JP4774639B2 - Manufacturing method of surface mount type piezoelectric oscillator - Google Patents

Manufacturing method of surface mount type piezoelectric oscillator Download PDF

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JP4774639B2
JP4774639B2 JP2001200198A JP2001200198A JP4774639B2 JP 4774639 B2 JP4774639 B2 JP 4774639B2 JP 2001200198 A JP2001200198 A JP 2001200198A JP 2001200198 A JP2001200198 A JP 2001200198A JP 4774639 B2 JP4774639 B2 JP 4774639B2
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circuit board
base printed
printed circuit
oscillator
lead terminal
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JP2003017940A (en
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富雄 佐藤
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Miyazaki Epson Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、周波数制御デバイス等として使用される圧電発振器に関し、特に圧電振動子をヒータによって加熱すると共に、温度制御回路によってヒータ温度を制御する構成を備えた表面実装型の高安定圧電発振器の改良に関する。
【０００２】
【従来の技術】
無線基地局に使用される通信機器や、伝送ネットワークに使用される移動体通信機器や伝送通信機器において、周波数制御デバイスとして使用される水晶発振器等の圧電発振器として、内蔵したヒータと温度制御回路によって圧電振動子を加熱してその温度を制御することによって、外部の温度変化に影響されることなく高安定な周波数を出力することができる温度制御型の高安定圧電発振器が知られている。
従来の温度制御型高安定圧電発振器は、ベース板を貫通して上下方向へ突出する導体リード線の上端部に、圧電振動子、ヒータ、回路部品等を搭載した発振用プリント基板を架設し、これらの部品を含むベース板上の空間を金属ケースにより包囲した構成を備えている。この発振器をマザープリント基板上に搭載する際には、発振器のベース板下方へから引き出された複数本の線状リード端子をマザープリント基板に設けたスルーホール内に差し込んだ上でハンダにより接続固定する。
この種の高安定圧電発振器は、周波数安定度が重要視されていたためその大きさや形状についての制約は少なかったが、近年になって小型化、表面実装化の要求が高まってきている。
図５は従来の表面実装型の温度制御型高安定圧電発振器の概略構成を示す断面図であり、この高安定圧電発振器１は、図示しないマザープリント基板上に表面実装するため外部端子２を備えたベースプリント基板３と、ベースプリント基板３の上面に搭載された電子部品（発振回路部品、ヒータ、温度制御回路部品）４と、ベースプリント基板３の上面からわずかに浮き上がった状態で導体リード線５によってベースプリント基板３と接続支持された圧電振動子６と、これらの構成要素４，５，６を含むベースプリント基板３上の空間を包囲した状態でベースプリント基板３に固定された金属ケース７を有する。しかし、このようにベースプリント基板３上面にヒータ等を配置すると、圧電振動子６を加温するための熱がベースプリント基板３からマザープリント基板側へ逃げてしまい、効率的な温度制御が困難となる。
このような不具合を解消するためには、図６，図７に夫々示した構成の表面実装型の温度制御型高安定圧電発振器のように、ヒータ等の電子部品４と圧電振動子６を搭載した発振回路基板１０をベースプリント基板３から遠ざけて配置する必要があった。
【０００３】
即ち、図６に示した従来の高安定圧電発振器１は、図示しないマザープリント基板上に表面実装するための外部端子２を備えたベースプリント基板３と、ベースプリント基板上のパッド上にハンダ１１によって立設された複数の線状のリード端子１２と、リード端子１２の上部に固定され且つ電子部品（発振回路部品、ヒータ、温度制御回路部品）４及び圧電振動子６を搭載した発振回路基板１０と、これらの構成要素４，６、１０を含むベースプリント基板３上の空間を包囲した状態でベースプリント基板３に固定された金属ケース７と、を有する。しかし、このタイプの圧電発振器１にあっては、リード端子１２をベースプリント基板上のパッド上にハンダ接続する際に横方向へ位置ずれが生じやすく、位置ずれしたリード端子１２に固定した発振回路基板１０がケース７の内壁に接近すると、搭載した圧電振動子６が外気温の影響を受けやすくなり、周波数の安定度が低下する。
また、図７（ａ）（ｂ）に示したタイプは、図６の発振器に用いられる線状のリード端子１２に代えて薄板状のリード端子１５を使用している。このリード端子１５は、発振回路基板１０に貫通して接続されるリード本体１５ａの下部にストッパ１５ｂと、位置決めピン１５ｃとを有し、この位置決めピン１５ｃをベースプリント基板３上のランド１６上に設けた穴１６ａ内に差し込んだ上でハンダ１７によって固定される。しかし、リード端子としてこのように表面積が大きい板状の部材を使用すると放熱し易くなり、搭載した圧電振動子６が外気温の影響を受けやすくなって、周波数の安定度が低下する。
更に、上記いずれのタイプの表面実装型の温度制御型高安定圧電発振器にあっても、完成した発振器の動作をチェックする際には、図８に示した如き端子治具２０に設けた端子２１に外部端子２を当接させて通電を行うが、このような動作チェックを実施すると、外部端子２に傷が付いたり、或いは剥離する等の不具合が発生するので、動作チェックを受けた発振器の不良品率が増大する虞があった。
【０００４】
【発明が解決しようとする課題】
本発明は上記従来例の欠点を改善するために提案されたものであり、圧電振動子をヒータによって加熱すると共に、温度制御回路によってヒータ温度を制御する構成を備えた表面実装型の温度制御型高安定圧電発振器において、ベースプリント基板の上方に発振回路基板及び圧電振動子を架設支持するリード端子を放熱量の少ない線材によって構成しながらも、ベースプリント基板上におけるリード端子の位置ずれを確実に防止することができる表面実装型高安定圧電発振器を提供することを課題とする。
