JP4824937B2 - Arrangement method of electrical wiring pair or electrode pair - Google Patents
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本発明は、電気配線対あるいは電極対の配置方法に関し、詳細には、直流用の電気配線対あるいは電極対において電流リークによる配線劣化を抑制する電気配線対あるいは電極対の配置方法に関するものである。 The present invention relates to a method for arranging an electric wiring pair or an electrode pair, and more particularly to a method for arranging an electric wiring pair or an electrode pair for suppressing deterioration of wiring due to current leakage in a DC electric wiring pair or electrode pair. .
電子機器、電子部品などには電流を目的の機器に流すために多くの電気配線が使用されており、配線材料として高い電気導電率や熱伝導率を有する銅合金が一般的に利用されている。そして、これらの配線が樹脂やセラミックなどの被覆をされることなく使われることがある。例えば、民生用コンセントの受け刃部分やプラグ、各種電気製品の電線と電線をつなぐ電極、車載の金属導体接続片、あるいは電子機器用プリント基板などがその代表例である。このように配線用金属が空気中に露出する部分では、空気中の水分が配線に結露するなどして配線用金属の劣化を引き起こすことがある。特に、配線と配線が隣接し、なおかつ、配線間に加わる電位差が高い場合には配線間に電流リークが生じ、やがては絶縁破壊などの深刻な劣化をひきおこすことになる。これは電子機器や電気機器の正常な動作を妨げるだけでなく、やがては発熱による火災をも引き起こすこともある。 Many electrical wirings are used for electronic devices, electronic parts, etc. in order to flow current to the target device, and copper alloys having high electrical conductivity and thermal conductivity are generally used as wiring materials. . These wirings may be used without being coated with a resin or ceramic. Typical examples include consumer blade receptacles and plugs, electrodes of various electrical products, electrodes for connecting electric wires, in-vehicle metal conductor connection pieces, printed boards for electronic devices, and the like. As described above, in the portion where the wiring metal is exposed to the air, moisture in the air may be condensed on the wiring and the wiring metal may be deteriorated. In particular, when the wirings are adjacent to each other and the potential difference applied between the wirings is high, current leakage occurs between the wirings, which eventually causes serious deterioration such as dielectric breakdown. This not only interferes with the normal operation of electronic and electrical equipment, but may eventually cause a fire due to heat generation.
従来から、このような電流リークを抑制する方法は配線間の間隔を十分開けることが効果的であることはわかっているが、近年の電子機器や電気回路の小型化、高集積化に伴なって配線間の間隔は短くなる一方である。 Conventionally, it has been known that such a method for suppressing current leakage is effective in sufficiently spacing between wirings. However, with recent downsizing and higher integration of electronic devices and electric circuits. As a result, the distance between wirings is becoming shorter.
また、配線表面を空気に触れないように樹脂やセラミックで覆うことも有効な手段である。例えば、プリント配線などでは、特開平６−１３７４９号公報（特許文献１）に、銅箔の表面にニッケル、モリブデン、コバルトからなる三元合金被覆層を形成して、電流リークにつながるマイグレーション耐性を向上させる方法が開示されている。もっとも、これらの手段はコストがかさむうえに、隙間やピンホールが発生して、やがては電流リークが発生してしまうこともある。また、電気導電体接続片や電極などでは、配線を形成した後に電線やコネクタなどを接続したり、あるいは電極に電線やコネクタを何度も付け替えることが必要であるためその場合は配線の上を被覆することはできない。したがって、電気導電体接続片や電極を被覆することなく、耐電流リーク性を向上させることが望まれる。
本発明は、上記の事情を基になしたものであって、その目的は、表面被覆などの処理を施すことなく耐電流リーク性にすぐれる電気配線対あるいは電極対の配置方法を提供しようとするものである。 The present invention is based on the above circumstances, and an object of the present invention is to provide a method for arranging an electric wiring pair or an electrode pair having excellent current leakage resistance without performing a surface coating or the like. To do.
上記の目的を達成するために、本発明（請求項１）に係る電気配線対あるいは電極対の配置方法は、電気配線間あるいは電極間の電圧差（Ｖｈ）が２Ｖ以上８００Ｖ以下の範囲で使用される電気配線対あるいは電極対の配置方法であって、前記電気配線対あるいは電極対における電圧が高いほうの配線あるいは電極がＡｌを７５質量％（以下単に％と記す）以上含有するアルミニウム基合金からなり、電圧が低いほうの配線あるいは電極が銅を９５％以上含有する銅基合金からなり、前記アルミニウム基合金には銅、マンガン、マグネシウム、亜鉛、チタンが５％以下、シリコンが１５％以下添加され、前記銅基合金には錫、鉄、クロム、ニッケル、マグネシウム、シリコン、ジルコニウム、チタンが５％以下添加され、且つ、電気配線間あるいは電極間の間隔（Ｈ：ｍｍ）と電圧差（Ｖｈ：Ｖ）との関係が次式：０．０５Ｖｈ＋１９＞Ｈ＞０．００１６Ｖｈ＋０．０１を満たす範囲内とするものである。 In order to achieve the above object, the electrical wiring pair or electrode pair arranging method according to the present invention (Claim 1) is used in the range where the voltage difference (Vh) between the electrical wirings or between the electrodes is 2V or more and 800V or less. An aluminum-based alloy in which the wiring or electrode having a higher voltage in the electrical wiring pair or electrode pair contains 75 mass% (hereinafter simply referred to as%) of Al or more. The lower voltage wiring or electrode is made of a copper-based alloy containing 95% or more of copper, and the aluminum-based alloy includes copper, manganese, magnesium, zinc, titanium of 5% or less, and silicon of 15% or less. is added, the said copper base alloy of tin, iron, chromium, nickel, magnesium, silicon, zirconium, is added titanium than 5%, and, among the electric wiring Oh There is the spacing between the electrodes (H: mm) and the voltage difference (Vh: V) relationship with the following formula: 0.05Vh + 19> are those in a range that satisfies H> 0.0016Vh + 0.01.
