JP4811913B2 - Manufacturing method of optical communication module - Google Patents

Manufacturing method of optical communication module Download PDF

Info

Publication number
JP4811913B2
JP4811913B2 JP2005271937A JP2005271937A JP4811913B2 JP 4811913 B2 JP4811913 B2 JP 4811913B2 JP 2005271937 A JP2005271937 A JP 2005271937A JP 2005271937 A JP2005271937 A JP 2005271937A JP 4811913 B2 JP4811913 B2 JP 4811913B2
Authority
JP
Japan
Prior art keywords
light
integrated circuit
resin
communication module
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005271937A
Other languages
Japanese (ja)
Other versions
JP2007088026A (en
Inventor
友春 堀尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2005271937A priority Critical patent/JP4811913B2/en
Publication of JP2007088026A publication Critical patent/JP2007088026A/en
Application granted granted Critical
Publication of JP4811913B2 publication Critical patent/JP4811913B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Description

本発明は、電子機器における双方向通信などに用いられる光通信モジュールの製造方法に関する。 The present invention relates to a process for the production of optical communication modules used for such two-way communication in an electronic device.

従来の光通信モジュールの一例を図１０に示す。同図に示された光通信モジュールＸは、基板９１に搭載された発光素子９２、受光素子９３、集積回路素子９４、および樹脂パッケージ９５を備えている。樹脂パッケージ９５には、発光素子９２および受光素子９３の正面に位置する２つのレンズ９５ａ，９５ｂが形成されている。発光素子９２は、赤外線を発光可能に構成されている。発光素子９２、受光素子９３、および集積回路素子９４には、複数のワイヤ９８が接続されている。発光素子９２の全体、および受光素子９３の図中上面は、透光性保護樹脂９７により覆われている。透光性保護樹脂９７は、発光素子９２や受光素子９３に不当な応力が発生することを防止するためのものである。集積回路素子９４は、遮光性保護樹脂９６により覆われている。遮光性保護樹脂９６は、外来の光あるいは発光素子９２からの光を遮蔽することにより、集積回路素子９４の誤動作を回避するためのものであり、遮光性樹脂材料を塗布することにより形成されている。発光素子９２から発せられた赤外線は、レンズ９５ａにより指向性を高められて図中上方へと出射される。一方、図中上方から向かってきた赤外線は、レンズ９５ｂにより受光素子９３へと集光される。このようにして、光通信モジュールＸによる赤外線を用いた双方向通信がなされる。   An example of a conventional optical communication module is shown in FIG. The optical communication module X shown in the figure includes a light emitting element 92, a light receiving element 93, an integrated circuit element 94, and a resin package 95 mounted on a substrate 91. In the resin package 95, two lenses 95a and 95b positioned in front of the light emitting element 92 and the light receiving element 93 are formed. The light emitting element 92 is configured to emit infrared light. A plurality of wires 98 are connected to the light emitting element 92, the light receiving element 93, and the integrated circuit element 94. The entire light emitting element 92 and the upper surface of the light receiving element 93 in the figure are covered with a translucent protective resin 97. The translucent protective resin 97 is for preventing an unreasonable stress from being generated in the light emitting element 92 and the light receiving element 93. The integrated circuit element 94 is covered with a light shielding protective resin 96. The light shielding protective resin 96 is for avoiding malfunction of the integrated circuit element 94 by shielding extraneous light or light from the light emitting element 92, and is formed by applying a light shielding resin material. Yes. Infrared rays emitted from the light emitting element 92 are emitted upward in the figure with the directivity enhanced by the lens 95a. On the other hand, the infrared rays traveling from above in the figure are condensed onto the light receiving element 93 by the lens 95b. In this way, bidirectional communication using infrared rays by the optical communication module X is performed.

しかしながら、光通信モジュールＸの製造工程において、遮光性保護樹脂９６を形成する際に、集積回路素子９４を完全に封止するように上記遮光性樹脂材料を塗布することは困難である。たとえば、上記遮光性樹脂材料を塗布する際に、ワイヤ９８が上記遮光性樹脂材料の流動を阻止する場合がある。この場合、遮光性保護樹脂９６には、集積回路素子９４に通じる孔が形成されるおそれがある。外来の光あるいは発光素子９２からの光がこの孔を通して集積回路素子９４に到達すると、集積回路素子９４が誤動作してしまう。このように、光通信モジュールＸは、集積回路素子９４の遮光対策について、未だ改善の余地があった。   However, in the manufacturing process of the optical communication module X, it is difficult to apply the light-shielding resin material so as to completely seal the integrated circuit element 94 when forming the light-shielding protective resin 96. For example, when applying the light-shielding resin material, the wire 98 may prevent the light-shielding resin material from flowing. In this case, the light shielding protective resin 96 may be formed with a hole leading to the integrated circuit element 94. When extraneous light or light from the light emitting element 92 reaches the integrated circuit element 94 through this hole, the integrated circuit element 94 malfunctions. Thus, the optical communication module X still has room for improvement with respect to the light shielding measures for the integrated circuit element 94.

