JP4913522B2 - 回路基板相互接続用コネクタ装置 - Google Patents
回路基板相互接続用コネクタ装置 Download PDFInfo
- Publication number
- JP4913522B2 JP4913522B2 JP2006269651A JP2006269651A JP4913522B2 JP 4913522 B2 JP4913522 B2 JP 4913522B2 JP 2006269651 A JP2006269651 A JP 2006269651A JP 2006269651 A JP2006269651 A JP 2006269651A JP 4913522 B2 JP4913522 B2 JP 4913522B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- circuit board
- conductive paths
- pitch
- rectangular parallelepiped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000011295 pitch Substances 0.000 description 120
- 238000009413 insulation Methods 0.000 description 22
- 239000000919 ceramic Substances 0.000 description 11
- 230000001151 other effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
3、103、103´ 第1の接続用電極
5、105 第2の回路基板
7、107、107´ 第2の接続用電極
9 直方体状接続子
9E 円柱状接続子
11 コネクタハウジング
11a 第1の収容室
11b 第2の収容室
13 絶縁基体
13a〜13d 連続する四面を構成する各面
13e及び13f 対向する二面を構成する面
15 絶縁間隔
17 導電路
17a 第1の導電路部分
17b 第2の導電路部分
17c 第3の導電路部分
19 基板部分導入口
21 接触させる構造
23 開口部
25 蓋部材
27 弾性押圧部材
29 フック
31 フック孔
33、133、133´ 第1の導電路
133a、133´a 第1及び第2の接触部分
35、135 第1の接続子
37、137 雄型コネクタ部材
39、139 第2の導電路
139´ 第3の導電路
41、141 第2の接続子
141´ 第3の接続子
43、143 雌型コネクタ部材
45、145 絶縁基体
45a〜45d、145a〜145d 四面
47、147、147´ 絶縁間隔
49、149 位置決め用フランジ部
51、151、151´ 絶縁基体
51a〜51d、151a〜151d、151´a〜151´d 四面
53、153、153´ 絶縁間隔
55、155 コネクタハウジング
155a 部材
57、157 第1の接続子嵌め込み室
57a、157a 位置決め用フランジ部嵌め込み部
159、161、163 隙間
Claims (3)
- 表面に所定の第1の電極間ピッチを持って形成された複数の第1の接続用電極が並設されている第1の回路基板の前記複数の第1の接続用電極と、表面に0.2mm以下で前記第1の電極間ピッチとは異なる第2の電極間ピッチを持って形成された複数の第2の接続用電極が並設されている第2の回路基板の前記複数の第2の接続用電極とを電気的に接続するために用いられる回路基板相互接続用コネクタ装置であって、
連続する四面と対向する二面を有する直方体状の絶縁基体と、前記絶縁基体の前記連続する四面中の少なくとも連続する三面上に、前記対向する二面が並ぶ方向にそれぞれ絶縁間隔を隔てて並設された複数の導電路とを備え、前記複数の導電路は前記連続する三面のうちの対向する二面の一方の面上に前記第1の電極間ピッチに相当する第1の導電路間ピッチを持って形成された複数の第1の導電路部分を有し、また前記複数の導電路は前記連続する三面のうちの対向する前記二面の他方の面上に前記第2の電極間ピッチに相当する第2の導電路間ピッチを持って形成された複数の第2の導電路部分を有し、さらに前記複数の導電路は前記連続する三面のうちの残りの一面上には、前記複数の第1の導電路部分と前記複数の第2の導電路部分とをそれぞれ結ぶピッチ変換用の複数の第3の導電路部分を有するように形成されている直方体状接続子と、
前記直方体状接続子を収容した状態で前記第1の回路基板に取り付けられるコネクタハウジングとを具備し、
前記コネクタハウジングは、
前記直方体状接続子の前記連続する三面のうちの対向する二面の一方の面上に設けられた前記複数の導電路の部分が、前記第1の回路基板に設けられた前記複数の第1の接続用電極に電気的に接続されることを許容し、
前記第2の回路基板の前記複数の第2の接続用電極が設けられた基板部分を受け入れて、前記直方体状接続子の前記連続する三面のうちの対向する前記二面の他方の面上に設けられた前記複数の導電路の部分と前記複数の第2の接続用電極とが対向する位置で前記基板部分を保持し、
さらに前記他方の面上に設けられた前記複数の導電路の部分に前記複数の第2の接続用電極を接触させる構造を有していることを特徴とする回路基板相互接続用コネクタ装置。 - 前記コネクタハウジングは、前記直方体状接続子の前記一方の面を露出させた状態で前記接続子を収容する第1の収容室と、前記第1の収容室と連通するように形成されて前記基板部分を収容する第2の収容室と、外部から前記第2の収容室に前記基板部分を導入する基板部分導入口とを有するハウジング本体と、
