JP4864767B2 - Electronic components - Google Patents

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JP4864767B2
JP4864767B2 JP2007043207A JP2007043207A JP4864767B2 JP 4864767 B2 JP4864767 B2 JP 4864767B2 JP 2007043207 A JP2007043207 A JP 2007043207A JP 2007043207 A JP2007043207 A JP 2007043207A JP 4864767 B2 JP4864767 B2 JP 4864767B2
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tab terminal
lead wire
flat tab
region
round bar
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JP2008210823A (en
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勝利 澤口
順 野澤
晃 岩澤
祐樹 笹崎
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Nichicon Capacitor Ltd
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Description

本発明は、電子部品に関し、電子部品素子から電極を引き出すために用いられるリード線を用いて構成される電子部品に関するものである。 The present invention relates to electronic components, an electronic component constructed of a lead wire used to pull out the electrode from the electronic component element.

従来の多くの電子部品において、その作用の中核をなす電子部品素子の保護や信頼性確保・向上のため、該電子部品素子は金属や樹脂等からなる収納容器内に収納され、また収納容器の開口端は樹脂材料等の封口材によって封止される。この際、電子部品素子の通電用として、例えば引き出しリード線が用いられる。   In many conventional electronic components, the electronic component element is housed in a storage container made of metal, resin, etc. in order to protect the electronic component element, which is the core of its operation, and to ensure and improve reliability. The opening end is sealed with a sealing material such as a resin material. At this time, for example, a lead wire is used for energizing the electronic component element.

例えば、アルミニウム電解コンデンサの一般的な構造は図１の様になっている。このアルミニウム電解コンデンサは次のように製造される。先ず、高純度のアルミニウム箔にエッチング処理を施して表面積を拡大させる。このアルミニウム箔に化成処理を施してコンデンサの誘電体となる酸化皮膜を形成した陽極箔、およびエッチング処理された陰極箔を製造する。この陽極箔および陰極箔（以後、あわせて「電極箔」と呼称する）を、セパレータを介し、巻回してコンデンサ素子２を製造する。続いて、このコンデンサ素子２に電解液または固体電解質を含浸し、含浸後のコンデンサ素子を、一端が開口している収納容器３（主としてアルミニウム製ケースが用いられる）に収納する。該収納容器の開口端は、電極を取り出すための引き出しリード線１が挿通する挿通孔を備えた封口材４（イソブチレン−イソプレンラバー：ＩＩＲやエチレンプロピレンターポリマー：ＥＰＴの様な弾性ゴムが用いられる）によって封止される。封口材４の挿通孔の隙間は、後述するタブ端子部分が針穴加締や超音波溶接等の方法を用いて電極箔に接合された引き出しリード線１を挿通させることにより密封される。   For example, the general structure of an aluminum electrolytic capacitor is as shown in FIG. This aluminum electrolytic capacitor is manufactured as follows. First, an etching process is performed on a high-purity aluminum foil to increase the surface area. This aluminum foil is subjected to a chemical conversion treatment to produce an anode foil in which an oxide film serving as a capacitor dielectric is formed, and an etched cathode foil. Capacitor element 2 is manufactured by winding the anode foil and the cathode foil (hereinafter collectively referred to as “electrode foil”) through a separator. Subsequently, the capacitor element 2 is impregnated with an electrolytic solution or a solid electrolyte, and the impregnated capacitor element is stored in a storage container 3 (mainly an aluminum case is used) having an open end. The opening end of the storage container is made of a sealing material 4 (an elastic rubber such as isobutylene-isoprene rubber: IIR or ethylene propylene terpolymer: EPT) having an insertion hole through which the lead wire 1 for taking out the electrode is inserted. ). A gap in the insertion hole of the sealing material 4 is sealed by inserting a lead wire 1 in which a tab terminal portion described later is bonded to the electrode foil using a method such as needle hole caulking or ultrasonic welding.