本発明に係る電気配線対あるいは電極対の配置方法によれば、隣接する直流配線および電極においてリーク電流を抑制することができ、表面被覆などの処理を施すことなく耐電流リーク性を向上させることができる。 According to the arrangement method of the electrical wiring pair or the electrode pair according to the present invention, the leakage current can be suppressed in the adjacent DC wiring and the electrode, and the current leakage resistance can be improved without performing the surface coating or the like. Can do.
本発明者は、上記の従来技術における課題を見出した後、この課題を解決するため調査、研究を行ってきた。以下、その調査、研究を踏まえ本発明について詳細を説明する。まず、純銅で構成される隣接する電気配線に対して、異なる電位を加えて電流リークが発生する条件を調査した。その結果、配線の高電位側からの銅の溶出が電流リークを促進する原因であることがわかった。なお、この調査は、図１に示すように構成してリーク電流を測定した。すなわち、陽極１と陰極２のそれぞれの電極に電線３を取付け、その電極を所望間隔Ｈを保持するようにＭＣナイロン（登録商標）板４の上に配置して試験部材５とし、この試験部材５の電線３に電源６、電流計７を接続してリーク電流を測定した。
The present inventor has conducted research and research in order to solve this problem after finding out the problem in the above-described prior art. Hereinafter, the present invention will be described in detail based on the investigation and research. First, the conditions under which current leakage occurs by applying different potentials to adjacent electrical wirings made of pure copper were investigated. As a result, it was found that elution of copper from the high potential side of the wiring was the cause of promoting current leakage. This investigation was configured as shown in FIG. 1 and the leakage current was measured. That is, the electric wires 3 are attached to the respective electrodes of the
例えば、厚さ１ｍｍのタフピッチ銅電極２枚に電線を取付け、電極の間隔Ｈを１．５ｍｍに保持するようにＭＣナイロン（登録商標）基板上に設置する。さらに、電極間に電気伝導率１０μＳ／ｃｍのイオン交換水１０μｌを滴下して、電極間に直流５０Ｖを印加する。この場合、数分以内に電極間に１ｍＡ以上の電流リークが発生する。電圧の低い側（陰極）から黒色の樹枝上物質（デンドライト）が成長して電極間を短絡するようになる。やがて電極間の水分はジュール熱で蒸発して枯渇する。さらに、黒色物質は酸化第二銅（ＣｕＯ）や酸化第一銅（Ｃｕ２Ｏ）であり、これらの銅酸化物は半導体特性を有しているため、水分が蒸発後も電極間には数〜数十μＡ程度の電流リークが生じるようになる。このような現象を繰り返すとやがては顕著な水分の付着がなくても電極間の絶縁抵抗が低下して常時数ｍＡ以上の電流リークが生じるようになる。このように、電極からの銅の溶出と銅酸化物生成がリーク促進の大きな原因である。 For example, electric wires are attached to two tough pitch copper electrodes having a thickness of 1 mm, and are placed on an MC nylon (registered trademark) substrate so that the distance H between the electrodes is maintained at 1.5 mm. Further, 10 μl of ion exchange water having an electric conductivity of 10 μS / cm is dropped between the electrodes, and a direct current of 50 V is applied between the electrodes. In this case, a current leakage of 1 mA or more occurs between the electrodes within several minutes. Black dendritic material grows from the low voltage side (cathode) and short-circuits between the electrodes. Eventually, the moisture between the electrodes evaporates due to Joule heat and is depleted. Further, the black material is cupric oxide (CuO) or cuprous oxide (Cu 2 O), and these copper oxides have semiconductor characteristics. A current leak of about tens of μA occurs. When such a phenomenon is repeated, the insulation resistance between the electrodes decreases and current leakage of several mA or more always occurs even if there is no noticeable moisture adhesion. Thus, elution of copper from the electrode and copper oxide generation are major causes of leakage promotion.
つぎに、陽極を銅電極、陰極をカーボン電極にした実験を行なった。その結果、陰極からのデンドライトの成長が認められ、水分蒸発後の電流リークも認められた。逆に、陽極をカーボン電極に、陰極を銅電極にした場合、陰極側からのデンドライト成長はおこらず、顕著な電流リークも認められなかった。このことから陽極からの銅の溶出が電流リークを促進していることは明らかである。 Next, an experiment was conducted in which the anode was a copper electrode and the cathode was a carbon electrode. As a result, dendrite growth from the cathode was observed, and current leakage after water evaporation was also observed. Conversely, when the anode was a carbon electrode and the cathode was a copper electrode, dendrite growth from the cathode side did not occur and no significant current leakage was observed. From this, it is clear that elution of copper from the anode promotes current leakage.