特開２００１−７７４０４号公報JP 2001-77404 A

本発明は、上記した事情のもとで考え出されたものであって、集積回路素子の誤動作を適切に防止することが可能な光通信モジュールの製造方法を提供することをその課題とする。 The present invention, which has been proposed under the circumstances described above, and its object is to provide a manufacturing method of an optical communication module which can appropriately prevent malfunction of the integrated circuit device .

上記課題を解決するため、本発明では、次の技術的手段を講じている。   In order to solve the above problems, the present invention takes the following technical means.

本発明によって提供される光通信モジュールの製造方法は、発光素子、受光素子、および集積回路素子を基板に搭載する基板搭載工程と、上記集積回路素子を遮光性樹脂により金型を用いて封止する工程と、上記発光素子および上記受光素子を透光性樹脂により金型を用いて封止する工程と、を含んでおり、上記基板搭載工程においては、複数の上記集積回路素子を列状に集合基板に搭載し、かつ複数ずつの上記発光素子および上記受光素子を、上記複数の集積回路素子を挟んで両側に列状に上記集合基板に搭載し、複数の上記集積回路素子を封止する遮光性樹脂体を金型成形する工程と、複数の上記受光素子を封止するもの、および複数の上記発光素子を封止するもの、を含む２以上の透光性樹脂体を金型成形する工程と、上記集合基板、上記遮光性樹脂体、および上記透光性樹脂体を一括して切断する工程と、を有しており、上記遮光性樹脂体を金型成型する工程においては、上記発光素子および上記受光素子を収容する複数の凹部を有する金型を用いることを特徴としている。 A method of manufacturing an optical communication module provided by the present invention includes a substrate mounting step of mounting a light emitting element, a light receiving element, and an integrated circuit element on a substrate, and sealing the integrated circuit element with a light shielding resin using a mold. And a step of sealing the light emitting element and the light receiving element with a translucent resin using a mold. In the substrate mounting step, the plurality of integrated circuit elements are arranged in a row. A plurality of the light emitting elements and the light receiving elements mounted on the collective substrate are mounted on the collective substrate in rows on both sides of the plurality of integrated circuit elements, and the plurality of integrated circuit elements are sealed. Two or more translucent resin bodies including a step of molding a light-shielding resin body, a mold for sealing the plurality of light receiving elements, and a mold for sealing the plurality of light emitting elements are molded. Process and the above-mentioned collective substrate, Serial light-shielding resin material, and a step of cutting collectively the translucent resin member, which have a, in the step of molding the light-shielding resin material, the light emitting element and the light receiving element using a mold having a plurality of recesses for housing is characterized in Rukoto.

このような構成によれば、上記集積回路素子を上記遮光性樹脂により密閉することが可能である。上記遮光性樹脂を塗布することにより上記集積回路素子を封止する工程とは異なり、上記集積回路素子に通じる孔が形成されるおそれがない。したがって、上記集積回路素子を適切に遮光することが可能である。また、このような構成によれば、上記光通信モジュールを効率よく製造することができる。 According to such a configuration, the integrated circuit element can be sealed with the light shielding resin. Unlike the step of sealing the integrated circuit element by applying the light-shielding resin, there is no possibility that a hole leading to the integrated circuit element is formed. Therefore, the integrated circuit element can be appropriately shielded from light. Moreover, according to such a structure, the said optical communication module can be manufactured efficiently.

本発明のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。   Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

以下、本発明の好ましい実施の形態につき、図面を参照して具体的に説明する。   Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

図１および図２は、本発明に係る光通信モジュールの製造方法によって製造される光通信モジュールの一例としての赤外線データ通信モジュールを示している。図示された赤外線データ通信モジュールＡは、基板１、発光素子２、受光素子３、集積回路素子４、樹脂パッケージ５を具備しており、赤外線を用いた双方向通信が可能に構成されている。 1 and 2 show an infrared data communication module as an example of an optical communication module manufactured by the method for manufacturing an optical communication module according to the present invention. The illustrated infrared data communication module A includes a substrate 1, a light emitting element 2, a light receiving element 3, an integrated circuit element 4, and a resin package 5, and is configured to be capable of bidirectional communication using infrared rays.