前記第2の収納室内に収納されて、前記基板部分を前記直方体状接続子に向かって押し付ける押圧手段とを備えている請求項1に記載の回路基板相互接続用コネクタ装置。 - 前記押圧手段は、バネ力または弾性力により前記基板部分を前記直方体状接続子に向かって押し付けるように構成されている請求項2に記載の回路基板相互接続用コネクタ装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006269651A JP4913522B2 (ja) | 2006-09-29 | 2006-09-29 | 回路基板相互接続用コネクタ装置 |
CN200780036065.XA CN101517834B (zh) | 2006-09-29 | 2007-08-29 | 电路基板相互连接用连接器装置 |
PCT/JP2007/066775 WO2008041432A1 (fr) | 2006-09-29 | 2007-08-29 | Connecteur pour l'interconnexion de cartes de circuit imprimé |
GB0907198A GB2456441B (en) | 2006-09-29 | 2007-08-29 | Connector Device For Interconnecting Circuit Substrates |
US12/443,322 US7878820B2 (en) | 2006-09-29 | 2007-08-29 | Connector device for interconnecting circuit substrates |
GBGB0907208.3A GB0907208D0 (en) | 2006-09-29 | 2009-04-28 | Connector for circuit board interconnection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006269651A JP4913522B2 (ja) | 2006-09-29 | 2006-09-29 | 回路基板相互接続用コネクタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008091163A JP2008091163A (ja) | 2008-04-17 |
JP4913522B2 true JP4913522B2 (ja) | 2012-04-11 |
Family
ID=39268296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006269651A Expired - Fee Related JP4913522B2 (ja) | 2006-09-29 | 2006-09-29 | 回路基板相互接続用コネクタ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7878820B2 (ja) |
JP (1) | JP4913522B2 (ja) |
CN (1) | CN101517834B (ja) |
GB (2) | GB2456441B (ja) |
WO (1) | WO2008041432A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2327122A4 (en) * | 2008-09-15 | 2013-07-24 | Pacific Aerospace & Electronics Inc | CONNECTOR ASSEMBLIES WITH CERAMIC INSERTS AND CONDUCTIVE PATHS AND INTERFACES |
JP5609451B2 (ja) * | 2010-09-09 | 2014-10-22 | 富士通株式会社 | コネクタ、光伝送装置およびコネクタ接続方法 |
JP6114637B2 (ja) * | 2013-06-06 | 2017-04-12 | 日本航空電子工業株式会社 | コネクタ |
US9484699B2 (en) * | 2014-03-13 | 2016-11-01 | Apple Inc. | Elastomeric connectors |
DE102017111280B4 (de) * | 2017-05-23 | 2018-12-27 | Osypka Ag | Elektromedizinischer Adapter, elektromedizinische Elektrode und elektromedizinischer Impulsgeber |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2234960C3 (de) * | 1971-11-26 | 1975-04-30 | Teledyne, Inc., Los Angeles, Calif. (V.St.A.) | Elektrischer Stecker |
DE2651186A1 (de) * | 1976-11-10 | 1978-05-18 | Kabel Metallwerke Ghh | Vorrichtung zur elektrisch leitenden verbindung zweier bauteile |
US4057311A (en) * | 1976-11-11 | 1977-11-08 | Amp Incorporated | Elastomeric connector for parallel circuit boards |
US4693529A (en) * | 1986-03-31 | 1987-09-15 | Amp Incorporated | Elastomeric mother-daughter board electrical connector |
US4695258A (en) * | 1986-12-09 | 1987-09-22 | Cherne Industries, Inc. | Connector assembly for electrically connecting flexible and rigid printed circuits |
