JP4819422B2 - Method for attaching solder powder to electronic circuit board and electronic wiring board with solder - Google Patents
Method for attaching solder powder to electronic circuit board and electronic wiring board with solder Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Description
本発明は、電子回路基板（プリント配線板も含む。）の露出した微細な金属面のみに、精細にハンダ粉末を付着させる方法及び該電子回路基板に電子部品を取りつけるため、前記ハンダ粉末を溶融して露出金属面にハンダ薄層を形成する方法及びこのハンダ付電子回路基板を使用した電子部品に関する。 The present invention provides a method for finely attaching a solder powder only to an exposed fine metal surface of an electronic circuit board (including a printed wiring board), and melting the solder powder in order to attach an electronic component to the electronic circuit board. The present invention also relates to a method for forming a thin solder layer on an exposed metal surface and an electronic component using this soldered electronic circuit board.
近年電子回路基板、例えばプラスチック基板（フィルムもある。）、セラミック基板、あるいはプラスチック等をコートした金属基板等の絶縁性基板上に、電子回路パターンを形成した電子回路基板が開発され、その配線面上にＩＣ素子、半導体チップ、抵抗、コンデンサー等の電子部品をハンダ接合して電子回路を構成させる手段が広く採用されている。 In recent years, an electronic circuit board having an electronic circuit pattern formed on an insulating substrate such as an electronic circuit board, for example, a plastic substrate (also with a film), a ceramic substrate, or a metal substrate coated with plastic has been developed. On top of this, means for forming an electronic circuit by soldering electronic components such as an IC element, a semiconductor chip, a resistor, and a capacitor are widely adopted.
この場合、電子部品のリード端子を、回路パターンの所定の部分に接合させるためには、電子回路基板上の露出している導電性回路電極表面に予めハンダ薄層を形成させておき、ハンダペーストまたはフラックスを印刷し、所定の電子部品を位置決め載置した後、ハンダ薄層またはハンダ薄層及びハンダペーストをリフローさせ、ハンダ接続させるのが一般的である。 In this case, in order to join the lead terminal of the electronic component to a predetermined portion of the circuit pattern, a solder thin layer is formed in advance on the exposed conductive circuit electrode surface on the electronic circuit board, and the solder paste Or, after printing a flux and positioning and mounting a predetermined electronic component, the solder thin layer or the solder thin layer and the solder paste are generally reflowed and soldered.
また最近では電子製品の小型化のため、電子回路はファインピッチ化が要求され、小面積内にファインピッチの部品、例えば０．３ｍｍピッチのＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）タイプのＬＳＩ、ＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）、０．１５ｍｍピッチのＦＣ（Ｆｌｉｐ Ｃｈｉｐ）などが多く搭載されている。このため、電子回路基板には、ファインピッチ対応の精細なハンダ回路パターンが要求されている。 Recently, in order to reduce the size of electronic products, electronic circuits are required to have fine pitches. Fine pitch components within a small area, for example, 0.3 mm pitch QFP (Quad Flat Package) type LSI, CSP (Chip Size). Package), 0.15 mm pitch FC (Flip Chip) and the like are often mounted. For this reason, a fine solder circuit pattern corresponding to the fine pitch is required for the electronic circuit board.
電子回路基板にハンダ膜によるハンダ回路を形成するためには、メッキ法、ＨＡＬ（ホットエアーレベラ）法、あるいはハンダ粉末のペーストを印刷しリフローする方法などが行われている。しかし、メッキ法によるハンダ回路の製造方法は、ハンダ層を必要な厚さにするのが困難であり、ＨＡＬ法、ハンダペーストの印刷による方法は、ファインピッチパターンへの対応が困難である。 In order to form a solder circuit with a solder film on an electronic circuit board, a plating method, a HAL (hot air leveler) method, a method of printing a solder powder paste, and reflowing is performed. However, it is difficult for the solder circuit manufacturing method by the plating method to make the solder layer to a required thickness, and the HAL method and the solder paste printing method are difficult to cope with the fine pitch pattern.
そのため、回路パターンの位置合わせ等の面倒な操作を必要せずハンダ回路を形成する方法として、電子回路基板の導電性回路電極表面に、粘着性付与化合物を反応させることにより粘着性を付与し、該粘着部にハンダ粉末を付着させ、次いで該電子回路基板を加熱し、ハンダを溶解してハンダ回路を形成する方法が開示されている（例えば、特許文献１参照。）。 Therefore, as a method of forming a solder circuit without the need for troublesome operations such as alignment of circuit patterns, the tackiness imparting compound is imparted to the surface of the conductive circuit electrode of the electronic circuit board by imparting tackiness, A method is disclosed in which solder powder is attached to the adhesive portion, and then the electronic circuit board is heated to dissolve the solder to form a solder circuit (see, for example, Patent Document 1).
特許文献１で開示された方法により、簡単な操作で微細なハンダ回路パターンを形成させ、信頼性の高い回路電子回路基板を提供することが可能となったが、この方法では乾式でハンダ粉末を回路電子回路基板に付着させるため、静電気等により粉末が必要な箇所以外の余分な部分に付着することが避けられず、また電子回路基板の金属露出面にも余分に付着しりすることがあって、ハンダ粉末を付着させた後にこのような余分のハンダ粉末を効率よく除去する技術の開発が求められていた。乾式法によるときは、粉末の飛散等が生じて、回路電子回路基板のファイン化の妨げとなったり、また余分に付着したハンダ粉末は乾式処理においては幾分酸化が進むため、回収したハンダ粉末の再利用にも幾分問題が残っていた。このような問題点は特に微粉のハンダ粉末を用いる場合に顕著となった。 According to the method disclosed in Patent Document 1, it is possible to form a fine solder circuit pattern by a simple operation and to provide a highly reliable circuit electronic circuit board. Because it adheres to the circuit electronic circuit board, it is inevitable that the powder adheres to extra portions other than where it is necessary due to static electricity, etc., and may also adhere to the exposed metal surface of the electronic circuit board. Therefore, there has been a demand for the development of a technique for efficiently removing such excess solder powder after the solder powder is adhered. When the dry method is used, powder scattering occurs, which may hinder the finer circuit electronic circuit board, and the excessively adhered solder powder will oxidize somewhat during the dry processing, so the collected solder powder Some problems remained in the reuse of. Such a problem becomes remarkable particularly when a fine solder powder is used.
本発明は、電子回路基板上の露出した金属表面（導電性回路電極表面）を、粘着性付与化合物処理することにより該金属表面に粘着性を付与し、該粘着部にハンダ粉末を付着させ、次いで該電子回路基板を加熱し、ハンダを溶解してハンダ回路を形成する電子回路基板の製造方法において、より微細な回路パターンを実現できるハンダ粉末の付着方法、該方法により付着ハンダ粉末をリフローしたハンダ付電子回路基板の製造方法、微細な回路パターンを有し信頼性の高い電子回路基板、高信頼性、高実装密度を実現できる電子部品を実装した回路電子回路基板並びにハンダ粉末付着において劣化の少ないハンダ粉末の再使用方法を提供することを目的とする。 In the present invention, the exposed metal surface (conductive circuit electrode surface) on the electronic circuit board is subjected to a tackifying compound treatment to impart adhesiveness to the metal surface, and solder powder is attached to the adhesive part. Next, in the method of manufacturing an electronic circuit board in which the electronic circuit board is heated and the solder is melted to form a solder circuit, the solder powder adhesion method capable of realizing a finer circuit pattern, and the solder powder adhered by the method is reflowed Manufacturing method of soldered electronic circuit board, highly reliable electronic circuit board with fine circuit pattern, circuit electronic circuit board mounted with electronic components that can realize high reliability and high mounting density, and solder powder adhesion The object is to provide a method for reusing less solder powder.