基板１は、たとえばガラスエポキシ樹脂により、全体として平面視長矩形状に形成されている。基板１の図中上面には、配線パターン（図示略）が形成されている。基板１には、発光素子２、受光素子３、および集積回路素子４が搭載されている。図２に示すように、基板１の図中左側には、凹部が形成されている。この凹部は、その内面に金属膜（図示略）がメッキにより形成されており、発光素子２からの光を図中上方へと反射させる機能を発揮する。   The board | substrate 1 is formed in planar view long rectangular shape as a whole with glass epoxy resin, for example. A wiring pattern (not shown) is formed on the upper surface of the substrate 1 in the drawing. A light emitting element 2, a light receiving element 3, and an integrated circuit element 4 are mounted on the substrate 1. As shown in FIG. 2, a concave portion is formed on the left side of the substrate 1 in the figure. The recess has a metal film (not shown) formed on the inner surface thereof by plating, and exhibits a function of reflecting light from the light emitting element 2 upward in the drawing.

発光素子２は、たとえば、赤外線を発することができる赤外線発光ダイオードなどからなり、基板１の凹部内に搭載されている。発光素子２は、ワイヤ６により上記配線パターンと接続されている。   The light emitting element 2 is made of, for example, an infrared light emitting diode capable of emitting infrared light, and is mounted in the recess of the substrate 1. The light emitting element 2 is connected to the wiring pattern by wires 6.

受光素子３は、たとえば、赤外線を感知することができるＰＩＮフォトダイオードなどからなり、ワイヤ６により上記配線パターンと接続されている。受光素子３は、赤外線を受光すると、その光量に応じた出力信号を出力可能に構成されている。   The light receiving element 3 is composed of, for example, a PIN photodiode capable of sensing infrared rays, and is connected to the wiring pattern by wires 6. The light receiving element 3 is configured to be able to output an output signal corresponding to the amount of light when it receives infrared rays.

集積回路素子４は、発光素子２および受光素子３による送受信動作を制御するためのものである。集積回路素子４は、複数のワイヤ６により上記配線パターンと接続され、かつ上記配線パターンを通じて発光素子２および受光素子３に接続されている。   The integrated circuit element 4 is for controlling transmission / reception operations by the light emitting element 2 and the light receiving element 3. The integrated circuit element 4 is connected to the wiring pattern by a plurality of wires 6 and is connected to the light emitting element 2 and the light receiving element 3 through the wiring pattern.

樹脂パッケージ５は、発光素子２、受光素子３、および集積回路素子４を保護するためのものであり、２つの透光性樹脂部５１，５２と遮光性樹脂部５３とからなる。２つの透光性樹脂部５１，５２は、基板１の両端寄りに離間して配置されている。透光性樹脂部５１は、発光素子２を封止しており、透光性樹脂部５２は、受光素子３を封止している。２つの透光性樹脂部５１，５２は、たとえば顔料を含んだエポキシ樹脂により形成されており、可視光に対しては透光性を有しない反面、赤外線に対しては透光性を有する。２つの透光性樹脂部５１，５２には、それぞれレンズ５１ａ，５２ａが形成されている。レンズ５１ａは、発光素子２の図中上方正面に位置しており、発光素子２から放射された赤外線を集光しつつ出射するように構成されている。レンズ５２ａは、受光素子３の図中上方正面に位置しており、赤外線データ通信モジュールＡに送信されてきた赤外線を集光して受光素子３に入射するように構成されている。   The resin package 5 is for protecting the light emitting element 2, the light receiving element 3, and the integrated circuit element 4, and includes two light transmitting resin portions 51 and 52 and a light shielding resin portion 53. The two translucent resin portions 51 and 52 are arranged apart from both ends of the substrate 1. The translucent resin part 51 seals the light emitting element 2, and the translucent resin part 52 seals the light receiving element 3. The two translucent resin portions 51 and 52 are formed of, for example, an epoxy resin containing a pigment, and have no translucency for visible light, but have translucency for infrared light. Lenses 51a and 52a are formed on the two translucent resin portions 51 and 52, respectively. The lens 51a is positioned in front of the light emitting element 2 in the figure, and is configured to emit the infrared rays emitted from the light emitting element 2 while condensing them. The lens 52 a is positioned in front of the light receiving element 3 in the figure, and is configured to collect the infrared light transmitted to the infrared data communication module A and enter the light receiving element 3.

