JP4891037B2 - 複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法 - Google Patents
複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法 Download PDFInfo
- Publication number
- JP4891037B2 JP4891037B2 JP2006315195A JP2006315195A JP4891037B2 JP 4891037 B2 JP4891037 B2 JP 4891037B2 JP 2006315195 A JP2006315195 A JP 2006315195A JP 2006315195 A JP2006315195 A JP 2006315195A JP 4891037 B2 JP4891037 B2 JP 4891037B2
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- JP
- Japan
- Prior art keywords
- layer
- copper foil
- molybdenum
- composite copper
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 70
- 239000011889 copper foil Substances 0.000 title claims description 36
- 239000002131 composite material Substances 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 15
- 229910052750 molybdenum Inorganic materials 0.000 claims description 15
- 239000011733 molybdenum Substances 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 238000005868 electrolysis reaction Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000008151 electrolyte solution Substances 0.000 claims description 5
- 239000005078 molybdenum compound Substances 0.000 claims description 5
- 150000002752 molybdenum compounds Chemical class 0.000 claims description 5
- 150000002816 nickel compounds Chemical class 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 66
- 238000009792 diffusion process Methods 0.000 description 11
- 239000009719 polyimide resin Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 230000008961 swelling Effects 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- -1 citric acid Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
Claims (3)
- 支持体となる金属箔と、
該金属箔上に、ニッケルとモリブデンと酸素からなる層(1)、主としてモリブデンと酸素からなる層(2)及びニッケルとモリブデンと酸素からなる層(3)を電気分解によって順次析出して形成した剥離層と、
該剥離層上の薄銅層
とからなる複合銅箔を、100℃以上の温度で熱処理して得られた複合銅箔であって、表面温度400℃のラミネートロールによる貼合わせ工程において、フクレが発生しないことを特徴とする複合銅箔。 - モリブデン化合物とニッケル化合物からなる電解液中で、支持体となる金属箔上にニッケルとモリブデンと酸素からなる層を電気分解により析出し、ついで、前記の電気分解条件より低い電流密度により、主としてモリブデンと酸素からなる層を電気分解により析出した後、再度、ニッケルとモリブデンと酸素からなる層を電気分解により析出することにより剥離層を形成し、ついで、薄銅層を電気分解により析出し、100℃以上の温度で熱処理することを特徴とする請求項1の複合銅箔の製造方法。
- 請求項1の複合銅箔を樹脂基材に積層成型し、ついで、支持体となる金属箔と剥離層を除去し、薄銅層に対して回路加工を行うことを特徴とする配線板の製造方法。
Priority Applications (1)
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JP2006315195A JP4891037B2 (ja) | 2006-11-22 | 2006-11-22 | 複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法 |
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JP2006315195A JP4891037B2 (ja) | 2006-11-22 | 2006-11-22 | 複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2008130867A JP2008130867A (ja) | 2008-06-05 |
JP4891037B2 true JP4891037B2 (ja) | 2012-03-07 |
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JP2006315195A Active JP4891037B2 (ja) | 2006-11-22 | 2006-11-22 | 複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法 |
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JP (1) | JP4891037B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5959149B2 (ja) | 2008-09-05 | 2016-08-02 | 古河電気工業株式会社 | キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3977790B2 (ja) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
TW200609109A (en) * | 2004-08-02 | 2006-03-16 | Nippon Denkai Ltd | Composite copper foil and method for production thereof |
JP4934409B2 (ja) * | 2005-12-15 | 2012-05-16 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
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- 2006-11-22 JP JP2006315195A patent/JP4891037B2/ja active Active
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