この引き出しリード線１は、一般的には図２（ａ）に示すように、アルミニウム製の丸棒部１ｂと、その一部を平板状に圧延した平形タブ端子部１ａと、丸棒部１ｂに溶接された引き出し線１ｃとからなる。引き出し線１ｃは、丸棒部１ｂに対して平形タブ端子部１ａとは反対側に溶接されている。平形タブ端子部１ａの大部分は、コンデンサ素子２の巻回した電極箔内に組み込まれている。引き出し線１ｃは丸棒部１ｂよりも径が小さい。この引き出しリード線１の平形タブ端子部１ａは、圧延により形成される（例えば、特許文献１や特許文献２）ため、丸棒部１ｂの直径Ｂよりも広い幅Ａを持っている。そのため、平形タブ端子部１ａには、（Ａ−Ｂ）の半分の長さＤだけ丸棒部１ｂよりも幅方向にそれぞれ突出した張り出し部分がある。   As shown in FIG. 2A, this lead wire 1 generally includes an aluminum round bar portion 1b, a flat tab terminal portion 1a obtained by rolling a part thereof into a flat plate shape, and a round bar portion 1b. The lead wire 1c is welded to the lead wire. The lead wire 1c is welded to the opposite side of the flat tab terminal portion 1a with respect to the round bar portion 1b. Most of the flat tab terminal portion 1 a is incorporated in the wound electrode foil of the capacitor element 2. The lead wire 1c has a smaller diameter than the round bar portion 1b. Since the flat tab terminal portion 1a of the lead wire 1 is formed by rolling (for example, Patent Literature 1 and Patent Literature 2), it has a width A wider than the diameter B of the round bar portion 1b. Therefore, the flat tab terminal portion 1a has a protruding portion that protrudes in the width direction from the round bar portion 1b by a length D that is half of (A-B).

特許第３６７０８５６号公報Japanese Patent No. 3670856 特開２００３−３４７１７４号公報JP 2003-347174 A

図１に示したアルミニウム電解コンデンサを製造するには、陽極箔と陰極箔の適切な位置にリード線の平形タブ端子部を加締し、電極箔を巻回してコンデンサ素子とし、収納容器３内に配置される。その後、コンデンサ素子２から露出した平形タブ端子部１ａの一部および丸棒部１ｂが封口材４で被覆されるように、リード線１に封口材４の挿通孔を挿通させる。挿通孔は丸棒部１ｂよりも径が小さい。その際に、封口材４が図２（ｂ）の矢印の方向に平形タブ端子部１ａを押し上げる力が発生し、電極箔と平形タブ端子部１ａとの接合部分へストレスを加えてしまう場合がある。場合によっては、電極箔と平形タブ端子部１ａの接合部の剥離や電極箔の破断を引き起こし、電極を引き出すという本来の作用が得られなくなる。   In order to manufacture the aluminum electrolytic capacitor shown in FIG. 1, the flat tab terminal portion of the lead wire is crimped at an appropriate position of the anode foil and the cathode foil, and the electrode foil is wound to form a capacitor element. Placed in. Thereafter, the insertion hole of the sealing material 4 is inserted into the lead wire 1 so that a part of the flat tab terminal portion 1 a exposed from the capacitor element 2 and the round bar portion 1 b are covered with the sealing material 4. The insertion hole has a smaller diameter than the round bar 1b. At that time, the sealing material 4 generates a force for pushing up the flat tab terminal portion 1a in the direction of the arrow in FIG. 2B, and stress may be applied to the joint portion between the electrode foil and the flat tab terminal portion 1a. is there. In some cases, the joint between the electrode foil and the flat tab terminal portion 1a is peeled off or the electrode foil is broken, and the original action of drawing out the electrode cannot be obtained.

加えて、近年には電気電子機器の小形化や薄形化が進み、それに対応して電子部品の小形化や低背化が進んでいる。この小形化・低背化によって電子部品内部の空間が少なくなってきたため、上述のようなストレスが発生する可能性が大きくなっている。   In addition, in recent years, electric and electronic devices have been reduced in size and thickness, and electronic components have been correspondingly reduced in size and height. Since the space inside the electronic component has decreased due to the downsizing and reduction in height, the possibility of the stress described above is increasing.

またこの小形化・低背化により電極箔の細幅化が図られ、電極箔と平形タブ端子部１ａの接合面積が小さくなる傾向にある。このため、上述のようなストレスを極力抑制することが重要となっている。   In addition, the reduction in the size and height of the electrode foil makes it possible to reduce the width of the electrode foil, and the bonding area between the electrode foil and the flat tab terminal portion 1a tends to be reduced. For this reason, it is important to suppress the above stress as much as possible.