遮光性樹脂部５３は、集積回路素子４を封止しており、外来の光あるいは発光素子２からの光を遮断して集積回路素子４が誤動作することを防止するためのものである。遮光性樹脂部５３は、全体が略直方体形状であって、２つの透光性樹脂部５１，５２の間に介在しており、その図中上面およびこの上面に繋がる２つの側面が露出している。これにより、遮光性樹脂部５３は、樹脂パッケージ５のうち中央寄りの比較的大部分を占めている。遮光性樹脂部５３は、たとえばエポキシ樹脂を主成分として、可視光を遮断吸収するための染料、紫外線の一部を遮断吸収するための黒色顔料であるカーボンブラック、および広い波長領域において光を吸収可能な酸化チタンなどが含有された樹脂により形成されている。   The light-shielding resin portion 53 seals the integrated circuit element 4 and blocks external light or light from the light emitting element 2 to prevent the integrated circuit element 4 from malfunctioning. The light-shielding resin portion 53 has a substantially rectangular parallelepiped shape as a whole, and is interposed between the two light-transmitting resin portions 51 and 52. In the drawing, the upper surface and two side surfaces connected to the upper surface are exposed. Yes. Thereby, the light-shielding resin portion 53 occupies a relatively large portion of the resin package 5 closer to the center. The light-shielding resin portion 53 is composed of, for example, an epoxy resin as a main component, a dye for blocking and absorbing visible light, carbon black which is a black pigment for blocking and absorbing part of ultraviolet rays, and absorbs light in a wide wavelength region. It is made of a resin containing possible titanium oxide or the like.

次に、赤外線データ通信モジュールＡの製造方法の一例について図３〜図９を参照しつつ以下に説明する。   Next, an example of a method for manufacturing the infrared data communication module A will be described below with reference to FIGS.

まず、図３に示すように集合基板１Ａを用意する。この集合基板１Ａは、図中左右方向に延びる長矩形状であり、ガラスエポキシ樹脂からなる。集合基板１Ａは、図１に示す基板１を複数個形成可能なサイズとされる。集合基板１Ａには、配線パターン（図示略）を形成しておく。この配線パターンを形成した後に、集合基板１Ａの片面に、複数ずつの発光素子２、受光素子３、および集積回路素子４を搭載する。この際、マトリクス状の配置とされた樹脂成形体形成予定領域５Ａ’を設定しておき、各樹脂成形体形成予定領域５Ａ’に、２つずつの発光素子２、受光素子３、および集積回路素子４を配置する。さらに、図１および図２に示す複数のワイヤ６をワイヤボンディングの手法により形成する。   First, as shown in FIG. 3, a collective substrate 1A is prepared. The collective substrate 1A has a long rectangular shape extending in the left-right direction in the drawing and is made of glass epoxy resin. The collective substrate 1A has a size capable of forming a plurality of substrates 1 shown in FIG. A wiring pattern (not shown) is formed on the collective substrate 1A. After this wiring pattern is formed, a plurality of light emitting elements 2, light receiving elements 3, and integrated circuit elements 4 are mounted on one side of the collective substrate 1A. At this time, a resin molded body formation scheduled area 5A ′ arranged in a matrix is set, and two light emitting elements 2, two light receiving elements 3, and an integrated circuit are provided in each resin molded body formation planned area 5A ′. Element 4 is arranged. Further, a plurality of wires 6 shown in FIGS. 1 and 2 are formed by a wire bonding technique.

次いで、図４に示すように、金型Ｍ１を集合基板１Ａに押し当てる。図４は、図３のＩＶ−ＩＶ線に沿う断面図に金型Ｍ１を追加したものである。金型Ｍ１には、複数の凹部Ｍ１ａ，Ｍ１ｂが形成されている。凹部Ｍ１ａは、図中奥行き方向を長手方向とする断面矩形状の凹部である。凹部Ｍ１ｂは、図中奥行き方向を長手方向とする断面半楕円形状の凹部である。図示されたように、２つの凹部Ｍ１ｂは、凹部Ｍ１ａを挟んで配置されている。金型Ｍ１を集合基板１Ａに押し当てる際には、凹部Ｍ１ａ内に２つの集積回路素子４を収容し、凹部Ｍ１ｂ内に発光素子２または受光素子３を収容する。これにより、凹部Ｍ１ａと集合基板１Ａのうち凹部Ｍ１ａに対向する部分とにより、空隙部Ｃ１が形成される。   Next, as shown in FIG. 4, the mold M1 is pressed against the collective substrate 1A. FIG. 4 is obtained by adding a mold M1 to the cross-sectional view taken along line IV-IV in FIG. A plurality of concave portions M1a and M1b are formed in the mold M1. The recess M1a is a recess having a rectangular cross section with the depth direction in the figure as the longitudinal direction. The concave portion M1b is a concave portion having a semi-elliptical cross section whose longitudinal direction is the depth direction in the drawing. As illustrated, the two recesses M1b are arranged with the recess M1a interposed therebetween. When pressing the mold M1 against the collective substrate 1A, the two integrated circuit elements 4 are accommodated in the recess M1a, and the light emitting element 2 or the light receiving element 3 is accommodated in the recess M1b. Thereby, the cavity C1 is formed by the recess M1a and the portion of the collective substrate 1A that faces the recess M1a.

