移動し、吸着された電子部品４およびステージ２５に保持されている配線基板１４を撮像する（Ｓ１２）。次に、画像データを制御部４０に送り、予め記憶している電子部品４と配線基板１４の画像データとをそれぞれ比較し、電子部品４および配線基板１４の位置と向きを検出する（Ｓ１３）。次に、検出結果に基づいて、電子部品４および配線基板１４を、予め設定した相対位置および向きに補正する（Ｓ１４）。電子部品４または接合ヘッド２３と接触しない位置に撮像ユニット２８が退避し、接合ヘッド２３が降下して電子部品４と配線基板１４が接合する（Ｓ１５）。そして、接合ヘッド２３による電子部品４の吸着が解除され、接合ヘッド２３が上昇する（Ｓ１６）ことによって、接合動作の一つのサイクルが完了する。   In FIG. 2, under the control of the control unit 40, first, the electronic component 4 supplied by the supply mechanism is sucked by the bonding head 23 (S11). Next, the imaging unit 28 moves between the electronic component 4 and the wiring board 14, and images the sucked electronic component 4 and the wiring board 14 held on the stage 25 (S12). Next, the image data is sent to the control unit 40, and the electronic component 4 stored in advance and the image data of the wiring board 14 are respectively compared to detect the position and orientation of the electronic component 4 and the wiring board 14 (S13). . Next, based on the detection result, the electronic component 4 and the wiring board 14 are corrected to a preset relative position and orientation (S14). The imaging unit 28 is retracted to a position where it does not come into contact with the electronic component 4 or the bonding head 23, and the bonding head 23 descends to bond the electronic component 4 and the wiring board 14 (S15). And the adsorption | suction of the electronic component 4 by the joining head 23 is cancelled | released, and the joining head 23 raises (S16), and one cycle of joining operation | movement is completed.

なお、電子部品４および配線基板１４を、予め設定した相対位置と向きとに補正する工程（Ｓ１４）において、図１に示すステージ移動機構２６ではなく、接合機構２１に別途移動機構を設けて補正を行うようにしてもよい。   In the step of correcting the electronic component 4 and the wiring board 14 to the preset relative position and orientation (S14), a correction mechanism is provided by providing a separate moving mechanism in the joining mechanism 21 instead of the stage moving mechanism 26 shown in FIG. May be performed.

図３は、電子部品４を接合させる条件である超音波振動条件と荷重条件のプロファイルと、各接合時間における電子部品４および配線基板１４部分を示す図である。図３（ａ）は超音波振動と荷重条件のプロファイルを示し、図３（ｂ１）〜図３（ｂ３）は各接合時間における電子部品４と配線基板１４、および電子部品４と配線基板１４とを接合させる接合材１３の構成を示す断面図であり、図３（ｃ１）〜図３（ｃ３）は、各接合時間における電子部品４と配線基板１４の間に配置された接合材１３の電子部品上電極１２との接触面の領域を示す図である。なお、図中の５は超音波振動方向を示す。   FIG. 3 is a diagram showing profiles of ultrasonic vibration conditions and load conditions, which are conditions for bonding the electronic component 4, and the electronic component 4 and the wiring board 14 portions at each bonding time. FIG. 3A shows a profile of ultrasonic vibration and load conditions. FIGS. 3B1 to 3B3 show the electronic component 4 and the wiring board 14 and the electronic component 4 and the wiring board 14 at each bonding time. FIG. 3 (c1) to FIG. 3 (c3) are cross-sectional views showing the configuration of the bonding material 13 for bonding the electrodes, and FIG. 3 (c3) shows the electrons of the bonding material 13 arranged between the electronic component 4 and the wiring board 14 at each bonding time. It is a figure which shows the area | region of a contact surface with the electrode 12 on components. In addition, 5 in a figure shows an ultrasonic vibration direction.