このストレスを緩和するために、圧延によって突出した張り出し部分を切り落とすことによって引き出しリード端子１の平形タブ端子部１ａの幅Ａを丸棒部１ｂの直径Ｂと同じ寸法にすることが考えられる。しかしながら、この場合、突出部の切り落とし処理や切り落とした後に平形タブ端子部１ａの切断面のバリ処理が必要になり工数が増えてしまうことに加え、電極箔と平形タブ端子部１ａの当接面積が減り、針穴加締または超音波溶接のような接合方法ではその接合条件の変更が必要となる。
また、平形タブ端子部１ａの圧延加工時に圧力を減らして突出する量を減らす方法が考えられるが、針穴加締や超音波溶接のような接合方式では、電極箔と平形タブ端子部１ａの接合部分の電気的抵抗が増大し、機械的強度が従来より弱くなり、結果としてストレスに対する耐性が落ちてしまう。 In order to alleviate this stress, it is conceivable that the width A of the flat tab terminal portion 1a of the lead-out lead terminal 1 is made the same as the diameter B of the round bar portion 1b by cutting off the protruding portion protruding by rolling. However, in this case, in addition to the process of cutting off the protruding portion and the burr processing of the cut surface of the flat tab terminal portion 1a after cutting off, the man-hour is increased, and the contact area between the electrode foil and the flat tab terminal portion 1a is increased. Therefore, in joining methods such as needle hole caulking or ultrasonic welding, it is necessary to change the joining conditions.
Moreover, although the method of reducing the amount of protrusion by reducing pressure at the time of rolling of the flat tab terminal part 1a can be considered, in joining methods such as needle hole caulking and ultrasonic welding, the electrode foil and the flat tab terminal part 1a The electrical resistance of the joint portion increases, the mechanical strength becomes weaker than before, and as a result, the resistance to stress decreases.

本発明は上述のように、引き出しリード線を封口材に挿通する際に発生する電子部品素子への押し込みストレスの緩和が可能であるリード線を含む電子部品を提供することを目的としている。 As described above, an object of the present invention is to provide an electronic component including a lead wire that can relieve the indentation stress to the electronic component element that is generated when the lead wire is inserted through the sealing material.

また、本発明は、電子部品製造時の、電極箔と平形タブ端子部の接合部剥離や電極箔切断等の異常発生を低減させ、電子部品の製造をより容易にすることを目的としている。更に本発明のリード線を用いた電子部品を製造することで、従来よりも更に製品の信頼性を高めることを目的としている。   Another object of the present invention is to make it easier to manufacture electronic parts by reducing the occurrence of abnormalities such as peeling of the joint between the electrode foil and the flat tab terminal and cutting of the electrode foil during the manufacture of electronic parts. Further, it is an object of the present invention to further improve the reliability of the product by manufacturing an electronic component using the lead wire of the present invention.

前記の目的を達成するため、本発明の電子部品は、円柱状の丸棒部と、平形タブ端子部と、前記丸棒部に対して前記平形タブ端子部とは反対側に形成された引き出し線とを有し、電子部品素子から電極を取り出すためのリード線と、前記リード線の平形タブ端子部に接合された電子部品素子と、前記電子部品素子および前記リード線を収納する収納容器と、前記収納容器の開口を封止する封口材とを備えている。そして、前記平形タブ端子部は、前記丸棒部よりも幅広である幅広領域と、前記平形タブ端子部と前記丸棒部との境界面から前記幅広領域に向けて連続し、前記幅広領域の幅方向において前記丸棒部の径と同じ幅を有する同幅領域とを有し、前記リード線の丸棒部が前記封口材に被覆されていると共に、前記平形タブ端子部の幅広領域が前記封口材に被覆されていない。 In order to achieve the above object, an electronic component according to the present invention includes a columnar round bar portion, a flat tab terminal portion, and a drawer formed on the opposite side of the round tab portion from the flat tab terminal portion. A lead wire for taking out an electrode from the electronic component element, an electronic component element joined to a flat tab terminal portion of the lead wire, and a storage container for storing the electronic component element and the lead wire And a sealing material for sealing the opening of the storage container. The flat tab terminal portion is continuous toward the wide region from a wide area that is wider than the round bar portion, and a boundary surface between the flat tab terminal portion and the round bar portion. A width region having the same width as the diameter of the round bar portion in the width direction, the round bar portion of the lead wire is covered with the sealing material, and the wide region of the flat tab terminal portion is the The sealing material is not covered.