本発明者は、上記課題を解決すべく鋭意努力検討した結果、本発明に到達した。即ち本発明は、
［１］ 電子回路基板の露出した金属表面を、粘着性付与化合物で処理することにより粘着性を付与し、該粘着部にハンダ粉末を乾式または湿式において付着させ、次いで液体中において余分に付着したハンダ粉末を除去することからなるハンダ粉末の付着方法、
The inventor of the present invention has reached the present invention as a result of diligent efforts to solve the above problems. That is, the present invention
[1] The exposed metal surface of the electronic circuit board is treated with a tackifying compound to provide tackiness, and solder powder is adhered to the adhesive part in a dry or wet manner, and then excessively adhered in the liquid. Solder powder adhesion method comprising removing the solder powder;
［２］ ハンダ粉末の付着方法のハンダ粉末除去の際に用いる液体が、水である上記［１］に記載のハンダ粉末の付着方法、
［３］ ハンダ粉末の付着方法のハンダ粉末除去の際に用いる液体が、脱酸素水である上記［２］に記載のハンダ粉末の付着方法、
［４］ ハンダ粉末の付着方法のハンダ粉末除去の際に用いる液体が、防錆剤を添加した脱酸素水である上記［３］に記載のハンダ粉末の付着方法、
[2] The solder powder adhesion method according to the above [1], wherein the liquid used for removing the solder powder in the solder powder adhesion method is water,
[3] The solder powder adhesion method according to the above [2], wherein the liquid used when removing the solder powder in the solder powder adhesion method is deoxygenated water,
[4] The solder powder adhesion method according to the above [3], wherein the liquid used for removing the solder powder in the solder powder adhesion method is deoxygenated water to which a rust preventive agent has been added.
［５］ 電子回路基板を、粘着性付与化合物で処理することにより金属回路露出部のみに粘着性を付与し、該粘着部にハンダ粉末を乾式または湿式において付着させ、次いで振動した液体中において余分に付着したハンダ粉末を除去した後、これを加熱溶融して回路を形成することからなるハンダ付電子回路基板の製造方法、 [5] By treating the electronic circuit board with the tackifier compound, the metal circuit exposed portion is given tackiness, and solder powder is attached to the adhesive portion in a dry or wet manner, and then the excess in the vibrated liquid. A method of manufacturing a soldered electronic circuit board comprising removing the solder powder adhering to the substrate and then heating and melting it to form a circuit;
［６］ 電子回路基板上の金属回路露出部を、粘着性付与化合物であるナフトトリアゾール系誘導体、ベンゾトリアゾール系誘導体、イミダゾール系誘導体、ベンゾイミダゾール系誘導体、メルカプトベンゾチアゾール系誘導体及びベンゾチアゾールチオ脂肪酸系誘導体の少なくとも一種を含む溶液に浸漬処理または塗布、処理することにより粘着性を付与する上記［５］に記載のハンダ付電子回路基板の製造方法、
［７］ 粘着部形成が、処理温度３０〜６０℃、処理時間５ｓｅｃ〜５ｍｉｎで処理する上記［６］に記載のハンダ付電子回路基板の製造方法、
［８］ 余分に付着したハンダ粉末の除去方法における振動した液体が、超音波振動を付与された液体である上記［５］に記載のハンダ付電子回路基板の製造方法、
[6] An exposed portion of a metal circuit on an electronic circuit board is coated with a naphthotriazole derivative, a benzotriazole derivative, an imidazole derivative, a benzimidazole derivative, a mercaptobenzothiazole derivative, and a benzothiazole thio fatty acid series that are tackifiers. The method for producing a soldered electronic circuit board according to the above [5], wherein adhesion is imparted by immersing or applying to a solution containing at least one derivative,
[7] The method for producing a soldered electronic circuit board according to the above [6], wherein the adhesive part formation is performed at a processing temperature of 30 to 60 ° C. and a processing time of 5 sec to 5 min.
[8] The method for producing a soldered electronic circuit board according to the above [5], wherein the vibrated liquid in the method of removing excessively attached solder powder is a liquid to which ultrasonic vibration is applied,
［９］ 上記［５］〜［８］のいずれかに記載の製造方法を用いて作成したハンダ付電子回路基板、
［１０］ 上記［９］に記載のハンダ付電子回路基板に、電子部品を載置する工程と、ハンダをリフローして電子部品を基板に接合する工程とを含むことを特徴とする電子部品の実装方法、
［１１］ 上記［１０］に記載の電子部品の実装方法を用いて作成した電子部品を実装した電子回路基板、及び
［１２］ 粘着性付与化合物で処理することにより、電子回路基板上の金属回路露出部のみに粘着性を付与し、乾式または湿式において該粘着部にハンダ粉末を付着させ、次いで液体中において付着した余分なハンダ粉末を除去し、除去したハンダ粉末を回収して再使用することを特徴とするハンダ付電子回路基板の製造方法、を開発することにより上記の課題を解決した。
[9] A soldered electronic circuit board produced using the manufacturing method according to any one of [5] to [8],
[10] An electronic component comprising: a step of placing an electronic component on the soldered electronic circuit board according to [9]; and a step of reflowing the solder to join the electronic component to the substrate. Implementation method,
[11] An electronic circuit board on which an electronic component created using the electronic component mounting method described in [10] above is mounted, and [12] a metal circuit on the electronic circuit board by treating with an adhesive compound. Apply adhesiveness only to the exposed part, attach solder powder to the adhesive part in a dry or wet process, then remove excess solder powder adhering in the liquid, collect the removed solder powder, and reuse it. The above-mentioned problems have been solved by developing a method for manufacturing a soldered electronic circuit board characterized by:
本発明によるハンダ粉末の乾式付着、湿式除去からなるハンダ粉末の付着方法及びそれを用いた電子回路基板製造方法により、簡単な操作で微細なハンダ回路パターンを形成すること及び回収ハンダ粉末の再使用が可能となった。特に、微細な回路パターンにおいても隣接する回路パターン間でのハンダ金属による短絡が減少する効果が得られ、電子回路基板の信頼性が著しく向上した。また本発明の電子回路基板の製造方法により、電子部品を実装した回路基板の小型化と高信頼性化が実現でき、優れた特性の電子機器を提供することが可能となった。 Forming a fine solder circuit pattern with a simple operation and reusing the recovered solder powder by the method of depositing solder powder comprising dry deposition and wet removal of the solder powder according to the present invention and the method of manufacturing an electronic circuit board using the same Became possible. In particular, even in a fine circuit pattern, an effect of reducing a short circuit due to solder metal between adjacent circuit patterns is obtained, and the reliability of the electronic circuit board is remarkably improved. In addition, the electronic circuit board manufacturing method of the present invention can realize miniaturization and high reliability of a circuit board on which electronic components are mounted, and can provide an electronic device having excellent characteristics.