また、表面実装型でありながらベースプリント基板底部に設けた外部端子を利用した動作チェックを行う必要を無くすることにより、動作チェック時に外部端子が被る損傷を防止して、発振器の不良品率を大幅に低減できる表面実装型高安定圧電発振器を提供することを課題とする。
【０００５】
【課題を解決するための手段】
上記課題を解決するため、請求項１の発明は、外面に表面実装用の外部端子を備えた絶縁材料から成るベースプリント基板と、該ベースプリント基板を貫通する少なくとも２つの線状リード端子と、該ベースプリント基板上に突出するリード端子の上部に架設支持された発振回路基板と、該発振回路基板に搭載した圧電振動子と、前記各構成要素を含むベースプリント基板上の空間を包囲する金属ケースと、を備え、前記ベースプリント基板の下面には前記リード端子が貫通する位置に凹所を有し、前記凹所と前記ベースプリント基板の上面との間の壁部には前記リード端子の下部を挿入支持するための、前記凹所よりも小径のスルーホールを有し、前記リード端子の適所には、前記スルーホールの上側周縁に係止されるフランジ部を備え、前記リード端子を、下端部を前記ペースプリント基板の下面よりも長く突出させるように前記スルーホール内に挿着した状態で前記フランジ部と前記スルーホール周縁のパッドとの間をハンダ接続した表面実装型圧電発振器の製造方法において、前記リード端子の下端部に通電し当該表面実装型圧電発振器の動作チェックを行う工程と、前記リード端子の下端部を切断除去して前記凹所内に退避した状態で終端させる工程と、を有することを特徴とする。
請求項２の発明は、前記金属ケースは、前記ベースプリント基板上面と対面する下面が開放し、内側に屈曲したその裾部をネジによってベースプリント基板に固定される構成を備え、該金属ケースの裾部と対応するベースプリント基板に設けた連結穴の下部は連結用凹所となっていることを請求項１に記載の表面実装型圧電発振器の製造方法を特徴とする。
請求項３の発明は、前記ベースプリント基板の上面と、該上面の上方に位置する発振回路基板及び圧電振動子との間の空間内に、断熱材を配置した請求項１又は２に記載の表面実装型圧電発振器の製造方法を特徴とする。
【０００６】
【発明の実施の形態】
以下、本発明を図面に示した実施の形態により詳細に説明する。
図１（ａ）（ｂ）及び（ｃ）は本発明の一実施形態に係る表面実装型の温度制御型高安定圧電発振器（以下、発振器、という）の構成を示す縦断面図、底面図、及び要部拡大断面図である。
この実施形態に係る発振器３１は、外面（外底部）に表面実装用の外部端子３２を備えた絶縁材料から成るベースプリント基板３３と、該ベースプリント基板３３を貫通する少なくとも３つの線状のリード端子３４と、該ベースプリント基板３３上に突出するリード端子３４の上部に架設支持された発振回路基板５０と、該発振回路基板５０に搭載した圧電振動子５１及び電子部品（ヒータ、発振回路部品、温度制御回路部品）５２と、上記各構成要素５０，５１，５２を含むベースプリント基板３３上の空間を包囲するためにベースプリント基板３３上に裾部をハンダ５４により接続された金属ケース５３と、を備える。
ベースプリント基板３３は、上面にパッド３５、配線パターンを備え、外底面から側面、或いは上面にかけて延在する外部端子３２を複数有している。また、ベースプリント基板３３の底面には、リード端子３４が貫通する位置に大径の凹所６０（ザグリホール）を有し、該凹所６０とベースプリント基板上面との間の壁部３３ａにはスルーホール６１が形成され、このスルーホール６１内にリード端子３４の下端部が挿通されて凹所６０の上部にて終端している。スルーホール６１は、絶縁基板に設けた貫通穴６１ａの内壁に導体膜６１ｂを形成した構成を有し、導体膜６１ｂはパッド３５と導通している。
リード端子３４の適所には、スルーホール６１の上側周縁（基板３３の上面）に係止されるフランジ部３４ａを備え、フランジ部３４ａよりも下方のリード端子部分がスルーホール６１内に挿入された状態で、ハンダ６５によってリード端子３４とパッド３５とが接続される。
なお、ベースプリント基板３３の肉厚を例えば１．６ｍｍとした場合に、リード端子３４の直径は例えば０．４ｍｍとし、スルーホール６１の直径は例えば０，６ｍｍとし、凹所６０の直径は２．５ｍｍ、深さは０．８ｍｍとする。
【０００７】
このように本実施形態の発振器３１にあっては、上部にて発振回路基板５０を支持する線状リード端子３４をベースプリント基板に位置決めする際に、ベースプリント基板３３に設けたスルーホール６１内にリード端子３４の下部を差し込み、且つリード端子下部に設けたストッパとしてのフランジ部３４ａによってリード端子上部の突出長を一定にする。この状態で、フランジ部３４ａをスルーホール６１と導通したパッド３５とハンダにより接続するので、リード端子の３４横方向位置を常に一定にすることができる。このため、従来のように線状のリード端子の位置が横方向にずれることに起因して発生する発振回路基板の位置ずれと、それによって発生する外気温度による悪影響を解消できる。また、リード端子は、線状導体から成るので、ヒータからの熱を多く放熱せず、温度変化による周波数変動をもたらす虞がない。
【０００８】
一方、ベースプリント基板３３の底面に、スルーホール６１と連通する大径の凹所６０を設けたことにより、完成した発振器３１の動作チェックを行う際に外部端子３２を利用して図８のように端子治具の端子を接触させる必要が無くなる。
即ち、図２（ａ）（ｂ）はリード端子３４を利用して発振器３１の動作チェックを行うために、リード端子３４の下端部をベースプリント基板３３の下面よりも充分に長く突出させた状態を示す説明図である。
換言すれば、図１に示した発振器は、図２に示した長尺のリード端子３４の下端部を動作チェック後に切断した完成品の状態を示している。
図１に示した発振器３１は、完成前の状態では図２に示した如くリード端子３４の下部が下方へ突出しており、図２（ａ）に示した如きリード端子挿通穴７１を有した測定治具７０を用い、挿通穴７１内にリード端子３４の突出した下端部を挿通させた状態で動作チェックを行う。動作チェックの結果、正常に動作することが判明した場合には、凹所６０とスルーホール６１との境界面にてリード端子を、小型ニッパ等を用いて切断することにより、図１の完成状態にすることができる。仮に、リード端子の切断後に、スルーホール６１内から凹所６０内に多少リード端子下部が突出していたとしても凹所６０内に収まっている限り、リード端子下部はベースプリント基板３３の下面から突出することがないので、表面実装時にマザープリント基板上のパッド、配線パターン等と接触を起こす虞がなくなる。
なお、凹所６０の形状は必ずしも図１に示した如き円筒形状である必要はなく、例えば図３に示した如き略円錐形状であってもよい。
また、リード端子の数として上記各実施形態では、図示説明の便宜上から２端子しか示していないが、実際には発振回路とヒータを動作させるために多数の端子が設けられている。
【０００９】