デンドライトの成長は陽極から溶出した銅の陰極への移行、すなわちイオンマイグレーション現象であり、特に銀や鉛を陽極に使った場合に顕著であり、金や錫においても多少発生する。各種金属を用いてのデンドライト成長現象を調査した実験では、銀では銅に比べて非常に激しいイオンマイグレーション現象が生じ、一方、金や錫、ニッケルにおいてもイオンマイグレーションが確認できるものの銅よりははるかに穏やかな現象である。また、アルミニウム、チタンにおいてはほとんど観察されなかった。 Dendritic growth is a migration of copper eluted from the anode to the cathode, that is, an ion migration phenomenon, which is particularly noticeable when silver or lead is used for the anode, and also occurs somewhat in gold and tin. In an experiment investigating the dendrite growth phenomenon using various metals, the ion migration phenomenon is much more intense in silver than in copper, while the ion migration can be confirmed in gold, tin, and nickel. It is a calm phenomenon. Further, it was hardly observed in aluminum and titanium.
さて、上述のように、アルミニウムやチタンを電極として用いれば銅電極や銀電極のような激しいデンドライト成長を伴う電流リークが生じないことがわかったが、アルミニウムやチタンを実際に電極として用いるためにはいくつかの制約がある。 Now, as described above, it has been found that if aluminum or titanium is used as an electrode, current leakage with intense dendrite growth like a copper electrode or a silver electrode does not occur, but in order to actually use aluminum or titanium as an electrode. Has some limitations.
すなわち、電気回路や電子回路の配線には電流を流すという目的があり、そのためには金属の電気抵抗が低いことが必須である。電気抵抗が低い金属は、銀、銅、金、アルミニウムであり、それぞれ電気抵抗率は１．６×１０−６Ωｃｍ、１．７×１０−６Ωｃｍ、２．３×１０−６Ωｃｍ、２．７×１０−６Ωｃｍである。チタンの電気抵抗率は５５×１０−６Ωｃｍである。配線の電気抵抗率が高いと配線部分で電力を消費して配線での発熱を引き起こすので、省電力、機器の発熱防止の観点から配線の電気抵抗が低い銅や銀が好ましい。さらに、配線で発熱した熱を逃がすという観点から配線金属の熱伝導性が高いほうがよい。熱伝導率が高い金属は銀、銅、金、アルミニウムであり、それぞれ４２９Ｗ／ｍＫ、４０１Ｗ／ｍＫ、３１７Ｗ／ｍＫ、２３７Ｗ／ｍＫである。チタンは２１．９Ｗ／ｍＫである。このように、回路全体の電気抵抗を低下させ、なおかつ熱伝導性を維持するという目的を兼ね備えて配線材料を構成するためには銀や銅を使うことが望ましい。 In other words, there is a purpose of passing a current through the wiring of an electric circuit or an electronic circuit. For that purpose, it is essential that the electric resistance of the metal is low. The metals having low electrical resistance are silver, copper, gold, and aluminum, and the electrical resistivity is 1.6 × 10 −6 Ωcm, 1.7 × 10 −6 Ωcm, 2.3 × 10 −6 Ωcm, 2 0.7 × 10 −6 Ωcm. The electrical resistivity of titanium is 55 × 10 −6 Ωcm. If the electrical resistivity of the wiring is high, power is consumed in the wiring portion to cause heat generation in the wiring. Therefore, copper or silver having low electrical resistance of the wiring is preferable from the viewpoint of power saving and prevention of heat generation of the device. Furthermore, it is better that the thermal conductivity of the wiring metal is higher from the viewpoint of releasing the heat generated by the wiring. Metals having high thermal conductivity are silver, copper, gold, and aluminum, which are 429 W / mK, 401 W / mK, 317 W / mK, and 237 W / mK, respectively. Titanium is 21.9 W / mK. Thus, it is desirable to use silver or copper in order to configure the wiring material with the purpose of reducing the electrical resistance of the entire circuit and maintaining the thermal conductivity.
しかし、配線や電極が隣接していて、かつ隣接した配線や電極間に高い電位差が発生し、かつ、空気中に露出している部分に配線あるいは電極を形成する場合には、銀や銅電極では空気中の水分の付着が促進要因となってマイグレーションによるデンドライト成長や電流リークが生じやすい。 However, when wiring or electrodes are adjacent to each other and a high potential difference is generated between the adjacent wirings or electrodes and the wirings or electrodes are formed in portions exposed to the air, a silver or copper electrode Then, adhesion of moisture in the air is an acceleration factor, and dendrite growth and current leakage are likely to occur due to migration.
このように、導電性と熱伝導性、リーク性を両立させるのは難しい。そこで、マイグレーションによるデンドライトの成長を抑制して電流リークを低減し、なおかつ回路全体の電気抵抗を低下させて熱伝導性を維持するには、配線あるいは電極の高電位部分にのみアルミニウム基合金を使い、低電位部分は、特に限定するものではないが、銅基合金あるいは金を使うことがよいと考えられる。 Thus, it is difficult to achieve both conductivity, thermal conductivity, and leakage. Therefore, to suppress dendrite growth due to migration, reduce current leakage, and lower the electrical resistance of the entire circuit and maintain thermal conductivity, aluminum-based alloys are used only in the high-potential portion of the wiring or electrode. The low potential portion is not particularly limited, but it is considered preferable to use a copper-based alloy or gold.