本発明の対象となる電子回路基板は、プラスチック基板、プラスチックフィルム基板、ガラス布基板、紙基質エポキシ樹脂基板、セラミックス基板等に金属板を積層した基板、あるいは金属基材にプラスチックあるいはセラミックス等を被覆した絶縁基板上に、金属等の導電性物質を用いて回路パターンを形成した片面電子回路基板、両面電子回路基板、多層電子回路基板あるいはフレキシブル電子回路基板等である。 Electronic circuit boards subject to the present invention are plastic substrates, plastic film substrates, glass cloth substrates, paper substrates, epoxy resin substrates, substrates obtained by laminating metal plates on ceramic substrates, etc., or metal substrates coated with plastics, ceramics, etc. A single-sided electronic circuit board, a double-sided electronic circuit board, a multilayer electronic circuit board, a flexible electronic circuit board, or the like in which a circuit pattern is formed on a conductive substrate such as a metal on the insulating substrate.
本発明は、例えば上記電子回路基板上の導電性回路電極表面を粘着性付与化合物で処理することにより該電極表面に粘着性を付与し、該粘着部にハンダ粉末を付着させ、静電気などで目的とする導電性回路電極表面以外に付着した余分のハンダ粉末、必要以上に導電性回路電極表面付着した余分のハンダ粉末を、液体中において効率よく除去し、次いで該電子回路基板を加熱し、付着しているハンダを溶融してハンダ回路を形成するハンダ付電子回路基板の製造方法である。 The present invention, for example, by treating the surface of the conductive circuit electrode on the electronic circuit board with a tackifier compound, imparts tackiness to the electrode surface, attaches solder powder to the adhesive portion, The excess solder powder adhered to the surface other than the conductive circuit electrode surface, and the excessive solder powder adhered to the conductive circuit electrode surface more efficiently than necessary, are efficiently removed in the liquid, and then the electronic circuit board is heated and adhered. This is a method of manufacturing a soldered electronic circuit board in which solder is melted to form a solder circuit.
回路を形成する導電性物質としては、ほとんどの場合銅が用いられているが、本発明ではこれに限定されず、後述する粘着性付与物質により表面に粘着性が得られる導電性の物質であればよい。これらの物質として、例えば、Ｎｉ、Ｓｎ、Ｎｉ−Ａｌ、ハンダ合金等を含む物質が例示できる。 In most cases, copper is used as a conductive material for forming a circuit. However, the present invention is not limited to this, and any conductive material can be used that provides adhesion to the surface by a tackifier that will be described later. That's fine. Examples of these substances include substances containing Ni, Sn, Ni—Al, solder alloys, and the like.
本発明で用いることが好ましい粘着性付与化合物としては、ナフトトリアゾール系誘導体、べンゾトリアゾール系誘導体、イミダゾール系誘導体、べンゾイミダゾール系誘導体、メルカプトべンゾチアゾール系誘導体及びべンゾチアゾールチオ脂肪酸等が挙げられる。これらの粘着性付与化合物は特に銅に対しての効果が強いが、他の導電性物質にも粘着性を付与することができる。 Examples of tackifying compounds preferably used in the present invention include naphthotriazole derivatives, benzotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothioazole derivatives, and benzothiazole thio fatty acids. Is mentioned. These tackifying compounds have a particularly strong effect on copper, but can also provide tackiness to other conductive substances.
べンゾトリアゾール系誘導体は一般式（１）で表される。
本発明においては、一般式（１）のＲ１〜Ｒ４は、独立に水素原子、炭素数が１〜１６、好ましくは、５〜１６のアルキル基、アルコキシ基、Ｆ、Ｂｒ、Ｃｌ、Ｉ、シアノ基、アミノ基またはＯＨ基を表す。
これらの化合物は、一般式（１）で示されるべンゾトリアゾール系誘導体としてはＲ１〜Ｒ４は、一般には炭素数が多いほうが粘着性が強い。
In the present invention, R1 to R4 in the general formula (1) are independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, preferably 5 to 16 alkyl groups, an alkoxy group, F, Br, Cl, I, cyano. Represents a group, an amino group or an OH group.
In these compounds, as the benzotriazole derivative represented by the general formula (1), R1 to R4 generally have higher adhesion as the number of carbon atoms increases.
ナフトトリアゾール系誘導体は一般式（２）で表される。
本発明においては、一般式（２）のＲ５〜Ｒ１０は、独立に水素原子、炭素数が１〜１６、好ましくは、５〜１６のアルキル基、アルコキシ基、Ｆ、Ｂｒ、Ｃｌ、Ｉ、シアノ基、アミノ基またはＯＨ基を表す。 In the present invention, R5 to R10 in the general formula (2) are independently a hydrogen atom, an alkyl group having 1 to 16, and preferably 5 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, cyano. Represents a group, an amino group or an OH group.
イミダゾール系誘導体は一般式（３）で表される。
本発明においては、一般式（３）のＲ１１、Ｒ１２は、独立に水素原子、炭素数が１〜１６、好ましくは、５〜１６のアルキル基、アルコキシ基、Ｆ、Ｂｒ、Ｃｌ、Ｉ、シアノ基、アミノ基またはＯＨ基を表す。 In the present invention, R11 and R12 in the general formula (3) are each independently a hydrogen atom, an alkyl group having 1 to 16, preferably 5 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, cyano. Represents a group, an amino group or an OH group.
べンゾイミダゾール系誘導体は一般式（４）で表される。
本発明においては、一般式（４）のＲ１３〜Ｒ１７は、独立に水素原子、炭素数が１〜１６、好ましくは、５〜１６のアルキル基、アルコキシ基、Ｆ、Ｂｒ、Ｃｌ、Ｉ、シアノ基、アミノ基またはＯＨ基を表す。
一般式（３）及び一般式（４）で示されるイミダゾール系誘導体及びべンゾイミダゾール系誘導体のＲ１１〜Ｒ１７においても、一般には炭素数の多いほうが粘着性が強い。
In the present invention, R13 to R17 in the general formula (4) are independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, preferably 5 to 16 alkyl groups, an alkoxy group, F, Br, Cl, I, cyano. Represents a group, an amino group or an OH group.
Also in R11 to R17 of the imidazole derivatives and benzoimidazole derivatives represented by the general formula (3) and the general formula (4), in general, the higher the number of carbon atoms, the stronger the tackiness.
メルカプトべンゾチアゾール系誘導体は一般式（５）で表される。
本発明においては、一般式（５）のＲ１８〜Ｒ２１は、独立に水素原子、炭素数が１〜１６、好ましくは、５〜１６のアルキル基、アルコキシ基、Ｆ、Ｂｒ、Ｃｌ、Ｉ、シアノ基、アミノ基またはＯＨ基を表す。 In the present invention, R18 to R21 in the general formula (5) are each independently a hydrogen atom, an alkyl group having 1 to 16, and preferably 5 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, cyano. Represents a group, an amino group or an OH group.