次に、図４（ａ）（ｂ）（ｃ）及び（ｄ）は本発明の他の実施形態に係る発振器の構成を示す正面縦断面図、平面図、要部拡大図、及び変形例の要部拡大図である。
この実施形態の発振器８１が、上記実施形態の発振器と異なる構成の一つは、リード端子３４を挿通するための凹所６０の他に、同様のザグリホールから成る連結用凹所８２をベースプリント基板３３の底面に設け、この連結用凹所８２と対応する位置に張り出した金属ケース５３の裾部５３ａとベースプリント基板３３とを皿ネジ８３によって連結固定した点にある。金属ケース５３の裾部５３ａは、ケースの側壁の下端縁から内側に屈曲して張り出した構成を備えており、この裾部５３ａを厚肉に構成するか、或いは折り曲げ、折り返して複数層構造にすることにより（図４（ｄ））、強度を高める。そして、この裾部５３ａにネジ穴５３ａ‘を設け、連結用凹所８２側からこのネジ穴５３ａ’に皿ネジ８３を螺着することにより、ケース５３をベースプリント基板３３に対して強固に固定できる。このネジ穴５３ａ‘と対応するベースプリント基板３３側にはテーパ状の連結穴８４があり、連結穴８４とネジ穴５３ａ’を連通させた状態で皿ネジ８３を螺着したときに、螺着後の皿ネジ８３の頭部は、連結用凹所８２内に埋没するため、マザープリント基板上に実装した際に、マザープリント基板上面のパッド等と干渉する虞がない。
【００１０】
更に、本実施形態が前記実施形態と異なる点は、ケース５３内部に圧電振動子５１とベースプリント基板３３とを隔絶する板状の断熱材８５を配置した構成にある。即ち、断熱材８５は、リード端子３４を挿通する貫通孔８６を有し、その外周縁をケース５３の内壁に接着剤８７によって固定する。また、貫通孔８６とリード端子３４との間の空間には、絶縁性接着剤８８を充填する。発振器を、無線装置等のマザープリント基板上に実装した場合には、発振器側の熱がハンダ接続した部分からマザープリント基板側へ逃げて周波数の安定度が低下し易いが、この実施形態のようにヒータ及び圧電振動子を支持した発振回路基板５０とベースプリント基板３３との間の空間に断熱材８５を介在させて熱的に遮断することによって、ケース内空間を介してベースプリント基板３３へ逃げる熱量を低減することができる。このため、外部温度の変化にも拘わらず、周波数の安定度を高めることができる。
また、連結用凹所８２等は必ずしも４個必要ではなく左右１個ずつであってもよい。
なお、図４に示した実施形態では、皿ネジ８３によりベースプリント基板３３とケース５３とを固定する構造と、断熱材８５による熱遮断構造を同時に備えた発振器を開示したが、常に両構造が必須となるわけではなく、いずれか一方の構造だけを備えた発振器であってもよいことは勿論である。
【００１１】
【発明の効果】
以上のように本発明によれば、圧電振動子をヒータによって加熱すると共に、温度制御回路によってヒータ温度を制御する構成を備えた表面実装型の温度制御型高安定圧電発振器において、ベースプリント基板の上方に発振回路基板及び圧電振動子を架設支持するリード端子を放熱量の少ない線材によって構成しながらも、ベースプリント基板上におけるリード端子の位置ずれを確実に防止することができる。また、表面実装型でありながらベースプリント基板底部に設けた外部端子を利用した動作チェックを行う必要を無くすることにより、動作チェック時に外部端子が被る損傷を防止して、発振器の不良品率を大幅に低減できる表面実装型高安定圧電発振器を提供することを課題とする。即ち、請求項１に記載の表面実装型高安定圧電発振器は、ベースプリント基板の下面に、線状リード端子が貫通する位置に大径の凹所を有し、該凹所とベースプリント基板上面との間の壁部には前記リード端子の下部を挿入支持するスルーホールを備え、リード端子の適所には、スルーホールの上側周縁に係止されるフランジ部を備え、リード端子の下部をスルーホール内に挿着した状態で該フランジ部とスルーホール周縁のパッドとの間をハンダ接続した。このようにリード端子として線状材を使用しているので、リード端子からの放熱を防止しつつ、線状リード端子を用いた場合の欠点である基板上に置ける位置決めの困難化という不具合を解消できる。また、リード端子下端部は、凹所内に引っ込んでいるので、マザープリント基板上に実装したときの干渉を防止できる。また、リード端子は、フランジ部よりも下方へ延びる下側部分がベースプリント基板の肉厚を越えた長さを備え、該リード端子の下側部分は圧電発振器の完成後の動作チェック後に切断除去されて凹所内に退避した状態で終端するので、発振器を完成する直前の状態ではベースプリント基板下面から線状リード端子の下部が突出しており、この突出しているリード端子下端部に測定治具を接触させて動作チェックをおこなうことができるので、基板底部の外部端子を用いた動作チェックを回避でき、外部端子の損傷を防止できる。動作チェック後は、リード下端部を切断して凹所内に引っ込んだ状態とするので、マザープリント基板上に実装したときに基板上のパターン等との干渉を防止できる。
【００１２】
請求項２の発振器では、金属ケースは、ベースプリント基板上面と対面する下面が開放し、内側に屈曲したその裾部をネジによってベースプリント基板に固定される構成を備え、該金属ケースの裾部と対応するベースプリント基板に設けた連結穴の下部は大径の連結用凹所となっている。このため、金属ケースを強固且つ確実にベースプリント基板に対して固定することができ、デバイスとしての耐久性、信頼性を向上できる。従来の如くハンダによってケースを接合する場合に発生していた組み付け手数の増大、接合の信頼性の低下という不具合を一挙に解消できる。
請求項３の発振器では、前記ベースプリント基板の上面と、その上方に位置する発振回路基板及び圧電振動子との間の空間内に、断熱材を配置したので、発振器を通信機器などのマザープリント基板上に実装した場合にベースプリント基板を介して逃げやすい熱をケース内に閉じ込めて外部温度の変化に起因した周波数の変動を有効に防止することができる。
【図面の簡単な説明】
【図１】（ａ）（ｂ）及び（ｃ）は本発明の一実施形態に係る表面実装型の温度制御型高安定圧電発振器の構成を示す縦断面図、底面図、及び要部拡大断面図・
【図２】（ａ）（ｂ）はリード端子を利用して発振器の動作チェックを行うために、リード端子の下端部をベースプリント基板の下面よりも充分に長く突出させた状態を示す説明図。
【図３】本発明の他の実施形態の要部構成図。
【図４】（ａ）（ｂ）（ｃ）及び（ｄ）は本発明の他の実施形態に係る発振器の構成を示す正面縦断面図、平面図、要部拡大図、及び変形例の要部拡大図。
【図５】従来の圧電発振器の構成を示す断面図。
【図６】他の従来例の圧電発振器の断面図。
【図７】他の従来例の圧電発振器の断面図。
【図８】従来の動作チェック方法を説明する図。
【符号の説明】
