JP4757924B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP4757924B2 JP4757924B2 JP2009043420A JP2009043420A JP4757924B2 JP 4757924 B2 JP4757924 B2 JP 4757924B2 JP 2009043420 A JP2009043420 A JP 2009043420A JP 2009043420 A JP2009043420 A JP 2009043420A JP 4757924 B2 JP4757924 B2 JP 4757924B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- unit
- wafer
- heat treatment
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
W ウエハ
S1 キャリアブロック
S2 処理ブロック
S3 インターフェイスブロック
S4 露光装置
H1〜H4 液処理ユニット
G1〜G5 熱処理ブロック
G6 検査測定ブロック
G7、G8 受け渡しブロック
41 熱処理ユニット
42 検査測定ユニット
A1〜A3 メインアーム
51、52 アーム体
HP 加熱ユニット
COL 冷却ユニット
CHP 加熱冷却ユニット
62 支持ピン
70 トレイ
82 上部支持ガイド
83 下部支持ガイド
Claims (2)
- 基板に所定の処理を施す複数の処理ユニットを備え、搬送手段によって前記基板を各々の処理ユニットに搬送する基板処理装置において、
前記複数の処理ユニットは、基板に塗布液を塗布して基板に塗布膜を形成する塗布処理ユニット及び前記塗布膜が形成された基板に現像液を供給して現像処理を行う現像処理ユニットと、基板に加熱又は冷却処理を行う熱処理ユニットとを含み、
前記塗布処理ユニット及び現像処理ユニットに対しては、前記搬送手段により前記基板が水平状態で搬入、搬出され、
前記熱処理ユニットに対しては、前記搬送手段により前記基板が垂直状態で搬入、搬出され、
前記熱処理ユニットは、当該熱処理ユニット内に搬入された基板を垂直状態で加熱処理又は冷却処理し、
さらに前記熱処理ユニットは、前記垂直状態で搬送された基板を受け取り、かつ当該基板に対して加熱処理又は冷却処理を行うユニット本体内の所定の位置に基板を移動する、基板支持手段を備え、
前記基板支持手段は、基板側に進退して基板の裏面側に接触可能な複数の支持ピンを有し、
これら複数の支持ピンにおける基板との接触部分には、吸着手段が備えられた、ことを特徴とする、基板処理装置。 - 前記基板支持手段は、前記基板の外周部を把持する把持手段を備えたことを特徴とする、請求項1に記載の基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009043420A JP4757924B2 (ja) | 2009-02-26 | 2009-02-26 | 基板処理装置 |
KR1020100016883A KR20100097610A (ko) | 2009-02-26 | 2010-02-25 | 기판 처리 장치 및 기판 처리 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009043420A JP4757924B2 (ja) | 2009-02-26 | 2009-02-26 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010199355A JP2010199355A (ja) | 2010-09-09 |
JP4757924B2 true JP4757924B2 (ja) | 2011-08-24 |
Family
ID=42823770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009043420A Expired - Fee Related JP4757924B2 (ja) | 2009-02-26 | 2009-02-26 | 基板処理装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4757924B2 (ja) |
KR (1) | KR20100097610A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5212443B2 (ja) * | 2010-09-13 | 2013-06-19 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
TWI523134B (zh) * | 2011-09-22 | 2016-02-21 | 東京威力科創股份有限公司 | 基板處理系統、基板搬運方法、及電腦記憶媒體 |
JP5661584B2 (ja) * | 2011-09-22 | 2015-01-28 | 東京エレクトロン株式会社 | 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体 |
KR102069744B1 (ko) * | 2017-03-03 | 2020-01-23 | (주)인스케이프 | 공정 유닛 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5982221A (ja) * | 1982-10-29 | 1984-05-12 | Hitachi Ltd | 搬送装置 |
JPH08288362A (ja) * | 1995-04-14 | 1996-11-01 | Hitachi Ltd | 板状物搬送装置およびそれを使用した板状物処理装置 |
JP3248129B2 (ja) * | 1997-01-21 | 2002-01-21 | 東京エレクトロン株式会社 | 基板搬送処理装置 |
JPH1197399A (ja) * | 1997-09-25 | 1999-04-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP3785332B2 (ja) * | 2000-05-01 | 2006-06-14 | 東京エレクトロン株式会社 | 加熱冷却処理装置及び基板処理装置 |
TWI262165B (en) * | 2002-10-16 | 2006-09-21 | Sez Ag | Device and method for transporting wafer-shaped articles |
JP4566035B2 (ja) * | 2005-03-11 | 2010-10-20 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法 |
-
2009
- 2009-02-26 JP JP2009043420A patent/JP4757924B2/ja not_active Expired - Fee Related
-
2010
- 2010-02-25 KR KR1020100016883A patent/KR20100097610A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20100097610A (ko) | 2010-09-03 |
JP2010199355A (ja) | 2010-09-09 |
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