JP4829647B2 - プリント配線板及びその製造方法 - Google Patents
プリント配線板及びその製造方法 Download PDFInfo
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- JP4829647B2 JP4829647B2 JP2006065010A JP2006065010A JP4829647B2 JP 4829647 B2 JP4829647 B2 JP 4829647B2 JP 2006065010 A JP2006065010 A JP 2006065010A JP 2006065010 A JP2006065010 A JP 2006065010A JP 4829647 B2 JP4829647 B2 JP 4829647B2
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- Prior art keywords
- resin
- copper
- copper foil
- layer
- printed wiring
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 211
- 229910052802 copper Inorganic materials 0.000 claims description 125
- 239000010949 copper Substances 0.000 claims description 125
- 238000007747 plating Methods 0.000 claims description 91
- 239000011889 copper foil Substances 0.000 claims description 86
- 229920005989 resin Polymers 0.000 claims description 73
- 239000011347 resin Substances 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 41
- 239000000805 composite resin Substances 0.000 claims description 33
- 229920001721 polyimide Polymers 0.000 claims description 31
- 238000005530 etching Methods 0.000 claims description 30
- 239000011342 resin composition Substances 0.000 claims description 30
- 239000004642 Polyimide Substances 0.000 claims description 20
- 150000001875 compounds Chemical class 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000009719 polyimide resin Substances 0.000 claims description 11
- -1 maleimide compound Chemical class 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 229920001400 block copolymer Polymers 0.000 claims description 7
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 3
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 claims description 2
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 description 106
- 239000003822 epoxy resin Substances 0.000 description 18
- 229920000647 polyepoxide Polymers 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000000243 solution Substances 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000004643 cyanate ester Substances 0.000 description 5
- 239000002798 polar solvent Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 2
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 2
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000012661 block copolymerization Methods 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
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- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
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- 239000008096 xylene Substances 0.000 description 2
- HMHLDAMOJGEOMQ-UHFFFAOYSA-N (1-cyanato-4-phenylcyclohexa-2,4-dien-1-yl) cyanate Chemical group C1=CC(OC#N)(OC#N)CC=C1C1=CC=CC=C1 HMHLDAMOJGEOMQ-UHFFFAOYSA-N 0.000 description 1
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- YDCUTCGACVVRIQ-UHFFFAOYSA-N (3,6-dicyanatonaphthalen-1-yl) cyanate Chemical compound N#COC1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 YDCUTCGACVVRIQ-UHFFFAOYSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
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- GXFRMDVUWJDFAI-UHFFFAOYSA-N [2,6-dibromo-4-[2-(3,5-dibromo-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Br)=C(OC#N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OC#N)C(Br)=C1 GXFRMDVUWJDFAI-UHFFFAOYSA-N 0.000 description 1
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- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- PPZSVSGWDQKBIW-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphanyloxyphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OP(OC=1C=CC(OC#N)=CC=1)OC1=CC=C(OC#N)C=C1 PPZSVSGWDQKBIW-UHFFFAOYSA-N 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