以下、図３を用いて、超音波振動条件と荷重条件の各プロファイルと、各接合時間における電子部品４および配線基板１４の状態の関係を説明する。まず、配線電極１５上に接合材１３が配置されている配線基板１４と電子部品４を用意する〔図３（ａ）０秒時，図３（ｂ１），図３（ｃ１）：初期領域３０〕。次に、ｔ１秒間は荷重のみを印加する〔図３（ａ）０秒〜ｔ１秒，図３（ｂ２），図３（ｃ２）：荷重により拡大した領域３１〕。このとき印加する荷重Ｆ〔Ｎ〕は、ｔ１〔ｓ〕後に超音波振動を印加した場合に電子部品４が位置ずれを生じない十分な値とする。次に、ｔ１秒後から超音波振動Ｐ〔Ｗ〕と荷重Ｆ〔Ｎ〕をｔ２秒後まで印加し、接合プロファイルを完了させる〔図３（ａ）ｔ１秒〜ｔ２秒，図３（ｂ３），図３（ｃ３）：荷重＋超音波振動により拡大した領域３２〕。   Hereinafter, the relationship between each profile of the ultrasonic vibration condition and the load condition and the state of the electronic component 4 and the wiring board 14 at each bonding time will be described with reference to FIG. First, the wiring board 14 in which the bonding material 13 is arranged on the wiring electrode 15 and the electronic component 4 are prepared [FIG. 3 (a) at 0 second, FIG. 3 (b1), FIG. 3 (c1): initial region 30. ]. Next, only a load is applied for t1 seconds [FIG. 3 (a) 0 second to t1 second, FIG. 3 (b2), FIG. 3 (c2): region 31 enlarged by load]. The load F [N] applied at this time is set to a sufficient value so that the electronic component 4 is not displaced when ultrasonic vibration is applied after t1 [s]. Next, ultrasonic vibration P [W] and load F [N] are applied until t2 seconds after t1 second to complete the bonding profile [FIG. 3 (a) t1 to t2 seconds, FIG. 3 (b3). FIG. 3 (c3): Region 32 enlarged by load + ultrasonic vibration].

ここで、図３（ｃ２）に示す接合材１３の荷重により拡大した領域３１は、接合強度が低いため、荷重Ｆ〔Ｎ〕は、電子部品４が位置ずれを生じないのに十分で、かつ小さい値であることが望ましい。   Here, since the region 31 enlarged by the load of the bonding material 13 shown in FIG. 3C2 has a low bonding strength, the load F [N] is sufficient for the electronic component 4 not to be displaced, and A small value is desirable.

なお、本実施形態では、予め接合材１３を配線上に配置した配線基板１４と電子部品４を対向させて接合させる接合方法を例として説明するが、接合材１３は予め電子部品４に配置されていてもよい。また、ｔ１〔ｓ〕後の荷重または超音波振動は、図３（ａ）に示すように、必ずしも一定である必要はなく、また、超音波振動の制御因子も電力Ｗではなく、電圧や電流であってもよい。   In the present embodiment, a bonding method in which the wiring substrate 14 on which the bonding material 13 is previously arranged on the wiring and the electronic component 4 are bonded to each other will be described as an example. However, the bonding material 13 is previously arranged on the electronic component 4. It may be. Further, the load or ultrasonic vibration after t1 [s] does not necessarily have to be constant as shown in FIG. 3A, and the control factor of the ultrasonic vibration is not the power W, but the voltage or current. It may be.

図４は本実施形態に関する電子部品４の各接合部に負荷される荷重条件および超音波振動条件と電子部品４の各接合部の良品・不良品の関係を示した説明図である。図４において領域３６は、電子部品の各領域に実際に負荷される接合条件の範囲を示す。   FIG. 4 is an explanatory diagram showing the relationship between the load condition and ultrasonic vibration condition applied to each joint portion of the electronic component 4 and the non-defective / defective products at each joint portion of the electronic component 4 according to this embodiment. In FIG. 4, a region 36 indicates a range of bonding conditions that are actually loaded in each region of the electronic component.

図４に示すように、接合条件である荷重値および超音波振動は接合強度が確保でき、かつ電子部品４または配線基板１４の破壊が発生しない範囲で設定する必要があり、接合する面積や接合材料の特性にもよるが、例えば荷重であれば５Ｎから５００Ｎ程度が妥当であり、超音波振動であれば無荷重時の超音波振幅に換算して０．５μｍから１０μｍ程度が妥当である。   As shown in FIG. 4, it is necessary to set the load value and ultrasonic vibration, which are bonding conditions, within a range in which bonding strength can be ensured and the electronic component 4 or the wiring board 14 does not break down. Although depending on the characteristics of the material, for example, about 5N to 500N is appropriate for a load, and about 0.5 μm to 10 μm is appropriate for ultrasonic vibration when converted to an ultrasonic amplitude at no load.