べンゾチアゾールチオ脂肪酸系誘導体は一般式（６）で表される。
本発明においては、一般式（６）のＲ２２〜Ｒ２６は、独立に水素原子、炭素数が１〜１６、好ましくは、１または２のアルキル基、アルコキシ基、Ｆ、Ｂｒ、Ｃｌ、Ｉ、シアノ基、アミノ基またはＯＨ基を表す。
一般式（６）で示されるべンゾチアゾールチオ脂肪酸系誘導体においては、Ｒ２２〜Ｒ２６は炭素数１または２が好ましい。
In the present invention, R22 to R26 in the general formula (6) are independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, preferably 1 or 2, an alkoxy group, F, Br, Cl, I, cyano. Represents a group, an amino group or an OH group.
In the benzothiazole thio fatty acid derivative represented by the general formula (6), R22 to R26 preferably have 1 or 2 carbon atoms.
本発明において、電子回路基板上の導電性回路電極表面に粘着性を付与するに際し、上記の粘着性付与化合物の少なくとも一つを水または酸性水に溶解し、好ましくはｐＨ３〜４程度の微酸性に調整して用いる。ｐＨの調整に用いる物質としては、導電性物質が金属であるときは塩酸、硫酸、硝酸、リン酸等の無機酸をあげることができる。また有機酸としては、蟻酸、酢酸、プロピオン酸、リンゴ酸、シュウ酸、マロン酸、コハク酸、酒石酸等が使用できる。該粘着性付与化合物の濃度は厳しく限定はされないが溶解性、使用状況に応じて適宜調整して用いるが、好ましくは全体として０．０５質量％〜２０質量％の範囲内の濃度が使用しやすい。これより低濃度にすると粘着性膜の生成が不十分となり、性能上好ましくない。 In the present invention, at the time of imparting tackiness to the surface of the conductive circuit electrode on the electronic circuit board, at least one of the tackifying compounds described above is dissolved in water or acidic water, preferably slightly acidic having a pH of about 3 to 4. Adjust to use. Examples of the substance used for adjusting the pH include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid when the conductive substance is a metal. As the organic acid, formic acid, acetic acid, propionic acid, malic acid, oxalic acid, malonic acid, succinic acid, tartaric acid and the like can be used. The concentration of the tackifier compound is not strictly limited, but is appropriately adjusted according to solubility and use conditions, but preferably a concentration in the range of 0.05% by mass to 20% by mass is easy to use as a whole. . If the concentration is lower than this, the formation of an adhesive film becomes insufficient, which is not preferable in terms of performance.
処理温度は室温よりは若干加温したほうが粘着性膜の生成速度、生成量が良い。粘着性付与化合物濃度、金属の種類などにより変わり限定的でないが、一般的には３０℃〜６０℃位の範囲が好適である。処理時間は限定的でないが、作業効率から５秒〜５分間位の範囲になるように他の条件を調整することが好ましい。 The treatment temperature and the production amount of the adhesive film are better when the treatment temperature is slightly warmer than room temperature. Although it varies depending on the tackifying compound concentration, the type of metal, and the like, it is generally in the range of about 30 ° C to 60 ° C. Although the treatment time is not limited, it is preferable to adjust other conditions so that the working efficiency is in the range of about 5 seconds to 5 minutes.
なおこの場合、溶液中に銅（１価または２価）をイオンとして１００〜１０００ｐｐｍを共存させると、粘着性膜の生成速度、生成量などの生成効率が高まるので好ましい。 In this case, it is preferable to coexist 100 to 1000 ppm with copper (monovalent or divalent) as ions in the solution because the production efficiency such as the production rate and production amount of the adhesive film is increased.
処理すべき電子回路基板は、ハンダ不要の導電性回路部分をレジスト等で覆い、回路パターンの導電性回路電極部分（基板上、露出した金属表面）のみが露出した状態にしておき、粘着性付与化合物溶液で処理するのが好ましい。
ここで使用する前述の粘着性付与化合物溶液に電子回路基板を浸漬するか、または溶液を塗布若しくはスプレーなどをすると、導電性回路表面が粘着性が付与される。
For the electronic circuit board to be treated, cover the conductive circuit part that does not require soldering with resist, etc., and leave only the conductive circuit electrode part (exposed metal surface on the board) of the circuit pattern to give adhesion. Treatment with a compound solution is preferred.
When the electronic circuit board is immersed in the above-described tackifying compound solution used here, or the solution is applied or sprayed, the surface of the conductive circuit is given tackiness.
本発明の電子回路基板の製造方法に使用するハンダ粉末の金属組成としては、例えばＳｎ−Ｐｂ系、Ｓｎ−Ｐｂ−Ａｇ系、Ｓｎ−Ｐｂ−Ｂｉ系、Ｓｎ−Ｐｂ−Ｂｉ−Ａｇ系、Ｓｎ−Ｐｂ−Ｃｄ系が挙げられる。また最近の産業廃棄物におけるＰｂ排除の観点から、Ｐｂを含まないＳｎ−Ｉｎ系、Ｓｎ−Ｂｉ系、Ｉｎ−Ａｇ系、Ｉｎ−Ｂｉ系、Ｓｎ−Ｚｎ系、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｓｂ系、Ｓｎ−Ａｕ系、Ｓｎ−Ｂｉ−Ａｇ−Ｃｕ系、Ｓｎ−Ｇｅ系、Ｓｎ−Ｂｉ−Ｃｕ系、Ｓｎ−Ｃｕ−Ｓｂ−Ａｇ系、Ｓｎ−Ａｇ−Ｚｎ系、Ｓｎ−Ｃｕ−Ａｇ系、Ｓｎ−Ｂｉ−Ｓｂ系、Ｓｎ−Ｂｉ−Ｓｂ−Ｚｎ系、Ｓｎ−Ｂｉ−Ｃｕ−Ｚｎ系、Ｓｎ−Ａｇ−Ｓｂ系、Ｓｎ−Ａｇ−Ｓｂ−Ｚｎ系、Ｓｎ−Ａｇ−Ｃｕ−Ｚｎ系、Ｓｎ−Ｚｎ−Ｂｉ系が好ましい。 Examples of the metal composition of the solder powder used in the method for producing an electronic circuit board of the present invention include Sn—Pb, Sn—Pb—Ag, Sn—Pb—Bi, Sn—Pb—Bi—Ag, and Sn. -Pb-Cd system is mentioned. Further, from the viewpoint of eliminating Pb in recent industrial waste, Sn-In, Sn-Bi, In-Ag, In-Bi, Sn-Zn, Sn-Ag, Sn-Cu, which does not contain Pb. -Based, Sn-Sb-based, Sn-Au-based, Sn-Bi-Ag-Cu-based, Sn-Ge-based, Sn-Bi-Cu-based, Sn-Cu-Sb-Ag-based, Sn-Ag-Zn-based, Sn -Cu-Ag system, Sn-Bi-Sb system, Sn-Bi-Sb-Zn system, Sn-Bi-Cu-Zn system, Sn-Ag-Sb system, Sn-Ag-Sb-Zn system, Sn-Ag -Cu-Zn type and Sn-Zn-Bi type are preferable.