前記平形タブ端子部が、前記幅広領域と前記同幅領域との間に、前記同幅領域に近づくに連れて曲線的に幅が小さくなる円弧形状領域を有していてもよい。 The flat tab terminal portion may have an arc-shaped region between the wide region and the same width region , the arc-shaped region having a width that decreases in a curve as it approaches the same width region .

本発明によると、平形タブ端子部と丸棒部との境界面近傍において平形タブ端子部が丸棒部と同じ幅になっているので、封口材が丸棒部を被覆し、かつ平形タブ端子部の幅広領域を被覆していないため、リード線を封口材に挿通する際に電子部品素子へ加えられるストレスを緩和することができる。よって、電子部品製造時の、電極箔と平形タブ端子部の接合部剥離や電極箔切断等の異常発生を低減させ、電子部品の製造をより容易にすることができる。そのため、製品の信頼性を高めることができる。   According to the present invention, since the flat tab terminal portion has the same width as the round bar portion in the vicinity of the boundary surface between the flat tab terminal portion and the round bar portion, the sealing material covers the round bar portion, and the flat tab terminal Since the wide region of the part is not covered, the stress applied to the electronic component element when the lead wire is inserted into the sealing material can be reduced. Therefore, it is possible to reduce the occurrence of abnormalities such as peeling of the joint between the electrode foil and the flat tab terminal and cutting of the electrode foil at the time of manufacturing the electronic component, thereby making it easier to manufacture the electronic component. Therefore, the reliability of the product can be improved.

また、平形タブ端子部の厚さ、材質および幅広領域の幅を変更せず、平形タブ端子部の平面形状のみを変更して張り出し部分が形成されないようにするので、電極箔と平形タブ端子部を接合するときに行われる針穴加締や超音波溶接の接合条件を変更することなく電子部品素子へのストレス緩和の効果が得られるため、現行の電子部品製造条件の変更や再検討の必要がなく、現行の製造工程に容易に導入することが可能である。   In addition, the thickness and material of the flat tab terminal part and the width of the wide area are not changed, and only the flat shape of the flat tab terminal part is changed so that no overhang is formed. The effect of relieving stress on electronic component elements can be obtained without changing the joining conditions of needle hole crimping and ultrasonic welding performed when joining parts. And can be easily introduced into the current manufacturing process.

以下、本発明の実施例について、図を参照しながら具体的に説明する。   Examples of the present invention will be specifically described below with reference to the drawings.

（従来例）
図２（ａ）は従来の引き出しリード線を図示したものである。これを封口材４に挿通した場合、図２（ｂ）中の矢印で示される様な押し上げ力が発生してしまう。 (Conventional example)
FIG. 2A shows a conventional lead wire. When this is inserted through the sealing material 4, a pushing-up force as indicated by an arrow in FIG.

［参考例］
図３（ａ）は、本発明の参考例に係るリード線の概略図である。図３（ａ）に示すリード線は、平形タブ端子部１ａを丸棒部１ｂに向かってテーパー形状を用いて狭められている。つまり、平形タブ端子部１ａの丸棒部１ｂに隣接する領域が、テーパー形状領域１２（軸方向長さＬ）となっている。両者の境界面１２ａでは、平形タブ端子部１ａの幅Ａ’と丸棒部１ｂの直径Ｂとがほぼ同等となっている。平形タブ端子部１ａのテーパー形状領域１２以外の部分は、丸棒部１ｂよりも幅の広い幅広領域１３となっている。図３（ａ）において、境界面近くの台形で描かれた部分およびその両側の三角形で描かれた部分は、平形タブ端子部１ａに対して傾斜した傾斜面となっている（本発明において、傾斜面は平形タブ端子部１ａの一部である）。そして、図３（ｂ）に示すように、図３に示すリード線を含むアルミニウム電解コンデンサにおいて、丸棒部１ｂよりも径が小さい挿通孔を有する封口材４は、丸棒部１ｂを被覆しているが、幅広領域１３を被覆していない。すなわち、封口材４の端部は、テーパー形状領域１２の一部と接している。 [ Reference example ]
FIG. 3A is a schematic diagram of a lead wire according to a reference example of the present invention. In the lead wire shown in FIG. 3A, the flat tab terminal portion 1a is narrowed toward the round bar portion 1b by using a tapered shape. That is, a region adjacent to the round bar portion 1b of the flat tab terminal portion 1a is a tapered region 12 (axial length L). At the boundary surface 12a between them, the width A ′ of the flat tab terminal portion 1a and the diameter B of the round bar portion 1b are substantially equal. A portion other than the tapered region 12 of the flat tab terminal portion 1a is a wide region 13 wider than the round bar portion 1b. In FIG. 3A, a portion drawn in a trapezoid near the boundary surface and a portion drawn in a triangle on both sides thereof are inclined surfaces inclined with respect to the flat tab terminal portion 1a (in the present invention, The inclined surface is a part of the flat tab terminal portion 1a). As shown in FIG. 3B, in the aluminum electrolytic capacitor including the lead wire shown in FIG. 3, the sealing material 4 having an insertion hole whose diameter is smaller than that of the round bar portion 1b covers the round bar portion 1b. However, the wide region 13 is not covered. That is, the end portion of the sealing material 4 is in contact with a part of the tapered region 12.