また、電子部品４および配線基板１４の接合部に対し、荷重，超音波振動以外に熱を印加すると、接合材１３と電子部品上電極１２、および配線基板１４上の配線電極１５の相互拡散が促進され、より低荷重，低超音波振動で接合が可能となるため、接合条件のマージンが広がり、さらに安定した品質を得ることができる。   When heat is applied to the joint between the electronic component 4 and the wiring board 14 in addition to the load and ultrasonic vibration, mutual diffusion of the bonding material 13, the electronic component upper electrode 12, and the wiring electrode 15 on the wiring board 14 is caused. This facilitates bonding with a lower load and lower ultrasonic vibration, so that the margin of bonding conditions is widened, and a more stable quality can be obtained.

図５は図１に示す接合ヘッド２３の構成図である。図５（ａ）は接合ヘッドの正面一部断面図であり、図５（ｂ）の右図は接合ヘッドの底面図、図５（ｂ）の左図は無荷重時のツール上位置と超音波振幅の関係を示す説明図、図５（ｂ）の下図は無荷重時の超音波ホーンと超音波振幅の関係を示す説明図であり、図５（ｃ）は接合ヘッドの構成部材であるツールにおける電子部品の吸着用吸着孔と電子部品およびツール着脱用ネジ孔の位置関係を示す底面図である。なお、図５では、接合ヘッドに保持される電子部品も併せて図示する。また、図５（ｂ）の左図に示す無荷重時の超音波振幅９は、荷重印加時の超音波振動の伝達量を近似的に表している。   FIG. 5 is a configuration diagram of the joining head 23 shown in FIG. FIG. 5A is a front sectional view of the joining head, the right view of FIG. 5B is a bottom view of the joining head, and the left view of FIG. FIG. 5B is an explanatory diagram showing the relationship between the ultrasonic amplitude, the lower diagram in FIG. 5B is an explanatory diagram showing the relationship between the ultrasonic horn and the ultrasonic amplitude when there is no load, and FIG. 5C is a component of the joining head. It is a bottom view which shows the positional relationship of the suction hole for adsorption | suction of the electronic component in a tool, the electronic component, and the screw hole for tool attachment / detachment. FIG. 5 also shows the electronic components held by the bonding head. Moreover, the ultrasonic amplitude 9 at the time of no load shown in the left figure of FIG.5 (b) represents the transmission amount of the ultrasonic vibration at the time of a load application approximately.

図５に示すように、接合ヘッド２３は、電子部品４を吸着するツール３、超音波振動を発生する超音波振動子１、超音波振動をツール３に伝える超音波ホーン２、超音波ホーン２の支持部材１０、荷重印加部材１１で構成される。超音波ホーン２は、長手方向の中央部に超音波振動の最大振幅点３５を有し、ツール３は、超音波振動の最大振幅点３５である超音波ホーン２の中央部に配置されている。本構成により、超音波振動を最も効率的に電子部品４に伝達することができる。   As shown in FIG. 5, the bonding head 23 includes a tool 3 that attracts the electronic component 4, an ultrasonic vibrator 1 that generates ultrasonic vibrations, an ultrasonic horn 2 that transmits ultrasonic vibrations to the tool 3, and an ultrasonic horn 2. Support member 10 and load application member 11. The ultrasonic horn 2 has a maximum amplitude point 35 of ultrasonic vibration in the central portion in the longitudinal direction, and the tool 3 is disposed in the central portion of the ultrasonic horn 2 that is the maximum amplitude point 35 of ultrasonic vibration. . With this configuration, ultrasonic vibration can be transmitted to the electronic component 4 most efficiently.

超音波振動子１は、超音波ホーン２の長手方向の一端部に配置され、超音波の長手方向に超音波振動する。また、超音波ホーン２は、超音波振動におけるノーダル部３４（節部）のみで支持部材１０により固定されている。このような構成により、超音波ホーン２の超音波振動を阻害することなく、超音波ホーン２を保持することができる。   The ultrasonic transducer 1 is disposed at one end of the ultrasonic horn 2 in the longitudinal direction, and ultrasonically vibrates in the longitudinal direction of the ultrasonic wave. The ultrasonic horn 2 is fixed by the support member 10 only at the nodal portion 34 (node portion) in ultrasonic vibration. With such a configuration, the ultrasonic horn 2 can be held without inhibiting the ultrasonic vibration of the ultrasonic horn 2.