また、一般に、銅には優れたばね特性があるので、電極としてばね特性が求められる材料には銅あるいは銅合金が最適であるが、アルミニウムにはばね特性がないためこのような用途にはアルミニウム単独で電極として使うことは難しい。そこで、電極として使う場合、デンドライト抑制の観点から陽極には固定式のアルミニウム電極を、陰極にはばね特性を有した銅電極を使うことも有効であると考えられる。 In general, copper has excellent spring characteristics, so copper or copper alloy is the best material for which spring characteristics are required as an electrode. However, aluminum does not have spring characteristics, so aluminum alone is not suitable for such applications. It is difficult to use as an electrode. Therefore, when used as an electrode, it is considered effective to use a fixed aluminum electrode for the anode and a copper electrode having spring characteristics for the cathode from the viewpoint of dendrite suppression.
ところで、配線や電極にアルミニウムを使用した場合、電極間に結露水などの純水に近い水分とは異なって、酸性度の高い酸性水などが付着した場合アルミニウムの溶出が懸念される。しかし、この場合も、水分が付着しているときのアルミニウム成分溶出は避けられないものの水分が乾燥したあとは絶縁性のアルミナが残るので、水分が乾燥した後の電流リークは起こらない。銅基合金の場合、半導体性のＣｕ２ＯあるいはＣｕＯが水分乾燥後も電極間に残るため、水分乾燥後の電流リークが発生して、これが問題となる。この意味からも陽極にアルミニウム基合金を使うことは有効である。 By the way, when aluminum is used for the wiring and the electrodes, unlike the water close to pure water such as condensed water between the electrodes, there is a concern about the elution of aluminum when highly acidic water is attached. However, in this case as well, elution of the aluminum component when moisture is attached is inevitable, but since the insulating alumina remains after the moisture is dried, current leakage does not occur after the moisture is dried. In the case of a copper-based alloy, semiconducting Cu 2 O or CuO remains between the electrodes even after moisture drying, causing current leakage after moisture drying, which is a problem. From this point of view, it is effective to use an aluminum-based alloy for the anode.
なお、特に導電性や熱伝導性あるいはばね特性が問題とならない場合には、陰極にもアルミニウム基合金を使うこともできる。 It should be noted that an aluminum-based alloy can also be used for the cathode when conductivity, thermal conductivity, or spring characteristics are not a problem.
さて、上述したように、本発明では陽極にアルミ基合金材を用いることが肝要となるが、陽極と陰極間の電流リーク量は配線や電極間に加わる電圧差や、配線間隔あるいは電極間隔の長さに依存して異なってくると考えられる。そこで、どのような電圧差あるいは配線（電極）間隔であれば配線（電極）として有効に機能するかを陽極にアルミ基合金電極、陰極に銅基合金電極を用いた場合を例に調査した。 As described above, in the present invention, it is important to use an aluminum-based alloy material for the anode. However, the amount of current leakage between the anode and the cathode is the voltage difference applied between the wiring and the electrode, the wiring spacing or the electrode spacing. It will be different depending on the length. Therefore, the case of using an aluminum-based alloy electrode as the anode and a copper-based alloy electrode as the cathode was investigated as an example to determine what voltage difference or wiring (electrode) interval would function effectively as the wiring (electrode).
その結果、隣接する配線間あるいは電極間の電位差が２Ｖ以上８００Ｖ以下の範囲であって、かつ、電圧が高いほうの配線材料あるいは電極（陽極）がアルミ基合金であれば、電圧が低いほうの配線材料あるいは電極（陰極）との間隔Ｈが次式：０．０５Ｖｈ＋１９＞Ｈ＞０．００１６Ｖｈ＋０．０１を満たす範囲内である場合にリークを抑制するのに有効であることを実験的に確認した。 As a result, if the potential difference between adjacent wires or electrodes is in the range of 2V to 800V and the higher voltage wiring material or electrode (anode) is an aluminum-based alloy, the lower voltage It has been experimentally confirmed that it is effective for suppressing leakage when the distance H between the wiring material and the electrode (cathode) is within a range satisfying the following formula: 0.05Vh + 19> H> 0.0016Vh + 0.01. .
すなわち、電圧が２Ｖ未満では両極とも銅電極を用いた場合でも顕著なデンドライト成長や水分蒸発後の電流リークは発生しない。水の電気分解に必要な電圧が１．４Ｖであり、その程度以下の電圧では水中に水素イオンが生成せず銅の陽極からの溶出を顕著には促進しない。つまり、デンドライト成長を伴う電流リーク現象は２Ｖ以上の電圧印加で発生する。また、電圧が２Ｖ以上になると銅電極ではデンドライト成長が確認され、陽極をアルミニウム配線（電極）にすると抑制される。 That is, when the voltage is less than 2 V, no significant dendrite growth or current leakage after water evaporation occurs even when copper electrodes are used for both electrodes. The voltage required for the electrolysis of water is 1.4 V, and at a voltage below that level, hydrogen ions are not generated in the water and the elution from the copper anode is not significantly promoted. That is, the current leak phenomenon accompanied by dendrite growth occurs when a voltage of 2 V or more is applied. Further, when the voltage is 2 V or more, dendrite growth is confirmed on the copper electrode, and is suppressed when the anode is made of aluminum wiring (electrode).