参考例によると、封口材４への挿通時の押し上げ力が、テーパー面に垂直な力の上向き方向への分力（図３（ｂ）に上向き矢印で示す）となる。したがって、押し上げ力が緩和され、電子部品素子へのストレスを低減させることができる。尚、テーパー形状領域１２の長さ寸法Lは、該引き出しリード線のサイズや、例えば電極箔との接合方法や接合状態に鑑みて、任意に決めることができるが、少なくとも封口材４が当接する領域よりも長い（テーパー形状領域１２の上端が封口材４の外にある）ことが望ましい。 According to the reference example , the push-up force at the time of insertion into the sealing material 4 becomes a component force in the upward direction of the force perpendicular to the tapered surface (indicated by an upward arrow in FIG. 3B). Therefore, the pushing force is relieved and stress on the electronic component element can be reduced. The length L of the tapered region 12 can be arbitrarily determined in view of the size of the lead wire, for example, the bonding method and bonding state with the electrode foil, but at least the sealing material 4 contacts. It is desirable that it is longer than the region (the upper end of the tapered region 12 is outside the sealing material 4).

［実施例１］
図４（ａ）は、本発明の実施例１に係るリード線の概略図である。図４（ａ）に示すリード線は、平形タブ端子部１ａの外周の一部を円弧形状１４とし、当該円弧形状１４の部分よりも丸棒部１ｂに近い部分がすべて同じ幅Ａ’の領域（同幅領域１５）となっている。すなわち、同幅領域１５の丸棒部１ｂとの境界面１５ａの幅は、Ａ’であり、同幅領域１５の幅Ａ’は丸棒部１ｂの直径Ｂとほぼ同等となっている。このとき、同幅領域１５があることにより、封口材４は、丸棒部１ｂを被覆しているが、幅広領域１３を被覆していない。すなわち、封口材４の端部が同幅領域１５と接している。これにより、図４（ｂ）に示すように、封口材４へのリード線の挿通時に平形タブ端子部１ａには、平形タブ端子の同幅領域による押し上げ力がかからなくなる。尚、円弧形状１４を設ける部分は、該引き出しリード線のサイズや、例えば電極箔との接合方法や接合状態に鑑みて、任意に決めることができるが、少なくとも封口材４が当接する領域から離れた箇所であることが望ましい。 [ Example 1 ]
FIG. 4A is a schematic diagram of a lead wire according to the first embodiment of the present invention. In the lead wire shown in FIG. 4A, a part of the outer periphery of the flat tab terminal portion 1a has a circular arc shape 14, and all portions closer to the round bar portion 1b than the circular arc shape portion 14 have the same width A ′. (Same width region 15). That is, the width of the boundary surface 15a with the round bar portion 1b of the same width region 15 is A ', and the width A' of the same width region 15 is substantially equal to the diameter B of the round bar portion 1b. At this time, the sealing material 4 covers the round bar portion 1 b but does not cover the wide region 13 due to the presence of the same width region 15. That is, the end portion of the sealing material 4 is in contact with the same width region 15. As a result, as shown in FIG. 4B, when the lead wire is inserted into the sealing material 4, the flat tab terminal portion 1a is not subjected to a pushing force due to the same width region of the flat tab terminal. The portion where the arc shape 14 is provided can be arbitrarily determined in consideration of the size of the lead wire, for example, the bonding method and bonding state with the electrode foil, but at least away from the region where the sealing material 4 abuts. It is desirable that