ツール３に荷重を印加する荷重印加部材１１は、超音波ホーン２の最大振幅点３５であるツール３位置上に配置され、かつ超音波ホーン２とはネジやボルトなどで固定結合されておらず、荷重印加部材１１とツール３の反対面の超音波ホーン２の最大振幅点３５を含む面とが接触した構造をしている。また、荷重印加部材１１における超音波ホーン２との接触面は耐摩擦性が高く、摩擦係数の小さい材料である方が望ましく、例えば超硬合金やダイヤモンド等など構成すればよい。   The load applying member 11 for applying a load to the tool 3 is disposed on the position of the tool 3 that is the maximum amplitude point 35 of the ultrasonic horn 2 and is not fixedly coupled to the ultrasonic horn 2 with a screw or a bolt. The load application member 11 and the surface including the maximum amplitude point 35 of the ultrasonic horn 2 on the opposite surface of the tool 3 are in contact with each other. The contact surface of the load application member 11 with the ultrasonic horn 2 is preferably made of a material having high friction resistance and a small friction coefficient. For example, a cemented carbide or diamond may be used.

本構成によれば、例えば超音波振動のノーダル部３４である支持部材１０だけで超音波ホーン２に荷重を印加するよりも、大きい面積で荷重を印加できるため、超音波ホーン２および荷重印加部材１１の剛性を気にすることなく、大きい荷重の印加が可能であり、かつ荷重印加部材１１に超音波振動を阻害されずに、超音波ホーン２が超音波振動できるため、より大型の電子部品４への適用が可能となる。   According to this configuration, for example, the load can be applied in a larger area than the load applied to the ultrasonic horn 2 only by the support member 10 that is the nodal portion 34 of the ultrasonic vibration. 11, a large load can be applied without worrying about the rigidity of the motor 11, and the ultrasonic horn 2 can be vibrated ultrasonically without being disturbed by the load application member 11. 4 can be applied.

ここで、荷重印加部材１１の超音波ホーン２との接触部の形状としては、９０度以下の鋭角な部位があると、超音波振動時に超音波ホーン２との摩擦によって荷重印加部材１１の超音波ホーン２との接触部の鋭角な部位が欠けやすく、発塵源となるため、荷重印加部材１１の超音波ホーン２との接触部Ｃは、例えば図５（ａ）に示すような傾斜面加工などにより、鋭角な部位の無い形状が望まれる。   Here, if the shape of the contact portion of the load application member 11 with the ultrasonic horn 2 is an acute angle portion of 90 degrees or less, the superposition of the load application member 11 is caused by friction with the ultrasonic horn 2 during ultrasonic vibration. Since the sharp portion of the contact portion with the sonic horn 2 is easily chipped and becomes a dust generation source, the contact portion C of the load applying member 11 with the ultrasonic horn 2 is, for example, an inclined surface as shown in FIG. A shape without an acute angle part is desired by processing or the like.

ツール３は、電子部品４の接合において好適な振動特性および振動伝達特性を有するステンレス鋼により形成されており、電子部品４の吸着に利用される複数の吸着孔３３を備える。   The tool 3 is made of stainless steel having vibration characteristics and vibration transmission characteristics suitable for joining the electronic component 4, and includes a plurality of suction holes 33 used for suction of the electronic component 4.

ここで、接合ヘッド２３の移動時にも電子部品４を位置ずれなくツール３で吸着保持するためには、電子部品４の全面を均等に吸引する必要がある。また、それぞれの吸引孔に対応した複数の吸引ポンプを設置することは、装置コストが増加するため、複数の吸引孔は１つの吸引ポンプに連結されることが望ましく、よって、全ての吸着孔３３で安定して電子部品４の吸着力を発現するためには、全ての吸着孔３３が電子部品４で密閉された状態でなければならない。つまり、安定して電子部品４をツール３で吸着するためには、例えば、図５（ｃ）に示すような複数の吸着孔３３は吸着する電子部品４の領域内であり、かつ電子部品４の全領域に均等に配置されていることが望ましい。   Here, in order to attract and hold the electronic component 4 with the tool 3 without displacement even when the bonding head 23 moves, it is necessary to suck the entire surface of the electronic component 4 evenly. In addition, it is desirable to install a plurality of suction pumps corresponding to the respective suction holes to increase the apparatus cost. Therefore, it is desirable that the plurality of suction holes be connected to one suction pump. Therefore, all the suction holes 33 must be sealed with the electronic component 4 in order to develop the suction force of the electronic component 4 stably. That is, in order to stably suck the electronic component 4 with the tool 3, for example, the plurality of suction holes 33 as shown in FIG. 5C are in the region of the sucked electronic component 4 and the electronic component 4. It is desirable to be evenly arranged in all areas.

