JP4844520B2 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
JP4844520B2
JP4844520B2 JP2007248150A JP2007248150A JP4844520B2 JP 4844520 B2 JP4844520 B2 JP 4844520B2 JP 2007248150 A JP2007248150 A JP 2007248150A JP 2007248150 A JP2007248150 A JP 2007248150A JP 4844520 B2 JP4844520 B2 JP 4844520B2
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circuit board
emitting element
substrate
light emitting
light
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JP2007248150A
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JP2009080989A (en
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隆雄 宮井
隆介 小寺
明則 平松
理 棚橋
真理 藤本
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Description

本発明は、照明装置に関する。   The present invention relates to a lighting device.

従来から、有機ＥＬ素子等の発光素子を用いた照明装置が提供されており、例えば特許文献１に開示されているようなものがある。この従来例は、熱伝導層、第１の電極、絶縁層、有機層、第２の電極を有する積層体をガラス基板上に形成して成る照明装置であって、有機層は、蒸着等の方法によって正孔注入層、正孔輸送層、発光層、電子輸送層及び電子注入層を順次形成して成る。積層体の熱伝導層は、ガラス基板上の略全域に亘って形成されており、熱伝導層上に積層体を封止する封止ガラスが接着剤によって接合されるとともに、熱伝導層上における封止ガラスの外側には、複数の放熱フィンを有するヒートシンク（放熱部材）が接着剤によって接合されている。而して、高輝度で連続駆動する際に有機層から発する熱を熱伝導層を介してヒートシンクから放出することで、有機ＥＬ素子が劣化して発光輝度が低下するという問題を解消している。
特開２００６−２１０２１６号公報 2. Description of the Related Art Conventionally, lighting devices using light emitting elements such as organic EL elements have been provided, for example, as disclosed in Patent Document 1. This conventional example is an illuminating device in which a laminated body having a heat conductive layer, a first electrode, an insulating layer, an organic layer, and a second electrode is formed on a glass substrate. According to the method, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed. The heat conductive layer of the laminate is formed over substantially the entire area of the glass substrate, and a sealing glass that seals the laminate on the heat conductive layer is joined by an adhesive, A heat sink (heat radiating member) having a plurality of heat radiating fins is bonded to the outside of the sealing glass by an adhesive. Thus, the problem that the organic EL element is deteriorated and the light emission luminance is reduced by releasing the heat generated from the organic layer from the heat sink through the heat conductive layer when continuously driven with high luminance is eliminated. .
JP 2006-210216 A

ところで、上記従来例では、ガラス基板上に無機層・有機層を積層して封止する構造であるため、基板及び積層体の発光面を除いた部位を枠体で覆って保護することで、利用の際の安全性を高める必要がある。また、発光素子と発光素子に点灯電力を供給する点灯回路を備えた回路基板とを一体化した照明装置では、発光素子と回路基板とが枠体に取り付けられる。しかしながら、この枠体を樹脂材料で形成した場合、発光素子及び回路基板の双方の発熱によって、発光素子及び回路基板の双方の寿命を低下させるという問題があった。   By the way, in the above-mentioned conventional example, since it is a structure in which an inorganic layer and an organic layer are laminated and sealed on a glass substrate, by covering and protecting the portion excluding the light emitting surface of the substrate and the laminate with a frame, It is necessary to increase safety when using it. In a lighting device in which a light emitting element and a circuit board including a lighting circuit that supplies lighting power to the light emitting element are integrated, the light emitting element and the circuit board are attached to the frame. However, when this frame is formed of a resin material, there is a problem that the lifetimes of both the light emitting element and the circuit board are reduced due to the heat generated by both the light emitting element and the circuit board.

本発明は、上記の点に鑑みて為されたもので、発光素子及び回路基板の寿命の低下を抑えることのできる照明装置を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide an illuminating device that can suppress a decrease in the lifetime of a light emitting element and a circuit board.