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- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
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- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
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- 238000001308 synthesis method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明のプリント配線板の製造方法において、樹脂複合銅箔の樹脂層厚みは、より好ましくは、0.1μm〜10μmである。
(合成例)
ステンレス製の碇型攪拌棒、窒素導入管とストップコックのついたトラップ上に、玉付冷却管を取り付けた還流冷却器を取り付けた2リットルの三つ口フラスコに、3,4、3',4'-ビフェニルテトラカルボン酸二無水物 117.68g(400mmol)、1,3-ビス(3-アミノフェノキシ)ベンゼン 87.7g(300mmol)、γ-バレロラクトン 4.0g(40mmol)、ピリジン 4.8g(60mmol)、N-メチル-2-ピロリドン(以下NMPと記す) 300g、トルエン 20gを加え、180℃で1時間加熱した後室温付近まで冷却した後、3,4、3',4'-ビフェニルテトラカルボン酸二無水物 29.42g(100mmol)、2,2-ビス{4-(4-アミノフェノキシ)フェニル}プロパン 82.12g(200mmol)、NMP 200g、トルエン 40gを加え、室温で1時間混合後、180℃で3時間加熱して、固形分 38%のブロック共重合ポリイミドを得た。このブロック共重合ポリイミドは、一般式(1):一般式(2)=3:2であり、数平均分子量:70000、重量平均分子量:150000であった。
合成例で得られたブロック共重合ポリイミド溶液をNMPで更に希釈し、固形分 10%のブロック共重合ポリイミド溶液とした。このブロック共重合ポリイミド溶液にビス(4-マレイミドフェニル)メタン(BMI-H、ケイ・アイ化成)を表1に記載した固形分重量比率で各々60℃、20分間溶解混合して各々樹脂溶液とした後、厚み 12μmの電解銅箔(F0-WS箔 Rz=1.5μm、古河サーキットフォイル製)のマット面に、リバースロール塗工機を用いて塗工し、窒素雰囲気下で、120℃で3分間、160℃で3分間乾燥処理後、最後に300℃で2分間加熱処理を行い、各々樹脂複合銅箔を作製した。
実施例1〜4において、無電解メッキ液により、厚さ1μmの銅層を形成する工程までは実施例1〜4と同様に行い、次いで厚さ15μmのメッキレジストフィルムを貼り付け、露光、現像して銅回路を形成する場所以外をメッキレジストで被覆(レジスト残り幅9μm、レジスト開溝幅15μm)した後、メッキレジストを剥離し、硫酸銅メッキ液を用い、1.5アンペア/ dm2で50分間電解銅メッキを行い、厚さ17μmの銅回路を各々形成した。ついで、過酸化水素/硫酸エッチング液(三菱ガス化学製 商品名 CPE800)でエッチングをおこない、線幅/線間隔が約12/12μmの回路を形成した後、130℃の加熱炉で2時間加熱してプリント配線板を各々作製した。評価結果を表2に示す。
実施例1、5において、ビスマレイミドを使用しない以外は、実施例1、5と同様にして行い、プリント配線板を作製した。評価結果を表3に示す。
1)全体厚み:
JIS C6481に準じて、樹脂複合銅箔(サイズ500×500mm)の厚みをマイクロメータにて5ケ所測定した平均値。
2)銅メッキ接着力:
0.4mmの銅張積層板の銅箔を全面エッチングした積層板を使用し、回路形成することなく、無電解メッキと電解銅メッキを行った全面銅メッキ層積層板を作製し、JIS C6481に準じて、3回測定した平均値。
3)吸湿耐熱性:
プリント配線板を50mm×50mm角に切断し、プレシッヤークッカー試験機(平山製作所製PC-3型)で121℃、2気圧で所定時間処理後、260℃の半田槽に60秒間フロートさせて、外観変化の異常の有無を目視にて観察した。(○:異常なし、×:膨れ、剥がれが発生)
2 樹脂層
3 Bステージ樹脂組成物層
4 スルーホール
5 無電解銅メッキ層
6 電解銅メッキ層
7 回路
Claims (7)
- 銅箔の片面にブロック共重合ポリイミド樹脂とポリマレイミド化合物を含有する樹脂層を形成した樹脂複合銅箔の樹脂層面に、Bステージ樹脂組成物層を重ね、積層成形して銅張積層板とした後、該銅張積層板の銅箔をすべてエッチング除去し、樹脂層表面を露出させて積層板とし、該積層板の樹脂層表面を凹凸処理することなく、無電解銅メッキにより無電解銅メッキ層を形成し、次いで無電解銅メッキ層の上に電解銅メッキにより電解銅メッキ層を形成した後、無電解銅メッキ層と電解銅メッキ層を、選択的にエッチング除去して銅回路を形成するプリント配線板の製造方法において、該ブロック共重合ポリイミドが、一般式(1)及び一般式(2)で表される構造単位を有するブロック共重合ポリイミド樹脂であり、かつ該ポリマレイミド化合物が4,4”−ジフェニルメタンビスマレイミド、ポリフェニルメタンマレイミド、m−フェニレンビスマレイミド、ビスフェノールAジフェニルエーテルビスマレイミド、3,3”−ジメチル−5,5”−ジエチル−4,4”−ジフェニルメタンビスマレイミドから選ばれるいずれか一種または二種以上であるプリント配線板の製造方法。
- 銅箔の片面にブロック共重合ポリイミド樹脂とポリマレイミド化合物を含有する樹脂層を形成した樹脂複合銅箔の樹脂層面に、Bステージ樹脂組成物層を重ね、積層成形して銅張積層板とした後、該銅張積層板の銅箔をすべてエッチング除去し、樹脂層表面を露出させて積層板とし、該積層板の樹脂層表面を凹凸処理することなく、無電解銅メッキにより無電解銅メッキ層を形成し、次いで無電解銅メッキ層の上に選択的に電解銅メッキ層を形成した後、少なくとも電解銅メッキ層が形成されていない無電解銅メッキ層をエッチング除去して銅回路を形成するプリント配線板の製造方法。
- 請求項1および請求項2記載のプリント配線板の製造方法において、無電解メッキ層または電解銅メッキ層を形成した後に、100℃〜200℃で加熱処理をすることを特徴とするプリント配線板の製造方法。
- 該樹脂複合銅箔の樹脂層厚みが0.1μm〜10μmである樹脂複合銅箔である請求項1〜3のいずれかに記載のプリント配線板の製造方法。
- 該樹脂複合銅箔の樹脂層におけるブロック共重合ポリイミドとマレイミド化合物との含有割合が、重量比で10〜90:90〜10である樹脂複合銅箔である請求項1〜4のいずれかに記載のプリント配線板の製造方法。
- 該樹脂複合銅箔が、銅箔の片面に該ブロック共重合ポリイミドと該マレイミド化合物を含有する樹脂溶液を塗工した後、250〜360℃の加熱処理工程を経てなる、200℃以下では、溶融しない樹脂層を形成した樹脂複合銅箔である請求項1〜5のいずれかに記載のプリント配線板の製造方法。
- 請求項1〜6のいずれかに記載のプリント配線板の製造方法で得られるプリント配線板。
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KR1020070008038A KR101308119B1 (ko) | 2006-01-25 | 2007-01-25 | 수지 복합 동박, 인쇄 배선 기판 및 그 제조 방법 |
US11/657,529 US7989081B2 (en) | 2006-01-25 | 2007-01-25 | Resin composite copper foil, printed wiring board, and production processes thereof |
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JP5470487B1 (ja) * | 2013-05-29 | 2014-04-16 | Jx日鉱日石金属株式会社 | 銅箔、それを用いた半導体パッケージ用銅張積層体、プリント配線板、プリント回路板、樹脂基材、回路の形成方法、セミアディティブ工法、半導体パッケージ用回路形成基板及び半導体パッケージ |
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