上記の具体例としては、Ｓｎが６３質量％、Ｐｂが３７質量％の共晶ハンダ（以下６３Ｓｎ／３７Ｐｂと表す。）を中心として、６２Ｓｎ／３６Ｐｂ／２Ａｇ、６２．６Ｓｎ／３７Ｐｂ／０．４Ａｇ、６０Ｓｎ／４０Ｐｂ、５０Ｓｎ／５０Ｐｂ、３０Ｓｎ／７０Ｐｂ、２５Ｓｎ／７５Ｐｂ、１０Ｓｎ／８８Ｐｂ／２Ａｇ、４６Ｓｎ／８Ｂｉ／４６Ｐｂ、５７Ｓｎ／３Ｂｉ／４０Ｐｂ、４２Ｓｎ／４２Ｐｂ／１４Ｂｉ／２Ａｇ、４５Ｓｎ／４０Ｐｂ／１５Ｂｉ、５０Ｓｎ／３２Ｐｂ／１８Ｃｄ、４８Ｓｎ／５２Ｉｎ、４３Ｓｎ／５７Ｂｉ、９７Ｉｎ／３Ａｇ、５８Ｓｎ／４２Ｉｎ、９５Ｉｎ／５Ｂｉ、６０Ｓｎ／４０Ｂｉ、９１Ｓｎ／９Ｚｎ、９６．５Ｓｎ／３．５Ａｇ、９９．３Ｓｎ／０．７Ｃｕ、９５Ｓｎ／５Ｓｂ、２０Ｓｎ／８０Ａｕ、９０Ｓｎ／１０Ａｇ、９０Ｓｎ／７．５Ｂｉ／２Ａｇ／０．５Ｃｕ、９７Ｓｎ／３Ｃｕ、９９Ｓｎ／１Ｇｅ、９２Ｓｎ／７．５Ｂｉ／０．５Ｃｕ、９７Ｓｎ／２Ｃｕ／０．８Ｓｂ／０．２Ａｇ、９５．５Ｓｎ／３．５Ａｇ／１Ｚｎ、９５．５Ｓｎ／４Ｃｕ／０．５Ａｇ、５２Ｓｎ／４５Ｂｉ／３Ｓｂ、５１Ｓｎ／４５Ｂｉ／３Ｓｂ／１Ｚｎ、８５Ｓｎ／１０Ｂｉ／５Ｓｂ、８４Ｓｎ／１０Ｂｉ／５Ｓｂ／１Ｚｎ、８８．２Ｓｎ／１０Ｂｉ／０．８Ｃｕ／１Ｚｎ、８９Ｓｎ／４Ａｇ／７Ｓｂ、８８Ｓｎ／４Ａｇ／７Ｓｂ／１Ｚｎ、９８Ｓｎ／１Ａｇ／１Ｓｂ、９７Ｓｎ／１Ａｇ／１Ｓｂ／１Ｚｎ、９１．２Ｓｎ／２Ａｇ／０．８Ｃｕ／６Ｚｎ、８９Ｓｎ／８Ｚｎ／３Ｂｉ、８６Ｓｎ／８Ｚｎ／６Ｂｉ、８９．１Ｓｎ／２Ａｇ／０．９Ｃｕ／８Ｚｎなどが挙げられる。また本発明に用いるハンダ粉末として、異なる組成のハンダ粉末を２種類以上混合したものでもよい。 Specific examples of the above are 62Sn / 36Pb / 2Ag, 62.6Sn / 37Pb / 0.4Ag centering on eutectic solder (hereinafter referred to as 63Sn / 37Pb) with 63% by mass of Sn and 37% by mass of Pb. 60Sn / 40Pb, 50Sn / 50Pb, 30Sn / 70Pb, 25Sn / 75Pb, 10Sn / 88Pb / 2Ag, 46Sn / 8Bi / 46Pb, 57Sn / 3Bi / 40Pb, 42Sn / 42Pb / 14Bi / 2Ag, 45Sn / 40Pb / 15Si / 32Pb / 18Cd, 48Sn / 52In, 43Sn / 57Bi, 97In / 3Ag, 58Sn / 42In, 95In / 5Bi, 60Sn / 40Bi, 91Sn / 9Zn, 96.5Sn / 3.5Ag, 99.3Sn / 0.7Cu, 95Sn / 5Sb, 20Sn / 80Au, 0Sn / 10Ag, 90Sn / 7.5Bi / 2Ag / 0.5Cu, 97Sn / 3Cu, 99Sn / 1Ge, 92Sn / 7.5Bi / 0.5Cu, 97Sn / 2Cu / 0.8Sb / 0.2Ag, 95.5Sn / 3.5Ag / 1Zn, 95.5Sn / 4Cu / 0.5Ag, 52Sn / 45Bi / 3Sb, 51Sn / 45Bi / 3Sb / 1Zn, 85Sn / 10Bi / 5Sb, 84Sn / 10Bi / 5Sb / 1Zn, 88.2Sn / 10Bi / 0.8Cu / 1Zn, 89Sn / 4Ag / 7Sb, 88Sn / 4Ag / 7Sb / 1Zn, 98Sn / 1Ag / 1Sb, 97Sn / 1Ag / 1Sb / 1Zn, 91.2Sn / 2Ag / 0.8Cu / 6Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn / 6Bi, 89.1Sn / 2Ag / 0.9Cu / 8Z And the like. Further, the solder powder used in the present invention may be a mixture of two or more kinds of solder powders having different compositions.
上記のハンダ粉末の中でもＰｂフリーハンダ、特に好ましくはＳｎおよびＺｎ、又はＳｎおよびＺｎおよびＢｉを含有するハンダから選ばれた合金組成を用いて本発明の電子回路基板を作製した場合、Ｓｎ−Ｐｂ系のハンダと同等レベルまでリフロー温度が下げられるため、実装部品の長寿命化がはかられ、また部品の多様化にも対応できる。 When the electronic circuit board of the present invention is produced using an alloy composition selected from Pb-free solder, particularly preferably Sn and Zn, or solder containing Sn and Zn and Bi among the above solder powders, Sn-Pb Since the reflow temperature is lowered to the same level as the solder of the system, the life of the mounted parts can be extended, and it is possible to cope with the diversification of parts.
ハンダ粉末の粒径としては、日本工業規格（ＪＩＳ）には、ふるい分けにより５３〜２２μｍ、４５〜２２μｍ及び３８〜２２μｍ等の規格が定められている。本発明のハンダ粉末の平均粒径測定には通常、ＪＩＳにより定められた、標準ふるいと天秤による方法を用いることができる。また、この他にも、顕微鏡による画像解析や、エレクトロゾーン法によるコールターカウンターでも行うことができる。コールターカウンターについては「粉体工学便覧」（粉体工学会編、第２版ｐ１９〜ｐ２０）にその原理が示されているが、粉末を分散させた溶液を隔壁にあけた細孔に通過させ、その細孔の両側で電気抵抗変化を測定することにより粉末の粒径分布を測定するもので、粉径の個数比率を再現性良く測定することが可能である。本発明のハンダ粉末の平均粒径は上述の方法を用いて定めることができる。 As the particle size of the solder powder, standards such as 53 to 22 μm, 45 to 22 μm, and 38 to 22 μm are defined in the Japanese Industrial Standard (JIS) by sieving. In order to measure the average particle size of the solder powder of the present invention, a method using a standard sieve and a balance defined by JIS can be usually used. In addition, image analysis using a microscope or Coulter counter using an electrozone method can also be performed. The principle of the Coulter Counter is shown in the “Powder Engineering Handbook” (Edition of Powder Engineering, 2nd edition, p19-p20), but the solution in which the powder is dispersed is passed through the pores in the partition walls. The particle size distribution of the powder is measured by measuring the change in electrical resistance on both sides of the pore, and the number ratio of the powder diameter can be measured with good reproducibility. The average particle size of the solder powder of the present invention can be determined using the method described above.