請求項１の発明は、上記目的を達成するために、透光性を有する材料から成る基板、基板の一表面側に積層される第１の電極、第１の電極層の基板と反対側の面に積層されて少なくとも発光層を含む有機層、有機層の基板と反対側の面に積層される第２の電極、基板の前記一表面側に形成されて第１の電極と電気的に接続された第１の給電部、基板の前記一表面側に形成されて第２の電極と電気的に接続された第２の給電部から成る発光素子と、外部電源に接続されるとともに発光素子に点灯電力を供給する点灯回路を備えた回路基板と、回路基板と第１の給電部及び第２の給電部との間を各々電気的に接続する複数の給電部材とを備えた照明装置であって、回路基板は、樹脂材料によって封止され、回路基板と発光素子との間に金属製の板状部材を設けるとともに、板状部材と発光素子とを接触させたことを特徴とする。   In order to achieve the above object, the invention of claim 1 provides a substrate made of a light-transmitting material, a first electrode laminated on one surface side of the substrate, and a first electrode layer on the opposite side of the substrate. An organic layer including at least a light-emitting layer stacked on the surface, a second electrode stacked on the surface of the organic layer opposite to the substrate, and formed on the one surface side of the substrate and electrically connected to the first electrode A light-emitting element comprising a first power-feeding unit, a second power-feeding part formed on the one surface side of the substrate and electrically connected to the second electrode, and connected to an external power source and connected to the light-emitting element A lighting device comprising: a circuit board including a lighting circuit that supplies lighting power; and a plurality of power supply members that electrically connect between the circuit board and the first power supply unit and the second power supply unit. The circuit board is sealed with a resin material, and a metal plate is interposed between the circuit board and the light emitting element. Provided with a member, characterized in that contacting the light emitting element and a plate-like member.

請求項２の発明は、請求項１の発明において、板状部材は、回路基板及び発光素子を保持する金属製の枠体と一体に形成され、枠体は、回路基板を収納する収納凹部を有し、回路基板は、収納凹部に樹脂材料を充填することで封止されることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the invention, the plate-like member is formed integrally with a metal frame that holds the circuit board and the light emitting element, and the frame has a storage recess for storing the circuit board. The circuit board is sealed by filling the housing recess with a resin material.

本発明によれば、発光素子と回路基板との間に金属製の板状部材を設け、板状部材と発光素子とを接触させたので、装置駆動時における発光素子での発熱を板状部材を介して外部に放出することで発光素子の温度を下げることができ、したがって発光素子の寿命の低下を抑えることができる。また、回路基板を樹脂材料で封止したので、回路基板の放熱性・防水性・耐湿度性を高めることができ、したがって回路基板の寿命の低下を抑えることができる。   According to the present invention, the metal plate-like member is provided between the light-emitting element and the circuit board, and the plate-like member and the light-emitting element are brought into contact with each other. The temperature of the light-emitting element can be lowered by discharging to the outside through this, and therefore, the lifetime of the light-emitting element can be prevented from decreasing. In addition, since the circuit board is sealed with the resin material, the heat dissipation, waterproofness, and humidity resistance of the circuit board can be increased, and therefore the reduction in the life of the circuit board can be suppressed.

以下、本発明に係る照明装置の実施形態について図面を用いて説明する。尚、以下の説明では、特に断りの無い限りは図１（ａ）における上下左右を上下左右方向と定めるものとする。本実施形態は、図１（ａ）に示すように、略平板状に形成された発光素子１と、外部電源（図示せず）に接続されるとともに発光素子１に点灯電力を供給する点灯回路を備えた回路基板４と、回路基板４と発光素子１との間を電気的に接続する複数（図示では２つ）のピン状の給電部材２と、少なくとも一部が発光素子１と接触するとともに発光素子１を保持する枠体３とから成る。   Hereinafter, an embodiment of a lighting device according to the present invention will be described with reference to the drawings. In the following description, unless otherwise specified, the vertical and horizontal directions in FIG. 1A are defined as the vertical and horizontal directions. In the present embodiment, as shown in FIG. 1A, a light emitting element 1 formed in a substantially flat plate shape and a lighting circuit that is connected to an external power source (not shown) and supplies lighting power to the light emitting element 1. , A plurality (two in the drawing) of pin-shaped power supply members 2 that electrically connect the circuit board 4 and the light emitting element 1, and at least a part of which is in contact with the light emitting element 1. And a frame 3 for holding the light emitting element 1.