また、電極間隔Ｈがあまりにも短い場合には水分蒸発時に電極間にアークが発生することがあり、電極の破損や基板樹脂の溶損が生じるためあまり電極間隔が短い場合は陽極にアルミニウムをつかっても効果はない。特に８００Ｖ以上では十分に電極間隔Ｈを保たないとアークが飛んで危険である。電極間隔が十分長い場合には、リークは生じにくくなり陽極に銅電極を用いてもリークは生じにくくなるので、陽極をアルミニウム電極にする必要性は低下する。そこで、陽極を銅基合金に代えてアルミ基合金を使うことによって電流リーク抑制に効果がある電極間隔を評価した。配線間あるいは電極間の電位差をＶｈとし、配線あるいは電極間隔をＨ（図１参照）とすると、この間隔Ｈが次式：０．０５Ｖｈ＋１９＞Ｈ＞０．００１６Ｖｈ＋０．０１を満たす範囲内であれば陽極をアルミニウムにすることが有効である。つまり、電極間隔が短い場合はアークが飛んで効果がないことを示し、距離が長い場合は電極をアルミニウムにする効果が少ないことを示している。 Also, if the electrode spacing H is too short, an arc may occur between the electrodes when the moisture evaporates, causing electrode breakage or substrate resin melting. If the electrode spacing is too short, use aluminum for the anode. But it has no effect. In particular, when the voltage is 800 V or more, an arc may fly if the electrode spacing H is not sufficiently maintained. When the electrode interval is sufficiently long, leakage hardly occurs, and even if a copper electrode is used for the anode, the leakage is hardly generated, so that the necessity of using the anode as an aluminum electrode is reduced. Therefore, an electrode interval effective for suppressing current leakage was evaluated by using an aluminum-based alloy instead of a copper-based alloy for the anode. If the potential difference between the wirings or between the electrodes is Vh and the wiring or electrode spacing is H (see FIG. 1), this spacing H is within a range satisfying the following formula: 0.05Vh + 19> H> 0.0016Vh + 0.01. It is effective to use aluminum for the anode. That is, when the electrode interval is short, it indicates that the arc is blown and there is no effect, and when the distance is long, the effect of making the electrode aluminum is small.
電極として使うことができる陽極用材料はアルミニウム基合金であり、電気抵抗率が極端に下がらない程度に添加物を加えることができる。このとき、銀や鉛は水分存在下の電圧印加でアルミニウム合金から溶出しやすいため使わないことが望ましい。また、銅、マンガン、マグネシウム、亜鉛、チタンは５％以下、シリコンは１５％以下の添加であれば陽極用材料として問題なく使用できる。 The anode material that can be used as an electrode is an aluminum-based alloy, and additives can be added to such an extent that the electrical resistivity does not extremely decrease. At this time, it is desirable not to use silver or lead because they are easily eluted from the aluminum alloy when a voltage is applied in the presence of moisture. Further, copper, manganese, magnesium, zinc and titanium can be used as a material for an anode without any problem if added at 5% or less and silicon at 15% or less.
また、陰極用材料としては、特に限定するものではないが、銅基合金を用いることができ、この場合、導電率があまり下がると配線として銅を使うメリットが減少するため、一般的に銅に添加する錫、鉄、クロム、ニッケル、マグネシウム、シリコン、ジルコニウム、チタンを５％以下添加したものが好ましい。黄銅、あるいは真鍮として知られるＣｕ−Ｚｎ合金は、通常３０〜４０％Ｚｎを含有しており、極めてアークが発生しやすくなっているため、２０Ｖ以上の電圧印加状態で使うことは望ましくないが、アークが発生しにくい条件、例えば電極間隔を１０ｍｍ以上に設定する場合には６００Ｖあるいは８００Ｖで使っても特に問題がない。 In addition, the cathode material is not particularly limited, but a copper-based alloy can be used. In this case, if the conductivity is lowered too much, the merit of using copper as a wiring is reduced. What added 5% or less of tin, iron, chromium, nickel, magnesium, a silicon | silicone, a zirconium, and titanium to add is preferable. A Cu-Zn alloy known as brass or brass usually contains 30 to 40% Zn and is very easy to generate an arc, so it is not desirable to use it in a voltage applied state of 20 V or more. There is no particular problem even if it is used at 600V or 800V under conditions where arcing is difficult to occur, for example, when the electrode spacing is set to 10 mm or more.
以下、本発明の実施例及び比較例について説明する。なお、実施例及び比較例は、図１のように構成してリーク電流を測定した。また、比較例６と実施例４を除く例の銅試験片はタフピッチ銅を用い、実施例４と比較例１０を除く例のアルミニウム試験片はＪＩＳ１０００系のアルミニウム合金（合金番号１１００）を用いた。 Examples of the present invention and comparative examples will be described below. The examples and comparative examples were configured as shown in FIG. 1 and the leakage current was measured. Moreover, the copper test piece of the example except the comparative example 6 and Example 4 used tough pitch copper, and the aluminum test piece of the example except Example 4 and the comparative example 10 used JIS1000 series aluminum alloy (alloy number 1100). .
実施例１
厚さ１ｍｍのアルミニウム試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔が１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、直流電源装置（高砂製作所製）を用いて両極間に５０Ｖの直流電圧を印加した。電極間にかかる電圧及び配線に流れる電流をテスター（ＨＩＯＫＩ製）で測定した。その結果、３０分の試験時間中デンドライトの成長や０．１ｍＡ以上の電流リークは観察できなかった。水分の蒸発もおこらず、３０分間電極間に水分が滞留したままの状態を保った。
Example 1
After an aluminum test piece having a thickness of 1 mm is used as an anode and a copper test piece having a thickness of 1 mm is used as a cathode, the distance between the anode and the cathode is adjusted to be 1.5 mm on an MC nylon (registered trademark) plate. After adding 10 μl of ion-exchanged water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 50 V was applied between both electrodes using a DC power supply (manufactured by Takasago Seisakusho). The voltage applied between the electrodes and the current flowing through the wiring were measured with a tester (manufactured by HIOKI). As a result, dendrite growth and current leakage of 0.1 mA or more could not be observed during the test time of 30 minutes. Water did not evaporate and the state where water remained between the electrodes for 30 minutes was maintained.