［実施例２］
図５は、本発明の実施例２に係るリード線の概略図である。図５に示すリード線は、平形タブ端子部１ａの一部を段差形状１７とし、段差形状１７の部分よりも丸棒部１ｂに近い部分がすべて同じ幅Ａ’の領域（同幅領域１８）となっている。すなわち、同幅領域１８の丸棒部１ｂとの境界面１８ａの幅は、Ａ’であり、同幅領域１８の幅Ａ’は丸棒部１ｂの直径Ｂとほぼ同等となっている。このとき、同幅領域１８があることにより、封口材４は、丸棒部１ｂを被覆しているが、幅広領域１３を被覆していない。すなわち、封口材４の端部が同幅領域１８と接している。尚、段差形状１７を設ける長さ寸法は、該引き出しリード線のサイズや、例えば電極箔との接合方法や接合状態に鑑みて、任意に決めることができるが、少なくとも封口材４が当接する領域から離れた箇所であることが望ましい。 [ Example 2 ]
FIG. 5 is a schematic diagram of a lead wire according to the second embodiment of the present invention. In the lead wire shown in FIG. 5, a part of the flat tab terminal portion 1 a has a stepped shape 17, and the portion closer to the round bar portion 1 b than the portion of the stepped shape 17 has the same width A ′ (same width region 18). It has become. That is, the width of the boundary surface 18a with the round bar portion 1b of the same width region 18 is A ', and the width A' of the same width region 18 is substantially equal to the diameter B of the round bar portion 1b. At this time, the sealing material 4 covers the round bar portion 1 b due to the presence of the same width region 18, but does not cover the wide region 13. That is, the end of the sealing material 4 is in contact with the same width region 18. The length dimension for providing the stepped shape 17 can be arbitrarily determined in view of the size of the lead wire, for example, the bonding method and bonding state with the electrode foil, but at least the region where the sealing material 4 abuts. It is desirable to be away from the location.

［実施例３］
図６は、本発明の実施例３に係るリード線の概略図である。図６に示すリード線は、平形タブ端子部１ａの一部を、テーパー形状を介した段差形状１９とし、段差形状１９の部分よりも丸棒部１ｂに近い部分がすべて同じ幅Ａ’の領域（同幅領域２０）となっている。すなわち、同幅領域２０の丸棒部１ｂとの境界面２０ａの幅は、Ａ’であり、同幅領域２０の幅Ａ’は丸棒部１ｂの直径Ｂとほぼ同等となっている。このとき、同幅領域２０があることにより、封口材４は、丸棒部１ｂを被覆しているが、幅広領域１３を被覆していない。すなわち、封口材４の端部が同幅領域２０と接している。尚、段差形状１９を設ける部分は、該引き出しリード線のサイズや、例えば電極箔との接合方法や接合状態に鑑みて、任意に決めることができるが、少なくとも封口材４が当接する領域から離れた箇所であることが望ましい。 [ Example 3 ]
FIG. 6 is a schematic view of a lead wire according to the third embodiment of the present invention. In the lead wire shown in FIG. 6, a part of the flat tab terminal portion 1a has a stepped shape 19 via a taper shape, and the portion closer to the round bar portion 1b than the portion of the stepped shape 19 has the same width A ′. (Same width region 20). That is, the width of the boundary surface 20a with the round bar portion 1b of the same width region 20 is A ′, and the width A ′ of the same width region 20 is substantially equal to the diameter B of the round bar portion 1b. At this time, the sealing material 4 covers the round bar portion 1b due to the presence of the same width region 20, but does not cover the wide region 13. That is, the end portion of the sealing material 4 is in contact with the same width region 20. The portion where the step shape 19 is provided can be arbitrarily determined in consideration of the size of the lead wire, for example, the bonding method and bonding state with the electrode foil, but at least away from the region where the sealing material 4 abuts. It is desirable that