３１ 発振器、３２ 外部端子、３３ ベースプリント基板、３３ａ 壁、３４リード端子、３４ａ フランジ部、３５ パッド、５０ 発振回路基板、５１圧電振動子、５２ 電子部品（ヒータ、発振回路部品、温度制御回路部品）、５３ 金属ケース、５４ ハンダ、６０ 凹所、６１ スルーホール、６１ａ 貫通穴、６１ｂ 導体膜、６５ ハンダ、７０ 測定治具、７１ 挿通穴、８１発振器、８２ 連結用凹所、８３ 皿ネジ、８４ 連結穴、８５ 断熱材、８６ 貫通孔、８７ 接着剤、８８ 絶縁性接着剤。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a piezoelectric oscillator used as a frequency control device and the like, and in particular, an improvement of a surface mount type highly stable piezoelectric oscillator having a configuration in which a piezoelectric vibrator is heated by a heater and a heater temperature is controlled by a temperature control circuit. About.
[0002]
[Prior art]
As a piezoelectric oscillator such as a crystal oscillator used as a frequency control device in communication equipment used in wireless base stations, mobile communication equipment used in transmission networks, and transmission communication equipment, it has a built-in heater and temperature control circuit. There is known a temperature control type highly stable piezoelectric oscillator capable of outputting a highly stable frequency without being affected by an external temperature change by heating a piezoelectric vibrator and controlling its temperature.
A conventional temperature control type high stability piezoelectric oscillator has a printed circuit board for oscillation mounted with a piezoelectric vibrator, a heater, a circuit component, etc. on the upper end portion of a conductor lead wire penetrating the base plate and projecting vertically. The space on the base plate including these parts is enclosed by a metal case. When mounting this oscillator on the mother printed circuit board, multiple linear lead terminals drawn out from below the base plate of the oscillator are inserted into through holes provided in the mother printed circuit board and fixed by soldering. To do.
In this type of highly stable piezoelectric oscillator, since frequency stability is regarded as important, there are few restrictions on its size and shape, but in recent years, demands for miniaturization and surface mounting have increased.
FIG. 5 is a cross-sectional view showing a schematic configuration of a conventional surface mount type temperature controlled high stability piezoelectric oscillator. This high stability piezoelectric oscillator 1 includes an external terminal 2 for surface mounting on a mother printed circuit board (not shown). The base printed circuit board 3, the electronic components (oscillation circuit components, heaters, temperature control circuit components) 4 mounted on the upper surface of the base printed circuit board 3, and the conductor lead wires slightly lifted from the upper surface of the base printed circuit board 3 5 and a metal case fixed to the base printed circuit board 3 in a state of surrounding a space on the base printed circuit board 3 including these components 4, 5, and 6. 7 However, when a heater or the like is arranged on the upper surface of the base printed board 3 in this way, heat for heating the piezoelectric vibrator 6 escapes from the base printed board 3 to the mother printed board, making it difficult to perform efficient temperature control. It becomes.