比較例１
厚さ１ｍｍの銅試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に５０Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧印加後から電流がリークしはじめ、黒色のデンドライトが成長するとともにリーク電流が増加した。やがて、水分が蒸発してリーク電流が減少していった。最大リーク電流は２５ｍＡであり、最大の電流リークまでの通電時間は１００秒であった。このような現象となった理由は、陽極を銅としたためと考える。
Comparative Example 1
A 1 mm thick copper test piece was used as an anode, and a 1 mm thick copper test piece was used as a cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.5 mm. Then, after adding 10 μl of ion-exchanged water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 50 V is applied between both electrodes in the same manner as in Example 1, and the voltage applied between the electrodes and the current flowing through the wiring are Measured with a tester. As a result, current began to leak after voltage application, and black dendrite grew and the leakage current increased. Eventually, the water evaporated and the leakage current decreased. The maximum leakage current was 25 mA, and the energization time until the maximum current leakage was 100 seconds. The reason for this phenomenon is that the anode is made of copper.
比較例２
厚さ１ｍｍの銀試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に５０Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧印加後２２秒後に、５０ｍＡのリーク電流が流れ、やがて水分が蒸発した。このような現象となった理由は、陽極を銀としたためと考える。
Comparative Example 2
A silver test piece having a thickness of 1 mm was used as an anode and a copper test piece having a thickness of 1 mm was used as a cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.5 mm. Then, after adding 10 μl of ion-exchanged water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 50 V is applied between both electrodes in the same manner as in Example 1, and the voltage applied between the electrodes and the current flowing through the wiring are Measured with a tester. As a result, a leak current of 50 mA flowed 22 seconds after the voltage application, and eventually the water evaporated. The reason for this phenomenon is that the anode is made of silver.
比較例３
厚さ１ｍｍの銅試験片を陽極とし、厚さ１ｍｍのアルミニウム試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に５０Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧印加後１８０秒後に、２６ｍＡのリーク電流が流れやがて、水分が蒸発した。このような現象となった理由は、陽極を銅としたためと考える。
Comparative Example 3
A 1 mm-thick copper test piece was used as the anode, and a 1 mm-thick aluminum test piece was used as the cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.5 mm. Then, after adding 10 μl of ion-exchanged water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 50 V is applied between both electrodes in the same manner as in Example 1, and the voltage applied between the electrodes and the current flowing through the wiring are Measured with a tester. As a result, a leakage current of 26 mA flowed 180 seconds after the voltage application, and the water evaporated. The reason for this phenomenon is that the anode is made of copper.
比較例４
厚さ１ｍｍの銅試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に６００Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧を加えるとリーク電流が２８秒後に最大４８ｍＡとなり、その後水分が蒸発してリーク電流が低下するとともに水分がなくなった。このような現象となった理由は、陽極を銅とし、さらに両極間の電圧を６００Ｖと高めたためと考える。
Comparative Example 4
A 1 mm thick copper test piece was used as an anode, and a 1 mm thick copper test piece was used as a cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.5 mm. Thereafter, 10 μl of ion exchange water having a conductivity of 10 μS / cm is added between the electrodes, and then a DC voltage of 600 V is applied between the two electrodes in the same manner as in Example 1 above. Measured with a tester. As a result, when a voltage was applied, the leak current reached a maximum of 48 mA after 28 seconds, and then the water evaporated, the leak current decreased and the water disappeared. The reason for this phenomenon is considered to be that the anode was made of copper and the voltage between both electrodes was further increased to 600V.
実施例２
厚さ１ｍｍのアルミニウム試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に６００Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、通電開始後、リーク電流が流れ１５秒後に最大リーク電流は３ｍＡ流れたが、３０秒後にリーク電流は０．１ｍＡ以下となり、水分の蒸発もおこらず、その後３０分間電極間に水分が滞留したままの状態をたもった。このような現象となった理由は、電圧が６００Ｖと高いために通電直後に水分の分極にともなう若干の電流が流れたものの、陽極がアルミニウムでありリーク電流の増加が認められず電極からの金属溶出が抑えられたためであると考える。
Example 2
An aluminum test piece with a thickness of 1 mm was used as an anode, and a copper test piece with a thickness of 1 mm was used as a cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.5 mm. Thereafter, 10 μl of ion exchange water having a conductivity of 10 μS / cm is added between the electrodes, and then a DC voltage of 600 V is applied between the two electrodes in the same manner as in Example 1 above. Measured with a tester. As a result, after the energization started, the leakage current flowed, and the maximum leakage current flowed 3 mA after 15 seconds. However, after 30 seconds, the leakage current became 0.1 mA or less, and the water did not evaporate. The state that stayed was kept. The reason for this phenomenon was that although the voltage was as high as 600 V, a slight current flowed due to moisture polarization immediately after energization, but the anode was made of aluminum and no increase in leakage current was observed. This is thought to be because elution was suppressed.