本発明では粘着性を付与した電子回路基板へのハンダ粉末の付着を従来法の乾式または湿式で行い、余分に付着したハンダ粉末の除去を液体中で行うことを特徴とする。余分のハンダ粉末の除去を液体中で行うことにより、除去作業中にハンダ粉末が静電気により粘着性のない部分に付着したり、またハンダ粉末が静電気により凝集したりするのを防ぎ、ファインピッチの回路基板や、また微粉のハンダ粉を用いることが可能となる。
ハンダ粉末の付着工程を乾式で行うときは、プラスチック基板などの静電を帯びやすい電子回路基板は、余分のハンダ粉末を除去するためにプラスチック表面を刷毛などでこすると静電が発生しやすく、ハンダ粉末が微細であると粘着性を付与しない部分にも付着しやすく、必要でない部分にハンダ粉末が付着して回路パターン間で短絡などを生じやすい。本発明においてはこの問題を液体中で余分のハンダ粉末の除去を行うことにより静電等によるトラブルを解決した。
The present invention is characterized in that the adhesion of the solder powder to the electronic circuit board to which the adhesiveness has been imparted is performed by a conventional dry or wet method, and the excessively adhered solder powder is removed in a liquid. By removing the excess solder powder in the liquid, it is possible to prevent the solder powder from adhering to non-adhesive parts due to static electricity during the removal operation, and to prevent the solder powder from aggregating due to static electricity. It is possible to use a circuit board or fine solder powder.
When the solder powder adhesion process is performed in a dry process, an electrostatic circuit board such as a plastic substrate, which is easily charged with static electricity, can easily generate static electricity by rubbing the surface of the plastic with a brush to remove excess solder powder. If the solder powder is fine, it easily adheres to a portion where no tackiness is imparted, and the solder powder adheres to an unnecessary portion, so that a short circuit is likely to occur between circuit patterns. In the present invention, this problem is solved by removing the excess solder powder in the liquid, thereby causing troubles due to static electricity.
また粘着性を付与した電子回路基板へのハンダ粉末の付着を液体中で行う場合には、ハンダ粉末を分散させた液体中にプリント配線板を浸すことにより行う。ハンダ粉末を付着させる際に、はんだ粉末分散液に振動、好ましくは０．１Ｈｚ〜数ｋＨｚの振動、特に好ましくは低周波振動を加えて付着させることが好ましい。液体中でハンダ粉末を付着させる際の、液体中のハンダ粉末の濃度は、好ましくは０．５〜１０見かけ容積％の範囲内、より好ましくは、３〜８見かけ容積％の範囲内とする。
本発明では、ハンダ粉末の付着に用いる液体として、水を用いるのが好ましい。また液体中の溶存酸素によりハンダ粉末が酸化するのを防ぐため、液体に防錆剤を添加するのが好ましい。
Further, when the solder powder is attached to the electronic circuit board to which the adhesive property is given in the liquid, the printed wiring board is immersed in the liquid in which the solder powder is dispersed. When depositing the solder powder, it is preferable to apply the vibration to the solder powder dispersion by applying vibration, preferably vibration of 0.1 Hz to several kHz, particularly preferably low frequency vibration. The concentration of the solder powder in the liquid when depositing the solder powder in the liquid is preferably in the range of 0.5 to 10 apparent volume%, more preferably in the range of 3 to 8 apparent volume%.
In the present invention, water is preferably used as the liquid used for the adhesion of the solder powder. In order to prevent the solder powder from being oxidized by dissolved oxygen in the liquid, it is preferable to add a rust inhibitor to the liquid.
乾式または湿式において付着させた余分のハンダ粉末除去工程に使用する液体としては、水またはこれと水溶性の低沸点の有機溶媒の混合溶媒などが使用出来る。環境汚染などの問題を考慮すると好ましいものは水である。
ハンダ粉末のリサイクルを考慮するときは、液体中の溶存酸素によりハンダ粉末が酸化するのを防ぐため、脱酸素水および／または防錆剤を添加した水が好ましい。脱酸素水としては、加熱して脱ガスした水、あるいは炭酸ガス、窒素などの不活性ガスでバブリングした水が使用出来る。また防錆剤を添加した水あるいは脱酸素水に防錆剤を添加した水であっても良い。この様な脱酸素水および／または防錆剤を添加した水を使用するときは、除去したハンダ粉末表面の酸化が防止されるため、回収して再利用するのに都合がよい。防錆剤を使用したときは後で水洗の必要などがあることがあるので、脱酸素水の使用が好ましい。
As the liquid used in the process of removing the excess solder powder adhered in the dry or wet process, water or a mixed solvent of this and a water-soluble low boiling organic solvent can be used. In view of problems such as environmental pollution, water is preferred.
When recycling the solder powder is considered, deoxidized water and / or water to which a rust inhibitor is added is preferable in order to prevent the solder powder from being oxidized by dissolved oxygen in the liquid. As deoxygenated water, water degassed by heating, or water bubbled with an inert gas such as carbon dioxide or nitrogen can be used. Moreover, the water which added the rust preventive agent to the water which added the rust preventive agent, or deoxygenated water may be sufficient. When such deoxygenated water and / or water added with a rust inhibitor is used, oxidation of the removed solder powder surface is prevented, which is convenient for recovery and reuse. When a rust inhibitor is used, it may be necessary to wash with water later, and therefore deoxygenated water is preferably used.
本発明では、液体中で行う余分のハンダ粉末の除去を、液体中に電子回路基板を浸したりスプレーするにより行うことが出来る。余分のハンダ粉末の除去は刷毛などで電子回路基板表面を軽くなでることでも良いが、液体に振動、好ましくは０．１Ｈｚ〜数百Ｈｚの振動、または超音波を加えるのが好ましい。液体中でハンダ粉末を除去する際の液体中のハンダ粉末は簡単に沈降するので 、飛散せず容易に回収できる。 In the present invention, the removal of excess solder powder in the liquid can be performed by immersing or spraying the electronic circuit board in the liquid. The excess solder powder may be removed by brushing the surface of the electronic circuit board with a brush or the like, but it is preferable to apply vibration, preferably vibration of 0.1 Hz to several hundred Hz, or ultrasonic wave to the liquid. Since the solder powder in the liquid when the solder powder is removed in the liquid easily settles, it can be easily recovered without scattering.