In order to solve such a problem, the electronic component 4 such as a heater and the piezoelectric vibrator 6 are mounted as in the surface mount type temperature control type high stability piezoelectric oscillator having the configuration shown in FIGS. It is necessary to dispose the oscillated circuit board 10 away from the base printed board 3.
[0003]
That is, the conventional highly stable piezoelectric oscillator 1 shown in FIG. 6 includes a base printed board 3 having external terminals 2 for surface mounting on a mother printed board (not shown), and solder 11 on pads on the base printed board. Oscillation circuit board mounted with a plurality of linear lead terminals 12 erected by, an electronic component (oscillation circuit component, heater, temperature control circuit component) 4 and piezoelectric vibrator 6 fixed to the top of the lead terminal 12 10, and a metal case 7 fixed to the base printed circuit board 3 in a state of surrounding a space on the base printed circuit board 3 including these components 4, 6, and 10. However, in the piezoelectric oscillator 1 of this type, when the lead terminal 12 is solder-connected to the pad on the base printed circuit board, the positional shift is likely to occur in the lateral direction, and the oscillation circuit is fixed to the misaligned lead terminal 12. When the substrate 10 approaches the inner wall of the case 7, the mounted piezoelectric vibrator 6 is easily affected by the outside air temperature, and the frequency stability is lowered.
The types shown in FIGS. 7A and 7B use thin lead terminals 15 instead of the linear lead terminals 12 used in the oscillator of FIG. The lead terminal 15 has a stopper 15b and a positioning pin 15c at the lower part of a lead body 15a penetratingly connected to the oscillation circuit board 10, and the positioning pin 15c is placed on the land 16 on the base printed board 3. After being inserted into the provided hole 16 a, it is fixed by the solder 17. However, when a plate-shaped member having a large surface area is used as the lead terminal, heat is easily radiated, and the mounted piezoelectric vibrator 6 is easily affected by the outside air temperature, so that the frequency stability is lowered.
Further, in any type of the above surface-mount type temperature control type high stability piezoelectric oscillator, when checking the operation of the completed oscillator, the terminal 21 provided on the terminal jig 20 as shown in FIG. The external terminal 2 is brought into contact with the power supply and energized. However, if such an operation check is performed, the external terminal 2 may be damaged or peeled off. There was a risk that the defective product rate would increase.
[0004]
[Problems to be solved by the invention]
The present invention has been proposed in order to improve the drawbacks of the conventional example described above, and is a surface mount type temperature control type having a configuration in which the piezoelectric vibrator is heated by a heater and the temperature of the heater is controlled by a temperature control circuit. In highly stable piezoelectric oscillators, the lead terminals for oscillating and supporting the oscillation circuit board and the piezoelectric vibrator above the base printed board are made of a wire material with low heat dissipation, but the lead terminals on the base printed board are reliably misaligned. It is an object of the present invention to provide a surface mount type highly stable piezoelectric oscillator that can be prevented.
In addition, by eliminating the need to perform an operation check using the external terminals provided at the bottom of the base printed circuit board, even though it is a surface mount type, it prevents damage to the external terminals during the operation check and reduces the defective product rate of the oscillator. It is an object of the present invention to provide a surface mount type highly stable piezoelectric oscillator that can be significantly reduced.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the invention of claim 1 is a base printed circuit board made of an insulating material having external terminals for surface mounting on the outer surface, and at least two linear lead terminals penetrating the base printed circuit board, An oscillation circuit board installed and supported on top of a lead terminal protruding on the base print board, a piezoelectric vibrator mounted on the oscillation circuit board, and a metal surrounding a space on the base print board including the respective components e Bei a case, wherein the base printed circuit on the lower surface of the substrate has a concave offices in a position where the front Symbol lead terminals penetrating, the wall portion between the upper surface of the base printed circuit board and the recess the lead to lower the insertion support pin has a small diameter of the through hole than the recess, the position of the lead terminals, with a flange portion which is engaged with the upper peripheral edge of the through hole, Surface mounting a serial lead terminals, the bottom portion is solder connections between the said through-hole peripheral edge and the flange portion in a state of being inserted into the through-hole pads so as to protrude longer than the lower surface of the pace PCB the method of manufacturing a mold piezoelectric oscillator, a state in which the retracted and performing operation check of the read current to the lower end the surface mount pressure electrostatic oscillator terminals, to the lead the recess the lower portion cut away to the terminal And a step of terminating at .
According to a second aspect of the present invention, the metal case has a configuration in which a lower surface facing the upper surface of the base printed board is opened, and a hem portion bent inward is fixed to the base printed board with screws, the lower portion of the connecting hole provided on the base printed circuit board and the corresponding skirt features a method of making a surface-mounted pressure electrostatic oscillator according that it is a consolidated for recess in claim 1.
According to a third aspect of the present invention, the heat insulating material is arranged in a space between the upper surface of the base printed board and the oscillation circuit board and the piezoelectric vibrator located above the upper surface . wherein the manufacturing method of the surface mount pressure electrostatic oscillator.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
1A, 1B, and 1C are a longitudinal sectional view, a bottom view, and a bottom view showing a configuration of a surface-mounted temperature-controlled high-stability piezoelectric oscillator (hereinafter referred to as an oscillator) according to an embodiment of the present invention. And it is a principal part expanded sectional view.