金型Ｍ１を集合基板１Ａに押し付けた状態で、遮光性樹脂材料を空隙部Ｃ１内に充填する。この遮光性樹脂材料としては、たとえば上述した遮光性樹脂部５３を形成するためのエポキシ樹脂を溶融させたものを用いる。この遮光性樹脂材料を冷却した後に金型Ｍ１から集合基板１Ａを離間させると、図５に示すように遮光性樹脂成形体５３Ａが形成される。図６に示すように、集合基板１Ａには、複数の遮光性樹脂成形体５３Ａがマトリクス状に配置される。各遮光性樹脂成形体５３Ａは、各樹脂成形体形成予定領域５Ａ’の中央寄りに位置している。集積回路素子４およびこれに繋がる複数のワイヤ６は、遮光性樹脂成形体５３Ａにより封止される。金型Ｍ１を用いて遮光性樹脂成形体５３Ａを形成することにより、空隙部Ｃ１内の隅々に上記遮光性樹脂材料を容易に充填することができる。このため、遮光性樹脂成形体５３Ａに集積回路素子４に通じる孔などが不当に形成されるおそれがない。   With the mold M1 pressed against the collective substrate 1A, the light shielding resin material is filled into the gap C1. As this light-shielding resin material, for example, a material obtained by melting an epoxy resin for forming the above-described light-shielding resin portion 53 is used. When the collective substrate 1A is separated from the mold M1 after the light-shielding resin material is cooled, a light-shielding resin molded body 53A is formed as shown in FIG. As shown in FIG. 6, a plurality of light-shielding resin molded bodies 53A are arranged in a matrix on the collective substrate 1A. Each light-shielding resin molded body 53A is located near the center of each resin molded body formation scheduled region 5A '. The integrated circuit element 4 and the plurality of wires 6 connected thereto are sealed with a light-shielding resin molded body 53A. By forming the light-shielding resin molded body 53A using the mold M1, the light-shielding resin material can be easily filled in every corner of the gap C1. For this reason, there is no possibility that a hole or the like leading to the integrated circuit element 4 is unfairly formed in the light-shielding resin molded body 53A.

複数の遮光性樹脂成形体５３Ａを形成した後は、図７に示すように、金型Ｍ２を集合基板１Ａに押し当てる。金型Ｍ２には、複数の凹部Ｍ２ａが形成されている。各凹部Ｍ２ａは、全体が扁平な直方体形状であり、４つの半球形状部分を有している。また、各凹部Ｍ２ａの図中奥行き方向の寸法は、金型Ｍ１の凹部Ｍ１ａおよび遮光性樹脂成形体５３Ａと略同一である。金型Ｍ２を集合基板１Ａに押し付ける際には、各凹部Ｍ２ａ内に各遮光性樹脂成形体５３Ａを収容する。これにより、凹部Ｍ２ａと集合基板１Ａのうち凹部Ｍ２ａに対向する部分と遮光性樹脂成形体５３Ａとにより、２つの空隙部Ｃ２が形成される。   After the plurality of light-shielding resin molded bodies 53A are formed, the mold M2 is pressed against the collective substrate 1A as shown in FIG. A plurality of concave portions M2a are formed in the mold M2. Each recess M2a has a flat rectangular parallelepiped shape as a whole and has four hemispherical portions. Further, the dimension of each recess M2a in the depth direction in the drawing is substantially the same as that of the recess M1a of the mold M1 and the light-shielding resin molded body 53A. When pressing the mold M2 against the collective substrate 1A, each light-shielding resin molded body 53A is accommodated in each recess M2a. Thus, two gaps C2 are formed by the recess M2a and the portion of the collective substrate 1A that faces the recess M2a and the light-shielding resin molded body 53A.

金型Ｍ２を集合基板１Ａに押し付けた状態で、透光性樹脂材料を空隙部Ｃ２内に充填する。この透光性樹脂材料としては、たとえば上述した透光性樹脂部５１，５２を形成するためのエポキシ樹脂を溶融させたものを用いる。この透光性樹脂材料を冷却した後に金型Ｍ２から集合基板１Ａを離間させると、図８に示すように、透光性樹脂成形体５１Ａ，５２Ａが形成される。透光性樹脂成形体５１Ａ，５２Ａと遮光性樹脂成形体５３とは、樹脂成形体５Ａを一体的に構成している。図９に示すように、集合基板１Ａには、複数の樹脂成形体５Ａがマトリクス状に配置される。   In a state where the mold M2 is pressed against the collective substrate 1A, the light-transmitting resin material is filled into the gap C2. As this translucent resin material, for example, a material obtained by melting an epoxy resin for forming the above-described translucent resin portions 51 and 52 is used. When the collective substrate 1A is separated from the mold M2 after cooling the translucent resin material, translucent resin molded bodies 51A and 52A are formed as shown in FIG. The translucent resin molded bodies 51A and 52A and the light-shielding resin molded body 53 integrally constitute the resin molded body 5A. As shown in FIG. 9, a plurality of resin molded bodies 5A are arranged in a matrix on the collective substrate 1A.