本発明に使用するハンダ粉末は酸化を防止するため、ハンダ粉末の表面をコーティングするのが好ましい。ハンダ粉末のコーティング剤としては、ベンゾチアゾール誘導体、炭素数４〜１０のアルキル基を側鎖にもつアミン類、チオ尿素、シランカップリング剤、鉛、スズ、金、無機酸塩及び有機酸塩のうちの少なくとも１種を用いて行うのが好ましく、有機酸塩としては、ラウリン酸、ミリスチン酸、パルミチン酸およびステアリン酸から選ばれる少なくとも１つを用いるのが好ましい。
本発明の処理方法は、前述したハンダプリコート回路基板のみならず、ＢＧＡ接合用等のバンプ形成としても有効に使用できるものであり、本発明の電子回路基板に当然含まれるものである。
In order to prevent oxidation of the solder powder used in the present invention, the surface of the solder powder is preferably coated. Solder powder coating agents include benzothiazole derivatives, amines having 4 to 10 carbon atoms in the side chain, thiourea, silane coupling agents, lead, tin, gold, inorganic acid salts and organic acid salts. It is preferable to use at least one of them, and as the organic acid salt, it is preferable to use at least one selected from lauric acid, myristic acid, palmitic acid and stearic acid.
The processing method of the present invention can be effectively used not only for the solder precoat circuit board described above but also for bump formation for BGA bonding and the like, and is naturally included in the electronic circuit board of the present invention.
余分のハンダ粉末を除去し、且つ粘着部にハンダ粉末を付着した電子回路基板は次ぎに乾燥し、次いでリフロー工程により付着ハンダ粉末を加熱、溶融してハンダ付電子回路基板とする。この加熱は粘着部に付着しているハンダ粉末が溶融すればよいのでハンダ粉末の融点などを考慮して簡単に処理温度、処理時間等を定めることが出来る。 The electronic circuit board with the excess solder powder removed and the solder powder adhered to the adhesive portion is then dried, and then the adhered solder powder is heated and melted in a reflow process to obtain a soldered electronic circuit board. In this heating, the solder powder adhering to the adhesive portion only needs to be melted, so that the processing temperature, processing time, etc. can be easily determined in consideration of the melting point of the solder powder.
液体中で電子回路基板から除去した余分なハンダ粉末は、簡単に液体から分離出来るのでこれを集め、非酸化性雰囲気下で乾燥し、ハンダ粉末の乾式付着工程にリサイクルする。乾燥に際し出来ればハンダ粉末の表面を前記のコーティング剤等でコーティングするのが好ましい。または粉末を水中で付着する方法をとる場合は沈殿させた粉末を回収しそのまま利用する。 The excess solder powder removed from the electronic circuit board in the liquid can be easily separated from the liquid and is collected, dried in a non-oxidizing atmosphere, and recycled to the solder powder dry deposition process. If possible, it is preferable to coat the surface of the solder powder with the coating agent or the like. Alternatively, when the method of attaching the powder in water is used, the precipitated powder is recovered and used as it is.
本発明で作製したハンダ付電子回路基板は、電子部品を載置する工程と、ハンダをリフローして電子部品を接合する工程とを含む電子部品の実装方法に好適に用いることができる。例えば本発明で作製したハンダ付電子回路基板の、電子部品の接合を所望する部分に、印刷法等でハンダペーストを塗布し、電子部品を載置し、その後加熱してハンダペースト中のハンダ粉末を溶融し凝固させることにより電子部品を回路基板に接合することができる。 The soldered electronic circuit board produced by the present invention can be suitably used for a mounting method of an electronic component including a step of placing the electronic component and a step of reflowing the solder to join the electronic component. For example, a solder paste is applied to a portion of the electronic circuit board with solder produced according to the present invention where the electronic component is desired to be joined by a printing method or the like, the electronic component is placed, and then heated to solder powder in the solder paste. By melting and solidifying, the electronic component can be bonded to the circuit board.
本発明方法によって得られたハンダ付電子回路基板と電子部品の接合方法（実装方法）としては、例えば表面実装技術（ＳＭＴ）を用いることができる。この実装方法は、まずハンダペーストを印刷法により電子回路基板、例えば回路パターンの所望する箇所に塗布する。次いで、チップ部品やＱＦＰなどの電子部品をハンダペースト上に載置し、リフロー熱源により一括してハンダ接合をする。リフロー熱源には、熱風炉、赤外線炉、蒸気凝縮ハンダ付け装置、光ビームハンダ付け装置等を使用することができる。 As a bonding method (mounting method) between the electronic circuit board with solder and the electronic component obtained by the method of the present invention, for example, surface mounting technology (SMT) can be used. In this mounting method, first, a solder paste is applied to a desired portion of an electronic circuit board, for example, a circuit pattern, by a printing method. Next, electronic components such as chip components and QFP are placed on the solder paste, and solder bonding is collectively performed using a reflow heat source. As the reflow heat source, a hot air furnace, an infrared furnace, a vapor condensation soldering device, a light beam soldering device, or the like can be used.
本発明のリフローのプロセスはハンダ合金組成で異なるが、９１Ｓｎ／９Ｚｎ、８９Ｓｎ／８Ｚｎ／３Ｂｉ、８６Ｓｎ／８Ｚｎ／６ＢｉなどのＳｎ−Ｚｎ系の場合、プレヒートとリフローの２段工程で行うのが好ましく、それぞれの条件は、プレヒートが温度１３０〜１８０℃、好ましくは、１３０〜１５０℃、プレヒート時間が６０〜１２０秒、好ましくは、６０〜９０秒、リフローは温度が２１０〜２３０℃、好ましくは、２１０〜２２０℃、リフロー時間が３０〜６０秒、好ましくは、３０〜４０秒である。なお他の合金系におけるリフロー温度は、用いる合金の融点に対し＋２０〜＋５０℃、好ましくは、合金の融点に対し＋２０〜＋３０℃とし、他のプレヒート温度、プレヒート時間、リフロー時間は上記と同様の範囲であればよい。 The reflow process of the present invention differs depending on the solder alloy composition, but in the case of Sn—Zn systems such as 91Sn / 9Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn / 6Bi, it is preferable to carry out two steps of preheating and reflow. In each condition, the preheating temperature is 130 to 180 ° C, preferably 130 to 150 ° C, the preheating time is 60 to 120 seconds, preferably 60 to 90 seconds, and the reflow temperature is 210 to 230 ° C, preferably 210-220 degreeC and reflow time are 30-60 seconds, Preferably, it is 30-40 seconds. The reflow temperature in other alloy systems is +20 to + 50 ° C. with respect to the melting point of the alloy used, preferably +20 to + 30 ° C. with respect to the melting point of the alloy, and the other preheating temperature, preheating time and reflow time are the same as above. Any range is acceptable.
上記のリフロープロセスを窒素中でも大気中でも実施することが可能である。窒素リフローの場合は酸素濃度を５見かけ容積％以下、好ましくは０．５見かけ容積％以下とすることで大気リフローの場合よりハンダ回路へのハンダの濡れ性が向上し、ハンダボールの発生も少なくなり安定した処理ができる。 The above reflow process can be carried out in nitrogen or air. In the case of nitrogen reflow, by setting the oxygen concentration to 5 apparent volume% or less, preferably 0.5 apparent volume% or less, the wettability of the solder to the solder circuit is improved and the generation of solder balls is less than in the case of atmospheric reflow. Stable processing is possible.