発光素子１は、図２に示すように、透光性を有する材料から成る基板１０と、基板１０に積層される有機材料から成る有機発光層１１と、有機発光層１１を挟んで設けられる陽極となる第１の電極層１２及び陰極となる第２の電極層１３と、第１の電極層１２及び第２の電極層１３を覆うように設けられて有機発光層１１を封止する封止層１４と、第１の電極層１２及び第２の電極層１３に各々接続されて外部電源Ａから電圧を供給するための第１の給電部１５、第２の給電部１６とから成る。   As shown in FIG. 2, the light-emitting element 1 includes a substrate 10 made of a light-transmitting material, an organic light-emitting layer 11 made of an organic material laminated on the substrate 10, and an anode provided with the organic light-emitting layer 11 interposed therebetween. The first electrode layer 12 to be and the second electrode layer 13 to be the cathode, and the sealing for sealing the organic light emitting layer 11 provided so as to cover the first electrode layer 12 and the second electrode layer 13 The layer 14 includes a first power feeding unit 15 and a second power feeding unit 16 that are connected to the first electrode layer 12 and the second electrode layer 13 and supply a voltage from the external power source A, respectively.

基板１０は、有機発光層１１を支持するための平板状の部材であって、例えばガラス等の透光性を有する材料から成る。有機発光層１１は、蛍光物質の有機材料又は蛍光物質を含む有機材料から成る発光層を少なくとも含んで構成され、必要に応じて正孔注入層、正孔輸送層、電子輸送層、電子注入層等を含んで構成される。   The substrate 10 is a flat plate-like member for supporting the organic light emitting layer 11 and is made of a light-transmitting material such as glass. The organic light emitting layer 11 includes at least a light emitting layer made of an organic material of a fluorescent material or an organic material containing a fluorescent material, and if necessary, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer Etc. are configured.

第１の電極層１２は、透光性を有する材料から成る導電性の薄膜であって、例えばインジウム・すず酸化物（Indium Tin Oxide：ITO）等で形成される。尚、第１の電極層１２は、その一部が基板１０の長手方向における一方の端部側に後述する封止層１４から露出するように引き出され、陽極端子部１２ａを形成している。   The first electrode layer 12 is a conductive thin film made of a light-transmitting material, and is formed of, for example, indium tin oxide (ITO) or the like. The first electrode layer 12 is drawn out so that a part of the first electrode layer 12 is exposed from a sealing layer 14 described later on one end side in the longitudinal direction of the substrate 10 to form an anode terminal portion 12a.

第２の電極層１３は、有機発光層１１で発光する光を反射する材料から成る導電性の薄膜であって、例えば、アルミニウム（Al）、アルミリチウム（Al：Li）、マグネシウム銀（Mg：Ag）等の金属や合金などで形成される。本実施形態では、導電性、反射率及びコスト等の観点から、第２の電極層１３はアルミニウムで形成されている。第２の電極層１３は、その一部が基板１０の長手方向における他方の端部側に後述する封止層１４から露出するように引き出され、陰極端子部１３ａを形成している。   The second electrode layer 13 is a conductive thin film made of a material that reflects light emitted from the organic light emitting layer 11. For example, aluminum (Al), aluminum lithium (Al: Li), magnesium silver (Mg: Ag) or other metal or alloy. In the present embodiment, the second electrode layer 13 is made of aluminum from the viewpoints of conductivity, reflectance, cost, and the like. A part of the second electrode layer 13 is drawn out so as to be exposed from a sealing layer 14 described later on the other end side in the longitudinal direction of the substrate 10 to form a cathode terminal portion 13a.

封止層１４は、基板１０と併せて有機発光層１１を気密に封止するための絶縁性を有する薄膜であって、例えばシリコン樹脂等から形成される。封止層１４は、第２の電極層１３の図２における上面及び右側面を覆うとともに、有機発光層１１の左側面を覆うように形成される。   The sealing layer 14 is an insulating thin film for hermetically sealing the organic light emitting layer 11 together with the substrate 10 and is formed of, for example, a silicon resin. The sealing layer 14 is formed so as to cover the upper surface and the right side surface of the second electrode layer 13 in FIG. 2 and the left side surface of the organic light emitting layer 11.

第１の給電部１５及び第２の給電部１６は、何れも例えばクロムめっきから形成され、一端が陽極端子部１２ａ若しくは陰極端子部１３ａと接続される幅寸法の短い細幅部１５ａ，１６ａと、細幅部１５ａ，１６ａの各他端と一体に形成されて外部電源Ａからの給電部材２が接続される幅寸法の長い太幅部１５ｂ，１６ｂとから成る。尚、各給電部１５，１６は何れも封止層１４の外側に形成される。   The first power supply unit 15 and the second power supply unit 16 are both made of, for example, chrome plating, and have narrow width portions 15a and 16a having short widths, one end of which is connected to the anode terminal portion 12a or the cathode terminal portion 13a. The narrow width portions 15a and 16b are formed integrally with the other ends of the narrow width portions 15a and 16a, and the wide width portions 15b and 16b having long widths to which the power supply member 2 from the external power source A is connected. Each of the power supply portions 15 and 16 is formed outside the sealing layer 14.