さらに、超音波振動子１における超音波振動方向５に対して垂直方向の長さ２０は、接合させる電子部品４における超音波振動方向５に対して垂直方向の長さ８よりも小さく、かつツール３および超音波ホーン２における超音波振動方向５に対して垂直方向の長さ７は、共に電子部品４における超音波振動方向５に対して垂直方向の長さ８よりも大きくしている。本実施形態によると、電子部品４よりも超音波振動子１が小さい。 Further, the length 20 in the direction perpendicular to the ultrasonic vibration direction 5 in the ultrasonic vibrator 1 is smaller than the length 8 in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4 to be joined, and the tool. 3 and the length 7 in the direction perpendicular to the ultrasonic vibration direction 5 in the ultrasonic horn 2 are both larger than the length 8 in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4. According to the present embodiment, than the electronic component 4 has small ultrasonic vibrator 1.

図５（ｂ）の左図に示す超音波振動波形９のように、超音波振動方向５と垂直方向におけるツール３の端部以外は、ツール３内の超音波振幅、つまり超音波振動の差が小さいため、例えば、ツール３内の超音波振幅の差が小さい領域における超音波振動方向５に対して垂直方向の長さよりも、超音波振動方向５に対して垂直な方向の長さが小さい電子部品４を用意し、超音波振動方向５に対して垂直な方向におけるツール３の中心と電子部品４の中心が重なる位置で電子部品４を接合させることにより、電子部品４における超音波振動方向５に対して垂直方向における中央部と端部とで、超音波振動の伝達を近似的に同一にすることができる。   Like the ultrasonic vibration waveform 9 shown in the left diagram of FIG. 5B, the ultrasonic amplitude in the tool 3, that is, the difference between the ultrasonic vibrations, except for the end of the tool 3 in the direction perpendicular to the ultrasonic vibration direction 5. Therefore, for example, the length in the direction perpendicular to the ultrasonic vibration direction 5 is smaller than the length in the direction perpendicular to the ultrasonic vibration direction 5 in the region where the difference in ultrasonic amplitude in the tool 3 is small. By preparing the electronic component 4 and joining the electronic component 4 at a position where the center of the tool 3 and the center of the electronic component 4 overlap in a direction perpendicular to the ultrasonic vibration direction 5, the ultrasonic vibration direction in the electronic component 4 5, the transmission of ultrasonic vibration can be made approximately the same at the center and the end in the vertical direction.

このように超音波振動の伝達を近似的に同一にすることができるため、図３（ｃ）に示す荷重＋超音波振動により拡大した領域３２を、電子部品４における超音波振動方向５に対して垂直方向の中央部と端部との電極で近似的に同一にすることができ、電子部品４における超音波振動方向５に対して垂直な方向の中央部と端部との電極部の接合強度を近似的に同一にすることができ、かつ接合時に、電子部品４における超音波振動方向５に対して垂直な方向の中央部と端部との電極部に与える負荷を近似的に同一にすることができる。   Since the transmission of the ultrasonic vibration can be made approximately the same in this way, the region 32 expanded by the load + ultrasonic vibration shown in FIG. Thus, the electrodes at the center and the end in the vertical direction can be made approximately the same, and the junction between the electrode at the center and the end in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4 can be made. The strength can be made approximately the same, and the load applied to the electrode portions of the central portion and the end portion in the direction perpendicular to the ultrasonic vibration direction 5 in the electronic component 4 can be made approximately the same at the time of joining. can do.

よって、電子部品４の各接合部に実際に負荷される接合条件の範囲３６は、従来と比べ格段に小さくなり、例えば図４に示すように、電子部品４の各接合部に実際に負荷される接合条件の範囲３６を接合良品の範囲内に設定することが可能となる。   Therefore, the range 36 of the bonding condition that is actually loaded on each joint of the electronic component 4 is much smaller than that in the past, and is actually loaded on each joint of the electronic component 4 as shown in FIG. It is possible to set the joining condition range 36 within the range of the good joining product.

特に、超音波振動方向５に対して垂直な方向のツール３および超音波ホーン２の長さが、電子部品４の１．５倍以上であれば十分であることが実験により分かっており、例えば電子部品４における超音波振動方向５に対して垂直な方向の長さが２０ｍｍの場合は、ツール３の超音波振動方向５に対して垂直な方向の長さは３０ｍｍ以上あれば十分である。   In particular, experiments have shown that it is sufficient if the length of the tool 3 and the ultrasonic horn 2 in a direction perpendicular to the ultrasonic vibration direction 5 is 1.5 times or more that of the electronic component 4, for example, When the length of the electronic component 4 in the direction perpendicular to the ultrasonic vibration direction 5 is 20 mm, it is sufficient that the length of the tool 3 in the direction perpendicular to the ultrasonic vibration direction 5 is 30 mm or more.