The oscillator 31 according to this embodiment includes a base printed board 33 made of an insulating material having external terminals 32 for surface mounting on the outer surface (outer bottom), and at least three linear leads penetrating the base printed board 33. A terminal 34, an oscillation circuit board 50 installed and supported above the lead terminal 34 protruding on the base printed board 33, a piezoelectric vibrator 51 mounted on the oscillation circuit board 50, and electronic components (heaters, oscillation circuit parts) , A temperature control circuit component) 52 and a metal case 53 having a hem portion connected to the base printed board 33 by solder 54 so as to surround a space on the base printed board 33 including the components 50, 51, 52. And comprising.
The base printed board 33 includes a pad 35 and a wiring pattern on the upper surface, and has a plurality of external terminals 32 extending from the outer bottom surface to the side surface or the upper surface. The bottom surface of the base printed circuit board 33 has a large-diameter recess 60 (counterbore hole) at a position where the lead terminal 34 penetrates, and a wall 33a between the recess 60 and the top surface of the base printed circuit board is provided. A through hole 61 is formed, and the lower end portion of the lead terminal 34 is inserted into the through hole 61 and terminates at the upper portion of the recess 60. The through hole 61 has a configuration in which a conductor film 61 b is formed on the inner wall of a through hole 61 a provided in the insulating substrate, and the conductor film 61 b is electrically connected to the pad 35.
The lead terminal 34 is provided with a flange portion 34 a that is locked to the upper peripheral edge (the upper surface of the substrate 33) of the through hole 61. A lead terminal portion below the flange portion 34 a is inserted into the through hole 61. In this state, the lead terminal 34 and the pad 35 are connected by the solder 65.
When the thickness of the base printed board 33 is 1.6 mm, for example, the lead terminal 34 has a diameter of 0.4 mm, the through hole 61 has a diameter of 0.6 mm, for example, and the recess 60 has a diameter of 2 mm. .5mm and depth is 0.8mm.
[0007]
As described above, in the oscillator 31 according to the present embodiment, when the linear lead terminal 34 that supports the oscillation circuit board 50 is positioned on the base print board in the upper portion, the inside of the through hole 61 provided in the base print board 33. The lower part of the lead terminal 34 is inserted, and the protruding length of the upper part of the lead terminal is made constant by a flange part 34a as a stopper provided at the lower part of the lead terminal. In this state, since the flange portion 34a is connected to the pad 35, which is electrically connected to the through hole 61, by solder, the 34 lateral position of the lead terminal can be always constant. For this reason, it is possible to eliminate the adverse effect caused by the positional deviation of the oscillation circuit board caused by the lateral deviation of the position of the linear lead terminal as in the prior art and the outside air temperature caused thereby. In addition, since the lead terminal is made of a linear conductor, a large amount of heat from the heater is not radiated and there is no possibility of causing frequency fluctuation due to temperature change.
[0008]
On the other hand, since a large-diameter recess 60 that communicates with the through hole 61 is provided on the bottom surface of the base printed board 33, the external terminal 32 is used as shown in FIG. There is no need to contact the terminal of the terminal jig.
2A and 2B show a state in which the lower end portion of the lead terminal 34 protrudes sufficiently longer than the lower surface of the base printed circuit board 33 in order to check the operation of the oscillator 31 using the lead terminal 34. It is explanatory drawing which shows.
In other words, the oscillator shown in FIG. 1 shows a state of a finished product in which the lower end portion of the long lead terminal 34 shown in FIG. 2 is cut after the operation check.
The oscillator 31 shown in FIG. 1 has a measurement in which the lower part of the lead terminal 34 protrudes downward as shown in FIG. 2 and has a lead terminal insertion hole 71 as shown in FIG. Using the jig 70, an operation check is performed in a state where the protruding lower end portion of the lead terminal 34 is inserted into the insertion hole 71. As a result of the operation check, when it is found that the device operates normally, the lead terminal is cut at the boundary surface between the recess 60 and the through hole 61 using a small nipper or the like, thereby completing the completed state of FIG. Can be. Even if the lower portion of the lead terminal protrudes from the through hole 61 into the recess 60 after cutting the lead terminal, the lower portion of the lead terminal protrudes from the lower surface of the base printed circuit board 33 as long as it is within the recess 60. Therefore, there is no risk of contact with pads, wiring patterns, etc. on the mother printed circuit board during surface mounting.
The shape of the recess 60 is not necessarily a cylindrical shape as shown in FIG. 1, and may be a substantially conical shape as shown in FIG. 3, for example.
In the above embodiments, only two terminals are shown as the number of lead terminals for the sake of convenience of illustration and explanation, but in reality, a large number of terminals are provided to operate the oscillation circuit and the heater.
[0009]
Next, FIGS. 4A, 4B, 4C, and 4D are a front longitudinal sectional view, a plan view, an enlarged view of a main part, and a modified example showing the configuration of an oscillator according to another embodiment of the present invention. It is a principal part enlarged view.