［実施例４］
図７は、本発明の実施例４に係るリード線の概略図である。図５に示すリード線は、平形タブ端子部１ａの一部を波形状２１とし、当該波形状２１の部分よりも丸棒部１ｂに近い部分がすべて同じ幅Ａ’の領域（同幅領域２２）となっている。すなわち、同幅領域２２の丸棒部１ｂとの境界面２２ａの幅は、Ａ’であり、同幅領域２２の幅Ａ’は丸棒部１ｂの直径Ｂとほぼ同等となっている。このとき、同幅領域２２があることにより、封口材４は、丸棒部１ｂを被覆しているが、幅広領域１３を被覆していない。すなわち、封口材４の端部が同幅領域２２と接している。尚、波形状２１を設ける部分は、該引き出しリード線のサイズや、例えば電極箔との接合方法や接合状態に鑑みて、任意に決めることができるが、少なくとも封口材４が当接する領域から離れた箇所であることが望ましい。 [ Example 4 ]
FIG. 7 is a schematic view of a lead wire according to Embodiment 4 of the present invention. In the lead wire shown in FIG. 5, a portion of the flat tab terminal portion 1 a has a corrugated shape 21, and the portion closer to the round bar portion 1 b than the corrugated portion 21 has the same width A ′ (the same width region 22). ). That is, the width of the boundary surface 22a with the round bar portion 1b of the same width region 22 is A ', and the width A' of the same width region 22 is substantially equal to the diameter B of the round bar portion 1b. At this time, the sealing material 4 covers the round bar portion 1 b due to the presence of the same width region 22, but does not cover the wide region 13. That is, the end portion of the sealing material 4 is in contact with the same width region 22. The portion where the corrugation 21 is provided can be arbitrarily determined in view of the size of the lead wire, for example, the bonding method and bonding state with the electrode foil, but at least away from the region where the sealing material 4 abuts. It is desirable that

参考例、実施例１〜４および従来例に示した構造の引き出しリード線を用いて、φ６．３×５．４ｍｍＬサイズのチップ形（ＪＩＳ３２形）アルミニウム電解コンデンサを作製し、Ｘ線透過装置を用いてリードタブ接合部分での素子突き上げ発生数を比較した。その結果を表１に示す。素子突き上げは、Ｘ線透過装置にて透視し、素子頭部（収納容器底面側）において、巻回された電極箔の端面から平形タブ端子部が突出しているものを突き上げと判定した。
なお、参考例、実施例で使用した引き出しリード線の丸棒部は直径０．９６ｍｍ、平形タブ端子部幅は１．１ｍｍ、参考例のテーパー部長さは約０．５ｍｍであった。テーパー部の角度θは約６〜１２度の範囲である。参考例の場合、テーパー部角度は、テーパー部長さが短い程、封口材の押し上げ力を抑制するため、鋭角であることが好ましい。 Using the lead wires having the structures shown in the reference examples, examples 1 to 4 and the conventional example, a chip type (JIS32 type) aluminum electrolytic capacitor having a size of φ6.3 × 5.4 mmL was manufactured, and an X-ray transmission device was manufactured. The number of device push-up occurrences at the lead tab joint portion was compared. The results are shown in Table 1. Element push-up was seen through with an X-ray transmission device, and it was determined that a flat tab terminal portion protruding from the end face of the wound electrode foil at the element head (storage container bottom side) was pushed up.
In addition, the round bar part of the lead wire used in the reference examples and examples had a diameter of 0.96 mm, the flat tab terminal part width was 1.1 mm, and the taper part length of the reference example was about 0.5 mm. The angle θ of the tapered portion is in the range of about 6 to 12 degrees. In the case of the reference example , the taper portion angle is preferably an acute angle as the taper portion length is shorter in order to suppress the pushing-up force of the sealing material.

Figure 0004864767
Figure 0004864767

上記の表１から明らかな様に、本発明の引き出しリード線を用いた製品では素子突き上げ発生数が参考例、実施例１〜４ではなく、従来例での発生数に比べ明らかに素子突き上げの発生が抑制され、引き出しリード端子を封口材に挿通する際のタブ端子部の押し上げが抑制されていることが分かる。 As apparent from Table 1 above, in the products using the lead wires of the present invention, the number of element push- ups is not the reference example, Examples 1-4 , but clearly the element push-up compared to the number of occurrences in the conventional example. Generation | occurrence | production is suppressed and it turns out that pushing up of the tab terminal part at the time of inserting a drawer lead terminal into a sealing material is suppressed.