またツール３は、超音波ホーン２と必ずしも一体となっている必要はなく、メンテナンス性向上のため、ツール着脱用ネジ１８により、着脱可能となっていてもよい。   Further, the tool 3 is not necessarily integrated with the ultrasonic horn 2 and may be detachable by a tool attaching / detaching screw 18 in order to improve maintainability.

図５に示す構成はツール３が着脱可能な構成になっており、電子部品４との接触面に対して垂直なツール３の断面厚さは、図５（ａ）に示すように、ツール着脱用ネジ１８を締結する部位が電子部品４と接触する部位よりも薄く、また電子部品４と接触する面と平行なツール３の平面は、図５（ｃ）に示すように、ツール３の４つのコーナー部にそれぞれツール着脱用ネジ孔１９を有している。   The configuration shown in FIG. 5 is such that the tool 3 can be attached and detached, and the cross-sectional thickness of the tool 3 perpendicular to the contact surface with the electronic component 4 is as shown in FIG. As shown in FIG. 5C, the flat surface of the tool 3 parallel to the surface in contact with the electronic component 4 is thinner than the portion in which the screw 18 is fastened. Each corner has a screw hole 19 for attaching / detaching a tool.

また、図５（ｂ）に示すように、ツール３の電子部品４との接触面が、電子部品４のツール３との接触面と平行になるように、かつツール着脱用ネジ１８が電子部品４に接触しないように、４つのツール着脱用ネジ１８によってツール３が超音波ホーン２に締結されている。   Further, as shown in FIG. 5B, the contact surface of the tool 3 with the electronic component 4 is parallel to the contact surface of the electronic component 4 with the tool 3, and the tool attaching / detaching screw 18 is provided with the electronic component. The tool 3 is fastened to the ultrasonic horn 2 by four tool attaching / detaching screws 18 so as not to contact with the tool 4.

前記構成によれば、ツール着脱用ネジ１８の締結部ではツール３が薄いため、ツール着脱用ネジ１８が電子部品４と干渉しないので、電子部品４を破壊することのない超音波装置を提供することができる。   According to the above configuration, since the tool 3 is thin at the fastening portion of the tool attaching / detaching screw 18, the tool attaching / detaching screw 18 does not interfere with the electronic component 4, and thus an ultrasonic device that does not destroy the electronic component 4 is provided. be able to.

また、各部材の材料としては、超音波振動子１は圧電素子、超音波ホーン２はステンレスが適していると考えられる。   Further, as the material of each member, it is considered that a piezoelectric element is suitable for the ultrasonic vibrator 1 and stainless steel is suitable for the ultrasonic horn 2.

以上、例えば長辺が２０ｍｍ程度のサイズの電子部品４を従来の方法で配線基板１４に接合すると、電子部品４内の場所により伝達する超音波振動に差が生じるため、接合界面の剥離などの不良が発生するが、本実施形態によれば、電子部品４の全領域に同一の超音波振動を伝達できるため、不良となることなく、安定した製品の生産が可能となる。   As described above, for example, when the electronic component 4 having a long side of about 20 mm is bonded to the wiring board 14 by a conventional method, a difference occurs in the ultrasonic vibration transmitted depending on the location in the electronic component 4. Although a defect occurs, according to the present embodiment, the same ultrasonic vibration can be transmitted to the entire area of the electronic component 4, so that a stable product can be produced without causing a defect.

本発明によれば、配線基板上に電子部品を接合するときに、電子部品と配線基板の十分な接合と非破壊を同時に満たすことができ、例えば、大型で狭ピッチ電極である半導体チップを搭載する必要のある画像表示装置用駆動ドライバー用ＩＣの分野において有用である。   According to the present invention, when bonding an electronic component on a wiring board, sufficient bonding and non-destructiveness between the electronic component and the wiring board can be satisfied at the same time. For example, a semiconductor chip that is a large and narrow pitch electrode is mounted. This is useful in the field of drive driver ICs for image display devices that need to be performed.