One of the different configurations of the oscillator 81 of this embodiment from the oscillator of the above embodiment is that, in addition to the recess 60 for inserting the lead terminal 34, a connecting recess 82 made of a similar counterbore hole is provided on the base printed board. The base printed board 33 is connected and fixed by a flat head screw 83 to the bottom 53a of the metal case 53, which is provided on the bottom surface of 33 and protrudes to a position corresponding to the connecting recess 82. The skirt portion 53a of the metal case 53 has a configuration in which the skirt portion 53a is bent and protrudes inward from the lower end edge of the side wall of the case, and the skirt portion 53a is configured to be thick or folded and folded to form a multi-layer structure. By doing so (FIG. 4D), the strength is increased. Then, a screw hole 53a ′ is provided in the skirt 53a, and a countersunk screw 83 is screwed into the screw hole 53a ′ from the connecting recess 82 side, thereby firmly fixing the case 53 to the base printed board 33. it can. There is a tapered connecting hole 84 on the side of the base printed circuit board 33 corresponding to the screw hole 53a ′. When the countersunk screw 83 is screwed in a state where the connecting hole 84 and the screw hole 53a ′ are in communication, the screw hole 53a ′ is screwed. Since the head of the countersunk screw 83 is buried in the connecting recess 82, there is no possibility of interfering with a pad or the like on the upper surface of the mother printed board when mounted on the mother printed board.
[0010]
Further, the present embodiment is different from the above-described embodiment in that a plate-like heat insulating material 85 that isolates the piezoelectric vibrator 51 and the base printed board 33 is disposed inside the case 53. That is, the heat insulating material 85 has a through hole 86 through which the lead terminal 34 is inserted, and the outer peripheral edge thereof is fixed to the inner wall of the case 53 with the adhesive 87. The space between the through hole 86 and the lead terminal 34 is filled with an insulating adhesive 88. When the oscillator is mounted on a mother printed circuit board such as a wireless device, the heat on the oscillator side tends to escape from the soldered part to the mother printed circuit board side, and the frequency stability tends to decrease. A heat insulating material 85 is interposed in the space between the oscillation circuit board 50 that supports the heater and the piezoelectric vibrator and the base print board 33 to thermally shut it off, and the base print board 33 is passed through the space in the case. The amount of heat that escapes can be reduced. For this reason, it is possible to increase the stability of the frequency regardless of the change in the external temperature.
Further, the connecting recesses 82 and the like are not necessarily four, but may be one on each side.
In the embodiment shown in FIG. 4, the oscillator having the structure in which the base printed board 33 and the case 53 are fixed by the flat head screw 83 and the heat blocking structure by the heat insulating material 85 is disclosed. Needless to say, the oscillator may be provided with only one of the structures.
[0011]
【The invention's effect】
As described above, according to the present invention, in the surface mount type temperature control type highly stable piezoelectric oscillator having a configuration in which the piezoelectric vibrator is heated by the heater and the heater temperature is controlled by the temperature control circuit, While the lead terminal for installing and supporting the oscillation circuit board and the piezoelectric vibrator is formed of a wire material with a small amount of heat radiation, it is possible to reliably prevent the position of the lead terminal on the base printed board from being displaced. In addition, by eliminating the need to perform an operation check using the external terminals provided at the bottom of the base printed circuit board, even though it is a surface mount type, it prevents damage to the external terminals during the operation check and reduces the defective product rate of the oscillator. It is an object of the present invention to provide a surface mount type highly stable piezoelectric oscillator that can be significantly reduced. That is, the surface-mount type high-stability piezoelectric oscillator according to claim 1 has a large-diameter recess at a position where the linear lead terminal passes through the lower surface of the base printed board, and the upper surface of the base printed board. A through hole for inserting and supporting the lower portion of the lead terminal is provided in the wall portion between and a flange portion that is locked to an upper peripheral edge of the through hole at a proper position of the lead terminal, and the lower portion of the lead terminal is passed through. Solder connection was made between the flange portion and the pad on the periphery of the through hole in a state of being inserted into the hole. In this way, since the wire material is used as the lead terminal, the problem of difficulty in positioning on the substrate, which is a drawback when using the wire lead terminal, is solved while preventing heat dissipation from the lead terminal. it can. Further, since the lower end portion of the lead terminal is retracted into the recess, it is possible to prevent interference when mounted on the mother printed board. In addition, the lead terminal has a lower part extending below the flange part and exceeding the thickness of the base printed circuit board, and the lower part of the lead terminal is cut and removed after the operation check after the piezoelectric oscillator is completed. Since it is terminated in the state of being retracted in the recess, the lower part of the linear lead terminal protrudes from the bottom surface of the base printed board immediately before the completion of the oscillator, and a measuring jig is attached to the lower end of the protruding lead terminal. Since the operation check can be performed by bringing them into contact with each other, the operation check using the external terminals at the bottom of the substrate can be avoided, and damage to the external terminals can be prevented. After the operation check, the lower end of the lead is cut and retracted into the recess, so that interference with a pattern on the substrate can be prevented when mounted on the mother printed circuit board.
[0012]
The oscillator of claim 2, the metal case is a base printed circuit board upper surface and the lower surface is opened to face, a structure which is fixed to the base printed circuit board by screws the skirt portion which is bent inward, the skirt of the metal casing The lower part of the connection hole provided in the corresponding base printed board is a large-diameter connection recess. For this reason, the metal case can be firmly and securely fixed to the base printed board, and the durability and reliability of the device can be improved. Problems such as an increase in the number of assembling steps and a decrease in the reliability of joining, which have occurred when joining cases with solder as in the past, can be solved at once.
In the oscillator according to claim 3 , since the heat insulating material is disposed in the space between the upper surface of the base printed board and the oscillation circuit board and the piezoelectric vibrator located above the upper surface of the base printed board, the oscillator is used as a mother print of a communication device or the like. When mounted on a substrate, heat that can easily escape through the base printed circuit board is confined in the case, and frequency fluctuations due to changes in the external temperature can be effectively prevented.
[Brief description of the drawings]
1A, 1B, and 1C are a longitudinal sectional view, a bottom view, and an enlarged cross-sectional view of a main part showing a configuration of a surface-mounted temperature-controlled high-stability piezoelectric oscillator according to an embodiment of the present invention. Figure
FIGS. 2A and 2B are explanatory views showing a state in which the lower end portion of the lead terminal protrudes sufficiently longer than the lower surface of the base printed circuit board in order to check the operation of the oscillator using the lead terminal. .