上記ではチップ形アルミニウム電解コンデンサにて評価実験を行ったが、類似した構造を持つリード形（ＪＩＳ０４形）アルミニウム電解コンデンサや、その他の電子部品についても同様の効果が得られることは明白である。   In the above, an evaluation experiment was performed using a chip-type aluminum electrolytic capacitor. However, it is obvious that the same effect can be obtained for a lead-type (JIS 04 type) aluminum electrolytic capacitor having a similar structure and other electronic components.

電子部品の一例として選択したアルミニウム電解コンデンサの構成概略図である。It is the structure schematic of the aluminum electrolytic capacitor selected as an example of an electronic component. （ａ）は従来の引き出しリード線の概略図であり、（ｂ）はその引き出しリード線を封口材に挿通した状態を表した模式図である。(A) is the schematic of the conventional drawer lead wire, (b) is the schematic diagram showing the state which penetrated the drawer lead wire to the sealing material. （ａ）は本発明の参考例の引き出しリード線の概略図、（ｂ）はその引き出しリード線を封口材に挿通した状態を表した模式図である。(A) is the schematic of the lead wire of the reference example of this invention, (b) is the schematic diagram showing the state which penetrated the lead wire to the sealing material. （ａ）は本発明の実施例１の引き出しリード線の概略図、（ｂ）はその引き出しリード線を封口材に挿通した状態を表した模式図である。(A) is the schematic of the lead lead wire of Example 1 of this invention, (b) is the schematic diagram showing the state which penetrated the lead lead wire to the sealing material. 本発明の実施例２の引き出しリード線の概略図である。It is the schematic of the drawer lead wire of Example 2 of this invention. 本発明の実施例３の引き出しリード線の概略図である。It is the schematic of the extraction lead wire of Example 3 of this invention. 本発明の実施例４の引き出しリード線の概略図である。It is the schematic of the drawer lead wire of Example 4 of this invention.

符号の説明Explanation of symbols

１ 引き出しリード線
１ａ 平形タブ端子部
１ｂ 丸棒部
１ｃ 引き出し線
２ コンデンサ素子
３ 収納容器
４ 封口材
１２ テーパー形状領域 DESCRIPTION OF SYMBOLS 1 Lead wire 1a Flat tab terminal part 1b Round bar part 1c Lead wire 2 Capacitor element 3 Storage container 4 Sealing material 12 Tapered area

Claims (2)

円柱状の丸棒部と、平形タブ端子部と、前記丸棒部に対して前記平形タブ端子部とは反対側に形成された引き出し線とを有し、電子部品素子から電極を取り出すためのリード線と、
前記リード線の平形タブ端子部に接合された電子部品素子と、
前記電子部品素子および前記リード線を収納する収納容器と、
前記収納容器の開口を封止する封口材とを備えており、
前記平形タブ端子部は、前記丸棒部よりも幅広である幅広領域と、前記平形タブ端子部と前記丸棒部との境界面から前記幅広領域に向けて連続し、前記幅広領域の幅方向において前記丸棒部の径と同じ幅を有する同幅領域とを有し、
前記リード線の丸棒部が前記封口材に被覆されていると共に、前記平形タブ端子部の幅広領域が前記封口材に被覆されていないことを特徴とする電子部品。 A cylindrical round bar portion, a flat tab terminal portion, and a lead wire formed on the opposite side of the round tab portion from the flat tab terminal portion, for extracting an electrode from an electronic component element Lead wires,
An electronic component element bonded to the flat tab terminal portion of the lead wire;
A storage container for storing the electronic component element and the lead wire;
A sealing material for sealing the opening of the storage container,
The flat tab terminal portion is continuous from the interface between the flat tab terminal portion and the round bar portion toward the wide region, and is wide in the width direction of the wide region. And having the same width region having the same width as the diameter of the round bar portion,
An electronic component, wherein a round bar portion of the lead wire is covered with the sealing material, and a wide region of the flat tab terminal portion is not covered with the sealing material. 前記平形タブ端子部が、前記幅広領域と前記同幅領域との間に、前記同幅領域に近づくにつれて曲線的に幅が小さくなる円弧形状領域を有していることを特徴とする請求項１に記載の電子部品。 2. The flat tab terminal portion has an arc-shaped region between the wide region and the same width region , which has an arc-shaped region whose width decreases in a curve as the width of the flat tab terminal portion approaches the same width region. Electronic components described in
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