JPH04160774A (ja) * | 1990-10-23 | 1992-06-04 | Taiyo Yuden Co Ltd | 外部接続端子、および外部接続端子を備えた混成集積回路装置、並びに外部接続端子の製造方法 |
JP2846751B2 (ja) * | 1991-07-03 | 1999-01-13 | ローム株式会社 | 回路基板に対するフレキシブルケーブルの接続装置 |
US5462441A (en) * | 1994-05-27 | 1995-10-31 | Renn; Robert M. | Low profile electrical connector |
JP3820603B2 (ja) * | 1995-09-28 | 2006-09-13 | Jsr株式会社 | コネクター装置 |
US5642441A (en) * | 1995-10-24 | 1997-06-24 | Neopath, Inc. | Separation apparatus and method for measuring focal plane |
US6403226B1 (en) * | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
TW445680B (en) * | 1999-01-21 | 2001-07-11 | Shinetsu Polymer Co | Press-contact electrical interconnectors and method for producing the same |
US6835071B2 (en) * | 2001-07-18 | 2004-12-28 | Tyco Electronics Corporation | Elastomeric connector interconnecting flexible circuits and circuit board and method of manufacturing the same |
JP2003203688A (ja) * | 2001-12-28 | 2003-07-18 | Denso Corp | 電線接続装置 |
DE60336234D1 (de) * | 2002-07-23 | 2011-04-14 | Panasonic Elec Works Co Ltd | Flachprofilverbinder |
JP2004265599A (ja) | 2002-12-19 | 2004-09-24 | Iriso Denshi Kogyo Kk | 基板接続用コネクタ及びコネクタ接続用基板 |
JP4422464B2 (ja) | 2003-11-12 | 2010-02-24 | 北陸電気工業株式会社 | コネクタチップ及びその製造方法 |
JP2005158360A (ja) * | 2003-11-21 | 2005-06-16 | Nec Saitama Ltd | 三次元基板間接続部品および三次元基板間接続構造 |
JP2005294036A (ja) * | 2004-03-31 | 2005-10-20 | Matsushita Electric Works Ltd | コネクタ及びその製造方法 |
JP4478609B2 (ja) * | 2005-05-23 | 2010-06-09 | 日本航空電子工業株式会社 | プラグコネクタ及びレセプタクルコネクタ |
JP4913523B2 (ja) * | 2006-09-29 | 2012-04-11 | 北陸電気工業株式会社 | 回路基板相互接続用コネクタ装置 |
-
2006
- 2006-09-29 JP JP2006269651A patent/JP4913522B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-29 GB GB0907198A patent/GB2456441B/en not_active Expired - Fee Related
- 2007-08-29 CN CN200780036065.XA patent/CN101517834B/zh not_active Expired - Fee Related
- 2007-08-29 US US12/443,322 patent/US7878820B2/en not_active Expired - Fee Related
- 2007-08-29 WO PCT/JP2007/066775 patent/WO2008041432A1/ja active Application Filing
-
2009
- 2009-04-28 GB GBGB0907208.3A patent/GB0907208D0/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US7878820B2 (en) | 2011-02-01 |
JP2008091163A (ja) | 2008-04-17 |
GB2456441B (en) | 2011-09-07 |
US20100003839A1 (en) | 2010-01-07 |
CN101517834A (zh) | 2009-08-26 |
GB0907208D0 (en) | 2009-06-10 |
GB2456441A (en) | 2009-07-22 |
GB0907198D0 (en) | 2009-06-10 |
WO2008041432A1 (fr) | 2008-04-10 |
CN101517834B (zh) | 2014-03-12 |
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