比較例５
厚さ１ｍｍの銅試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．０ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に１２Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧を加えるとリーク電流が４８０秒後に最大８２ｍＡとなり、その後水分が蒸発してリーク電流が低下するとともに水分がなくなった。このような現象となった理由は、比較例２と同様、陽極を銅としたためと考える。
Comparative Example 5
A 1 mm thick copper test piece was used as an anode and a 1 mm thick copper test piece was used as a cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.0 mm. Thereafter, 10 μl of ion exchange water having a conductivity of 10 μS / cm is added between the electrodes, and then a DC voltage of 12 V is applied between both electrodes in the same manner as in Example 1 above. Measured with a tester. As a result, when a voltage was applied, the leak current reached a maximum of 82 mA after 480 seconds, and then the moisture evaporated to reduce the leak current and remove the moisture. The reason for this phenomenon is thought to be that the anode was copper, as in Comparative Example 2.
実施例３
厚さ１ｍｍのアルミニウム試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔が１．０ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に１２Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、３０分の試験時間中デンドライトの成長や０．１ｍＡ以上の電流リークは観察されなかった。
Example 3
After an aluminum test piece having a thickness of 1 mm is used as an anode and a copper test piece having a thickness of 1 mm is used as a cathode, the distance between the anode and the cathode is adjusted to 1.0 mm on an MC nylon (registered trademark) plate and installed. After adding 10 μl of ion-exchanged water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 12 V is applied between both electrodes in the same manner as in Example 1 above, and the voltage applied between the electrodes and the current flowing through the wiring are tested. Measured with As a result, no dendrite growth or current leakage of 0.1 mA or more was observed during the test time of 30 minutes.
比較例６
真空蒸着法により、コーニング社製＃１７３７ガラス上に純銅を厚さ１μｍ蒸着した。このとき、ステンレス製のメタルマスクを設置して陽極と陰極の間隔Ｈが０．１５ｍｍとなるようにして１０ｍｍ角の電極形状を形成した。陽極と陰極の間に、導電率１０μＳ／ｃｍのイオン交換水を１μｌ添加したのち、上記実施例１と同要領で両極間に３Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧を加えるとリーク電流が９６０秒後に最大３９ｍＡとなり、その後水分が蒸発してリーク電流が低下するとともに水分がなくなった。このような現象となった理由は、比較例２や５と同様、陽極を銅としたためと考える。
Comparative Example 6
Pure copper was deposited to a thickness of 1 μm on Corning # 1737 glass by a vacuum deposition method. At this time, a stainless steel metal mask was installed to form a 10 mm square electrode shape so that the distance H between the anode and the cathode was 0.15 mm. After adding 1 μl of ion-exchanged water having a conductivity of 10 μS / cm between the anode and the cathode, a DC voltage of 3 V is applied between the two electrodes in the same manner as in Example 1, and the voltage flows between the electrodes and the wiring. The current was measured with a tester. As a result, when a voltage was applied, the leak current reached a maximum of 39 mA after 960 seconds, and then the moisture evaporated to reduce the leak current and remove the moisture. The reason for this phenomenon is thought to be that the anode was copper, as in Comparative Examples 2 and 5.
実施例４
真空蒸着装置よって、コーニング社製＃００５０ガラス上にステンレスマスクを用いて、陽極用として純アルミニウムを厚さ１μｍ、１０ｍｍ角の形状で真空蒸着した。つづけて、陽極と陰極の間隔Ｈが０．１５ｍｍとなるようにあらたなメタルマスクを用いて陰極用として銅を厚さ１μｍ、１０ｍｍ角の形状で蒸着した。この陽極と陰極の間に、導電率１０μＳ／ｃｍのイオン交換水を１μｌ添加したのち、上記実施例１と同要領で両極間に３Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、０．１ｍＡ以上のリーク電流は観察されなかった。
Example 4
Using a stainless steel mask on a Corning # 0050 glass, pure aluminum was vacuum-deposited in a shape of 1 μm thick and 10 mm square with a vacuum deposition apparatus. Subsequently, copper was deposited in a shape of 1 μm thick and 10 mm square using a new metal mask so that the distance H between the anode and the cathode was 0.15 mm. After adding 1 μl of ion-exchanged water having a conductivity of 10 μS / cm between the anode and the cathode, a DC voltage of 3 V is applied between both electrodes in the same manner as in Example 1 above, and the voltage and wiring applied between the electrodes are applied. The flowing current was measured with a tester. As a result, a leakage current of 0.1 mA or more was not observed.
比較例７
厚さ１ｍｍのアルミニウム試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に８５０Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧を加えると電極間にアークが発生し、リーク電流最大１Ａ流れて、瞬時に水分が蒸発した。このような現象となった理由は、電圧が８００Ｖ以上では、アーキングが発生しやすいため、陽極をアルミニウムにしても効果が少ないためである。
Comparative Example 7
An aluminum test piece with a thickness of 1 mm was used as an anode, and a copper test piece with a thickness of 1 mm was used as a cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 1.5 mm. Then, after adding 10 μl of ion exchange water having a conductivity of 10 μS / cm between the electrodes, a 850 V DC voltage was applied between both electrodes in the same manner as in Example 1 above, and the voltage applied between the electrodes and the current flowing through the wiring were Measured with a tester. As a result, when a voltage was applied, an arc was generated between the electrodes, a leakage current of 1 A maximum flowed, and moisture was instantly evaporated. The reason for this phenomenon is that arcing is likely to occur when the voltage is 800 V or higher, and even if the anode is made of aluminum, the effect is small.