複数の樹脂成形体５Ａを形成した後は、図９に示す複数の切断線ＣＬに沿って、集合基板１Ａおよび複数の樹脂成形体５Ａを切断する。この切断により、図１および図２に示す赤外線データ通信モジュールＡを複数個製造することができる。   After the plurality of resin molded bodies 5A are formed, the aggregate substrate 1A and the plurality of resin molded bodies 5A are cut along the plurality of cutting lines CL shown in FIG. By this cutting, a plurality of infrared data communication modules A shown in FIGS. 1 and 2 can be manufactured.

次に、赤外線データ通信モジュールＡの作用について説明する。   Next, the operation of the infrared data communication module A will be described.

本実施形態によれば、集積回路素子４は、樹脂パッケージ５の比較的大部分を占める遮光性樹脂部５３により覆われる。また、遮光性樹脂部５３は、金型Ｍ１を用いて形成されるため、たとえば遮光性樹脂材料を塗布することにより形成される場合と異なり、集積回路素子４に通じる孔が形成されてしまうおそれがない。したがって、遮光性樹脂部５３により外来の光や発光素子２からの光を適切に遮蔽することが可能であり、集積回路素子４の誤動作を防止するのに適している。   According to this embodiment, the integrated circuit element 4 is covered with the light-shielding resin portion 53 that occupies a relatively large portion of the resin package 5. Further, since the light-shielding resin portion 53 is formed using the mold M1, for example, unlike the case where it is formed by applying a light-shielding resin material, a hole leading to the integrated circuit element 4 may be formed. There is no. Therefore, extraneous light and light from the light emitting element 2 can be appropriately shielded by the light shielding resin portion 53, which is suitable for preventing malfunction of the integrated circuit element 4.

２つの透光性樹脂部５１，５２が互いに別体とされており、遮光性樹脂部５３を挟んで離間配置されている。これにより、発光素子２から発せられた光が透光性樹脂部５１内において乱反射しても、この光が集積回路素子４に向かってくることを回避できる。したがって、集積回路素子４の誤動作防止に好適である。   The two translucent resin parts 51 and 52 are separated from each other, and are spaced apart with the light-shielding resin part 53 interposed therebetween. Thereby, even if the light emitted from the light emitting element 2 is irregularly reflected in the translucent resin portion 51, it is possible to avoid the light coming toward the integrated circuit element 4. Therefore, it is suitable for preventing malfunction of the integrated circuit element 4.

本発明に係る光通信モジュールの製造方法は、上述した実施形態に限定されるものではない。本発明に係る光通信モジュールの製造方法の具体的な構成は、種々に設計変更自在である。 Method of manufacturing an optical communication module according to the present invention is not limited to the embodiments described above. Concrete structure of a manufacturing method of an optical communication module according to the present invention may be modified in various ways.

遮光性樹脂部５３の形状は、直方体形状に限定されず、たとえば断面半円形状であってもよい。本発明でいう透光性樹脂部は、上記実施形態のように互いに別体とされた透光性樹脂部５１，５２とされることが遮光効果を高める上で好ましいが、これに限定されず、一体成形されたものであってもよい。   The shape of the light-shielding resin portion 53 is not limited to a rectangular parallelepiped shape, and may be, for example, a semicircular cross section. The light-transmitting resin portion referred to in the present invention is preferably the light-transmitting resin portions 51 and 52 that are separated from each other as in the above embodiment, but is not limited thereto. , It may be integrally molded.

本発明に係る光通信モジュールの製造方法によって製造される光通信モジュールは、赤外線を用いた通信を可能に構成したものに限定されず、あらゆる波長の光を用いた通信を可能に構成してもよい。 The optical communication module manufactured by the method for manufacturing an optical communication module according to the present invention is not limited to the one configured to enable communication using infrared rays, and may be configured to enable communication using light of any wavelength. Good.