回路基板４は、その下面に各種電子部品４ａが実装されており、例えば商用電源の交流出力を全波整流するダイオードブリッジから成る整流回路と、整流された脈流電圧を平滑化するコンデンサと、平滑化された直流電圧を発光素子１の定格に応じた電圧に変換するＤＣ−ＤＣコンバータ回路とから成る点灯回路が構成されている。尚、このような回路は周知であるので、ここでは図示及び詳細な説明を省略する。また、回路基板４は、外部電源と電気的に接続される外部端子部（図示せず）を有するとともに、発光素子１の各端子部１５，１６と給電部材２を介して電気的に接続される給電端子部（図示せず）を有する。   Various electronic components 4a are mounted on the lower surface of the circuit board 4, for example, a rectifier circuit composed of a diode bridge for full-wave rectification of an AC output of a commercial power supply, a capacitor for smoothing the rectified pulsating voltage, A lighting circuit including a DC-DC converter circuit that converts the smoothed DC voltage into a voltage corresponding to the rating of the light emitting element 1 is configured. Since such a circuit is well known, illustration and detailed description thereof are omitted here. The circuit board 4 has an external terminal portion (not shown) that is electrically connected to an external power source, and is electrically connected to the terminal portions 15 and 16 of the light emitting element 1 via the power supply member 2. A power supply terminal portion (not shown).

而して、回路基板４の外部端子部と外部電源とをリード線７を介して接続するとともに、発光素子１の各給電部１５，１６と回路基板４の給電端子部との間に給電部材２を接続し、陽極端子部１２ａと陰極端子部１３ａとの間に直流電圧を印加することで有機発光層１１が可視光を発光する。この有機発光層１１で発光した光は、直接或いは第２の電極層１２で反射することにより、基板１０の図２における下面から取り出され、基板１０の前記下面が面状発光する（以下では、基板１０の面状発光する面を「発光面１０ａ」と呼ぶものとする）。尚、回路基板４の給電端子部と給電部材２との接続は、半田付けやねじ止めによって行われる。   Thus, the external terminal portion of the circuit board 4 and the external power source are connected via the lead wire 7, and the power supply member is provided between the power supply portions 15 and 16 of the light emitting element 1 and the power supply terminal portion of the circuit board 4. 2 and connecting the anode terminal portion 12a and the cathode terminal portion 13a to apply a DC voltage, the organic light emitting layer 11 emits visible light. The light emitted from the organic light emitting layer 11 is taken out from the lower surface of the substrate 10 in FIG. 2 directly or by being reflected by the second electrode layer 12, and the lower surface of the substrate 10 emits planar light (hereinafter, The surface of the substrate 10 that emits light in a planar manner is called “light emitting surface 10a”). The connection between the power supply terminal portion of the circuit board 4 and the power supply member 2 is performed by soldering or screwing.

枠体３は、例えば鉄、銅、ステンレス鋼等の金属材料から形成され、図１（ａ）に示すように、略平板状の本体部３０と、本体部３０の左右両端部から下方に突出して形成された略鈎形の保持部３１とから構成される。尚、本実施形態では、熱伝導率や重量を考慮してアルミニウムで形成されている。本体部３０の下面には、発光素子１が発光面１０ａを下向きにした状態で配設される。この際、発光素子１は封止層１４が本体部３０と当接するとともに、各給電部１５，１６が本体部３０と上下方向に間隔を空けて配設されるので、各給電部１５，１６が本体部３０と接触して短絡しないようになっている。保持部３１は、各々の先端部が互いに近づく方向に突出しており、これら先端部と本体部３０との間に発光素子１が保持されることで、発光素子１と枠体３との間の密着が長期に亘って維持されるようになっている。また、本体部３０の左右両端部には、それぞれ給電部材２を挿通させるための挿通孔３０ａが貫設されている。   The frame 3 is formed of a metal material such as iron, copper, and stainless steel, for example, and protrudes downward from the substantially flat main body 30 and the left and right ends of the main body 30 as shown in FIG. It is comprised from the substantially bowl-shaped holding | maintenance part 31 formed in this way. In the present embodiment, aluminum is formed in consideration of thermal conductivity and weight. The light emitting element 1 is disposed on the lower surface of the main body 30 with the light emitting surface 10a facing downward. At this time, the light-emitting element 1 has the sealing layer 14 in contact with the main body portion 30 and the power feeding portions 15 and 16 are spaced apart from the main body portion 30 in the vertical direction. Is in contact with the main body 30 so as not to be short-circuited. The holding portion 31 protrudes in a direction in which the respective front end portions approach each other, and the light emitting element 1 is held between the front end portion and the main body portion 30, so that the space between the light emitting element 1 and the frame body 3 is held. Adhesion is maintained over a long period of time. Further, insertion holes 30 a for inserting the power supply member 2 are provided in both the left and right ends of the main body 30.