比較例８
厚さ１ｍｍのアルミニウム試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが０．９ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に６００Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、電圧を加えると電極間にアークが発生し、最大１Ａのリーク電流が流れて、瞬時に水分が蒸発した。このような現象となった理由は、電極間隔Ｈが０．００１６Ｖｈ＋０．０１（＝０．９７ｍｍ）よりも短い場合には、アーキングが発生しやすいため、陽極をアルミニウムにしても効果が少ないためである。
Comparative Example 8
An aluminum test piece having a thickness of 1 mm was used as the anode, and a copper test piece having a thickness of 1 mm was used as the cathode, and the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 0.9 mm. Thereafter, 10 μl of ion exchange water having a conductivity of 10 μS / cm is added between the electrodes, and then a DC voltage of 600 V is applied between the two electrodes in the same manner as in Example 1 above. Measured with a tester. As a result, when a voltage was applied, an arc was generated between the electrodes, a leak current of 1 A at maximum flowed, and moisture was instantly evaporated. The reason for this phenomenon is that when the electrode spacing H is shorter than 0.0016 Vh + 0.01 (= 0.97 mm), arcing is likely to occur, and even if the anode is made of aluminum, the effect is small. is there.
比較例９
厚さ１ｍｍの銅試験片を陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが５０ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に６００Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、３０分以上リーク電流は流れなかった。このような現象となった理由は、電極間隔Ｈが０．０５Ｖｈ＋１９（＝４９ｍｍ）より長い場合には、陽極を銅にしてもリーク電流は流れず大きな問題はないためで、陽極をアルミニウムにする必要性が認められない。
Comparative Example 9
After the copper test piece having a thickness of 1 mm was used as an anode and the copper test piece having a thickness of 1 mm was used as a cathode, the MC was installed on an MC nylon (registered trademark) plate so that the distance H between the anode and the cathode was 50 mm. After adding 10 μl of ion-exchanged water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 600 V is applied between both electrodes in the same manner as in Example 1 above, and the voltage applied between the electrodes and the current flowing through the wiring are measured with a tester. It was measured. As a result, no leakage current flowed for 30 minutes or more. The reason for this phenomenon is that when the electrode interval H is longer than 0.05 Vh + 19 (= 49 mm), there is no significant problem even if the anode is made of copper and no leakage current flows, so the anode is made of aluminum. Necessity is not recognized.
実施例５
ボタン溶解炉でそれぞれ銅（Ｃｕ）を４％，マンガン（Ｍｎ）を１．２％，シリコン（Ｓｉ）を１２％，マグネシウム（Ｍｇ）を２％含むアルミニウム合金を４種類作成して厚さ１ｍｍの試験片を作成して陽極とし、厚さ１ｍｍの銅試験片を陰極として、ＭＣナイロン（登録商標）板上に陽極と陰極の間隔Ｈが１．５ｍｍとなるように調整して設置した後、電極間に導電率１０μＳ／ｃｍのイオン交換水を１０μｌ添加したのち、上記実施例１と同要領で両極間に６００Ｖの直流電圧を印加し、電極間にかかる電圧及び配線に流れる電流をテスターで測定した。その結果、３０分以上リーク電流は流れなかった。このような現象となった理由は、上記実施例２と同じ理由による。
Example 5
Four types of aluminum alloys containing 4% copper (Cu), 1.2% manganese (Mn), 12% silicon (Si), and 2% magnesium (Mg) were prepared in a button melting furnace, and the thickness was 1mm. After preparing the test piece as an anode and using a copper test piece having a thickness of 1 mm as a cathode, and adjusting and installing on the MC nylon (registered trademark) plate so that the distance H between the anode and the cathode is 1.5 mm. After adding 10 μl of ion exchange water having a conductivity of 10 μS / cm between the electrodes, a DC voltage of 600 V was applied between both electrodes in the same manner as in Example 1 above, and the voltage applied between the electrodes and the current flowing through the wiring were measured. Measured with As a result, no leakage current flowed for 30 minutes or more. The reason for this phenomenon is the same as in Example 2 above.
１：陽極 ２：陰極 ３：電線
４：ＭＣナイロン板 ５：試験部材 ６：電源
７：電流計（テスター） Ｈ：電極間の間隔
1: Anode 2: Cathode 3: Electric wire 4: MC nylon plate 5: Test member 6: Power supply 7: Ammeter (tester) H: Spacing between electrodes
Claims (1)
式：０．０５Ｖｈ＋１９＞Ｈ＞０．００１６Ｖｈ＋０．０１ An electrical wiring pair or electrode pair arrangement method used in a range where a voltage difference (Vh) between electrical wirings or between electrodes is 2 V or more and 800 V or less, wherein a wiring having a higher voltage in the electrical wiring pair or electrode pair. Alternatively, the electrode is made of an aluminum-based alloy containing 75% by mass or more of Al (hereinafter simply referred to as “%”), and the lower voltage wiring or electrode is made of a copper- based alloy containing 95% or more of copper. Copper, Manganese, Magnesium, Zinc and Titanium are added at 5% or less and Silicon is added at 15% or less. Tin, Iron, Chromium, Nickel, Magnesium, Silicon, Zirconium and Titanium are added to the copper base alloy at 5% or less. it is, and the spacing between between electrical wiring or an electrode (H: mm) and the voltage difference: that the relationship between (Vh V) is within a range satisfying the following formula Method of arranging the electric wire pair or electrode pair, wherein.
Formula: 0.05Vh + 19>H> 0.0016Vh + 0.01
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