この後、該電子回路基板を冷却し表面実装が完了する。この実装方法による電子部品接合物の製造方法においては、電子回路基板の両面に接合を行ってもよい。なお、本発明の電子部品の実装方法に使用することができる電子部品としては、例えば、ＬＳＩ、抵抗器、コンデンサ、トランス、インダクタンス、フィルタ、発振子・振動子等があげられるが、これらに限定されるものではない。 Thereafter, the electronic circuit board is cooled to complete the surface mounting. In the manufacturing method of the electronic component bonded article by this mounting method, bonding may be performed on both surfaces of the electronic circuit board. Examples of electronic components that can be used in the electronic component mounting method of the present invention include, but are not limited to, LSIs, resistors, capacitors, transformers, inductances, filters, oscillators / vibrators, and the like. Is not to be done.
最小電極間隔が３０μｍのプリント配線板を作製した。導電性回路には銅を用いた。
粘着性付与化合物溶液として、一般式（３）のＲ１２のアルキル基がＣ１１Ｈ２３、Ｒ１１が水素原子であるイミダゾール系化合物の２質量％水溶液を、酢酸によりｐＨを約４に調整して用いた。該水溶液を４０℃に加温し、これに塩酸水溶液により前処理した前記プリント配線板を３分間浸漬し、銅回路表面に粘着性物質を生成させた。
A printed wiring board having a minimum electrode interval of 30 μm was produced. Copper was used for the conductive circuit.
As a tackifying compound solution, a 2% by mass aqueous solution of an imidazole compound in which the alkyl group of R12 in the general formula (3) is C 11 H 23 and R11 is a hydrogen atom is used by adjusting the pH to about 4 with acetic acid. It was. The aqueous solution was heated to 40 ° C., and the printed wiring board pretreated with an aqueous hydrochloric acid solution was immersed in the solution for 3 minutes to generate an adhesive substance on the surface of the copper circuit.
次いで該プリント配線板を、乾式において平均粒径約１０μｍの９６．５Ｓｎ／３．５Ａｇハンダ粉末を電極に接触させ付着した。その後表の条件で余分な部分に付着した粉末を除去した。次いで乾式においてエアジェットで吹き飛ばす方法、振動を付与した脱酸素水中で余分のハンダ粉末を除去する方法、及びプリント基板に振動を付与しながら脱酸素水のシャワーで洗浄する方法を行った。
このプリント配線板を２４０℃のオーブンに入れ、ハンダ粉末を溶融し、銅回路露出部上に厚さ約１０μｍの９６．５Ｓｎ／３．５Ａｇハンダ薄層を形成し、観察をおこなった。結果を表１に示す。
Subsequently, 96.5Sn / 3.5Ag solder powder having an average particle diameter of about 10 μm was brought into contact with the electrode and adhered to the printed wiring board. Thereafter, the powder adhering to the excess portion was removed under the conditions shown in the table. Next, a method of blowing away with an air jet in a dry method, a method of removing excess solder powder in deoxygenated water to which vibration was applied, and a method of washing with a shower of deoxygenated water while applying vibration to the printed circuit board were performed.
This printed wiring board was placed in an oven at 240 ° C., the solder powder was melted, and a thin 96.5 Sn / 3.5 Ag solder layer having a thickness of about 10 μm was formed on the exposed copper circuit, and observation was performed. The results are shown in Table 1.
基板上の金属露出部に粘着性を付与し、該粘着部にハンダ粉末を付着させ、次いで液体中で余分に付着した半田粉末を除去し、除去した該電子回路基板を加熱し、ハンダを溶解してハンダ回路有するハンダ付電子回路基板の製造方法は、微細な回路パターンにおいても隣接する回路パターン間でのハンダ金属による短絡が減少する効果が得られ、信頼性が著しく向上したハンダ付電子回路基板を製造することが出来た。
この結果、微細な回路パターンを有し信頼性の高い電子部品を実装した回路基板の小型化と高信頼性化が実現でき、電子回路基板、高信頼性、高実装密度を実現できる電子部品を実装した回路基板、優れた特性の電子機器を提供することが可能となった。
除去した余分のハンダ粉末は回収して、ハンダ粉末付着工程にリサイクル使用出来るのでハンダ粉末の使用率も高くすることが出来た。
Adhesiveness is imparted to the exposed metal parts on the board, solder powder is adhered to the adhesive parts, then the solder powder that has been excessively adhered in the liquid is removed, the removed electronic circuit board is heated, and the solder is dissolved. The method of manufacturing a soldered electronic circuit board having a solder circuit has the effect of reducing the short circuit caused by the solder metal between adjacent circuit patterns even in a fine circuit pattern, and the soldered electronic circuit with significantly improved reliability. The board could be manufactured.
As a result, it is possible to reduce the size and reliability of a circuit board having a fine circuit pattern and mounted with highly reliable electronic components, and to achieve electronic circuit boards, electronic components that can achieve high reliability and high mounting density. It has become possible to provide mounted circuit boards and electronic devices with excellent characteristics.
The removed excess solder powder can be recovered and recycled in the solder powder adhesion process, so that the usage rate of the solder powder can be increased.
Claims (11)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005201567A JP4819422B2 (en) | 2005-07-11 | 2005-07-11 | Method for attaching solder powder to electronic circuit board and electronic wiring board with solder |
| CN2006800330575A CN101263753B (en) | 2005-07-11 | 2006-07-07 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
| KR1020087002109A KR100985057B1 (en) | 2005-07-11 | 2006-07-07 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
| PCT/JP2006/314019 WO2007007865A1 (en) | 2005-07-11 | 2006-07-07 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
| TW095125270A TWI328415B (en) | 2005-07-11 | 2006-07-11 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
| US12/013,246 US8109432B2 (en) | 2005-07-11 | 2008-01-11 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
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| JP2005201567A JP4819422B2 (en) | 2005-07-11 | 2005-07-11 | Method for attaching solder powder to electronic circuit board and electronic wiring board with solder |
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| JP2007019389A JP2007019389A (en) | 2007-01-25 |
| JP4819422B2 true JP4819422B2 (en) | 2011-11-24 |
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| JP (1) | JP4819422B2 (en) |
| KR (1) | KR100985057B1 (en) |
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| JPH0548258A (en) * | 1991-08-20 | 1993-02-26 | Murata Mfg Co Ltd | Soldering method for electronic component |
| JP2592757B2 (en) * | 1992-10-30 | 1997-03-19 | 昭和電工株式会社 | Solder circuit board and method for forming the same |
| TW379392B (en) * | 1996-10-30 | 2000-01-11 | Du Pont | Product and method for placing particles on contact pads of electronic devices |
| JP2933065B2 (en) * | 1997-06-18 | 1999-08-09 | 日本電気株式会社 | Arrangement method of small metal balls |
| JPH11240612A (en) * | 1998-02-26 | 1999-09-07 | Nichiden Mach Ltd | Minute ball alignment method and device |
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| KR20080019725A (en) | 2008-03-04 |
| KR100985057B1 (en) | 2010-10-04 |
| TWI328415B (en) | 2010-08-01 |
| JP2007019389A (en) | 2007-01-25 |
| CN101263753A (en) | 2008-09-10 |
| TW200730056A (en) | 2007-08-01 |
| CN101263753B (en) | 2010-09-29 |
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