本発明に係る超音波接合装置の実施形態の概略構成図Schematic configuration diagram of an embodiment of an ultrasonic bonding apparatus according to the present invention 本実施形態における接合動作に係るフロー図Flow chart related to bonding operation in this embodiment 本実施形態における超音波振動条件と荷重条件のプロファイルと、各接合時間における電子部品および配置基板部分を示す図であって、(ａ)は、超音波振動と荷重条件のプロファイルを示す図、（ｂ１）〜（ｂ３）は各接合時間における電子部品と配線基板と接合材の構成を示す断面図、(ｃ１)〜（ｃ３）は、各接合時間における電子部品と配線基板の間に配置された接合材の電子部品上電極との接触面の領域を示す図It is a figure which shows the profile of the ultrasonic vibration conditions and load conditions in this embodiment, and the electronic component and arrangement | positioning board | substrate part in each joining time, Comprising: (a) is a figure which shows the profile of ultrasonic vibration and load conditions, b1) to (b3) are cross-sectional views showing configurations of the electronic component, the wiring board, and the bonding material at each bonding time, and (c1) to (c3) are arranged between the electronic component and the wiring board at each bonding time. The figure which shows the area of the contact surface with the electrode on the electronic component of the bonding material 本実施形態における電子部品の各接合部に負荷される荷重条件および超音波振動条件と電子部品の各接合部の良品・不良品の関係を示す説明図Explanatory drawing which shows the relationship between the load condition and ultrasonic vibration condition which are loaded to each junction part of the electronic component in this embodiment, and the quality goods and inferior goods of each junction part of an electronic component 本実施形態における接合ヘッドを示し、（ａ）は断面図、（ｂ）の右図は底面図、（ｂ）の左図は無荷重時のツール上位置と超音波振幅の関係を示す説明図、（ｂ）の下図は無荷重時の超音波ホーンと超音波振幅の関係を示す説明図、（ｃ）は接合ヘッドの構成部材であるツールにおける電子部品の吸着用吸着孔と電子部品およびツール着脱用ネジ孔の位置関係を示す底面図The joining head in this embodiment is shown, (a) is sectional drawing, (b) The right figure is a bottom view, (b) The left figure is explanatory drawing which shows the relationship between the position on a tool at the time of no load, and an ultrasonic amplitude. The lower figure of (b) is explanatory drawing which shows the relationship between the ultrasonic horn and ultrasonic amplitude at the time of no load, (c) is the adsorption | suction hole for electronic components in the tool which is a structural member of a joining head, an electronic component, and a tool Bottom view showing the positional relationship of the detachable screw holes 従来の超音波接合装置による電子部品と配線基板の接合を実施している状態を示す説明図であって、（ａ）は正面図、（ｂ）の右図は配線基板を除いた底面図、（ｂ）の左図は無荷重時のツール上の位置と超音波振幅との関係を示す説明図It is explanatory drawing which shows the state which is implementing the joining of the electronic component and wiring board by the conventional ultrasonic bonding apparatus, Comprising: (a) is a front view, The right figure of (b) is a bottom view except a wiring board, The left figure of (b) is explanatory drawing which shows the relationship between the position on a tool at the time of no load, and an ultrasonic amplitude. 従来装置における電子部品の各接合部に負荷される荷重条件および超音波振動条件と電子部品の各接合部の良品・不良品の関係を示した説明図Explanatory drawing which showed the relationship between the load condition and ultrasonic vibration condition which are applied to each joint part of the electronic component in the conventional apparatus, and the non-defective / defective product of each joint part of the electronic component

符号の説明Explanation of symbols

１ 超音波振動子
２ 超音波ホーン
３ ツール
４ 電子部品
５ 超音波振動方向
６ 超音波ホーン長
７ ツール長
８ 電子部品長
９ 無負荷時の超音波振幅
１０ 超音波ホーンの支持部材
１１ 荷重印加部材
１２ 電子部品上電極
１３ 接合材
１４ 配線基板
１５ 配線電極
１７ 超音波振動子の中心線
１８ ツール着脱用ネジ
１９ ツール着脱用ネジ孔
２０ 超音波振動子長
２１ 接合機構
２２ 昇降機構
２３ 接合ヘッド
２４ 配線基板保持部
２５ ステージ
２６ ステージ移動機構
２７ 撮像機構
２８ 撮像ユニット
２９ 撮像ユニット移動機構
３０ 初期領域
３１ 荷重により拡大した領域
３２ 荷重＋超音波振動により拡大した領域
３３ 吸着孔
３４ ノーダル部
３５ 最大振幅点
３６ 電子部品の各領域に実際に負荷される接合条件の範囲
４０ 制御部 DESCRIPTION OF SYMBOLS 1 Ultrasonic vibrator 2 Ultrasonic horn 3 Tool 4 Electronic component 5 Ultrasonic vibration direction 6 Ultrasonic horn length 7 Tool length 8 Electronic component length 9 Ultrasonic amplitude at the time of no load 10 Ultrasonic horn support member 11 Load application member 12 Electrode upper electrode 13 Bonding material 14 Wiring board 15 Wiring electrode 17 Center line of ultrasonic transducer 18 Tool attaching / detaching screw 19 Tool attaching / detaching screw hole 20 Ultrasonic transducer length 21 Joining mechanism 22 Lifting mechanism 23 Joining head 24 Wiring Substrate holder 25 Stage 26 Stage moving mechanism 27 Imaging mechanism 28 Imaging unit 29 Imaging unit moving mechanism 30 Initial area 31 Area enlarged by load 32 Area enlarged by load + ultrasonic vibration 33 Adsorption hole 34 Nodal part 35 Maximum amplitude point 36 Range of joining conditions actually applied to each area of electronic component 40