本発明に係る光通信モジュールの製造方法によって製造された光通信モジュールの一例を示す全体斜視図である。It is a whole perspective view which shows an example of the optical communication module manufactured by the manufacturing method of the optical communication module which concerns on this invention. 図１のＩＩ−ＩＩ線に沿う断面図である。It is sectional drawing which follows the II-II line | wire of FIG. 本発明に係る光通信モジュールの製造方法の一例に用いられる集合基板を示す要部平面図である。It is a principal part top view which shows the aggregate substrate used for an example of the manufacturing method of the optical communication module which concerns on this invention. 本発明に係る光通信モジュールの製造方法の一例において、集合基板に遮光性樹脂部を形成するための金型を押し当てた状態を示す要部断面図である。In an example of the manufacturing method of the optical communication module which concerns on this invention, it is principal part sectional drawing which shows the state which pressed the metal mold | die for forming the light-shielding resin part on an aggregate substrate. 本発明に係る光通信モジュールの製造方法の一例における、遮光性樹脂部の形成工程を示す要部断面図である。It is principal part sectional drawing which shows the formation process of the light-shielding resin part in an example of the manufacturing method of the optical communication module which concerns on this invention. 本発明に係る光通信モジュールの製造方法の一例における、遮光性樹脂部の形成工程を示す要部平面図である。It is a principal part top view which shows the formation process of the light-shielding resin part in an example of the manufacturing method of the optical communication module which concerns on this invention. 本発明に係る光通信モジュールの製造方法の一例において、集合基板に透光性樹脂部を形成するための金型を押し当てた状態を示す要部断面図である。In an example of the manufacturing method of the optical communication module which concerns on this invention, it is principal part sectional drawing which shows the state which pressed the metal mold | die for forming the translucent resin part to an aggregate substrate. 本発明に係る光通信モジュールの製造方法の一例における、透光性樹脂部の形成工程を示す要部断面図である。It is principal part sectional drawing which shows the formation process of the translucent resin part in an example of the manufacturing method of the optical communication module which concerns on this invention. 本発明に係る光通信モジュールの製造方法の一例における、透光性樹脂部の形成工程を示す要部平面図である。It is a principal part top view which shows the formation process of the translucent resin part in an example of the manufacturing method of the optical communication module which concerns on this invention. 従来の光通信モジュールの一例を示す断面図である。It is sectional drawing which shows an example of the conventional optical communication module.

Ａ 赤外線データ通信モジュール（光通信モジュール）
Ｍ１，Ｍ２ 金型
１ 基板
１Ａ 集合基板
２ 発光素子
３ 受光素子
４ 集積回路素子
５ 樹脂パッケージ
５Ａ 樹脂成形体
５Ａ’ 樹脂成形体形成予定領域
６ ワイヤ
５１，５２ 透光性樹脂部
５１ａ，５２ａ レンズ
５１Ａ，５２Ａ 透光性樹脂成形体
５３ 遮光性樹脂部
５３Ａ 遮光性樹脂成形体 A Infrared data communication module (optical communication module)
M1, M2 Mold 1 Substrate 1A Collective substrate 2 Light emitting element 3 Light receiving element 4 Integrated circuit element 5 Resin package 5A Resin molded body 5A ′ Resin molded body formation planned area 6 Wire 51, 52 Translucent resin portion 51a, 52a Lens 51A , 52A Translucent resin molded body 53 Light-shielding resin portion 53A Light-shielding resin molded body

Claims (1)

発光素子、受光素子、および集積回路素子を基板に搭載する基板搭載工程と、
上記集積回路素子を遮光性樹脂により金型を用いて封止する工程と、
上記発光素子および上記受光素子を透光性樹脂により金型を用いて封止する工程と、を含んでおり、
上記基板搭載工程においては、複数の上記集積回路素子を列状に集合基板に搭載し、かつ複数ずつの上記発光素子および上記受光素子を、上記複数の集積回路素子を挟んで両側に列状に上記集合基板に搭載し、
複数の上記集積回路素子を封止する遮光性樹脂体を金型成形する工程と、
複数の上記受光素子を封止するもの、および複数の上記発光素子を封止するもの、を含む２以上の透光性樹脂体を金型成形する工程と、
上記集合基板、上記遮光性樹脂体、および上記透光性樹脂体を一括して切断する工程と、を有しており、
上記遮光性樹脂体を金型成型する工程においては、上記発光素子および上記受光素子を収容する複数の凹部を有する金型を用いることを特徴とする、光通信モジュールの製造方法。 A substrate mounting process for mounting the light emitting element, the light receiving element, and the integrated circuit element on the substrate;
Sealing the integrated circuit element with a light-shielding resin using a mold;
Sealing the light-emitting element and the light-receiving element with a translucent resin using a mold,
In the substrate mounting step, a plurality of the integrated circuit elements are mounted on the collective substrate in a row, and a plurality of the light emitting elements and the light receiving elements are arranged in a row on both sides with the plurality of integrated circuit elements interposed therebetween. Mounted on the above assembly board,
A step of molding a light-shielding resin body for sealing a plurality of the integrated circuit elements;
A step of molding two or more translucent resin bodies including one that seals the plurality of light receiving elements and one that seals the plurality of light emitting elements;
The aggregate substrate, and possess a step, a of cutting collectively the light shielding resin material, and the transmissive resin member,
In the step of molding the light-shielding resin material, and wherein the Rukoto using a mold having a plurality of recesses for accommodating the light emitting element and the light receiving element, a manufacturing method of the optical communication module.
JP2005271937A 2005-09-20 2005-09-20 Manufacturing method of optical communication module Expired - Fee Related JP4811913B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005271937A JP4811913B2 (en) 2005-09-20 2005-09-20 Manufacturing method of optical communication module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005271937A JP4811913B2 (en) 2005-09-20 2005-09-20 Manufacturing method of optical communication module