回路基板４は、図１（ａ）に示すように、略柱状の一対の固定部６によって枠体３の本体部３０上面に取付固定されている。固定手段としては、例えばかしめ固定やねじ止め等が挙げられる。また、回路基板４は、枠体３に取付固定された状態で全体を絶縁性を有する樹脂材料５によって封止される。而して、回路基板４を樹脂材料５で封止することで回路基板４の放熱性・防水性・耐湿度性を高めることができる。尚、回路基板４を樹脂材料５によって封止する際に、樹脂材料５が挿通孔３０ａを介して発光素子１側に漏れ出ないように、給電部材２の周囲を絶縁性部材（図示せず）で覆っている。また、該絶縁性部材によって給電部材２と枠体３とが短絡するのを防いでいる。   As shown in FIG. 1A, the circuit board 4 is fixedly attached to the upper surface of the main body 30 of the frame 3 by a pair of substantially columnar fixing parts 6. Examples of the fixing means include caulking and screwing. In addition, the circuit board 4 is entirely sealed with an insulating resin material 5 while being fixedly attached to the frame 3. Thus, by sealing the circuit board 4 with the resin material 5, the heat dissipation, waterproofness, and humidity resistance of the circuit board 4 can be improved. Note that when the circuit board 4 is sealed with the resin material 5, an insulating member (not shown) is provided around the power supply member 2 so that the resin material 5 does not leak to the light emitting element 1 side through the insertion hole 30a. ). Further, the insulating member prevents the power feeding member 2 and the frame 3 from being short-circuited.

上述のように、発光素子１と回路基板４との間に金属製の枠体３の本体部３０を設け、発光素子１を本体部３０に接触させたので、装置駆動時における発光素子１での発熱を枠体３を介して外部に放出することで発光素子１の温度を下げることができ、したがって発光素子１の寿命の低下を抑えることができる。また、回路基板４を樹脂材料５で封止したので、回路基板４の放熱性・防水性・耐湿度性を高めることができ、したがって回路基板４の寿命の低下を抑えることができる。   As described above, since the main body 30 of the metal frame 3 is provided between the light emitting element 1 and the circuit board 4 and the light emitting element 1 is brought into contact with the main body 30, the light emitting element 1 at the time of driving the device is used. The temperature of the light emitting element 1 can be lowered by releasing the heat generated through the frame 3 to the outside, and hence the lifetime of the light emitting element 1 can be prevented from being reduced. In addition, since the circuit board 4 is sealed with the resin material 5, the heat dissipation, waterproofness, and humidity resistance of the circuit board 4 can be improved, and therefore the life of the circuit board 4 can be prevented from being reduced.

尚、図１（ｂ）に示すように、枠体３の本体部３０上面外周縁から全周に亘って上方に突出する壁部３２を設け、該壁部３２及び本体部３０に囲繞される部位に回路基板４を収納する収納凹部３３を形成し、該収納凹部３３に例えばエポキシ樹脂やウレタン樹脂等の樹脂材料５を充填して硬化させることで、回路基板４を封止する構成を適用しても構わない。このように構成した場合にも、上記と同様の効果を奏することができる。尚、本実施形態の枠体３は、例えば板金の曲げ溶接加工やダイキャスト成形等で製作することができる。また、外部電源と回路基板４との間の配線は、本実施形態のリード線７による配線に限定されるものではなく、例えば回路基板４の外部端子部にコネクタを設け、外部電源から引き回されるケーブルのコネクタと接続する配線でも構わない。   As shown in FIG. 1 (b), a wall portion 32 that protrudes upward from the outer peripheral edge of the upper surface of the main body portion 30 of the frame body 3 is provided, and is surrounded by the wall portion 32 and the main body portion 30. A configuration in which the circuit board 4 is sealed by forming a storage recess 33 for storing the circuit board 4 in a portion and filling the storage recess 33 with a resin material 5 such as an epoxy resin or a urethane resin and curing it. It doesn't matter. Even when configured in this manner, the same effects as described above can be obtained. The frame body 3 of the present embodiment can be manufactured by, for example, bending welding of a sheet metal or die casting. Further, the wiring between the external power supply and the circuit board 4 is not limited to the wiring by the lead wire 7 of the present embodiment. For example, a connector is provided on the external terminal portion of the circuit board 4 and is routed from the external power supply. It may be a wiring connected to the connector of the cable to be used.

本発明の照明装置の実施形態を示す図で、（ａ）は概略図で、（ｂ）は枠体に収納凹部を設けた場合の概略図である。It is a figure which shows embodiment of the illuminating device of this invention, (a) is schematic, (b) is schematic when the accommodation recessed part is provided in the frame. 同上の発光素子を示す概略図である。It is the schematic which shows a light emitting element same as the above.

符号の説明Explanation of symbols

１ 発光素子
１０ 基板
１１ 有機発光層
１２ 第１の電極層
１３ 第２の電極層
１４ 封止層
１５ 第１の給電部
１６ 第２の給電部
２ 給電部材
３ 枠体
３０ 本体部
３０ａ 挿通孔
３１ 保持部
４ 回路基板
５ 樹脂材料 DESCRIPTION OF SYMBOLS 1 Light emitting element 10 Board | substrate 11 Organic light emitting layer 12 1st electrode layer 13 2nd electrode layer 14 Sealing layer 15 1st electric power feeding part 16 2nd electric power feeding part 2 Electric power feeding member 3 Frame 30 Main body part 30a Insertion hole 31 Holding part 4 Circuit board 5 Resin material

Claims (2)

透光性を有する材料から成る基板、基板の一表面側に積層される第１の電極、第１の電極層の基板と反対側の面に積層されて少なくとも発光層を含む有機層、有機層の基板と反対側の面に積層される第２の電極、基板の前記一表面側に形成されて第１の電極と電気的に接続された第１の給電部、基板の前記一表面側に形成されて第２の電極と電気的に接続された第２の給電部から成る発光素子と、外部電源に接続されるとともに発光素子に点灯電力を供給する点灯回路を備えた回路基板と、回路基板と第１の給電部及び第２の給電部との間を各々電気的に接続する複数の給電部材とを備えた照明装置であって、回路基板は、樹脂材料によって封止され、回路基板と発光素子との間に金属製の板状部材を設けるとともに、板状部材と発光素子とを接触させたことを特徴とする照明装置。   A substrate made of a light-transmitting material, a first electrode stacked on one surface of the substrate, an organic layer including at least a light-emitting layer stacked on a surface of the first electrode layer opposite to the substrate, and an organic layer A second electrode laminated on the surface opposite to the substrate, a first power feeding part formed on the one surface side of the substrate and electrically connected to the first electrode, on the one surface side of the substrate A circuit board including a light emitting element formed of a second power feeding portion formed and electrically connected to the second electrode, a lighting circuit connected to an external power supply and supplying lighting power to the light emitting element; A lighting device including a plurality of power supply members that electrically connect between a substrate and a first power supply unit and a second power supply unit, wherein the circuit board is sealed with a resin material. A metal plate-like member is provided between the light-emitting element and the light-emitting element. Lighting device is characterized in that in contact. 前記板状部材は、回路基板及び発光素子を保持する金属製の枠体と一体に形成され、枠体は、回路基板を収納する収納凹部を有し、回路基板は、収納凹部に樹脂材料を充填することで封止されることを特徴とする請求項１記載の照明装置。   The plate-like member is formed integrally with a metal frame that holds the circuit board and the light emitting element, the frame has a storage recess for storing the circuit board, and the circuit board is made of a resin material in the storage recess. The lighting device according to claim 1, wherein the lighting device is sealed by filling.
JP2007248150A 2007-09-25 2007-09-25 Lighting device Expired - Fee Related JP4844520B2 (en)

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