JP4842201B2 - チップモジュール、チップカード - Google Patents
チップモジュール、チップカード Download PDFInfo
- Publication number
- JP4842201B2 JP4842201B2 JP2007119711A JP2007119711A JP4842201B2 JP 4842201 B2 JP4842201 B2 JP 4842201B2 JP 2007119711 A JP2007119711 A JP 2007119711A JP 2007119711 A JP2007119711 A JP 2007119711A JP 4842201 B2 JP4842201 B2 JP 4842201B2
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- chip
- contact
- substrate
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- connection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
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Description
本発明は、基板に適用された接触領域を備えたチップモジュールと接触領域を有するチップカードとに関し、両方の装置は、チップ接続領域を有するチップを備え、上記チップ接続領域は上記接触領域に電気的に導電的に接続されている。
図1は、チップ上面2と接触上面3とを有する基板1を備えているチップモジュールを示している。上記基板1は、好ましくは、繊維強化エポキシ樹脂から構成される。上記基板1は、構造化手法でチップ上面2と接触上面3との両方においてメタライゼーションされている。上記基板1の上記接触上面3の構造化されたメタライゼーションは接触領域4を形成する。これらの接触領域4は、例えば、少なくとも寸法に関して、チップカード用のISO標準規格に合うような方法で配置される。
2 チップ上面
3 接触上面
4 接触領域、メタライゼーション
5 導体構造
6 通路
7 封止部の縁
8 チップ
9 チップ接続接点
10 封止部
11 ワイヤボンド接続(第2の部品)
11’ ワイヤボンド接続(第1の部品)
12 接着剤
13 中間接触素子、メタライゼーション
14 接着剤
15 外縁
16 コイル接続接点
17 封止部の輪郭
18 接触領域
19 接触領域
20 領域
21 チップ輪郭
22 銅層
23 層の順序
Claims (2)
- チップ上面(2)とチップ上面(2)の反対側の接触上面(3)とを有する基材(1)と、
基材(1)のチップ上面(2)に取り付けられたチップ(8)と、
基材(1)の接触上面(3)に形成された接触領域(4)と、
基材(1)のチップ上面(2)に形成された中間接触素子(13)と、
基材(1)に形成された通路(6)と、
少なくとも1つの、第1の部品(11’)と第2の部品(11)との2つの部品から成るワイヤボンド接続とを備え、
第1の部品(11’)は、少なくとも1つの通路(6)内の接触領域(4)から中間接触素子(13)に接続され、第2の部品(11)は、中間接触素子(13)からチップ(8)上のチップ接続接点(9)に接続されており、
上記中間接触素子(13)、および、接触領域(4)は、金属層として形成され、上記金属層は、3つの異なる副層から成り、
上記通路(6)は、0.5mmから0.3mmの間の口径を有し、
中間接触素子(13)を形成している上記金属層と接触領域(4)を形成している金属層とが、通路(6)の壁面に形成された金属層によって電気的に接続されることを特徴とするチップモジュール。 - 請求項1に記載のチップモジュールが格納される凹部を有するチップカードであって、
上記凹部は、上記チップモジュールの上記接触領域(4)を有する上記基材(1)で覆われていることを特徴とするチップカード。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006019925.1 | 2006-04-28 | ||
DE102006019925A DE102006019925B4 (de) | 2006-04-28 | 2006-04-28 | Chipmodul, Chipkarte und Verfahren zum Herstellen dieser |
Publications (2)
Publication Number | Publication Date |
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JP2007300121A JP2007300121A (ja) | 2007-11-15 |
JP4842201B2 true JP4842201B2 (ja) | 2011-12-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007119711A Active JP4842201B2 (ja) | 2006-04-28 | 2007-04-27 | チップモジュール、チップカード |
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JP (1) | JP4842201B2 (ja) |
DE (1) | DE102006019925B4 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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FR3013504B1 (fr) | 2013-11-18 | 2022-06-10 | Interplex Microtech | Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04269841A (ja) * | 1991-02-26 | 1992-09-25 | Sharp Corp | 半導体装置 |
JP2660397B2 (ja) * | 1995-04-10 | 1997-10-08 | イビデン株式会社 | Icカード用プリント配線板 |
JPH10189636A (ja) * | 1996-12-24 | 1998-07-21 | Hitachi Chem Co Ltd | 半導体パッケ−ジ |
DE19929610C1 (de) * | 1999-06-28 | 2000-10-12 | Giesecke & Devrient Gmbh | Chipmodul, Chipkarte und Verfahren zu deren Herstellung |
JP4450921B2 (ja) * | 2000-01-19 | 2010-04-14 | 大日本印刷株式会社 | Icカード用icチップ実装基板 |
DE10151941A1 (de) * | 2001-10-22 | 2003-01-02 | Infineon Technologies Ag | Chipmodul und Chipkarte oder Speicherkarte |
JP4422494B2 (ja) * | 2003-05-07 | 2010-02-24 | 大日本印刷株式会社 | Icカードおよびsim |
EP1513032A1 (fr) * | 2003-09-02 | 2005-03-09 | The Swatch Group Management Services AG | Objet à carcasse métallique comprenant un module électronique pour la mémorisation d'informations, et module électronique pour un tel objet |
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2006
- 2006-04-28 DE DE102006019925A patent/DE102006019925B4/de not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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DE102006019925A1 (de) | 2007-10-31 |
JP2007300121A (ja) | 2007-11-15 |
DE102006019925B4 (de) | 2010-09-16 |
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