Publications (2)

Publication Number Publication Date
JP2007088026A JP2007088026A (en) 2007-04-05
JP4811913B2 true JP4811913B2 (en) 2011-11-09

Family

ID=37974746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005271937A Expired - Fee Related JP4811913B2 (en) 2005-09-20 2005-09-20 Manufacturing method of optical communication module

Country Status (1)

Country Link
JP (1) JP4811913B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101033623B1 (en) * 2008-07-25 2011-05-11 광전자 주식회사 Detector package
KR101103336B1 (en) * 2010-10-19 2012-01-11 광전자 주식회사 Photo diode package and manufacturing method thereof
JP6365187B2 (en) * 2014-09-30 2018-08-01 日亜化学工業株式会社 Light emitting device
JP2017009902A (en) * 2015-06-25 2017-01-12 本多通信工業株式会社 Optical module and method for manufacturing the same
JP2023133730A (en) * 2022-03-14 2023-09-27 スタンレー電気株式会社 Semiconductor light-emitting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193075A (en) * 1981-05-22 1982-11-27 Nec Corp Resin-sealed type photoelectric conversion module
JP3066236B2 (en) * 1993-11-11 2000-07-17 シャープ株式会社 Manufacturing method of light receiving unit
JP3143351B2 (en) * 1995-03-07 2001-03-07 シャープ株式会社 Reflective optical coupling device
JP4003847B2 (en) * 1997-08-13 2007-11-07 シチズン電子株式会社 Infrared data communication module and manufacturing method thereof
JP2000269544A (en) * 1999-03-19 2000-09-29 Stanley Electric Co Ltd Light emitting/receiving element and manufacture of the same
JP2002324916A (en) * 2001-04-24 2002-11-08 Rohm Co Ltd Infrared data communication module and method of manufacturing the same
JP4955953B2 (en) * 2005-07-28 2012-06-20 シャープ株式会社 Optical semiconductor device and electronic equipment

Also Published As

Publication number Publication date
JP2007088026A (en) 2007-04-05

Similar Documents

Publication Publication Date Title
US8411197B2 (en) Image pickup device and production method thereof
CN108351966A (en) Optical fingerprint sensor encapsulates
JP5340157B2 (en) Housing for optoelectronic devices, optoelectronic device, and method of manufacturing housing for optoelectronic devices
US20060027479A1 (en) Optical or electronic module and method for its production
JP4811913B2 (en) Manufacturing method of optical communication module
CN101569023A (en) Housing for an optoelectronic component and arrangement of an optoelectronic component in a housing
JP2006005141A (en) Optical semiconductor package and method of manufacturing the same
JP2010237641A (en) Optical module and cable with module
GB2312551A (en) Encapsulating semiconductor optical devices
TWI578491B (en) Optical sensing device and manufacturing method for optical device
JP2013235887A (en) Method of manufacturing light source-integrated optical sensor
JP2013187357A (en) Reflection light sensor
US20080211048A1 (en) Encapsulated Optical Package
US12013284B2 (en) Optical sensor module and packaging method thereof
JP4730135B2 (en) Image sensor package
CN215527753U (en) LED display module and LED display screen
JP5255950B2 (en) Manufacturing method of optical semiconductor device
JP4926421B2 (en) Optical communication module and manufacturing method thereof
CN212434647U (en) Optical chip packaging structure and photoelectric device
JP2013065717A (en) Semiconductor device and manufacturing method of the same
CN110556368B (en) Photoelectric sensor and preparation method thereof
US20050023489A1 (en) Chip type photo coupler
JP2008226969A (en) Optical communication module
JP4841981B2 (en) Manufacturing method of light receiving module
WO2018030261A1 (en) Optical communication module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080404

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110114

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110603

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110817

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110818

R150 Certificate of patent or registration of utility model

Ref document number: 4811913

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140902

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees