JP4901078B2 - チップ状電子部品 - Google Patents
チップ状電子部品 Download PDFInfo
- Publication number
- JP4901078B2 JP4901078B2 JP2004204118A JP2004204118A JP4901078B2 JP 4901078 B2 JP4901078 B2 JP 4901078B2 JP 2004204118 A JP2004204118 A JP 2004204118A JP 2004204118 A JP2004204118 A JP 2004204118A JP 4901078 B2 JP4901078 B2 JP 4901078B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- component
- terminal electrode
- resistor film
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 239000002923 metal particle Substances 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000010408 film Substances 0.000 description 99
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 238000000034 method Methods 0.000 description 12
- 238000007747 plating Methods 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000012528 membrane Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910019899 RuO Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Landscapes
- Ceramic Capacitors (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
2 部品本体
9,10 入出力端子電極
11,12 グラウンド端子電極
14,15 内部電極
16 下地導体膜
17 抵抗体膜
17a ペースト膜
18 外部導体膜
19 導電性金属粒子
22 集積物
24 軟質体
28 ノズル
C キャパシタンス素子
R 抵抗素子
L インダクタンス成分
Claims (1)
- チップ状の部品本体と前記部品本体の外表面上に形成された複数の端子電極とを備え、
前記部品本体は、積層された複数の絶縁層および前記絶縁層を介して互いに対向して静電容量を形成するように前記絶縁層間の特定の界面に沿って形成される少なくとも1対の第1および第2の内部電極を備え、
前記端子電極は、前記第1の内部電極に電気的に接続される第1の端子電極と前記第2の内部電極に電気的に接続される第2の端子電極とを備え、
前記第1の端子電極はグラウンド端子電極を備え、前記第2の端子電極は2つの入出力端子電極を備え、それによって、3端子CR複合部品を構成するものであり、
前記グラウンド端子電極は、導電性粒子を硬化性樹脂中に分散させた状態にあり、かつ体積抵抗率が5×10-3Ω・m以上の抵抗体膜と、前記抵抗体膜上に電気めっきにより形成された外部導体膜と、前記部品本体の外表面と前記抵抗体膜との間に形成される下地導体膜とを備え、前記抵抗体膜と前記外部導体膜との界面近傍には、前記抵抗体膜中の前記導電性粒子とは異なる金属からなる複数の導電性金属粒子が分布している、
チップ状電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004204118A JP4901078B2 (ja) | 2003-07-15 | 2004-07-12 | チップ状電子部品 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003196948 | 2003-07-15 | ||
JP2003196948 | 2003-07-15 | ||
JP2004204118A JP4901078B2 (ja) | 2003-07-15 | 2004-07-12 | チップ状電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005051226A JP2005051226A (ja) | 2005-02-24 |
JP4901078B2 true JP4901078B2 (ja) | 2012-03-21 |
Family
ID=34277305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004204118A Expired - Lifetime JP4901078B2 (ja) | 2003-07-15 | 2004-07-12 | チップ状電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4901078B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3904024B1 (ja) * | 2005-09-30 | 2007-04-11 | 株式会社村田製作所 | 積層電子部品 |
JP2007234828A (ja) | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
JP4400583B2 (ja) * | 2006-03-01 | 2010-01-20 | Tdk株式会社 | 積層コンデンサ及びその製造方法 |
WO2008062602A1 (fr) * | 2006-11-22 | 2008-05-29 | Murata Manufacturing Co., Ltd. | Composant électronique stratifié, et procédé pour sa fabrication |
JP4983357B2 (ja) * | 2007-04-11 | 2012-07-25 | パナソニック株式会社 | セラミック電子部品およびその製造方法 |
WO2012108122A1 (ja) * | 2011-02-08 | 2012-08-16 | 株式会社村田製作所 | コンデンサアレイ、及び、コンデンサアレイの実装方法 |
KR101598253B1 (ko) | 2013-10-02 | 2016-02-26 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
KR101983183B1 (ko) | 2015-06-15 | 2019-05-28 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
KR102242667B1 (ko) | 2015-12-22 | 2021-04-21 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
JP2017126704A (ja) * | 2016-01-15 | 2017-07-20 | 株式会社村田製作所 | 複合電子部品 |
KR101973433B1 (ko) | 2016-04-15 | 2019-04-29 | 삼성전기주식회사 | 적층형 커패시터 및 그 제조 방법 |
US10446320B2 (en) | 2016-04-15 | 2019-10-15 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor having external electrode including conductive resin layer |
KR101883049B1 (ko) | 2016-06-03 | 2018-07-27 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
US10580567B2 (en) | 2016-07-26 | 2020-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component and method of manufacturing the same |
KR101892819B1 (ko) | 2016-07-26 | 2018-08-28 | 삼성전기주식회사 | 코일 부품 |
JP6935707B2 (ja) * | 2016-12-22 | 2021-09-15 | 株式会社村田製作所 | 積層セラミックコンデンサ |
KR101922879B1 (ko) | 2017-04-04 | 2018-11-29 | 삼성전기 주식회사 | 적층형 커패시터 |
US10319527B2 (en) | 2017-04-04 | 2019-06-11 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor |
-
2004
- 2004-07-12 JP JP2004204118A patent/JP4901078B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005051226A (ja) | 2005-02-24 |
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