FIG. 3 is a main part configuration diagram of another embodiment of the present invention.
FIGS. 4A, 4B, 4C and 4D are a front longitudinal sectional view, a plan view, an enlarged view of a main part and an essential part of a modified example showing a configuration of an oscillator according to another embodiment of the present invention. Part enlarged view.
FIG. 5 is a cross-sectional view showing a configuration of a conventional piezoelectric oscillator.
FIG. 6 is a cross-sectional view of another conventional piezoelectric oscillator.
FIG. 7 is a cross-sectional view of another conventional piezoelectric oscillator.
FIG. 8 is a diagram for explaining a conventional operation check method;
[Explanation of symbols]
31 oscillator, 32 external terminal, 33 base printed circuit board, 33a wall, 34 lead terminal, 34a flange, 35 pad, 50 oscillation circuit board, 51 piezoelectric vibrator, 52 electronic components (heater, oscillation circuit component, temperature control circuit component) ), 53 metal case, 54 solder, 60 recess, 61 through hole, 61a through hole, 61b conductor film, 65 solder, 70 measuring jig, 71 insertion hole, 81 oscillator, 82 coupling recess, 83 countersunk screw, 84 connecting hole, 85 heat insulating material, 86 through hole, 87 adhesive, 88 insulating adhesive.

Claims (3)

外面に表面実装用の外部端子を備えた絶縁材料から成るベースプリント基板と、該ベースプリント基板を貫通する少なくとも２つの線状リード端子と、該ベースプリント基板上に突出するリード端子の上部に架設支持された発振回路基板と、該発振回路基板に搭載した圧電振動子と、前記各構成要素を含むベースプリント基板上の空間を包囲する金属ケースと、を備え、
前記ベースプリント基板の下面には前記リード端子が貫通する位置に凹所を有し、
前記凹所と前記ベースプリント基板の上面との間の壁部には前記リード端子の下部を挿入支持するための、前記凹所よりも小径のスルーホールを有し、
前記リード端子の適所には、前記スルーホールの上側周縁に係止されるフランジ部を備え、
前記リード端子を、下端部を前記ペースプリント基板の下面よりも長く突出させるように前記スルーホール内に挿着した状態で前記フランジ部と前記スルーホール周縁のパッドとの間をハンダ接続した表面実装型圧電発振器の製造方法において、
前記リード端子の下端部に通電し当該表面実装型圧電発振器の動作チェックを行う工程と、
前記リード端子の下端部を切断除去して前記凹所内に退避した状態で終端させる工程と、
を有することを特徴とする表面実装型圧電発振器の製造方法。A base printed circuit board made of an insulating material having external terminals for surface mounting on the outer surface, at least two linear lead terminals penetrating the base printed circuit board, and installed on top of the lead terminals protruding on the base printed circuit board e Bei and supported oscillator circuit, and a piezoelectric vibrator mounted on the oscillation circuit substrate, and the metal case surrounding the space on the base printed circuit board comprising the respective components, the,
Has a concave offices in a position where the front Symbol lead terminal through the lower surface of the base printed circuit board,
For inserting supporting a lower portion of the lead terminal to the wall portion between the upper surface of the base printed circuit board and the recess has a smaller diameter through hole than the recess,
The position of the lead terminals, with a flange portion which is engaged with the upper peripheral edge of the through hole,
Surface mounting the lead terminal, the lower end portion is solder connections between the said through-hole peripheral edge and the flange portion in a state of being inserted into the through-hole pads so as to protrude longer than the lower surface of the pace PCB In the manufacturing method of the piezoelectric oscillator,
And performing an operation check of energized the surface mount pressure electrostatic oscillator to the lower end portion of the lead terminal,
Cutting and removing the lower end of the lead terminal and terminating it in the retracted state in the recess ;
Method of manufacturing a surface mount pressure electrostatic oscillator, characterized in that it comprises a. 前記金属ケースは、前記ベースプリント基板上面と対面する下面が開放し、内側に屈曲したその裾部をネジによってベースプリント基板に固定される構成を備え、
該金属ケースの裾部と対応するベースプリント基板に設けた連結穴の下部は連結用凹所となっていることを特徴とする請求項１に記載の表面実装型圧電発振器の製造方法。The metal case has a configuration in which a lower surface facing the upper surface of the base printed circuit board is opened, and a hem portion bent inward is fixed to the base printed circuit board with screws,
Surface mount pressure electrostatic oscillator method of claim 1 in which the lower portion of the connecting hole provided on the base printed circuit board, characterized in that it is a consolidated for recesses corresponding to the skirt portion of the metal case. 前記ベースプリント基板の上面と、該上面の上方に位置する発振回路基板及び圧電振動子との間の空間内に、断熱材を配置したことを特徴とする請求項１又は２に記載の表面実装型圧電発振器の製造方法。The surface mounting according to claim 1 or 2, wherein a heat insulating material is disposed in a space between the upper surface of the base printed board and the oscillation circuit board and the piezoelectric vibrator located above the upper surface. method for producing a mold pressure electric oscillator.
JP2001200198A 2001-06-29 2001-06-29 Manufacturing method of surface mount type piezoelectric oscillator Expired - Fee Related JP4774639B2 (en)

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JP6297872B2 (en) * 2014-03-24 2018-03-20 日本電波工業株式会社 Measuring jig for inspecting surface mounted piezoelectric device and inspection method for surface mounted piezoelectric device
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