Claims (5)

超音波ホーンの長手方向の端部に配置され前記長手方向に超音波振動する超音波振動子から発生した前記超音波振動を、前記超音波ホーンの最大振幅点に配置したツールから配線基板上の電子部品に伝達し、前記電子部品と前記配線基板とを接合させる超音波接合装置において、
前記超音波振動子における超音波振動方向に対して垂直方向の長さが、接合させる電子部品における超音波振動方向に対して垂直方向の長さよりも小さく、かつ前記ツールと前記超音波ホーンにおける超音波振動方向に対して垂直な方向の長さが、共に前記電子部品における超音波振動方向に対して垂直方向の長さよりも大きくなるように設定したことを特徴とする超音波接合装置。 The ultrasonic vibration generated from the ultrasonic vibrator vibrates ultrasonically in the longitudinal direction are arranged in the longitudinal direction of the end portion of the ultrasonic horn, from said tool arranged to the maximum amplitude point of the ultrasonic horn of the wiring substrate In an ultrasonic bonding apparatus that transmits to an electronic component and bonds the electronic component and the wiring board,
The length in the direction perpendicular to the ultrasonic vibration direction in the ultrasonic vibrator is smaller than the length in the direction perpendicular to the ultrasonic vibration direction in the electronic component to be joined, and the length in the tool and the ultrasonic horn is An ultrasonic bonding apparatus characterized in that a length in a direction perpendicular to a sound wave vibration direction is set to be longer than a length in a direction perpendicular to the ultrasonic vibration direction in the electronic component. 前記ツールの電子部品との接触面の端部以外に前記電子部品が配置されていることを特徴とする請求項１記載の超音波接合装置。 The ultrasonic bonding apparatus according to claim 1 , wherein the electronic component is disposed at a portion other than an end portion of a contact surface of the tool with the electronic component . 前記超音波ホーンが超音波振動の影響を受けない前記超音波ホーンのノーダル部のみで支持部材により固定されていることを特徴とする請求項１または２記載の超音波接合装置。   The ultrasonic bonding apparatus according to claim 1, wherein the ultrasonic horn is fixed by a support member only at a nodal portion of the ultrasonic horn that is not affected by ultrasonic vibration. 前記ツールに荷重を印加する荷重印加部材の前記超音波ホーンとの接触部が、前記超音波ホーンの最大振幅点である前記ツールの設置位置上に配置され、前記荷重印加部材の接触部と前記超音波ホーンとが接触して前記電子部品に超音波を印加する構成にしたことを特徴とする請求項１〜３いずれか１項記載の超音波接合装置。   The contact portion of the load application member that applies a load to the tool and the ultrasonic horn is disposed on the installation position of the tool that is the maximum amplitude point of the ultrasonic horn, and the contact portion of the load application member and the The ultrasonic bonding apparatus according to claim 1, wherein an ultrasonic wave is applied to the electronic component in contact with an ultrasonic horn. 請求項１〜４いずれか１項記載の超音波接合装置を用いて電子部品と配線基板とを接合する接合方法であって、
超音波振動方向に対して垂直な方向におけるツールの中心と電子部品の中心とが重なる位置で前記電子部品と前記配線基板とを接合させることを特徴とする電子部品の接合方法。 A bonding method for bonding an electronic component and a wiring board using the ultrasonic bonding apparatus according to any one of claims 1 to 4,
An electronic component joining method comprising joining the electronic component and the wiring board at a position where a center of a tool and a center of the electronic component overlap in a direction perpendicular to an ultrasonic vibration direction.
JP2007118215A 2007-04-27 2007-04-27 Ultrasonic bonding apparatus and electronic component bonding method Expired - Fee Related JP4917957B2 (en)

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